WO2007137095A3 - Carbon nanotube-based structures and methods for removing heat from solid-state devices - Google Patents
Carbon nanotube-based structures and methods for removing heat from solid-state devices Download PDFInfo
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- WO2007137095A3 WO2007137095A3 PCT/US2007/069080 US2007069080W WO2007137095A3 WO 2007137095 A3 WO2007137095 A3 WO 2007137095A3 US 2007069080 W US2007069080 W US 2007069080W WO 2007137095 A3 WO2007137095 A3 WO 2007137095A3
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- solid
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- state devices
- carbon nanotube
- removing heat
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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Abstract
Thermally conductive devices including carbon nanotubes for dissipating heat from solid-state devices are disclosed. The nanotube elements of the invention may be characterized using Raman spectroscopy, and accepted or rejected based on the ratio of the D peak to the G peak of the spectrum. The thermally conductive devices may further include a phase change material that increases lateral heat conduction between the carbon nanotubes.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
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US80093506P | 2006-05-16 | 2006-05-16 | |
US60/800,935 | 2006-05-16 | ||
US86266406P | 2006-10-24 | 2006-10-24 | |
US60/862,664 | 2006-10-24 | ||
US87457906P | 2006-12-12 | 2006-12-12 | |
US60/874,579 | 2006-12-12 | ||
US74911607A | 2007-05-15 | 2007-05-15 | |
US11/749,116 | 2007-05-15 |
Publications (2)
Publication Number | Publication Date |
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WO2007137095A2 WO2007137095A2 (en) | 2007-11-29 |
WO2007137095A3 true WO2007137095A3 (en) | 2008-07-24 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/US2007/069080 WO2007137095A2 (en) | 2006-05-16 | 2007-05-16 | Carbon nanotube-based structures and methods for removing heat from solid-state devices |
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WO (1) | WO2007137095A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US8919428B2 (en) | 2007-10-17 | 2014-12-30 | Purdue Research Foundation | Methods for attaching carbon nanotubes to a carbon substrate |
US8541058B2 (en) | 2009-03-06 | 2013-09-24 | Timothy S. Fisher | Palladium thiolate bonding of carbon nanotubes |
US8323439B2 (en) | 2009-03-08 | 2012-12-04 | Hewlett-Packard Development Company, L.P. | Depositing carbon nanotubes onto substrate |
Citations (5)
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US5525753A (en) * | 1994-01-14 | 1996-06-11 | Brush Wellman, Inc. | Multilayer laminate product and process |
US20030038382A1 (en) * | 1993-09-03 | 2003-02-27 | Combs Edward G. | Molded plastic package with heat sink and enhanced electrical performance |
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