WO2009022630A1 - Conductive resin composition and substrate having conductive pattern obtained by using the same - Google Patents

Conductive resin composition and substrate having conductive pattern obtained by using the same Download PDF

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Publication number
WO2009022630A1
WO2009022630A1 PCT/JP2008/064241 JP2008064241W WO2009022630A1 WO 2009022630 A1 WO2009022630 A1 WO 2009022630A1 JP 2008064241 W JP2008064241 W JP 2008064241W WO 2009022630 A1 WO2009022630 A1 WO 2009022630A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
conductive
conductive resin
substrate
metal coating
Prior art date
Application number
PCT/JP2008/064241
Other languages
French (fr)
Japanese (ja)
Inventor
Nobuyuki Suzuki
Hiroyuki Tokai
Kazutaka Nakada
Original Assignee
Taiyo Ink Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg. Co., Ltd. filed Critical Taiyo Ink Mfg. Co., Ltd.
Publication of WO2009022630A1 publication Critical patent/WO2009022630A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal

Abstract

Disclosed is a conductive resin composition which is excellent in oxidation resistance at high temperatures and enables to form a conductive pattern during fine pattern formation. Also disclosed is a substrate having a low-cost conductive pattern using such a conductive resin composition. Specifically disclosed is a conductive resin composition containing an organic binder (A) and a conductive powder (B), which is characterized in that the conductive powder (B) contains a two-layer-coated copper particle (C) having a core of a copper particle, a first metal coating layer formed on the surface of the copper particle and a second metal coating layer as the outermost layer. The conductive resin composition is further characterized in that the first metal coating layer is composed of at least one element selected from Ni, Co, Mn and Cr, and the second metal coating layer is composed of Ag. Also specifically disclosed is a substrate having a conductive pattern formed by using the conductive resin composition.
PCT/JP2008/064241 2007-08-10 2008-08-07 Conductive resin composition and substrate having conductive pattern obtained by using the same WO2009022630A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-209097 2007-08-10
JP2007209097A JP5421523B2 (en) 2007-08-10 2007-08-10 Conductive resin composition and substrate having conductive pattern obtained using the same

Publications (1)

Publication Number Publication Date
WO2009022630A1 true WO2009022630A1 (en) 2009-02-19

Family

ID=40350683

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064241 WO2009022630A1 (en) 2007-08-10 2008-08-07 Conductive resin composition and substrate having conductive pattern obtained by using the same

Country Status (4)

Country Link
JP (1) JP5421523B2 (en)
KR (1) KR20090125771A (en)
CN (1) CN101641413A (en)
WO (1) WO2009022630A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014037537A (en) * 2013-08-27 2014-02-27 Taiyo Holdings Co Ltd Conductive resin composition and substrate having conductive pattern obtained by using the same
CN104558526B (en) * 2013-10-28 2018-02-13 中国石油化工股份有限公司 The preparation method of hot melt prepreg medium temperature fast-curing epoxy resin composition
CN104559066B (en) * 2013-10-28 2018-01-09 中国石油化工股份有限公司 Hot melt prepreg intermediate temperature setting composition epoxy resin and preparation method thereof
JP5854248B1 (en) * 2015-05-27 2016-02-09 東洋インキＳｃホールディングス株式会社 Conductive adhesive, and conductive adhesive sheet and electromagnetic wave shielding sheet using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0477547A (en) * 1990-07-16 1992-03-11 Mitsui Mining & Smelting Co Ltd Electrically conductive copper composition
JPH04170491A (en) * 1990-11-02 1992-06-18 Oki Electric Ind Co Ltd Paste for forming thick-film conductor
JP2002289038A (en) * 2001-03-23 2002-10-04 Kyoto Elex Kk Conductive paste composition for use in filling via
JP2004156062A (en) * 2002-11-01 2004-06-03 Mitsui Mining & Smelting Co Ltd Double layer-coated copper powder, method for production thereof, and conductive paste obtained by using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0477547A (en) * 1990-07-16 1992-03-11 Mitsui Mining & Smelting Co Ltd Electrically conductive copper composition
JPH04170491A (en) * 1990-11-02 1992-06-18 Oki Electric Ind Co Ltd Paste for forming thick-film conductor
JP2002289038A (en) * 2001-03-23 2002-10-04 Kyoto Elex Kk Conductive paste composition for use in filling via
JP2004156062A (en) * 2002-11-01 2004-06-03 Mitsui Mining & Smelting Co Ltd Double layer-coated copper powder, method for production thereof, and conductive paste obtained by using the same

Also Published As

Publication number Publication date
JP2009040932A (en) 2009-02-26
KR20090125771A (en) 2009-12-07
CN101641413A (en) 2010-02-03
JP5421523B2 (en) 2014-02-19

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