WO2008156226A1 - Apparatus for depositing organic thin film - Google Patents

Apparatus for depositing organic thin film Download PDF

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Publication number
WO2008156226A1
WO2008156226A1 PCT/KR2007/002981 KR2007002981W WO2008156226A1 WO 2008156226 A1 WO2008156226 A1 WO 2008156226A1 KR 2007002981 W KR2007002981 W KR 2007002981W WO 2008156226 A1 WO2008156226 A1 WO 2008156226A1
Authority
WO
WIPO (PCT)
Prior art keywords
deposition
thin film
point
organic thin
source assembly
Prior art date
Application number
PCT/KR2007/002981
Other languages
French (fr)
Inventor
Ha-Jin Song
Seung-Jin Han
Yoon-Seok Lee
Original Assignee
Doosan Mecatec Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Mecatec Co., Ltd. filed Critical Doosan Mecatec Co., Ltd.
Priority to PCT/KR2007/002981 priority Critical patent/WO2008156226A1/en
Publication of WO2008156226A1 publication Critical patent/WO2008156226A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase

Definitions

  • the present invention relates to an apparatus for depositing an organic thin film, and more particularly to an apparatus for depositing an organic thin film, which may control uniformity of thin film deposition by adjusting separation distances among a plurality of point-type deposition sources linearly arranged.
  • This flat panel display representatively includes a liquid crystal display, a plasma display panel, organic light emitting diodes and so on.
  • the organic light emitting diode comes into the spotlight as the next generation display device due to many good advantages such as rapid response, low energy consumption, less weight, possibility of ultra slim structure because of no backlight required, and high brightness rather than an existing liquid crystal display.
  • This organic light emitting diode is configured such that an anode film, an organic thin film and a cathode film are coated on a substrate in order, and, if a voltage is applied between the anode and the cathode, a suitable energy difference is formed in the organic thin film to emit light by itself. That is to say, while an injected electron is recombined with a hole, a remaining exciting energy is generated as light. At this time, a wavelength of generated light may be adjusted depending on an amount of dopant of organic material, thereby capable of realizing full color.
  • the organic light emitting diode is configured in detail such that an anode, a hole injection layer, a hole transfer layer, an emitting layer, an electron transfer layer, an electron injection layer and a cathode are laminated on a substrate in order.
  • the anode mainly adopts ITO (Indium Tin Oxide) with low surface resistance and good transmittance.
  • the organic thin film is configured in multi layers composed of the hole injection layer, the hole transfer layer, the emitting layer, the electron transfer layer and the electron injection layer so as to enhance a light emitting efficiency, and the organic material used in the emitting layer may adopt AIq 3 , TPD, PBD, m-MTDATA, TCTA and so on.
  • a LiF-Al metal layer is used as the cathode.
  • the organic thin film is very week against moisture and oxygen in the air, so a protective film is formed at its uppermost portion so as to increase a lifetime.
  • an organic thin film has been formed using vacuum deposition, sputtering, ion-beam deposition, pulsed-laser deposition, molecular-beam deposition, chemical vapor deposition, spin coater, and so on.
  • the vacuum deposition is currently commercially used.
  • the vacuum deposition is conducted in a way that a surrounding of a crucible containing organic material is heated to evaporate or sublimate the organic material such that the vapor (gas) organic material is deposited on a substrate positioned above the crucible.
  • the organic thin film deposition device is constructed such that a deposition source 110 is installed to a deposition chamber 100 to be capable of carrying and supporting a substrate S, as shown in FIGS. 1 and 2.
  • the deposition source 110 is a linear source with an opening 111 in its upper portion.
  • the deposition source 110 may contain organic material in its linear body, and it has a heater
  • the organic material may be evaporated to form an organic thin film with a predetermined thickness.
  • uniformity of thin film deposition is essential.
  • deposition is more active at a center portion of the substrate, rather than at its edges.
  • a center of the opening is formed smaller than both ends thereof, as shown in FIGS. 1 and 2, in order to improve uniformity of thin film deposition.
  • the shape of the opening of the conventional organic thin film deposition device can be adjusted through numerous repeated experiments, which is so complicated and uneconomic.
  • an object of the present invention is to provide an apparatus for depositing an organic thin film which may conveniently control uniformity of thin film deposition using a deposition source assembly having a plurality of point-type deposition sources among which separation distances are suitably adjusted.
  • the present invention provides an apparatus for depositing an organic thin film on a substrate, which includes a deposition chamber; and a deposition source assembly detachably installed in the deposition chamber and having a plurality of point-type deposition sources spaced apart from each other and arranged linearly, wherein separation distances among the point-type deposition sources are decreased from a center of the deposition source assembly to outside.
  • the deposition source assembly may have the point-type deposition sources arranged in one row, in which point-type deposition sources for evaporating a host and point-type deposition sources for evaporating a dopant are alternately arranged.
  • the deposition source assembly may have the point-type deposition sources arranged in at least two rows, in which a row for evaporating a host and a row for evaporating a dopant are alternately arranged.
  • a shield having a slit for controlling a scattering pattern of evaporated organic material may be further provided above the deposition source assembly.
  • the apparatus may further include a carrying means for moving the substrate in a horizontal direction.
  • FIG. 1 is a schematic sectional view showing a conventional organic thin film deposition device
  • FIG. 2 is a schematic view illustrating a conventional organic thin film deposition process
  • FIG. 3 is a schematic sectional view showing an apparatus for depositing an organic thin film according to the present invention.
  • FIG. 4 is a schematic view illustrating an organic thin film deposition process of the apparatus for depositing an organic thin film according to the present invention
  • FIGS. 5 to 7 are schematic views showing various embodiments of deposition source assemblies applied to the apparatus for depositing an organic thin film according to the present invention.
  • an apparatus 1 for depositing an organic thin film includes a chamber 2, and a deposition source assembly 10 installed in the chamber.
  • the deposition source assembly 10 is configured such that a plurality of point-type deposition sources are linearly arranged, and separation distances of the point- type deposition sources are controlled.
  • a shield 20 is further provided in a space between the substrate S and the deposition source assembly 10.
  • the shield 20 is used for controlling a scattering pattern of an evaporated organic material, and a slit 21 is formed therein such that the organic material may pass through it.
  • the organic thin film deposition apparatus 1 may further include a substrate carrying means (not shown) such that the substrate S may be moved in a horizontal direction and then scanned during the deposition process.
  • the substrate carrying means may adopt any known means in the art.
  • the plurality of point-type deposition sources may be arranged such that point-type deposition sources for evaporating a host and point-type deposition sources for evaporating a dopant are alternately arranged, and this arrangement allows different kinds of materials to be deposited at the same time.
  • the plurality of point-type deposition sources may also be arranged in two rows, as shown in FIG. 6.
  • one row of the two rows is point-type deposition sources 11 for evaporating the host, and the other row is point-type deposition sources 12 for evaporating the dopant.
  • the deposition source assembly 10 may be composed of a plurality of point-type deposition sources linearly arranged in three rows, as shown in FIG. 7. In this case, first and third rows among the three rows are point-type deposition sources 11 for evaporating the host, and the second row is point-type deposition sources 12 for evaporating the dopant.
  • each point-type deposition source of the second row may be arranged in a zigzag pattern with respect to corresponding point-type deposition sources of adjacent the first and third rows.
  • the first and third rows are point-type deposition sources for evaporating the dopant
  • the second row is point-type deposition sources for evaporating the host, contrarily to the above.
  • the apparatus for depositing an organic thin film configured as mentioned above according to the present invention may act as a linear deposition source by arranging point-type deposition sources linearly as shown in FIGS. 3 to 7, and also may suitably control uniformity of thin film deposition by adjusting separation distances among the point-type deposition sources.
  • the present invention may very conveniently control uniformity of thin film deposition by means of a deposition source assembly having a plurality of point-type deposition sources whose separation distances are suitably adjusted.

Abstract

An apparatus for depositing an organic thin film is disclosed. The organic thin film deposition apparatus includes a deposition chamber, and a deposition source assembly detachably installed in the deposition chamber and having a plurality of point-type deposition sources spaced apart from each other and arranged linearly, wherein the separation distances among the point-type deposition sources are decreased from a center of the deposition source assembly to outside. This apparatus may very conveniently control uniformity of thin film deposition using the deposition source assembly.

Description

APPARATUS FOR DEPOSITING ORGANIC THIN FILM
Technical Field
The present invention relates to an apparatus for depositing an organic thin film, and more particularly to an apparatus for depositing an organic thin film, which may control uniformity of thin film deposition by adjusting separation distances among a plurality of point-type deposition sources linearly arranged.
Background Art
Recently, along with rapid progress of information communication techniques and expansion of its market, a flat panel display comes into the spotlight as a display device. This flat panel display representatively includes a liquid crystal display, a plasma display panel, organic light emitting diodes and so on.
Among them, the organic light emitting diode comes into the spotlight as the next generation display device due to many good advantages such as rapid response, low energy consumption, less weight, possibility of ultra slim structure because of no backlight required, and high brightness rather than an existing liquid crystal display.
This organic light emitting diode is configured such that an anode film, an organic thin film and a cathode film are coated on a substrate in order, and, if a voltage is applied between the anode and the cathode, a suitable energy difference is formed in the organic thin film to emit light by itself. That is to say, while an injected electron is recombined with a hole, a remaining exciting energy is generated as light. At this time, a wavelength of generated light may be adjusted depending on an amount of dopant of organic material, thereby capable of realizing full color.
Though not shown in the figures, the organic light emitting diode is configured in detail such that an anode, a hole injection layer, a hole transfer layer, an emitting layer, an electron transfer layer, an electron injection layer and a cathode are laminated on a substrate in order. Here, the anode mainly adopts ITO (Indium Tin Oxide) with low surface resistance and good transmittance. The organic thin film is configured in multi layers composed of the hole injection layer, the hole transfer layer, the emitting layer, the electron transfer layer and the electron injection layer so as to enhance a light emitting efficiency, and the organic material used in the emitting layer may adopt AIq3, TPD, PBD, m-MTDATA, TCTA and so on. In addition, a LiF-Al metal layer is used as the cathode. The organic thin film is very week against moisture and oxygen in the air, so a protective film is formed at its uppermost portion so as to increase a lifetime. Meanwhile, to the present, an organic thin film has been formed using vacuum deposition, sputtering, ion-beam deposition, pulsed-laser deposition, molecular-beam deposition, chemical vapor deposition, spin coater, and so on. Among them, the vacuum deposition is currently commercially used.
Here, the vacuum deposition is conducted in a way that a surrounding of a crucible containing organic material is heated to evaporate or sublimate the organic material such that the vapor (gas) organic material is deposited on a substrate positioned above the crucible.
Now, a conventional organic thin film deposition device is explained with reference to FIGS. 1 and 2. The organic thin film deposition device is constructed such that a deposition source 110 is installed to a deposition chamber 100 to be capable of carrying and supporting a substrate S, as shown in FIGS. 1 and 2. The deposition source 110 is a linear source with an opening 111 in its upper portion. The deposition source 110 may contain organic material in its linear body, and it has a heater
(not shown) for evaporating the organic material.
Accordingly, after a substrate S is carried to the deposition chamber 100 and positioned on the deposition source 110, the organic material may be evaporated to form an organic thin film with a predetermined thickness.
Meanwhile, when forming an organic thin film, uniformity of thin film deposition is essential. Generally, deposition is more active at a center portion of the substrate, rather than at its edges. To solve this problem, in the deposition source 110, a center of the opening is formed smaller than both ends thereof, as shown in FIGS. 1 and 2, in order to improve uniformity of thin film deposition.
However, the shape of the opening of the conventional organic thin film deposition device can be adjusted through numerous repeated experiments, which is so complicated and uneconomic.
Disclosure Technical Problem
Therefore, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an apparatus for depositing an organic thin film which may conveniently control uniformity of thin film deposition using a deposition source assembly having a plurality of point-type deposition sources among which separation distances are suitably adjusted.
Technical Solution
In order to accomplish the above-mentioned object, the present invention provides an apparatus for depositing an organic thin film on a substrate, which includes a deposition chamber; and a deposition source assembly detachably installed in the deposition chamber and having a plurality of point-type deposition sources spaced apart from each other and arranged linearly, wherein separation distances among the point-type deposition sources are decreased from a center of the deposition source assembly to outside.
In addition, there are also provided more specific embodiments as follows in addition to the above embodiment of the present invention.
According to one embodiment of the present invention, the deposition source assembly may have the point-type deposition sources arranged in one row, in which point-type deposition sources for evaporating a host and point-type deposition sources for evaporating a dopant are alternately arranged. According to one embodiment of the present invention, the deposition source assembly may have the point-type deposition sources arranged in at least two rows, in which a row for evaporating a host and a row for evaporating a dopant are alternately arranged. According to one embodiment of the present invention, a shield having a slit for controlling a scattering pattern of evaporated organic material may be further provided above the deposition source assembly.
According to one embodiment of the present invention, the apparatus may further include a carrying means for moving the substrate in a horizontal direction.
Description of Drawings
FIG. 1 is a schematic sectional view showing a conventional organic thin film deposition device;
FIG. 2 is a schematic view illustrating a conventional organic thin film deposition process;
FIG. 3 is a schematic sectional view showing an apparatus for depositing an organic thin film according to the present invention;
FIG. 4 is a schematic view illustrating an organic thin film deposition process of the apparatus for depositing an organic thin film according to the present invention;
FIGS. 5 to 7 are schematic views showing various embodiments of deposition source assemblies applied to the apparatus for depositing an organic thin film according to the present invention.
Best Mode
Hereinafter, preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
Referring to FIGS. 3 and 4, an apparatus 1 for depositing an organic thin film according to one embodiment of the present invention includes a chamber 2, and a deposition source assembly 10 installed in the chamber.
The deposition source assembly 10 is configured such that a plurality of point-type deposition sources are linearly arranged, and separation distances of the point- type deposition sources are controlled.
In addition, a shield 20 is further provided in a space between the substrate S and the deposition source assembly 10. The shield 20 is used for controlling a scattering pattern of an evaporated organic material, and a slit 21 is formed therein such that the organic material may pass through it.
Also, the organic thin film deposition apparatus 1 may further include a substrate carrying means (not shown) such that the substrate S may be moved in a horizontal direction and then scanned during the deposition process. The substrate carrying means may adopt any known means in the art. Meanwhile, the separation distances among the point- type deposition sources of the deposition source assembly 10 may be arranged, for example, such that they are decreased from the center to outside (di=d2>d3=d4>d5=d6) , as shown in FIG. 5. This arrangement is to prevent deposition from being excessively focused on the center portion of the substrate S, as described above.
As another example, the plurality of point-type deposition sources may be arranged such that point-type deposition sources for evaporating a host and point-type deposition sources for evaporating a dopant are alternately arranged, and this arrangement allows different kinds of materials to be deposited at the same time.
The plurality of point-type deposition sources may also be arranged in two rows, as shown in FIG. 6. In this case, one row of the two rows is point-type deposition sources 11 for evaporating the host, and the other row is point-type deposition sources 12 for evaporating the dopant. As another example, the deposition source assembly 10 may be composed of a plurality of point-type deposition sources linearly arranged in three rows, as shown in FIG. 7. In this case, first and third rows among the three rows are point-type deposition sources 11 for evaporating the host, and the second row is point-type deposition sources 12 for evaporating the dopant. In this case, each point-type deposition source of the second row may be arranged in a zigzag pattern with respect to corresponding point-type deposition sources of adjacent the first and third rows. In addition, it is also possible that the first and third rows are point-type deposition sources for evaporating the dopant, and the second row is point-type deposition sources for evaporating the host, contrarily to the above. The apparatus for depositing an organic thin film configured as mentioned above according to the present invention may act as a linear deposition source by arranging point-type deposition sources linearly as shown in FIGS. 3 to 7, and also may suitably control uniformity of thin film deposition by adjusting separation distances among the point-type deposition sources.
Industrial Applicability
As mentioned above, the present invention may very conveniently control uniformity of thin film deposition by means of a deposition source assembly having a plurality of point-type deposition sources whose separation distances are suitably adjusted.

Claims

1. An apparatus for depositing an organic thin film on a substrate, comprising: a deposition chamber; and a deposition source assembly detachably installed in the deposition chamber and having a plurality of point-type deposition sources spaced apart from each other and arranged linearly, wherein separation distances among the point-type deposition sources are decreased from a center of the deposition source assembly to outside.
2. The apparatus for depositing an organic thin film according to claim 1, wherein the deposition source assembly has the point-type deposition sources arranged in one row, in which point-type deposition sources for evaporating a host and point-type deposition sources for evaporating a dopant are alternately arranged.
3. The apparatus for depositing an organic thin film according to claim 1, wherein the deposition source assembly has the point-type deposition sources arranged in at least two rows, in which a row for evaporating a host and a row for evaporating a dopant are alternately arranged.
4. The apparatus for depositing an organic thin film according to claim 1, wherein a shield having a slit for controlling a scattering pattern of evaporated organic material is further provided above the deposition source assembly.
5. The apparatus for depositing an organic thin film according to claim 1, further comprising a carrying means for moving the substrate in a horizontal direction.
PCT/KR2007/002981 2007-06-20 2007-06-20 Apparatus for depositing organic thin film WO2008156226A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2007/002981 WO2008156226A1 (en) 2007-06-20 2007-06-20 Apparatus for depositing organic thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2007/002981 WO2008156226A1 (en) 2007-06-20 2007-06-20 Apparatus for depositing organic thin film

Publications (1)

Publication Number Publication Date
WO2008156226A1 true WO2008156226A1 (en) 2008-12-24

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030168013A1 (en) * 2002-03-08 2003-09-11 Eastman Kodak Company Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device
US20040139914A1 (en) * 2002-08-30 2004-07-22 Semiconductor Energy Laboratory Co., Ltd. Fabrication system, light-emitting device and fabricating method of organic compound-containing layer
US20050008778A1 (en) * 2001-11-27 2005-01-13 Koji Utsugi Device and method for vacuum film formation
US20060006827A1 (en) * 2002-10-07 2006-01-12 Denso Corporation Motor control apparatus having current supply phase correction
US20070013301A1 (en) * 2005-06-30 2007-01-18 Shunpei Yamazaki Light emitting element, light emitting device, and electronic apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050008778A1 (en) * 2001-11-27 2005-01-13 Koji Utsugi Device and method for vacuum film formation
US20030168013A1 (en) * 2002-03-08 2003-09-11 Eastman Kodak Company Elongated thermal physical vapor deposition source with plural apertures for making an organic light-emitting device
US20040139914A1 (en) * 2002-08-30 2004-07-22 Semiconductor Energy Laboratory Co., Ltd. Fabrication system, light-emitting device and fabricating method of organic compound-containing layer
US20060006827A1 (en) * 2002-10-07 2006-01-12 Denso Corporation Motor control apparatus having current supply phase correction
US20070013301A1 (en) * 2005-06-30 2007-01-18 Shunpei Yamazaki Light emitting element, light emitting device, and electronic apparatus

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