WO2008123767A2 - An undercoating layer formulation for non-platable grade substrate for electroless metal plating - Google Patents

An undercoating layer formulation for non-platable grade substrate for electroless metal plating Download PDF

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Publication number
WO2008123767A2
WO2008123767A2 PCT/MY2008/000029 MY2008000029W WO2008123767A2 WO 2008123767 A2 WO2008123767 A2 WO 2008123767A2 MY 2008000029 W MY2008000029 W MY 2008000029W WO 2008123767 A2 WO2008123767 A2 WO 2008123767A2
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WO
WIPO (PCT)
Prior art keywords
group
coating formulation
multifunctional
grade substrate
platable grade
Prior art date
Application number
PCT/MY2008/000029
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French (fr)
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WO2008123767A3 (en
Inventor
Mohamad Nasir Mohamad Ibrahim
Coswald Stephen Sipaut
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Universiti Sains Malaysia
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Filing date
Publication date
Application filed by Universiti Sains Malaysia filed Critical Universiti Sains Malaysia
Priority to CN200880019459A priority Critical patent/CN101743286A/en
Priority to EP08741606A priority patent/EP2181164A4/en
Publication of WO2008123767A2 publication Critical patent/WO2008123767A2/en
Publication of WO2008123767A3 publication Critical patent/WO2008123767A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/04—Polymeric products of isocyanates or isothiocyanates with vinyl compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Definitions

  • This invention is directed to a process for electrolessly plating a conductive metal to the surface of a nonconductive and a non-platable grade material.
  • this invention relates to a coating formulation for said non-platable grade substrate prior to undergoing electroless plating process and a method for applying said coaling formulation onto said non-platable grade substrate.
  • Electroless plating process is a well-known process whereby substrate, which is a nonconductive material, is coated with metal for various applications. It is an autocatalytic process in which ionic state metal is reduced chemically without the influence of electricity.
  • Acrylonitrile-butadiene-styrene (ABS) plastic for example, are coated with metal for not only decorative purposes such as motorcar accessories, furniture fittings, fashion jewelry and buttons but also for functional reasons such as housings of electrical appliances in order to achieve efficient shielding from emission or immission of electromagnetic v radiation.
  • ABS Acrylonitrile-butadiene-styrene
  • the superior 1 properties of coated metal on substrate materials with excelled characteristics of wear resistance, surface finishing and uniform coating thickness rendered electroless plating technique a wide application window as in aerospace, automotives, electronics, computers, machinery, oil and gas production and valve industries. However, this technique is limited by the indispensable reliance on platable grade substrates.
  • a coating formulation for non-platable grade substrate prior to undergoing electroless metal process wherein said coating formulation comprises a mixture of a multifunctional based monomer having allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or - phthalate- group or a combination thereof, and diphenylmetane-4, 4-d ⁇ socyanate (MDI), said multifunctional based monomer does not include multifunctional monomer having hydroxyl group.
  • the ratio of said multifunctional based monomer is less than or equal to ( ⁇ ) said diphenylmetane-4, 4-diisocyanate (MDI).
  • said coating formulation comprises a mixture of a multifunctional based monomer having allyl group or aflcyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group or combination thereof, and diphenylmetane-4, 4-diisocyanate (MDI) 3 said multifunctional based monomer does not include multifunctional monomer having hydroxyl group, are mixed in a vacuum chamber and left for about 30 minutes to allow the polymers to mix well and stabilize before being applied to said non-platable grade substrate.
  • MDI diphenylmetane-4, 4-diisocyanate
  • a method for applying said coating formulation in accordance with the present invention onto a non-platable grade substrate prior to undergoing electroless metal plating process comprises the steps of:
  • a coating formulation for non- platable grade substrate prior to undergoing electroless metal process comprises a mixture of a multifunctional monomer i.e. any monomer based on allyl group or aUryl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group and inclusive any possible combination of the said groups and, diphenylmetane-4, 4-d ⁇ socyanate (MDI).
  • a multifunctional monomer however does not include multifunctional monomer having hydroxyl group.
  • the ratio of said multifunctional monomer is less than or equal to ( ⁇ ) MDI.
  • the above mentioned coating formulation for non-platable grade is an innovative solution that compatibilizes adhesiveness between metal and non- platable grade substrate surfaces.
  • This coating formulation offers versatility and is applicable on virtually all types of materials regardless of it nature or origin such as semi-metals nice silicon, silicates, glasses, ceramics as well as non- metals like plastics, woods and shells.
  • said multifunctional monomer comprises of any monomer based on allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group and inclusive any possible combination of the said groups except for multifunctional monomer having hydroxyl group.
  • multifunctional monomer includes rriallylcyanurate (multifunctional monomer based allyl group), trimethylolpropane trimethacrylate (multifunctional monomer based alkyl group), poly(ethylene)glycol divinyl ether or ester (multifunctional monomer based vinyl group or ether group or ester group), triethylene glycol dimethacrylate or ethyleneglycol dimethacrylate ( multifunctional monomer based methacrylate group), polypropylene glycol (6) acrylate multifunctional monomer based acrylate group) and diallyl phthalate (DALP) (multifunctional monomer based phthalate ' group).
  • rriallylcyanurate multifunctional monomer based allyl group
  • trimethylolpropane trimethacrylate multifunctional monomer based alkyl group
  • poly(ethylene)glycol divinyl ether or ester multifunctional monomer based vinyl group or ether group or ester group
  • the monomer of diallyl phthalate (DALP) and diphenylmetane-4, 4- d ⁇ socyanate (MDT) from analytical grade are used for the preparation of said polymer solution.
  • Mixture of monomers preferably in the ratio of 1:2 for DALP: MDI is used.
  • the mixing process between these two liquids must be done inside a vacuum chamber and left for 30 minutes to allow the mixture to mix well and stabilize before it can readily be used.
  • the polymer solution must be kept inside vacuum bottle to avoid oxidation.
  • the ratio of said multifunctional monomer is less than or equal ( ⁇ ) to diphenyImetane-4, 4-d ⁇ socyanate (MDI), a more preferred ratio of 1:1 is favorable for multifunctional monomer based vinyl group or ether group or ester group such as poly(ethylene) glycol divinyl ether.
  • non-platable grade substrate such as wood
  • the conventional plating process i.e. etching, neutra ⁇ zarion, -activation, acceleration and plating is the same for any other metal plating.
  • plaster of Paris is coated with polymer formulation according to the present invention comprising a ratio of 1 : 2 of diallyl phthalate (DALP) and ch ' phenylmetane-4, 4-diisocyanate (MDI) from analytical grade.
  • DALP diallyl phthalate
  • MDI 4-diisocyanate
  • the plaster of Paris is then cured at room temperature for 8 hours and further dried in an oven for two days. After that, said plaster of Paris undergoing a conventional electroless plating process i.e. etching, neutralization, activation, acceleration and plating.
  • multifunctional monomer any monomer based on allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group and inclusive any possible combination of the said groups, except for multifunctional monomer having hydroxyl group
  • DALP diallyl phthalate
  • MDI 4-diisocyanate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemically Coating (AREA)

Abstract

Described herein is a coating formulation for non-platable grade substrate prior to undergoing an electroless metal plating process. Said coating formulation comprises of a mixture of multifunctional based monomer and diphenylmetane- 4, 4-diisocyanate (MDI), said multifunctional based monomer has allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group or combination thereof but does not include multifunctional monomer having hydroxyl group. According to the present invention, the ratio of said multifunctional based monomer is less than or equal (<) to diphenylmetane-4, 4-diisocyanate (MDI). Said coating formulation is mixed in a vacuum chamber for about 30 minutes before being applied to the surface of a non-platable grade substrate.

Description

AN UNDERCOATING LAYER FORMULATION FOR NON- PLATABLE GRADE SUBSTRATE FOR ELECTROLESS METAL
PLATING
Field of the Invention
This invention is directed to a process for electrolessly plating a conductive metal to the surface of a nonconductive and a non-platable grade material. In particular, this invention relates to a coating formulation for said non-platable grade substrate prior to undergoing electroless plating process and a method for applying said coaling formulation onto said non-platable grade substrate.
Technological Background
Electroless plating process is a well-known process whereby substrate, which is a nonconductive material, is coated with metal for various applications. It is an autocatalytic process in which ionic state metal is reduced chemically without the influence of electricity. Acrylonitrile-butadiene-styrene (ABS) plastic, for example, are coated with metal for not only decorative purposes such as motorcar accessories, furniture fittings, fashion jewelry and buttons but also for functional reasons such as housings of electrical appliances in order to achieve efficient shielding from emission or immission of electromagnetic v radiation. The superior1 properties of coated metal on substrate materials with excelled characteristics of wear resistance, surface finishing and uniform coating thickness rendered electroless plating technique a wide application window as in aerospace, automotives, electronics, computers, machinery, oil and gas production and valve industries. However, this technique is limited by the indispensable reliance on platable grade substrates.
There have also been attempts and researches to metal coat nonconductive and non-platable grade substrates as well. The main problem encountered in metal coating of non-platable substrate by electroless plating is most of the time the metal will not plate at all on the substrate. In the case when plating is possible, the adhesion of the metal onto the surface of said non- platable grade substrate is very weak. This problem directly affects the wear resistance, surface finishing as well as the uniform coating thickness of the plated substrate. And, these problems still persist even though there have been many attempts to improve wear resistance, surface finishing as well as the uniform coating thickness of the plated substrate by applying coating formulations onto said substrate prior to the electroless plating process.
Summary of the Invention
It is therefore an object of the invention to provide for a coating formulation for non-platable grade substrate such that said non-platable grade substrate can possibly be plated with metal. Therefore, the plated substrates have improved their wear resistance, surface finishing and uniform coating thickness after undergoing an electroless plating process.
It is also another object of the present invention to provide for a method for preparing said coating formulation.
It is yet another object of the present invention to provide for a method to coat said formulation onto a non-platable grade substrate prior to the electroless plating process.
According to the first object of the invention, there is provided a coating formulation for non-platable grade substrate prior to undergoing electroless metal process wherein said coating formulation comprises a mixture of a multifunctional based monomer having allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or - phthalate- group or a combination thereof, and diphenylmetane-4, 4-dϋsocyanate (MDI), said multifunctional based monomer does not include multifunctional monomer having hydroxyl group. Preferably, in said coating formulation the ratio of said multifunctional based monomer is less than or equal to ( < ) said diphenylmetane-4, 4-diisocyanate (MDI). According to the second object of the invention, said coating formulation comprises a mixture of a multifunctional based monomer having allyl group or aflcyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group or combination thereof, and diphenylmetane-4, 4-diisocyanate (MDI)3 said multifunctional based monomer does not include multifunctional monomer having hydroxyl group, are mixed in a vacuum chamber and left for about 30 minutes to allow the polymers to mix well and stabilize before being applied to said non-platable grade substrate.
According to the third object of the invention, there is provided a method for applying said coating formulation in accordance with the present invention onto a non-platable grade substrate prior to undergoing electroless metal plating process, said method comprises the steps of:
(a) coating said formulation onto the surface of said non-platable grade substrate, preferably by brushing or dipping;
(b) curing said non-platable grade substrate in a room temperature for at least 8 hours to allow the polymers mixture to be fully cured and solidified;
(c) drying said substrate, preferably in an oven, for 2 to 3 days.
In order that the invention may be readily understood and be put into practical effect, preferred examples will be described in the following Detailed Description.
Detailed Description of the Invention
In accordance with the present invention, a coating formulation for non- platable grade substrate prior to undergoing electroless metal process comprises a mixture of a multifunctional monomer i.e. any monomer based on allyl group or aUryl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group and inclusive any possible combination of the said groups and, diphenylmetane-4, 4-dϋsocyanate (MDI). Said multifunctional monomer however does not include multifunctional monomer having hydroxyl group. Further, according to the present invention, in said coating formulation the ratio of said multifunctional monomer is less than or equal to (<) MDI.
The above mentioned coating formulation for non-platable grade is an innovative solution that compatibilizes adhesiveness between metal and non- platable grade substrate surfaces. This coating formulation offers versatility and is applicable on virtually all types of materials regardless of it nature or origin such as semi-metals nice silicon, silicates, glasses, ceramics as well as non- metals like plastics, woods and shells.
According to the present invention, said multifunctional monomer comprises of any monomer based on allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group and inclusive any possible combination of the said groups except for multifunctional monomer having hydroxyl group. Some specific examples of said multifunctional monomer includes rriallylcyanurate (multifunctional monomer based allyl group), trimethylolpropane trimethacrylate (multifunctional monomer based alkyl group), poly(ethylene)glycol divinyl ether or ester (multifunctional monomer based vinyl group or ether group or ester group), triethylene glycol dimethacrylate or ethyleneglycol dimethacrylate ( multifunctional monomer based methacrylate group), polypropylene glycol (6) acrylate multifunctional monomer based acrylate group) and diallyl phthalate (DALP) (multifunctional monomer based phthalate 'group).
The monomer of diallyl phthalate (DALP) and diphenylmetane-4, 4- dϋsocyanate (MDT) from analytical grade are used for the preparation of said polymer solution. Mixture of monomers preferably in the ratio of 1:2 for DALP: MDI is used. The mixing process between these two liquids must be done inside a vacuum chamber and left for 30 minutes to allow the mixture to mix well and stabilize before it can readily be used. The polymer solution must be kept inside vacuum bottle to avoid oxidation.
Although in the present invention the ratio of said multifunctional monomer is less than or equal (<) to diphenyImetane-4, 4-dϋsocyanate (MDI), a more preferred ratio of 1:1 is favorable for multifunctional monomer based vinyl group or ether group or ester group such as poly(ethylene) glycol divinyl ether.
To plate non-platable grade substrate such as wood, we have to apply thin layer of this polymer solution onto the said substrate. Either dipping the substrate into the polymer or apply the polymer solution onto the substrate using brush should be fine. Then, the substrate will undergo a curing process at room temperature for at least 8 hours before further dried inside an oven for several days (2 or 3 days) After that, the substrate is ready for the next process which is conventional electroless plating process.
Conventional electroless metal plating involves five main processes. They are etching, neutralization, activation, acceleration and plating. For nickel plating process, the substrate which has been coated with the polymer formulation of the present invention is soaked into etching solution (potassium permanganate) for 5 minutes. Then, the substrate is soaked into neutralizing solution (mixture of hydrazine hydrate, sodium hydroxide and sodium tartrate, where hydrazine hydrate can be replaced with hydrogen peroxide or formaldehyde) for about 45 seconds. After the neutralization process, the substrate is then dipped into activation solution (mixture of stannous chloride, palladium chloride) for 5 minutes, followed by the acceleration solution (hydrochloric acid) for 2 minutes. Finally, the substrate is dipped into nickel plating bath. For electroless copper plating process, the plating steps are the same as described above. However, the etching solution used is chromic acid and the plating bath is copper plating bath.
The conventional plating process i.e. etching, neutraϋzarion, -activation, acceleration and plating is the same for any other metal plating.
Example 1 : Metal Plating onto Plaster of Paris
Firstly, plaster of Paris is coated with polymer formulation according to the present invention comprising a ratio of 1 : 2 of diallyl phthalate (DALP) and ch'phenylmetane-4, 4-diisocyanate (MDI) from analytical grade.
The plaster of Paris is then cured at room temperature for 8 hours and further dried in an oven for two days. After that, said plaster of Paris undergoing a conventional electroless plating process i.e. etching, neutralization, activation, acceleration and plating.
As mentioned above, different multifunctional monomer (any monomer based on allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group and inclusive any possible combination of the said groups, except for multifunctional monomer having hydroxyl group) may be used in place of diallyl phthalate (DALP) in Example 1 given that in general the ratio of said multifunctional monomer is < diphenylmetane-4, 4-diisocyanate (MDI) .
While the preferred embodiments of the present invention and its advantages have been disclosed in the above detailed description, the invention is not limited thereto but only by the features and scopes of the appended claims.

Claims

Claims:
1. A coating formulation for non-platable grade substrate prior to undergoing electroless metal process wherein said coating formulation comprises a mixture of a multifunctional based monomer having allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group or combination thereof, and diphenylmetane-4, 4-diisocyanate (MDI), said multifunctional based monomer does not include multifunctional monomer having hydroxyl group.
2. A coating formulation for non-platable grade substrate according to Claim 1 wherein the ratio of said multifunctional based monomer is less than or equal to said diphenylmetane-4, 4-dϋsocyanate (MDI).
3. A coating formulation for non-platable grade substrate according to Claim 1 or 2 wherein said multifunctional based monomer is diallyl phthalate (DALP).
4. A coating formulation for non-platable grade substrate according to Claim 3 wherein said coating formulation comprises a mixture of diallyl phthalate (DALP) and diphenylmetane-4, 4-diisocyanate (MDI) in ratio of 1: 2.
5. A coating formulation for non-platable grade substrate according to Claim 1 or 2 wherein said multifunctional monomer is poly(ethylene) glycol divinyl ether .
6. A coating formulation for non-platable grade substrate according to Claim 5 wherein said coating formulation comprises' a mixture of poly(ethylene) glycol divinyl ether and diphenylmetane-4, 4- dϋsocyanate (MDI) in the ratio of 1 : 1.
7. A coating formulation for non-platable grade substrate according to Claim 1 or 2 wherein said multifunctional based monomer having allyl group or alkyl group or vinyl group or ether group or ester group or methacrylate group or acrylate group or phthalate group or combination thereof, and diphenylmetane-4, 4-dϋsocyanate (MDI)', said multifunctional based monomer does not include multifunctional monomer having hydroxy! group, are mixed in a vacuum chamber and left for about 30 minutes to allow the polymers to mix well and stabilize before being applied to said non-platable grade substrate.
8. A coating formulation for non-platable grade substrate according to Claim 7 wherein said multifunctional based monomer is diallyl phthalate (DALP) .
9. A coating formulation for non-platable grade substrate according to Claim 7 wherein said multifunctional based monomer is polyethylene) glycol divinyl ether.
10. A method for applying coating formulation according to Claim lor 2 or 7 or 8 or 9 onto a non-platable grade substrate prior to undergoing electroless metal process, said method comprises the steps of:
(a) coating said formulation onto the surface of said non-platable grade substrate, preferably by brushing or dipping;
(b) curing said non-platable grade substrate at room temperature for at least 8 hours to allow the polymers mixture to be fully cured and solidified;
(c) drying said substrate, preferably in an oven, for 2 to 3 days.
PCT/MY2008/000029 2007-04-10 2008-04-08 An undercoating layer formulation for non-platable grade substrate for electroless metal plating WO2008123767A2 (en)

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CN200880019459A CN101743286A (en) 2007-04-10 2008-04-08 An undercoating layer formulation for non-platable grade substrate for electroless metal plating
EP08741606A EP2181164A4 (en) 2007-04-10 2008-04-08 An undercoating layer formulation for non-platable grade substrate for electroless metal plating

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MYPI20070548 2007-04-10
MYPI20070548 2007-04-10

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WO2008123767A3 WO2008123767A3 (en) 2008-12-11

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EP2181164A4 (en) 2011-01-26
CN101743286A (en) 2010-06-16
EP2181164A2 (en) 2010-05-05
WO2008123767A3 (en) 2008-12-11

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