WO2009005042A1 - 金属材料、その製造方法、及びそれを用いた電気電子部品 - Google Patents

金属材料、その製造方法、及びそれを用いた電気電子部品 Download PDF

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Publication number
WO2009005042A1
WO2009005042A1 PCT/JP2008/061869 JP2008061869W WO2009005042A1 WO 2009005042 A1 WO2009005042 A1 WO 2009005042A1 JP 2008061869 W JP2008061869 W JP 2008061869W WO 2009005042 A1 WO2009005042 A1 WO 2009005042A1
Authority
WO
WIPO (PCT)
Prior art keywords
same
metal material
producing
electronic component
electrical electronic
Prior art date
Application number
PCT/JP2008/061869
Other languages
English (en)
French (fr)
Inventor
Yoshiaki Kobayashi
Kazuo Yoshida
Original Assignee
The Furukawa Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Furukawa Electric Co., Ltd. filed Critical The Furukawa Electric Co., Ltd.
Priority to JP2009521629A priority Critical patent/JP4795466B2/ja
Priority to EP08777720A priority patent/EP2182093A4/en
Priority to US12/667,129 priority patent/US20110036621A1/en
Priority to KR1020107001928A priority patent/KR101505698B1/ko
Priority to CN200880022779XA priority patent/CN101688312B/zh
Publication of WO2009005042A1 publication Critical patent/WO2009005042A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
    • C23C10/30—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes using a layer of powder or paste on the surface
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Details Of Resistors (AREA)
  • Contacts (AREA)

Abstract

　導電性基体１上に、スズまたはその合金からなる表層２が設けられ、該表層の表面上にエーテル結合基を有する有機化合物から形成した有機皮膜３が設けられて構成される金属材料（１０）。
PCT/JP2008/061869 2007-06-29 2008-06-30 金属材料、その製造方法、及びそれを用いた電気電子部品 WO2009005042A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009521629A JP4795466B2 (ja) 2007-06-29 2008-06-30 金属材料、その製造方法、及びそれを用いた電気電子部品
EP08777720A EP2182093A4 (en) 2007-06-29 2008-06-30 METALLIC MATERIAL, METHOD FOR PRODUCING THE SAME, AND ELECTRIC-ELECTRONIC COMPONENT USING THE SAME
US12/667,129 US20110036621A1 (en) 2007-06-29 2008-06-30 Metal material, method for producing the same, and electrical/electronic component using the same
KR1020107001928A KR101505698B1 (ko) 2007-06-29 2008-06-30 금속재료, 그 제조방법, 및 그것을 이용한 전기전자부품
CN200880022779XA CN101688312B (zh) 2007-06-29 2008-06-30 金属材料、其制造方法、以及使用该金属材料的电气电子部件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-173336 2007-06-29
JP2007173336 2007-06-29

Publications (1)

Publication Number Publication Date
WO2009005042A1 true WO2009005042A1 (ja) 2009-01-08

Family

ID=40226086

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061869 WO2009005042A1 (ja) 2007-06-29 2008-06-30 金属材料、その製造方法、及びそれを用いた電気電子部品

Country Status (7)

Country Link
US (1) US20110036621A1 (ja)
EP (1) EP2182093A4 (ja)
JP (1) JP4795466B2 (ja)
KR (1) KR101505698B1 (ja)
CN (1) CN101688312B (ja)
TW (1) TWI443232B (ja)
WO (1) WO2009005042A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013508902A (ja) * 2009-10-19 2013-03-07 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング はんだフリーの電気的接続装置
WO2014034300A1 (ja) * 2012-08-29 2014-03-06 株式会社オートネットワーク技術研究所 コネクタ端子及びコネクタ端子用材料
US9263315B2 (en) 2010-03-30 2016-02-16 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
US9773960B2 (en) 2010-11-02 2017-09-26 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5555146B2 (ja) * 2010-12-01 2014-07-23 株式会社日立製作所 金属樹脂複合構造体及びその製造方法、並びにバスバ、モジュールケース及び樹脂製コネクタ部品
DE102011088211A1 (de) * 2011-12-12 2013-06-13 Robert Bosch Gmbh Kontaktelement und Verfahren zu seiner Herstellung
US9908637B2 (en) * 2014-05-23 2018-03-06 The Boeing Company Modified shank fasteners for electromagnetic effect (EME) technology
RU2580355C1 (ru) * 2014-11-24 2016-04-10 Общество с ограниченной ответственностью "Энкон-сервис" (ООО "Энкон-сервис") Способ нанесения металлического покрытия на токопередающие поверхности контактных соединений
DE102015009944B4 (de) 2015-06-29 2019-03-14 Diehl Metal Applications Gmbh Steckverbinder hergestellt aus einem Band aus einer Aluminium-Legierung
JP6755096B2 (ja) * 2016-01-22 2020-09-16 日立オートモティブシステムズ株式会社 車載用電子モジュール、カードエッジコネクタ、およびコネクタ
DE102016215879B3 (de) * 2016-08-24 2018-02-01 Robert Bosch Gmbh Steckkontakt, Verfahren zur Herstellung eines solchen sowie elektrisches Steckverbindersystem
CN106400072B (zh) * 2016-11-07 2018-11-30 深圳市博耀新材料有限公司 一种耐腐蚀铝基复合材料及其制备工艺
US11137014B2 (en) 2019-01-08 2021-10-05 The Boeing Company Conductive fastening system and method for improved EME performance

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01208493A (ja) * 1988-02-15 1989-08-22 Furukawa Electric Co Ltd:The 接触子の製造方法
JP2000015743A (ja) * 1998-06-29 2000-01-18 Japan Aviation Electronics Ind Ltd めっき材
JP2000212720A (ja) 1999-01-27 2000-08-02 Dowa Mining Co Ltd 耐摩耗性銅または銅基合金とその製造方法ならびに該耐摩耗性銅または銅基合金からなる電気部品
JP2000226645A (ja) 1999-02-03 2000-08-15 Dowa Mining Co Ltd 銅または銅基合金の製造方法
JP2003328153A (ja) * 2002-05-09 2003-11-19 Kobe Steel Ltd 錫めっき付き嵌合型接続端子用材料
JP2004068026A (ja) 2001-07-31 2004-03-04 Kobe Steel Ltd 接続部品用導電材料及びその製造方法
JP2004323926A (ja) 2003-04-25 2004-11-18 Ishihara Chem Co Ltd メッキ表面の後処理液、及び後処理方法
JP2006173059A (ja) * 2004-12-20 2006-06-29 Kobe Steel Ltd コネクタ接点材料
JP2007084934A (ja) 2005-09-21 2007-04-05 Rasselstein Gmbh メッキを施された金属帯の不動態化方法およびメッキを施された帯鋼に不動態化層を塗布する装置

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JP2002212582A (ja) * 2001-01-15 2002-07-31 Chemical Denshi:Kk 水溶性金属表面潤滑剤及び電子部品
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JP2003183882A (ja) * 2001-12-11 2003-07-03 Kobe Steel Ltd 錫めっき付き電子材料
US7524535B2 (en) * 2004-02-25 2009-04-28 Posco Method of protecting metals from corrosion using thiol compounds
US7104850B2 (en) * 2004-08-18 2006-09-12 Yazaki Corporation Low insertion-force connector terminal, method of producing the same and substrate for the same
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JP4904953B2 (ja) * 2006-04-06 2012-03-28 日立電線株式会社 配線用導体及びその製造方法並びに端末接続部並びにＰｂフリーはんだ合金
JP5376553B2 (ja) * 2006-06-26 2013-12-25 日立金属株式会社 配線用導体及び端末接続部
WO2009005041A1 (ja) * 2007-06-29 2009-01-08 The Furukawa Electric Co., Ltd. 耐フレッティング性コネクタおよびその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01208493A (ja) * 1988-02-15 1989-08-22 Furukawa Electric Co Ltd:The 接触子の製造方法
JP2000015743A (ja) * 1998-06-29 2000-01-18 Japan Aviation Electronics Ind Ltd めっき材
JP2000212720A (ja) 1999-01-27 2000-08-02 Dowa Mining Co Ltd 耐摩耗性銅または銅基合金とその製造方法ならびに該耐摩耗性銅または銅基合金からなる電気部品
JP2000226645A (ja) 1999-02-03 2000-08-15 Dowa Mining Co Ltd 銅または銅基合金の製造方法
JP2004068026A (ja) 2001-07-31 2004-03-04 Kobe Steel Ltd 接続部品用導電材料及びその製造方法
JP2003328153A (ja) * 2002-05-09 2003-11-19 Kobe Steel Ltd 錫めっき付き嵌合型接続端子用材料
JP2004323926A (ja) 2003-04-25 2004-11-18 Ishihara Chem Co Ltd メッキ表面の後処理液、及び後処理方法
JP2006173059A (ja) * 2004-12-20 2006-06-29 Kobe Steel Ltd コネクタ接点材料
JP2007084934A (ja) 2005-09-21 2007-04-05 Rasselstein Gmbh メッキを施された金属帯の不動態化方法およびメッキを施された帯鋼に不動態化層を塗布する装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013508902A (ja) * 2009-10-19 2013-03-07 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング はんだフリーの電気的接続装置
US8932090B2 (en) 2009-10-19 2015-01-13 Robert Bosch Gmbh Electrical connection having press-fitted partners with an OSP coating
US9263315B2 (en) 2010-03-30 2016-02-16 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
US9887331B2 (en) 2010-03-30 2018-02-06 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
US9966517B2 (en) 2010-03-30 2018-05-08 Dai Nippon Printing Co., Ltd. LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
US9773960B2 (en) 2010-11-02 2017-09-26 Dai Nippon Printing Co., Ltd. Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
WO2014034300A1 (ja) * 2012-08-29 2014-03-06 株式会社オートネットワーク技術研究所 コネクタ端子及びコネクタ端子用材料

Also Published As

Publication number Publication date
JPWO2009005042A1 (ja) 2010-08-26
KR101505698B1 (ko) 2015-03-30
EP2182093A4 (en) 2011-10-19
CN101688312A (zh) 2010-03-31
KR20100051629A (ko) 2010-05-17
EP2182093A1 (en) 2010-05-05
TWI443232B (zh) 2014-07-01
US20110036621A1 (en) 2011-02-17
CN101688312B (zh) 2012-02-29
TW200909618A (en) 2009-03-01
JP4795466B2 (ja) 2011-10-19

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