WO2008120418A1 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
WO2008120418A1
WO2008120418A1 PCT/JP2007/073308 JP2007073308W WO2008120418A1 WO 2008120418 A1 WO2008120418 A1 WO 2008120418A1 JP 2007073308 W JP2007073308 W JP 2007073308W WO 2008120418 A1 WO2008120418 A1 WO 2008120418A1
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WIPO (PCT)
Prior art keywords
electrode
semiconductor device
source
drain
gate
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Application number
PCT/JP2007/073308
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English (en)
French (fr)
Inventor
Kazutaka Takagi
Original Assignee
Kabushiki Kaisha Toshiba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toshiba filed Critical Kabushiki Kaisha Toshiba
Priority to US12/514,933 priority Critical patent/US8278685B2/en
Priority to KR1020097008283A priority patent/KR101156779B1/ko
Priority to EP07832928A priority patent/EP2133909A4/en
Publication of WO2008120418A1 publication Critical patent/WO2008120418A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/095—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being Schottky barrier gate field-effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725—Source or drain electrodes for field effect devices
    • H01L29/41758—Source or drain electrodes for field effect devices for lateral devices with structured layout for source or drain region, i.e. the source or drain region having cellular, interdigitated or ring structure or being curved or angular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/812—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

　接地インダクタンスを低減化した半導体装置およびその製造方法。 　半絶縁性基板１１の第１表面に配置され,複数のフィンガーを有するゲート電極、ソース電極およびドレイン電極と、第１表面とは反対側の第２表面に配置された接地導体２６と、ゲート電極、ソース電極およびドレイン電極ごとに複数のフィンガーをそれぞれ束ねて形成したゲート端子電極１４、ソース端子電極１８およびドレイン端子電極１２と、ゲート電極、ソース電極およびドレイン電極の下部の半絶縁性基板１１上に形成された動作層と、第１表面近傍の小口径ＶＩＡホール３０と第２表面近傍の大口径ＶＩＡホール２０とからなる多段ＶＩＡホールと、多段ＶＩＡホールの内壁面および第２表面に形成され、ソース端子電極１８に対して第２表面側の接地導体から接続された接地電極２３とを備える半導体装置およびその製造方法。
PCT/JP2007/073308 2007-04-02 2007-12-03 半導体装置およびその製造方法 WO2008120418A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/514,933 US8278685B2 (en) 2007-04-02 2007-12-03 Semiconductor device used with high frequency band
KR1020097008283A KR101156779B1 (ko) 2007-04-02 2007-12-03 반도체 장치 및 그 제조 방법
EP07832928A EP2133909A4 (en) 2007-04-02 2007-12-03 SEMICONDUCTOR ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-096851 2007-04-02
JP2007096851A JP5100185B2 (ja) 2007-04-02 2007-04-02 半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
WO2008120418A1 true WO2008120418A1 (ja) 2008-10-09

Family

ID=39808006

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073308 WO2008120418A1 (ja) 2007-04-02 2007-12-03 半導体装置およびその製造方法

Country Status (6)

Country Link
US (1) US8278685B2 (ja)
EP (1) EP2133909A4 (ja)
JP (1) JP5100185B2 (ja)
KR (1) KR101156779B1 (ja)
TW (1) TWI385788B (ja)
WO (1) WO2008120418A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010068872A1 (en) * 2008-12-12 2010-06-17 Qualcomm Incorporated Via first plus via last technique for ic interconnect
CN106847679A (zh) * 2015-10-09 2017-06-13 英飞凌科技股份有限公司 通过去除非晶化的部分来制造碳化硅半导体器件的方法

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US8143654B1 (en) * 2008-01-16 2012-03-27 Triquint Semiconductor, Inc. Monolithic microwave integrated circuit with diamond layer
US20110018013A1 (en) * 2009-07-21 2011-01-27 Koninklijke Philips Electronics N.V. Thin-film flip-chip series connected leds
JP5631607B2 (ja) * 2009-08-21 2014-11-26 株式会社東芝 マルチチップモジュール構造を有する高周波回路
CN102263192B (zh) * 2010-05-31 2016-02-03 精材科技股份有限公司 发光二极管次基板、发光二极管封装及其制造方法
JP5649357B2 (ja) * 2010-07-30 2015-01-07 住友電工デバイス・イノベーション株式会社 半導体装置及び製造方法
JP5760394B2 (ja) * 2010-11-05 2015-08-12 三菱電機株式会社 ビアホールの製造方法およびビアホールを有する半導体素子の製造方法
US8853857B2 (en) 2011-05-05 2014-10-07 International Business Machines Corporation 3-D integration using multi stage vias
KR101813180B1 (ko) * 2011-06-28 2017-12-29 삼성전자주식회사 고 전자 이동도 트랜지스터 및 그 제조방법
WO2013136422A1 (ja) * 2012-03-12 2013-09-19 三菱電機株式会社 太陽電池セルの製造方法
KR101988893B1 (ko) 2012-12-12 2019-09-30 한국전자통신연구원 반도체 소자 및 이를 제조하는 방법
US10672877B2 (en) * 2018-02-06 2020-06-02 Integrated Device Technology, Inc. Method of boosting RON*COFF performance
US10629526B1 (en) 2018-10-11 2020-04-21 Nxp Usa, Inc. Transistor with non-circular via connections in two orientations
JP2021052025A (ja) * 2019-09-20 2021-04-01 富士通株式会社 半導体装置、半導体装置の製造方法及び電子装置
US11356070B2 (en) 2020-06-01 2022-06-07 Wolfspeed, Inc. RF amplifiers having shielded transmission line structures
US11670605B2 (en) 2020-04-03 2023-06-06 Wolfspeed, Inc. RF amplifier devices including interconnect structures and methods of manufacturing
US11837457B2 (en) * 2020-09-11 2023-12-05 Wolfspeed, Inc. Packaging for RF transistor amplifiers
US20240096968A1 (en) * 2021-02-17 2024-03-21 Mitsubishi Electric Corporation Nitride semiconductor device and method for manufacturing nitride semiconductor device

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JPS63278368A (ja) * 1987-05-11 1988-11-16 Nec Corp 半導体基板のバイアホ−ル形成方法
JPH02307219A (ja) * 1989-05-23 1990-12-20 Oki Electric Ind Co Ltd 半導体素子の電極の製造方法
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010068872A1 (en) * 2008-12-12 2010-06-17 Qualcomm Incorporated Via first plus via last technique for ic interconnect
US7939926B2 (en) 2008-12-12 2011-05-10 Qualcomm Incorporated Via first plus via last technique for IC interconnects
US7985620B2 (en) 2008-12-12 2011-07-26 Qualcomm Incorporated Method of fabricating via first plus via last IC interconnect
US8076768B2 (en) 2008-12-12 2011-12-13 Qualcomm Incorporated IC interconnect
CN106847679A (zh) * 2015-10-09 2017-06-13 英飞凌科技股份有限公司 通过去除非晶化的部分来制造碳化硅半导体器件的方法

Also Published As

Publication number Publication date
KR101156779B1 (ko) 2012-06-18
US20100059791A1 (en) 2010-03-11
US8278685B2 (en) 2012-10-02
TW200841455A (en) 2008-10-16
EP2133909A4 (en) 2011-03-16
KR20090084825A (ko) 2009-08-05
JP2008258281A (ja) 2008-10-23
EP2133909A1 (en) 2009-12-16
JP5100185B2 (ja) 2012-12-19
TWI385788B (zh) 2013-02-11

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