WO2009041464A1 - Package for pressure sensor - Google Patents

Package for pressure sensor Download PDF

Info

Publication number
WO2009041464A1
WO2009041464A1 PCT/JP2008/067240 JP2008067240W WO2009041464A1 WO 2009041464 A1 WO2009041464 A1 WO 2009041464A1 JP 2008067240 W JP2008067240 W JP 2008067240W WO 2009041464 A1 WO2009041464 A1 WO 2009041464A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure sensor
package
pads
sensor chip
semiconductor pressure
Prior art date
Application number
PCT/JP2008/067240
Other languages
French (fr)
Japanese (ja)
Inventor
Yukihiro Gorai
Katsuya Kikuiri
Tetsuya Fukuda
Original Assignee
Alps Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co., Ltd. filed Critical Alps Electric Co., Ltd.
Publication of WO2009041464A1 publication Critical patent/WO2009041464A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

Intended is to provide a pressure sensor package, which can achieve an excellent rinsing property and a high reliability. The package contains a semiconductor pressure sensor chip (1) having a plurality of pads (24) in the periphery of a diaphragm (21) so that a pressure introducing space is formed in the semiconductor pressure sensor chip (1) by a sealing plate (117). The package includes a plurality of pads (113b) wire-bonded to the pads (24) of the semiconductor pressure sensor chip (1), and at least a pair of pressure introduction ports (125) formed in the side walls of the package confronting across the semiconductor pressure sensor chip (1) in the pressure introducing space. The pressure introduction ports (125) are so formed close to the sealing plate (117) as to have a width equal to or larger than the spacing (W2) of a resin (123) sealing the pads (24) and a wire bonding (121).
PCT/JP2008/067240 2007-09-25 2008-09-25 Package for pressure sensor WO2009041464A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-247087 2007-09-25
JP2007247087A JP2010281569A (en) 2007-09-25 2007-09-25 Package for pressure sensor

Publications (1)

Publication Number Publication Date
WO2009041464A1 true WO2009041464A1 (en) 2009-04-02

Family

ID=40511347

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067240 WO2009041464A1 (en) 2007-09-25 2008-09-25 Package for pressure sensor

Country Status (2)

Country Link
JP (1) JP2010281569A (en)
WO (1) WO2009041464A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112013001218B4 (en) 2012-02-29 2023-05-11 Omron Corporation Pressure sensor housing and method for its manufacture

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012207931A (en) * 2011-03-29 2012-10-25 Omron Corp Pressure sensor package
JP5756181B2 (en) * 2011-11-04 2015-07-29 アルプス電気株式会社 Pressure sensor device
JP2014085289A (en) * 2012-10-26 2014-05-12 Murata Mfg Co Ltd Semiconductor pressure sensor
JP6737675B2 (en) * 2016-09-27 2020-08-12 京セラ株式会社 Package for mounting pressure sensing element, pressure sensing device and electronic module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719979A (en) * 1993-06-29 1995-01-20 Omron Corp Pressure sensor chip and pressure sensor
JP2004219402A (en) * 2002-12-24 2004-08-05 Denso Corp Pressure sensor device and manufacturing method therefor
JP2005091166A (en) * 2003-09-17 2005-04-07 Matsushita Electric Works Ltd Semiconductor pressure sensor
EP1717562A1 (en) * 2005-04-29 2006-11-02 Sensirion AG A method for packaging integrated sensors
WO2008065883A1 (en) * 2006-11-29 2008-06-05 Fujikura Ltd. Pressure sensor module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719979A (en) * 1993-06-29 1995-01-20 Omron Corp Pressure sensor chip and pressure sensor
JP2004219402A (en) * 2002-12-24 2004-08-05 Denso Corp Pressure sensor device and manufacturing method therefor
JP2005091166A (en) * 2003-09-17 2005-04-07 Matsushita Electric Works Ltd Semiconductor pressure sensor
EP1717562A1 (en) * 2005-04-29 2006-11-02 Sensirion AG A method for packaging integrated sensors
WO2008065883A1 (en) * 2006-11-29 2008-06-05 Fujikura Ltd. Pressure sensor module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112013001218B4 (en) 2012-02-29 2023-05-11 Omron Corporation Pressure sensor housing and method for its manufacture

Also Published As

Publication number Publication date
JP2010281569A (en) 2010-12-16

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