WO2009054410A1 - Conductive particle, circuit connecting material, and connection structure - Google Patents

Conductive particle, circuit connecting material, and connection structure Download PDF

Info

Publication number
WO2009054410A1
WO2009054410A1 PCT/JP2008/069142 JP2008069142W WO2009054410A1 WO 2009054410 A1 WO2009054410 A1 WO 2009054410A1 JP 2008069142 W JP2008069142 W JP 2008069142W WO 2009054410 A1 WO2009054410 A1 WO 2009054410A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit connecting
conductive particle
connecting material
connection structure
point
Prior art date
Application number
PCT/JP2008/069142
Other languages
French (fr)
Japanese (ja)
Inventor
Toshiaki Tanaka
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008231035A external-priority patent/JP5141456B2/en
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to KR1020127033932A priority Critical patent/KR101254474B1/en
Priority to CN200880112368A priority patent/CN101836333A/en
Publication of WO2009054410A1 publication Critical patent/WO2009054410A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Disclosed is a circuit connecting material (50) for connecting a first electrode and a second electrode facing each other, which contains an adhesive composition (52) and conductive particles (10) dispersed in the adhesive composition (52). Each conductive particle (10) comprises a core (12) mainly composed of a material having a melting point or softening point of T1 (˚C), a conductive layer (14) covering the surface of the core (12) and mainly composed of a low-melting-point metal having a melting point of T2 (˚C), and an insulating layer (16) covering the surface of the conductive layer (14) and composed of a resin composition having a softening point of T3 (˚C). In this connection, T1, T2 and T3 satisfy the following formula (1). T1 > T2 > T3 (1)
PCT/JP2008/069142 2007-10-24 2008-10-22 Conductive particle, circuit connecting material, and connection structure WO2009054410A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020127033932A KR101254474B1 (en) 2007-10-24 2008-10-22 Circuit connecting material and connection structure
CN200880112368A CN101836333A (en) 2007-10-24 2008-10-22 Conductive particle, circuit connecting material, and connection structure

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007276363 2007-10-24
JP2007-276363 2007-10-24
JP2008231035A JP5141456B2 (en) 2007-10-24 2008-09-09 Circuit connection material and connection structure
JP2008-231035 2008-09-09

Publications (1)

Publication Number Publication Date
WO2009054410A1 true WO2009054410A1 (en) 2009-04-30

Family

ID=40579514

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069142 WO2009054410A1 (en) 2007-10-24 2008-10-22 Conductive particle, circuit connecting material, and connection structure

Country Status (1)

Country Link
WO (1) WO2009054410A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011062149A1 (en) * 2009-11-17 2011-05-26 日立化成工業株式会社 Circuit connection material, connection structure using same, and temporary pressure-bonding method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05334912A (en) * 1992-06-01 1993-12-17 Casio Comput Co Ltd Anisotropic conductive adhesive and conductive connection structure
JP2000105388A (en) * 1998-09-30 2000-04-11 Matsushita Electric Ind Co Ltd Production of liquid crystal display device, liquid crystal display device and conductive adhesive film
JP2006185922A (en) * 2006-01-11 2006-07-13 Hitachi Chem Co Ltd Connecting structure of electrode
JP2007510268A (en) * 2003-11-06 2007-04-19 チェイル インダストリーズ インコーポレイテッド Insulating conductive fine particles and anisotropic conductive film containing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05334912A (en) * 1992-06-01 1993-12-17 Casio Comput Co Ltd Anisotropic conductive adhesive and conductive connection structure
JP2000105388A (en) * 1998-09-30 2000-04-11 Matsushita Electric Ind Co Ltd Production of liquid crystal display device, liquid crystal display device and conductive adhesive film
JP2007510268A (en) * 2003-11-06 2007-04-19 チェイル インダストリーズ インコーポレイテッド Insulating conductive fine particles and anisotropic conductive film containing the same
JP2006185922A (en) * 2006-01-11 2006-07-13 Hitachi Chem Co Ltd Connecting structure of electrode

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011062149A1 (en) * 2009-11-17 2011-05-26 日立化成工業株式会社 Circuit connection material, connection structure using same, and temporary pressure-bonding method
CN102686690A (en) * 2009-11-17 2012-09-19 日立化成工业株式会社 Circuit connection material, connection structure using same, and temporary pressure-bonding method
JP2015091957A (en) * 2009-11-17 2015-05-14 日立化成株式会社 Circuit connection material, connection structure using the same and temporal crimping method
CN104877611A (en) * 2009-11-17 2015-09-02 日立化成工业株式会社 Circuit Connection Material, Connection Structure Using Same, And Temporary Pressure-bonding Method
JP5944102B2 (en) * 2009-11-17 2016-07-05 日立化成株式会社 Circuit connection material and connection structure using the same

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