WO2007094234A1 - Imaging device - Google Patents

Imaging device Download PDF

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Publication number
WO2007094234A1
WO2007094234A1 PCT/JP2007/052237 JP2007052237W WO2007094234A1 WO 2007094234 A1 WO2007094234 A1 WO 2007094234A1 JP 2007052237 W JP2007052237 W JP 2007052237W WO 2007094234 A1 WO2007094234 A1 WO 2007094234A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
sub
positioning
main
imaging device
Prior art date
Application number
PCT/JP2007/052237
Other languages
French (fr)
Japanese (ja)
Inventor
Masao Fujiwara
Kenichi Kudo
Original Assignee
Seiko Precision Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Precision Inc. filed Critical Seiko Precision Inc.
Publication of WO2007094234A1 publication Critical patent/WO2007094234A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/75—Circuitry for compensating brightness variation in the scene by influencing optical camera components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means

Definitions

  • the present invention relates to an imaging apparatus, and more particularly to an imaging apparatus suitable for mounting on a small device such as a mobile phone.
  • An imaging device mounted on an electronic device such as a mobile phone or a mobile computer is mounted on an optical unit supporting a lens, an electronic component for driving the imaging device, and a force board.
  • an electronic device external device
  • an optical unit supporting a lens an optical unit supporting a lens
  • an electronic component for driving the imaging device and a force board.
  • Some of such imaging devices have an optical unit and a plurality of electronic components mounted on the same surface.
  • imaging apparatus is required to reduce the size and space of the imaging apparatus itself as the mounted electronic apparatus becomes smaller.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2004-309623
  • the optical unit needs to have a height corresponding to the entire length of the lens or a moving distance of the lens in the optical axis direction, a certain amount is required to reduce the height of the optical unit in the optical axis direction. There was a limit. Therefore, when the optical unit and the electronic component are mounted on the same surface of the substrate, the difference in height between the optical unit and the electronic component in the optical axis direction is large. This height difference created a dead space near the top of the electronic component when the imaging device was mounted on an electronic device (external device).
  • the size of the imaging device depends on the size of the area of the substrate, it is difficult to reduce the size of the imaging device if the area of the substrate is large. In particular, depending on the length of the substrate in the longitudinal direction, the degree of freedom of the mounting position on the electronic device may be limited.
  • the present invention provides an imaging device that can be reduced in size.
  • An imaging device includes a main board on which an imaging element, a main component, and an optical unit for guiding light to the imaging element are mounted on the same surface, and a flexible board on the main board.
  • the main board and the sub board are connected via the flexible board, so that the sub board is disposed to face the main component within the width in the longitudinal direction of the main board. be able to.
  • the main board has only a large occupied area member (image sensor, signal processor, and optical unit) on the same plane, and other sub-components are provided on the sub board. It becomes possible.
  • the sub board by arranging the sub board in this way, the vicinity of the upper part of the main part (subject side in the optical axis direction) caused by the height difference in the optical axis direction between the optical unit and the main part mounted on the main board is provided. Dead space can be eliminated.
  • the sub board is disposed within the longitudinal width of the main board, the length of the imaging apparatus in the longitudinal direction can be suppressed, and the imaging apparatus can be downsized. Also, by mounting sub-components that have been mounted on the main board, other than the image sensor, the signal processing device, and the optical unit, on the sub-board, the area of the main board can be reduced. Thereby, an imaging device can be reduced in size. Further, the degree of freedom of the mounting position on the electronic device is improved by downsizing.
  • the sub board is arranged apart from the main part, the influence of heat radiation from the main part can be suppressed.
  • a configuration may be employed in which the sub-board is disposed so as to be held at a position that is V lower than the height of the optical unit in the optical axis direction.
  • the height of the imaging device in the optical axis direction can be suppressed to the height of the optical unit, so that the imaging device can be reduced in thickness and size.
  • the sub-board may be provided with a terminal portion for electrical connection with an external device.
  • the main board that has the optical unit (including the image sensor) is provided with a large occupied area! / A main part is provided, and the terminal area with a large occupied area is provided on the sub-board separately from the optical unit and main part. Because.
  • the main board and the sub board are rigid wiring boards made of hard base material
  • the main board, the sub board, and the flexible board include the main board and the sub board. It is possible to adopt a configuration that is a rigid flexible wiring board that is integrally connected and electrically connected by a flexible substrate. Since the main board, the sub board, and the flexible board are integrated, it is not necessary to provide a connection portion or a connector space on each board, and the image pickup apparatus can be further downsized.
  • the separation distance between the sub-board and the main component is regulated, so that it is possible to suppress the influence of heat dissipation from the main component due to the separation distance being too small, and imaging due to the separation distance being too large.
  • the height of the device in the optical axis direction can be suppressed.
  • the positioning restricting portion may be formed integrally with the optical unit.
  • the positioning restricting portion is formed integrally with the optical unit, so that it is not necessary to separately attach the positioning restricting portion, and the manufacturing cost can be reduced.
  • the positioning restriction portion may include a second terminal portion that electrically connects the connected device and the sub-board.
  • the sub-board can be positioned and the sub-board and the connected device can be electrically connected.
  • a positioning unit that positions the imaging device is formed in the external device on which the imaging device is mounted, and the positioning engagement that engages the positioning unit is formed in the imaging device.
  • the positioning engagement portion is configured to position the main board and the sub board and to engage with the positioning portion that regulates a separation distance between the sub board and the main component. it can.
  • the imaging device can be manufactured at low cost.
  • the positioning of the main board and the sub board is controlled by a single member and the distance between the sub board and the main part is regulated, so that the positional accuracy is reduced due to dimensional tolerances compared to the case of positioning by multiple members. Can be minimized.
  • FIG. 1 is a diagram illustrating a configuration of an imaging apparatus according to a first embodiment.
  • FIG. 2 is a side view of the imaging device before positioning the sub-board.
  • FIGS. 3A and 3B are diagrams illustrating a configuration of an imaging apparatus according to a second embodiment.
  • FIGS. 4A and 4B are diagrams illustrating a configuration of an imaging apparatus according to a third embodiment.
  • FIGS. 5A and 5B are diagrams illustrating a configuration of an imaging apparatus according to Embodiment 4.
  • FIG. 5A and 5B are diagrams illustrating a configuration of an imaging apparatus according to Embodiment 4.
  • FIGS. 6 (a) and 6 (b) are enlarged views showing a configuration around a positioning pin.
  • FIGS. 1 (a) and 1 (b) are diagrams illustrating the configuration of the imaging apparatus 1 according to the first embodiment.
  • FIG. 1 (a) is a front view of the imaging apparatus 1
  • FIG. 1 (b) is a side view of the imaging apparatus 1.
  • the imaging apparatus 1 includes an optical unit 10, a voice coil motor 20, an image sensor 30, a system IC (main component) 40, a main substrate 50, an electronic component (sub component) 60, a sub substrate 70, and FPC (Flexible Printed). Circuit) (flexible substrate) 55, spacer 80, connector 90, etc.
  • the main board 50 and the sub board 70 are formed of a multilayer rigid wiring made of a hard base material.
  • the main board 50 and the sub board 70 have an inner layer, a part of the inner layer is composed of FPC55, and the main board 50 and the sub board 70 are electrically connected by the FPC55. .
  • the main board 50, the sub board 70, and the FPC 55 are integrated into a rigid flexible board.
  • a lens barrel holding a lens is disposed in the lens barrel opening 21 formed in the voice coil motor 20 which is omitted in FIGS. 1 (a) and 1 (b).
  • the optical unit 10 includes a voice coil motor 20, an imaging device 30, a lens barrel, and the like.
  • the voice coil motor 20 gives a driving force for moving the lens held in the lens barrel in the optical axis direction.
  • the lens guides light to the image sensor 30.
  • the image sensor 30 is composed of a CCD (Charge Coupled Devices) type image sensor or a COMS (Complementary Metal-Oxide Semiconductor) type image sensor.
  • the image sensor 30 is attached to the main board 50 and receives light through a lens.
  • the main board 50 is a board such as paper phenol or glass epoxy, and is formed in a rectangular shape. On the main board 50, the voice coil motor 20 and the system IC 40 are adjacently mounted on the same surface.
  • the system IC 40 includes at least a DSP (Digital Signal Processor) having an image processing circuit, a control circuit for controlling the image sensor 30, an image signal processing circuit for performing image processing on an image signal obtained by the optical unit 10, and the like. It constitutes.
  • the system IC 40 is a component that occupies a large area after the optical unit 10.
  • the image sensor 30 is mounted on the main board 50, and is provided so that the center of the lens barrel opening 21 formed in the voice coil motor 20 and the center of the imaging area of the image sensor 30 overlap. ing.
  • the main board 50 is sized so that only the optical unit 10 (including the imaging element 30) with a large occupation area and the system IC 40 with a large occupation area are provided, and the other electronic components 60 are sub boards 70. Is provided. With this configuration, the imaging device 1 is thin and small.
  • the FPC 55 is formed of a film material such as polyimide and has flexibility.
  • the FPC 55 electrically connects the main board 50 and the sub board 70.
  • the electronic component 60 is mounted on the sub board 70. Details are described below. As shown in FIG. 1 (b), the sub board 70 is formed to have a smaller area than the main board 50, and is V. Because the optical unit 10 (including the image sensor 30) and the system IC 40 are provided on the main board 50, the sub board 70 can be formed smaller than the main board 50.
  • the sub board 70 is connected to the main board 50 via the FPC 55.
  • Spacer 80 (positioning restricting portion) is formed in a columnar shape extending in the optical axis direction, and is formed between the lower end surface of spacer 80 (the end surface on the main board 50 side) and the upper surface of system IC 40.
  • the four corners are fixed, and the upper end surface (the subject side surface) of the spacer 80 and the sub board 70 are fixed.
  • the sub-board 70 is disposed opposite to and separated from the system IC 40.
  • the sub board 70 is arranged in parallel with the main board 50.
  • the FPC 55 is held in a bent state.
  • a plurality of electronic components 60 are mounted on the surface of the sub-board 70 facing the system IC 40.
  • the spacer 80 is formed to have a longer length in the optical axis direction than the electronic component 60, and the sub board 70 is disposed at a position where the electronic component 60 does not contact the system IC 40. Accordingly, the sub-board 70 is disposed opposite to the system IC 40 at a position where the electronic component 60 does not contact the system IC 40.
  • the sub board 70 is disposed within the width of the main board 50 in the longitudinal direction and the width direction.
  • the sub board 70 may be arranged so as to be at least within the width of the main board 50 in the longitudinal direction.
  • the sub board 70 is disposed so as to be opposed to the system IC 40 within the width of the main board 50 in the longitudinal direction.
  • the sub board 70 can be arranged to face the system IC 40 within the width in the longitudinal direction.
  • the dead space near the top of the system IC 40 (the subject side in the optical axis direction) caused by the height difference in the optical axis direction between the optical unit 10 and the system IC 40 is eliminated. be able to.
  • the area of the main board 50 can be reduced.
  • the imaging device 1 can be reduced in size.
  • external devices such as mobile phones The degree of freedom of the mounting position is improved.
  • the sub-board 70 is disposed apart from the system IC 40, the influence of heat radiation from the system IC 40 can be suppressed.
  • the sub board 70 has the sub board 70 and the electronic component 60 at a position lower than the height in the optical axis direction of the optical unit 10 (or the voice coil motor 20). Arranged to be retained. In other words, the sub board 70 holds the sub board 70 and the electronic component 60 at a position closer to the main board 50 side than the upper end surface of the voice coil motor 20 (the surface on the subject side in the optical axis direction). Placed in.
  • the height of the imaging device 1 in the optical axis direction can be suppressed within the height of the optical unit 10, and thus the imaging device 1 can be reduced in size.
  • the electronic component 60 is mounted on a surface facing the system IC 40.
  • a connector (terminal portion) 90 for electrically connecting the sub-board 70 and an external device is provided on the back surface of the surface on which the electronic components of the sub-board 70 are mounted.
  • An FPC 100 that electrically connects the sub board 70 and an external device is attached to the connector 90. Thereby, the substrate of an external device such as a mobile phone on which the imaging device 1 is mounted and the sub-substrate 70 can be electrically connected.
  • the connector 90 is a component having a large occupied area following the optical unit 10 (including the imaging device 30) and the system IC 40. Since the connector 90 and the electronic component 60 smaller than the system IC 40 are provided on the sub board 70, the imaging device 1 is thin and small. This is because components are mounted on one side of the main board 50 in order to reduce the thickness of the main board 50. If more electronic components are provided on the main board 50, the main board 50 becomes larger by the space, and the entire imaging device 1 It will not be downsized. Further, when the system IC 40 is provided on the sub-board 70 in order to further reduce the main board 50, if the sub-board 70 is arranged within the height of the optical unit 10, the width force in the longitudinal direction of the main board 50 is also reduced.
  • the imaging device 1 Does not reduce the size of the imaging device 1. Further, if the system IC 40 and the sub board 70 are provided at a position overlapping the main board 50 in the optical axis direction, the force for further miniaturization in the plan view is not reduced. For this reason, in order to reduce the thickness and size, the main board 50 on which the optical unit 10 is provided has a large occupation area, and only the components (system IC 40 in this embodiment) are provided. Further, since the connector 90 electrically connects the sub board 70 and the external device, the imaging device 1 can be easily mounted on the external device.
  • the FPC 100 attached to the board of the external device is connected to the connector 90 so that the imaging device 1 and the board of the external device can be easily connected. Can be electrically connected.
  • the spacer 80 positions the sub board 70 by regulating the distance between the sub board 70 and the system IC 40.
  • the separation distance between the sub board 70 and the system IC 40 is regulated, so that the influence of heat radiation from the system IC 40 when the separation distance is too small can be suppressed, and the separation distance is too large. Accordingly, the height in the optical axis direction of the imaging device 1 can be suppressed.
  • the image sensor 30, voice coil motor 20, and system IC 40 are mounted on the main board 50.
  • the spacer 80 is mounted on the sub-board 70 together with the electronic component 60. More specifically, the electronic component 60 is mounted on the sub-board 70 and connected to the wiring pattern on the sub-board 70.
  • the spacer 80 is mounted on the sub board 70.
  • the spacer 80 is mounted in the same manner as the electronic component 60 mounted on the sub board 70. For example, a conductive adhesive used when mounting the electronic component 60 on the sub board 70 is used.
  • FIG. 2 is a side view of the imaging apparatus 1 before positioning the sub board 70. As shown in FIG. 2, the spacer 80 is mounted on the same surface as the surface on which the electronic component 60 of the sub-board 70 is mounted.
  • FIGS. 3 (a) and 3 (b) are diagrams illustrating the configuration of the imaging apparatus la according to the second embodiment.
  • FIG. 3 (a) is a front view of the imaging device la
  • FIG. 3 (b) is a side view of the imaging device la. Since the basic configuration of the image pickup apparatus la is the same as that of the image pickup apparatus 1, the same portions are denoted by the same reference numerals and the description thereof is omitted.
  • projecting pieces (positioning restricting portions) 22a to 22c are formed on a part of the side surface 20a of the voice coil motor 20.
  • the projecting pieces 22a to 22c are formed on the side surface 20a of the voice coil motor 20 adjacent to the system IC 40.
  • the projecting pieces 22 a to 22 c extend in the direction perpendicular to the optical axis direction and are formed in a plate shape parallel to the main substrate 50. Further, the projecting pieces 22a to 22c are formed at positions closer to the subject side than the upper surface of the system IC 40. Further, the projecting piece 22a is formed closer to the subject than the projecting pieces 22b and 22c.
  • the protrusions 22b and 22c are formed at the same height in the optical axis direction.
  • the sub board 70 is sandwiched between the projecting piece 22a and the projecting pieces 22b and 22c, and the sub board 70 is positioned by regulating the separation distance between the sub board 70 and the system IC 40.
  • the projecting pieces 22 a to 22 c are formed integrally with the voice coil motor 20. Manufacturing costs can be reduced without the need for a separate positioning restriction.
  • the sub board 70 is positioned in contact with the side surface 20a of the voice coil motor 20. For this reason, the sub board 70 is positioned in the vertical direction of the side face 20a by the side face 20a. As a result, similarly to the first embodiment, the sub-board 70 can be easily arranged so as to be at least within the width of the main board 50 in the longitudinal direction.
  • FIGS. 4A and 4B are diagrams illustrating the configuration of the imaging device lb according to the third embodiment.
  • 4 (a) is a front view of the image pickup device lb
  • FIG. 4 (b) is a side view of the image pickup device lb. Since the basic configuration of the image pickup apparatus lb is the same as that of the image pickup apparatus 1, the same portions are denoted by the same reference numerals and description thereof is omitted.
  • the projecting pieces 22b and 22c which are positioning regulating portions, are formed on a part of the side surface 20a of the voice coil motor 20, and the drive power to the voice coil motor 20
  • a second terminal portion 23 is formed to convey the above.
  • the second terminal portion 23 is formed in parallel with the projecting pieces 22b and 22c.
  • the The second terminal portion 23 is formed closer to the subject than the protrusions 22b and 22c.
  • the sub board 70 is sandwiched between the second terminal portion 23 and the projecting pieces 22b and 22c, and the sub board 70 is positioned by regulating the separation distance between the sub board 70 and the system IC 40.
  • the second terminal portion 23 and the sub board 70 are electrically connected by solder 24. Thereby, the sub board 70 can be reliably positioned between the second terminal portion 23 and the projecting pieces 22b and 22c.
  • the second terminal portion 23 is electrically connected to the voice coil motor 20 and the sub board 70. As described above, the second terminal portion 23 electrically connects the voice coil motor 20 as the non-connecting device and the sub board 70. In addition to positioning the sub board 70, the sub board 70 and the voice coil motor 20 can be electrically connected.
  • FIGS. 5A and 5B are diagrams illustrating the configuration of the imaging device lc according to the fourth embodiment.
  • FIG. 5 (a) is a front view of the imaging device lc
  • FIG. 5 (b) is a side view of the imaging device lc. Since the basic configuration of the image pickup apparatus lc is the same as that of the image pickup apparatus 1, the same portions are denoted by the same reference numerals and description thereof is omitted.
  • the imaging device lc is mounted on a housing 101 of an external device such as a mobile phone.
  • Positioning pins (positioning portions) 102a to 102c are formed on the inner wall surface of the casing 101 so as to extend toward the subject side in the optical axis direction.
  • Notched recesses (positioning engagement portions) 72a to 72c that engage with the end portions of the positioning pins 102a to 102c are formed on the side surface of the sub-board 70a.
  • the notch recesses 72a to 72c are formed at positions corresponding to the positioning pins 102a to 102c, respectively.
  • the positioning pins 102a to 102c position the sub board 70a. Further, the positioning pins 102a to 102c are positioned so that the electronic component 60 does not contact the system IC 40.
  • FIG. 6 (a) and 6 (b) are enlarged views showing the configuration around the positioning pin 102a.
  • FIG. 6 (a) is a diagram showing the engagement between the positioning pin 102a and the notch recess 72a.
  • the engaging pin 1021a protrudes toward the subject side in the optical axis direction. Is formed. Further, the engaging pin 1021a is formed thinner than the body portion of the positioning pin 102a.
  • the engagement pin 1021a engages with the notch recess 72a.
  • the notch recesses 72b and 72c and the positioning pins 102b and 102c have the same configuration as described above.
  • notches 52a to 52c that engage with the side surfaces of the positioning pins 102a to 102c are formed on the side surfaces of the main board 50a. Has been. The notches 52a to 52c are formed at positions corresponding to the positioning pins 102a to 102c, respectively.
  • the positioning pins 102a to 102c position the main board 50a.
  • FIG. 6 (b) is a diagram showing the engagement between the positioning pin 102a and the notch recess 52a.
  • the side surface of the body portion of the positioning pin 102a engages with the notch recess 52a.
  • the notch recesses 52b and 52c and the positioning pins 102b and 102c have the same configuration as described above.
  • the main substrate 50a is positioned with respect to the orthogonal direction of the optical axis.
  • the imaging device lc is easily mounted on the external device. can do.
  • the positioning pins 102a to 102c regulate the separation distance between the sub board 70a and the system IC 40 according to the length in the optical axis direction.
  • the main board 50a and the sub board 70a are positioned by one member and the distance between the sub board 70a and the system IC 40 is regulated, the number of parts of the imaging device can be reduced.
  • the manufacturing process of the imaging device lc can be simplified. Thereby, the imaging device lc can be manufactured at low cost.
  • the main board 50a and the sub board 70a are positioned by one member and the distance between the sub board 70a and the system IC 40 is regulated, the dimensional tolerance is compared with the case of positioning by a plurality of members. It is possible to minimize the deterioration of the position accuracy due to.
  • the optical unit 10 has a voice coil around the lens barrel.
  • the force in which the motor 20 is arranged is not limited to such a configuration, and an actuator for moving the lens in the optical axis direction may be provided in the lens barrel.
  • a positioning restricting portion is formed on the outer peripheral portion of the lens barrel.
  • the main board 50 is not limited to the system IC 40 provided with the system IC 40 on the main board 50.
  • the main board 50 may have any larger area than the electronic component 60 provided on the sub board 70.
  • a DSP or an ISP (Image Signal Processor) having an image processing circuit may be provided.
  • the lens may be driven not only by the voice coil motor 20 but also by using another motor. Further, it may be a single focus type imaging device without a lens driving device. Also, it can be the terminal part to be soldered in the connector 90 into which the FPC100 is inserted!
  • the electronic component 60 is mounted on the surface of the sub-board 70 that faces the system IC 40.
  • the electronic component 60 is not limited to such a configuration, and is opposed to the optical unit 10 unless the height is higher than that of the optical unit 10.
  • An electronic component may be mounted on the surface that is not provided.
  • the spacer 60 is fixed to the system IC 40 and the sub board 70.
  • the spacer 60 is not limited to such a configuration, and the spacer 60 is connected to the main board 50 and the sub board 70. You may comprise so that it may be fixed to. In this case, the spacer 60 may be mounted on the main board 50 together with the system IC 40.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

An imaging device (1) includes: a main substrate (50) having a surface on which a system IC (40) and an optical unit (10) for guiding light to an imaging device (30) are mounted; and a sub substrate (70) connected to the main substrate (50) via an FPC (55) and having a sub part (60). In the state that the FPC (55) is bent, the sub substrate (70) is arranged to oppose to and apart from the system IC (40) within a width in the longitudinal direction of the main substrate (50).

Description

明 細 書  Specification
撮像装置  Imaging device
技術分野  Technical field
[0001] 本発明は、撮像装置、特に携帯電話機などの小型機器への搭載に適した撮像装 置に関する。  [0001] The present invention relates to an imaging apparatus, and more particularly to an imaging apparatus suitable for mounting on a small device such as a mobile phone.
背景技術  Background art
[0002] 携帯電話機ゃモバイルコンピュータ等の電子機器 (外部装置）に搭載される撮像装 置には、レンズを支持する光学ユニットと撮像素子などを駆動するための電子部品と 力 基板上に取り付けられているものがある（特許文献 1参照)。  [0002] An imaging device mounted on an electronic device (external device) such as a mobile phone or a mobile computer is mounted on an optical unit supporting a lens, an electronic component for driving the imaging device, and a force board. (See Patent Document 1).
このような撮像装置は、同一面上に光学ユニットと複数の電子部品とが実装されて いるものがある。  Some of such imaging devices have an optical unit and a plurality of electronic components mounted on the same surface.
また、このような撮像装置は、搭載される電子機器の小型化に伴って、撮像装置自 体も小型化、省スペース化が要請されている。  In addition, such an imaging apparatus is required to reduce the size and space of the imaging apparatus itself as the mounted electronic apparatus becomes smaller.
[0003] 特許文献 1：特開 2004— 309623号公報 [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2004-309623
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0004] ここで光学ユニットは、光軸方向にレンズ全長分の高さあるいはレンズの移動領分 の高さが必要とされるため、光学ユニットの光軸方向の高さを低くするには一定の限 界があった。従って、光学ユニットと電子部品とを基板の同一面上に実装した場合、 光学ユニットと電子部品との光軸方向との高低差が大きなものとなっていた。この高 低差が撮像装置を電子機器 (外部装置）に搭載した際に、電子部品の上部付近の空 間のデッドスペースを生んで 、た。 [0004] Here, since the optical unit needs to have a height corresponding to the entire length of the lens or a moving distance of the lens in the optical axis direction, a certain amount is required to reduce the height of the optical unit in the optical axis direction. There was a limit. Therefore, when the optical unit and the electronic component are mounted on the same surface of the substrate, the difference in height between the optical unit and the electronic component in the optical axis direction is large. This height difference created a dead space near the top of the electronic component when the imaging device was mounted on an electronic device (external device).
また、撮像装置の大きさは基板の面積の大きさに依存するため、基板の面積が大き いと、撮像装置を小型化することが困難となる。特に、基板の長手方向の長さによつ ては、電子機器への搭載位置の自由度が制限される場合がある。  Further, since the size of the imaging device depends on the size of the area of the substrate, it is difficult to reduce the size of the imaging device if the area of the substrate is large. In particular, depending on the length of the substrate in the longitudinal direction, the degree of freedom of the mounting position on the electronic device may be limited.
[0005] そこで、本発明は、小型化することができる撮像装置を提供する。 Accordingly, the present invention provides an imaging device that can be reduced in size.
課題を解決するための手段 [0006] 本発明に係る撮像装置は、撮像素子とメイン部品と前記撮像素子へ導光する光学 ユニットとが同一面上に実装されたメイン基板と、可撓性基板を介して前記メイン基板 に接続されると共にサブ部品が実装されたサブ基板とを備え、前記可撓性基板が曲 げられた状態で、前記サブ基板は、前記メイン基板の長手方向の幅内に前記メイン 部品と離間して光軸方向に対向配置されることを特徴としている。 Means for solving the problem [0006] An imaging device according to the present invention includes a main board on which an imaging element, a main component, and an optical unit for guiding light to the imaging element are mounted on the same surface, and a flexible board on the main board. A sub-board on which the sub-component is mounted and the flexible substrate is bent, the sub-board is separated from the main component within a longitudinal width of the main board. It is characterized by being arranged opposite to the optical axis direction.
[0007] このような構成により、メイン基板とサブ基板とを可撓性基板を介して接続することに より、サブ基板を、メイン基板の長手方向の幅内にメイン部品と対向して配置すること ができる。メイン基板には、占有面積の大きい部材 (撮像素子と信号処理装置と光学 ユニット）のみを同一面上に設け、それ以外のサブ部品をサブ基板に設けているため 、薄型で且つ小型の撮像装置とすることが可能になる。また、このようにサブ基板が 配置されることにより、光学ュニットとメイン基板に実装されたメイン部品との光軸方向 の高低差によって生じる、メイン部品の上部付近 (光軸方向の被写体側）のデッドス ペースを解消することができる。 With such a configuration, the main board and the sub board are connected via the flexible board, so that the sub board is disposed to face the main component within the width in the longitudinal direction of the main board. be able to. The main board has only a large occupied area member (image sensor, signal processor, and optical unit) on the same plane, and other sub-components are provided on the sub board. It becomes possible. In addition, by arranging the sub board in this way, the vicinity of the upper part of the main part (subject side in the optical axis direction) caused by the height difference in the optical axis direction between the optical unit and the main part mounted on the main board is provided. Dead space can be eliminated.
また、前記サブ基板は、前記メイン基板の長手方向の幅内に配置されるので、撮像 装置の長手方向の長さを抑えることができ、撮像装置を小型化することができる。 また、撮像素子と信号処理装置と光学ユニット以外の従来メイン基板に実装されて いたサブ部品をサブ基板に搭載することにより、メイン基板の面積を小さくすることが できる。これにより、撮像装置を小型化することができる。また、小型化されることにより 、電子機器への搭載位置の自由度が向上する。  In addition, since the sub board is disposed within the longitudinal width of the main board, the length of the imaging apparatus in the longitudinal direction can be suppressed, and the imaging apparatus can be downsized. Also, by mounting sub-components that have been mounted on the main board, other than the image sensor, the signal processing device, and the optical unit, on the sub-board, the area of the main board can be reduced. Thereby, an imaging device can be reduced in size. Further, the degree of freedom of the mounting position on the electronic device is improved by downsizing.
また、サブ基板はメイン部品と離間して配置されるので、メイン部品からの放熱の影 響を抑制することができる。  Further, since the sub board is arranged apart from the main part, the influence of heat radiation from the main part can be suppressed.
[0008] 上記構成において、前記サブ基板は、前記光学ユニットの光軸方向の高さよりも低 V、位置で保持されるように配置される、構成を採用できる。 [0008] In the above configuration, a configuration may be employed in which the sub-board is disposed so as to be held at a position that is V lower than the height of the optical unit in the optical axis direction.
このような構成により、撮像装置の光軸方向の高さを光学ユニットの高さに抑えるこ とができるので、撮像装置の薄型化、小型化を図ることができる。  With such a configuration, the height of the imaging device in the optical axis direction can be suppressed to the height of the optical unit, so that the imaging device can be reduced in thickness and size.
[0009] 上記構成にぉ 、て、前記サブ基板は、外部装置と電気的に接続するための端子部 が設けられて 、る構成を採用できる。 [0009] In addition to the above configuration, the sub-board may be provided with a terminal portion for electrical connection with an external device.
このような構成により、メイン基板の大型化が避けられ、撮像装置の小型化を図れる 。光学ユニット (含む撮像素子）が設けられて ヽるメイン基板に占有面積の大き!/ヽメイ ン部品を設け、光学ユニット、メイン部品についで占有面積の大きい端子部をサブ基 板に分けて設けるためである。 With such a configuration, it is possible to avoid an increase in the size of the main board and to reduce the size of the imaging device. . The main board that has the optical unit (including the image sensor) is provided with a large occupied area! / A main part is provided, and the terminal area with a large occupied area is provided on the sub-board separately from the optical unit and main part. Because.
また、前記メイン基板と前記サブ基板は、硬質基材カゝらなるリジット配線基板であり 、前記メイン基板と前記サブ基板と前記可撓性基板とは、前記メイン基板と前記サブ 基板とを前記可撓性基板で一体ィ匕して電気的に接続されているリジットフレキ配線基 板である構成を採用できる。メイン基板とサブ基板と可撓性基板とが一体になつて ヽ るため、各基板に接続部やコネクタのスペースを設ける必要がなくなりより撮像装置 の小型化を図れる。  Further, the main board and the sub board are rigid wiring boards made of hard base material, and the main board, the sub board, and the flexible board include the main board and the sub board. It is possible to adopt a configuration that is a rigid flexible wiring board that is integrally connected and electrically connected by a flexible substrate. Since the main board, the sub board, and the flexible board are integrated, it is not necessary to provide a connection portion or a connector space on each board, and the image pickup apparatus can be further downsized.
[0010] 上記構成にお ヽて、前記サブ基板と前記メイン部品との離間距離を規制して前記 サブ基板を位置決めする位置決め規制部を備えて ヽる、構成を採用できる。  [0010] In the above configuration, it is possible to employ a configuration that includes a positioning restricting portion that positions the sub substrate by restricting the distance between the sub substrate and the main component.
このような構成により、サブ基板とメイン部品との離間距離が規制されるので、離間 距離が小さすぎることに伴うメイン部品からの放熱の影響を抑制できると共に、離間 距離が大きすぎることに伴う撮像装置の光軸方向の高さを抑えることができる。  With such a configuration, the separation distance between the sub-board and the main component is regulated, so that it is possible to suppress the influence of heat dissipation from the main component due to the separation distance being too small, and imaging due to the separation distance being too large. The height of the device in the optical axis direction can be suppressed.
[0011] 上記構成において、前記位置決め規制部は、前記光学ユニットに一体に成形され ている、構成を採用できる。  [0011] In the above configuration, the positioning restricting portion may be formed integrally with the optical unit.
このような構成により、位置決め規制部は、光学ユニットと一体に成形されるので、 別途位置決め規制部を取り付ける必要はなぐ製造コストの削減を図ることができる。  With such a configuration, the positioning restricting portion is formed integrally with the optical unit, so that it is not necessary to separately attach the positioning restricting portion, and the manufacturing cost can be reduced.
[0012] 上記構成にお ヽて、前記位置決め規制部は、被接続装置と前記サブ基板とを電気 的に接続する第 2端子部を備えている、構成を採用できる。  [0012] In the above configuration, the positioning restriction portion may include a second terminal portion that electrically connects the connected device and the sub-board.
このような構成により、サブ基板を位置決めすると共に、サブ基板と被接続装置とを 電通接続することができる。  With such a configuration, the sub-board can be positioned and the sub-board and the connected device can be electrically connected.
[0013] 上記構成において、前記撮像装置が搭載される外部装置には、該撮像装置を位 置決めする位置決め部が形成され、前記撮像装置には、位置決め部に係合する位 置決め係合部が形成され、前記位置決め係合部は、前記メイン基板とサブ基板とを 位置決めすると共に前記サブ基板と前記メイン部品との離間距離を規制する前記位 置決め部に係合する、構成を採用できる。  [0013] In the configuration described above, a positioning unit that positions the imaging device is formed in the external device on which the imaging device is mounted, and the positioning engagement that engages the positioning unit is formed in the imaging device. The positioning engagement portion is configured to position the main board and the sub board and to engage with the positioning portion that regulates a separation distance between the sub board and the main component. it can.
[0014] このような構成により、外部装置に形成された位置決め部に係合する位置決め係合 部を備えているので、撮像装置を外部装置に容易に搭載することができる。 [0014] With such a configuration, positioning engagement that engages with a positioning portion formed in the external device The image pickup apparatus can be easily mounted on the external device.
また、一の部材で、メイン基板とサブ基板とを位置決めすると共にサブ基板とメイン 部品との離間距離を規制するので、撮像装置の部品数を減らすことができ、撮像装 置の製造工程を簡略ィ匕することができる。これにより、撮像装置を低コストで製造でき る。  In addition, since the main board and the sub board are positioned with one member and the distance between the sub board and the main component is regulated, the number of parts of the imaging device can be reduced and the manufacturing process of the imaging device is simplified. You can do it. Thereby, the imaging device can be manufactured at low cost.
また、一の部材により、メイン基板とサブ基板とを位置決めすると共にサブ基板とメ イン部品との離間距離を規制するので、複数の部材により位置決めする場合と比較 し、寸法公差による位置精度の低下を最小限に抑えることができる。  In addition, the positioning of the main board and the sub board is controlled by a single member and the distance between the sub board and the main part is regulated, so that the positional accuracy is reduced due to dimensional tolerances compared to the case of positioning by multiple members. Can be minimized.
発明の効果  The invention's effect
[0015] 本発明によれば、小型化の撮像装置を提供することができる。  [0015] According to the present invention, it is possible to provide a downsized imaging apparatus.
図面の簡単な説明  Brief Description of Drawings
[0016] [図 1]図 1 (a)、（b)は実施例 1に係る撮像装置の構成を示す図である。 1 is a diagram illustrating a configuration of an imaging apparatus according to a first embodiment.
[図 2]図 2は、サブ基板を位置決めする前の撮像装置の側面図である。  FIG. 2 is a side view of the imaging device before positioning the sub-board.
[図 3]図 3 (a)、（b)は、実施例 2に係る撮像装置の構成を示す図である。  FIGS. 3A and 3B are diagrams illustrating a configuration of an imaging apparatus according to a second embodiment.
[図 4]図 4 (a)、（b)は、実施例 3に係る撮像装置の構成を示す図である。  FIGS. 4A and 4B are diagrams illustrating a configuration of an imaging apparatus according to a third embodiment.
[図 5]図 5 (a)、（b)は、実施例 4に係る撮像装置の構成を示す図である。  FIGS. 5A and 5B are diagrams illustrating a configuration of an imaging apparatus according to Embodiment 4. FIG.
[図 6]図 6 (a)、 (b)は、位置決めピン周辺の構成を示した拡大図である。  [FIG. 6] FIGS. 6 (a) and 6 (b) are enlarged views showing a configuration around a positioning pin.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0017] 以下、図面を参照して本発明に係る複数の実施例を説明する。 Hereinafter, a plurality of embodiments according to the present invention will be described with reference to the drawings.
実施例 1  Example 1
[0018] 図 1 (a)、 (b)を参照しながら本実施例の撮像装置の構成を説明する。図 1 (a)、 (b) は、実施例 1に係る撮像装置 1の構成を示す図である。図 1 (a)は、撮像装置 1の正 面図、図 1 (b)は、撮像装置 1の側面図である。  [0018] The configuration of the imaging apparatus according to the present embodiment will be described with reference to FIGS. 1 (a) and 1 (b). 1A and 1B are diagrams illustrating the configuration of the imaging apparatus 1 according to the first embodiment. FIG. 1 (a) is a front view of the imaging apparatus 1, and FIG. 1 (b) is a side view of the imaging apparatus 1.
[0019] 撮像装置 1は、光学ユニット 10、ボイスコイルモータ 20、撮像素子 30、システム IC ( メイン部品） 40、メイン基板 50、電子部品（サブ部品） 60、サブ基板 70、 FPC (Flexibl e Printed Circuit) (可撓性基板） 55、スぺーサ 80、コネクタ 90などから構成される。 本実施例では、メイン基板 50とサブ基板 70は、硬質基材からなる多層のリジット配線 基板となっており、メイン基板 50とサブ基板 70とは内層を有し、内層の一部が FPC5 5で構成されて、メイン基板 50とサブ基板 70とが FPC55によって電気的に接続され ている。これによりメイン基板 50とサブ基板 70と FPC55とが一体となったリジットフレ キ基板となっている。 [0019] The imaging apparatus 1 includes an optical unit 10, a voice coil motor 20, an image sensor 30, a system IC (main component) 40, a main substrate 50, an electronic component (sub component) 60, a sub substrate 70, and FPC (Flexible Printed). Circuit) (flexible substrate) 55, spacer 80, connector 90, etc. In the present embodiment, the main board 50 and the sub board 70 are formed of a multilayer rigid wiring made of a hard base material. The main board 50 and the sub board 70 have an inner layer, a part of the inner layer is composed of FPC55, and the main board 50 and the sub board 70 are electrically connected by the FPC55. . As a result, the main board 50, the sub board 70, and the FPC 55 are integrated into a rigid flexible board.
尚、図 1 (a)、（b)には省略してある力 ボイスコイルモータ 20に形成されたレンズ鏡 筒用開口部 21には、レンズを保持したレンズ鏡筒が配置される。  A lens barrel holding a lens is disposed in the lens barrel opening 21 formed in the voice coil motor 20 which is omitted in FIGS. 1 (a) and 1 (b).
[0020] 光学ユニット 10は、ボイスコイルモータ 20、撮像素子 30、レンズ鏡筒などを含む。 The optical unit 10 includes a voice coil motor 20, an imaging device 30, a lens barrel, and the like.
ボイスコイルモータ 20は、レンズ鏡筒に保持されたレンズに対して、光軸方向に移 動させるための駆動力を与える。レンズは、撮像素子 30へ導光する。  The voice coil motor 20 gives a driving force for moving the lens held in the lens barrel in the optical axis direction. The lens guides light to the image sensor 30.
撮像素子 30は、 CCD(Charge Coupled Devices)型イメージセンサや COMS(Co mplementary Metal-Oxide Semiconductor)型イメージセンサからなる。撮像素子 30 は、メイン基板 50に取り付けられており、レンズを介して受光する。  The image sensor 30 is composed of a CCD (Charge Coupled Devices) type image sensor or a COMS (Complementary Metal-Oxide Semiconductor) type image sensor. The image sensor 30 is attached to the main board 50 and receives light through a lens.
[0021] メイン基板 50は、紙フエノールやガラスエポキシ系などの基板であり、長方形に形 成されている。また、メイン基板 50には、ボイスコイルモータ 20とシステム IC40とが隣 接して同一面上に実装されて 、る。 [0021] The main board 50 is a board such as paper phenol or glass epoxy, and is formed in a rectangular shape. On the main board 50, the voice coil motor 20 and the system IC 40 are adjacently mounted on the same surface.
システム IC40は、画像処理回路を有する DSP (Digital Signal Processor)を少なく とも含み、撮像素子 30を制御するための制御回路や、光学ユニット 10により得られる 画像信号に画像処理を施す画像信号処理回路などを構成するものである。システム IC40は、光学ユニット 10についで占有面積の大きい部品である。  The system IC 40 includes at least a DSP (Digital Signal Processor) having an image processing circuit, a control circuit for controlling the image sensor 30, an image signal processing circuit for performing image processing on an image signal obtained by the optical unit 10, and the like. It constitutes. The system IC 40 is a component that occupies a large area after the optical unit 10.
尚、撮像素子 30は、メイン基板 50に実装されており、ボイスコイルモータ 20に形成 されたレンズ鏡筒用開口部 21の中心と、撮像素子 30の撮像領域の中心とが重なる ように設けられている。メイン基板 50は、占有面積の大きい光学ユニット 10 (撮像素 子 30を含む）と、同じく占有面積が大きいシステム IC40とのみが設けられる大きさと なっており、他の電子部品 60は、サブ基板 70に設けられている。この構成により、撮 像装置 1は薄型かつ小型となる。  The image sensor 30 is mounted on the main board 50, and is provided so that the center of the lens barrel opening 21 formed in the voice coil motor 20 and the center of the imaging area of the image sensor 30 overlap. ing. The main board 50 is sized so that only the optical unit 10 (including the imaging element 30) with a large occupation area and the system IC 40 with a large occupation area are provided, and the other electronic components 60 are sub boards 70. Is provided. With this configuration, the imaging device 1 is thin and small.
[0022] FPC55は、ポリイミドなどのフィルム材料により形成されており、可撓性を有している 。また、 FPC55は、メイン基板 50とサブ基板 70とを電気的に接続する。 [0022] The FPC 55 is formed of a film material such as polyimide and has flexibility. The FPC 55 electrically connects the main board 50 and the sub board 70.
電子部品 60は、サブ基板 70に実装されている。詳細は以下に述べる。 [0023] 図 1 (b)に示すように、サブ基板 70は、メイン基板 50よりも面積が小さく形成されて V、る。占有面積の大き!/、光学ユニット 10 (含む撮像素子 30)及びシステム IC40をメイ ン基板 50に設けるため、サブ基板 70はメイン基板 50より小さく形成できる。サブ基板 70は、 FPC55を介してメイン基板 50と接続されている。また、スぺーサ 80 (位置決め 規制部）は、光軸方向に延伸して円柱状に形成されており、スぺーサ 80の下端面 (メ イン基板 50側の端面）とシステム IC40の上面の四隅とが固定されており、スぺーサ 8 0の上端面 (被写体側の面）とサブ基板 70とが固定される。これにより、サブ基板 70 は、システム IC40と離間して対向配置される。また、サブ基板 70は、メイン基板 50と 平行に配置される。また、 FPC55は、曲げられた状態で保持される。 The electronic component 60 is mounted on the sub board 70. Details are described below. As shown in FIG. 1 (b), the sub board 70 is formed to have a smaller area than the main board 50, and is V. Because the optical unit 10 (including the image sensor 30) and the system IC 40 are provided on the main board 50, the sub board 70 can be formed smaller than the main board 50. The sub board 70 is connected to the main board 50 via the FPC 55. Spacer 80 (positioning restricting portion) is formed in a columnar shape extending in the optical axis direction, and is formed between the lower end surface of spacer 80 (the end surface on the main board 50 side) and the upper surface of system IC 40. The four corners are fixed, and the upper end surface (the subject side surface) of the spacer 80 and the sub board 70 are fixed. As a result, the sub-board 70 is disposed opposite to and separated from the system IC 40. The sub board 70 is arranged in parallel with the main board 50. The FPC 55 is held in a bent state.
[0024] また、システム IC40に対向するサブ基板 70の面には、複数の電子部品 60が実装 されている。スぺーサ 80は、電子部品 60よりも光軸方向の長さが長く形成されており 、電子部品 60がシステム IC40に当接しない位置にサブ基板 70を配置する。従って 、サブ基板 70は、電子部品 60がシステム IC40と当接しない位置において、システム IC40と離間して対向配置される。  In addition, a plurality of electronic components 60 are mounted on the surface of the sub-board 70 facing the system IC 40. The spacer 80 is formed to have a longer length in the optical axis direction than the electronic component 60, and the sub board 70 is disposed at a position where the electronic component 60 does not contact the system IC 40. Accordingly, the sub-board 70 is disposed opposite to the system IC 40 at a position where the electronic component 60 does not contact the system IC 40.
[0025] また、サブ基板 70は、メイン基板 50の長手方向及び幅方向の幅内に配置される。  Further, the sub board 70 is disposed within the width of the main board 50 in the longitudinal direction and the width direction.
サブ基板 70は、少なくともメイン基板 50の長手方向の幅内に収まるように配置されて いればよい。  The sub board 70 may be arranged so as to be at least within the width of the main board 50 in the longitudinal direction.
[0026] 以上のように、 FPC55が曲げられた状態で、サブ基板 70は、メイン基板 50の長手 方向の幅内にシステム IC40と離間して対向配置される。  As described above, in a state where the FPC 55 is bent, the sub board 70 is disposed so as to be opposed to the system IC 40 within the width of the main board 50 in the longitudinal direction.
このような構成により、メイン基板 50とサブ基板 70とを FPC55を介して接続すること により、サブ基板 70を、長手方向の幅内にシステム IC40と対向して配置することが できる。  With such a configuration, by connecting the main board 50 and the sub board 70 via the FPC 55, the sub board 70 can be arranged to face the system IC 40 within the width in the longitudinal direction.
上記のようにサブ基板 70が配置されることにより、光学ユニット 10とシステム IC40と の光軸方向の高低差によって生じる、システム IC40の上部付近 (光軸方向の被写体 側）のデッドスペースを解消することができる。  By arranging the sub-board 70 as described above, the dead space near the top of the system IC 40 (the subject side in the optical axis direction) caused by the height difference in the optical axis direction between the optical unit 10 and the system IC 40 is eliminated. be able to.
[0027] また、従来メイン基板 50に実装されていた電子部品 60をサブ基板 70に搭載するこ とにより、メイン基板 50の面積を小さくすることができる。これにより、撮像装置 1を小 型化することができる。また、小型化されることにより、携帯電話などの外部装置への 搭載位置の自由度が向上する。 In addition, by mounting the electronic component 60 that has been mounted on the main board 50 on the sub board 70, the area of the main board 50 can be reduced. Thereby, the imaging device 1 can be reduced in size. In addition, by downsizing, external devices such as mobile phones The degree of freedom of the mounting position is improved.
また、サブ基板 70はシステム IC40と離間して配置されるので、システム IC40から の放熱の影響を抑制することができる。  Further, since the sub-board 70 is disposed apart from the system IC 40, the influence of heat radiation from the system IC 40 can be suppressed.
[0028] また、図 1 (b)に示すように、サブ基板 70は、光学ユニット 10 (又はボイスコイルモー タ 20)の光軸方向の高さよりも低い位置でサブ基板 70及び電子部品 60が保持され るように配置される。換言すると、サブ基板 70は、ボイスコイルモータ 20の上端面 (光 軸方向の被写体側の面)よりも、メイン基板 50側に近い位置で、サブ基板 70及び電 子部品 60が保持されるように配置される。  In addition, as shown in FIG. 1 (b), the sub board 70 has the sub board 70 and the electronic component 60 at a position lower than the height in the optical axis direction of the optical unit 10 (or the voice coil motor 20). Arranged to be retained. In other words, the sub board 70 holds the sub board 70 and the electronic component 60 at a position closer to the main board 50 side than the upper end surface of the voice coil motor 20 (the surface on the subject side in the optical axis direction). Placed in.
このような構成により、撮像装置 1の光軸方向の高さを光学ユニット 10の高さ内に抑 えることができるので、撮像装置 1の小型化を図ることができる。  With such a configuration, the height of the imaging device 1 in the optical axis direction can be suppressed within the height of the optical unit 10, and thus the imaging device 1 can be reduced in size.
[0029] サブ基板 70は、電子部品 60は、システム IC40と対向する面に実装されている。サ ブ基板 70の電子部品が実装された面の裏面に、サブ基板 70と外部装置と電気的に 接続するためのコネクタ (端子部） 90が設けられている。このコネクタ 90には、サブ基 板 70と外部装置とを電気的に接続する FPC100が取り付けられている。これにより、 撮像装置 1が搭載される携帯電話などの外部装置の基板とサブ基板 70とを電気的 に接続することができる。  [0029] In the sub-board 70, the electronic component 60 is mounted on a surface facing the system IC 40. A connector (terminal portion) 90 for electrically connecting the sub-board 70 and an external device is provided on the back surface of the surface on which the electronic components of the sub-board 70 are mounted. An FPC 100 that electrically connects the sub board 70 and an external device is attached to the connector 90. Thereby, the substrate of an external device such as a mobile phone on which the imaging device 1 is mounted and the sub-substrate 70 can be electrically connected.
[0030] コネクタ 90は、光学ユニット 10 (含む撮像素子 30)及びシステム IC40についで占 有面積が大きい部品である。このシステム IC40よりも小さいコネクタ 90や電子部品 6 0をサブ基板 70に設けるため、撮像装置 1は、薄型且つ小型になる。なぜなら、薄型 を目指してメイン基板 50の片面に部品を実装しているので、メイン基板 50にこれ以 上の電子部品を設けるとそのスペース分メイン基板 50が大きくなつてしまい、撮像装 置 1全体の小型化にはならない。また、メイン基板 50を更に小さくしょうとしてシステム IC40をサブ基板 70に設けた場合は、光学ユニット 10の高さ内にサブ基板 70を配置 させると、メイン基板 50の長手方向の幅力もサブ基板 70が出てしまい、撮像装置 1の 小型化にはならない。また、システム IC40やサブ基板 70をメイン基板 50と光軸方向 に重なる位置に設ければ平面的には更に小型化になる力 薄型化にはならない。こ のため、薄型且つ小型化にするには、光学ユニット 10が設けられるメイン基板 50に 占有面積が大き 、部品（本実施例ではシステム IC40)のみを設けるのがよ 、。 また、コネクタ 90は、サブ基板 70と外部装置とを電気的に接続するため、撮像装置 1を外部装置に容易に搭載することができる。 The connector 90 is a component having a large occupied area following the optical unit 10 (including the imaging device 30) and the system IC 40. Since the connector 90 and the electronic component 60 smaller than the system IC 40 are provided on the sub board 70, the imaging device 1 is thin and small. This is because components are mounted on one side of the main board 50 in order to reduce the thickness of the main board 50. If more electronic components are provided on the main board 50, the main board 50 becomes larger by the space, and the entire imaging device 1 It will not be downsized. Further, when the system IC 40 is provided on the sub-board 70 in order to further reduce the main board 50, if the sub-board 70 is arranged within the height of the optical unit 10, the width force in the longitudinal direction of the main board 50 is also reduced. Does not reduce the size of the imaging device 1. Further, if the system IC 40 and the sub board 70 are provided at a position overlapping the main board 50 in the optical axis direction, the force for further miniaturization in the plan view is not reduced. For this reason, in order to reduce the thickness and size, the main board 50 on which the optical unit 10 is provided has a large occupation area, and only the components (system IC 40 in this embodiment) are provided. Further, since the connector 90 electrically connects the sub board 70 and the external device, the imaging device 1 can be easily mounted on the external device.
即ち、撮像装置 1の製造後、携帯電話などの外部装置に搭載する際に、外部装置 の基板に取り付けられた FPC100をコネクタ 90と接続することにより、容易に撮像装 置 1と外部装置の基板とを電気的に接続することができる。  That is, when the imaging device 1 is manufactured and mounted on an external device such as a mobile phone, the FPC 100 attached to the board of the external device is connected to the connector 90 so that the imaging device 1 and the board of the external device can be easily connected. Can be electrically connected.
[0031] また、スぺーサ 80は、サブ基板 70とシステム IC40との離間距離を規制してサブ基 板 70を位置決めする。このような構成により、サブ基板 70とシステム IC40との離間距 離が規制されるので、離間距離が小さすぎることに伴うシステム IC40からの放熱の影 響を抑制できると共に、離間距離が大きすぎることに伴う撮像装置 1の光軸方向の高 さを抑えることができる。  In addition, the spacer 80 positions the sub board 70 by regulating the distance between the sub board 70 and the system IC 40. With such a configuration, the separation distance between the sub board 70 and the system IC 40 is regulated, so that the influence of heat radiation from the system IC 40 when the separation distance is too small can be suppressed, and the separation distance is too large. Accordingly, the height in the optical axis direction of the imaging device 1 can be suppressed.
[0032] 次に、スぺーサ 80の取り付け方法について説明する。  Next, a method for attaching the spacer 80 will be described.
予め可撓性基板を介して非撓性 (硬質)基板同士が接続されて!ヽるリジットフレキ基 板を用い、メイン基板 50に、撮像素子 30、ボイスコイルモータ 20、システム IC40を実 装した後に、スぺーサ 80が、電子部品 60と共にサブ基板 70に実装される。詳細に は、サブ基板 70上に電子部品 60を搭載し、これらとサブ基板 70上の配線パターンと を接続する。ここで同時に、スぺーサ 80をサブ基板 70に実装する。スぺーサ 80は、 サブ基板 70上に搭載されている電子部品 60と同様の方法で実装する。例えば、電 子部品 60をサブ基板 70に実装する際に用いられる導電性接着剤を用いる。  Using a rigid flexible board that is connected to each other in advance via flexible boards, the image sensor 30, voice coil motor 20, and system IC 40 are mounted on the main board 50. Later, the spacer 80 is mounted on the sub-board 70 together with the electronic component 60. More specifically, the electronic component 60 is mounted on the sub-board 70 and connected to the wiring pattern on the sub-board 70. At the same time, the spacer 80 is mounted on the sub board 70. The spacer 80 is mounted in the same manner as the electronic component 60 mounted on the sub board 70. For example, a conductive adhesive used when mounting the electronic component 60 on the sub board 70 is used.
[0033] 図 2は、サブ基板 70を位置決めする前の撮像装置 1の側面図である。図 2に示すよ うに、サブ基板 70の電子部品 60が実装される面と同一面上に、スぺーサ 80が実装 される。  FIG. 2 is a side view of the imaging apparatus 1 before positioning the sub board 70. As shown in FIG. 2, the spacer 80 is mounted on the same surface as the surface on which the electronic component 60 of the sub-board 70 is mounted.
次に、サブ基板 70を位置決めするために、スぺーサ 80の他端面に接着剤を塗布 し、 FPC55を曲げた状態にして、スぺーサ 80の他端面を、メイン基板 50に実装され たシステム IC40の上面に固定する。このようにして、スぺーサ 80は、電子部品 60と 共にサブ基板 70に実装される。これにより、撮像装置 1の製造工程を簡略ィ匕すること ができる。  Next, in order to position the sub board 70, an adhesive was applied to the other end face of the spacer 80, and the FPC 55 was bent, and the other end face of the spacer 80 was mounted on the main board 50. Secure to the top surface of the system IC40. In this way, the spacer 80 is mounted on the sub board 70 together with the electronic component 60. Thereby, the manufacturing process of the imaging device 1 can be simplified.
実施例 2  Example 2
[0034] 次に、図 3 (a)、 (b)を参照して、実施例 2に係る撮像装置 laについて説明する。図 3 (a) , (b)は、実施例 2に係る撮像装置 laの構成を示す図である。図 3 (a)は、撮像 装置 laの正面図、図 3 (b)は、撮像装置 laの側面図である。この撮像装置 laの基本 的な構成は、撮像装置 1と同様であるため、同一の部分には同一の符号を付与する ことにより説明を省略する。 Next, an imaging device la according to the second embodiment will be described with reference to FIGS. 3 (a) and 3 (b). Figure 3 (a) and (b) are diagrams illustrating the configuration of the imaging apparatus la according to the second embodiment. FIG. 3 (a) is a front view of the imaging device la, and FIG. 3 (b) is a side view of the imaging device la. Since the basic configuration of the image pickup apparatus la is the same as that of the image pickup apparatus 1, the same portions are denoted by the same reference numerals and the description thereof is omitted.
[0035] 図 3 (a)、 (b)に示すように、ボイスコイルモータ 20の側面 20aの一部には、突片（位 置決め規制部） 22a〜22cが形成されている。突片 22a〜22cは、システム IC40と隣 り合うボイスコイルモータ 20の側面 20aに形成されている。突片 22a〜22cは、光軸 方向と直行方向に延伸しており、メイン基板 50と平行に板状に形成されている。また 、突片 22a〜22cは、システム IC40の上面よりも被写体側の位置に形成されている。 また、突片 22aは、突片 22b、 22cよりも被写体側に形成されている。 As shown in FIGS. 3 (a) and 3 (b), projecting pieces (positioning restricting portions) 22a to 22c are formed on a part of the side surface 20a of the voice coil motor 20. The projecting pieces 22a to 22c are formed on the side surface 20a of the voice coil motor 20 adjacent to the system IC 40. The projecting pieces 22 a to 22 c extend in the direction perpendicular to the optical axis direction and are formed in a plate shape parallel to the main substrate 50. Further, the projecting pieces 22a to 22c are formed at positions closer to the subject side than the upper surface of the system IC 40. Further, the projecting piece 22a is formed closer to the subject than the projecting pieces 22b and 22c.
突片 22b、 22cとは光軸方向の高さが同一の位置に形成されている。突片 22aと、 突片 22b、 22cとの間に、サブ基板 70が挟持されて、サブ基板 70とシステム IC40と の離間距離を規制してサブ基板 70は位置決めされる。  The protrusions 22b and 22c are formed at the same height in the optical axis direction. The sub board 70 is sandwiched between the projecting piece 22a and the projecting pieces 22b and 22c, and the sub board 70 is positioned by regulating the separation distance between the sub board 70 and the system IC 40.
[0036] この突片 22a〜22cは、ボイスコイルモータ 20と一体に形成されている。別途位置 決め規制部を取り付ける必要はなぐ製造コストの削減を図ることができる。 The projecting pieces 22 a to 22 c are formed integrally with the voice coil motor 20. Manufacturing costs can be reduced without the need for a separate positioning restriction.
また、サブ基板 70は、ボイスコイルモータ 20の側面 20aに当接して位置決めされる 。このため、サブ基板 70は、側面 20aにより、側面 20aの垂直方向での位置決めがな される。これにより、実施例 1と同様にサブ基板 70を少なくともメイン基板 50の長手方 向の幅内に収まるように容易に配置することができる。  The sub board 70 is positioned in contact with the side surface 20a of the voice coil motor 20. For this reason, the sub board 70 is positioned in the vertical direction of the side face 20a by the side face 20a. As a result, similarly to the first embodiment, the sub-board 70 can be easily arranged so as to be at least within the width of the main board 50 in the longitudinal direction.
実施例 3  Example 3
[0037] 次に、図 4 (a)、（b)を参照して、実施例 3に係る撮像装置 lbについて説明する。図 4 (a) , (b)は、実施例 3に係る撮像装置 lbの構成を示す図である。図 4 (a)は、撮像 装置 lbの正面図、図 4 (b)は、撮像装置 lbの側面図である。この撮像装置 lbの基本 的な構成は、撮像装置 1と同様であるため、同一の部分には同一の符号を付与する ことにより説明を省略する。  Next, an imaging device lb according to Example 3 will be described with reference to FIGS. 4 (a) and 4 (b). FIGS. 4A and 4B are diagrams illustrating the configuration of the imaging device lb according to the third embodiment. 4 (a) is a front view of the image pickup device lb, and FIG. 4 (b) is a side view of the image pickup device lb. Since the basic configuration of the image pickup apparatus lb is the same as that of the image pickup apparatus 1, the same portions are denoted by the same reference numerals and description thereof is omitted.
[0038] 図 4 (a)、 (b)〖こ示すように、ボイスコイルモータ 20の側面 20aの一部に、位置決め 規制部である突片 22b、 22cと、ボイスコイルモータ 20へ駆動電力等を伝える第 2端 子部 23が形成されている。第 2端子部 23は、突片 22b、 22cと平行に形成されてい る。また、第 2端子部 23は、突片 22b、 22cよりも被写体側に形成されている。第 2端 子部 23と、突片 22b、 22cとの間に、サブ基板 70が挟持されて、サブ基板 70とシス テム IC40との離間距離を規制してサブ基板 70は位置決めされる。 [0038] As shown in FIGS. 4 (a) and (b), the projecting pieces 22b and 22c, which are positioning regulating portions, are formed on a part of the side surface 20a of the voice coil motor 20, and the drive power to the voice coil motor 20 A second terminal portion 23 is formed to convey the above. The second terminal portion 23 is formed in parallel with the projecting pieces 22b and 22c. The The second terminal portion 23 is formed closer to the subject than the protrusions 22b and 22c. The sub board 70 is sandwiched between the second terminal portion 23 and the projecting pieces 22b and 22c, and the sub board 70 is positioned by regulating the separation distance between the sub board 70 and the system IC 40.
[0039] また、第 2端子部 23とサブ基板 70とは、半田 24により電気的に接続されている。こ れにより、サブ基板 70は、第 2端子部 23と、突片 22b、 22cとの間に、確実に位置決 めすることができる。 Further, the second terminal portion 23 and the sub board 70 are electrically connected by solder 24. Thereby, the sub board 70 can be reliably positioned between the second terminal portion 23 and the projecting pieces 22b and 22c.
また、第 2端子部 23は、ボイスコイルモータ 20とサブ基板 70と電気的に接続する。 このように、第 2端子部 23は、非接続装置としてのボイスコイルモータ 20とサブ基板 7 0とを電気的に接続する。サブ基板 70を位置決めすると共に、サブ基板 70とボイスコ ィルモータ 20とを電通接続することができる。  Further, the second terminal portion 23 is electrically connected to the voice coil motor 20 and the sub board 70. As described above, the second terminal portion 23 electrically connects the voice coil motor 20 as the non-connecting device and the sub board 70. In addition to positioning the sub board 70, the sub board 70 and the voice coil motor 20 can be electrically connected.
実施例 4  Example 4
[0040] 次に、図 5 (a)、 (b)を参照して、実施例 4に係る撮像装置 lcについて説明する。図 5 (a) , (b)は、実施例 4に係る撮像装置 lcの構成を示す図である。図 5 (a)は、撮像 装置 lcの正面図、図 5 (b)は、撮像装置 lcの側面図である。この撮像装置 lcの基本 的な構成は、撮像装置 1と同様であるため、同一の部分には同一の符号を付与する ことにより説明を省略する。  Next, an imaging device lc according to Example 4 will be described with reference to FIGS. FIGS. 5A and 5B are diagrams illustrating the configuration of the imaging device lc according to the fourth embodiment. FIG. 5 (a) is a front view of the imaging device lc, and FIG. 5 (b) is a side view of the imaging device lc. Since the basic configuration of the image pickup apparatus lc is the same as that of the image pickup apparatus 1, the same portions are denoted by the same reference numerals and description thereof is omitted.
[0041] 図 5 (a)、（b)に示すように、撮像装置 lcは、携帯電話などの外部装置の筐体 101 に搭載されている。筐体 101の内壁面には、光軸方向の被写体側に延伸して位置 決めピン (位置決め部） 102a〜102cが形成されて 、る。  [0041] As shown in FIGS. 5A and 5B, the imaging device lc is mounted on a housing 101 of an external device such as a mobile phone. Positioning pins (positioning portions) 102a to 102c are formed on the inner wall surface of the casing 101 so as to extend toward the subject side in the optical axis direction.
サブ基板 70aの側面には、位置決めピン 102a〜102cの端部と係合する切欠き凹 部 (位置決め係合部） 72a〜72cが形成されている。切欠き凹部 72a〜72cは、位置 決めピン 102a〜102cと夫々対応する位置に形成されている。  Notched recesses (positioning engagement portions) 72a to 72c that engage with the end portions of the positioning pins 102a to 102c are formed on the side surface of the sub-board 70a. The notch recesses 72a to 72c are formed at positions corresponding to the positioning pins 102a to 102c, respectively.
これにより位置決めピン 102a〜102cはサブ基板 70aを位置決めする。また、位置 決めピン 102a〜102cは、電子部品 60がシステム IC40に当接しないように位置決 めする。  Accordingly, the positioning pins 102a to 102c position the sub board 70a. Further, the positioning pins 102a to 102c are positioned so that the electronic component 60 does not contact the system IC 40.
[0042] 図 6 (a)、 (b)は位置決めピン 102a周辺の構成を示した拡大図である。図 6 (a)は、 位置決めピン 102aと切欠き凹部 72aとの係合を示した図である。  6 (a) and 6 (b) are enlarged views showing the configuration around the positioning pin 102a. FIG. 6 (a) is a diagram showing the engagement between the positioning pin 102a and the notch recess 72a.
位置決めピン 102aの先端には、係合ピン 1021aが光軸方向の被写体側に突出し て形成されている。また、係合ピン 1021aは、位置決めピン 102aの胴体部よりも細く 形成されている。この係合ピン 1021aが切欠き凹部 72aと係合する。尚、切欠き凹部 72b、 72c、位置決めピン 102b、 102cについても、上記構成と同様である。 At the tip of the positioning pin 102a, the engaging pin 1021a protrudes toward the subject side in the optical axis direction. Is formed. Further, the engaging pin 1021a is formed thinner than the body portion of the positioning pin 102a. The engagement pin 1021a engages with the notch recess 72a. The notch recesses 72b and 72c and the positioning pins 102b and 102c have the same configuration as described above.
[0043] また、図 5 (a)、 (b)には示されていないが、メイン基板 50aの側面には、位置決めピ ン 102a〜102cの側面と係合する切欠き凹部 52a〜52cが形成されている。切欠き 凹部 52a〜52cは、位置決めピン 102a〜102cと夫々対応する位置に形成されてい る。 [0043] Although not shown in Figs. 5 (a) and (b), notches 52a to 52c that engage with the side surfaces of the positioning pins 102a to 102c are formed on the side surfaces of the main board 50a. Has been. The notches 52a to 52c are formed at positions corresponding to the positioning pins 102a to 102c, respectively.
これにより位置決めピン 102a〜102cはメイン基板 50aを位置決めする。  Thereby, the positioning pins 102a to 102c position the main board 50a.
[0044] 図 6 (b)は、位置決めピン 102aと切欠き凹部 52aとの係合を示した図である。位置 決めピン 102aの胴体部の側面と切欠き凹部 52aとが係合する。尚、切欠き凹部 52b 、 52c、位置決めピン 102b、 102cについても、上記構成と同様である。 FIG. 6 (b) is a diagram showing the engagement between the positioning pin 102a and the notch recess 52a. The side surface of the body portion of the positioning pin 102a engages with the notch recess 52a. The notch recesses 52b and 52c and the positioning pins 102b and 102c have the same configuration as described above.
これにより、メイン基板 50aは光軸の直行方向に対して位置決めされる。  Thereby, the main substrate 50a is positioned with respect to the orthogonal direction of the optical axis.
[0045] このように、外部装置に形成された位置決めピン 102a〜102cに係合する切欠き凹 部 52a〜52c、 72a〜72cを有しているので、撮像装置 lcを外部装置に容易に搭載 することができる。 [0045] As described above, since the notched recesses 52a to 52c and 72a to 72c that engage with the positioning pins 102a to 102c formed in the external device are provided, the imaging device lc is easily mounted on the external device. can do.
[0046] また、位置決めピン 102a〜102cは、光軸方向の長さによって、サブ基板 70aとシ ステム IC40との離間距離を規制する。  In addition, the positioning pins 102a to 102c regulate the separation distance between the sub board 70a and the system IC 40 according to the length in the optical axis direction.
[0047] このように、一の部材で、メイン基板 50aとサブ基板 70aとを位置決めすると共にサ ブ基板 70aとシステム IC40との離間距離を規制するので、撮像装置の部品数を減ら すことができ、撮像装置 lcの製造工程を簡略ィ匕することができる。これにより、撮像装 置 lcを低コストで製造できる。 [0047] As described above, since the main board 50a and the sub board 70a are positioned by one member and the distance between the sub board 70a and the system IC 40 is regulated, the number of parts of the imaging device can be reduced. In addition, the manufacturing process of the imaging device lc can be simplified. Thereby, the imaging device lc can be manufactured at low cost.
[0048] また、一の部材により、メイン基板 50aとサブ基板 70aとを位置決めすると共にサブ 基板 70aとシステム IC40との離間距離を規制するので、複数の部材により位置決め する場合と比較し、寸法公差による位置精度の低下を最小限に抑えることができる。 [0048] Further, since the main board 50a and the sub board 70a are positioned by one member and the distance between the sub board 70a and the system IC 40 is regulated, the dimensional tolerance is compared with the case of positioning by a plurality of members. It is possible to minimize the deterioration of the position accuracy due to.
[0049] 以上本発明の好ましい実施形態について詳述したが、本発明は係る特定の実施 形態に限定されるものではなぐ特許請求の範囲に記載された本発明の要旨の範囲 内において、変形 '変更が可能である。 [0049] While the preferred embodiment of the present invention has been described in detail above, the present invention is not limited to the specific embodiment, and modifications can be made within the scope of the gist of the present invention described in the claims. It can be changed.
例えば、上記実施例において、光学ユニット 10は、レンズ鏡筒の周囲にボイスコィ ルモータ 20が配置される構成となっている力 このような構成に限定されず、レンズ 鏡筒内にレンズを光軸方向に移動させるためのァクチユエータが備えられて 、るもの であってもよい。この場合、レンズ鏡筒の外周部に、位置決め規制部が形成される。 また、本実施例ではメイン基板 50にシステム IC40を設けた力 システム IC40に限 るものではなぐメイン基板 50には、サブ基板 70に設けられる電子部品 60よりも占有 面積が大きいものであればよい。また、システム IC40に換えて画像処理回路を有す る DSP又は ISP (Image Signal Processor)を設けてもよい。また、ボイスコイルモータ 20に限らず他のモータを使ってレンズを駆動するようにしてもよい。また、レンズ駆動 装置が付いてない単焦点タイプの撮像装置であってもよい。また、 FPC100が差し 込まれるコネクタ 90ではなぐはんだ付けされる端子部であってもよ!/、。 For example, in the above embodiment, the optical unit 10 has a voice coil around the lens barrel. The force in which the motor 20 is arranged is not limited to such a configuration, and an actuator for moving the lens in the optical axis direction may be provided in the lens barrel. In this case, a positioning restricting portion is formed on the outer peripheral portion of the lens barrel. Further, in this embodiment, the main board 50 is not limited to the system IC 40 provided with the system IC 40 on the main board 50. The main board 50 may have any larger area than the electronic component 60 provided on the sub board 70. . Further, instead of the system IC 40, a DSP or an ISP (Image Signal Processor) having an image processing circuit may be provided. Further, the lens may be driven not only by the voice coil motor 20 but also by using another motor. Further, it may be a single focus type imaging device without a lens driving device. Also, it can be the terminal part to be soldered in the connector 90 into which the FPC100 is inserted!
また、上記実施例において、電子部品 60は、サブ基板 70のシステム IC40と対向 する面に実装されているが、このような構成に限定されず、光学ユニット 10より高さが 高くならなければ対向していない面にも電子部品を実装してもよい。  In the above embodiment, the electronic component 60 is mounted on the surface of the sub-board 70 that faces the system IC 40. However, the electronic component 60 is not limited to such a configuration, and is opposed to the optical unit 10 unless the height is higher than that of the optical unit 10. An electronic component may be mounted on the surface that is not provided.
また、上記実施例 1において、スぺーサ 60は、システム IC40とサブ基板 70とに固 定されるが、このような構成に限定されず、スぺーサ 60をメイン基板 50とサブ基板 70 とに固定されるように構成してもよい。この場合、スぺーサ 60を、システム IC40と共に メイン基板 50に実装してもよ 、。  In the first embodiment, the spacer 60 is fixed to the system IC 40 and the sub board 70. However, the spacer 60 is not limited to such a configuration, and the spacer 60 is connected to the main board 50 and the sub board 70. You may comprise so that it may be fixed to. In this case, the spacer 60 may be mounted on the main board 50 together with the system IC 40.

Claims

請求の範囲 The scope of the claims
[1] 撮像素子とメイン部品と前記撮像素子へ導光する光学ユニットとが同一面上に実装 されたメイン基板と、  [1] A main board on which an image sensor, a main component, and an optical unit for guiding light to the image sensor are mounted on the same surface;
可撓性基板を介して前記メイン基板に接続されると共にサブ部品が実装されたサ ブ基板とを備え、  A sub board connected to the main board via a flexible board and mounted with sub-components,
前記可撓性基板が曲げられた状態で、前記サブ基板は、前記メイン基板の長手方 向の幅内に前記メイン部品と離間して光軸方向に対向配置されることを特徴とする撮 像装置。  In the state in which the flexible substrate is bent, the sub-substrate is spaced apart from the main component within the width in the longitudinal direction of the main substrate, and is opposed to the optical axis direction. apparatus.
[2] 前記サブ基板は、前記光学ユニットの光軸方向の高さよりも低い位置で保持されるよ うに配置されることを特徴とする請求項 1に記載の撮像装置。  [2] The imaging apparatus according to [1], wherein the sub-board is disposed so as to be held at a position lower than a height in the optical axis direction of the optical unit.
[3] 前記サブ基板は、外部装置を電気的に接続するための端子部が設けられていること を特徴とする請求項 1又は 2に記載の撮像装置。 [3] The imaging device according to [1] or [2], wherein the sub-board is provided with a terminal portion for electrically connecting an external device.
[4] 前記メイン基板と前記サブ基板は、硬質基材カゝらなるリジット配線基板であり、前記メ イン基板と前記サブ基板と前記可撓性基板とは、前記メイン基板と前記サブ基板とを 前記可撓性基板で一体ィ匕して電気的に接続されているリジットフレキ配線基板であ ることを特徴とする請求項 1乃至 3の何れかに記載の撮像装置。 [4] The main board and the sub board are rigid wiring boards made of a hard base material, and the main board, the sub board, and the flexible board are the main board, the sub board, and the like. The imaging apparatus according to claim 1, wherein the imaging apparatus is a rigid-flex wiring board that is electrically connected integrally with the flexible board.
[5] 前記サブ基板と前記メイン部品との離間距離を規制して前記サブ基板を位置決めす る位置決め規制部を備えていることを特徴とする請求項 1乃至 4の何れかに記載の 撮像装置。 5. The imaging apparatus according to claim 1, further comprising a positioning restriction portion that positions the sub board by regulating a distance between the sub board and the main component. .
[6] 前記位置決め規制部は、前記光学ユニットに一体に成形されていることを特徴とする 請求項 5に記載の撮像装置。  6. The imaging apparatus according to claim 5, wherein the positioning restriction portion is formed integrally with the optical unit.
[7] 前記位置決め規制部は、被接続装置と前記サブ基板とを電気的に接続する第 2端 子部を備えていることを特徴とする請求項 5又は 6に記載の撮像装置。 7. The imaging apparatus according to claim 5 or 6, wherein the positioning restriction portion includes a second terminal portion that electrically connects the connected device and the sub-board.
[8] 前記撮像装置が搭載される外部装置には、該撮像装置を位置決めする位置決め部 が形成され、前記撮像装置には、前記位置決め部に係合する位置決め係合部が形 成され、 [8] A positioning portion for positioning the imaging device is formed in the external device on which the imaging device is mounted, and a positioning engagement portion for engaging with the positioning portion is formed in the imaging device,
前記位置決め部は、前記メイン基板とサブ基板とを位置決めすると共に前記サブ 基板と前記メイン部品との離間距離を規制することを特徴とする請求項 1乃至 4の何 れかに記載の撮像装置。 5. The positioning device according to claim 1, wherein the positioning portion positions the main board and the sub board and regulates a separation distance between the sub board and the main component. An imaging apparatus according to any one of the above.
PCT/JP2007/052237 2006-02-16 2007-02-08 Imaging device WO2007094234A1 (en)

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