WO2009005042A1 - 金属材料、その製造方法、及びそれを用いた電気電子部品 - Google Patents
金属材料、その製造方法、及びそれを用いた電気電子部品 Download PDFInfo
- Publication number
- WO2009005042A1 WO2009005042A1 PCT/JP2008/061869 JP2008061869W WO2009005042A1 WO 2009005042 A1 WO2009005042 A1 WO 2009005042A1 JP 2008061869 W JP2008061869 W JP 2008061869W WO 2009005042 A1 WO2009005042 A1 WO 2009005042A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- same
- metal material
- producing
- electronic component
- electrical electronic
- Prior art date
Links
- 239000007769 metal material Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002344 surface layer Substances 0.000 abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 1
- 125000005647 linker group Chemical group 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
- C23C10/30—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes using a layer of powder or paste on the surface
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Details Of Resistors (AREA)
- Contacts (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009521629A JP4795466B2 (ja) | 2007-06-29 | 2008-06-30 | 金属材料、その製造方法、及びそれを用いた電気電子部品 |
EP08777720A EP2182093A4 (en) | 2007-06-29 | 2008-06-30 | METALLIC MATERIAL, METHOD FOR PRODUCING THE SAME, AND ELECTRIC-ELECTRONIC COMPONENT USING THE SAME |
US12/667,129 US20110036621A1 (en) | 2007-06-29 | 2008-06-30 | Metal material, method for producing the same, and electrical/electronic component using the same |
KR1020107001928A KR101505698B1 (ko) | 2007-06-29 | 2008-06-30 | 금속재료, 그 제조방법, 및 그것을 이용한 전기전자부품 |
CN200880022779XA CN101688312B (zh) | 2007-06-29 | 2008-06-30 | 金属材料、其制造方法、以及使用该金属材料的电气电子部件 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-173336 | 2007-06-29 | ||
JP2007173336 | 2007-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009005042A1 true WO2009005042A1 (ja) | 2009-01-08 |
Family
ID=40226086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/061869 WO2009005042A1 (ja) | 2007-06-29 | 2008-06-30 | 金属材料、その製造方法、及びそれを用いた電気電子部品 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110036621A1 (ja) |
EP (1) | EP2182093A4 (ja) |
JP (1) | JP4795466B2 (ja) |
KR (1) | KR101505698B1 (ja) |
CN (1) | CN101688312B (ja) |
TW (1) | TWI443232B (ja) |
WO (1) | WO2009005042A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013508902A (ja) * | 2009-10-19 | 2013-03-07 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | はんだフリーの電気的接続装置 |
WO2014034300A1 (ja) * | 2012-08-29 | 2014-03-06 | 株式会社オートネットワーク技術研究所 | コネクタ端子及びコネクタ端子用材料 |
US9263315B2 (en) | 2010-03-30 | 2016-02-16 | Dai Nippon Printing Co., Ltd. | LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate |
US9773960B2 (en) | 2010-11-02 | 2017-09-26 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5555146B2 (ja) * | 2010-12-01 | 2014-07-23 | 株式会社日立製作所 | 金属樹脂複合構造体及びその製造方法、並びにバスバ、モジュールケース及び樹脂製コネクタ部品 |
DE102011088211A1 (de) * | 2011-12-12 | 2013-06-13 | Robert Bosch Gmbh | Kontaktelement und Verfahren zu seiner Herstellung |
US9908637B2 (en) * | 2014-05-23 | 2018-03-06 | The Boeing Company | Modified shank fasteners for electromagnetic effect (EME) technology |
RU2580355C1 (ru) * | 2014-11-24 | 2016-04-10 | Общество с ограниченной ответственностью "Энкон-сервис" (ООО "Энкон-сервис") | Способ нанесения металлического покрытия на токопередающие поверхности контактных соединений |
DE102015009944B4 (de) | 2015-06-29 | 2019-03-14 | Diehl Metal Applications Gmbh | Steckverbinder hergestellt aus einem Band aus einer Aluminium-Legierung |
JP6755096B2 (ja) * | 2016-01-22 | 2020-09-16 | 日立オートモティブシステムズ株式会社 | 車載用電子モジュール、カードエッジコネクタ、およびコネクタ |
DE102016215879B3 (de) * | 2016-08-24 | 2018-02-01 | Robert Bosch Gmbh | Steckkontakt, Verfahren zur Herstellung eines solchen sowie elektrisches Steckverbindersystem |
CN106400072B (zh) * | 2016-11-07 | 2018-11-30 | 深圳市博耀新材料有限公司 | 一种耐腐蚀铝基复合材料及其制备工艺 |
US11137014B2 (en) | 2019-01-08 | 2021-10-05 | The Boeing Company | Conductive fastening system and method for improved EME performance |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01208493A (ja) * | 1988-02-15 | 1989-08-22 | Furukawa Electric Co Ltd:The | 接触子の製造方法 |
JP2000015743A (ja) * | 1998-06-29 | 2000-01-18 | Japan Aviation Electronics Ind Ltd | めっき材 |
JP2000212720A (ja) | 1999-01-27 | 2000-08-02 | Dowa Mining Co Ltd | 耐摩耗性銅または銅基合金とその製造方法ならびに該耐摩耗性銅または銅基合金からなる電気部品 |
JP2000226645A (ja) | 1999-02-03 | 2000-08-15 | Dowa Mining Co Ltd | 銅または銅基合金の製造方法 |
JP2003328153A (ja) * | 2002-05-09 | 2003-11-19 | Kobe Steel Ltd | 錫めっき付き嵌合型接続端子用材料 |
JP2004068026A (ja) | 2001-07-31 | 2004-03-04 | Kobe Steel Ltd | 接続部品用導電材料及びその製造方法 |
JP2004323926A (ja) | 2003-04-25 | 2004-11-18 | Ishihara Chem Co Ltd | メッキ表面の後処理液、及び後処理方法 |
JP2006173059A (ja) * | 2004-12-20 | 2006-06-29 | Kobe Steel Ltd | コネクタ接点材料 |
JP2007084934A (ja) | 2005-09-21 | 2007-04-05 | Rasselstein Gmbh | メッキを施された金属帯の不動態化方法およびメッキを施された帯鋼に不動態化層を塗布する装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11217579A (ja) * | 1998-02-04 | 1999-08-10 | Kanto Chem Co Inc | 電気接点用処理剤 |
JP2002212582A (ja) * | 2001-01-15 | 2002-07-31 | Chemical Denshi:Kk | 水溶性金属表面潤滑剤及び電子部品 |
DE60211808T2 (de) * | 2001-07-31 | 2006-10-19 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.), Kobe | Plattierte Kupferlegierung und Verfahren zu ihre Herstellung |
US6924044B2 (en) * | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
JP2003183882A (ja) * | 2001-12-11 | 2003-07-03 | Kobe Steel Ltd | 錫めっき付き電子材料 |
US7524535B2 (en) * | 2004-02-25 | 2009-04-28 | Posco | Method of protecting metals from corrosion using thiol compounds |
US7104850B2 (en) * | 2004-08-18 | 2006-09-12 | Yazaki Corporation | Low insertion-force connector terminal, method of producing the same and substrate for the same |
US7820303B2 (en) * | 2004-09-10 | 2010-10-26 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Conductive material for connecting part and method for manufacturing the conductive material |
JP4904953B2 (ja) * | 2006-04-06 | 2012-03-28 | 日立電線株式会社 | 配線用導体及びその製造方法並びに端末接続部並びにPbフリーはんだ合金 |
JP5376553B2 (ja) * | 2006-06-26 | 2013-12-25 | 日立金属株式会社 | 配線用導体及び端末接続部 |
WO2009005041A1 (ja) * | 2007-06-29 | 2009-01-08 | The Furukawa Electric Co., Ltd. | 耐フレッティング性コネクタおよびその製造方法 |
-
2008
- 2008-06-30 CN CN200880022779XA patent/CN101688312B/zh not_active Expired - Fee Related
- 2008-06-30 US US12/667,129 patent/US20110036621A1/en not_active Abandoned
- 2008-06-30 EP EP08777720A patent/EP2182093A4/en not_active Withdrawn
- 2008-06-30 JP JP2009521629A patent/JP4795466B2/ja not_active Expired - Fee Related
- 2008-06-30 KR KR1020107001928A patent/KR101505698B1/ko not_active IP Right Cessation
- 2008-06-30 WO PCT/JP2008/061869 patent/WO2009005042A1/ja active Application Filing
- 2008-06-30 TW TW097124676A patent/TWI443232B/zh not_active IP Right Cessation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01208493A (ja) * | 1988-02-15 | 1989-08-22 | Furukawa Electric Co Ltd:The | 接触子の製造方法 |
JP2000015743A (ja) * | 1998-06-29 | 2000-01-18 | Japan Aviation Electronics Ind Ltd | めっき材 |
JP2000212720A (ja) | 1999-01-27 | 2000-08-02 | Dowa Mining Co Ltd | 耐摩耗性銅または銅基合金とその製造方法ならびに該耐摩耗性銅または銅基合金からなる電気部品 |
JP2000226645A (ja) | 1999-02-03 | 2000-08-15 | Dowa Mining Co Ltd | 銅または銅基合金の製造方法 |
JP2004068026A (ja) | 2001-07-31 | 2004-03-04 | Kobe Steel Ltd | 接続部品用導電材料及びその製造方法 |
JP2003328153A (ja) * | 2002-05-09 | 2003-11-19 | Kobe Steel Ltd | 錫めっき付き嵌合型接続端子用材料 |
JP2004323926A (ja) | 2003-04-25 | 2004-11-18 | Ishihara Chem Co Ltd | メッキ表面の後処理液、及び後処理方法 |
JP2006173059A (ja) * | 2004-12-20 | 2006-06-29 | Kobe Steel Ltd | コネクタ接点材料 |
JP2007084934A (ja) | 2005-09-21 | 2007-04-05 | Rasselstein Gmbh | メッキを施された金属帯の不動態化方法およびメッキを施された帯鋼に不動態化層を塗布する装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013508902A (ja) * | 2009-10-19 | 2013-03-07 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | はんだフリーの電気的接続装置 |
US8932090B2 (en) | 2009-10-19 | 2015-01-13 | Robert Bosch Gmbh | Electrical connection having press-fitted partners with an OSP coating |
US9263315B2 (en) | 2010-03-30 | 2016-02-16 | Dai Nippon Printing Co., Ltd. | LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate |
US9887331B2 (en) | 2010-03-30 | 2018-02-06 | Dai Nippon Printing Co., Ltd. | LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate |
US9966517B2 (en) | 2010-03-30 | 2018-05-08 | Dai Nippon Printing Co., Ltd. | LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate |
US9773960B2 (en) | 2010-11-02 | 2017-09-26 | Dai Nippon Printing Co., Ltd. | Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
WO2014034300A1 (ja) * | 2012-08-29 | 2014-03-06 | 株式会社オートネットワーク技術研究所 | コネクタ端子及びコネクタ端子用材料 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009005042A1 (ja) | 2010-08-26 |
KR101505698B1 (ko) | 2015-03-30 |
EP2182093A4 (en) | 2011-10-19 |
CN101688312A (zh) | 2010-03-31 |
KR20100051629A (ko) | 2010-05-17 |
EP2182093A1 (en) | 2010-05-05 |
TWI443232B (zh) | 2014-07-01 |
US20110036621A1 (en) | 2011-02-17 |
CN101688312B (zh) | 2012-02-29 |
TW200909618A (en) | 2009-03-01 |
JP4795466B2 (ja) | 2011-10-19 |
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