WO2009022517A1 - 配線基板、及び、液晶表示装置 - Google Patents

配線基板、及び、液晶表示装置 Download PDF

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Publication number
WO2009022517A1
WO2009022517A1 PCT/JP2008/062898 JP2008062898W WO2009022517A1 WO 2009022517 A1 WO2009022517 A1 WO 2009022517A1 JP 2008062898 W JP2008062898 W JP 2008062898W WO 2009022517 A1 WO2009022517 A1 WO 2009022517A1
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WIPO (PCT)
Prior art keywords
row
wiring board
liquid crystal
display device
crystal display
Prior art date
Application number
PCT/JP2008/062898
Other languages
English (en)
French (fr)
Inventor
Takashi Matsui
Motoji Shiota
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Priority to CN200880102513A priority Critical patent/CN101779526A/zh
Priority to US12/673,440 priority patent/US20120006584A1/en
Publication of WO2009022517A1 publication Critical patent/WO2009022517A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
  • Liquid Crystal (AREA)

Abstract

　本発明の配線基板（１）は、複数列に配置されたパッド（３０）のうち、パッド（３０）へのメタル配線（１０）の長さが長い第１列パッド（３０ａ）と、メタル配線（１０）の長さが、第１列パッド（３０ａ）の第１メタル配線（１０ａ）よりも短い第２列パッド（３０ｂ）とにおいて、第１列パッド（３０ａ）に接続された第１メタル配線（１０ａ）は、隣接する第２列パッド（３０ｂ）の間の領域ではなく、第２列パッド（３０ｂ）の下層領域に、第２列パッド（３０ｂ）のとの間に少なくとも絶縁層を介して設けられている。
PCT/JP2008/062898 2007-08-10 2008-07-17 配線基板、及び、液晶表示装置 WO2009022517A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880102513A CN101779526A (zh) 2007-08-10 2008-07-17 配线基板和液晶显示装置
US12/673,440 US20120006584A1 (en) 2007-08-10 2008-07-17 Wiring board and liquid crystal display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007210336 2007-08-10
JP2007-210336 2007-08-10

Publications (1)

Publication Number Publication Date
WO2009022517A1 true WO2009022517A1 (ja) 2009-02-19

Family

ID=40350572

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Application Number Title Priority Date Filing Date
PCT/JP2008/062898 WO2009022517A1 (ja) 2007-08-10 2008-07-17 配線基板、及び、液晶表示装置

Country Status (3)

Country Link
US (1) US20120006584A1 (ja)
CN (1) CN101779526A (ja)
WO (1) WO2009022517A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013065364A (ja) * 2011-09-15 2013-04-11 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法
JP2015133165A (ja) * 2015-02-23 2015-07-23 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP2017097040A (ja) * 2015-11-19 2017-06-01 三菱電機株式会社 液晶表示装置
JP2022003399A (ja) * 2014-09-05 2022-01-11 株式会社半導体エネルギー研究所 表示装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI423410B (zh) * 2010-12-31 2014-01-11 Au Optronics Corp 金屬導電結構及其製作方法
CN102655131A (zh) * 2011-03-04 2012-09-05 元太科技工业股份有限公司 电极阵列及电极阵列制作方法
US9508618B2 (en) * 2014-04-11 2016-11-29 Globalfoundries Inc. Staggered electrical frame structures for frame area reduction
CN105093758A (zh) * 2015-09-07 2015-11-25 深圳市华星光电技术有限公司 一种液晶显示面板及装置
CN205264316U (zh) * 2015-12-30 2016-05-25 京东方科技集团股份有限公司 阵列基板及显示器件
CN106338866B (zh) * 2016-10-18 2019-08-02 武汉华星光电技术有限公司 一种液晶面板的焊盘区域结构
CN107422551A (zh) * 2017-07-25 2017-12-01 武汉天马微电子有限公司 一种显示装置
CN107167971A (zh) * 2017-07-28 2017-09-15 武汉天马微电子有限公司 显示面板和显示装置
KR102481818B1 (ko) 2017-08-22 2022-12-28 삼성디스플레이 주식회사 전자 부품 및 이를 포함하는 전자 장치
WO2021077334A1 (zh) * 2019-10-23 2021-04-29 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH11282012A (ja) * 1998-03-30 1999-10-15 Seiko Epson Corp アクティブマトリクス基板および液晶表示装置
JP2002202522A (ja) * 2000-12-13 2002-07-19 Lg Phillips Lcd Co Ltd 液晶ディスプレイパネル及びその製造方法
JP2004252466A (ja) * 2003-02-20 2004-09-09 Samsung Electronics Co Ltd 駆動ｉｃ及びこれを具備したディスプレイ装置

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
CN1195243C (zh) * 1999-09-30 2005-03-30 三星电子株式会社 用于液晶显示器的薄膜晶体管阵列屏板及其制造方法
CN1592866A (zh) * 2000-11-08 2005-03-09 西铁城时计株式会社 液晶显示装置
KR100795344B1 (ko) * 2001-05-29 2008-01-17 엘지.필립스 엘시디 주식회사 액정표시장치용 어레이 기판 및 그의 제조방법
TW200530655A (en) * 2004-03-05 2005-09-16 Toppoly Optoelectronics Corp Display panel, lead pad structure, lead pad array structure and method of fabricating the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11282012A (ja) * 1998-03-30 1999-10-15 Seiko Epson Corp アクティブマトリクス基板および液晶表示装置
JP2002202522A (ja) * 2000-12-13 2002-07-19 Lg Phillips Lcd Co Ltd 液晶ディスプレイパネル及びその製造方法
JP2004252466A (ja) * 2003-02-20 2004-09-09 Samsung Electronics Co Ltd 駆動ｉｃ及びこれを具備したディスプレイ装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013065364A (ja) * 2011-09-15 2013-04-11 Dainippon Printing Co Ltd サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法
JP2022003399A (ja) * 2014-09-05 2022-01-11 株式会社半導体エネルギー研究所 表示装置
JP2015133165A (ja) * 2015-02-23 2015-07-23 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
JP2017097040A (ja) * 2015-11-19 2017-06-01 三菱電機株式会社 液晶表示装置

Also Published As

Publication number Publication date
CN101779526A (zh) 2010-07-14
US20120006584A1 (en) 2012-01-12

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