WO2009054410A1 - Conductive particle, circuit connecting material, and connection structure - Google Patents
Conductive particle, circuit connecting material, and connection structure Download PDFInfo
- Publication number
- WO2009054410A1 WO2009054410A1 PCT/JP2008/069142 JP2008069142W WO2009054410A1 WO 2009054410 A1 WO2009054410 A1 WO 2009054410A1 JP 2008069142 W JP2008069142 W JP 2008069142W WO 2009054410 A1 WO2009054410 A1 WO 2009054410A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit connecting
- conductive particle
- connecting material
- connection structure
- point
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020127033932A KR101254474B1 (en) | 2007-10-24 | 2008-10-22 | Circuit connecting material and connection structure |
CN200880112368A CN101836333A (en) | 2007-10-24 | 2008-10-22 | Conductive particle, circuit connecting material, and connection structure |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007276363 | 2007-10-24 | ||
JP2007-276363 | 2007-10-24 | ||
JP2008231035A JP5141456B2 (en) | 2007-10-24 | 2008-09-09 | Circuit connection material and connection structure |
JP2008-231035 | 2008-09-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009054410A1 true WO2009054410A1 (en) | 2009-04-30 |
Family
ID=40579514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/069142 WO2009054410A1 (en) | 2007-10-24 | 2008-10-22 | Conductive particle, circuit connecting material, and connection structure |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009054410A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011062149A1 (en) * | 2009-11-17 | 2011-05-26 | 日立化成工業株式会社 | Circuit connection material, connection structure using same, and temporary pressure-bonding method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05334912A (en) * | 1992-06-01 | 1993-12-17 | Casio Comput Co Ltd | Anisotropic conductive adhesive and conductive connection structure |
JP2000105388A (en) * | 1998-09-30 | 2000-04-11 | Matsushita Electric Ind Co Ltd | Production of liquid crystal display device, liquid crystal display device and conductive adhesive film |
JP2006185922A (en) * | 2006-01-11 | 2006-07-13 | Hitachi Chem Co Ltd | Connecting structure of electrode |
JP2007510268A (en) * | 2003-11-06 | 2007-04-19 | チェイル インダストリーズ インコーポレイテッド | Insulating conductive fine particles and anisotropic conductive film containing the same |
-
2008
- 2008-10-22 WO PCT/JP2008/069142 patent/WO2009054410A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05334912A (en) * | 1992-06-01 | 1993-12-17 | Casio Comput Co Ltd | Anisotropic conductive adhesive and conductive connection structure |
JP2000105388A (en) * | 1998-09-30 | 2000-04-11 | Matsushita Electric Ind Co Ltd | Production of liquid crystal display device, liquid crystal display device and conductive adhesive film |
JP2007510268A (en) * | 2003-11-06 | 2007-04-19 | チェイル インダストリーズ インコーポレイテッド | Insulating conductive fine particles and anisotropic conductive film containing the same |
JP2006185922A (en) * | 2006-01-11 | 2006-07-13 | Hitachi Chem Co Ltd | Connecting structure of electrode |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011062149A1 (en) * | 2009-11-17 | 2011-05-26 | 日立化成工業株式会社 | Circuit connection material, connection structure using same, and temporary pressure-bonding method |
CN102686690A (en) * | 2009-11-17 | 2012-09-19 | 日立化成工业株式会社 | Circuit connection material, connection structure using same, and temporary pressure-bonding method |
JP2015091957A (en) * | 2009-11-17 | 2015-05-14 | 日立化成株式会社 | Circuit connection material, connection structure using the same and temporal crimping method |
CN104877611A (en) * | 2009-11-17 | 2015-09-02 | 日立化成工业株式会社 | Circuit Connection Material, Connection Structure Using Same, And Temporary Pressure-bonding Method |
JP5944102B2 (en) * | 2009-11-17 | 2016-07-05 | 日立化成株式会社 | Circuit connection material and connection structure using the same |
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