WO2009028269A1 - Element assembly, and its manufacturing method - Google Patents

Element assembly, and its manufacturing method Download PDF

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Publication number
WO2009028269A1
WO2009028269A1 PCT/JP2008/062747 JP2008062747W WO2009028269A1 WO 2009028269 A1 WO2009028269 A1 WO 2009028269A1 JP 2008062747 W JP2008062747 W JP 2008062747W WO 2009028269 A1 WO2009028269 A1 WO 2009028269A1
Authority
WO
WIPO (PCT)
Prior art keywords
recess
mounting
electrode
cover
plate
Prior art date
Application number
PCT/JP2008/062747
Other languages
French (fr)
Japanese (ja)
Inventor
Makoto Moriguchi
Shobu Sato
Original Assignee
Omron Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corporation filed Critical Omron Corporation
Publication of WO2009028269A1 publication Critical patent/WO2009028269A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C10/00—Adjustable resistors
    • H01C10/10—Adjustable resistors adjustable by mechanical pressure or force
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/40—Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F21/00—Variable inductances or transformers of the signal type
    • H01F21/12—Variable inductances or transformers of the signal type discontinuously variable, e.g. tapped
    • H01F2021/125—Printed variable inductor with taps, e.g. for VCO
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F21/00—Variable inductances or transformers of the signal type
    • H01F21/02—Variable inductances or transformers of the signal type continuously variable, e.g. variometers
    • H01F21/08—Variable inductances or transformers of the signal type continuously variable, e.g. variometers by varying the permeability of the core, e.g. by varying magnetic bias

Abstract

In the upper face of a substrate (22), there are formed a plurality of recesses (25). In one recess, a variable condenser (27) is formed by mounting a plate-shaped stationary electrode (30) on the bottom face of the recess (25) and by mounting a plate-shaped movable electrode (31) in a confronting manner on the back of a cover (23). In another recess, a stationary electrode (33) is mounted on the bottom of the recess (25), and a moving electrode (34) is mounted in a confronting manner on the back of the cover (23), so that a high resistor (35) is formed between the two electrodes, thereby to form a variable resistor (28). In still another recess, a variable inductor (29) is formed by mounting a plate-shaped stationary electrode (36) on the bottom of the recess (25) and by mounting a zigzag-meandering movable electrode (37) in a confronting manner on the back of the cover (23).
PCT/JP2008/062747 2007-08-31 2008-07-15 Element assembly, and its manufacturing method WO2009028269A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007225487A JP5352975B2 (en) 2007-08-31 2007-08-31 Element assembly and manufacturing method thereof
JP2007-225487 2007-08-31

Publications (1)

Publication Number Publication Date
WO2009028269A1 true WO2009028269A1 (en) 2009-03-05

Family

ID=40386998

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062747 WO2009028269A1 (en) 2007-08-31 2008-07-15 Element assembly, and its manufacturing method

Country Status (3)

Country Link
JP (1) JP5352975B2 (en)
TW (1) TW200917301A (en)
WO (1) WO2009028269A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3863176A4 (en) * 2018-10-23 2021-10-27 Huawei Technologies Co., Ltd. Method for preparing monolithic integrated baw resonator

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101541906B1 (en) * 2007-11-07 2015-08-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Micro-electro-mechanical device and method of manufacturing the same
JP5271674B2 (en) * 2007-11-13 2013-08-21 株式会社半導体エネルギー研究所 Micro electromechanical device
JP5317635B2 (en) * 2007-11-30 2013-10-16 株式会社半導体エネルギー研究所 Method for manufacturing micro electromechanical device
JP2009272354A (en) * 2008-04-30 2009-11-19 Omron Corp Dielectric material for sealing variable capacitor, variable capacitor and element assembly
WO2012123991A1 (en) 2011-03-16 2012-09-20 富士通株式会社 Electronic apparatus comprising variable capacitance element and method of manufacturing same
WO2012164974A1 (en) 2011-06-02 2012-12-06 アルプス電気株式会社 Variable capacitance capacitor
CN110459388B (en) * 2019-09-03 2024-04-09 浙江江山变压器股份有限公司 Radial free-arrangement continuous dry-type transformer winding and processing method thereof

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119012A (en) * 1984-11-15 1986-06-06 Toyo Commun Equip Co Ltd Loose coupling transformer
JPH04346278A (en) * 1991-05-23 1992-12-02 Kenichi Arai Magnetostriction/electrostriction converting element and converter
JPH056802U (en) * 1991-07-08 1993-01-29 ホシデン株式会社 Displacement-electric resistance conversion element
JPH0696957A (en) * 1992-09-14 1994-04-08 Murata Mfg Co Ltd Chip type variable inductor
JPH0686325U (en) * 1993-05-27 1994-12-13 株式会社村田製作所 Variable capacitor
JPH08213282A (en) * 1995-02-01 1996-08-20 Murata Mfg Co Ltd Variable capacitance capacitor
JPH09199376A (en) * 1996-01-18 1997-07-31 Murata Mfg Co Ltd Variable-capacitance capacitor
JP2001320150A (en) * 2000-02-29 2001-11-16 Mitsui Chemicals Inc Wiring board by stamper and manufacturing method thereof
WO2003069776A2 (en) * 2002-02-13 2003-08-21 Commissariat A L'energie Atomique Tunable bulk acoustic wave mems microresonator
JP2005332802A (en) * 2004-04-22 2005-12-02 Ngk Insulators Ltd Microswitch and its manufacturing method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4675960A (en) * 1985-12-30 1987-06-30 Motorola, Inc. Method of manufacturing an electrically variable piezoelectric hybrid capacitor
JPH06111971A (en) * 1992-09-30 1994-04-22 Toshiba Lighting & Technol Corp Electrodeless discharge lamp lighting device
JP3544839B2 (en) * 1997-10-13 2004-07-21 シャープ株式会社 Variable capacitance element
JP2003243254A (en) * 2002-02-14 2003-08-29 Murata Mfg Co Ltd Variable capacitor
JP2004045178A (en) * 2002-07-11 2004-02-12 Nitta Ind Corp Capacitance type sensor
US6958255B2 (en) * 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
KR100608927B1 (en) * 2005-05-26 2006-08-08 한국과학기술원 Electrode layer for capacitor, method of manufacturing the electrode layer, unit sensor using the electrode layer and tactile sensor using the unit sensor

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119012A (en) * 1984-11-15 1986-06-06 Toyo Commun Equip Co Ltd Loose coupling transformer
JPH04346278A (en) * 1991-05-23 1992-12-02 Kenichi Arai Magnetostriction/electrostriction converting element and converter
JPH056802U (en) * 1991-07-08 1993-01-29 ホシデン株式会社 Displacement-electric resistance conversion element
JPH0696957A (en) * 1992-09-14 1994-04-08 Murata Mfg Co Ltd Chip type variable inductor
JPH0686325U (en) * 1993-05-27 1994-12-13 株式会社村田製作所 Variable capacitor
JPH08213282A (en) * 1995-02-01 1996-08-20 Murata Mfg Co Ltd Variable capacitance capacitor
JPH09199376A (en) * 1996-01-18 1997-07-31 Murata Mfg Co Ltd Variable-capacitance capacitor
JP2001320150A (en) * 2000-02-29 2001-11-16 Mitsui Chemicals Inc Wiring board by stamper and manufacturing method thereof
WO2003069776A2 (en) * 2002-02-13 2003-08-21 Commissariat A L'energie Atomique Tunable bulk acoustic wave mems microresonator
JP2005332802A (en) * 2004-04-22 2005-12-02 Ngk Insulators Ltd Microswitch and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3863176A4 (en) * 2018-10-23 2021-10-27 Huawei Technologies Co., Ltd. Method for preparing monolithic integrated baw resonator

Also Published As

Publication number Publication date
TW200917301A (en) 2009-04-16
JP2009059866A (en) 2009-03-19
JP5352975B2 (en) 2013-11-27

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