WO2008148264A1 - Static electricity prevention method of an organic el display - Google Patents
Static electricity prevention method of an organic el display Download PDFInfo
- Publication number
- WO2008148264A1 WO2008148264A1 PCT/CN2007/003116 CN2007003116W WO2008148264A1 WO 2008148264 A1 WO2008148264 A1 WO 2008148264A1 CN 2007003116 W CN2007003116 W CN 2007003116W WO 2008148264 A1 WO2008148264 A1 WO 2008148264A1
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- WO
- WIPO (PCT)
- Prior art keywords
- display
- protective
- edge
- antistatic
- substrate glass
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 230000003068 static effect Effects 0.000 title abstract description 7
- 230000005611 electricity Effects 0.000 title abstract description 6
- 230000002265 prevention Effects 0.000 title abstract 3
- 239000011521 glass Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 230000001681 protective effect Effects 0.000 claims description 48
- 238000007689 inspection Methods 0.000 claims description 45
- 239000003292 glue Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000005401 electroluminescence Methods 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920006254 polymer film Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract 2
- 239000010408 film Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 230000002618 waking effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
Definitions
- the present invention relates to an antistatic method for an organic electroluminescent display, and more particularly to an antistatic method for use in a glass-on-chip (COG) type organic electroluminescent display product.
- COG glass-on-chip
- the organic electroluminescent display is a new type of flat panel display, which is recognized as the main force of the next generation display because of its active illumination, high contrast, thinness, and fast response.
- the principle of illumination is to sequentially insert various functional layers between the anode and the cathode, including a charge injection layer, a charge transport layer and a light-emitting layer, and the device can emit light by applying an appropriate voltage between the electrodes.
- the invention designs a novel anti-static protection method for the organic electroluminescent display, the processing method is simple, the cost is low, and the antistatic effect of the display can be effectively ensured.
- an antistatic method for an organic electroluminescence display which is provided with an antistatic treatment on a lead wire exposed on an edge of the device and exposed to an external environment, and a lead cloth
- the package back cover at the edge of the display is widened so that the package back cover at the edge is wider than the substrate glass size, and a protective glue or a protective film is applied to the edge to isolate the lead wires from the external environment. s contact.
- the leads are covered with a flexible circuit board, and then coated with a protective glue or a protective film.
- the lead of the present invention is a cathode inspection line and an anode inspection line of a display device.
- the protective cover film of the present invention is 0. 05 ⁇ 5mm wider than the substrate glass ;
- the protective adhesive is silica gel or UV glue, and
- the protective film is a protective paper or a polymer film.
- step (5) the coating protective tape or the protective film is operated together with the assembly integrated circuit process.
- the antistatic method of the present invention is a novel design that fixes the protective adhesive or the protective film by waking up the back cover of the display with a width of 0. 05 ⁇ 5, and electrostatically protects the display, so that the design is more flexible;
- Figure 1 is a schematic view of each row of displays connected in series by inspection lines
- Figure 2 is a schematic view of each row of displays connected in parallel by inspection lines
- FIG. 3 is a schematic view showing the connection of a single-grain display through a cathode-anode inspection line to a power contact block;
- FIG. 4 is a schematic view showing the structure of a display device using the anti-static design of the type 1 of the present invention;
- FIG. 5 is a schematic view showing the anode and cathode inspection lines of the display taken out from the left side and the top end of the display;
- FIG. 6 is a schematic view showing the structure of the display device using the novel antistatic design of the present invention.
- Figure 7 is a schematic view of the display of the anode and cathode inspection lines are taken from the top of the display;
- Figure 8 is a schematic view of the cathode and cathode inspection lines of the display taken from the left side of the display;
- FIG. 9 is a schematic structural view 3 of a display device using the novel antistatic design of the present invention.
- FIG. 10 is a schematic view showing the anode and cathode inspection lines of the display taken out from the left and right sides of the display;
- FIG. 11 is a schematic structural view of the display device using the novel antistatic design of the present invention.
- Embodiment 1 of the present invention is shown in FIGS. 1 to 4 and FIG. 7.
- FIGS. 1 to 3 show the wiring structure of the inspection line of the display 3, and the K-pole inspection line 31 of the display 3 is taken out from the top of the display 3, and the cathode The inspection line 22 is led out from the pin end of the display 3 to be connected to the inspection line 11 or the power contact block 12. After cutting the pellets into a single-grain display, these anode inspection lines 31 and cathode inspection lines 22 are partially exposed to the external environment.
- the method for performing anti-static protection on the display 3 described above, as shown in FIG. 4, specifically includes the following steps:
- step (4) when the cathode inspection line 31 is taken out on the side of the substrate glass on which the integrated circuit (IC) 5 is mounted, the flexible wiring board (FPC) 6 covers the leads at the same time.
- the protective adhesive 4 is a silica gel and a UV adhesive
- the protective film 4 is a protective paper or a polymer film.
- the protective or paste protection described does with the existing assembly integrated circuit (IC) 5 process. That is, immediately after assembling the integrated circuit (IC) 5 and the flexible wiring board (FPC) 6, the protective rubber or the protective film 4 is added to the glass cross section where the anode and the cathode lead are led out to the side of the substrate glass, that is, The package back cover 2 is coated with a protective glue or a protective film at a position wider than the substrate glass 1 by 0.05 to 5 mni and the flexible circuit board (FPC) 6 is pressed against the edge of the display of the lead.
- IC integrated circuit
- FPC flexible circuit board
- connection check line 11 of the display Since the final cut into 3 pieces of monolithic display, there will be an anode inspection of the connection check line 11 of the display.
- the line 31 is routed to the side of the substrate glass 1, and part of the trace and its cross section are exposed to the external environment, so that the package back cover 2 is designed to be 0.05 to 5 mm wider than the substrate glass 1 at this place, and then where the anode inspection line 31 is present.
- the protective cover or protective film 4 is added to isolate the contact with the external environment, and the package back cover 2 wider than the substrate glass 1 serves to fix the protective adhesive or the protective film 4.
- the cathode inspection line 22 is also exposed to the external environment, where it is covered with a flexible road plate (FPC) '6, and then a protective glue or protective film 4 is added to isolate it from contact with the external environment to prevent The effect of static electricity. Since these design changes are outside the display area of the display 3, the display effect and visual effect of the display 3 are not affected.
- FPC flexible road plate
- Embodiment 2 of the present invention is different from the previous embodiment in that the anode inspection line 31 of the display 3 is taken out from the top end of the display 3, and the cathode inspection line 22 is from the left side of the display 3, as shown in FIG.
- the lead-out is connected to the inspection line 11 in Figs. 1, 2 or the power contact block 12 in Fig. 3.
- a schematic diagram of the antistatic protection design of the display of the above structure is shown in FIG. 6.
- the package back cover 2 is designed to be 0.05 to 5 mm wider than the substrate glass 1 in the place where the cathode inspection line 22 and the anode inspection line 31 are taken out, and then added.
- the upper protective rubber or protective film 4 isolates its contact with the external environment to provide an antistatic effect.
- the cathode inspection line 22 can also be drawn from the right side of the display 3, and the corresponding antistatic material of the protective film or protective film 4 is also on the right side of the display 3.
- Embodiment 3 of the present invention is as shown in Fig. 8. Unlike the previous embodiment, the anode inspection line 31 and the cathode inspection line 22 of the display 3 are simultaneously taken out from the left side (or the right side) of the display 3. Connected to the inspection line 11 of Figures 1, 2 or the power contact block 12 of Figure 3. A schematic diagram of the design of the corresponding display device anti-static protection is shown in FIG. 9.
- the package back cover 2 is designed to be 0.05 to 5 mm wider than the substrate glass 1 in the place where the cathode inspection line 22 and the anode inspection line '31 are taken out, and then
- the protective glue or protective film 4 is isolated from the external environment to provide an antistatic effect.
- Embodiment 4 of the present invention is as shown in Fig. 10.
- the anode inspection line 31 in Fig. 10 is taken out from the right side of the display 3, and the cathode inspection line 22 is taken out from the left side.
- the anode inspection line 31 can also be taken out from the left and right sides of the display 3 at the same time, and the cathode inspection line 22 is taken out from one side (left side or right side), and the inspection line 11 in FIG. 1, FIG. 2 or FIG.
- the power contact block 12 is connected, and the corresponding schematic diagram of the anti-static protection design for the display device is as shown in FIG. 11.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Description
有机电致发光显示器的防静电方法 技术领域
本发明涉及一种用于有机电致发光显示器的防静电方法，尤其是用在玻璃上 芯片 （COG)方式的有机电致发光显示器产品上的防静电方法。 背景技术
有机电致发光显示器是目前新兴的一种平板显示器， 因它有主动发光，对比 度高， 能薄型化， 响应速度快等诸多优点， 被公认为是下一代显示器的主力军。 其发光原理是在阳极和阴极之间顺序***各种功能层，包括电荷注入层、电荷传 输层和发光层， 在电极之间加上适当的电压， 器件就能发光。
但对于电子产品， 很容易受到静电损害， 有机电致发光显示器件也不例外， 需要采取措施对器件进行静电防护。'目前对于电子产品的静电防护鄣是在设计上 除了在装配集成电路（IC)的玻璃边上有阴阳极电源线引出外， 其它地方都不能 有电源线引出暴露在空气中。 这样就对某些设计有了很大的局限。
在有机电致发光显示器量产过程中，需要对刚生产出来的显示器点亮一段时 间进行检査， 将不良品剔除， 同时也可以对没有缺陷的器件进行老化， 使其性能 的稳定性和均匀性方面有较大的提高 而在设计检査线的走线时，如果只延长阴 阳极引线的方法来将显示器件的阴阳极与检査线连接，对于某些产品如玻璃上芯 片（COG)产品则无法实现。而采用从显示器的各个方向都可以选择走线的话就 可以解决这些问题，并且使得显示器在设计上更加灵活。但是采用这样的设计的 话，最后显示器做成单粒后，会有些引线引到显示器的边缘而暴露在外部环境中， 从而很容易造成静电伤害， 因此必须采用新的不同于常规的防静电方法。
发明内容
本发明设计一种新型的有机电致发光显示器的防静电保护方法，加工工艺简 单， 成本低， 并可以有效保证显示器的防静电效果。
本发明的目的可通过以下的技术方案予以实现：一种有机电致发光显示器的 防静电方法，对显示器上布线到器件的边缘而暴露于外部环境中的引线进行防静 电处理，将有引线布到的显示器边缘处的封装后盖扩宽，使该边缘处的封装后盖 宽于基板玻璃尺寸，并在所述边缘处涂上保护胶或贴上保护膜， 以隔绝这些引线 '与外部环境的接触。
本发明对于显示器上用于装配集成电路的边缘， 当有引线布到该边缘时，先 用柔性线路板覆盖住这些引线， 然后再涂上保护胶或贴上保护膜。
本发明所述的引线是显示器件的阴极检査线和阳极检査线。
本发明所述的封装后盖比基板玻璃尺寸宽 0. 05〜5mm; 所述的保护胶是硅胶 或 UV胶， 所述的保护膜是保护纸或聚合物薄膜。
本发明所述的有机电致发光显示器防静电的制作方法，其特征 于包括如下 具体处理步骤：
(1) . 在基板玻璃上制作有机电致发光显示器件；
(2) .切割和断粒成单个显示器件，除装配集成线路的那一条显示器件玻璃边 外， 在有引线引出到基板玻璃边处， 封装后盖比基板玻璃扩宽 0. 05〜5im;
(3) . 装配集成线路；
(4) . 装配柔性线路板；
(5) . 涂保护胶或贴保护膜。
所述步骤 (4)中， 当在集成线路装配的基板玻璃边上有阴极检查线引线引出 时， 则用柔性线路板将这些引线覆盖住。 ·
所述步骤 (5)中， 所述的涂保护胶或贴保护膜与装配集成电路工艺一起操作。 与现有技术相比， 本发明的优点是：
(1) .本发明的防静电方法是对显示器封装后盖比基板玻璃宽 0. 05〜5醒来固 定保护胶或保护膜，对显示器进行静电保护的新颖设计，使得设计更具有灵活性；
(2) . 本发明的防静电方法可以在装配集成电路（IC)的时候同时实现， 几乎 不会带来任何附加的成本， 且工艺简单。 附图说明
下面结合附图和实施例对本发明做进一步的说明。
图 1为每排显示器之间通过检査线串联连接的示意图；
图 2为每排显示器之间通过检査线并联连接的示意图；
图 3为单粒显示器通过阴阳极检查线与电源接触块连接的示意图； 图 4为采用本发明中^1型防静电设计的显示器件结构示意图一；
图 5为显示器的阴阳极检查线分别从显示器的左侧和顶端引出的示意图； 图 6为采用本发明中新型防静电设计的显示器件结构示意图二；
图 7为显示器的阴阳极检查线都从显示器的顶端引出的示意图；
图 8为显示器的阴阳极检查线都从显示器的左侧引出的示意图；
图 9为釆用本发明中新型防静电设计的显示器件结构示意图三；
图 10为显示器的阴阳极检査线分别从显示器的左右侧引出的示意图； 图 11为采用本发明中新型防静电设计的显示器件结构示意图四； 具体实施方式
以下结合附图所示之实施例作进一步详述。
实施例 1
本发明的实施例 1如图 1〜4和图 7所示，图 1〜3所示的为显示器 3检查线 的布线结构， 显示器 3的 K极检查线 31都从显示器 3的顶端引出， 阴极检查线 22都从显示器 3的引脚端引出与检査线 11或电源接触块 12连接。 切割断粒成 单粒显示器后，这些阳极检查线 31和阴极检査线 22就会有部分暴露在外部环境 中。对上述的显示器 3进行防静电保护的方法，如图 4所示，具体包括如下步骤:
(1) . 在大片基板玻璃 1上制作有机电致发光显示器 3 ;
(2) . 切割和断粒成单个显示器 3， 除装配集成线路 （IC) 5的那一条显示器 件玻璃边外， 在有阴极检査线 22和阳极检査线 31引出到基板玻璃边的地方 封装后盖 2比基板玻璃 1宽 0.05〜5mm ； '
(3) . 装配集成线路 (IC) 5;
(4) . 装配柔性线路板 (FPC) 6；
(5) . 涂保护胶或贴保护膜 4。
上述步骤 (4)中， 当在集成线路（IC) 5装配的基板玻璃边上有阴极检査线 31 引出时， 则同时柔性线路板 (FPC) 6会将这些引线覆盖住。
上述步骤 (5)中，所述的保护胶 4是硅胶和 UV胶，保护膜 4是保护纸或聚合 物薄膜。 所述的涂保护胶或贴保护 I莫与现有的装配集成电路（IC) 5工艺一起操 作。 即在装配好集成电路 （IC) 5和柔性线路板 （FPC) 6后马上操作， 在有阳 极和阴极引线引出到基板玻璃边的地方的玻璃截面处加上保护胶或保护膜 4， 即 在封装后盖 2比基板玻璃 1尺寸宽 0.05~5mni和柔性线路板（FPC) 6压住引线 的显示器边缘的地方涂保护胶或贴保护膜。 与现有的装配集成电路 <IC) 5方法 相比， 几乎没有增加成本 '
由于最后切割成单粹显示器 3件后会有显示器的连接检査线 11的阳极检査
线 31走线到基板玻璃 1边， 部分走线和其截面暴露在外部环境中， 因此在这个 地方设计封装后盖 2比基板玻璃 1宽 0.05〜5mm， 然后在有阳极检査线 31的地 方加上保护胶或保护膜 4， 以隔绝其与外部环境的接触， 比基板玻璃 1宽的封装 后盖 2起到固定保护胶或保护膜 4的效果。 切割断粒后， 阴极检查线 22也是暴 露在外部环境中的， 这里用柔性路板（FPC)' 6覆盖住， 然后再加上保护胶或保 护膜 4隔绝其与外部环境的接触，达到防静电的效果。 由于这些设计变化都是在 显示器 3的显示区域外， 因此并不会影响显示器 3的显示效果和视觉效果。 实施例 2
本发明的实施例 2如图 5所示，与上一个实施例所不同的是，显示器 3的阳 极检査线 31从显示器 3的顶端引出的同时，阴极检査线 22从显示器 3的左侧引 出， 与图 1、 图 2中的检査线 11或图 3中的电源接触块 12连接。 对上述结构的 显示器的防静电保护设计的示意图如图 6所示， 在有阴极检査线 22和阳极检查 线 31引出的地方设计封装后盖 2比基板玻璃 1宽 0.05〜5mm， 然后再加上保护 胶或保护膜 4隔绝其与外部环境的接触， 起到防静电的效果。
当然， 阴极检査线 22也可以从显示器 3的右侧引出，相应的加保护胶或保 护膜 4防静电的地方也在显示器 3的右边。
实施例 3
本发明的实施例 3如图 8所示，与上一个实施例所不同的是，显示器 3的阳 极检査线 31和阴极检査线 22都同时从显示器 3的左侧（或右侧）引出，与图 1、 图 2中的检査线 11或图 3中的电源接触块 12连接。则其对应的显示器件防静电 保护的设计的示意图如图 9所示，在有阴极检查线 22和阳极检査线 '31引出的地 方设计封装后盖 2比基板玻璃 1宽 0.05〜5mm， 然后再加上保护胶或保护膜 4 隔绝其与外部环境的接触， 起到防静电的效果。
实施例 4
本发明的实施例 4如图 10所示，与上一个实施例所不同的是， 图 10中的阳 极检査线 31从显示器 3的右侧引出， 而阴极检査线 22从左侧引出， 当然， 这里 阳极检查线 31也可以同时从显示器 3的左右两侧引出，而阴极检查线 22从一侧 (左侧或右侧） 引出， 与图 1、 图 2中的检查线 11或图 3中的电源接触块 12连 接， 则其对应的对显示器件防静电保护设计的示意图如图 11所示， 在显示器 3 的两侧有阴极检査线 22和阳极检查线 31引出的地方设计封装后盖 2比基板玻璃
1宽 0.05 5 然后再加上保护胶或保护膜 4隔绝其与外部环境的接觫， 起到 防静电的效果。
Claims
1. 一种有机电致发光显示器的防静电方法， 对显示器上布线到器件的边缘 而暴露于外部环境中的引线进行防静电处理，其特征在于，将有引线布到的显示 器边缘处的封装后盖扩宽，使该边缘处的封装后盖宽于基板玻璃尺寸，并在所述 边缘处涂上保护胶或贴上保护膜， 以隔绝这些引线与外部环境的接触。
2.根据权利要求 1所述的有机电致发光显示器的防静电方法，其特征在于， 寸于显示器上用于装配集成电路的边缘， 当有引线布到该边缘时，先用柔性线路 板覆盖住这些引线， 然后再涂上保护胶或贴上保护膜。
3. 根据权利要求 1或 2所述的有机电致发光显示器的防静电方法， 其特征 在于所述的引线是显示器件的阴极检查线和阳极检查线。
4. 根据权利要求 1所述的有机电致发光显示器的防静电方法， 其特征在于 所述的封装后盖比基板玻璃尺寸宽 0.05〜5mm。
5. 根据权利要求 1或 2所述的有机电致发光显示器的防静电方法， 其特征 在于在所述的保护胶是硅胶或 UV胶， 所述的保护膜是保护纸或聚合物薄膜。
6. 权利要求 1或 2所述的有机电致发光显示器防静电的制作方法， 其特征 在于包括如下具体处理步骤-
(1) . 在基板玻璃上制作有机电致发光显示器件； '
(2) .切割和断粒成单个显示器件， 除装配集成线路的那一条显示器件玻璃边 外， 在有引线引出到基板玻璃边处， 封装后盖比基板玻璃扩宽 0.05〜5mm;
(3) . 装配集成线路；
(4) . 装配柔性线路板；
(5) . 涂保护胶或贴保护膜。
7. 根据权利要求 6所述的有机电致发光显示器防静电的制作方法， 其特征 在于所述步骤 (4)中， 当在集成线路装配的基板玻璃边上有阴极检査线引线引出 时， 则用柔性线路板将这些引线覆盖住。
8. 根据权利要求 6所述的有机电致发光显示器防静电的制作方法， 其特征 在于所述步骤 (5)中， 所述的涂保护胶或贴保护膜与装配集成电路工艺一起操作。
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| US12/663,216 US20100173554A1 (en) | 2007-06-08 | 2007-11-02 | Static electricity prevention method of an organic el display |
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| CN200710028497.8 | 2007-06-08 | ||
| CNB2007100284978A CN100508675C (zh) | 2007-06-08 | 2007-06-08 | 有机电致发光显示器的防静电方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003271075A (ja) * | 2002-03-13 | 2003-09-25 | Toshiba Corp | 表示装置 |
| CN1493173A (zh) * | 2001-11-29 | 2004-04-28 | ס�ѵ�����ҵ��ʽ���� | 电致发光显示装置 |
| CN1230038C (zh) * | 2001-03-30 | 2005-11-30 | 三洋电机株式会社 | 有机电场发光型显示器的密封结构 |
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| JP3783637B2 (ja) * | 2002-03-08 | 2006-06-07 | セイコーエプソン株式会社 | 材料の除去方法、基材の再生方法、表示装置の製造方法、及び該製造方法によって製造された表示装置を備えた電子機器 |
| US7193364B2 (en) * | 2002-09-12 | 2007-03-20 | Osram Opto Semiconductors (Malaysia) Sdn. Bhd | Encapsulation for organic devices |
| JP4480989B2 (ja) * | 2003-11-28 | 2010-06-16 | オプトレックス株式会社 | 有機ｅｌ表示装置 |
| JP2005173299A (ja) * | 2003-12-12 | 2005-06-30 | Optrex Corp | 有機ｅｌ表示装置および有機ｅｌ表示装置の基板 |
| KR100583252B1 (ko) * | 2003-12-29 | 2006-05-24 | 엘지.필립스 엘시디 주식회사 | 유기전계 발광소자와 그 제조방법 |
| US7764012B2 (en) * | 2004-04-16 | 2010-07-27 | Semiconductor Energy Laboratory Co., Ltd | Light emitting device comprising reduced frame portion, manufacturing method with improve productivity thereof, and electronic apparatus |
| US7355204B2 (en) * | 2004-12-30 | 2008-04-08 | E.I. Du Pont De Nemours And Company | Organic device with environmental protection structure |
| KR100719554B1 (ko) * | 2005-07-06 | 2007-05-17 | 삼성에스디아이 주식회사 | 평판 디스플레이 장치 및 그 제조방법 |
| KR100636502B1 (ko) * | 2005-08-31 | 2006-10-18 | 삼성에스디아이 주식회사 | 원장단위 검사가 가능한 유기 전계발광표시장치 및 그검사방법 |
| US20070120460A1 (en) * | 2005-11-30 | 2007-05-31 | Youn Hae-Su | Image display device |
| KR100688795B1 (ko) * | 2006-01-25 | 2007-03-02 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1230038C (zh) * | 2001-03-30 | 2005-11-30 | 三洋电机株式会社 | 有机电场发光型显示器的密封结构 |
| CN1493173A (zh) * | 2001-11-29 | 2004-04-28 | ס�ѵ�����ҵ��ʽ���� | 电致发光显示装置 |
| JP2003271075A (ja) * | 2002-03-13 | 2003-09-25 | Toshiba Corp | 表示装置 |
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| CN101080116A (zh) | 2007-11-28 |
| CN100508675C (zh) | 2009-07-01 |
| US20100173554A1 (en) | 2010-07-08 |
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