WO2008066051A1 - Composition de résine thermiquement conductrice - Google Patents

Composition de résine thermiquement conductrice Download PDF

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Publication number
WO2008066051A1
WO2008066051A1 PCT/JP2007/072875 JP2007072875W WO2008066051A1 WO 2008066051 A1 WO2008066051 A1 WO 2008066051A1 JP 2007072875 W JP2007072875 W JP 2007072875W WO 2008066051 A1 WO2008066051 A1 WO 2008066051A1
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WO
WIPO (PCT)
Prior art keywords
parts
weight
thermal conductivity
resin composition
liquid crystalline
Prior art date
Application number
PCT/JP2007/072875
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English (en)
Japanese (ja)
Inventor
Takayuki Miyashita
Takashi Usami
Original Assignee
Polyplastics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Polyplastics Co., Ltd. filed Critical Polyplastics Co., Ltd.
Priority to CN2007800437045A priority Critical patent/CN101547975B/zh
Publication of WO2008066051A1 publication Critical patent/WO2008066051A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Definitions

  • the present invention relates to an insulating heat conductive resin composition having excellent moldability and wear characteristics. More specifically, the present invention relates to a heat used for various automobile parts, electric and electronic parts and the like that require heat dissipation. The present invention relates to a liquid crystalline polymer composition having excellent conductivity. Background art
  • Liquid crystalline polymers that can form an anisotropic molten phase are known as materials that are superior in dimensional accuracy and vibration damping properties among thermoplastic resins, and that generate very little burrs during molding.
  • liquid crystal polymer compositions reinforced with glass fibers have been widely used as materials for various electric and electronic parts.
  • these components have become lighter, thinner, and shorter, and heat radiation inside the components has become a problem, and there has been a demand for materials that impart heat dissipation.
  • thermoplastic resin Japanese Patent Application Laid-Open No. 2000-061 1994.
  • PBO polybenzazole
  • An object of the present invention is to solve the above-mentioned drawbacks of the prior art and to provide a highly heat-conductive material that is insulating and excellent in moldability and wear characteristics.
  • the present inventors diligently searched for and studied a liquid crystalline polymer composition having excellent moldability and wear characteristics and high thermal conductivity. As a result, specific fibers were obtained for the liquid crystalline polymer.
  • the present invention has been completed by finding that it is extremely effective to combine a sheet-like heat conductive filler with a specific plate-like / spherical / indeterminate heat-conductive filler.
  • the total addition amount of the components (B) and (C) is 30 to 500 parts by weight with respect to 100 parts by weight of the (A) liquid crystalline polymer, and the thermal conductivity is at least 0.8 W / m ⁇ K. Insulating heat conductive resin composition.
  • the above composition has a thermal conductivity of 0.8 W / m ⁇ K or more.
  • the liquid crystalline polymer (A) used in the present invention refers to a melt processable polymer having a property capable of forming an optically anisotropic molten phase.
  • the properties of the anisotropic molten phase can be confirmed by a conventional polarization inspection method using an orthogonal polarizer. More specifically, the anisotropic molten phase can be confirmed by observing a molten sample placed on a Leitz hot stage at a magnification of 40 times in a nitrogen atmosphere using a Leit Z polarization microscope. .
  • a liquid crystalline polymer applicable to the present invention is examined between crossed polarizers, polarized light is normally transmitted even in a molten stationary state, and optically anisotropic.
  • the liquid crystalline polymer (A) is not particularly limited, but is preferably an aromatic polyester or an aromatic polyester amide, and the aromatic polyester or the aromatic polyester amide is contained in the same molecular chain. Partially included polyesters are also in that range. These are preferably at least about 2.0 d 1 / g, more preferably from 2.0 to 10 O dl / g when dissolved in pentafluorophenol at a concentration of 0.1 wt% at 60 ° C. Those having logarithmic viscosity (I.V.) are used.
  • the aromatic polyester or aromatic polyester amide as the liquid crystalline polymer (A) applicable to the present invention is particularly preferably at least selected from the group consisting of aromatic hydroxycarboxylic acids, aromatic hydroxyamines and aromatic diamines. Aromatic polyesters and aromatic polyester amides having one or more compounds as constituents.
  • liquid crystalline polymer (A) examples include aromatic hydroxycarboxylic acids such as p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, , 6-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 4, 4'-dihydroxybifenenole, hydroxyquinone, resorcin, compounds represented by the following general formula (I) and the following general formula (II), etc.
  • aromatic hydroxycarboxylic acids such as p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid
  • 6-dihydroxynaphthalene 1,4-dihydroxynaphthalene
  • 4, 4'-dihydroxybifenenole hydroxyquinone
  • resorcin compounds represented by the following general formula (I) and the following general formula (II), etc.
  • Aromatic diols terephthalic acid, isophthalic acid, 4,4′-diphenyldicarboxylic acid, 2,6-naphthalenedicarboxylic acid and aromatic dicarboxylic acids such as compounds represented by the following general formula (III); p-aminophenol And aromatic amines such as p-phenylenediamine.
  • liquid crystalline polymers (A) to which the present invention is applied include aromatic compounds containing p-hydroxybenzoic acid, 6-hydroxy-1-naphthoic acid, 4,4, -dihydroxybiphenyl, and terephthalic acid as main structural unit components.
  • a polyester A polyester.
  • fibrous titanium oxide used in the present invention its thermal conductivity is important. If the thermal conductivity is low, improvement in the thermal conductivity of the resin composition with filler added can hardly be expected. Therefore, the thermal conductivity of fibrous titanium oxide is 3 W / m ⁇ K or more, preferably lOWZm ⁇ K or higher. The aspect ratio is also important.
  • the pect ratio should be 10 or more, preferably 15 or more.
  • Fibrous titanium oxide satisfies the above-mentioned conditions, does not give adverse effects such as decomposition to the liquid crystalline polymer, and has no electrical conductivity.
  • the amount of fibrous titanium oxide added is too small. If the amount added is too small, the heat transfer path in the resin composition will not develop, so that sufficient heat conductivity will not be exhibited. Although the entanglement becomes intense and the thermal conductivity increases, the molding flow There are problems such as a problem that the mobility is remarkably reduced, a problem that the pressure in the extruder rises during kneading and the kneading property is extremely deteriorated, a fiber breaks due to thickening of the resin composition, and a problem that the thermal conductivity is rather lowered.
  • the amount of (B) fibrous titanium oxide added is 10 to 200 parts by weight, preferably 20 to 150 parts by weight, more preferably 20 to 100 parts by weight with respect to 100 parts by weight of (A) liquid crystalline polymer. Most preferably, it is 30 to 100 parts by weight.
  • the (C) plate-like / spherical / indeterminate thermally conductive filler used in the present invention is added.
  • the reason for adding the plate-like / spherical / indeterminate thermally conductive filler is as follows: (B) Fibrous oxidation Titanium alone increases the heat conduction in the fiber direction, but the improvement in the heat conductivity in the perpendicular direction is reduced. Therefore, by adding a filler that spreads in two or more dimensions of plate, spherical, and irregular shapes. It is possible to give uniform thermal conductivity as a resin composition, and adding only a large amount of fibrous titanium oxide causes a significant decrease in fluidity as described above. It is difficult to obtain resin yarns and compositions having high thermal conductivity.
  • the thermal conductivity of a plate-like, spherical, and amorphous heat-conducting filler is as important as that of fibrous titanium oxide.
  • the heat conductivity is low and it becomes difficult to transfer the heat transferred by the fibrous heat conductive filler, and the heat transfer at that portion becomes rate limiting. Therefore, the thermal conductivity of the plate-like / spherical / indeterminate thermal conductive filler is 2 WZm ⁇ K or more, preferably 3 W / m ⁇ K or more.
  • the amount of addition of the plate-shaped 'spherical' amorphous heat conductive filler is too small. However, if the amount added is too small, the heat transfer path in the resin composition will not develop, so that sufficient heat conductivity will not be exhibited. On the other hand, if the amount is too large, the fiber breaks due to the increase in the viscosity of the resin composition, but rather the problem that the thermal conductivity decreases, the problem that the internal pressure of the extruder increases during kneading, and the kneadability deteriorates significantly occurs.
  • the amount of (C) plate-like 'spherical' amorphous heat conductive filler added is 10 to 400 parts by weight with respect to 100 parts by weight of (A) liquid crystalline polymer, preferably 20 to: L00 Parts by weight, more preferably 30 to 80 parts by weight.
  • any material that satisfies the above conditions can be used.
  • Specific substances include talc, anhydrous magnesium carbonate, magnesium oxide, aluminum Mina, silica, beryllia, boron nitride, silicon carbide, and aluminum nitride can be used.
  • talc, magnesium carbonate anhydrous, and magnesium oxide are preferred from the standpoint of filler hardness, toxicity, and economy. .
  • the total addition amount is 30 to 100 parts by weight of 100 parts by weight of the (A) liquid crystalline polymer while satisfying the addition amounts of the components (B) and (C). 500 parts by weight, preferably 50 to 250 parts by weight, more preferably 50 to 200 parts by weight.
  • anhydrous magnesium carbonate used as component (C) Generally, magnesium carbonate exists as a trihydrate, and it is known that its crystal water is released at 100 ° C. For this reason, when general magnesium carbonate is mixed into the resin, problems such as foaming and resin decomposition occur due to the release of crystal water, and kneading cannot be performed.
  • anhydrous magnesium carbonate used in the present invention is obtained by treating a general magnesium carbonate existing as a trihydrate with high temperature and high pressure to form anhydrous crystals, and there is no such problem.
  • Anhydrous magnesium carbonate produced by such a method is generally available as high-purity magnesite M S L (manufactured by Kamijima Chemical Co., Ltd.).
  • magnesium oxide used as the component (C) can be used as it is, but it is preferable to use phosphorus-containing coated magnesium oxide in order to improve the heat and moisture resistance.
  • the phosphorus-containing coated magnesium oxide used in the present invention is the one in which a compound that forms a double oxide is present on the surface of the magnesium oxide and the surface is coated with the double oxide by melting at a high temperature. is there. Specifically, the compound that forms the double oxide is wet-added to the magnesium oxide powder and then mixed and stirred, or the compound that forms the double oxide is present on the surface of the magnesium oxide. It can be produced by firing at a temperature equal to or higher than the melting point of the coating material.
  • the compounds used to form double oxides are aluminum compounds, ironated
  • One or more compounds selected from the group consisting of a compound, a key compound and a titanium compound are preferred.
  • the form of the compound is not limited, but nitrate, sulfate, chloride, oxynitrate, oxysulfate, oxychloride, hydroxide, oxide, etc. are used. Specific examples of this compound include fumed silica, aluminum nitrate, iron nitrate and the like.
  • the method for producing a phosphorus-containing coated magnesium oxide is the following: surface treatment with a phosphorous compound is performed on magnesium oxide having a coating layer made of magnesium oxide or a double oxide produced by the above method, and magnesium phosphate is applied to the surface. A coating layer is formed from the compound.
  • Examples of the phosphorus compound used for this surface treatment include phosphoric acid, phosphate, and acidic phosphate ester. These may be used alone or in combination of two or more. ,.
  • Examples of the phosphate include sodium phosphate, potassium phosphate, and ammonium phosphate
  • examples of the acidic phosphate ester include isopropenoreaside phosphate, methenoreaside phosphate, ethenoreaside phosphate, and propinoreaside phosphate.
  • a predetermined amount of a phosphorus compound is added to magnesium oxide having a coating layer made of magnesium oxide or a double oxide, for example, 5 to 5 After stirring for 60 minutes, firing is performed at a temperature of 300 ° C or higher for 0.5 to 5 hours.
  • Phosphorus-containing coated magnesium oxide produced by such a method is generally available as Cool Filler CF2-1OOA (Tateho Chemical Industry Co., Ltd.).
  • the effect is particularly remarkable when phosphorus-containing coated magnesium oxide is used as component (C).
  • the alkoxysilane compound used in the present invention may be at least one selected from the group consisting of aminoalkoxysilane, vinylalkoxysilane, epoxyalkoxysilane, mercaptoalkoxysilane and arylalkoxysilane.
  • any silane compound having one or more amino groups in one molecule and having two or three alkoxy groups can be used, for example, y-aminopropyl. Trimethoxysilane, aminopropyltriethoxysilane, ⁇ -aminopropylmethyldimethoxysilane, ⁇ -aminopropylmethyljetoxysilane, ⁇ - ( ⁇ -aminoethyl) — ⁇ -aminobutyl pilltrimethoxysilane, ⁇ -phenol ⁇ And monoaminopropyltrimethoxysilane.
  • any silane compound having one or more bur groups in one molecule and having two or three alkoxy groups is effective.
  • Epoxyalkoxysilane is effective as long as it is a silane compound having one or more epoxy groups in one molecule and two or three alkoxy groups, such as ⁇ -glycidoxyprovir. Examples include trimethoxysilane, ⁇ - (3,4-epoxy hexyl) ethyltrimethylsilane, ⁇ -glycidoxy pill triethoxysilane, and the like.
  • any silane compound having one or more mercapto groups in one molecule and having two or three alkoxy groups can be used! /, But any of them can be used.
  • arylalkoxysilane any silane compound having one or more aryl groups in one molecule and having two or three alkoxy groups is effective.
  • one diallylaminopropyl Examples include trimethoxysilane, ⁇ -arylaminopropyltrimethoxysilane, and y-arylthiopropyltrimethoxysilane.
  • the alkoxysilane compounds aminoalkoxysilane is most preferable.
  • the amount of the alkoxysilane compound added is important. If the amount of the alkoxysilane compound is small, the mechanical properties after the PCT are remarkably deteriorated. Therefore, the addition amount of the alkoxysilane compound is 0.1 to 5 parts by weight, preferably 0.4 to 4 parts by weight with respect to 100 parts by weight of (A) liquid crystalline polymer.
  • the high thermal conductive resin composition of the present invention is within the object range of the present invention, in order to improve performance such as mechanical strength, heat resistance, dimensional stability (deformation resistance, warpage), and electrical properties.
  • B Inorganic or organic fillers other than the components may be blended, and for this purpose, fibrous, granular, or plate-like fillers are used.
  • thermoplastic resins that is, flame retardants, colorants such as dyes and pigments, stabilizers such as antioxidants and UV absorbers, lubricants, crystallization accelerators, crystal nucleating agents can be used as the composition of the present invention.
  • Molded products obtained by injection molding, extrusion molding, blow molding, etc. using the heat conductive resin composition of the present invention thus obtained have high moisture and heat resistance, chemical resistance, dimensions. Shows stability, flame retardancy, and excellent heat dissipation. Taking advantage of this advantage, it can be suitably used for components that radiate internally generated heat, such as heat exchangers, heat sinks, and optical pick-ups.
  • LEDs for example, LEDs, sensors, connectors, sockets, terminal blocks, printed circuit boards, motor parts, ECU cases and other electrical / electronic parts, lighting parts, TV parts, rice cooker parts, microwave oven parts, irons, etc. It can be used for home / office electrical product parts such as parts, copier-related parts, printer-related parts, facsimile-related parts, heaters, and air conditioner parts.
  • Example 1 LEDs, sensors, connectors, sockets, terminal blocks, printed circuit boards, motor parts, ECU cases and other electrical / electronic parts, lighting parts, TV parts, rice cooker parts, microwave oven parts, irons, etc. It can be used for home / office electrical product parts such as parts, copier-related parts, printer-related parts, facsimile-related parts, heaters, and air conditioner parts.
  • Thermal conductivity was measured by a hot disk method using a sample in which disk-shaped molded products having a diameter of 30 mra and a thickness of 2 mm were stacked.
  • Liquid crystal polymer, heat conductive filler, and alkoxysilane compound are mixed in the composition shown in Table 1 using a twin screw extruder (TEX30 ⁇ type, manufactured by Nippon Steel) to form pellets, then injected The above-mentioned specimens were molded using a molding machine, and various evaluations were performed. The results are shown in Table 1.
  • each component used and the alkoxysilane compound addition method are as follows.
  • Talc Crown talc PP manufactured by Matsumura Sangyo Co., Ltd., plate shape, average particle size 8 ⁇ , thermal conductivity 3.2W / m ⁇ K
  • Titanium oxide manufactured by Sakai Chemical Industry Co., Ltd.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne une matière isolante ayant une conductivité thermique élevée, qui présente une excellente aptitude au moulage et d'excellentes caractéristiques d'abrasion. L'invention concerne spécifiquement une matière isolante obtenue par l'addition de 10-200 parties en poids d'un oxyde de titane fibreux (B) ayant une conductivité thermique de pas moins de 3 W/m•K et un rapport d'allongement non inférieur à 10, et 10-400 parties en poids d'une ou plusieurs charges (C) thermiquement conductrices sphériques ou amorphes, en paillettes, ayant une conductivité thermique de pas moins de 2 W/m•K à 100 parties en poids d'un polymère cristal liquide (A) (à la condition que la quantité d'addition totale des composants (B) et (C) soit de 30-500 parties en poids pour 100 parties en poids du polymère cristal liquide (A)). La conductivité thermique de la composition est fixée à pas moins de 0,8 W/m•K.
PCT/JP2007/072875 2006-11-29 2007-11-20 Composition de résine thermiquement conductrice WO2008066051A1 (fr)

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CN2007800437045A CN101547975B (zh) 2006-11-29 2007-11-20 热传导性树脂组合物

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JP2006-321161 2006-11-29
JP2006321161A JP5122116B2 (ja) 2006-11-29 2006-11-29 熱伝導性樹脂組成物

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JP4469416B2 (ja) * 2008-08-07 2010-05-26 積水化学工業株式会社 絶縁シート及び積層構造体
WO2011010290A1 (fr) * 2009-07-24 2011-01-27 Ticona Llc Compositions de résine thermoplastique thermoconductrices et applications associées
WO2011010291A1 (fr) * 2009-07-24 2011-01-27 Ticona Llc Compositions de polymère thermoconductrices et articles fabriqués à partir de celles-ci
JP2012031391A (ja) * 2010-06-28 2012-02-16 Toray Ind Inc 液晶性樹脂組成物およびその製造方法
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JP5155769B2 (ja) * 2008-08-07 2013-03-06 ポリプラスチックス株式会社 全芳香族ポリエステル及びポリエステル樹脂組成物
JP5684999B2 (ja) * 2009-08-06 2015-03-18 株式会社カネカ ブロー成形用高熱伝導性熱可塑性樹脂組成物
JP5680873B2 (ja) * 2009-08-20 2015-03-04 株式会社カネカ 高熱伝導性熱可塑性樹脂および熱可塑性樹脂成形体
JP5490604B2 (ja) * 2009-09-18 2014-05-14 株式会社カネカ 熱可塑性樹脂組成物および放熱・伝熱用樹脂材料
SG179099A1 (en) 2009-09-30 2012-04-27 Polyplastics Co Liquid-crystalline polymer and molded article
JP5525322B2 (ja) * 2010-04-26 2014-06-18 株式会社カネカ 高熱伝導性熱可塑性樹脂組成物
KR20120114048A (ko) * 2011-04-06 2012-10-16 삼성정밀화학 주식회사 열전도성 고분자 복합소재 및 이를 포함하는 물품
JP6009535B2 (ja) * 2012-03-15 2016-10-19 東レ・デュポン株式会社 熱可塑性エラストマー樹脂組成物及び複合成形体
JP6526939B2 (ja) * 2013-06-14 2019-06-05 スターライト工業株式会社 熱伝導性樹脂成形品
JP6885687B2 (ja) * 2016-07-29 2021-06-16 上野製薬株式会社 液晶ポリマー組成物
JP6844968B2 (ja) * 2016-07-29 2021-03-17 上野製薬株式会社 液晶ポリマー組成物
JP2019203050A (ja) * 2018-05-22 2019-11-28 デンカ株式会社 断熱材料

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Cited By (10)

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Publication number Priority date Publication date Assignee Title
JP4469416B2 (ja) * 2008-08-07 2010-05-26 積水化学工業株式会社 絶縁シート及び積層構造体
JPWO2010016480A1 (ja) * 2008-08-07 2012-01-26 積水化学工業株式会社 絶縁シート及び積層構造体
WO2011010290A1 (fr) * 2009-07-24 2011-01-27 Ticona Llc Compositions de résine thermoplastique thermoconductrices et applications associées
WO2011010291A1 (fr) * 2009-07-24 2011-01-27 Ticona Llc Compositions de polymère thermoconductrices et articles fabriqués à partir de celles-ci
US20130003416A1 (en) * 2009-07-24 2013-01-03 Yuji Saga Thermally conductive thermoplastic resin compositions and related applications
US9090751B2 (en) * 2009-07-24 2015-07-28 Ticona Llc Thermally conductive thermoplastic resin compositions and related applications
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