WO2009057422A1 - 銅アノード又は含燐銅アノード、半導体ウエハへの電気銅めっき方法及びパーティクル付着の少ない半導体ウエハ - Google Patents
銅アノード又は含燐銅アノード、半導体ウエハへの電気銅めっき方法及びパーティクル付着の少ない半導体ウエハ Download PDFInfo
- Publication number
- WO2009057422A1 WO2009057422A1 PCT/JP2008/068167 JP2008068167W WO2009057422A1 WO 2009057422 A1 WO2009057422 A1 WO 2009057422A1 JP 2008068167 W JP2008068167 W JP 2008068167W WO 2009057422 A1 WO2009057422 A1 WO 2009057422A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor wafer
- copper
- phosphorus
- copper anode
- anode
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08843371.9A EP2213772B1 (en) | 2007-11-01 | 2008-10-06 | Phosphorus-containing copper anode |
KR1020097015831A KR101945043B1 (ko) | 2007-11-01 | 2008-10-06 | 구리 애노드 또는 인 함유 구리 애노드, 반도체 웨이퍼에 대한 전기 구리 도금 방법 및 파티클 부착이 적은 반도체 웨이퍼 |
CN200880005572.1A CN101796224B (zh) | 2007-11-01 | 2008-10-06 | 铜阳极或含磷铜阳极、在半导体晶片上电镀铜的方法及粒子附着少的半导体晶片 |
US12/524,623 US8216438B2 (en) | 2007-11-01 | 2008-10-06 | Copper anode or phosphorous-containing copper anode, method of electroplating copper on semiconductor wafer, and semiconductor wafer with low particle adhesion |
JP2009538986A JP5066577B2 (ja) | 2007-11-01 | 2008-10-06 | 銅アノード又は含燐銅アノード、半導体ウエハへの電気銅めっき方法及びパーティクル付着の少ない半導体ウエハ |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007285148 | 2007-11-01 | ||
JP2007-285148 | 2007-11-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009057422A1 true WO2009057422A1 (ja) | 2009-05-07 |
Family
ID=40590817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/068167 WO2009057422A1 (ja) | 2007-11-01 | 2008-10-06 | 銅アノード又は含燐銅アノード、半導体ウエハへの電気銅めっき方法及びパーティクル付着の少ない半導体ウエハ |
Country Status (7)
Country | Link |
---|---|
US (1) | US8216438B2 (ja) |
EP (1) | EP2213772B1 (ja) |
JP (2) | JP5066577B2 (ja) |
KR (1) | KR101945043B1 (ja) |
CN (3) | CN101796224B (ja) |
TW (1) | TWI492279B (ja) |
WO (1) | WO2009057422A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4011336B2 (ja) * | 2001-12-07 | 2007-11-21 | 日鉱金属株式会社 | 電気銅めっき方法、電気銅めっき用純銅アノード及びこれらを用いてめっきされたパーティクル付着の少ない半導体ウエハ |
JP5376168B2 (ja) * | 2010-03-30 | 2013-12-25 | 三菱マテリアル株式会社 | 電気銅めっき用高純度銅アノード、その製造方法および電気銅めっき方法 |
TWI588900B (zh) * | 2012-04-25 | 2017-06-21 | Markus Hacksteiner | Device and method for wafer metallization |
CN105586630A (zh) * | 2015-12-23 | 2016-05-18 | 南通富士通微电子股份有限公司 | 半导体封装中提升铜磷阳极黑膜品质的方法 |
WO2019070783A1 (en) | 2017-10-06 | 2019-04-11 | Corning Incorporated | ASSEMBLY COMPRISING A NANOPOROUS SURFACE LAYER WITH A HYDROPHOBIC LAYER |
JP6960363B2 (ja) | 2018-03-28 | 2021-11-05 | Jx金属株式会社 | Coアノード、Coアノードを用いた電気Coめっき方法及びCoアノードの評価方法 |
CN110528042B (zh) * | 2019-08-28 | 2021-02-09 | 深圳赛意法微电子有限公司 | 一种半导体器件电镀方法及用于电镀的活化槽 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03180468A (ja) | 1989-12-08 | 1991-08-06 | Matsushita Electric Ind Co Ltd | スパッタ用ターゲットの製造方法 |
JP2000265262A (ja) | 1999-03-16 | 2000-09-26 | Sanyo Special Steel Co Ltd | Ge−Sb−Te系スパッタリング用ターゲット材の製造方法 |
JP2001098366A (ja) | 1999-07-26 | 2001-04-10 | Sanyo Special Steel Co Ltd | Ge−Sb−Te系スパッタリングターゲット材の製造方法 |
JP2001123266A (ja) | 1999-10-21 | 2001-05-08 | Sanyo Special Steel Co Ltd | Ge−Sb−Te系スパッタリングターゲット材の製造方法 |
JP2001240949A (ja) * | 2000-02-29 | 2001-09-04 | Mitsubishi Materials Corp | 微細な結晶粒を有する高純度銅加工品素材の製造方法 |
JP2002275698A (ja) * | 2001-03-13 | 2002-09-25 | Mitsubishi Materials Corp | 電気メッキ用含燐銅陽極 |
JP2003171797A (ja) * | 2001-12-07 | 2003-06-20 | Nikko Materials Co Ltd | 電気銅めっき方法、電気銅めっき用純銅アノード及びこれらを用いてめっきされたパーティクル付着の少ない半導体ウエハ |
JP2003231995A (ja) * | 2002-02-13 | 2003-08-19 | Nikko Materials Co Ltd | 電気銅めっき用含リン銅アノード、該含リン銅アノードを使用する電気銅めっき方法、これらを用いてめっきされたパーティクル付着の少ない半導体ウエハ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6821407B1 (en) * | 2000-05-10 | 2004-11-23 | Novellus Systems, Inc. | Anode and anode chamber for copper electroplating |
JP4076751B2 (ja) * | 2001-10-22 | 2008-04-16 | 日鉱金属株式会社 | 電気銅めっき方法、電気銅めっき用含リン銅アノード及びこれらを用いてめっきされたパーティクル付着の少ない半導体ウエハ |
CN100350079C (zh) * | 2001-11-16 | 2007-11-21 | 霍尼韦尔国际公司 | 用于电镀操作的阳极以及在半导体基体上形成材料的方法 |
JP4034095B2 (ja) * | 2002-03-18 | 2008-01-16 | 日鉱金属株式会社 | 電気銅めっき方法及び電気銅めっき用含リン銅アノード |
US20030188975A1 (en) * | 2002-04-05 | 2003-10-09 | Nielsen Thomas D. | Copper anode for semiconductor interconnects |
-
2008
- 2008-10-06 CN CN200880005572.1A patent/CN101796224B/zh active Active
- 2008-10-06 CN CN201310598092.3A patent/CN103726097B/zh active Active
- 2008-10-06 EP EP08843371.9A patent/EP2213772B1/en active Active
- 2008-10-06 WO PCT/JP2008/068167 patent/WO2009057422A1/ja active Application Filing
- 2008-10-06 KR KR1020097015831A patent/KR101945043B1/ko active IP Right Grant
- 2008-10-06 JP JP2009538986A patent/JP5066577B2/ja active Active
- 2008-10-06 CN CN2013101381909A patent/CN103266337A/zh active Pending
- 2008-10-06 US US12/524,623 patent/US8216438B2/en active Active
- 2008-10-21 TW TW097140271A patent/TWI492279B/zh active
-
2012
- 2012-06-05 JP JP2012127804A patent/JP5709175B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03180468A (ja) | 1989-12-08 | 1991-08-06 | Matsushita Electric Ind Co Ltd | スパッタ用ターゲットの製造方法 |
JP2000265262A (ja) | 1999-03-16 | 2000-09-26 | Sanyo Special Steel Co Ltd | Ge−Sb−Te系スパッタリング用ターゲット材の製造方法 |
JP2001098366A (ja) | 1999-07-26 | 2001-04-10 | Sanyo Special Steel Co Ltd | Ge−Sb−Te系スパッタリングターゲット材の製造方法 |
JP2001123266A (ja) | 1999-10-21 | 2001-05-08 | Sanyo Special Steel Co Ltd | Ge−Sb−Te系スパッタリングターゲット材の製造方法 |
JP2001240949A (ja) * | 2000-02-29 | 2001-09-04 | Mitsubishi Materials Corp | 微細な結晶粒を有する高純度銅加工品素材の製造方法 |
JP2002275698A (ja) * | 2001-03-13 | 2002-09-25 | Mitsubishi Materials Corp | 電気メッキ用含燐銅陽極 |
JP2003171797A (ja) * | 2001-12-07 | 2003-06-20 | Nikko Materials Co Ltd | 電気銅めっき方法、電気銅めっき用純銅アノード及びこれらを用いてめっきされたパーティクル付着の少ない半導体ウエハ |
JP2003231995A (ja) * | 2002-02-13 | 2003-08-19 | Nikko Materials Co Ltd | 電気銅めっき用含リン銅アノード、該含リン銅アノードを使用する電気銅めっき方法、これらを用いてめっきされたパーティクル付着の少ない半導体ウエハ |
Non-Patent Citations (1)
Title |
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See also references of EP2213772A4 |
Also Published As
Publication number | Publication date |
---|---|
CN101796224B (zh) | 2014-06-18 |
EP2213772A4 (en) | 2012-01-11 |
JP5066577B2 (ja) | 2012-11-07 |
TW200924037A (en) | 2009-06-01 |
JPWO2009057422A1 (ja) | 2011-03-10 |
EP2213772A1 (en) | 2010-08-04 |
US8216438B2 (en) | 2012-07-10 |
CN101796224A (zh) | 2010-08-04 |
CN103266337A (zh) | 2013-08-28 |
EP2213772B1 (en) | 2016-08-17 |
JP2012188760A (ja) | 2012-10-04 |
KR20090096537A (ko) | 2009-09-10 |
TWI492279B (zh) | 2015-07-11 |
KR101945043B1 (ko) | 2019-02-01 |
JP5709175B2 (ja) | 2015-04-30 |
US20100096271A1 (en) | 2010-04-22 |
CN103726097A (zh) | 2014-04-16 |
CN103726097B (zh) | 2016-08-17 |
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