WO2008006239A1

WO2008006239A1 - Photothermic desoldering unit

Info

Publication number: WO2008006239A1
Application number: PCT/CN2006/001328
Authority: WO
Inventors: Yu-Ju Hsiao
Original assignee: Yu-Ju Hsiao
Priority date: 2006-06-14
Filing date: 2006-06-14
Publication date: 2008-01-17

Abstract

A photothermic desoldering unit comprises: a unit container(1); an upper cover plate(2), which covers the opening of the unit container, and fixes multiple fans (211,222) under hollow-out parts; a heating cover(4), in which an intake port(42) corresponding to a part of fans in the upper cover plate is provided at the bottom of depressed part, and there is an engagement with clearance between the bottom of the heating cover and the upper cover plate; and a fixation mechanism for circuit board (3), which is provided at the upper cover plate and can hold the circuit board to be desoldered with different size in length and width.

Description

光热式解焊机技术领域 Photothermal desoldering machine

本发明有关于光热式解焊机，特别是指一种体积小、适用范围广泛且加热效能佳的解焊机结构。背景技术 The invention relates to a photothermal type desoldering machine, in particular to a structure of a desoldering machine which is small in size, wide in application range and excellent in heating efficiency. Background technique

一般现有的解焊装置，是指运用于将电路板上电子元件的焊扬部份解除，以便于将该电子元件取下，而可提供更新元件或维修服务的设备；目前较传统的解焊设备，大致分有热风枪、 B G A处理器与小锡炉等三种，其中： Generally, the existing desoldering device refers to a device that is used to remove the soldering portion of the electronic component on the circuit board to facilitate the removal of the electronic component, thereby providing a device for updating the component or repairing service; Welding equipment, roughly divided into three types: hot air gun, BGA processor and small tin furnace, among which:

热风枪：是利用热风的原理直接吹拂于电路板上欲移除的电子元件，使其 ***的焊锡熔化，再利用真空装置吸取该电子元件；但此种热风枪装置因是直接环绕于电子元件的周围吹灌热风，所以只能适用于 S M D的 S O P类型（表面接着）的电子元件，且其设置距离与对应温度不易控制，易造成该电子元件邻近的电路板软化变形，常有损坏难以再利用的情形。 Hot air gun: It uses the principle of hot air to directly blow the electronic components to be removed on the circuit board, so that the solder on the periphery is melted, and then the electronic component is sucked by the vacuum device; however, the hot air gun device directly surrounds the electronic component. The hot air is blown around, so it can only be applied to the electronic components of the SMD SOP type (surface followed by), and the set distance and the corresponding temperature are not easy to control, and the circuit board adjacent to the electronic component is easily softened and deformed, which is often difficult to damage. The situation of utilization.

B G A焊接装置：为专用于 B G A (表面接着）类型电子元件焊接的装置，如中国台湾专利公告第 383983号「锡球阵列 IC焊接及对位装置」及中国台湾公告第 M242972号「锡球阵列 B G A对位焊接装置改良」等二新型专利案所揭示的结构，其虽然都主要应用于锡球阵列 B G A的焊接，也兼具有解焊的功能，但由于其也是釆用热风直接吹于电子元件周缘的方式熔化焊锡，因此同样地具有相同于前述热风枪加热不均匀、易破坏邻近其它电子元件的缺点，且其整体造价昂贵、应用范围也较窄。 BGA soldering device: It is a device dedicated to the soldering of BGA (surface-on-surface) type electronic components, such as Taiwan Patent Publication No. 383983 "Wit Ball Array IC Soldering and Alignment Device" and Taiwan Notice No. M242972 "Tin Ball Array BGA" The structure disclosed in the two new patents, such as the improvement of the alignment welding device, is mainly applied to the soldering of the solder ball array BGA, and also has the function of desoldering, but since it is also used, the hot air is directly blown onto the electronic component. The peripheral method melts the solder, and thus has the same disadvantages as that of the heat gun described above being unevenly heated and easily damaging adjacent electronic components, and the overall cost is high and the application range is narrow.

小锡炉：一般至少设有一电源开关与一温度控制旋钮，且其顶部具有一横向设置的除锡棒，利用该温度控制旋钮控制该除锡棒的表面温度，当利用该小锡炉解焊时，将待处理的电路板设置于该除锡棒上，并使欲解焊的电子元件底部接脚接触于该除锡棒，利用该除锡棒的热量熔化该电子元件各接脚的焊锡，进而达到解焊的目的；但此种小锡炉因采用直接接触的加热型式，仅能应用于电路板背面直接接触的形态，故只适用于 D I P类型（接脚穿透式）的电子元件解焊。 Tin solder furnace: generally has at least one power switch and one temperature control knob, and has a laterally disposed tin removing rod at the top thereof, and the temperature control knob is used to control the surface temperature of the tin removing rod, and when the small tin furnace is used for desoldering When the circuit board to be processed is disposed on the tin removing rod, and the bottom of the electronic component to be desoldered contacts the tin removing rod, and the solder of the soldering rod is used to melt the solder of each of the electronic components. , Furthermore, the purpose of the desoldering is achieved; however, the small tin furnace can only be applied to the direct contact of the back side of the circuit board due to the direct contact heating type, so it is only suitable for the DIP type (pin-through type) electronic component solution. weld.

有鉴于上述传统解焊设备具有各项使用上的缺陷及局限适用范围的情形，本案发明人有一中国台湾专利公告第 417530号及美国专利号码 US 6， 301, 436 B1 In view of the above-mentioned conventional desoldering equipment having various defects in use and limitations, the inventor of the present invention has a Taiwan Patent Patent No. 417530 and a US patent number US 6,301, 436 B1.

「光热式解焊机」的在先专利案，其主要是于一控制台上设有开关与温度控制旋钮，且于该控制台顶部设有一向上开口的架体，于该架体内置一光源，架体顶部罩设一铝反射板用以反射光源，且铝反射板内面设有温度感应器用以感测表面温度，该开关与温度控制旋钮则供控制光源的亮度，当温度感应器所感测到的表面温度与温度控制旋钮所设定的温度相同时，即控制切断供应光源的电源，通过光源产生热传导的形式提供解焊所需的热能温度，形成一种间接式加热形式，使其可适用于前述 S M D、 B G A类型（表面接着）及 D I P类型（接脚穿透式〉等各种电子元件，且具温度控制、避免电路板软化及邻近电子元件损坏等优点；然而，上述的前案结构于实际应用上仍有功能过于简单而难以满足较复杂作业需求的情形，因此，本案发明人再进一步研究改进，终于有本发明产生。 The prior patent of the "photothermal desoldering machine" is mainly provided with a switch and a temperature control knob on a console, and an upwardly open frame body is arranged on the top of the console, and a frame body is built in the frame body. The light source, the top of the frame is covered with an aluminum reflector for reflecting the light source, and the inner surface of the aluminum reflector is provided with a temperature sensor for sensing the surface temperature, and the switch and the temperature control knob are used to control the brightness of the light source, when the temperature sensor senses When the measured surface temperature is the same as the temperature set by the temperature control knob, the power supply of the supply source is controlled to be cut off, and the thermal energy temperature required for the desoldering is provided by the heat conduction of the light source to form an indirect heating form. It can be applied to various electronic components such as SMD, BGA type (surface follow-up) and DIP type (pin-through type), and has the advantages of temperature control, softening of the board and damage of adjacent electronic components; however, the above In the practical application, the case structure is still too simple to meet the needs of more complex operations. Therefore, the inventor of the case Further research and improvement, finally the invention has been produced.

发明内容 Summary of the invention

本发明的主要目的在于提供一种光热式解焊机，其具有较精准的温度控制及较佳的能源利用效率，可达到极佳的经济效益。 The main object of the present invention is to provide a photothermal type desoldering machine which has more precise temperature control and better energy utilization efficiency, and can achieve excellent economic benefits.

本发明的另一目的在于提供一种光热式解焊机，其整体结构的体积极小，却可处理大面积电路板的解焊作业，具有极佳的空间利用效率。 Another object of the present invention is to provide a photothermal type desoldering machine which has a small overall structure and can handle the desoldering operation of a large-area circuit board, and has excellent space utilization efficiency.

本发明为达成上述目的及功效，其所实行的技术手段是，一种光热式解焊机，包括：一机箱，为一顶侧开口的中空壳体，其内可供容置一电源供应器及一电路板，于该机箱的前侧并结合有多个按键及至少一显示装置；一上盖板，盖合于该机箱的开口，其中段部位设有多个镂空部，于各镂空部底侧可分别固定一向上排气的风扇；一加热罩，中央设一凹陷部位，于该凹陷部位中段跨设有至少一可辐射发热 -的加热管，而该加热管上方盖设一可聚热保温的聚热板，另于该凹陷部位底面设有一通风口对应于该上盖板的部份风扇，可供导入气流，而该凹陷部位周侧则设有多个通风槽孔，可供热空气向外排出，以降低该凹陷部位内的温度，又该加热罩底侧以多个铜柱支撑于前述上盖板上方，使该加热罩与上盖板间形成具一间隙的结合，以便于由上盖板的风扇向上的气流可流通于该加热罩的底侧，隔离该加热管的热量向下传递至上盖板；一电路板定位机构，设置于该上盖板上，其包括二平行设置且可相对滑移的衔接杆，且于各衔接杆上另设有多个可滑移的定位元件，以夹持不同长宽尺寸的电路板并使之定位于前述聚热板上方。 In order to achieve the above object and effect, the technical means implemented by the present invention is a photothermal type desoldering machine, comprising: a casing, which is a hollow housing with a top side opening, in which a power source can be accommodated a supplier and a circuit board, and a plurality of buttons and at least one display device are coupled to the front side of the chassis; an upper cover covering the opening of the chassis, wherein the segment is provided with a plurality of hollow portions, respectively The bottom side of the hollow can be separately fixed a fan that vents upward; a heating cover, a recessed portion is disposed in the center, and at least one radiant heat-generating heating pipe is disposed across the middle portion of the recessed portion, and a heat-collecting heat-concentrating layer is disposed above the heating pipe The hot plate has a vent corresponding to a portion of the fan of the upper cover for introducing airflow, and a plurality of ventilation slots for the outer side of the recessed portion for hot air to the outside. Discharging to reduce the temperature in the recessed portion, and the bottom side of the heating cover is supported by the plurality of copper pillars above the upper cover plate, so that a joint with a gap is formed between the heating cover and the upper cover plate, so as to be The upward airflow of the fan of the cover plate can flow to the bottom side of the heating cover, and the heat separating the heating pipe is transmitted downward to the upper cover; a circuit board positioning mechanism is disposed on the upper cover, which comprises two parallel arrangements and The sliding rods can be relatively slipped, and a plurality of slidable positioning elements are additionally disposed on the connecting rods to clamp the circuit boards of different length and width dimensions and position them above the heat collecting plates.

由上所述可知，本发明的光热式解焊机确实具有较精准的温度控制及较佳的能源利用效率，且可以较小的体积结构处理大面积电路板的功效，具有产业上的利用性。附图说明 As can be seen from the above, the photothermal desoldering machine of the present invention does have more precise temperature control and better energy utilization efficiency, and can handle the effect of a large-area circuit board with a small volume structure, and has industrial utilization. Sex. DRAWINGS

图 1 为本发明的构造分解图。 Figure 1 is an exploded perspective view of the structure of the present invention.

图 2 为本发明的组合示意图。 Figure 2 is a schematic view of the combination of the present invention.

图 3 为本发明的后侧组合外观图。 Fig. 3 is a perspective view showing the rear side combination of the present invention.

图 4 为本发明的整体组合剖面图。 Figure 4 is a cross-sectional view of the overall assembly of the present invention.

图 5 为本发明的上盖掀起的动作示意图。 Fig. 5 is a schematic view showing the action of lifting the upper cover of the present invention.

主要元件符号说明 Main component symbol description

I 机箱 I chassis

II 电路板 II board

12 电源供应器 12 power supply

13 显示电路板 132 显示装置13 display board 132 display device

14. 面板 -14. Panel -

15...· 插座单元组15...· socket unit group

151 输入电源插座151 input power outlet

152 输出电源插座152 output power outlet

153 输入讯号座153 input signal block

16 电源开关组16 power switch group

161 主电源开关161 main power switch

162 输出电源开关162 output power switch

17 侧通风孔17 side vents

18. 23....枢接孔 18. 23....Pivot hole

19 支架 19 bracket

191 讯号线 191 signal line

192 感温元件 192 temperature sensing element

2 上盖板 2 upper cover

211、 222..风扇 211, 222.. fan

221 导风罩 221 air duct

2211 上开口 2211 upper opening

24 轴杆 24 shaft

3 电路板定位机构 3 circuit board positioning mechanism

31 滑轨固定架31 rail mount

32 滑轨座 32 slide rail seat

3.21、 322..导槽 3.21, 322.. guide channel

323 挡止件 323 stop

33 第一滑轨组 33 first slide group

331、 341..滑轨 332、 342. .凸部 331, 341.. slide rail 332, 342. . convex

333、 343. .衔接杆 333, 343. . Connecting rod

334、 344. .定位元件 334, 344. Positioning components

335、 345. .钩部 335, 345. . hook

4 .加热罩 4. Heating cover

41, .通风槽孔 41, . Ventilation slot

42 .通风口 42. Vents

431 .加热管 431. Heating tube

44, .夹槽 44, .

441 .聚热板 441. Heat collecting plate

45 .温度感测元件 45. Temperature sensing element

46 .铜柱 46. Copper column

47 .支撑架 47. Support frame

.待解焊电路板具体实施方式 Desoldering circuit board

至于本发明的详细构造、应用原理、作用与功效，则参照下列依附图所作的说明即可得到完全的了解： As for the detailed construction, application principle, function and effect of the present invention, a complete understanding can be obtained by referring to the following description according to the drawings:

请参阅图 1〜5所示，可以很明显地看出，本发明主要包括：机箱 1、上盖板 2、电路板定位机构 3及加热罩 4等部份，其中机箱 1为一顶侧开口的中空壳体，其内可容置一电源供应器 12及一电路板 11，于该机箱 1前侧可结合一显示电路板 13，该显示电路板 13上设有多个按键 131及至少一显示装置 132，再以面板 14覆盖于该显示电路板 13表侧，使其按键 131、显示装置 132可向外展露，另于该机箱 1一侧面设有由一主电源幵关 161、二输出电源开关 162组成的电源开关组 16及多个密集排列的侧通风孔 17，而于机箱 1背侧则设有由二输入电源插座 151、二输出电源插座 152及一输入讯号座 153组成的插座单元组 15，又于机箱 1的开口周缘一侧设有枢接孔 1 8，上盖板 2的一侧设有多个枢接孔 23，可供一轴杆 24贯穿并伸入前述机箱 1的枢接孔 1 8形成枢接，使该上盖板 2可于机箱 1的开口上形成一可枢转掀起的结合，于该上盖板 2的中央部位设有多个镂空部，其中部份镂空部可供结合一向上排气的风扇 211，而另一镂空部则可结合一导风罩 221，该导风罩 221顶端设有一上幵口 2211，而该导风罩 221底端则可结合至少一风扇 222，且使该风扇 222恰位于机箱 1的侧通风孔 17内旁侧，电路板定位机构 3主要由一滑轨固定架 31、二滑轨座 32、一第一滑轨组 33 及一第二滑轨组 34组成，该二滑轨座 32以一滑轨固定架 31固定于上盖板 2上方二对侧，于该滑轨座 32内设有二上方镂空且沿轴向平行延伸的导槽 321、 322, 于该导槽 321、 322中段横设一挡止件 323，该第一、二滑轨组 33、 34分别于一衔接杆 333、 343二端部设有平行延伸的滑轨 331、 341 , 可分别伸入滑轨座 32 的导槽 321、 322内形成滑套，于各滑轨 331、 341另端部设有一凸部 332、 342, 可受该挡止件 323挡止，以限制该滑轨 331、 341的伸缩行程并防止其向外脱落，而于该衔接杆 333、 343上则可分别套合多个定位元件 334、 344, 并于该定位元件 334、 344上设有至少一钩部 335、 345，加热罩 4的底侧以多个铜柱 46支撑于前述上盖板 2上方，使该加热罩 4与上盖板 2间形成具一间隙的结合，于该加热罩 4 中央设一凹陷部位，于该凹陷部位其中二对侧中段跨设有多个加热管 431 (该加热管 431 为卤素灯、石英灯或炭素纤维灯之一或其组合），且于另二对侧设有镂空的通风槽孔 41，而该加热罩 4顶侧周缘设有二平行延伸的夹槽 44，可供***一具聚热保温功能的聚热板 441 (可为陶瓷玻璃或强化玻璃），于该聚热板 441中央可设置一支撑架 47，且该加热罩 4旁侧另设有一温度感测元件 45, 延伸于该聚热板 441上方，而于加热罩 4底面则设有一通风口 42对应于该导风罩 221的上开口 2211。 Referring to FIG. 1 to FIG. 5, it can be clearly seen that the present invention mainly includes: a chassis 1, an upper cover 2, a circuit board positioning mechanism 3, a heating cover 4, and the like, wherein the chassis 1 is a top side opening. A hollow housing having a power supply 12 and a circuit board 11 is disposed therein. A display circuit board 13 is coupled to the front side of the chassis 1. The display circuit board 13 is provided with a plurality of buttons 131 and at least A display device 132 is further covered by the panel 14 on the front side of the display circuit board 13 so that the button 131 and the display device 132 can be exposed outwardly, and a side of the chassis 1 is provided with a main power supply 161, two The power switch group 16 of the power switch 162 and the plurality of densely arranged side air vents 17 are arranged, and the back side of the chassis 1 is provided with a two-input power socket 151, two output power sockets 152 and an input signal socket 153. Socket unit group 15, again A pivot hole 1 is disposed on one side of the opening of the chassis 1 , and a plurality of pivot holes 23 are disposed on one side of the upper cover 2 , and a shaft 24 is inserted through the pivot hole 1 of the chassis 1 . 8 is pivoted, so that the upper cover 2 can form a pivotable joint on the opening of the casing 1, and a plurality of hollow portions are provided at a central portion of the upper cover 2, wherein some hollow portions are available In combination with an upwardly ventilating fan 211, the other hollow portion can be combined with an air hood 221, the top end of the air hood 221 is provided with an upper cymbal 2211, and the bottom end of the air hood 221 can be combined with at least one fan. 222, and the fan 222 is located just beside the side vent hole 17 of the chassis 1. The circuit board positioning mechanism 3 is mainly composed of a slide rail holder 31, two rail mounts 32, a first slide rail group 33, and a first The two rail assemblies 34 are fixed to the two opposite sides of the upper cover 2 by a slide rail holder 31. The slide rails 32 are provided with two upper hollows and parallel extending in the axial direction. A guiding member 323 is disposed in the middle of the guiding groove 321 and 322, and the first and second sliding rail groups 33 and 34 are respectively connected to a connecting rod 333 and 343. The sliding portions 331 and 341 extending parallel to the guiding grooves 321 and 322 of the sliding rail base 32 respectively form a sliding sleeve, and the convex portions 332 and 342 are disposed at the other ends of the sliding rails 331 and 341. The plurality of positioning elements 334, 344 are respectively sleeved on the connecting rods 333, 343, and are blocked by the blocking member 323 to limit the telescopic stroke of the sliding rails 331, 341, and to prevent them from falling outward. The positioning elements 334, 344 are provided with at least one hook portion 335, and the bottom side of the heating cover 4 is supported by the plurality of copper posts 46 above the upper cover 2 such that the heating cover 4 and the upper cover 2 are Forming a combination with a gap, a recessed portion is disposed in the center of the heating cover 4, and a plurality of heating tubes 431 are disposed across the opposite side of the recessed portion (the heating tube 431 is a halogen lamp, a quartz lamp or a carbon fiber lamp) One or a combination thereof, and the hollowing ventilation slots 41 are provided on the other two sides, and the top side of the heating cover 4 is provided with two parallel extending slots 44 for inserting a heat collecting and holding function. a heat collecting plate 441 (which may be ceramic glass or tempered glass), and a support frame may be disposed in the center of the heat collecting plate 441 47, and a temperature sensing component 45 is disposed on the side of the heating cover 4, extending above the heat collecting plate 441, and a ventilation opening 42 is formed on the bottom surface of the heating cover 4 corresponding to the upper opening 2211 of the air guiding cover 221 .

使用时，以该钩部 335、 345于该衔接杆 333、 343上滑移，配合滑轨 331、 341于滑轨座 32的导槽 321、 322内滑移，可供夹持不同长宽尺寸的待解焊电路板 5，而该加热管 431的热量可经由聚热板 441聚集后向上加热该待解焊电路板 5，以熔解其上的焊锡（其加热的温度可由温度感测元件 45感应，并回馈至电路板 11加以修正，以确保稳定而避免过热），另该支撑架 47则可于聚热板 441 上支撑于该待解焊电路板 5中央，以防止该待解焊电路板 5中央受热软化而下垂，此时，风扇 222可经由侧通风孔 17抽取机箱 1外部的空气，并经由导风罩 221的上幵口 2211导入加热罩 4内散热，且该热空气可由通风槽孔 41向外排出，以降低加热罩 4内的温度，再配合由上盖板 2的风扇 211吸取的向上气流流通于该加热罩 4的底侧，可有效隔离该加热管 431的热量向下传递至上盖板 2，以确保机箱 1内各元件正常运作。 In use, the hooks 335 and 345 slide on the connecting rods 333 and 343, and the sliding rails 331 and 341 slide in the guiding grooves 321 and 322 of the sliding rail seat 32 for clamping different length and width dimensions. The circuit board 5 to be soldered, and the heat of the heating tube 431 can be gathered by the heat collecting plate 441 to heat the board to be soldered upward. 5, in order to melt the solder thereon (the temperature of the heating can be induced by the temperature sensing element 45, and fed back to the circuit board 11 for correction to ensure stability and avoid overheating), and the support frame 47 can be used in the heat collecting plate 441 The upper portion is supported on the center of the circuit board 5 to be soldered to prevent the center of the circuit board 5 to be soldered from being softened and softened by the heat. The fan 222 can extract the air outside the chassis 1 through the side air vents 17 and pass through the air hood. The upper opening 2211 of the 221 is introduced into the heating cover 4 to dissipate heat, and the hot air can be discharged outward from the ventilation slot 41 to reduce the temperature in the heating cover 4, and then cooperate with the upward airflow drawn by the fan 211 of the upper cover 2. On the bottom side of the heating cover 4, the heat of the heating pipe 431 can be effectively isolated and transmitted downward to the upper cover 2 to ensure normal operation of the components in the casing 1.

本发明上述各加热管 431可为卤素灯、石英灯或炭素纤维灯之一或其组合 (例如：炭素纤维灯置于中央，于其二旁分别设置卤素灯或石英灯），以适应不同成本及功能要求的组合差异；而多个按键 131则可设定该电路板 11控制该加热管 431的多组加热始末时间、温度及加热时间长短，并于显示装置 132随时显示操作过程及加热状态，而于异常状态时，可通过电路板 11内建的声音警报装置发出警示声音。 Each of the heating tubes 431 of the present invention may be one of a halogen lamp, a quartz lamp or a carbon fiber lamp or a combination thereof (for example, a carbon fiber lamp is placed in the center, and a halogen lamp or a quartz lamp is respectively disposed on both sides thereof) to meet different costs. And a combination of the functional requirements; and the plurality of buttons 131 can set the plurality of sets of heating time, temperature and heating time of the heating tube 431, and display the operation process and the heating state at the display device 132 at any time. In the abnormal state, the warning sound can be sent through the sound alarm device built in the circuit board 11.

再者，本发明上述插座单元组 15的二输入电源插座 151可供衔接二组电源线，并于该二电源线于极性相同的连接状态下，该电路板 11方可动作，以避免因电流过大而造成单一电源线的过载危险情形，同时，二输出电源插座 152是由二输出电源幵关 162分别控制，以便于控制电源输出的衔接，而该输入讯号座 153则可供以一讯号线 191衔接外部预设的感温元件 192，且该感温元件 192 可设置于一具三点支撑的支架 19一端底部，使该支架 19可于设置感温元件 192 一端侧施以较重的配重，可使该支架 19对感温元件 192形成一稳固的定位，利用该支架 19可移动的特性，可使该感温元件 192随时依需要而被移至不同位置，以侦测待解焊电路板 5上不同位置的温度，并回馈至电路板 11以作为控制的参数。 Furthermore, the two-input power socket 151 of the socket unit group 15 of the present invention can be connected to two sets of power lines, and the circuit board 11 can be operated in the same polarity connection state to avoid If the current is too large, the overload condition of the single power line is caused. At the same time, the two output power sockets 152 are respectively controlled by the two output power switches 162 to facilitate the connection of the control power output, and the input signal base 153 is available for one. The signal line 191 is connected to the externally preset temperature sensing element 192, and the temperature sensing element 192 can be disposed at the bottom of one end of the bracket 19 having a three-point support, so that the bracket 19 can be heavier on one end side of the temperature sensing element 192. The weight of the bracket 19 can form a stable positioning of the temperature sensing element 192. By using the movable characteristic of the bracket 19, the temperature sensing element 192 can be moved to different positions as needed to detect The temperature at different locations on the board 5 is desoldered and fed back to the board 11 as a parameter for control.

本发明通过上述的构造，具有下列的特点： The present invention has the following features by the above configuration:

1.利用远红外线的炭素纤维灯，配合陶瓷玻璃或强化玻璃的聚热特性，可达到较低的能源耗费及较佳的能源使用效率。 1. Using carbon fiber lamps with far infrared rays, combined with the heat collecting characteristics of ceramic glass or tempered glass, Achieve lower energy costs and better energy efficiency.

2.利用至少一个以上的温度感应装置侦测不同位置的温度，并回馈至电路板 11作为控制的参数，因此，具有较精准的温度控制范围。 2. Using at least one temperature sensing device to detect the temperature at different positions and feeding back to the circuit board 11 as a control parameter, thus having a more precise temperature control range.

3.利用电路板定位机构 3 的伸缩结构，可夹持不同长宽尺寸的待解焊电路板 5，具有小体积处理大面积待解焊电路板 5的特点。 3. Using the telescopic structure of the circuit board positioning mechanism 3, the circuit board 5 to be desalted can be clamped with different length and width dimensions, and has the characteristics of small volume processing large-area circuit board 5 to be desoldered.

4.可针对 MICRO BGA进行拆取、回焊及植球等无铅制程作业。 4. Lead-free process operations such as removal, reflow and ball placement for the MICRO BGA.

5.双面电路板于零件向下解焊时，其零件不会向下掉落。 5. When the double-sided circuit board is unsoldered, the parts will not fall down.

6.由于是于非主要零件面加热，因此，除了不易伤害主要零件外，也可有效避免待解焊电路板 5上大面积的接地铜箔导热（大面积的接地铜箔必须以较高的热量及温度解焊）而造成零件损害及松香油挥发（会降低助焊效果）。 6. Because it is heated on the surface of non-main parts, in addition to not easily harming the main parts, it can effectively avoid the large-area grounding copper foil on the circuit board 5 to be soldered. (The large-area grounding copper foil must be higher. Heat and temperature desoldering) cause damage to parts and volatilization of rosin oil (which will reduce the effect of soldering).

但以上所述仅为本发明的一较佳实施例而已，并非用来限定本发明实施的范围。凡依本发明权利要求书所作的均等变化与修饰，皆为本发明专利范围所涵盖。 However, the above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All changes and modifications made in the claims of the present invention are covered by the scope of the invention.

Claims

权利要求书 Claim

1.一种光热式解焊机，其特.征在于，至少包括- 一机箱，为一顶侧幵口的中空壳体，其内可供容置一电源供应器及一电路板，于该机箱前侧并结合有多个按键及至少一显示装置； A photothermal de-soldering machine, characterized in that it comprises at least a casing, which is a hollow casing of a top side opening, in which a power supply and a circuit board are accommodated. a plurality of buttons and at least one display device are coupled to the front side of the chassis;

一上盖板，盖合于该机箱的开口，其中段部位设有多个镂空部，于各镂空部底侧可分别固定多个向上排气的风扇； An upper cover plate is closed to the opening of the casing, wherein a plurality of hollow portions are arranged in the section, and a plurality of upward exhaust fans are respectively fixed on the bottom sides of the hollow portions;

一加热罩，中央设一凹陷部位，于该凹陷部位中段跨设有至少一可辐射发热的加热管，而该加热管上方盖设一可聚热保温的聚热板，另于该凹陷部位底面设有一通风口对应于该上盖板的部份风扇，可供导入气流，而该凹陷部位周侧则设有多个通风槽孔，可供热空气向外排出，以降低该凹陷部位内的温度，又该加热罩底侧以多个铜柱支撑于前述上盖板上方，使该加热罩与上盖板间形成具一间隙的结合，便于由上盖板的风扇向上的气流可流通于该加热罩的底侧，以隔离该加热管的热量向下传递至上盖板； a heating cover, a recessed portion is arranged in the center, at least one heating tube capable of radiating heat is disposed across the middle portion of the recessed portion, and a heat collecting plate capable of collecting heat and heat is disposed above the heating tube, and a bottom surface of the recessed portion a fan corresponding to the upper cover is provided for introducing airflow, and a plurality of ventilation slots are provided on the circumferential side of the recessed portion for allowing hot air to be discharged outward to reduce the recessed portion. The bottom side of the heating cover is supported by the plurality of copper pillars above the upper cover plate to form a gap between the heating cover and the upper cover plate, so that the airflow upward from the fan of the upper cover can be circulated. The bottom side of the heating cover is passed down to the upper cover plate to isolate the heat of the heating pipe;

一电路板定位机构，设置于该上盖板上，其包括二平行设置且可相对滑移的衔接杆，且于各衔接杆上另设有多个可滑移的定位元件，以夹持不同长宽尺寸的待解焊电路板并使之定位于前述聚热板上方。 a circuit board positioning mechanism is disposed on the upper cover plate, and includes two parallelly disposed and relatively slidable connecting rods, and a plurality of slidable positioning elements are further disposed on each of the connecting rods to clamp different The long and wide size of the circuit board to be soldered is positioned above the aforementioned heat collecting plate.

2.如权利要求 1 所述的光热式解焊机，其特征在于，该电路板定位机构的二衔接杆分别于二端部设有平行延伸的滑轨，可分别伸入二滑轨座内相邻且平行延伸的导槽内，通过该滑轨于导槽内滑移，而可使二衔接杆形成相对远近的位置变化。 The photothermal desoldering machine according to claim 1, wherein the two connecting rods of the circuit board positioning mechanism are respectively provided with parallel sliding rails at two ends, and can respectively extend into the two sliding rail seats. In the inner adjacent and parallel extending guide grooves, the two connecting rods can be formed in a relatively distant position change by sliding the sliding rails in the guide grooves.

3.如权利要求 2所述的光热式解焊机，其特征在于，该滑轨座的二导槽呈顶侧镂空与外连通，可供容置各滑轨外端部周缘预设的凸部，且于各导槽中段横设有一挡止件，利用该挡止件挡止该滑轨的凸部，可限制二衔接杆向外拉伸的长度。 The photothermal welding machine according to claim 2, wherein the two guiding grooves of the sliding rail seat are connected to the top side of the hollow side and are connected to the outside, and are arranged to accommodate the peripheral edges of the outer ends of the sliding rails. The convex portion has a stopper on the middle of each of the guide grooves, and the stopper is used to block the convex portion of the slide rail, thereby limiting the length of the two engagement rods to be outwardly stretched.

4.如权利要求 3所述的光热式解焊机，其特征在于，该二滑轨座经由一滑轨固定架固定于该上盖板周缘的二对侧。 4. The photothermal desoldering machine according to claim 3, wherein the two rail seats are slidable The rail holder is fixed to two opposite sides of the periphery of the upper cover.

5.如权利要求 1所述的光热式解焊机，其特征在于，该机箱的顶侧开口周缘一侧设有枢接孔，而于上盖板一侧设有枢接孔，可供一轴杆贯穿枢接于前述机箱的枢接孔，形成一可枢转开启的结合。 The photothermal type soldering machine according to claim 1, wherein a pivot hole is provided on one side of the top side opening of the chassis, and a pivot hole is provided on one side of the upper cover. A shaft rod is pivotally connected to the pivot hole of the chassis to form a pivotable opening.

6.如权利要求 1所述的光热式解焊机，其特征在于，该加热罩边侧设有至少一温度感测元件，以侦测该加热罩上方与待解焊电路板间的温度。 The photothermal desoldering machine according to claim 1, wherein at least one temperature sensing element is disposed on the side of the heating cover to detect a temperature between the heating cover and the circuit board to be soldered. .

7.如权利要求 1 所述的光热式解焊机，其特征在于，一感温元件经由一支架可移动的设置于该待解焊电路板上，以随时依需要而被移至不同位置，以侦测待解焊电路板上不同位置的温度。 The photothermal desoldering machine according to claim 1, wherein a temperature sensing element is movably disposed on the circuit board to be soldered via a bracket to be moved to different positions as needed To detect the temperature at different locations on the board to be soldered.

8.如权利要求 7所述的光热式解焊机，其特征在于，该支架为一具三点支撑的结构，而该感温元件设置于其一支撑点的底部，且该支架于设置感温元件的一端侧具有较重的配重，可使该支架对感温元件形成一稳固的定位。 The photothermal desoldering machine according to claim 7, wherein the bracket is a three-point support structure, and the temperature sensing element is disposed at a bottom of a support point thereof, and the bracket is disposed The one end side of the temperature sensing element has a heavier weight, which enables the bracket to form a stable positioning of the temperature sensing element.

9.如权利要求 1所述的光热式解焊机，其特征在于，该机箱至少一旁侧设有多个侧通风孔，而该上盖板的一镂空部与风扇之间则设有一导风罩，使该导风罩的上开口可衔接于加热罩的通风口，而固设于导风罩下方开口的风扇则可延伸于该机箱的侧通风孔旁侧。 The photothermal welding machine of claim 1 , wherein at least one side of the chassis is provided with a plurality of side ventilation holes, and a guide between the hollow portion of the upper cover and the fan is provided. The wind hood allows the upper opening of the air hood to be coupled to the vent of the heating hood, and the fan fixed to the lower opening of the air hood extends to the side of the side vent of the chassis.

10.如权利要求 1所述的光热式解焊机，其特征在于，该加热管至少是选自卤素灯、石英灯或炭素纤维灯之一。 The photothermal desoldering machine according to claim 1, wherein the heating tube is at least one selected from the group consisting of a halogen lamp, a quartz lamp, and a carbon fiber lamp.

11.如权利要求 1所述的光热式解焊机，其特征在于，该聚热板是选自陶瓷玻璃或强化玻璃之一。 The photothermal desoldering machine according to claim 1, wherein the heat collecting plate is one selected from the group consisting of ceramic glass or tempered glass.

12.如权利要求 1所述的光热式解焊机，其特征在于，该多个按键及显示装置设置于一显示电路板上，并使该显示电路板固定于机箱的前侧，而于该显示电路板的前侧另设有一面板。 The photothermal desoldering machine according to claim 1, wherein the plurality of buttons and the display device are disposed on a display circuit board, and the display circuit board is fixed on the front side of the chassis, and A display panel is further provided on the front side of the display circuit board.