WO2009020052A1 - 塗布方法 - Google Patents

塗布方法 Download PDF

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Publication number
WO2009020052A1
WO2009020052A1 PCT/JP2008/063798 JP2008063798W WO2009020052A1 WO 2009020052 A1 WO2009020052 A1 WO 2009020052A1 JP 2008063798 W JP2008063798 W JP 2008063798W WO 2009020052 A1 WO2009020052 A1 WO 2009020052A1
Authority
WO
WIPO (PCT)
Prior art keywords
main body
adhesion layer
wafer
tool main
sidewall
Prior art date
Application number
PCT/JP2008/063798
Other languages
English (en)
French (fr)
Inventor
Takeshi Segawa
Original Assignee
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corporation filed Critical Lintec Corporation
Publication of WO2009020052A1 publication Critical patent/WO2009020052A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

バックグラインド工程を経て極薄に研削されたウエハの研削面に、塗布剤を滴下し、平滑化させて所定の膜を形成する際、ウエハを破損しないようにする。 ウエハＷの片面に固定治具（１）を密着固定した状態で搬送し、塗布装置で保持する。固定治具として、板状の治具本体（２）と、当該治具本体の片面に設けられた、半導体ウエハを着脱自在に密着保持する密着層（３）とから構成する。治具本体は、片面に前記密着層を支持する複数の支持突起（４）を有すると共に、片面の外周部に前記支持突起と同等高さの側壁（５）を有し、この側壁の端面に前記密着層が接着されて、前記密着層と前記治具本体との間に前記側壁で囲われた区画空間（６）が画成され、前記治具本体に前記区画空間に連通する通気孔（７）が形成され、この通気孔を介して前記区画空間内の空気を吸引することにより、前記密着層が変形されるものを用いる。
PCT/JP2008/063798 2007-08-09 2008-07-31 塗布方法 WO2009020052A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007208265A JP2009043997A (ja) 2007-08-09 2007-08-09 塗布方法
JP2007-208265 2007-08-09

Publications (1)

Publication Number Publication Date
WO2009020052A1 true WO2009020052A1 (ja) 2009-02-12

Family

ID=40341286

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063798 WO2009020052A1 (ja) 2007-08-09 2008-07-31 塗布方法

Country Status (3)

Country Link
JP (1) JP2009043997A (ja)
TW (1) TW200923586A (ja)
WO (1) WO2009020052A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101534357B1 (ko) 2009-03-31 2015-07-06 도쿄엘렉트론가부시키가이샤 기판 지지 장치 및 기판 지지 방법
JP2010239026A (ja) * 2009-03-31 2010-10-21 Tokyo Electron Ltd 基板保持部材及び液処理装置
JP5757649B2 (ja) * 2011-02-14 2015-07-29 信越ポリマー株式会社 保持治具
CN104465459A (zh) * 2014-11-12 2015-03-25 南通富士通微电子股份有限公司 晶圆刷胶的工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006318984A (ja) * 2005-05-10 2006-11-24 Shin Etsu Polymer Co Ltd 固定キャリア及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006318984A (ja) * 2005-05-10 2006-11-24 Shin Etsu Polymer Co Ltd 固定キャリア及びその製造方法

Also Published As

Publication number Publication date
TW200923586A (en) 2009-06-01
JP2009043997A (ja) 2009-02-26

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