WO2009005614A3 - 3d r/w cell with diode and resistive semiconductor element and method of making thereof - Google Patents

3d r/w cell with diode and resistive semiconductor element and method of making thereof Download PDF

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Publication number
WO2009005614A3
WO2009005614A3 PCT/US2008/007758 US2008007758W WO2009005614A3 WO 2009005614 A3 WO2009005614 A3 WO 2009005614A3 US 2008007758 W US2008007758 W US 2008007758W WO 2009005614 A3 WO2009005614 A3 WO 2009005614A3
Authority
WO
WIPO (PCT)
Prior art keywords
diode
cell
making
semiconductor element
resistive semiconductor
Prior art date
Application number
PCT/US2008/007758
Other languages
French (fr)
Other versions
WO2009005614A2 (en
Inventor
Tanmay Kumar
Christopher J Petti
Original Assignee
Sandisk 3D Llc
Tanmay Kumar
Christopher J Petti
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/819,895 external-priority patent/US7800939B2/en
Priority claimed from US11/819,989 external-priority patent/US7759666B2/en
Application filed by Sandisk 3D Llc, Tanmay Kumar, Christopher J Petti filed Critical Sandisk 3D Llc
Priority to EP08779718A priority Critical patent/EP2165337A2/en
Priority to CN200880024858.4A priority patent/CN101796588B/en
Priority to JP2010514766A priority patent/JP5695417B2/en
Publication of WO2009005614A2 publication Critical patent/WO2009005614A2/en
Publication of WO2009005614A3 publication Critical patent/WO2009005614A3/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/30—Resistive cell, memory material aspects
    • G11C2213/33—Material including silicon
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70—Resistive array aspects
    • G11C2213/72—Array wherein the access device being a diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)

Abstract

A nonvolatile memory device includes a semiconductor diode steering element, and a semiconductor read / write switching element.
PCT/US2008/007758 2007-06-29 2008-06-23 3d r/w cell with diode and resistive semiconductor element and method of making thereof WO2009005614A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08779718A EP2165337A2 (en) 2007-06-29 2008-06-23 3d r/w cell with diode and resistive semiconductor element and method of making thereof
CN200880024858.4A CN101796588B (en) 2007-06-29 2008-06-23 3d r/w cell with reduced reverse leakage and method of making thereof
JP2010514766A JP5695417B2 (en) 2007-06-29 2008-06-23 3D read / write cell with reduced reverse leakage and method of making it

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/819,895 2007-06-29
US11/819,989 2007-06-29
US11/819,895 US7800939B2 (en) 2007-06-29 2007-06-29 Method of making 3D R/W cell with reduced reverse leakage
US11/819,989 US7759666B2 (en) 2007-06-29 2007-06-29 3D R/W cell with reduced reverse leakage

Publications (2)

Publication Number Publication Date
WO2009005614A2 WO2009005614A2 (en) 2009-01-08
WO2009005614A3 true WO2009005614A3 (en) 2009-03-26

Family

ID=39735143

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/007758 WO2009005614A2 (en) 2007-06-29 2008-06-23 3d r/w cell with diode and resistive semiconductor element and method of making thereof

Country Status (6)

Country Link
EP (1) EP2165337A2 (en)
JP (1) JP5695417B2 (en)
KR (1) KR20100049564A (en)
CN (1) CN101796588B (en)
TW (1) TW200908205A (en)
WO (1) WO2009005614A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5367400B2 (en) * 2009-02-12 2013-12-11 株式会社東芝 Semiconductor memory device and manufacturing method thereof
JP2011165854A (en) * 2010-02-09 2011-08-25 Toshiba Corp Memory device and method of manufacturing the same
JP5422534B2 (en) * 2010-10-14 2014-02-19 株式会社東芝 Nonvolatile resistance change element and method of manufacturing nonvolatile resistance change element
US9331272B2 (en) 2011-06-10 2016-05-03 Seoul National University R&Db Foundation 3-dimensional (3D) non-volatile memory device and method of fabricating the same
US8748934B2 (en) * 2011-09-29 2014-06-10 Tsinghua University Vertical selection transistor, memory cell, and three-dimensional memory array structure and method for fabricating the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914055A (en) * 1989-08-24 1990-04-03 Advanced Micro Devices, Inc. Semiconductor antifuse structure and method
EP1376604A1 (en) * 2002-06-21 2004-01-02 Hewlett-Packard Development Company, L.P. Memory structures
WO2006078505A2 (en) * 2005-01-19 2006-07-27 Matrix Semiconductor, Inc. A non-volatile memory cell comprising a dielectric layer and a phase change material in series
US20070069276A1 (en) * 2005-09-28 2007-03-29 Scheuerlein Roy E Multi-use memory cell and memory array
US20070069217A1 (en) * 2003-12-03 2007-03-29 Herner S B P-i-n diode crystallized adjacent to a silicide in series with a dielectric anitfuse
US20070114508A1 (en) * 2005-11-23 2007-05-24 Matrix Semiconductor, Inc. Reversible resistivity-switching metal oxide or nitride layer with added metal

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050226067A1 (en) 2002-12-19 2005-10-13 Matrix Semiconductor, Inc. Nonvolatile memory cell operating by increasing order in polycrystalline semiconductor material
AU2003303259A1 (en) * 2002-12-20 2004-07-14 Koninklijke Philips Electronics N.V. Optical information storage unit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914055A (en) * 1989-08-24 1990-04-03 Advanced Micro Devices, Inc. Semiconductor antifuse structure and method
EP1376604A1 (en) * 2002-06-21 2004-01-02 Hewlett-Packard Development Company, L.P. Memory structures
US20070069217A1 (en) * 2003-12-03 2007-03-29 Herner S B P-i-n diode crystallized adjacent to a silicide in series with a dielectric anitfuse
WO2006078505A2 (en) * 2005-01-19 2006-07-27 Matrix Semiconductor, Inc. A non-volatile memory cell comprising a dielectric layer and a phase change material in series
US20070069276A1 (en) * 2005-09-28 2007-03-29 Scheuerlein Roy E Multi-use memory cell and memory array
US20070114508A1 (en) * 2005-11-23 2007-05-24 Matrix Semiconductor, Inc. Reversible resistivity-switching metal oxide or nitride layer with added metal

Also Published As

Publication number Publication date
TW200908205A (en) 2009-02-16
CN101796588B (en) 2013-07-24
EP2165337A2 (en) 2010-03-24
KR20100049564A (en) 2010-05-12
JP5695417B2 (en) 2015-04-08
JP2010532564A (en) 2010-10-07
CN101796588A (en) 2010-08-04
WO2009005614A2 (en) 2009-01-08

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