WO2008146448A1 - ピーラブル性を有する積層体およびその製造方法 - Google Patents
ピーラブル性を有する積層体およびその製造方法 Download PDFInfo
- Publication number
- WO2008146448A1 WO2008146448A1 PCT/JP2008/001164 JP2008001164W WO2008146448A1 WO 2008146448 A1 WO2008146448 A1 WO 2008146448A1 JP 2008001164 W JP2008001164 W JP 2008001164W WO 2008146448 A1 WO2008146448 A1 WO 2008146448A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- layer
- conductive layer
- heat
- resistant base
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12778—Alternative base metals from diverse categories
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009516165A JP5713560B2 (ja) | 2007-05-23 | 2008-05-09 | ピーラブル性を有する積層体およびその製造方法 |
US12/310,219 US20090246554A1 (en) | 2007-05-23 | 2008-05-09 | Laminate having peelability and production method therefor |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007136969 | 2007-05-23 | ||
JP2007-136969 | 2007-05-23 | ||
JP2007160676 | 2007-06-18 | ||
JP2007-160676 | 2007-06-18 | ||
JP2007188783 | 2007-07-19 | ||
JP2007-188783 | 2007-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008146448A1 true WO2008146448A1 (ja) | 2008-12-04 |
Family
ID=40074726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/001164 WO2008146448A1 (ja) | 2007-05-23 | 2008-05-09 | ピーラブル性を有する積層体およびその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090246554A1 (ja) |
JP (1) | JP5713560B2 (ja) |
WO (1) | WO2008146448A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013183605A1 (ja) * | 2012-06-04 | 2013-12-12 | Jx日鉱日石金属株式会社 | キャリア付金属箔 |
WO2013183604A1 (ja) * | 2012-06-04 | 2013-12-12 | Jx日鉱日石金属株式会社 | 多層プリント配線板の製造方法 |
WO2013183607A1 (ja) * | 2012-06-04 | 2013-12-12 | Jx日鉱日石金属株式会社 | キャリア付金属箔 |
WO2013183606A1 (ja) * | 2012-06-04 | 2013-12-12 | Jx日鉱日石金属株式会社 | キャリア付金属箔 |
JP2018056424A (ja) * | 2016-09-30 | 2018-04-05 | 信越ポリマー株式会社 | 電磁波シールドフィルムの製造方法および電磁波シールドフィルム付きプリント配線板の製造方法 |
JPWO2018139427A1 (ja) * | 2017-01-25 | 2019-11-14 | 東洋紡株式会社 | 高分子フィルム積層基板およびフレキシブル電子デバイスの製造方法 |
WO2021199811A1 (ja) * | 2020-04-03 | 2021-10-07 | 信越ポリマー株式会社 | 金属張積層板 |
WO2023074531A1 (ja) * | 2021-10-26 | 2023-05-04 | 東洋鋼鈑株式会社 | 金属積層材及びその製造方法、並びにプリント配線板 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013181136A (ja) * | 2012-03-02 | 2013-09-12 | Fuji Xerox Co Ltd | ポリイミド前駆体組成物、無端ベルトの製造方法、及び画像形成装置 |
JP6063183B2 (ja) * | 2012-08-31 | 2017-01-18 | パナソニックIpマネジメント株式会社 | 剥離可能銅箔付き基板及び回路基板の製造方法 |
US20150303483A1 (en) * | 2012-11-22 | 2015-10-22 | Kaneka Corporation | Collector for bipolar lithium ion secondary batteries, and bipolar lithium ion secondary battery |
CN103625029A (zh) * | 2013-11-25 | 2014-03-12 | 许子寒 | 一种石墨烯导热器件 |
DE102014210483A1 (de) * | 2014-06-03 | 2015-12-03 | Conti Temic Microelectronic Gmbh | Verfahren zum Herstellen einer Folienanordnung und entsprechende Folienanordnung |
US10348941B2 (en) * | 2014-07-30 | 2019-07-09 | Karl Storz Endovision, Inc. | Durable flexible circuit assembly |
US20160228678A1 (en) * | 2015-01-02 | 2016-08-11 | Pacific Diabetes Technologies | Highly Durable Dual Use Catheter for Analyte Sensing and Drug Delivery |
JP6236120B2 (ja) * | 2015-06-24 | 2017-11-22 | Jx金属株式会社 | キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06112610A (ja) * | 1992-09-25 | 1994-04-22 | Mitsui Toatsu Chem Inc | フレキシブル両面金属積層板の製造法 |
JPH088400B2 (ja) * | 1991-05-01 | 1996-01-29 | 東洋メタライジング株式会社 | キャリア |
JP2001295079A (ja) * | 2000-04-12 | 2001-10-26 | Nikko Materials Co Ltd | キャリヤ付き極薄銅箔及びその製造方法 |
JP2003033595A (ja) * | 2001-05-30 | 2003-02-04 | Sunstar Precision Co Ltd | 多頭式刺繍機の駆動装置 |
JP2006022406A (ja) * | 2000-09-22 | 2006-01-26 | Furukawa Circuit Foil Kk | キャリア付き極薄銅箔 |
JP2007007937A (ja) * | 2005-06-29 | 2007-01-18 | Furukawa Circuit Foil Kk | キャリア付き極薄銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003145674A (ja) * | 2001-11-08 | 2003-05-20 | Learonal Japan Inc | 樹脂複合材料の形成方法 |
JP2005285849A (ja) * | 2004-03-26 | 2005-10-13 | North:Kk | 多層配線基板製造用層間部材とその製造方法 |
JP2006068920A (ja) * | 2004-08-31 | 2006-03-16 | Shin Etsu Chem Co Ltd | フレキシブル銅箔ポリイミド積層板の製造方法 |
KR101045149B1 (ko) * | 2005-08-04 | 2011-06-30 | 가부시키가이샤 가네카 | 금속 피복 폴리이미드 필름 |
-
2008
- 2008-05-09 WO PCT/JP2008/001164 patent/WO2008146448A1/ja active Application Filing
- 2008-05-09 US US12/310,219 patent/US20090246554A1/en not_active Abandoned
- 2008-05-09 JP JP2009516165A patent/JP5713560B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH088400B2 (ja) * | 1991-05-01 | 1996-01-29 | 東洋メタライジング株式会社 | キャリア |
JPH06112610A (ja) * | 1992-09-25 | 1994-04-22 | Mitsui Toatsu Chem Inc | フレキシブル両面金属積層板の製造法 |
JP2001295079A (ja) * | 2000-04-12 | 2001-10-26 | Nikko Materials Co Ltd | キャリヤ付き極薄銅箔及びその製造方法 |
JP2006022406A (ja) * | 2000-09-22 | 2006-01-26 | Furukawa Circuit Foil Kk | キャリア付き極薄銅箔 |
JP2003033595A (ja) * | 2001-05-30 | 2003-02-04 | Sunstar Precision Co Ltd | 多頭式刺繍機の駆動装置 |
JP2007007937A (ja) * | 2005-06-29 | 2007-01-18 | Furukawa Circuit Foil Kk | キャリア付き極薄銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013183605A1 (ja) * | 2012-06-04 | 2013-12-12 | Jx日鉱日石金属株式会社 | キャリア付金属箔 |
WO2013183604A1 (ja) * | 2012-06-04 | 2013-12-12 | Jx日鉱日石金属株式会社 | 多層プリント配線板の製造方法 |
WO2013183607A1 (ja) * | 2012-06-04 | 2013-12-12 | Jx日鉱日石金属株式会社 | キャリア付金属箔 |
WO2013183606A1 (ja) * | 2012-06-04 | 2013-12-12 | Jx日鉱日石金属株式会社 | キャリア付金属箔 |
CN104334346A (zh) * | 2012-06-04 | 2015-02-04 | Jx日矿日石金属株式会社 | 附载体金属箔 |
CN104619486A (zh) * | 2012-06-04 | 2015-05-13 | Jx日矿日石金属株式会社 | 附载体金属箔 |
JP2019084829A (ja) * | 2012-06-04 | 2019-06-06 | Jx金属株式会社 | キャリア付金属箔 |
JP2018056424A (ja) * | 2016-09-30 | 2018-04-05 | 信越ポリマー株式会社 | 電磁波シールドフィルムの製造方法および電磁波シールドフィルム付きプリント配線板の製造方法 |
JPWO2018139427A1 (ja) * | 2017-01-25 | 2019-11-14 | 東洋紡株式会社 | 高分子フィルム積層基板およびフレキシブル電子デバイスの製造方法 |
WO2021199811A1 (ja) * | 2020-04-03 | 2021-10-07 | 信越ポリマー株式会社 | 金属張積層板 |
WO2023074531A1 (ja) * | 2021-10-26 | 2023-05-04 | 東洋鋼鈑株式会社 | 金属積層材及びその製造方法、並びにプリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
JP5713560B2 (ja) | 2015-05-07 |
JPWO2008146448A1 (ja) | 2010-08-19 |
US20090246554A1 (en) | 2009-10-01 |
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