WO2008129774A1 - 抵抗変化型記憶装置 - Google Patents

抵抗変化型記憶装置 Download PDF

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Publication number
WO2008129774A1
WO2008129774A1 PCT/JP2008/000542 JP2008000542W WO2008129774A1 WO 2008129774 A1 WO2008129774 A1 WO 2008129774A1 JP 2008000542 W JP2008000542 W JP 2008000542W WO 2008129774 A1 WO2008129774 A1 WO 2008129774A1
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WO
WIPO (PCT)
Prior art keywords
resistance
voltage
active element
current
limiting active
Prior art date
Application number
PCT/JP2008/000542
Other languages
English (en)
French (fr)
Inventor
Yoshikazu Katoh
Kazuhiko Shimakawa
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2009510754A priority Critical patent/JP5095728B2/ja
Priority to US12/529,103 priority patent/US8094481B2/en
Priority to CN2008800082108A priority patent/CN101636792B/zh
Publication of WO2008129774A1 publication Critical patent/WO2008129774A1/ja

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Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/003Cell access
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • G11C13/0028Word-line or row circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0038Power supply circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/08Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/009Write using potential difference applied between cell electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/10Resistive cells; Technology aspects
    • G11C2213/15Current-voltage curve
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/74Array wherein each memory cell has more than one access device
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/76Array using an access device for each cell which being not a transistor and not a diode
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/79Array wherein the access device being a transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)

Abstract

 本発明の抵抗変化型記憶装置(10)は、第1の電圧を超えると高抵抗状態へ第2の電圧を超えると低抵抗状態へ変化する抵抗変化型素子(1)と、制御装置(4)と、抵抗変化型素子(1)と直列に接続された電圧制限能動素子(2)と、電圧制限能動素子(2)を介して抵抗変化型素子(1)と直列に接続された電流制限能動素子(3)とを備え、制御装置(4)は、高抵抗状態へ変化させる場合に、電流と第1の抵抗値との積が第1の電圧以上となるように電流制限能動素子(3)を制御し、かつ電極間電圧が第2の電圧未満となるように電圧制限能動素子(2)を制御するように構成され、かつ、低抵抗状態へと変化させる場合に、電流と第2の抵抗値との積の絶対値が第2の電圧以上になりかつ電流と第1の抵抗値との積の絶対値が第1の電圧未満となるように電流制限能動素子(3)を制御するように構成されている。
PCT/JP2008/000542 2007-03-13 2008-03-12 抵抗変化型記憶装置 WO2008129774A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009510754A JP5095728B2 (ja) 2007-03-13 2008-03-12 抵抗変化型記憶装置
US12/529,103 US8094481B2 (en) 2007-03-13 2008-03-12 Resistance variable memory apparatus
CN2008800082108A CN101636792B (zh) 2007-03-13 2008-03-12 电阻变化型存储器件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007063155 2007-03-13
JP2007-063155 2007-03-13

Publications (1)

Publication Number Publication Date
WO2008129774A1 true WO2008129774A1 (ja) 2008-10-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000542 WO2008129774A1 (ja) 2007-03-13 2008-03-12 抵抗変化型記憶装置

Country Status (4)

Country Link
US (1) US8094481B2 (ja)
JP (1) JP5095728B2 (ja)
CN (1) CN101636792B (ja)
WO (1) WO2008129774A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8625328B2 (en) 2009-10-15 2014-01-07 Panasonic Corporation Variable resistance nonvolatile storage device
JP2016021272A (ja) * 2014-06-16 2016-02-04 パナソニックIpマネジメント株式会社 抵抗変化型不揮発性記憶装置
JP2020507880A (ja) * 2017-01-20 2020-03-12 ヘフェイ リライアンス メモリー リミティド Rram 書き込み

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100184803A1 (en) * 2007-03-09 2010-07-22 Link Medicine Corporation Treatment of Lysosomal Storage Diseases
JP2009271999A (ja) * 2008-05-07 2009-11-19 Toshiba Corp 抵抗変化メモリ装置
CN102169720B (zh) * 2010-02-25 2014-04-02 复旦大学 一种消除过写、误写现象的电阻随机存储器
US8498141B2 (en) * 2010-03-24 2013-07-30 Kabushiki Kaisha Toshiba Non-volatile semiconductor memory device
US8848421B2 (en) 2010-03-30 2014-09-30 Panasonic Corporation Forming method of performing forming on variable resistance nonvolatile memory element, and variable resistance nonvolatile memory device
US9570678B1 (en) 2010-06-08 2017-02-14 Crossbar, Inc. Resistive RAM with preferental filament formation region and methods
US9601692B1 (en) 2010-07-13 2017-03-21 Crossbar, Inc. Hetero-switching layer in a RRAM device and method
US8946046B1 (en) 2012-05-02 2015-02-03 Crossbar, Inc. Guided path for forming a conductive filament in RRAM
US8411485B2 (en) 2010-06-14 2013-04-02 Crossbar, Inc. Non-volatile variable capacitive device including resistive memory cell
US8274812B2 (en) * 2010-06-14 2012-09-25 Crossbar, Inc. Write and erase scheme for resistive memory device
US9437297B2 (en) 2010-06-14 2016-09-06 Crossbar, Inc. Write and erase scheme for resistive memory device
US9013911B2 (en) 2011-06-23 2015-04-21 Crossbar, Inc. Memory array architecture with two-terminal memory cells
US8884261B2 (en) 2010-08-23 2014-11-11 Crossbar, Inc. Device switching using layered device structure
US8569172B1 (en) 2012-08-14 2013-10-29 Crossbar, Inc. Noble metal/non-noble metal electrode for RRAM applications
US8315079B2 (en) 2010-10-07 2012-11-20 Crossbar, Inc. Circuit for concurrent read operation and method therefor
US8502185B2 (en) 2011-05-31 2013-08-06 Crossbar, Inc. Switching device having a non-linear element
USRE46335E1 (en) 2010-11-04 2017-03-07 Crossbar, Inc. Switching device having a non-linear element
US9620206B2 (en) 2011-05-31 2017-04-11 Crossbar, Inc. Memory array architecture with two-terminal memory cells
US8619459B1 (en) 2011-06-23 2013-12-31 Crossbar, Inc. High operating speed resistive random access memory
US9166163B2 (en) 2011-06-30 2015-10-20 Crossbar, Inc. Sub-oxide interface layer for two-terminal memory
US9627443B2 (en) 2011-06-30 2017-04-18 Crossbar, Inc. Three-dimensional oblique two-terminal memory with enhanced electric field
US9059705B1 (en) 2011-06-30 2015-06-16 Crossbar, Inc. Resistive random accessed memory device for FPGA configuration
US9058865B1 (en) 2011-06-30 2015-06-16 Crossbar, Inc. Multi-level cell operation in silver/amorphous silicon RRAM
US9564587B1 (en) 2011-06-30 2017-02-07 Crossbar, Inc. Three-dimensional two-terminal memory with enhanced electric field and segmented interconnects
US8946669B1 (en) 2012-04-05 2015-02-03 Crossbar, Inc. Resistive memory device and fabrication methods
US8754671B2 (en) 2011-07-29 2014-06-17 Crossbar, Inc. Field programmable gate array utilizing two-terminal non-volatile memory
US10056907B1 (en) 2011-07-29 2018-08-21 Crossbar, Inc. Field programmable gate array utilizing two-terminal non-volatile memory
US9729155B2 (en) 2011-07-29 2017-08-08 Crossbar, Inc. Field programmable gate array utilizing two-terminal non-volatile memory
US8674724B2 (en) 2011-07-29 2014-03-18 Crossbar, Inc. Field programmable gate array utilizing two-terminal non-volatile memory
TWI506627B (zh) * 2011-08-30 2015-11-01 Ind Tech Res Inst 電阻式記憶體及其寫入驗證方法
US8964460B2 (en) * 2012-02-08 2015-02-24 Taiyo Yuden Co., Ltd. Semiconductor device having a non-volatile memory built-in
US9685608B2 (en) 2012-04-13 2017-06-20 Crossbar, Inc. Reduced diffusion in metal electrode for two-terminal memory
US8658476B1 (en) 2012-04-20 2014-02-25 Crossbar, Inc. Low temperature P+ polycrystalline silicon material for non-volatile memory device
US9001552B1 (en) 2012-06-22 2015-04-07 Crossbar, Inc. Programming a RRAM method and apparatus
CN104508969B (zh) 2012-07-27 2017-06-13 松下知识产权经营株式会社 装载有无刷dc电动机的送风装置
US9583701B1 (en) 2012-08-14 2017-02-28 Crossbar, Inc. Methods for fabricating resistive memory device switching material using ion implantation
US9741765B1 (en) 2012-08-14 2017-08-22 Crossbar, Inc. Monolithically integrated resistive memory using integrated-circuit foundry compatible processes
US9672885B2 (en) * 2012-09-04 2017-06-06 Qualcomm Incorporated MRAM word line power control scheme
US9576616B2 (en) 2012-10-10 2017-02-21 Crossbar, Inc. Non-volatile memory with overwrite capability and low write amplification
CN104218552A (zh) * 2013-05-31 2014-12-17 中国科学院微电子研究所 过压过流保护元件及过压过流保护电路
CN104242277B (zh) * 2013-06-21 2018-03-23 中国科学院微电子研究所 一种对负载或输出进行限流保护的装置
US9123414B2 (en) * 2013-11-22 2015-09-01 Micron Technology, Inc. Memory systems and memory programming methods
US9336875B2 (en) 2013-12-16 2016-05-10 Micron Technology, Inc. Memory systems and memory programming methods
US10290801B2 (en) 2014-02-07 2019-05-14 Crossbar, Inc. Scalable silicon based resistive memory device
US9608624B2 (en) * 2014-03-06 2017-03-28 Mediatek Inc. Apparatus for performing signal driving with aid of metal oxide semiconductor field effect transistor
US9286976B2 (en) * 2014-05-29 2016-03-15 Intel Corporation Apparatuses and methods for detecting write completion for resistive memory
TWI688957B (zh) 2014-11-06 2020-03-21 日商索尼半導體解決方案公司 非揮發性記憶體裝置、及非揮發性記憶體裝置之控制方法
KR20160063067A (ko) 2014-11-26 2016-06-03 에스케이하이닉스 주식회사 저항 메모리 소자 및 그 제조 방법
CN107431487B (zh) * 2015-03-12 2019-12-24 美高森美SoC公司 基于紧凑ReRAM的FPGA
WO2016144434A1 (en) * 2015-03-12 2016-09-15 Microsemi SoC Corporation COMPACT ReRAM BASED FPGA
CN106328196B (zh) * 2015-07-01 2019-03-05 华邦电子股份有限公司 电阻式存储器装置的写入方法
US9443587B1 (en) * 2015-07-21 2016-09-13 Winbond Electronics Corp. Resistive memory apparatus and writing method thereof
US10718676B2 (en) * 2015-11-25 2020-07-21 Nanyang Technological University Pressure sensing electronic device, methods of forming and operating the same
CN105846393B (zh) * 2016-05-26 2018-04-13 华南理工大学 一种基于忆阻器的直流断路器电路
TWI600009B (zh) * 2016-11-04 2017-09-21 財團法人工業技術研究院 可變電阻記憶體電路以及可變電阻記憶體電路之寫入方法
TWI604372B (zh) * 2016-11-14 2017-11-01 瑞昱半導體股份有限公司 用於記憶卡存取之中介電路
US10997490B2 (en) * 2017-02-24 2021-05-04 International Business Machines Corporation Battery-based neural network weights
CN109935254A (zh) * 2017-12-15 2019-06-25 中电海康集团有限公司 写操作方法、电存储器件、装置及存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005025914A (ja) * 2003-06-12 2005-01-27 Sharp Corp 不揮発性半導体記憶装置及びその制御方法
WO2006137111A1 (ja) * 2005-06-20 2006-12-28 Fujitsu Limited 不揮発性半導体記憶装置及びその書き込み方法
WO2007046145A1 (ja) * 2005-10-19 2007-04-26 Fujitsu Limited 不揮発性半導体記憶装置の書き込み方法
WO2007074504A1 (ja) * 2005-12-26 2007-07-05 Fujitsu Limited 不揮発性半導体記憶装置及びその書き込み方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4205938B2 (ja) 2002-12-05 2009-01-07 シャープ株式会社 不揮発性メモリ装置
JP4781431B2 (ja) * 2006-05-16 2011-09-28 富士通株式会社 不揮発性半導体記憶装置及びその書き込み方法
JP4745395B2 (ja) * 2006-11-17 2011-08-10 パナソニック株式会社 抵抗変化型記憶装置
US7916556B2 (en) * 2007-01-09 2011-03-29 Sony Corporation Semiconductor memory device, sense amplifier circuit and memory cell reading method using a threshold correction circuitry
JP5065401B2 (ja) * 2007-09-10 2012-10-31 パナソニック株式会社 不揮発性記憶装置および不揮発性記憶装置へのデータ書込方法
KR101424176B1 (ko) * 2008-03-21 2014-07-31 삼성전자주식회사 저항체를 이용한 비휘발성 메모리 장치, 이를 포함하는메모리 시스템

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005025914A (ja) * 2003-06-12 2005-01-27 Sharp Corp 不揮発性半導体記憶装置及びその制御方法
WO2006137111A1 (ja) * 2005-06-20 2006-12-28 Fujitsu Limited 不揮発性半導体記憶装置及びその書き込み方法
WO2007046145A1 (ja) * 2005-10-19 2007-04-26 Fujitsu Limited 不揮発性半導体記憶装置の書き込み方法
WO2007074504A1 (ja) * 2005-12-26 2007-07-05 Fujitsu Limited 不揮発性半導体記憶装置及びその書き込み方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8625328B2 (en) 2009-10-15 2014-01-07 Panasonic Corporation Variable resistance nonvolatile storage device
JP2016021272A (ja) * 2014-06-16 2016-02-04 パナソニックIpマネジメント株式会社 抵抗変化型不揮発性記憶装置
JP2020507880A (ja) * 2017-01-20 2020-03-12 ヘフェイ リライアンス メモリー リミティド Rram 書き込み
US10998044B2 (en) 2017-01-20 2021-05-04 Hefei Reliance Memory Limited RRAM write using a ramp control circuit
US11238930B2 (en) 2017-01-20 2022-02-01 Hefei Reliance Memory Limited Method of RRAM WRITE ramping voltage in intervals
US11682457B2 (en) 2017-01-20 2023-06-20 Hefei Reliance Memory Limited Method of RRAM write ramping voltage in intervals

Also Published As

Publication number Publication date
JP5095728B2 (ja) 2012-12-12
CN101636792A (zh) 2010-01-27
CN101636792B (zh) 2013-03-13
US8094481B2 (en) 2012-01-10
JPWO2008129774A1 (ja) 2010-07-22
US20100110767A1 (en) 2010-05-06

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