WO2009008307A1 - Manufacturing method of wiring board - Google Patents

Manufacturing method of wiring board Download PDF

Info

Publication number
WO2009008307A1
WO2009008307A1 PCT/JP2008/062006 JP2008062006W WO2009008307A1 WO 2009008307 A1 WO2009008307 A1 WO 2009008307A1 JP 2008062006 W JP2008062006 W JP 2008062006W WO 2009008307 A1 WO2009008307 A1 WO 2009008307A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
manufacturing
protective base
base materials
bonded
Prior art date
Application number
PCT/JP2008/062006
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroyuki Sugayama
Masahiro Fukuda
Hidehiro Numao
Tatsushi Hirao
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Publication of WO2009008307A1 publication Critical patent/WO2009008307A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A manufacturing method of a wiring board allowing the flexibility of the wiring board to be kept by suppressing increase in its thickness, as well as reducing occurrence of plating failure. A protective base material (4) is laminated on one surface of each copper laminated board (3), and the protective base materials (4) are bonded together. Plating is performed while the protective base materials (4) are in a bonded state, and the bonded portion is then cut through in order to separate the respective wiring boards.
PCT/JP2008/062006 2007-07-12 2008-07-02 Manufacturing method of wiring board WO2009008307A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-183471 2007-07-12
JP2007183471A JP2009021435A (en) 2007-07-12 2007-07-12 Manufacturing method of wiring board

Publications (1)

Publication Number Publication Date
WO2009008307A1 true WO2009008307A1 (en) 2009-01-15

Family

ID=40228485

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062006 WO2009008307A1 (en) 2007-07-12 2008-07-02 Manufacturing method of wiring board

Country Status (3)

Country Link
JP (1) JP2009021435A (en)
TW (1) TW200922423A (en)
WO (1) WO2009008307A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052262A (en) * 2011-10-14 2013-04-17 北大方正集团有限公司 Method for manufacturing printing circuit board with different copper thicknesses
CN103796437A (en) * 2014-01-27 2014-05-14 广州兴森快捷电路科技有限公司 Method for manufacturing negative and positive copper foil circuit board
CN104254196A (en) * 2014-09-19 2014-12-31 江西景旺精密电路有限公司 Asymmetric copper thickness double-sided aluminum substrate and processing method thereof
CN109719404A (en) * 2019-01-15 2019-05-07 广东科翔电子科技有限公司 A kind of method of IC support plate laser drill

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62247596A (en) * 1986-04-21 1987-10-28 株式会社日立製作所 Manufacture of multilayer printed board
JPH11154788A (en) * 1997-11-20 1999-06-08 Nec Toyama Ltd Manufacture of multi-layered printed-wiring board
JPH11333975A (en) * 1998-05-26 1999-12-07 Ibiden Co Ltd Resin applied conductive foil, laminated sheet using the same and production of them
JP2001308548A (en) * 2000-04-11 2001-11-02 Lg Electronics Inc Multilayer printed circuit board, manufacturing method thereof and bga semiconductor package formed utilizing the same
JP2003324276A (en) * 2002-04-30 2003-11-14 Ngk Spark Plug Co Ltd Method of manufacturing wiring board
JP2004235323A (en) * 2003-01-29 2004-08-19 Fujitsu Ltd Manufacturing method of wiring substrate
JP2004363536A (en) * 2003-02-06 2004-12-24 Lg Electron Inc Interconnecting method for multilayer printed circuit board
JP2005236244A (en) * 2004-01-19 2005-09-02 Shinko Electric Ind Co Ltd Manufacturing method of circuit substrate
JP2006049660A (en) * 2004-08-06 2006-02-16 Cmk Corp Manufacturing method of printed wiring board
JP2006278774A (en) * 2005-03-29 2006-10-12 Hitachi Cable Ltd Double-sided wiring board, method for manufacturing the same and base substrate thereof

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62247596A (en) * 1986-04-21 1987-10-28 株式会社日立製作所 Manufacture of multilayer printed board
JPH11154788A (en) * 1997-11-20 1999-06-08 Nec Toyama Ltd Manufacture of multi-layered printed-wiring board
JPH11333975A (en) * 1998-05-26 1999-12-07 Ibiden Co Ltd Resin applied conductive foil, laminated sheet using the same and production of them
JP2001308548A (en) * 2000-04-11 2001-11-02 Lg Electronics Inc Multilayer printed circuit board, manufacturing method thereof and bga semiconductor package formed utilizing the same
JP2003324276A (en) * 2002-04-30 2003-11-14 Ngk Spark Plug Co Ltd Method of manufacturing wiring board
JP2004235323A (en) * 2003-01-29 2004-08-19 Fujitsu Ltd Manufacturing method of wiring substrate
JP2004363536A (en) * 2003-02-06 2004-12-24 Lg Electron Inc Interconnecting method for multilayer printed circuit board
JP2005236244A (en) * 2004-01-19 2005-09-02 Shinko Electric Ind Co Ltd Manufacturing method of circuit substrate
JP2006049660A (en) * 2004-08-06 2006-02-16 Cmk Corp Manufacturing method of printed wiring board
JP2006278774A (en) * 2005-03-29 2006-10-12 Hitachi Cable Ltd Double-sided wiring board, method for manufacturing the same and base substrate thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052262A (en) * 2011-10-14 2013-04-17 北大方正集团有限公司 Method for manufacturing printing circuit board with different copper thicknesses
CN103796437A (en) * 2014-01-27 2014-05-14 广州兴森快捷电路科技有限公司 Method for manufacturing negative and positive copper foil circuit board
CN104254196A (en) * 2014-09-19 2014-12-31 江西景旺精密电路有限公司 Asymmetric copper thickness double-sided aluminum substrate and processing method thereof
CN109719404A (en) * 2019-01-15 2019-05-07 广东科翔电子科技有限公司 A kind of method of IC support plate laser drill

Also Published As

Publication number Publication date
JP2009021435A (en) 2009-01-29
TW200922423A (en) 2009-05-16

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