WO2007083738A1 - Aligning jig, aligning method, method for manufacturing semiconductor module and soldering apparatus - Google Patents

Aligning jig, aligning method, method for manufacturing semiconductor module and soldering apparatus Download PDF

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Publication number
WO2007083738A1
WO2007083738A1 PCT/JP2007/050779 JP2007050779W WO2007083738A1 WO 2007083738 A1 WO2007083738 A1 WO 2007083738A1 JP 2007050779 W JP2007050779 W JP 2007050779W WO 2007083738 A1 WO2007083738 A1 WO 2007083738A1
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WO
WIPO (PCT)
Prior art keywords
jig
semiconductor element
positioning hole
solder sheet
positioning
Prior art date
Application number
PCT/JP2007/050779
Other languages
French (fr)
Japanese (ja)
Inventor
Masahiko Kimbara
Akiko Kumano
Original Assignee
Kabushiki Kaisha Toyota Jidoshokki
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Filing date
Publication date
Application filed by Kabushiki Kaisha Toyota Jidoshokki filed Critical Kabushiki Kaisha Toyota Jidoshokki
Publication of WO2007083738A1 publication Critical patent/WO2007083738A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68309—Auxiliary support including alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a positioning jig used when soldering a semiconductor element to a joint provided on a circuit board via a solder sheet, a positioning method using the positioning jig, and a method for manufacturing a semiconductor module And a soldering apparatus.
  • solder fillet is formed so as to surround the peripheral edge of the semiconductor element. Since the circuit board and the semiconductor element have different linear expansion coefficients, cracks may occur in the solder when the thermal stress is repeatedly generated in the solder that joins the circuit board as the temperature changes. The solder fillet suppresses the occurrence of such cracks.
  • Patent Document 1 discloses that a solder fillet is formed by cream solder when a chip component, which is an electronic component, is soldered onto a printed wiring board (circuit board).
  • cream solder contains flux, which is a component other than solder, and requires a cleaning process. For this reason, from the viewpoint of improving the efficiency of soldering work, soldering using a solid solder sheet is preferable.
  • Patent Document 2 discloses that when a semiconductor chip as an electronic component is soldered to a circuit board using a solid flat solder sheet, a solder fillet is formed by the solder sheet. .
  • a jig is used for soldering, The jig includes a lower jig having a recess capable of holding the circuit board and an upper jig having a through hole capable of holding the semiconductor chip. On the lower surface of the upper jig, a gap recess is formed around the through hole.
  • the circuit board is first positioned in the recess of the lower jig, and then the solder sheet is placed at a predetermined position on the circuit board.
  • the upper jig is placed on the lower jig, and a semiconductor chip is inserted into the through hole of the upper jig and the semiconductor chip is placed on the solder sheet.
  • the semiconductor chip is soldered to the circuit board by heating and melting the solder sheet with the solder sheet sandwiched between the circuit board and the semiconductor chip. At this time, the melted solder wets and spreads on the peripheral portion of the semiconductor chip, and a solder fillet is formed on the peripheral portion of the semiconductor chip.
  • the semiconductor chip is placed on the solder sheet in a state of being positioned by the wall surface of the through hole of the upper jig.
  • the through hole of the upper jig is formed to be slightly larger than the outer shape of the semiconductor chip because it is necessary to allow the semiconductor chip to pass through and to accurately position the semiconductor chip at a predetermined position on the solder sheet. ing. Therefore, when the semiconductor chip is passed through the through hole, the semiconductor chip may interfere with the wall surface of the through hole, and the semiconductor chip may not be securely placed on the solder sheet (for example, the semiconductor chip may be placed in the through hole). It gets stuck on the wall and does not reach the solder sheet). In such a case, soldering cannot be performed reliably, and solder fillets cannot be reliably formed.
  • Patent Document 1 Japanese Patent Laid-Open No. 5-37144
  • Patent Document 2 JP-A-6-21110
  • An object of the present invention is to provide a positioning jig and a positioning method capable of satisfactorily soldering a semiconductor element to a joint portion of a circuit board and forming a good solder fillet. It is in. Another object of the present invention is to attach a semiconductor element to a circuit board. An object of the present invention is to provide a method of manufacturing a semiconductor module and a soldering apparatus that can satisfactorily solder to a joint and can form a good solder fillet.
  • a positioning jig used when soldering a semiconductor element using a solder sheet to a joint provided on a circuit board.
  • the positioning jig includes a first jig and a second jig.
  • the first jig has a positioning hole penetrating in the vertical direction.
  • the positioning hole allows the semiconductor element and the solder sheet to be inserted.
  • the first jig is arranged with respect to the circuit board so that the positioning hole corresponds to the joint.
  • the second jig can be removed from the positioning hole, and a pressure surface that presses the semiconductor element disposed on the solder sheet toward the circuit board in a state of being inserted into the positioning hole. Have.
  • the second jig is inserted into the positioning hole, the second jig is positioned by the wall surface forming the positioning hole so that the pressing surface is disposed at a position facing the joint portion.
  • the solder sheet and the semiconductor element are positioned with respect to the circuit board.
  • a positioning method is provided. The positioning method is to prepare a positioning jig including a first jig and a second jig, and the first jig has a positioning hole penetrating in the vertical direction, and the first jig
  • the jig of 2 is detachable from the positioning hole and has a pressure surface, and the first jig is arranged with respect to the circuit board so that the positioning hole corresponds to the joint.
  • the second jig is positioned, whereby the solder sheet is positioned with respect to the joint, and the second jig is inserted into the positioning hole in a state where the semiconductor element is disposed on the pressing surface.
  • the pressure surface is the solder Over preparative second jig is positioned by the wall surface of the positioning hole so as to face the, it'll connection semiconductor element and a that is positioned with respect to the solder sheet.
  • a method for manufacturing a semiconductor module comprising a circuit board and a semiconductor element soldered to a joint provided on the circuit board using a solder sheet Law.
  • the semiconductor module manufacturing method includes preparing a positioning jig including a first jig and a second jig, and the first jig has a positioning hole penetrating in the vertical direction.
  • the second jig is detachable from the positioning hole and has a pressing surface, and the first jig is attached to the circuit board so that the positioning hole corresponds to the joint.
  • the second jig is inserted into the positioning hole in a state in which a solder sheet is disposed on the pressing surface, and the pressing surface faces the joint.
  • the second jig is positioned by the wall surface of the positioning hole, whereby the solder sheet is positioned with respect to the joint, and the semiconductor element is disposed on the pressing surface, and the second jig is positioned in the positioning hole.
  • the second jig is positioned by the wall surface of the positioning hole so that the pressing surface faces the solder sheet, thereby positioning the semiconductor element with respect to the solder sheet, and the positioning hole
  • the solder sheet is heated and melted in a state where the semiconductor element is pressed toward the circuit board by the pressure surface of the second jig inserted in the semiconductor device, and thereby the semiconductor element is soldered to the joint.
  • a soldering apparatus for soldering a semiconductor element using a solder sheet at a joint provided on a circuit board.
  • the soldering apparatus includes a first jig, a second jig, and a transport unit.
  • the first jig has a positioning hole penetrating in the vertical direction. The positioning hole allows the semiconductor element and the solder sheet to be inserted, and the first jig is disposed on the circuit board so that the positioning hole corresponds to the joint portion.
  • the second jig can be removed from the positioning hole.
  • the second jig has a pressing surface that presses the semiconductor element disposed on the solder sheet toward the circuit board while being inserted into the positioning hole.
  • the transport unit can transport at least the second jig among the first jig and the second jig.
  • FIG. 1 is a plan view of a semiconductor module according to the present invention provided with one ceramic substrate.
  • FIG. 2 is a cross-sectional view taken along line 2-2 in FIG.
  • FIG. 3 is a plan view of a semiconductor module according to the present invention including a plurality of ceramic substrates. 4] (a) is a plan view of a first jig used for soldering, and (b) is a perspective view of a second jig used for soldering.
  • FIG. 5 is a schematic longitudinal sectional view of the soldering apparatus of FIG. 3 according to the first embodiment.
  • FIG. 6 is a cross-sectional view of a portion including the first jig and the second jig in the soldering apparatus of FIG.
  • FIG. 7 is a plan view showing a pressing surface of a second jig.
  • FIG. 8 is a partial cross-sectional view showing a solder fillet formed on a peripheral portion of a semiconductor element.
  • FIG. 9 is a partial cross-sectional view of a soldering apparatus according to a second embodiment.
  • FIG. 10 is a schematic longitudinal sectional view of a soldering apparatus according to another embodiment.
  • FIG. 11 is a schematic longitudinal sectional view of a soldering apparatus according to another embodiment.
  • FIG. 12 is a schematic longitudinal sectional view of a soldering apparatus according to another embodiment.
  • the semiconductor module 10 includes a circuit board 11 and four semiconductor elements 12.
  • the four semiconductor elements 12 are joined to the circuit board 11 by soldering.
  • the circuit board 11 includes a ceramic substrate 14 having a metal circuit 13 on the surface, and a metal heat sink 15 fixed to the ceramic substrate 14 via a metal plate 16. That is, the circuit board 11 is a cooling circuit board including the heat sink 15.
  • the heat sink 15 is formed of an aluminum-based metal, copper, or the like, and includes a refrigerant channel 15a through which a cooling medium flows.
  • Aluminum metal means aluminum or aluminum alloy.
  • the metal plate 16 functions as a bonding layer for bonding the ceramic substrate 14 and the heat sink 15 and is made of, for example, aluminum or copper.
  • the metal circuit 13 is made of, for example, aluminum or copper.
  • the ceramic substrate 14 as a ceramic insulator is made of, for example, aluminum nitride, alumina, silicon nitride, or the like.
  • an electronic component such as an IGBT (Insulated Gate Bipolar Transistor) or a diode is used.
  • Each semiconductor element 12 is joined (soldered) to a metal circuit 13.
  • the metal circuit 13 constitutes a joint for joining the semiconductor element 12 onto the circuit board 11.
  • Each semiconductor element 1 2 is bonded to the metal circuit 13 by the solder layer H.
  • the solder layer H is formed by using a square sheet of solder sheet 33 (see FIG. 5).
  • a solder fillet F which is a part of the solder layer H, is formed on the peripheral edge 12a of the semiconductor element 12 over the entire circumference.
  • the cross-sectional shape of the solder fillet F when the solder layer H is cut in the vertical direction is smoothly curved in an arc shape from the top to the bottom of the solder layer H.
  • the semiconductor module 10 is not limited to a configuration in which a single ceramic substrate 14 having a metal circuit 13 on its surface as a circuit substrate 11 is integrated with a heat sink 15 made of metal and provided with a refrigerant flow path 15a. Absent.
  • a plurality of (six in this embodiment) ceramic substrates 14 having a metal circuit 13 on the surface as a circuit substrate 11 are integrally formed with a heat sink 15 made of metal and provided with a refrigerant flow path 15a.
  • the semiconductor module 100 may be provided with the cooling circuit board. In the semiconductor module 100, four semiconductor elements 12 are soldered on each ceramic substrate 14, respectively.
  • FIG. 5 schematically shows the configuration of the soldering apparatus HK.
  • the soldering device HK is configured as a device for soldering the semiconductor element 12 to the metal circuit 13 of the circuit board 11.
  • the soldering apparatus HK of this embodiment is configured as a soldering apparatus for the semiconductor module 100 shown in FIG. 3, that is, the semiconductor module 100 including a plurality (six) ceramic substrates 14 on the heat sink 15. ing.
  • the soldering apparatus HK includes a container (chamber) 17 that can be sealed, and the container 17 has a box-shaped main body 18 having an opening 18a, and an opening of the main body 18. And a lid 19 for opening and closing 18a.
  • the main body 18 is provided with a support base 20 that positions and supports the semiconductor module 100.
  • a packing 21 that can be in close contact with the lid 19 is provided at the opening edge of the main body 18.
  • the lid body 19 is formed in a size that can close the opening 18 a of the main body 18. By attaching the lid 19 to the main body 18, a sealed space S is formed in the container 17.
  • the lid body 19 has a portion 22 that faces the sealed space S, and the portion 22 is formed of an electrically insulating material that passes magnetic lines of force (magnetic flux).
  • glass is used as the electrical insulating material, and the portion 22 of the lid 19 is made of a glass plate.
  • the main body 18 is supplied with a reducing gas (hydrogen in this embodiment) into the container 17.
  • a reducing gas supply unit 23 is connected.
  • the reducing gas supply unit 23 includes a pipe 23a, an open / close valve 23b provided in the pipe 23a, and a hydrogen tank 23c.
  • an inert gas supply unit 24 for supplying an inert gas (nitrogen in this embodiment) into the container 17 is connected to the main body 18.
  • the inert gas supply unit 24 includes a pipe 24a, an open / close valve 24b provided in the pipe 24a, and a nitrogen tank 24c.
  • the main body 18 is connected to a gas discharge section 25 for discharging the gas filled in the container 17 to the outside.
  • the gas discharge unit 25 includes a pipe 25a, an open / close valve 25b provided in the pipe 25a, and a vacuum pump 25c.
  • the soldering device HK includes a reducing gas supply unit 23, an inert gas supply unit 24, and a gas discharge unit 25 so that the pressure in the sealed space S can be adjusted. Pressurized or depressurized by adjustment.
  • the main body 18 is connected to a heat medium supply unit 26 for supplying a heat medium (cooling gas) into the container 17 after soldering.
  • the heat medium supply unit 26 includes a pipe 26a, an open / close valve 26b provided in the pipe 26a, and a gas tank 26c.
  • the heat medium supply unit 26 supplies a cooling gas to the heat sink 15 of the semiconductor module 100 accommodated in the container 17.
  • the heat medium supplied from the heat medium supply unit 26 may be a coolant.
  • the main body 18 is provided with a temperature sensor (for example, a thermocouple) 27 for measuring the temperature inside the container 17.
  • a plurality of high-frequency heating coils 28 are installed above the soldering device HK, specifically above the lid 19.
  • the soldering apparatus HK of this embodiment has six high-frequency heating coils 28.
  • the six high-frequency heating coils 28 are respectively arranged above the ceramic substrate 14 so as to correspond to the six ceramic substrates 14 respectively.
  • it when the upward force is also seen, it has a size that can cover one ceramic substrate 14 and is larger than the contour of the upper surface of the second jig 35 described later.
  • Each high-frequency heating coil 28 is formed to have a spiral shape (rectangular spiral shape) in one plane, and has a substantially square plate shape as a whole.
  • Each high-frequency heating coil 28 is disposed so as to face the lid 19, specifically, to face the glass plate 22.
  • Each high-frequency heating coil 28 is electrically connected to a high-frequency generator 29 provided in the soldering device HK, Based on the measurement result of the temperature sensor 27 installed in the container 17, the output of the high-frequency generator 29 is controlled.
  • Each high-frequency heating coil 28 has a cooling passage 30 for passing cooling water therein, and is connected to a cooling water tank 31 provided in the soldering apparatus HK.
  • the soldering apparatus HK includes a positioning jig IK that positions the semiconductor element 12 and the solder sheet 33 when performing soldering.
  • the positioning jig IK includes a first jig 32 shown in FIG. 4 (a) and a second jig 35 shown in FIG. 4 (b).
  • the first jig 32 is formed in a flat plate shape and has the same size as the ceramic substrate 14 in the circuit board 11.
  • the first jig 32 is made of a material such as graphite or ceramics, for example. As shown in FIG. 5, the first jig 32 is placed on the circuit board 11 during soldering, and the solder sheet 33 is positioned at a predetermined position on the metal circuit 13 (joint portion) of the ceramic board 14.
  • the solder sheet 33 has a square plate shape and has an outer shape larger than the outer shape of the semiconductor element 12. That is, in the solder sheet 33, when the semiconductor element 12 is placed on the solder sheet 33, the peripheral portion 33a of the solder sheet 33 protrudes outward from the peripheral portion 12a of the semiconductor element 12.
  • the first jig 32 has a plurality of (four in this embodiment) positioning holes that penetrate the first jig 32 in the vertical direction. 34 is formed.
  • Each positioning hole 34 is disposed at a position corresponding to the metal circuit 13 (joint portion) in the ceramic substrate 14 in a state where the first jig 32 is placed on the circuit substrate 11. That is, in a state where the first jig 32 is placed on the circuit board 11, the metal circuit 13 is exposed to the upper side through each positioning hole 34.
  • Each positioning hole 34 is formed larger than the outer shape of the solder sheet 33 and the semiconductor element 12 so as to allow the insertion of the solder sheet 33 and the semiconductor element 12.
  • the solder sheet 33 can be inserted into the positioning hole 34 in a state in which the solder sheet 33 is parallel to the circuit board 11 and its peripheral edge 33a faces the wall surface 34a of the positioning hole 34.
  • FIG. 6 in the state where the solder sheet 33 is inserted into each positioning hole 34, there is a slight gap between the wall surface 34a of each positioning hole 34 and the peripheral edge 33a over the entire circumference of the solder sheet 33. Gap N is formed It is. That is, when the solder sheet 33 is inserted into the positioning hole 34 and placed on the metal circuit 13, the solder sheet 33 is positioned at a predetermined position on the metal circuit 13 by the wall surface 34a of the positioning hole 34. . When the solder sheet 33 is positioned at a predetermined position on the metal circuit 13, the entire lower surface of the solder sheet 33 is in contact with the metal circuit 13.
  • the wall surface 34a of the positioning hole 34 and the wall surface 34a A gap M is formed between the opposing peripheral edge 12a of the semiconductor element 12.
  • the peripheral portion 33 a of the solder sheet 33 protrudes outward from the peripheral portion 12 a of the semiconductor element 12.
  • the gap M is wider than the gap N between the peripheral edge portion 33a of the solder sheet 33 and the wall surface 34a of the positioning hole 34. Further, the gap M is larger than the thickness dimension D of the solder sheet 33.
  • the gap M is formed over the entire periphery of the semiconductor element 12, and is larger than the thickness dimension D of the solder sheet 33 even at a shift position around the semiconductor element 12.
  • the gap M becomes at least 1Z2 of the thickness dimension D of the solder sheet 33! /.
  • the second jig 35 is made of a material that can generate heat by electromagnetic induction, that is, due to its own electrical resistance when a current is generated by a change in magnetic flux passing through itself. It is formed using a material that generates heat.
  • the second jig 35 of this embodiment is made of stainless steel.
  • the second jig 35 is formed so as to be in contact with a non-joint surface which is the upper surface of the semiconductor element 12 immediately above the semiconductor element 12 placed on the solder sheet 33 at the time of soldering.
  • the second jig 35 is disposed on the lower surface side in contact with the four semiconductor elements 12 during soldering.
  • a pressing surface having a shape corresponding to the arrangement of the four semiconductor elements 12 is provided.
  • the second jig 35 has four pressing surfaces 35a each having a shape that can be inserted into the four positioning holes 34 of the first jig 32, and these pressing surfaces 35a correspond to each other.
  • Each of the semiconductor elements 12 can be brought into contact with each other.
  • the wall surface 34a of the positioning hole 34 is provided with a second jig 35.
  • each pressing surface 35a is formed to be recessed, and movement of the semiconductor element 12 is suppressed in a state where the semiconductor element 12 is disposed inside the pressing surface 35a.
  • the second jig 35 has a plurality of passages 37 corresponding to the four pressure surfaces 35a, and each passage 37 corresponds to the corresponding pressure surface 35a. It has an opening 37a that opens. Each passage 37 can apply a negative pressure to the pressing surface 35a through the opening 37a so as to adsorb the semiconductor element 12 or the solder sheet 33. Each passage 37 extends so as to penetrate the second jig 35 in the vertical direction. Further, as shown in FIG. 7, a plurality of communication grooves 35c communicating with the openings 37a of the passage 37 are formed in each pressure surface 35a. As shown in FIG. 5, a suction device 41 is disposed above the second jig 35.
  • a plurality of seal members 43 made of rubber material corresponding to the plurality of passages 37 of the second jig 35 are disposed on the lower surface 41 a of the adsorption device 41. Further, a passage 42 is formed in the adsorption device 41, and the passage 42 includes four portions extending vertically, and the lower end of these portions has an opening 42a opened downward in the seal member 43. Forming.
  • the adsorption device 41 includes a vacuum pump 38 as a negative pressure source, and the vacuum pump 38 is connected to the passage 42.
  • a negative pressure is applied to the passage 42 of the suction device 41 by the vacuum pump 38, and further, to the passage 37 of the second jig 35 via the seal member 43 that contacts the upper surface of the second jig 35. Negative pressure acts.
  • Negative pressure acts.
  • the second jig 35 is adsorbed to the adsorption device 41 and the pressure surface 35a has a semiconductor.
  • the element 12 or the solder sheet 33 is adsorbed.
  • the second jig 35 has a flange 35b at a portion opposite to the pressing surface 35a.
  • Fig. 4 (a) shows the outer shape of the second jig 35 on the pressing surface 35a side by a two-dot chain line, and the second jig 35 is inserted into the positioning hole 34 of the first jig 32. The positional relationship between the first jig 32 and the second jig 35 is shown.
  • the soldering apparatus HK is configured so that all the second jigs 35 can be collectively disposed at a pressing position where the semiconductor element 12 can be pressed. The two jigs 35 can be moved away from the semiconductor element 12 all at once. Yes.
  • the lid 19 of the soldering device HK is provided with a support plate 36 as a transport portion (transport device) capable of transporting the second jig 35.
  • the support plate 36 is made of an electrically insulating material (for example, ceramics) that passes the lines of magnetic force, and the hole 36a that permits the passage of the portion of the second jig 35 below the flange 35b is formed in the second jig. There are as many as 35 pieces.
  • the hole 36 a is formed at a position facing the joint portion (metal circuit 13) of the circuit board 11 positioned on the support base 20 in a state where the lid 19 is attached to the main body 18.
  • the second jig 35 is mounted on the support plate 36 in a state of being inserted into each hole 36a.
  • the second jig 35 is supported by the lid body 19 by the flange 35 b being supported by the support plate 36.
  • the second jig 35 is transported by moving the lid 19 while the flange 35b is supported by the support plate 36.
  • the lid body 19 including the support plate 36 functions as a transport unit (transport device) that transports the second jig 35.
  • the periphery of the peripheral portion 12a of the semiconductor element 12 is between the upper side of the peripheral portion 33a of the solder sheet 33 and the lower side of the pressing surface 35a of the second jig 35.
  • An outer space K is formed.
  • the space K is formed over the entire periphery of the peripheral edge 12a of the semiconductor element 12, and the width of the space K corresponds to the size of the gap M.
  • the soldering process is a process of manufacturing the semiconductor module 100 and includes a positioning process of the semiconductor element 12.
  • soldering object Prior to soldering using this soldering apparatus HK and positioning jig IK, a plurality of (six) ceramic substrates 14 having metal circuits 13 were joined to one heat sink 15.
  • An object (hereinafter referred to as “soldering object”) is prepared in advance. That is, the soldering object corresponds to the semiconductor module 100 shown in FIG. 3 excluding the semiconductor element 12.
  • the lid 19 is removed from the main body 18, and the opening 18a is opened. Then, as shown in FIG. 5, an object to be soldered is placed on the support base 20 of the main body 18 and positioned with respect to the support base 20. Next, the solder sheet 33 is disposed at a position corresponding to the positioning hole 34.
  • a necessary number of solder sheets 33 are arranged outside the main body 18 so as to correspond to the arrangement of the solder sheets 33 on the object to be soldered.
  • the lid body 19 is arranged so that the pressing surface 35 a of each second jig 35 corresponds to the solder sheet 33.
  • the negative pressure of the vacuum pump 38 is applied to the passage 42 of the adsorption device 41 to adsorb the second jig 35 to the adsorption device 41, and the vacuum pump 38 is inserted into the passage 37 of each second jig 35. Apply negative pressure.
  • the solder sheet 33 is adsorbed to the pressure surface 35a via the plurality of communication grooves 35c in each pressure surface 35a.
  • the solder sheet 33 is adsorbed to the pressure surface 35a so that the peripheral edge portion 33a does not protrude outward from the outer peripheral edge of the pressure surface 35a.
  • the lid body 19 is moved in a state where the solder sheet 33 is adsorbed, and the opening 18 a of the main body 18 is closed with the lid body 19.
  • the pressing surface 35a of each second jig 35 is inserted into the positioning hole 34 of the first jig 32 in a state where the solder sheet 33 is adsorbed.
  • the second jig 35 is positioned by the wall surface 34a of the positioning hole 34 so that the pressing surface 35a is located at a predetermined position on the metal circuit 13. For this reason, when the solder sheet 33 is inserted into the positioning hole 34, the peripheral edge portion 33a of the solder sheet 33 is prevented from interfering with the wall surface 34a of the positioning hole 34.
  • solder sheet 33 is moved to the metal circuit 13 (joint portion). ) Is arranged at a predetermined position on. At this time, the solder sheet 33 is positioned on the metal circuit 13 with the peripheral edge 33a of the solder sheet 33 facing the wall surface 34a of the positioning hole 34. For this reason, the solder sheet 33 is restrained from moving on one ceramic substrate 14 by force toward the solder sheet 33 placed adjacent thereto.
  • a necessary number of semiconductor elements 12 are arranged so as to correspond to the arrangement on the object to be soldered, and each second jig 35 is added to the semiconductor elements 12.
  • the lid 19 is arranged so that the pressure surface a corresponds.
  • the negative pressure of the vacuum pump 38 is applied to the passage 42 of the adsorption device 41, so that the second treatment is performed.
  • the tool 35 is adsorbed by the adsorbing device 41 and the negative pressure of the vacuum pump 38 is applied to the passage 37 of each second jig 35.
  • the semiconductor element 12 is adsorbed to the caloric pressure surface 35a via the plurality of communication grooves 35c in each pressure surface 35a.
  • the semiconductor element 12 is attracted to the pressure surface 35a so that the peripheral edge portion 33a does not protrude outward from the outer peripheral edge of the pressure surface 35a.
  • the lid body 19 is attached to the main body 18.
  • the pressing surface 35 a of each second jig 35 is inserted into the positioning hole 34 of the first jig 32.
  • the second jig 35 is positioned by the wall surface 34a of the positioning hole 34 so that the pressing surface 35a is disposed at a predetermined position on the solder sheet 33. .
  • the peripheral edge portion 12a of the semiconductor element 12 is prevented from contacting the wall surface 34a of the positioning hole 34.
  • each semiconductor element 12 is disposed at a predetermined position on the solder sheet 33 and each second jig 35 is placed on the semiconductor element 12.
  • the lid 19 is attached to the main body 18, the opening 18 a is closed, and the sealed space S is formed in the container 17.
  • the flange 35b is in a state where the upper surface force of the support plate 36 is also separated.
  • Each second jig 35 straddles four semiconductor elements 12 so that the semiconductor element 12 is pressed by the weight of the second jig 35 and the suction device 41 and the solder sheet 33 is pressed. Be placed. That is, the semiconductor element 12 is positioned on the solder sheet 33 by the weight of the second jig 35 and the adsorption device 41. In this state, on each ceramic substrate 14, the solder force 33, the semiconductor element 12, and the second jig 35 are also arranged in this order on the metal circuit 13 side force.
  • the plurality of high-frequency heating coils 28 are located above the corresponding second jig 35. Respectively. Between each high-frequency heating coil 28 and the second jig 35 corresponding thereto, a glass plate 22 assembled to the lid 19 is disposed. In this embodiment, when the high-frequency heating coil 28 is also viewed in an upward force, the contour of the upper surface of the second jig 35 is used. Thus, the high-frequency heating coil 28 is constructed and arranged so that the high-frequency heating coil 28 protrudes. Since the high-frequency heating coil 28 formed in a spiral shape as in this embodiment generates a large amount of magnetic flux near the center thereof, the second jig 35 can be disposed near the center of the high-frequency heating coil 28. Favored ,.
  • the inside of the container 17 is evacuated by operating the gas discharge unit 25. Further, the inert gas supply unit 24 is operated to supply nitrogen into the container 17, and the sealed space S is filled with the inert gas. After this evacuation and nitrogen supply are repeated several times, the reducing gas supply unit 23 is operated to supply hydrogen into the container 17, and the sealed space S is made a reducing gas atmosphere.
  • the high frequency generator 29 is operated, and a high frequency current is passed through each high frequency heating coil 28.
  • the high frequency heating coil 28 generates a high frequency magnetic flux that passes through the corresponding second jig 35, and an eddy current is generated in the second jig 35 due to the passage of the magnetic flux.
  • the second jig 35 placed in the magnetic flux of the high-frequency heating coil 28 generates heat due to electromagnetic induction, and the heat is transmitted from the pressure surface 35a of the second jig 35 to the semiconductor element 12.
  • the heat generated in the second jig 35 is applied to the solder sheet 33 placed on each joint portion of the circuit board 11 via the pressure surface 35a of the second jig 35 and the semiconductor element 12. It is transmitted intensively and the solder sheet 33 is heated. As a result, the solder sheet 33 melts at a temperature higher than its melting temperature.
  • the solder sheet 33 is positioned by the wall surface 34a of the positioning hole 34, the molten solder is prevented from moving toward the adjacent semiconductor element 12. As a result, the semiconductor elements 12 are prevented from being short-circuited by solder. Furthermore, since the semiconductor element 12 is pressed by the second jig 35, the formation of the solder fillet F that prevents the semiconductor element 12 from moving when the solder melts is suppressed.
  • the high frequency generator 29 is stopped. Na
  • the magnitude of the high-frequency current flowing through the high-frequency heating coil 28 is controlled based on the detection result of the temperature sensor 27 installed in the container 17. Further, the pressure in the container 17 (sealed space S) is increased and decreased according to the progress of the soldering operation.
  • the heating medium supply unit 26 is operated to supply the cooling gas into the container 17.
  • the cooling gas is blown toward the inlet or outlet of the refrigerant flow path 15a of the heat sink 15. Further, the cooling gas supplied into the container 17 flows around the refrigerant flow path 15a and the heat sink 15, and cools the soldering object.
  • the melted solder is solidified by being cooled below the melting temperature, joining the metal circuit 13 and the semiconductor element 12, and forming a solder fillet F on the peripheral edge portion 12 a of the semiconductor element 12.
  • the soldering operation is finished, and the semiconductor module 100 is completed.
  • the lid 19 is removed from the main body 18, the first jig 32 and the second jig 35 are removed, and then the semiconductor module 100 is taken out from the container 17.
  • the present embodiment has the following advantages.
  • the semiconductor element 12 and the solder sheet 33 are inserted into the positioning hole 34 by the second jig 35, respectively.
  • the second jig 35 is positioned by the wall surface 34a of the positioning hole 34 so that the pressurizing surface 35a is disposed at a position facing the joint (metal circuit 13). Therefore, in a state where the solder sheet 33 is disposed on the pressure surface 35a, the solder sheet 33 is disposed at a predetermined position on the joint (metal circuit 13), and the semiconductor element 12 is disposed on the pressure surface 35a. In this state, the semiconductor element 12 is arranged at a predetermined position on the solder sheet 33 arranged at a predetermined position.
  • the semiconductor element 12 and the solder sheet 33 are suppressed from being arranged at positions deviated from each predetermined position force. 12 can be soldered well to the joint (metal circuit 13). Further, since the semiconductor element 12 is disposed at a predetermined position on the solder sheet 33, the peripheral edge portion 13a of the solder sheet 33 is present at the peripheral edge portion 12a of the semiconductor element 12, and the melting of the solder causes the semiconductor element 12 to The solder fillet F is well formed on the peripheral edge 12a.
  • solder sheet 33 When the solder sheet 33 is inserted into the positioning hole 34, the solder sheet 33 is disposed at a predetermined position on the joint (metal circuit 13), and the semiconductor element 12 is inserted into the positioning hole 34. Then, the semiconductor element 12 is disposed at a predetermined position on the solder sheet 33. In a state where the semiconductor element 12 is positioned by the second jig 35, a gap M is formed between the wall surface 34a of the positioning hole 34 and the peripheral edge portion 12a of the semiconductor element 12, and the gap M is a solder sheet. Greater than thickness dimension D of 33.
  • the solder sheet 33 when the solder sheet 33 is melted, the presence of the gap M allows the solder capillary phenomenon around the semiconductor element 12, so that the solder fillet F is formed on the peripheral edge portion 12 a of the semiconductor element 12. . Accordingly, the solder fillet F is formed, and the solder sheet 33 and the semiconductor element 12 are soldered without being displaced upright, so that the semiconductor element 12 can be soldered to a predetermined position.
  • the size of positioning hole 34 is larger than the outer shape of solder sheet 33. Therefore, the solder sheet 33 can be inserted into the positioning hole 34 after the first jig 32 is placed on the soldering object. For example, when the solder sheet 33 is formed larger than the positioning hole 34, the first jig 32 can be placed on the soldering object only after the solder sheet 33 is placed on the joint. Can not. However, unlike this case, in the present embodiment, the solder sheet 33 can be positioned by the first jig 32.
  • the outer shape of the solder sheet 33 is larger than the outer shape of the semiconductor element 12.
  • the peripheral portion 33 a of the solder sheet 33 exists outside the peripheral portion 12 a of the semiconductor element 12. Therefore, when the solder sheet 33 is melted, the solder fillet F is reliably formed on the peripheral edge portion 33a of the solder sheet 33.
  • a passage 37 having an opening 37a is formed in each pressure surface 35a of the second jig 35.
  • the second jig 35 includes a suction device 41, and a vacuum pump 38 of the suction device 41 communicates with a passage 42 of the suction device 41. Then, by applying a negative pressure to the suction device 41 by the vacuum pump 38, the second jig 35 is sucked into the suction device 41 via the seal member 43. Furthermore, the semiconductor element 12 or the solder sheet 33 can be adsorbed to the pressure surface 35a of the second jig 35.
  • the semiconductor element 12 or the solder sheet 33 can be inserted into the positioning hole 34 in a state where the semiconductor element 12 or the solder sheet 33 is adsorbed to the pressing surface 35a. . Therefore, when the semiconductor element 12 or the solder sheet 33 is inserted into the positioning hole 34, the semiconductor element 12 or the solder sheet 33 is prevented from interfering with the wall surface 34a of the positioning hole 34, and the semiconductor element 12 or the solder sheet 33 is prevented. Can be accurately placed at a predetermined position.
  • the second jig 35 By causing the second jig 35 to function as an adsorbing portion that can adsorb the semiconductor element 12, the second jig 35 is placed on the solder sheet 33 and simultaneously with the second jig.
  • the tool 35 can be placed on the semiconductor element 12. In other words, the second jig 35 and the semiconductor element 12 can be transported simultaneously. Therefore, soldering work can be shortened.
  • Adsorbing a plurality of semiconductor elements 12 and a plurality of solder sheets 33 to the pressing surface 35a of the second jig 35 and placing them collectively on the joint (metal circuit 13) Can do.
  • the manufacturing time of the semiconductor module 100 can be shortened as compared with the case where the semiconductor element 12 and the solder sheet 33 are placed one by one on the joint (metal circuit 13).
  • a plurality of communication grooves 35c are formed on the pressure surface 35a of each second jig 35, and each communication groove 35c communicates with the vacuum pump 38 of the suction device 41 via passages 37 and 42. is doing. Therefore, when a negative pressure is applied to the second jig 35 by the vacuum pump 38 , the semiconductor element 12 or the solder sheet 33 can be adsorbed at a plurality of locations on the pressing surface 35a. Therefore, the semiconductor element 12 or the solder sheet 33 can be reliably adsorbed to each second jig 35, and the semiconductor element 12 or the solder sheet 33 can be reliably conveyed using the second jig 35. it can.
  • Soldering apparatus HK transports all the second jigs 35 in a batch by the support plate 36 of the lid 19. Therefore, the labor for carrying the second jig 35 can be saved, and as a result, the manufacturing time of the semiconductor module 100 can be shortened.
  • the second embodiment differs from the first embodiment in the configuration of the first jig 32, and other configurations. Since this is basically the same as that of the first embodiment, detailed description of the same parts is omitted.
  • This embodiment has the following advantages in addition to the advantages similar to the advantages (1) to (10) in the first embodiment.
  • the inclined portion 44 formed on the wall surface 34 a of the positioning hole 34 faces the peripheral portion 33 a of the solder sheet 33 placed on the metal circuit 13 and the peripheral portion 12 a of the semiconductor element 12. Therefore, when the solder sheet 33 is melted, the peripheral edge portion 33a of the solder sheet 33 is allowed to flow toward the inclined portion 44 by capillary action. As a result, the solder fillet F is reliably formed around the semiconductor element 12.
  • the soldering process of the semiconductor element 12 may be performed as follows.
  • the first jig 32 and the object to be soldered are turned upside down and the object to be soldered is placed on the first jig 32 so that the positioning hole 34 opens downward. . Further, after the second jig 35 is arranged so that the pressing surface 35 a faces upward, the semiconductor element 12 is arranged on the pressing surface 35 a and the solder sheet 33 is arranged on the semiconductor element 12.
  • the second jig 35 is inserted into the positioning hole 34 also with the pressing surface 35a side force, and the solder sheet 33 is disposed opposite to the metal circuit 13, and then the soldering object and Turn jigs 32 and 35 upside down. Then, the solder sheet 33 is disposed on the metal circuit 13, and the semiconductor element 12 is disposed on the solder sheet 33. Thereafter, the soldering operation is performed in a state where the semiconductor element 12 is pressurized by the second jig 35.
  • the upper force of the second jig 35 may also be deleted from the suction device 41.
  • a connecting portion 39 communicating with the passage 37 is provided on a surface other than the lower surface (pressurizing surface 35a) of the second jig 35, and the connecting portion 39 is connected to the outside of the container 17 through a flexible pipe 40.
  • a valve 40 a is provided in the middle of the pipe 40. The vacuum pipe 40 is introduced into the container 17 through the lid 19. The nozzle 40a can be switched between a state in which the connection part 39 can communicate with the negative pressure source 50 and a state in which the connection part 39 can communicate with the atmosphere.
  • the switching operation of the valve 40a switches between a state where negative pressure acts on the passage 37 and a state where the negative pressure action on the passage 37 is released.
  • the vacuum pipe 40 existing inside the container 17 is supported by a support portion (not shown) so that the load of the pipe 40 does not adversely affect the pressing action of the second jig 35.
  • the weight of each second jig 35 is set in consideration of the load applied by the pipe 40.
  • the suction device 41 is configured to be able to suck both the first jig 32 and the second jig 35, and the first jig 32 is used by the suction device 41.
  • a transport unit (transport device) for the second jig 35 may be configured.
  • the adsorption device 41 includes three vacuum pumps 38a, 38b, and 38c.
  • the first vacuum pump 38a mainly functions to adsorb the semiconductor element 12 and the solder sheet 33.
  • the passage 42 is connected to the first vacuum pump 38a, and the passage 42 passes through the seal member 43a. Can communicate with the passage 37 of the second jig 35.
  • the second vacuum pump 38b functions to adsorb the second jig 35, and a passage 45 different from the passage 42 is connected to the second vacuum pump 38b.
  • the passage 45 opens to the seal member 43a provided on the lower surface 41a of the adsorption device 41.
  • the third vacuum pump 38c functions to adsorb the first jig 32, and a passage 46 other than the passages 42 and 45 is connected to the third vacuum pump 38c.
  • the passage 46 opens to a seal member 43b different from the seal member 43a provided on the lower surface 41a of the adsorption device 41.
  • the negative pressure of the second vacuum pump 38b is applied to the passage 45 of the adsorption device 41, and the first passage is applied to the passage 42. 1Apply vacuum pressure of vacuum pump 38a. Then, the second jig 35 is adsorbed to the adsorption device 41 and the solder sheet 33 is adsorbed to each second jig 35. Then, the negative pressure of the third vacuum pump 38c is applied to the passage 46 of the adsorption device 41, and the first jig 32 is adsorbed to the adsorption device 41.
  • the first jig 32 and the second jig 35 are sucked by the suction device 41 in a state where the second jig 35 is inserted into the positioning hole 34 of the first jig 32.
  • the adsorption device 41 is transported to a predetermined position, the negative pressure action on the passages 42, 45, 46 is released, and the adsorption action by the adsorption device 41 is released.
  • the first jig 32 is placed on the metal circuit 13, and the solder sheet 33 is positioned in the positioning hole 34 of the first jig 32 so that the solder sheet 33 is metal. Mounted on circuit 13.
  • the negative pressure of the second vacuum pump 38b is applied to the passage 45 of the adsorption device 41, and the adsorption device 41 is moved to a position before transporting in a state where the second jig 35 is adsorbed by the adsorption device 41.
  • the negative pressure of the second vacuum pump 38b is applied to the passage 45 of the adsorption device 41 to cause the second jig 35 to be adsorbed to the adsorption device 41 and to the passage 42.
  • the negative pressure of the first vacuum pump 38a is applied to adsorb the semiconductor element 12 to each second jig 35.
  • the adsorption device 41 is transported to a predetermined position, the negative pressure action on the passages 42 and 45 is released, and the adsorption action by the adsorption device 41 is released.
  • the second jig 35 is inserted into the positioning hole 34 and the semiconductor element 12 is placed on the solder sheet 33.
  • the lid 19 is removed from the main body 18, and the suction device 41 is moved to a position corresponding to the semiconductor module 100. Thereafter, the negative pressure of the second vacuum pump 38b is applied to the passage 45 of the adsorption device 41, and the negative pressure of the third vacuum pump 38c is applied to the passage 46. As a result, the first jig 32 and the second jig 35 are adsorbed by the adsorption device 41. Then, after the first jig 32 and the second jig 35 are moved out of the container 17, the semiconductor module 100 is taken out.
  • the first jig 32 and the second jig are transported by the electromagnet instead of the suction device 41 as a transporting part (transporting device) for the first jig 32 and the second jig 35.
  • a magnetic circuit that can attract 35 may be used.
  • a magnetic material for example, iron
  • a magnetic material that can be attracted to the electromagnet is provided on the upper surfaces of the first jig 32 and the second jig 35.
  • a mechanical chuck mechanism may be used as a transport unit (transport device) for the first jig 32 and the second jig 35.
  • a locking member capable of locking the chuck mechanism is provided on the upper surfaces of the first jig 32 and the second jig 35.
  • the arrangement, size, and height of the semiconductor element 12 are not limited to those of the above embodiment.
  • the second jig 35 may be an integral part formed by projecting a plurality of pieces. It may consist of the split pieces joined together.
  • the size of the pressing surface 35a of the second jig 35 does not necessarily have to be a size capable of contacting the entire non-bonding surface of the corresponding semiconductor element 12.
  • the size of the pressing surface 35a may be larger or smaller than the non-bonding surface of the corresponding semiconductor element 12.
  • the outer shape of the solder sheet 33 may be the same as the outer shape of the semiconductor element 12.
  • the semiconductor element 1 is the same as the outer shape of the semiconductor element 12.
  • the second jig 35 is not limited to stainless steel but may be any material that can be induction heated.
  • stainless steel instead of stainless steel, it may be composed of iron, graphite, or two types of conductor materials having different thermal conductivities.
  • the heating method for heating the solder sheet 33 to the melting temperature or higher may be a method other than induction heating.
  • an electric heater may be provided in the container 17 to heat the solder sheet 33.
  • the circuit board 11 may have a configuration in which the ceramic substrate 14 is fixed to the heat sink 15 that does not have the refrigerant flow path 15a. Further, the circuit board 11 may be configured without the heat sink 15.
  • the lid 19 may be connected to the main body 18 so as to be detachable from the main body 18, for example, to be opened and closed.
  • the lid 19 may be formed of, for example, a ceramic resin instead of glass, where at least a portion facing the high-frequency heating coil 28 is preferably formed of an electrically insulating material. Further, the entire lid 19 may be formed of the same electrical insulating material.
  • the lid 19 is made of, for example, a composite material (GFRP (glass fiber reinforced Plastic)).
  • the lid 19 may be made of metal.
  • the metal is preferably a non-magnetic metal.
  • a magnetic metal is used for the lid 19, it is better to use a metal having a higher electrical resistivity than the second jig 35.
  • a ferromagnetic electromagnetic steel sheet or the like is preferably used immediately above the second jig 35.
  • the high-frequency heating coil 28 may be disposed above the plurality of second jigs 35 and straddling the plurality of second jigs 35. In this case, the number of high-frequency current supply paths and cooling water supply paths to the high-frequency heating coil 28 can be reduced, and the structure of the soldering apparatus HK can be further simplified.
  • the container 17 may be movable along with the production line, and the high-frequency heating coil 28 may be disposed along the movement path of the second jig 35 that moves together with the container 17.
  • the high frequency heating coil 28 may be formed in a shape along the moving path, or a plurality of high frequency heating coils 28 may be arranged along the moving path. With this configuration, the container 17 can be heated while being moved.
  • the high frequency heating coil 28 may be disposed so as to face the side surface of the second jig 35.
  • the high-frequency heating coil 28 may be disposed in the container 17 (sealed space S).

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  • Manufacturing & Machinery (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

Provided is an aligning jig to be used at the time of soldering a semiconductor element on a bonding portion arranged on a circuit board by using a solder sheet. The aligning jig is provided with a first jig and a second jig. The first jig is provided with an aligning hole which penetrates in the vertical direction. The positioning hole permits the semiconductor element and the solder sheet to be inserted into the hole. The first jig is arranged on the circuit board to have the aligning hole correspond to the bonding portion. The second jig can be inserted and removed into and from the aligning hole, and has a pressurizing plane which presses the semiconductor element arranged on the solder sheet toward the circuit board, in a status where the second jig is inserted into the aligning hole. When the second jig is inserted into the aligning hole, the second jig is aligned by a wall plane which forms the aligning hole so that the pressurizing plane is arranged at a position facing the bonding portion.

Description

明 細 書  Specification
位置決め治具、位置決め方法、半導体モジュールの製造方法及び半田 付け装置  Positioning jig, positioning method, semiconductor module manufacturing method, and soldering apparatus
技術分野  Technical field
[0001] 本発明は、回路基板に設けられた接合部に半田シートを介して半導体素子を半田 付けする際に用いられる位置決め治具、該位置決め治具を用いた位置決め方法、 半導体モジュールの製造方法及び半田付け装置に関する。  The present invention relates to a positioning jig used when soldering a semiconductor element to a joint provided on a circuit board via a solder sheet, a positioning method using the positioning jig, and a method for manufacturing a semiconductor module And a soldering apparatus.
背景技術  Background art
[0002] 回路基板に設けられた接合部、例えば、金属回路上に半導体素子 (電子部品）を 実装する場合、接合部と半導体素子とを半田を介して接合する方法が一般的である 。接合部と半導体素子とを半田付けする場合、半導体素子の周縁部を取り囲むよう に半田フィレットが形成される。前記回路基板と半導体素子とでは線膨張係数が異な るため、両者を接合する半田に温度変化に伴い熱応力が繰り返し発生したとき、該 半田にクラックが発生することがある。半田フィレットは、そのようなクラックの発生を抑 制する。  [0002] When a semiconductor element (electronic component) is mounted on a joint provided on a circuit board, for example, a metal circuit, a method of joining the joint and the semiconductor element via solder is generally used. When soldering the joint and the semiconductor element, a solder fillet is formed so as to surround the peripheral edge of the semiconductor element. Since the circuit board and the semiconductor element have different linear expansion coefficients, cracks may occur in the solder when the thermal stress is repeatedly generated in the solder that joins the circuit board as the temperature changes. The solder fillet suppresses the occurrence of such cracks.
[0003] 半導体素子の周縁部に形成された半田フィレットの表面は非常に滑らかで応力が 集中し難いので、前記熱応力が繰り返し発生しても、前記半田のクラック発生が好適 に抑制される。クラック発生が抑制されることによって熱が半田に集中し難くなり、過 度な温度上昇によって半田が破壊されることを防止することが可能となる。  [0003] Since the surface of the solder fillet formed at the peripheral edge of the semiconductor element is very smooth and stress does not concentrate, the occurrence of cracks in the solder is suitably suppressed even when the thermal stress is repeatedly generated. By suppressing the generation of cracks, it becomes difficult for heat to concentrate on the solder, and it is possible to prevent the solder from being destroyed by excessive temperature rise.
[0004] 特許文献 1には、プリント配線板（回路基板)のノッド上に電子部品であるチップ部 品を半田付けする際に、クリーム半田によって半田フィレットが形成されることが開示 されている。しかし、クリーム半田には、半田以外の成分であるフラックスなどが含有さ れているため、洗浄工程が必要となる。このため、半田付け作業の効率の向上の観 点から、固形状の半田シートを用いた半田付けの方が好ましい。  [0004] Patent Document 1 discloses that a solder fillet is formed by cream solder when a chip component, which is an electronic component, is soldered onto a printed wiring board (circuit board). However, cream solder contains flux, which is a component other than solder, and requires a cleaning process. For this reason, from the viewpoint of improving the efficiency of soldering work, soldering using a solid solder sheet is preferable.
[0005] 特許文献 2には、固形平板状の半田シートを用いて電子部品である半導体チップ を回路基板に半田付けする際に、前記半田シートによって半田フィレットが形成され ることが開示されている。特許文献 2において、半田付けの際には治具が用いられ、 その治具は、前記回路基板を保持可能な凹部を有する下治具と、前記半導体チップ を保持可能な貫通穴を有する上治具とを含んでいる。前記上治具の下面において 前記貫通穴の周囲には、隙間凹部が形成されている。 Patent Document 2 discloses that when a semiconductor chip as an electronic component is soldered to a circuit board using a solid flat solder sheet, a solder fillet is formed by the solder sheet. . In Patent Document 2, a jig is used for soldering, The jig includes a lower jig having a recess capable of holding the circuit board and an upper jig having a through hole capable of holding the semiconductor chip. On the lower surface of the upper jig, a gap recess is formed around the through hole.
[0006] 特許文献 2に開示された半田付け方法では、まず、下治具の凹部内に回路基板を 位置決めし、続いて、該回路基板上の所定位置に半田シートを載置する。次に、上 治具を下治具上に載置するとともに、上治具の貫通穴に半導体チップ挿入して該半 導体チップを半田シート上に載置する。回路基板と半導体チップとの間に半田シート が挟まれた状態で半田シートを加熱溶融させることによって、回路基板に半導体チッ プを半田付けする。このとき、溶融した半田が半導体チップの周縁部に濡れ拡がり、 半導体チップの周縁部に半田フィレットが形成される。  [0006] In the soldering method disclosed in Patent Document 2, the circuit board is first positioned in the recess of the lower jig, and then the solder sheet is placed at a predetermined position on the circuit board. Next, the upper jig is placed on the lower jig, and a semiconductor chip is inserted into the through hole of the upper jig and the semiconductor chip is placed on the solder sheet. The semiconductor chip is soldered to the circuit board by heating and melting the solder sheet with the solder sheet sandwiched between the circuit board and the semiconductor chip. At this time, the melted solder wets and spreads on the peripheral portion of the semiconductor chip, and a solder fillet is formed on the peripheral portion of the semiconductor chip.
[0007] 半導体チップは上治具の貫通穴の壁面によって位置決めされた状態で半田シート 上に配置される。前記上治具の貫通穴は、前記半導体チップの通過を許容し且つ該 半導体チップを半田シート上の所定位置に正確に位置決めする必要があるので、半 導体チップの外形より極わずかに大きく形成されている。したがって、半導体チップを 貫通穴に通過させるとき、半導体チップが貫通穴の壁面に干渉して、該半導体チッ プが半田シート上に確実に載置されないことがある（例えば、半導体チップが貫通穴 の壁面に引つかかって、半田シートにまで至らない)。このような場合、半田付けが確 実に行われ得ず、半田フィレットも確実に形成され得ない。  [0007] The semiconductor chip is placed on the solder sheet in a state of being positioned by the wall surface of the through hole of the upper jig. The through hole of the upper jig is formed to be slightly larger than the outer shape of the semiconductor chip because it is necessary to allow the semiconductor chip to pass through and to accurately position the semiconductor chip at a predetermined position on the solder sheet. ing. Therefore, when the semiconductor chip is passed through the through hole, the semiconductor chip may interfere with the wall surface of the through hole, and the semiconductor chip may not be securely placed on the solder sheet (for example, the semiconductor chip may be placed in the through hole). It gets stuck on the wall and does not reach the solder sheet). In such a case, soldering cannot be performed reliably, and solder fillets cannot be reliably formed.
[0008] そこで、上治具の貫通穴を大きくして、半導体チップを貫通穴に通過させるときに 該半導体チップが貫通穴の壁面に干渉するのを防止することが考えられる。しかしこ れは、半田シートに対する半導体チップの正確な位置決めを困難にする。よってこの 場合も、半田フィレットが半導体チップの周縁部に良好に形成され得ない。 [0008] Therefore, it is conceivable to enlarge the through hole of the upper jig to prevent the semiconductor chip from interfering with the wall surface of the through hole when the semiconductor chip is passed through the through hole. However, this makes it difficult to accurately position the semiconductor chip with respect to the solder sheet. Therefore, also in this case, the solder fillet cannot be satisfactorily formed on the peripheral portion of the semiconductor chip.
特許文献 1：特開平 5— 37144号公報  Patent Document 1: Japanese Patent Laid-Open No. 5-37144
特許文献 2：特開平 6 - 21110号公報  Patent Document 2: JP-A-6-21110
発明の開示  Disclosure of the invention
[0009] 本発明の目的は、半導体素子を回路基板の接合部に良好に半田付けすることが できるとともに、良好な半田フィレットの形成を可能とする位置決め治具及び位置決 め方法を提供することにある。また、本発明の目的は、半導体素子を回路基板の接 合部に良好に半田付けすることができるとともに、良好な半田フィレットの形成を可能 とする半導体モジュールの製造方法及び半田付け装置を提供することにある。 [0009] An object of the present invention is to provide a positioning jig and a positioning method capable of satisfactorily soldering a semiconductor element to a joint portion of a circuit board and forming a good solder fillet. It is in. Another object of the present invention is to attach a semiconductor element to a circuit board. An object of the present invention is to provide a method of manufacturing a semiconductor module and a soldering apparatus that can satisfactorily solder to a joint and can form a good solder fillet.
[0010] 上記の目的を達成するため、本発明の一態様では、回路基板上に設けられた接合 部に半田シートを用いて半導体素子を半田付けする際に用いられる位置決め治具 が提供される。該位置決め治具は、第 1の治具と第 2の治具とを備える。第 1の治具 は、上下方向に貫通する位置決め孔を有する。位置決め孔は、前記半導体素子及 び半田シートの挿入を許容する。第 1の治具は、前記位置決め孔が前記接合部に対 応するように回路基板に対して配置される。第 2の治具は、前記位置決め孔に揷脱 可能であり、前記位置決め孔内に挿入された状態において前記半田シート上に配置 された前記半導体素子を前記回路基板へ向けて押圧する加圧面を有する。第 2の 治具は、位置決め孔に挿入されたとき、加圧面が接合部と対向する位置に配置され るように、位置決め孔を形成する壁面によって位置決めされる。  In order to achieve the above object, according to one aspect of the present invention, there is provided a positioning jig used when soldering a semiconductor element using a solder sheet to a joint provided on a circuit board. . The positioning jig includes a first jig and a second jig. The first jig has a positioning hole penetrating in the vertical direction. The positioning hole allows the semiconductor element and the solder sheet to be inserted. The first jig is arranged with respect to the circuit board so that the positioning hole corresponds to the joint. The second jig can be removed from the positioning hole, and a pressure surface that presses the semiconductor element disposed on the solder sheet toward the circuit board in a state of being inserted into the positioning hole. Have. When the second jig is inserted into the positioning hole, the second jig is positioned by the wall surface forming the positioning hole so that the pressing surface is disposed at a position facing the joint portion.
[0011] また、本発明の別の態様では、回路基板上に設けられた接合部に半田シートを用 いて半導体素子を半田付けする際に、該回路基板に対して半田シート及び半導体 素子を位置決めするための位置決め方法が提供される。該位置決め方法は、第 1の 治具と第 2の治具とを備える位置決め治具を準備することであって、前記第 1の治具 は上下方向に貫通する位置決め孔を有し、前記第 2の治具は前記位置決め孔に揷 脱可能であるとともに加圧面を有することと、前記位置決め孔が前記接合部に対応 するように、前記第 1の治具を前記回路基板に対して配置することと、前記加圧面に 半田シートを配置した状態で前記位置決め孔に前記第 2の治具を挿入することであ つて、前記加圧面が前記接合部に対向するように前記位置決め孔の壁面によって第 2の治具が位置決めされ、それによつて半田シートが接合部に対して位置決めされる ことと、前記加圧面に半導体素子を配置した状態で前記位置決め孔に前記第 2の治 具を挿入することであって、前記加圧面が前記半田シートに対向するように前記位置 決め孔の壁面によって第 2の治具が位置決めされ、それによつて半導体素子が半田 シートに対して位置決めされることとを備える。 [0011] Further, in another aspect of the present invention, when soldering a semiconductor element using a solder sheet to a joint provided on the circuit board, the solder sheet and the semiconductor element are positioned with respect to the circuit board. A positioning method is provided. The positioning method is to prepare a positioning jig including a first jig and a second jig, and the first jig has a positioning hole penetrating in the vertical direction, and the first jig The jig of 2 is detachable from the positioning hole and has a pressure surface, and the first jig is arranged with respect to the circuit board so that the positioning hole corresponds to the joint. And inserting the second jig into the positioning hole in a state where the solder sheet is disposed on the pressing surface, and the wall surface of the positioning hole so that the pressing surface is opposed to the joint portion. The second jig is positioned, whereby the solder sheet is positioned with respect to the joint, and the second jig is inserted into the positioning hole in a state where the semiconductor element is disposed on the pressing surface. The pressure surface is the solder Over preparative second jig is positioned by the wall surface of the positioning hole so as to face the, it'll connexion semiconductor element and a that is positioned with respect to the solder sheet.
[0012] 本発明のさらなる態様では、回路基板と、該回路基板上に設けられた接合部に半 田シートを用いて半田付けされる半導体素子とを備える半導体モジュールの製造方 法が提供される。該半導体モジュールの製造方法は、第 1の治具と第 2の治具とを備 える位置決め治具を準備することであって、前記第 1の治具は上下方向に貫通する 位置決め孔を有し、前記第 2の治具は前記位置決め孔に揷脱可能であるとともに加 圧面を有することと、前記位置決め孔が前記接合部に対応するように、前記第 1の治 具を前記回路基板に対して配置することと、前記加圧面に半田シートを配置した状 態で前記位置決め孔に前記第 2の治具を挿入することであって、前記加圧面が前記 接合部に対向するように前記位置決め孔の壁面によって第 2の治具が位置決めされ 、それによつて半田シートが接合部に対して位置決めされることと、前記加圧面に前 記半導体素子を配置した状態で前記位置決め孔に前記第 2の治具を挿入すること であって、前記加圧面が前記半田シートに対向するように前記位置決め孔の壁面に よって第 2の治具が位置決めされ、それによつて半導体素子が半田シートに対して位 置決めされることと、前記位置決め孔に挿入された第 2の治具の加圧面によって前記 半導体素子を前記回路基板へ向けて押圧した状態で前記半田シートを加熱及び溶 融し、それによつて半導体素子を接合部に半田付けすることとを備える。 [0012] In a further aspect of the present invention, a method for manufacturing a semiconductor module comprising a circuit board and a semiconductor element soldered to a joint provided on the circuit board using a solder sheet Law is provided. The semiconductor module manufacturing method includes preparing a positioning jig including a first jig and a second jig, and the first jig has a positioning hole penetrating in the vertical direction. The second jig is detachable from the positioning hole and has a pressing surface, and the first jig is attached to the circuit board so that the positioning hole corresponds to the joint. The second jig is inserted into the positioning hole in a state in which a solder sheet is disposed on the pressing surface, and the pressing surface faces the joint. The second jig is positioned by the wall surface of the positioning hole, whereby the solder sheet is positioned with respect to the joint, and the semiconductor element is disposed on the pressing surface, and the second jig is positioned in the positioning hole. Insert the 2 jig, The second jig is positioned by the wall surface of the positioning hole so that the pressing surface faces the solder sheet, thereby positioning the semiconductor element with respect to the solder sheet, and the positioning hole The solder sheet is heated and melted in a state where the semiconductor element is pressed toward the circuit board by the pressure surface of the second jig inserted in the semiconductor device, and thereby the semiconductor element is soldered to the joint. With.
[0013] 本発明のさらなる別の態様では、回路基板に設けられた接合部に半田シートを用 いて半導体素子を半田付けする半田付け装置が提供される。該半田付け装置は、 第 1の治具、第 2の治具及び運搬部を備える。第 1の治具は、上下方向に貫通する位 置決め孔を有する。位置決め孔は前記半導体素子及び前記半田シートの挿入を許 容し、第 1の治具は前記位置決め孔が前記接合部に対応するように前記回路基板に 対して配置される。第 2の治具は位置決め孔に揷脱可能である。第 2の治具は、前記 位置決め孔内に挿入された状態にお 、て前記半田シート上に配置された前記半導 体素子を前記回路基板へ向けて押圧する加圧面を有する。第 2の治具は、位置決め 孔に挿入されたとき、前記加圧面が前記接合部と対向する位置に配置されるように、 位置決め孔を形成する壁面によって位置決めされる。運搬部は、第 1の治具及び前 記第 2の治具のうち少なくとも第 2の治具を運搬可能である。 [0013] In still another aspect of the present invention, a soldering apparatus is provided for soldering a semiconductor element using a solder sheet at a joint provided on a circuit board. The soldering apparatus includes a first jig, a second jig, and a transport unit. The first jig has a positioning hole penetrating in the vertical direction. The positioning hole allows the semiconductor element and the solder sheet to be inserted, and the first jig is disposed on the circuit board so that the positioning hole corresponds to the joint portion. The second jig can be removed from the positioning hole. The second jig has a pressing surface that presses the semiconductor element disposed on the solder sheet toward the circuit board while being inserted into the positioning hole. When the second jig is inserted into the positioning hole, the second jig is positioned by the wall surface forming the positioning hole so that the pressing surface is disposed at a position facing the joint portion. The transport unit can transport at least the second jig among the first jig and the second jig.
図面の簡単な説明  Brief Description of Drawings
[0014] [図 1]1枚のセラミック基板を備えた本発明における半導体モジュールの平面図。  FIG. 1 is a plan view of a semiconductor module according to the present invention provided with one ceramic substrate.
[図 2]図 1の 2— 2線に沿った断面図。 [図 3]複数枚のセラミック基板を備えた本発明における半導体モジュールの平面図。 圆 4] (a)は半田付けに際して使用される第 1の冶具の平面図、 (b)は半田付けに際 して使用される第 2の治具の斜視図。 FIG. 2 is a cross-sectional view taken along line 2-2 in FIG. FIG. 3 is a plan view of a semiconductor module according to the present invention including a plurality of ceramic substrates. 4] (a) is a plan view of a first jig used for soldering, and (b) is a perspective view of a second jig used for soldering.
[図 5]第 1実施形態に係る図 3の半田付け装置の概略縦断面図。  FIG. 5 is a schematic longitudinal sectional view of the soldering apparatus of FIG. 3 according to the first embodiment.
[図 6]図 5の半田付け装置における第 1の治具及び第 2の治具を含む部分の断面図。  6 is a cross-sectional view of a portion including the first jig and the second jig in the soldering apparatus of FIG.
[図 7]第 2の治具の加圧面を示す平面図。  FIG. 7 is a plan view showing a pressing surface of a second jig.
[図 8]半導体素子の周縁部に形成された半田フィレットを示す部分断面図。  FIG. 8 is a partial cross-sectional view showing a solder fillet formed on a peripheral portion of a semiconductor element.
[図 9]第 2実施形態に係る半田付け装置の部分断面図。  FIG. 9 is a partial cross-sectional view of a soldering apparatus according to a second embodiment.
[図 10]別の実施形態に係る半田付け装置の概略縦断面図。  FIG. 10 is a schematic longitudinal sectional view of a soldering apparatus according to another embodiment.
[図 11]別の実施形態に係る半田付け装置の概略縦断面図。  FIG. 11 is a schematic longitudinal sectional view of a soldering apparatus according to another embodiment.
[図 12]別の実施形態に係る半田付け装置の概略縦断面図。  FIG. 12 is a schematic longitudinal sectional view of a soldering apparatus according to another embodiment.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0015] 以下、本発明を具体ィ匕した第 1実施形態を図 1〜図 8にしたがって説明する。  Hereinafter, a first embodiment embodying the present invention will be described with reference to FIGS.
図 1及び図 2は、半導体モジュール 10を示している。半導体モジュール 10は、回路 基板 11と、 4個の半導体素子 12とを備えている。 4個の半導体素子 12は、回路基板 11上に半田付けによって接合されている。回路基板 11は、表面に金属回路 13を有 するセラミック基板 14と、前記セラミック基板 14に金属板 16を介して固定された金属 製のヒートシンク 15とを含む。つまり、回路基板 11は、ヒートシンク 15を備えた冷却回 路基板である。ヒートシンク 15はアルミニウム系金属や銅等で形成されており、冷却 媒体が流れる冷媒流路 15aを備えている。アルミニウム系金属とはアルミニウム又は アルミニウム合金を意味する。金属板 16は、セラミック基板 14とヒートシンク 15とを接 合する接合層として機能し、例えば、アルミニウムや銅などで形成されている。  1 and 2 show the semiconductor module 10. The semiconductor module 10 includes a circuit board 11 and four semiconductor elements 12. The four semiconductor elements 12 are joined to the circuit board 11 by soldering. The circuit board 11 includes a ceramic substrate 14 having a metal circuit 13 on the surface, and a metal heat sink 15 fixed to the ceramic substrate 14 via a metal plate 16. That is, the circuit board 11 is a cooling circuit board including the heat sink 15. The heat sink 15 is formed of an aluminum-based metal, copper, or the like, and includes a refrigerant channel 15a through which a cooling medium flows. Aluminum metal means aluminum or aluminum alloy. The metal plate 16 functions as a bonding layer for bonding the ceramic substrate 14 and the heat sink 15 and is made of, for example, aluminum or copper.
[0016] 金属回路 13は、例えば、アルミニウムや銅等で形成されている。セラミック絶縁体と してのセラミック基板 14は、例えば、窒化アルミニウム、アルミナ、窒化ケィ素等により 开成されている。半導体素子 12としては、例えば、 IGBT (Insulated Gate Bipolar Tra nsistor)やダイオード等の電子部品が用いられて 、る。  [0016] The metal circuit 13 is made of, for example, aluminum or copper. The ceramic substrate 14 as a ceramic insulator is made of, for example, aluminum nitride, alumina, silicon nitride, or the like. As the semiconductor element 12, for example, an electronic component such as an IGBT (Insulated Gate Bipolar Transistor) or a diode is used.
[0017] 各半導体素子 12は、金属回路 13に接合 (半田付け)されている。金属回路 13は半 導体素子 12を回路基板 11上に接合するための接合部を構成する。各半導体素子 1 2は、半田層 Hによって金属回路 13に接合している。前記半田層 Hは四角板状をな す半田シート 33 (図 5参照）を用 、て形成されて!、る。半導体素子 12の周縁部 12a には、その全周に亘り、半田層 Hの一部である半田フィレット Fが形成されている。半 田層 Hを上下方向へ切断した際の半田フィレット Fの断面形状は、半田層 Hの上から 下へ向かうに従 、円弧状に滑らかに反るようになって 、る。 Each semiconductor element 12 is joined (soldered) to a metal circuit 13. The metal circuit 13 constitutes a joint for joining the semiconductor element 12 onto the circuit board 11. Each semiconductor element 1 2 is bonded to the metal circuit 13 by the solder layer H. The solder layer H is formed by using a square sheet of solder sheet 33 (see FIG. 5). A solder fillet F, which is a part of the solder layer H, is formed on the peripheral edge 12a of the semiconductor element 12 over the entire circumference. The cross-sectional shape of the solder fillet F when the solder layer H is cut in the vertical direction is smoothly curved in an arc shape from the top to the bottom of the solder layer H.
[0018] 半導体モジュール 10は、回路基板 11として表面に金属回路 13を有する 1枚のセラ ミック基板 14を金属製で冷媒流路 15aを備えたヒートシンク 15と一体ィ匕した構成のも のに限らない。例えば、図 3に示すように、回路基板 11として表面に金属回路 13を 有する複数 (この実施形態では 6枚)のセラミック基板 14を金属製で冷媒流路 15aを 備えたヒートシンク 15と一体ィ匕した冷却回路基板を備えた半導体モジュール 100で あってもよい。半導体モジュール 100は、各セラミック基板 14上にそれぞれ 4個、全 体で 24個の半導体素子 12が半田付けされている。  [0018] The semiconductor module 10 is not limited to a configuration in which a single ceramic substrate 14 having a metal circuit 13 on its surface as a circuit substrate 11 is integrated with a heat sink 15 made of metal and provided with a refrigerant flow path 15a. Absent. For example, as shown in FIG. 3, a plurality of (six in this embodiment) ceramic substrates 14 having a metal circuit 13 on the surface as a circuit substrate 11 are integrally formed with a heat sink 15 made of metal and provided with a refrigerant flow path 15a. The semiconductor module 100 may be provided with the cooling circuit board. In the semiconductor module 100, four semiconductor elements 12 are soldered on each ceramic substrate 14, respectively.
[0019] 図 5は、半田付け装置 HKの構成を概略的に示している。半田付け装置 HKは、回 路基板 11の金属回路 13に半導体素子 12を半田付けするための装置として構成さ れている。また、この実施形態の半田付け装置 HKは、図 3に示す半導体モジュール 100、すなわち、ヒートシンク 15上に複数 (6枚)のセラミック基板 14を備えた半導体 モジュール 100のための半田付け装置として構成されている。  FIG. 5 schematically shows the configuration of the soldering apparatus HK. The soldering device HK is configured as a device for soldering the semiconductor element 12 to the metal circuit 13 of the circuit board 11. Further, the soldering apparatus HK of this embodiment is configured as a soldering apparatus for the semiconductor module 100 shown in FIG. 3, that is, the semiconductor module 100 including a plurality (six) ceramic substrates 14 on the heat sink 15. ing.
[0020] 図 5に示すように、半田付け装置 HKは、密閉可能な容器 (チャンバ） 17を備え、当 該容器 17は開口部 18aを有する箱型の本体 18と、当該本体 18の開口部 18aを開 放及び閉鎖する蓋体 19とを含む。本体 18には、半導体モジュール 100を位置決め 且つ支持する支持台 20が設置されている。また、本体 18の開口縁部には、蓋体 19 と密着し得るパッキン 21が配設されている。  As shown in FIG. 5, the soldering apparatus HK includes a container (chamber) 17 that can be sealed, and the container 17 has a box-shaped main body 18 having an opening 18a, and an opening of the main body 18. And a lid 19 for opening and closing 18a. The main body 18 is provided with a support base 20 that positions and supports the semiconductor module 100. A packing 21 that can be in close contact with the lid 19 is provided at the opening edge of the main body 18.
[0021] 蓋体 19は、本体 18の開口部 18aを閉鎖可能な大きさで形成されている。本体 18 に蓋体 19を装着することにより、容器 17内には密閉空間 Sが形成される。また、蓋体 19は、密閉空間 Sと対向する部位 22を有し、当該部位 22は、磁力線 (磁束)を通す 電気的絶縁材で形成されている。この実施形態では、電気的絶縁材としてガラスが 用いられており、蓋体 19の当該部位 22はガラス板よりなる。  The lid body 19 is formed in a size that can close the opening 18 a of the main body 18. By attaching the lid 19 to the main body 18, a sealed space S is formed in the container 17. The lid body 19 has a portion 22 that faces the sealed space S, and the portion 22 is formed of an electrically insulating material that passes magnetic lines of force (magnetic flux). In this embodiment, glass is used as the electrical insulating material, and the portion 22 of the lid 19 is made of a glass plate.
[0022] また、本体 18には、容器 17内に還元性ガス (この実施形態では水素）を供給する ための還元ガス供給部 23が接続されている。還元ガス供給部 23は、配管 23aと、当 該配管 23aに設けられた開閉バルブ 23bと、水素タンク 23cとを備えている。また、本 体 18には、容器 17内に不活性ガス (この実施形態では窒素）を供給するための不活 性ガス供給部 24が接続されている。不活性ガス供給部 24は、配管 24aと、当該配管 24aに設けられた開閉バルブ 24bと、窒素タンク 24cとを備えている。また、本体 18に は、容器 17内に充満したガスを外部に排出するためのガス排出部 25が接続されて いる。ガス排出部 25は、配管 25aと、当該配管 25aに設けられた開閉バルブ 25bと、 真空ポンプ 25cとを備えている。半田付け装置 HKは、還元ガス供給部 23、不活性 ガス供給部 24及びガス排出部 25を備えることにより、密閉空間 S内の圧力を調整可 能に構成されており、密閉空間 Sは、圧力調整によって加圧されたり、減圧されたりす る。 [0022] The main body 18 is supplied with a reducing gas (hydrogen in this embodiment) into the container 17. For this purpose, a reducing gas supply unit 23 is connected. The reducing gas supply unit 23 includes a pipe 23a, an open / close valve 23b provided in the pipe 23a, and a hydrogen tank 23c. Further, an inert gas supply unit 24 for supplying an inert gas (nitrogen in this embodiment) into the container 17 is connected to the main body 18. The inert gas supply unit 24 includes a pipe 24a, an open / close valve 24b provided in the pipe 24a, and a nitrogen tank 24c. The main body 18 is connected to a gas discharge section 25 for discharging the gas filled in the container 17 to the outside. The gas discharge unit 25 includes a pipe 25a, an open / close valve 25b provided in the pipe 25a, and a vacuum pump 25c. The soldering device HK includes a reducing gas supply unit 23, an inert gas supply unit 24, and a gas discharge unit 25 so that the pressure in the sealed space S can be adjusted. Pressurized or depressurized by adjustment.
[0023] また、本体 18には、半田付け後に容器 17内に熱媒体 (冷却用ガス）を供給するた めの熱媒供給部 26が接続されている。熱媒供給部 26は、配管 26aと、当該配管 26a に設けられた開閉バルブ 26bと、ガスタンク 26cとを備えている。熱媒供給部 26は、 容器 17内に収容した半導体モジュール 100のヒートシンク 15に対し、冷却用ガスを 供給する。なお、熱媒供給部 26から供給される熱媒体は冷却液でもよい。また、本 体 18には、容器 17内の温度を計測するための温度センサ (例えば、熱電対など） 27 が設置されている。  [0023] The main body 18 is connected to a heat medium supply unit 26 for supplying a heat medium (cooling gas) into the container 17 after soldering. The heat medium supply unit 26 includes a pipe 26a, an open / close valve 26b provided in the pipe 26a, and a gas tank 26c. The heat medium supply unit 26 supplies a cooling gas to the heat sink 15 of the semiconductor module 100 accommodated in the container 17. Note that the heat medium supplied from the heat medium supply unit 26 may be a coolant. The main body 18 is provided with a temperature sensor (for example, a thermocouple) 27 for measuring the temperature inside the container 17.
[0024] 半田付け装置 HKの上部、具体的には蓋体 19の上方には、複数の高周波加熱コ ィル 28が設置されている。この実施形態の半田付け装置 HKは、 6つの高周波加熱 コイル 28を有している。 6つの高周波加熱コイル 28は、 6枚のセラミック基板 14に各 別に対応するように、セラミック基板 14の上方にそれぞれ配置されている。この実施 形態では、上方力も見たときに、 1枚のセラミック基板 14を覆うことのできる大きさを有 し、且つ後述する第 2の治具 35の上面の輪郭よりも大きい。また、各高周波加熱コィ ル 28は、一平面内で渦巻き状 (角形渦巻き状)をなすように形成され、全体としてほ ぼ四角板状をなしている。また、各高周波加熱コイル 28は、蓋体 19に対向するよう に、具体的には、ガラス板 22に対向するように配置されている。また、各高周波加熱 コイル 28は、半田付け装置 HKが備える高周波発生装置 29に電気的に接続され、 容器 17内に設置された温度センサ 27の計測結果に基づき、高周波発生装置 29の 出力が制御される。各高周波加熱コイル 28は、内部に冷却水を通すための冷却路 3 0を有するとともに、半田付け装置 HKに備えられた冷却水タンク 31に接続されてい る。 A plurality of high-frequency heating coils 28 are installed above the soldering device HK, specifically above the lid 19. The soldering apparatus HK of this embodiment has six high-frequency heating coils 28. The six high-frequency heating coils 28 are respectively arranged above the ceramic substrate 14 so as to correspond to the six ceramic substrates 14 respectively. In this embodiment, when the upward force is also seen, it has a size that can cover one ceramic substrate 14 and is larger than the contour of the upper surface of the second jig 35 described later. Each high-frequency heating coil 28 is formed to have a spiral shape (rectangular spiral shape) in one plane, and has a substantially square plate shape as a whole. Each high-frequency heating coil 28 is disposed so as to face the lid 19, specifically, to face the glass plate 22. Each high-frequency heating coil 28 is electrically connected to a high-frequency generator 29 provided in the soldering device HK, Based on the measurement result of the temperature sensor 27 installed in the container 17, the output of the high-frequency generator 29 is controlled. Each high-frequency heating coil 28 has a cooling passage 30 for passing cooling water therein, and is connected to a cooling water tank 31 provided in the soldering apparatus HK.
[0025] 上記半田付け装置 HKは、半田付けを行う際に、半導体素子 12及び半田シート 33 を位置決めする位置決め治具 IKを備えている。位置決め治具 IKは、図 4 (a)に示す 第 1の治具 32と、図 4 (b)に示す第 2の治具 35とを含む。第 1の治具 32は、平板状に 形成され、回路基板 11におけるセラミック基板 14と同一の大きさを有する。第 1の治 具 32は、例えば、グラフアイトやセラミックスなどの材料で形成されている。第 1の治具 32は、図 5に示すように、半田付け時において前記回路基板 11上に載置され、半田 シート 33をセラミック基板 14の金属回路 13 (接合部）上の所定位置に位置決めする とともに、前記第 2の治具 35の加圧面 35aを前記金属回路 13と対向する所定位置に 位置決めするために使用される。前記半田シート 33は四角板状をなし、前記半導体 素子 12の外形より大きい外形を有する。すなわち、半田シート 33は、該半田シート 3 3上に半導体素子 12を載置したとき、半田シート 33の周縁部 33aが半導体素子 12 の周縁部 12aよりも外方へ突出する。  The soldering apparatus HK includes a positioning jig IK that positions the semiconductor element 12 and the solder sheet 33 when performing soldering. The positioning jig IK includes a first jig 32 shown in FIG. 4 (a) and a second jig 35 shown in FIG. 4 (b). The first jig 32 is formed in a flat plate shape and has the same size as the ceramic substrate 14 in the circuit board 11. The first jig 32 is made of a material such as graphite or ceramics, for example. As shown in FIG. 5, the first jig 32 is placed on the circuit board 11 during soldering, and the solder sheet 33 is positioned at a predetermined position on the metal circuit 13 (joint portion) of the ceramic board 14. At the same time, it is used to position the pressing surface 35a of the second jig 35 at a predetermined position facing the metal circuit 13. The solder sheet 33 has a square plate shape and has an outer shape larger than the outer shape of the semiconductor element 12. That is, in the solder sheet 33, when the semiconductor element 12 is placed on the solder sheet 33, the peripheral portion 33a of the solder sheet 33 protrudes outward from the peripheral portion 12a of the semiconductor element 12.
[0026] また、図 4 (a)に示すように、第 1の治具 32には、該第 1の治具 32を上下方向へ貫 通する複数 (この実施形態では 4つ）の位置決め孔 34が形成されて ヽる。各位置決 め孔 34は、第 1の治具 32が回路基板 11上に載置された状態では、セラミック基板 1 4における金属回路 13 (接合部）と対応する位置に配置される。すなわち、第 1の治 具 32を回路基板 11上に載置した状態において、各位置決め孔 34を通じて金属回 路 13が上側に露出する。各位置決め孔 34は、前記半田シート 33及び半導体素子 1 2の挿入を許容するように、半田シート 33及び半導体素子 12の外形よりも大きく形成 されている。  [0026] As shown in FIG. 4 (a), the first jig 32 has a plurality of (four in this embodiment) positioning holes that penetrate the first jig 32 in the vertical direction. 34 is formed. Each positioning hole 34 is disposed at a position corresponding to the metal circuit 13 (joint portion) in the ceramic substrate 14 in a state where the first jig 32 is placed on the circuit substrate 11. That is, in a state where the first jig 32 is placed on the circuit board 11, the metal circuit 13 is exposed to the upper side through each positioning hole 34. Each positioning hole 34 is formed larger than the outer shape of the solder sheet 33 and the semiconductor element 12 so as to allow the insertion of the solder sheet 33 and the semiconductor element 12.
[0027] 特に、半田シート 33は、回路基板 11と平行で且つその周縁部 33aが位置決め孔 3 4の壁面 34aに対向する状態で、位置決め孔 34に挿入され得る。図 6に示すように、 各位置決め孔 34内に半田シート 33が挿入された状態では、各位置決め孔 34の壁 面 34aと、半田シート 33の全周に亘る周縁部 33aとの間には僅かな隙間 Nが形成さ れる。すなわち、位置決め孔 34内に半田シート 33が挿入されて金属回路 13上に載 置された状態では、該半田シート 33は位置決め孔 34の壁面 34aによって金属回路 1 3上の所定位置に位置決めされる。なお、半田シート 33が金属回路 13上の所定位 置に位置決めされた状態では、半田シート 33の下面全面が金属回路 13に接してい る。 In particular, the solder sheet 33 can be inserted into the positioning hole 34 in a state in which the solder sheet 33 is parallel to the circuit board 11 and its peripheral edge 33a faces the wall surface 34a of the positioning hole 34. As shown in FIG. 6, in the state where the solder sheet 33 is inserted into each positioning hole 34, there is a slight gap between the wall surface 34a of each positioning hole 34 and the peripheral edge 33a over the entire circumference of the solder sheet 33. Gap N is formed It is. That is, when the solder sheet 33 is inserted into the positioning hole 34 and placed on the metal circuit 13, the solder sheet 33 is positioned at a predetermined position on the metal circuit 13 by the wall surface 34a of the positioning hole 34. . When the solder sheet 33 is positioned at a predetermined position on the metal circuit 13, the entire lower surface of the solder sheet 33 is in contact with the metal circuit 13.
[0028] 各位置決め孔 34内に半導体素子 12が挿入され、且つ該半導体素子 12が半田シ ート 33の所定位置に配置された状態では、位置決め孔 34の壁面 34aと、該壁面 34 aに対向する半導体素子 12の周縁部 12aとの間には隙間 Mが形成される。なお、半 導体素子 12が半田シート 33上の所定位置に配置された状態では、半田シート 33の 周縁部 33aが半導体素子 12の周縁部 12aよりも外方へ突出している。前記隙間 Mは 、半田シート 33の周縁部 33aと位置決め孔 34の壁面 34aとの間の隙間 Nより広い。 また、隙間 Mは、前記半田シート 33の厚さ寸法 Dよりも大きい。前記隙間 Mは、半導 体素子 12の周囲全体に亘つて形成され、半導体素子 12の周囲における 、ずれの 位置でも、半田シート 33の厚さ寸法 Dより大きい。なお、半導体素子 12の周縁部 12 aに半田フィレット Fを形成するためには、前記隙間 Mが半田シート 33の厚さ寸法 D の少なくとも 1Z2となって!/、ればよ!/、。  [0028] In a state where the semiconductor element 12 is inserted into each positioning hole 34 and the semiconductor element 12 is disposed at a predetermined position of the solder sheet 33, the wall surface 34a of the positioning hole 34 and the wall surface 34a A gap M is formed between the opposing peripheral edge 12a of the semiconductor element 12. In the state where the semiconductor element 12 is disposed at a predetermined position on the solder sheet 33, the peripheral portion 33 a of the solder sheet 33 protrudes outward from the peripheral portion 12 a of the semiconductor element 12. The gap M is wider than the gap N between the peripheral edge portion 33a of the solder sheet 33 and the wall surface 34a of the positioning hole 34. Further, the gap M is larger than the thickness dimension D of the solder sheet 33. The gap M is formed over the entire periphery of the semiconductor element 12, and is larger than the thickness dimension D of the solder sheet 33 even at a shift position around the semiconductor element 12. In order to form the solder fillet F on the peripheral edge 12a of the semiconductor element 12, the gap M becomes at least 1Z2 of the thickness dimension D of the solder sheet 33! /.
[0029] 図 4 (b)に示すように、第 2の治具 35は、電磁誘導作用によって発熱し得る材料、 即ち自身を通る磁束の変化により電流が発生したときに自身の電気抵抗に起因して 発熱する材料を用いて形成されている。本実施形態の第 2の治具 35は、ステンレス で形成されている。第 2の治具 35は、半田付け時において前記半田シート 33上に載 置された半導体素子 12の直上において当該半導体素子 12の上面である非接合面 に接し得るように形成されて ヽる。  [0029] As shown in FIG. 4 (b), the second jig 35 is made of a material that can generate heat by electromagnetic induction, that is, due to its own electrical resistance when a current is generated by a change in magnetic flux passing through itself. It is formed using a material that generates heat. The second jig 35 of this embodiment is made of stainless steel. The second jig 35 is formed so as to be in contact with a non-joint surface which is the upper surface of the semiconductor element 12 immediately above the semiconductor element 12 placed on the solder sheet 33 at the time of soldering.
[0030] 本実施形態においては、図 4 (a)及び図 4 (b)に示すように、第 2の治具 35は、半田 付け時において 4つの半導体素子 12と当接する下面側において、それら 4つの半導 体素子 12の配置と対応する形状を有する加圧面を備えている。本実施形態におい ては、第 2の治具 35は、第 1の治具 32の 4つの位置決め孔 34にそれぞれ挿入可能 な形状を有する 4つの加圧面 35aを有し、それら加圧面 35aは対応する半導体素子 12にそれぞれ当接可能である。また、位置決め孔 34の壁面 34aは、第 2の治具 35 の位置決め孔 34内への挿入時には、加圧面 35aが金属回路 13と対向する位置に 配置されるように第 2の治具 35を位置決め及びガイドするようになっている。また、図 6に示すように、各加圧面 35aは、凹むように形成されており、加圧面 35aの内側に半 導体素子 12が配置された状態では、半導体素子 12の移動が抑制される。 In the present embodiment, as shown in FIG. 4 (a) and FIG. 4 (b), the second jig 35 is disposed on the lower surface side in contact with the four semiconductor elements 12 during soldering. A pressing surface having a shape corresponding to the arrangement of the four semiconductor elements 12 is provided. In the present embodiment, the second jig 35 has four pressing surfaces 35a each having a shape that can be inserted into the four positioning holes 34 of the first jig 32, and these pressing surfaces 35a correspond to each other. Each of the semiconductor elements 12 can be brought into contact with each other. Further, the wall surface 34a of the positioning hole 34 is provided with a second jig 35. At the time of insertion into the positioning hole 34, the second jig 35 is positioned and guided so that the pressing surface 35a is disposed at a position facing the metal circuit 13. Further, as shown in FIG. 6, each pressing surface 35a is formed to be recessed, and movement of the semiconductor element 12 is suppressed in a state where the semiconductor element 12 is disposed inside the pressing surface 35a.
[0031] 図 5〜図 7に示すように、第 2の治具 35は、 4つの加圧面 35aにそれぞれ対応する 複数の通路 37を有しており、各通路 37は対応する加圧面 35aに開く開口 37aを有し ている。各通路 37は、前記半導体素子 12又は半田シート 33を吸着すべく開口 37a を通じて加圧面 35aに対して負圧を作用させることが可能である。各通路 37は、第 2 の治具 35を上下方向に貫通するように延びている。また、図 7に示すように、各加圧 面 35aには前記通路 37の開口 37aに連通する連通溝 35cが複数形成されている。 図 5に示すように、第 2の治具 35の上方には、吸着装置 41が配設されている。吸着 装置 41の下面 41aには、第 2の治具 35の複数の通路 37にそれぞれ対応するゴム材 料製の複数のシール部材 43が配設されている。また、吸着装置 41内には通路 42が 形成され、該通路 42は垂直に延びる 4つの部分を備えており、それらの部分の下端 が前記シール部材 43において下方に向けて開放された開口 42aを形成している。  [0031] As shown in Figs. 5 to 7, the second jig 35 has a plurality of passages 37 corresponding to the four pressure surfaces 35a, and each passage 37 corresponds to the corresponding pressure surface 35a. It has an opening 37a that opens. Each passage 37 can apply a negative pressure to the pressing surface 35a through the opening 37a so as to adsorb the semiconductor element 12 or the solder sheet 33. Each passage 37 extends so as to penetrate the second jig 35 in the vertical direction. Further, as shown in FIG. 7, a plurality of communication grooves 35c communicating with the openings 37a of the passage 37 are formed in each pressure surface 35a. As shown in FIG. 5, a suction device 41 is disposed above the second jig 35. A plurality of seal members 43 made of rubber material corresponding to the plurality of passages 37 of the second jig 35 are disposed on the lower surface 41 a of the adsorption device 41. Further, a passage 42 is formed in the adsorption device 41, and the passage 42 includes four portions extending vertically, and the lower end of these portions has an opening 42a opened downward in the seal member 43. Forming.
[0032] 吸着装置 41は負圧源たる真空ポンプ 38を備え、該真空ポンプ 38は前記通路 42 に接続されている。真空ポンプ 38により、吸着装置 41の通路 42に負圧が作用し、さ らに、第 2の治具 35の上面に接触するシール部材 43を介して第 2の治具 35の通路 3 7に負圧が作用する。吸着装置 41の通路 42と第 2の治具 35の通路 37とに共に負圧 が作用した状態では、吸着装置 41に第 2の治具 35が吸着されるとともに、加圧面 35 aには半導体素子 12又は半田シート 33が吸着される。  The adsorption device 41 includes a vacuum pump 38 as a negative pressure source, and the vacuum pump 38 is connected to the passage 42. A negative pressure is applied to the passage 42 of the suction device 41 by the vacuum pump 38, and further, to the passage 37 of the second jig 35 via the seal member 43 that contacts the upper surface of the second jig 35. Negative pressure acts. When negative pressure is applied to both the passage 42 of the adsorption device 41 and the passage 37 of the second jig 35, the second jig 35 is adsorbed to the adsorption device 41 and the pressure surface 35a has a semiconductor. The element 12 or the solder sheet 33 is adsorbed.
[0033] 第 2の治具 35は、加圧面 35aと反対側の部位にフランジ 35bを有している。図 4 (a) は第 2の治具 35の加圧面 35a側の外形を二点鎖線で示し、第 2の治具 35が第 1の 治具 32の位置決め孔 34に嵌挿された際の第 1の治具 32と第 2の治具 35との位置関 係を示している。  [0033] The second jig 35 has a flange 35b at a portion opposite to the pressing surface 35a. Fig. 4 (a) shows the outer shape of the second jig 35 on the pressing surface 35a side by a two-dot chain line, and the second jig 35 is inserted into the positioning hole 34 of the first jig 32. The positional relationship between the first jig 32 and the second jig 35 is shown.
[0034] また、この実施形態においては、半田付け装置 HKは、全ての第 2の治具 35を一括 して半導体素子 12を押圧可能な押圧位置へ配置可能に構成されるとともに、全ての 第 2の治具 35を一括して半導体素子 12から離間した位置へ退去可能に構成されて いる。図 5に示すように、半田付け装置 HKの蓋体 19には、第 2の治具 35を運搬可 能な運搬部 (運搬装置）としての支持プレート 36が配設されて 、る。支持プレート 36 は、磁力線を通す電気的絶縁材料 (例えば、セラミックス)で形成されており、フランジ 35bより下側の第 2の治具 35の部位の揷通を許可する孔 36aを第 2の治具 35の個数 分だけ備えている。前記孔 36aは、蓋体 19が本体 18に取り付けられた状態において 、支持台 20上に位置決めされた回路基板 11の接合部 (金属回路 13)と対向する位 置に形成されている。第 2の治具 35は各孔 36aに嵌挿された状態で支持プレート 36 に装備されている。第 2の治具 35は、フランジ 35bが支持プレート 36に支持されるこ とで蓋体 19に支持される。フランジ 35bが支持プレート 36に支持された状態で蓋体 1 9を移動させることにより、第 2の治具 35が運搬される。支持プレート 36を備えた蓋体 19は、第 2の治具 35を運搬する運搬部 (運搬装置)として機能する。 [0034] In this embodiment, the soldering apparatus HK is configured so that all the second jigs 35 can be collectively disposed at a pressing position where the semiconductor element 12 can be pressed. The two jigs 35 can be moved away from the semiconductor element 12 all at once. Yes. As shown in FIG. 5, the lid 19 of the soldering device HK is provided with a support plate 36 as a transport portion (transport device) capable of transporting the second jig 35. The support plate 36 is made of an electrically insulating material (for example, ceramics) that passes the lines of magnetic force, and the hole 36a that permits the passage of the portion of the second jig 35 below the flange 35b is formed in the second jig. There are as many as 35 pieces. The hole 36 a is formed at a position facing the joint portion (metal circuit 13) of the circuit board 11 positioned on the support base 20 in a state where the lid 19 is attached to the main body 18. The second jig 35 is mounted on the support plate 36 in a state of being inserted into each hole 36a. The second jig 35 is supported by the lid body 19 by the flange 35 b being supported by the support plate 36. The second jig 35 is transported by moving the lid 19 while the flange 35b is supported by the support plate 36. The lid body 19 including the support plate 36 functions as a transport unit (transport device) that transports the second jig 35.
[0035] 図 5に示すように、蓋体 19が閉鎖位置に配置された状態では、第 2の治具 35の加 圧面 35aが半導体素子 12の非接合面に当接するとともに、フランジ 35bが支持プレ ート 36の上面力も浮き上がった状態となって、第 2の治具 35及び吸着装置 41が、そ の自重で半導体素子 12を回路基板 11に向かって押圧する。すなわち、第 2の治具 3 5によって、半導体素子 12が金属回路 13の半田シート 33上に位置決めされる。この とき、図 6に示すように、半田シート 33の周縁部 33aの上側と、第 2の治具 35の加圧 面 35aの下側との間には、半導体素子 12の周縁部 12aの周囲外側に位置する空間 部 Kが形成される。この空間部 Kは、半導体素子 12の周縁部 12aの周囲全体に亘っ て形成され、空間部 Kの幅は前記隙間 Mの寸法に相当する。  [0035] As shown in FIG. 5, in the state where the lid 19 is disposed at the closed position, the pressure surface 35a of the second jig 35 abuts against the non-joint surface of the semiconductor element 12, and the flange 35b is supported. The upper surface force of the plate 36 is also lifted, and the second jig 35 and the suction device 41 press the semiconductor element 12 toward the circuit board 11 with its own weight. In other words, the semiconductor element 12 is positioned on the solder sheet 33 of the metal circuit 13 by the second jig 35. At this time, as shown in FIG. 6, the periphery of the peripheral portion 12a of the semiconductor element 12 is between the upper side of the peripheral portion 33a of the solder sheet 33 and the lower side of the pressing surface 35a of the second jig 35. An outer space K is formed. The space K is formed over the entire periphery of the peripheral edge 12a of the semiconductor element 12, and the width of the space K corresponds to the size of the gap M.
[0036] 次に、前記半田付け装置 HK及び位置決め治具 IKを用いて半導体素子 12を半田 付けする工程について説明する。半田付け工程は半導体モジュール 100の製造方 法の一工程であり、半導体素子 12の位置決め工程を含む。  Next, a process of soldering the semiconductor element 12 using the soldering apparatus HK and the positioning jig IK will be described. The soldering process is a process of manufacturing the semiconductor module 100 and includes a positioning process of the semiconductor element 12.
[0037] なお、この半田付け装置 HK及び位置決め治具 IKを用いて半田付けを行うのに先 立って、金属回路 13を有する複数（6枚）のセラミック基板 14を一つのヒートシンク 15 に接合した物（以下、「半田付け対象物」という）を予め作製しておく。即ち、半田付け 対象物は、図 3に示す半導体モジュール 100から半導体素子 12を除いたものに相 当する。 [0038] 半田付けを行う際には、最初に、本体 18から蓋体 19を外し、開口部 18aを開放す る。そして、図 5に示すように本体 18の支持台 20上に半田付け対象物を置き、支持 台 20に対して位置決めする。次に、半田シート 33を位置決め孔 34と対応する位置 に配置する。この場合は、本体 18の外部において、必要な数の半田シート 33を半田 付け対象物上上における半田シート 33の配置に対応するように配置する。そして、 各第 2の治具 35の加圧面 35aがそれら半田シート 33に対応するように蓋体 19を配 置する。その状態で吸着装置 41の通路 42に真空ポンプ 38の負圧を作用させて第 2 の治具 35を吸着装置 41に吸着させるとともに、各第 2の治具 35の通路 37に真空ポ ンプ 38の負圧を作用させる。すると、各加圧面 35aにおける複数の連通溝 35cを介 して加圧面 35aに半田シート 33が吸着される。このとき、半田シート 33は、その周縁 部 33aが加圧面 35aの外周縁より外方へ突出しな 、ように加圧面 35aに吸着される。 [0037] Prior to soldering using this soldering apparatus HK and positioning jig IK, a plurality of (six) ceramic substrates 14 having metal circuits 13 were joined to one heat sink 15. An object (hereinafter referred to as “soldering object”) is prepared in advance. That is, the soldering object corresponds to the semiconductor module 100 shown in FIG. 3 excluding the semiconductor element 12. [0038] When performing soldering, first, the lid 19 is removed from the main body 18, and the opening 18a is opened. Then, as shown in FIG. 5, an object to be soldered is placed on the support base 20 of the main body 18 and positioned with respect to the support base 20. Next, the solder sheet 33 is disposed at a position corresponding to the positioning hole 34. In this case, a necessary number of solder sheets 33 are arranged outside the main body 18 so as to correspond to the arrangement of the solder sheets 33 on the object to be soldered. Then, the lid body 19 is arranged so that the pressing surface 35 a of each second jig 35 corresponds to the solder sheet 33. In this state, the negative pressure of the vacuum pump 38 is applied to the passage 42 of the adsorption device 41 to adsorb the second jig 35 to the adsorption device 41, and the vacuum pump 38 is inserted into the passage 37 of each second jig 35. Apply negative pressure. Then, the solder sheet 33 is adsorbed to the pressure surface 35a via the plurality of communication grooves 35c in each pressure surface 35a. At this time, the solder sheet 33 is adsorbed to the pressure surface 35a so that the peripheral edge portion 33a does not protrude outward from the outer peripheral edge of the pressure surface 35a.
[0039] 半田シート 33が吸着された状態で蓋体 19を移動させて、本体 18の開口部 18aを 蓋体 19で閉鎖する。このとき、各第 2の治具 35の加圧面 35aが半田シート 33を吸着 した状態で第 1の治具 32の位置決め孔 34に挿入される。加圧面 35aに半田シート 3 3が吸着された状態では、第 2の治具 35は加圧面 35aが金属回路 13上の所定位置 に位置するように、位置決め孔 34の壁面 34aによって位置決めされる。このため、半 田シート 33が位置決め孔 34内に挿入されるとき、半田シート 33の周縁部 33aが位置 決め孔 34の壁面 34aに干渉することが防止される。  The lid body 19 is moved in a state where the solder sheet 33 is adsorbed, and the opening 18 a of the main body 18 is closed with the lid body 19. At this time, the pressing surface 35a of each second jig 35 is inserted into the positioning hole 34 of the first jig 32 in a state where the solder sheet 33 is adsorbed. In a state where the solder sheet 33 is attracted to the pressing surface 35a, the second jig 35 is positioned by the wall surface 34a of the positioning hole 34 so that the pressing surface 35a is located at a predetermined position on the metal circuit 13. For this reason, when the solder sheet 33 is inserted into the positioning hole 34, the peripheral edge portion 33a of the solder sheet 33 is prevented from interfering with the wall surface 34a of the positioning hole 34.
[0040] 次に通路 37, 42に対する負圧の作用を解除して、吸着装置 41による吸着作用を 解除した後、蓋体 19を本体 18から取り外すと、半田シート 33が金属回路 13 (接合部 )上の所定位置に配置される。このとき、位置決め孔 34の壁面 34aに半田シート 33 の周縁部 33aが対向した状態で、半田シート 33は金属回路 13上に位置決めされる 。このため、半田シート 33が 1つのセラミック基板 14上において、隣に載置された半 田シート 33に向力つて移動することが抑制される。  [0040] Next, after releasing the negative pressure action on the passages 37 and 42 and releasing the suction action by the suction device 41, when the lid 19 is removed from the main body 18, the solder sheet 33 is moved to the metal circuit 13 (joint portion). ) Is arranged at a predetermined position on. At this time, the solder sheet 33 is positioned on the metal circuit 13 with the peripheral edge 33a of the solder sheet 33 facing the wall surface 34a of the positioning hole 34. For this reason, the solder sheet 33 is restrained from moving on one ceramic substrate 14 by force toward the solder sheet 33 placed adjacent thereto.
[0041] 次に、本体 18の外部において、必要な数の半導体素子 12を半田付け対象物上の 配置に対応するように配置し、それらの半導体素子 12に各第 2の治具 35の加圧面 a が対応するように蓋体 19を配置する。  Next, outside the main body 18, a necessary number of semiconductor elements 12 are arranged so as to correspond to the arrangement on the object to be soldered, and each second jig 35 is added to the semiconductor elements 12. The lid 19 is arranged so that the pressure surface a corresponds.
[0042] その状態で吸着装置 41の通路 42に真空ポンプ 38の負圧を作用させて、第 2の治 具 35を吸着装置 41に吸着させるとともに、各第 2の治具 35の通路 37に真空ポンプ 3 8の負圧を作用させる。すると、各加圧面 35aにおける複数の連通溝 35cを介してカロ 圧面 35aに半導体素子 12が吸着される。このとき、半導体素子 12は、その周縁部 33 aが加圧面 35aの外周縁より外方へ突出しな 、ように加圧面 35aに吸着される。 [0042] In this state, the negative pressure of the vacuum pump 38 is applied to the passage 42 of the adsorption device 41, so that the second treatment is performed. The tool 35 is adsorbed by the adsorbing device 41 and the negative pressure of the vacuum pump 38 is applied to the passage 37 of each second jig 35. Then, the semiconductor element 12 is adsorbed to the caloric pressure surface 35a via the plurality of communication grooves 35c in each pressure surface 35a. At this time, the semiconductor element 12 is attracted to the pressure surface 35a so that the peripheral edge portion 33a does not protrude outward from the outer peripheral edge of the pressure surface 35a.
[0043] 次に、蓋体 19を本体 18に取り付ける。図 5に示すように、各第 2の治具 35の加圧面 35aがそれぞれ第 1の治具 32の位置決め孔 34に挿入される。加圧面 35aに半導体 素子 12が吸着された状態では、第 2の治具 35は加圧面 35aが半田シート 33上の所 定位置に配置されるように、位置決め孔 34の壁面 34aによって位置決めされる。この 結果、半導体素子 12が位置決め孔 34内に挿入されるとき、半導体素子 12の周縁部 12aが位置決め孔 34の壁面 34aに接触することが防止される。  Next, the lid body 19 is attached to the main body 18. As shown in FIG. 5, the pressing surface 35 a of each second jig 35 is inserted into the positioning hole 34 of the first jig 32. In a state where the semiconductor element 12 is attracted to the pressing surface 35a, the second jig 35 is positioned by the wall surface 34a of the positioning hole 34 so that the pressing surface 35a is disposed at a predetermined position on the solder sheet 33. . As a result, when the semiconductor element 12 is inserted into the positioning hole 34, the peripheral edge portion 12a of the semiconductor element 12 is prevented from contacting the wall surface 34a of the positioning hole 34.
[0044] 各位置決め孔 34の壁面 34aによって、第 2の治具 35の加圧面 35aが半田シート 33 上に位置するようにガイドされる。次に、通路 37, 42に対する負圧の作用が解除され て、第 2の治具 35による吸着作用が解除される。その結果、各半導体素子 12が半田 シート 33上の所定位置に配置されるとともに、半導体素子 12上に各第 2の治具 35が 載置される。  [0044] The pressing surface 35a of the second jig 35 is guided by the wall surface 34a of each positioning hole 34 so as to be positioned on the solder sheet 33. Next, the negative pressure action on the passages 37 and 42 is released, and the suction action by the second jig 35 is released. As a result, each semiconductor element 12 is disposed at a predetermined position on the solder sheet 33 and each second jig 35 is placed on the semiconductor element 12.
[0045] 次に、蓋体 19を本体 18に取り付け、開口部 18aを閉鎖して、容器 17内に密閉空間 Sを形成する。蓋体 19を本体 18に取り付けると、フランジ 35bが支持プレート 36の上 面力も離間した状態になる。各第 2の治具 35は 4個の半導体素子 12に跨った状態で 、第 2の治具 35及び吸着装置 41の自重によってそれら半導体素子 12を押圧すると ともに、半田シート 33を押圧するように配置される。すなわち、第 2の治具 35及び吸 着装置 41の自重によって、半導体素子 12が半田シート 33上に位置決めされる。こ の状態において、各セラミック基板 14上には、金属回路 13側力も順に半田シート 33 、半導体素子 12、第 2の治具 35が重なった状態で配置される。  Next, the lid 19 is attached to the main body 18, the opening 18 a is closed, and the sealed space S is formed in the container 17. When the lid 19 is attached to the main body 18, the flange 35b is in a state where the upper surface force of the support plate 36 is also separated. Each second jig 35 straddles four semiconductor elements 12 so that the semiconductor element 12 is pressed by the weight of the second jig 35 and the suction device 41 and the solder sheet 33 is pressed. Be placed. That is, the semiconductor element 12 is positioned on the solder sheet 33 by the weight of the second jig 35 and the adsorption device 41. In this state, on each ceramic substrate 14, the solder force 33, the semiconductor element 12, and the second jig 35 are also arranged in this order on the metal circuit 13 side force.
[0046] 密閉空間 S内に回路基板 11、半田シート 33、半導体素子 12及び第 2の治具 35を 収容した状態において、複数の高周波加熱コイル 28は、対応する第 2の治具 35の 上方にそれぞれ配置される。各高周波加熱コイル 28とそれに対応する第 2の治具 35 との間には、蓋体 19に組み付けられたガラス板 22が配置されている。この実施形態 では、高周波加熱コイル 28を上方力も見たときに、第 2の治具 35の上面の輪郭によ つて形成される領域力 高周波加熱コイル 28がはみ出るように、高周波加熱コイル 2 8が構成及び配置されて ヽる。この実施形態のように渦巻き状に形成された高周波 加熱コイル 28は、その中央寄りに磁束を多く発生するので、当該高周波加熱コイル 2 8の中央寄りに第 2の治具 35を配置することが好ま 、。 In a state where the circuit board 11, the solder sheet 33, the semiconductor element 12, and the second jig 35 are accommodated in the sealed space S, the plurality of high-frequency heating coils 28 are located above the corresponding second jig 35. Respectively. Between each high-frequency heating coil 28 and the second jig 35 corresponding thereto, a glass plate 22 assembled to the lid 19 is disposed. In this embodiment, when the high-frequency heating coil 28 is also viewed in an upward force, the contour of the upper surface of the second jig 35 is used. Thus, the high-frequency heating coil 28 is constructed and arranged so that the high-frequency heating coil 28 protrudes. Since the high-frequency heating coil 28 formed in a spiral shape as in this embodiment generates a large amount of magnetic flux near the center thereof, the second jig 35 can be disposed near the center of the high-frequency heating coil 28. Favored ,.
[0047] 次に、ガス排出部 25を操作して容器 17内を真空引きする。さらに、不活性ガス供 給部 24を操作して容器 17内に窒素を供給し、密閉空間 S内を不活性ガスで充満さ せる。この真空引きと窒素の供給とを数回繰り返した後、還元ガス供給部 23を操作し て容器 17内に水素を供給し、密閉空間 S内を還元ガス雰囲気とする。  Next, the inside of the container 17 is evacuated by operating the gas discharge unit 25. Further, the inert gas supply unit 24 is operated to supply nitrogen into the container 17, and the sealed space S is filled with the inert gas. After this evacuation and nitrogen supply are repeated several times, the reducing gas supply unit 23 is operated to supply hydrogen into the container 17, and the sealed space S is made a reducing gas atmosphere.
[0048] 次に、高周波発生装置 29を作動させ、各高周波加熱コイル 28に高周波電流を流 す。すると、高周波加熱コイル 28は、対応する第 2の治具 35を通る高周波の磁束が 発生し、第 2の治具 35には磁束の通過によって渦電流が発生する。その結果、高周 波加熱コイル 28の磁束内に置かれた第 2の治具 35は、電磁誘導作用によって発熱 し、その熱が第 2の治具 35の加圧面 35aから半導体素子 12に伝わる。そして、回路 基板 11の各接合部上に載置された半田シート 33には、第 2の治具 35に生じた熱が 該第 2の治具 35の加圧面 35a及び半導体素子 12を介して集中的に伝わり、半田シ ート 33が加熱される。この結果、半田シート 33は、自身の溶融温度以上の温度にな つて溶融する。  Next, the high frequency generator 29 is operated, and a high frequency current is passed through each high frequency heating coil 28. Then, the high frequency heating coil 28 generates a high frequency magnetic flux that passes through the corresponding second jig 35, and an eddy current is generated in the second jig 35 due to the passage of the magnetic flux. As a result, the second jig 35 placed in the magnetic flux of the high-frequency heating coil 28 generates heat due to electromagnetic induction, and the heat is transmitted from the pressure surface 35a of the second jig 35 to the semiconductor element 12. . The heat generated in the second jig 35 is applied to the solder sheet 33 placed on each joint portion of the circuit board 11 via the pressure surface 35a of the second jig 35 and the semiconductor element 12. It is transmitted intensively and the solder sheet 33 is heated. As a result, the solder sheet 33 melts at a temperature higher than its melting temperature.
[0049] 図 8に示すように、半導体素子 12は、第 2の治具 35によって半田付け対象物に向 力つて押圧されているので、溶融した半田の表面張力で動力されることはない。また 、半導体素子 12の周縁部 12aと位置決め孔 34の壁面 34aとの間には、隙間 M (空 間部 K)が設けられている。このため、溶融した半田は、隙間 M (空間部 K)によって 半導体素子 12の周縁部 12aに沿って濡れ拡がることが許容される。  As shown in FIG. 8, since the semiconductor element 12 is pressed against the soldering object by the second jig 35, it is not driven by the surface tension of the molten solder. In addition, a gap M (space portion K) is provided between the peripheral edge portion 12 a of the semiconductor element 12 and the wall surface 34 a of the positioning hole 34. Therefore, the molten solder is allowed to spread along the peripheral edge portion 12a of the semiconductor element 12 through the gap M (space portion K).
[0050] このとき、半田シート 33は位置決め孔 34の壁面 34aによって位置決めされているた め、溶融した半田が隣り合う半導体素子 12に向かって移動することが防止される。こ の結果、半田によって半導体素子 12同士が短絡することが防止される。さらに、半導 体素子 12が第 2の治具 35によって押圧されているため、半田溶融時に半導体素子 12が移動することがなぐ半田フィレット Fの形成が阻害されることが抑制される。  [0050] At this time, since the solder sheet 33 is positioned by the wall surface 34a of the positioning hole 34, the molten solder is prevented from moving toward the adjacent semiconductor element 12. As a result, the semiconductor elements 12 are prevented from being short-circuited by solder. Furthermore, since the semiconductor element 12 is pressed by the second jig 35, the formation of the solder fillet F that prevents the semiconductor element 12 from moving when the solder melts is suppressed.
[0051] そして、半田シート 33が完全に溶融したとき、高周波発生装置 29を停止させる。な お、高周波加熱コイル 28に流れる高周波電流の大きさは、容器 17内に設置した温 度センサ 27の検出結果に基づき制御される。また、容器 17 (密閉空間 S)内の圧力 は、半田付け作業の進行状況に応じて加圧及び減圧される。 [0051] Then, when the solder sheet 33 is completely melted, the high frequency generator 29 is stopped. Na The magnitude of the high-frequency current flowing through the high-frequency heating coil 28 is controlled based on the detection result of the temperature sensor 27 installed in the container 17. Further, the pressure in the container 17 (sealed space S) is increased and decreased according to the progress of the soldering operation.
[0052] そして、半田シート 33が完全に溶融した後、熱媒供給部 26を操作して容器 17内に 冷却用ガスを供給する。冷却用ガスは、ヒートシンク 15の冷媒流路 15aの入口又は 出口に向力つて吹き込まれる。さらに、容器 17内に供給された冷却用ガスは、冷媒 流路 15a及びヒートシンク 15の周囲を流れて、半田付け対象物を冷却する。この結 果、溶融した半田は、溶融温度未満に冷却されることによって凝固し、金属回路 13と 半導体素子 12とを接合するとともに、半導体素子 12の周縁部 12aに半田フィレット F が形成される。この状態において、半田付け作業が終了し、半導体モジュール 100 が完成する。そして、蓋体 19を本体 18から取り外し、第 1の治具 32及び第 2の治具 3 5を外した後に容器 17内から半導体モジュール 100を取り出す。  Then, after the solder sheet 33 is completely melted, the heating medium supply unit 26 is operated to supply the cooling gas into the container 17. The cooling gas is blown toward the inlet or outlet of the refrigerant flow path 15a of the heat sink 15. Further, the cooling gas supplied into the container 17 flows around the refrigerant flow path 15a and the heat sink 15, and cools the soldering object. As a result, the melted solder is solidified by being cooled below the melting temperature, joining the metal circuit 13 and the semiconductor element 12, and forming a solder fillet F on the peripheral edge portion 12 a of the semiconductor element 12. In this state, the soldering operation is finished, and the semiconductor module 100 is completed. Then, the lid 19 is removed from the main body 18, the first jig 32 and the second jig 35 are removed, and then the semiconductor module 100 is taken out from the container 17.
[0053] 本実施形態は、以下の利点を有する。  The present embodiment has the following advantages.
(1)半導体素子 12及び半田シート 33は、それぞれ第 2の治具 35によって位置決 め孔 34内に挿入される。加圧面 35aが接合部 (金属回路 13)の対向位置に配置され るように、第 2の治具 35が位置決め孔 34の壁面 34aによって位置決めされる。そのた め、加圧面 35aに半田シート 33が配置された状態では、半田シート 33は接合部 (金 属回路 13)上の所定位置に配置され、また、加圧面 35aに半導体素子 12が配置さ れた状態では、半導体素子 12は所定位置に配置された半田シート 33上の所定位置 に配置される。  (1) The semiconductor element 12 and the solder sheet 33 are inserted into the positioning hole 34 by the second jig 35, respectively. The second jig 35 is positioned by the wall surface 34a of the positioning hole 34 so that the pressurizing surface 35a is disposed at a position facing the joint (metal circuit 13). Therefore, in a state where the solder sheet 33 is disposed on the pressure surface 35a, the solder sheet 33 is disposed at a predetermined position on the joint (metal circuit 13), and the semiconductor element 12 is disposed on the pressure surface 35a. In this state, the semiconductor element 12 is arranged at a predetermined position on the solder sheet 33 arranged at a predetermined position.
[0054] したがって、第 1の治具 32及び第 2の治具 35を用いることにより、半導体素子 12や 半田シート 33が各所定位置力 ずれた位置に配置されることが抑制され、半導体素 子 12を接合部 (金属回路 13)に良好に半田付けすることができる。また、半田シート 33上の所定位置に半導体素子 12が配置されるため、半導体素子 12の周縁部 12a には半田シート 33の周縁部 33aが存在するようになり、半田の溶融によって半導体 素子 12の周縁部 12aに半田フィレット Fが良好に形成される。  [0054] Therefore, by using the first jig 32 and the second jig 35, the semiconductor element 12 and the solder sheet 33 are suppressed from being arranged at positions deviated from each predetermined position force. 12 can be soldered well to the joint (metal circuit 13). Further, since the semiconductor element 12 is disposed at a predetermined position on the solder sheet 33, the peripheral edge portion 13a of the solder sheet 33 is present at the peripheral edge portion 12a of the semiconductor element 12, and the melting of the solder causes the semiconductor element 12 to The solder fillet F is well formed on the peripheral edge 12a.
[0055] (2)特に、加圧面 35aに半導体素子 12又は半田シート 33が吸着された状態では、 半導体素子 12又は半田シート 33は加圧面 35aの外形サイズ内に収まる。このため、 第 2の治具 35を位置決め孔 34内へ挿入したときに、半導体素子 12の周縁部 12a又 は半田シート 33の周縁部 33aがそれぞ; ^立置決め孔 34の壁面 34aに干渉すること を防止することができる。 (2) In particular, in a state where the semiconductor element 12 or the solder sheet 33 is adsorbed on the pressing surface 35a, the semiconductor element 12 or the solder sheet 33 fits within the outer size of the pressing surface 35a. For this reason, When the second jig 35 is inserted into the positioning hole 34, the peripheral edge portion 12a of the semiconductor element 12 or the peripheral edge portion 33a of the solder sheet 33 respectively interferes with the wall surface 34a of the standing hole 34. Can be prevented.
[0056] (3)半田シート 33が位置決め孔 34内へ挿入されると、半田シート 33が接合部（金 属回路 13)上の所定位置に配置され、半導体素子 12が位置決め孔 34内へ挿入さ れると、半導体素子 12は半田シート 33上の所定位置に配置される。半導体素子 12 が第 2の治具 35によって位置決めされた状態では、位置決め孔 34の壁面 34aと、半 導体素子 12の周縁部 12aとの間には隙間 Mが形成され、該隙間 Mは半田シート 33 の厚さ寸法 Dより大きい。このため、半田シート 33が溶融した際には、隙間 Mの存在 によって半導体素子 12の周囲での半田の毛管現象が許容されるため、半導体素子 12の周縁部 12aに半田フィレット Fが形成される。したがって、半田フィレット Fが形成 され、且つ半田シート 33及び半導体素子 12がそれぞ; ^立置ずれすることなく半田付 けされるので、半導体素子 12を所定位置に半田付けすることができる。  [0056] (3) When the solder sheet 33 is inserted into the positioning hole 34, the solder sheet 33 is disposed at a predetermined position on the joint (metal circuit 13), and the semiconductor element 12 is inserted into the positioning hole 34. Then, the semiconductor element 12 is disposed at a predetermined position on the solder sheet 33. In a state where the semiconductor element 12 is positioned by the second jig 35, a gap M is formed between the wall surface 34a of the positioning hole 34 and the peripheral edge portion 12a of the semiconductor element 12, and the gap M is a solder sheet. Greater than thickness dimension D of 33. Therefore, when the solder sheet 33 is melted, the presence of the gap M allows the solder capillary phenomenon around the semiconductor element 12, so that the solder fillet F is formed on the peripheral edge portion 12 a of the semiconductor element 12. . Accordingly, the solder fillet F is formed, and the solder sheet 33 and the semiconductor element 12 are soldered without being displaced upright, so that the semiconductor element 12 can be soldered to a predetermined position.
[0057] (4)位置決め治具 IKにおいて、位置決め孔 34の大きさは半田シート 33の外形より 大きい。よって、第 1の治具 32が半田付け対象物上に載置された後に、位置決め孔 34内に半田シート 33を挿入することができる。例えば、半田シート 33が位置決め孔 34より大きく形成された場合には、半田シート 33を接合部上に載置した後でしか第 1 の治具 32を半田付け対象物上に載置することができない。しかし、このような場合と は異なり、本実施形態では、第 1の治具 32による半田シート 33の位置決めが可能と なる。  (4) Positioning jig In IK, the size of positioning hole 34 is larger than the outer shape of solder sheet 33. Therefore, the solder sheet 33 can be inserted into the positioning hole 34 after the first jig 32 is placed on the soldering object. For example, when the solder sheet 33 is formed larger than the positioning hole 34, the first jig 32 can be placed on the soldering object only after the solder sheet 33 is placed on the joint. Can not. However, unlike this case, in the present embodiment, the solder sheet 33 can be positioned by the first jig 32.
[0058] (5)半田シート 33の外形は半導体素子 12の外形より大きい。半田シート 33上に半 導体素子 12が配置されたとき、半導体素子 12の周縁部 12aよりも外側に半田シート 33の周縁部 33aが存在する。このため、半田シート 33の溶融時には、半田シート 33 の周縁部 33aに半田フィレット Fが確実に形成される。  (5) The outer shape of the solder sheet 33 is larger than the outer shape of the semiconductor element 12. When the semiconductor element 12 is disposed on the solder sheet 33, the peripheral portion 33 a of the solder sheet 33 exists outside the peripheral portion 12 a of the semiconductor element 12. Therefore, when the solder sheet 33 is melted, the solder fillet F is reliably formed on the peripheral edge portion 33a of the solder sheet 33.
[0059] (6)第 2の治具 35の各加圧面 35aには、開口 37aを有する通路 37が形成されて ヽ る。さらに、第 2の治具 35は吸着装置 41を備え、該吸着装置 41の真空ポンプ 38は 吸着装置 41の通路 42に連通している。そして、真空ポンプ 38によって吸着装置 41 に負圧を作用させることで、シール部材 43を介して吸着装置 41に第 2の治具 35を吸 着させ、さらに、第 2の治具 35の加圧面 35aに半導体素子 12又は半田シート 33を吸 着させることができる。 [0059] (6) A passage 37 having an opening 37a is formed in each pressure surface 35a of the second jig 35. Further, the second jig 35 includes a suction device 41, and a vacuum pump 38 of the suction device 41 communicates with a passage 42 of the suction device 41. Then, by applying a negative pressure to the suction device 41 by the vacuum pump 38, the second jig 35 is sucked into the suction device 41 via the seal member 43. Furthermore, the semiconductor element 12 or the solder sheet 33 can be adsorbed to the pressure surface 35a of the second jig 35.
[0060] このため、第 2の治具 35を位置決め孔 34内へ挿入する際に、半導体素子 12又は 半田シート 33を加圧面 35aに吸着した状態で位置決め孔 34内に挿入することがで きる。したがって、半導体素子 12又は半田シート 33を位置決め孔 34内に挿入する 際に、半導体素子 12又は半田シート 33が位置決め孔 34の壁面 34aに干渉すること を防止しつつ、半導体素子 12や半田シート 33を所定位置に正確に配置することが できる。  [0060] Therefore, when the second jig 35 is inserted into the positioning hole 34, the semiconductor element 12 or the solder sheet 33 can be inserted into the positioning hole 34 in a state where the semiconductor element 12 or the solder sheet 33 is adsorbed to the pressing surface 35a. . Therefore, when the semiconductor element 12 or the solder sheet 33 is inserted into the positioning hole 34, the semiconductor element 12 or the solder sheet 33 is prevented from interfering with the wall surface 34a of the positioning hole 34, and the semiconductor element 12 or the solder sheet 33 is prevented. Can be accurately placed at a predetermined position.
[0061] (7)第 2の治具 35を、半導体素子 12を吸着可能とする吸着部として機能させること によって、半導体素子 12を半田シート 33上に載置するのと同時に、第 2の治具 35を 半導体素子 12上に載置することができる。言い換えると、第 2の治具 35と半導体素 子 12とを同時に搬送することができる。したがって、半田付け作業の短縮を図ること ができる。  (7) By causing the second jig 35 to function as an adsorbing portion that can adsorb the semiconductor element 12, the second jig 35 is placed on the solder sheet 33 and simultaneously with the second jig. The tool 35 can be placed on the semiconductor element 12. In other words, the second jig 35 and the semiconductor element 12 can be transported simultaneously. Therefore, soldering work can be shortened.
[0062] (8)複数の半導体素子 12や複数の半田シート 33を第 2の治具 35の加圧面 35aに 吸着させ、それらを接合部 (金属回路 13)上に一括して載置することができる。その 結果として、半導体素子 12や半田シート 33を一つずつ接合部 (金属回路 13)上に 載置する場合に比して、半導体モジュール 100の製造時間を短縮することができる。  (8) Adsorbing a plurality of semiconductor elements 12 and a plurality of solder sheets 33 to the pressing surface 35a of the second jig 35 and placing them collectively on the joint (metal circuit 13) Can do. As a result, the manufacturing time of the semiconductor module 100 can be shortened as compared with the case where the semiconductor element 12 and the solder sheet 33 are placed one by one on the joint (metal circuit 13).
[0063] (9)各第 2の治具 35の加圧面 35aには、複数の連通溝 35cが形成され、各連通溝 35cは通路 37, 42を介して吸着装置 41の真空ポンプ 38に連通している。このため、 真空ポンプ 38によって第 2の治具 35に負圧を作用させると、加圧面 35aの複数箇所 にて半導体素子 12又は半田シート 33を吸着することができる。したがって、各第 2の 治具 35に半導体素子 12又は半田シート 33を確実に吸着することができ、第 2の治 具 35を用いた半導体素子 12又は半田シート 33の搬送を確実に行うことができる。 (9) A plurality of communication grooves 35c are formed on the pressure surface 35a of each second jig 35, and each communication groove 35c communicates with the vacuum pump 38 of the suction device 41 via passages 37 and 42. is doing. Therefore, when a negative pressure is applied to the second jig 35 by the vacuum pump 38 , the semiconductor element 12 or the solder sheet 33 can be adsorbed at a plurality of locations on the pressing surface 35a. Therefore, the semiconductor element 12 or the solder sheet 33 can be reliably adsorbed to each second jig 35, and the semiconductor element 12 or the solder sheet 33 can be reliably conveyed using the second jig 35. it can.
[0064] (10)半田付け装置 HKは、蓋体 19の支持プレート 36によって、全ての第 2の治具 35を一括して運搬する。したがって、第 2の治具 35の運搬作業を省力化でき、ひい ては半導体モジュール 100の製造時間の短縮を図ることができる。  [0064] (10) Soldering apparatus HK transports all the second jigs 35 in a batch by the support plate 36 of the lid 19. Therefore, the labor for carrying the second jig 35 can be saved, and as a result, the manufacturing time of the semiconductor module 100 can be shortened.
[0065] 次に、本発明を具体化した第 2実施形態を図 9を参照しながら説明する。なお、第 2 実施形態は、第 1実施形態と比較して第 1の治具 32の構成が異なり、その他の構成 は第 1実施形態と基本的に同様であるため、同様の部分についてはその詳細な説明 を省略する。 Next, a second embodiment embodying the present invention will be described with reference to FIG. The second embodiment differs from the first embodiment in the configuration of the first jig 32, and other configurations. Since this is basically the same as that of the first embodiment, detailed description of the same parts is omitted.
[0066] 図 9に示すように、第 1の治具 32において、位置決め孔 34の壁面 34aの下部であ つて、前記半導体素子 12の周縁部 12a及び半田シート 33の周縁部 33aと対向する 部位には傾斜部 44が形成されて 、る。傾斜部 44は、位置決め孔 34の上側から下側 へ向かうに従 、、位置決め孔 34を広げるように傾斜して 、る。  [0066] As shown in FIG. 9, in the first jig 32, a portion below the wall surface 34a of the positioning hole 34 and facing the peripheral edge portion 12a of the semiconductor element 12 and the peripheral edge portion 33a of the solder sheet 33 An inclined portion 44 is formed in the front. The inclined portion 44 is inclined to widen the positioning hole 34 as it goes from the upper side to the lower side of the positioning hole 34.
[0067] この実施形態にお!、ては、前記第 1実施形態における利点（1)〜（10)と同様な利 点を有する他に次の利点を有する。  [0067] This embodiment has the following advantages in addition to the advantages similar to the advantages (1) to (10) in the first embodiment.
(11)位置決め孔 34の壁面 34aに形成された傾斜部 44は、金属回路 13上に載置 された半田シート 33の周縁部 33a及び半導体素子 12の周縁部 12aと対向する。した がって、半田シート 33の溶融時には、半田シート 33の周縁部 33aは毛管現象によつ て傾斜部 44に向力つて流れることが許容される。この結果、半導体素子 12の周囲に は半田フィレット Fが確実に形成される。  (11) The inclined portion 44 formed on the wall surface 34 a of the positioning hole 34 faces the peripheral portion 33 a of the solder sheet 33 placed on the metal circuit 13 and the peripheral portion 12 a of the semiconductor element 12. Therefore, when the solder sheet 33 is melted, the peripheral edge portion 33a of the solder sheet 33 is allowed to flow toward the inclined portion 44 by capillary action. As a result, the solder fillet F is reliably formed around the semiconductor element 12.
[0068] 実施形態は前記に限定されるものではなぐ例えば、次のように具体ィ匕してもよい。  [0068] The embodiment is not limited to the above, and may be specifically described as follows, for example.
半導体素子 12の半田付け工程を以下のように行ってもよい。  The soldering process of the semiconductor element 12 may be performed as follows.
第 1の治具 32と半田付け対象物とを上下反転させ、第 1の治具 32上に半田付け対 象物を載置して、位置決め孔 34が下側に向けて開口するようにする。さらに、加圧面 35aが上向きとなるように第 2の治具 35を配置した後、該加圧面 35a上に半導体素 子 12を配置し、該半導体素子 12上に半田シート 33を配置する。  The first jig 32 and the object to be soldered are turned upside down and the object to be soldered is placed on the first jig 32 so that the positioning hole 34 opens downward. . Further, after the second jig 35 is arranged so that the pressing surface 35 a faces upward, the semiconductor element 12 is arranged on the pressing surface 35 a and the solder sheet 33 is arranged on the semiconductor element 12.
[0069] 次に、第 2の治具 35を、その加圧面 35a側力も位置決め孔 34内に挿入し、半田シ ート 33を金属回路 13に対向配置させた後、半田付け対象物及びの治具 32, 35を 上下反転させる。すると、金属回路 13上に半田シート 33が配置され、該半田シート 3 3上に半導体素子 12が配置される。その後、第 2の治具 35によって半導体素子 12 が加圧された状態で半田付け作業が行われる。  [0069] Next, the second jig 35 is inserted into the positioning hole 34 also with the pressing surface 35a side force, and the solder sheet 33 is disposed opposite to the metal circuit 13, and then the soldering object and Turn jigs 32 and 35 upside down. Then, the solder sheet 33 is disposed on the metal circuit 13, and the semiconductor element 12 is disposed on the solder sheet 33. Thereafter, the soldering operation is performed in a state where the semiconductor element 12 is pressurized by the second jig 35.
[0070] 図 10に示すように、第 2の治具 35上力も吸着装置 41を削除してもよい。この場合、 第 2の治具 35の下面 (加圧面 35a)以外の面に通路 37と連通する接続部 39が設け られ、該接続部 39はフレキシブルな配管 40を介して、容器 17の外部に設けられた 負圧源 50に接続される。また、配管 40の途中には、バルブ 40aが設けられている。 真空配管 40は、蓋体 19を通過して容器 17の内部に導入されている。ノ レブ 40aは 、接続部 39を負圧源 50に連通可能な状態と、接続部 39を大気とに連通可能な状態 とに切り換え可能になっている。すなわち、バルブ 40aの切り換え操作により、通路 3 7に負圧が作用する状態と、通路 37に対する負圧の作用が解除される状態とに切り 換えられる。なお、配管 40の荷重が第 2の治具 35による押圧作用に悪影響を及ぼさ ないように、容器 17の内部に存在する真空配管 40は図示しない支持部により支持さ れる。また、配管 40により加わる荷重を考慮して各第 2の治具 35の重さが設定される As shown in FIG. 10, the upper force of the second jig 35 may also be deleted from the suction device 41. In this case, a connecting portion 39 communicating with the passage 37 is provided on a surface other than the lower surface (pressurizing surface 35a) of the second jig 35, and the connecting portion 39 is connected to the outside of the container 17 through a flexible pipe 40. Connected to the negative pressure source 50 provided. Further, a valve 40 a is provided in the middle of the pipe 40. The vacuum pipe 40 is introduced into the container 17 through the lid 19. The nozzle 40a can be switched between a state in which the connection part 39 can communicate with the negative pressure source 50 and a state in which the connection part 39 can communicate with the atmosphere. That is, the switching operation of the valve 40a switches between a state where negative pressure acts on the passage 37 and a state where the negative pressure action on the passage 37 is released. Note that the vacuum pipe 40 existing inside the container 17 is supported by a support portion (not shown) so that the load of the pipe 40 does not adversely affect the pressing action of the second jig 35. In addition, the weight of each second jig 35 is set in consideration of the load applied by the pipe 40.
[0071] 図 11及び図 12に示すように、吸着装置 41を第 1の治具 32及び第 2の治具 35のい ずれも吸着可能な構成とし、吸着装置 41によって第 1の治具 32及び第 2の治具 35 のための運搬部（運搬装置）を構成してもよい。吸着装置 41は、 3つの真空ポンプ 38 a, 38b, 38cを備えている。第 1真空ポンプ 38aは、主に半導体素子 12及び半田シ ート 33を吸着するために機能し、該第 1真空ポンプ 38aには前記通路 42が接続され 、通路 42は前記シール部材 43aを介して第 2の治具 35の通路 37に連通可能である As shown in FIGS. 11 and 12, the suction device 41 is configured to be able to suck both the first jig 32 and the second jig 35, and the first jig 32 is used by the suction device 41. In addition, a transport unit (transport device) for the second jig 35 may be configured. The adsorption device 41 includes three vacuum pumps 38a, 38b, and 38c. The first vacuum pump 38a mainly functions to adsorb the semiconductor element 12 and the solder sheet 33. The passage 42 is connected to the first vacuum pump 38a, and the passage 42 passes through the seal member 43a. Can communicate with the passage 37 of the second jig 35.
[0072] 第 2真空ポンプ 38bは、第 2の治具 35を吸着するために機能し、該第 2真空ポンプ 38bには前記通路 42とは別の通路 45が接続されている。該通路 45は、吸着装置 41 の下面 41aに設けられた前記シール部材 43aに開口している。第 3真空ポンプ 38c は、第 1の治具 32を吸着するために機能し、該第 3真空ポンプ 38cには前記通路 42 , 45とは別の通路 46が接続されている。また、通路 46は、吸着装置 41の下面 41aに 設けられた前記シール部材 43aとは別のシール部材 43bに開口して 、る。 [0072] The second vacuum pump 38b functions to adsorb the second jig 35, and a passage 45 different from the passage 42 is connected to the second vacuum pump 38b. The passage 45 opens to the seal member 43a provided on the lower surface 41a of the adsorption device 41. The third vacuum pump 38c functions to adsorb the first jig 32, and a passage 46 other than the passages 42 and 45 is connected to the third vacuum pump 38c. The passage 46 opens to a seal member 43b different from the seal member 43a provided on the lower surface 41a of the adsorption device 41.
[0073] 上記吸着装置 41を用いて半田付けを行う場合、まず、図 11に示すように、吸着装 置 41の通路 45に第 2真空ポンプ 38bの負圧を作用させるとともに、通路 42に第 1真 空ポンプ 38aの負圧を作用させる。そして、第 2の治具 35を吸着装置 41に吸着させ るとともに、各第 2の治具 35に半田シート 33を吸着させる。カロえて、吸着装置 41の通 路 46に第 3真空ポンプ 38cの負圧を作用させ、第 1の治具 32を吸着装置 41に吸着 させる。このとき、第 1の治具 32の位置決め孔 34内に第 2の治具 35が挿入された状 態で第 1の治具 32及び第 2の治具 35が吸着装置 41に吸着される。 [0074] 次に、吸着装置 41を所定位置まで運搬し、通路 42, 45, 46に対する負圧の作用 を解除して、吸着装置 41による吸着作用を解除する。この結果、第 1の治具 32が金 属回路 13上に載置されるとともに、該第 1の治具 32の位置決め孔 34内に半田シート 33が位置決めされた状態で、半田シート 33が金属回路 13上に載置される。その後 、吸着装置 41の通路 45に第 2真空ポンプ 38bの負圧を作用させ、第 2の治具 35を 吸着装置 41に吸着させた状態で吸着装置 41を運搬前の位置まで移動させる。 When performing soldering using the adsorption device 41, first, as shown in FIG. 11, the negative pressure of the second vacuum pump 38b is applied to the passage 45 of the adsorption device 41, and the first passage is applied to the passage 42. 1Apply vacuum pressure of vacuum pump 38a. Then, the second jig 35 is adsorbed to the adsorption device 41 and the solder sheet 33 is adsorbed to each second jig 35. Then, the negative pressure of the third vacuum pump 38c is applied to the passage 46 of the adsorption device 41, and the first jig 32 is adsorbed to the adsorption device 41. At this time, the first jig 32 and the second jig 35 are sucked by the suction device 41 in a state where the second jig 35 is inserted into the positioning hole 34 of the first jig 32. Next, the adsorption device 41 is transported to a predetermined position, the negative pressure action on the passages 42, 45, 46 is released, and the adsorption action by the adsorption device 41 is released. As a result, the first jig 32 is placed on the metal circuit 13, and the solder sheet 33 is positioned in the positioning hole 34 of the first jig 32 so that the solder sheet 33 is metal. Mounted on circuit 13. Thereafter, the negative pressure of the second vacuum pump 38b is applied to the passage 45 of the adsorption device 41, and the adsorption device 41 is moved to a position before transporting in a state where the second jig 35 is adsorbed by the adsorption device 41.
[0075] 続いて、図 12に示すように、吸着装置 41の通路 45に第 2真空ポンプ 38bの負圧を 作用させて第 2の治具 35を吸着装置 41に吸着させるとともに、通路 42に第 1真空ポ ンプ 38aの負圧を作用させて各第 2の治具 35に半導体素子 12を吸着させる。そして 、吸着装置 41を所定位置まで運搬し、通路 42, 45に対する負圧の作用を解除して 、吸着装置 41による吸着作用を解除する。この結果、第 2の治具 35が位置決め孔 3 4内に挿入されるとともに、半導体素子 12が半田シート 33上に載置される。  Subsequently, as shown in FIG. 12, the negative pressure of the second vacuum pump 38b is applied to the passage 45 of the adsorption device 41 to cause the second jig 35 to be adsorbed to the adsorption device 41 and to the passage 42. The negative pressure of the first vacuum pump 38a is applied to adsorb the semiconductor element 12 to each second jig 35. Then, the adsorption device 41 is transported to a predetermined position, the negative pressure action on the passages 42 and 45 is released, and the adsorption action by the adsorption device 41 is released. As a result, the second jig 35 is inserted into the positioning hole 34 and the semiconductor element 12 is placed on the solder sheet 33.
[0076] 半田付けが終了した後、蓋体 19を本体 18から取り外し、吸着装置 41を半導体モジ ユール 100と対応する位置まで移動させる。その後、吸着装置 41の通路 45に第 2真 空ポンプ 38bの負圧を作用させるとともに、通路 46に第 3真空ポンプ 38cの負圧を作 用させる。この結果、第 1の治具 32及び第 2の治具 35が吸着装置 41に吸着される。 そして、第 1の治具 32及び第 2の治具 35を容器 17外へ移動させた後、半導体モジュ 一ノレ 100を取り出す。  After the soldering is completed, the lid 19 is removed from the main body 18, and the suction device 41 is moved to a position corresponding to the semiconductor module 100. Thereafter, the negative pressure of the second vacuum pump 38b is applied to the passage 45 of the adsorption device 41, and the negative pressure of the third vacuum pump 38c is applied to the passage 46. As a result, the first jig 32 and the second jig 35 are adsorbed by the adsorption device 41. Then, after the first jig 32 and the second jig 35 are moved out of the container 17, the semiconductor module 100 is taken out.
[0077] 第 1の治具 32及び第 2の治具 35のための運搬部 (運搬装置)として、上記吸着装 置 41に代えて、電磁石によって第 1の治具 32及び第 2の治具 35を吸着可能とする 磁気回路を用いてもよい。この磁気回路を用いた場合、第 1の治具 32及び第 2の治 具 35の上面に、前記電磁石に吸着され得る磁性材 (例えば、鉄）が設けられる。  [0077] Instead of the suction device 41, the first jig 32 and the second jig are transported by the electromagnet instead of the suction device 41 as a transporting part (transporting device) for the first jig 32 and the second jig 35. A magnetic circuit that can attract 35 may be used. When this magnetic circuit is used, a magnetic material (for example, iron) that can be attracted to the electromagnet is provided on the upper surfaces of the first jig 32 and the second jig 35.
[0078] 第 1の治具 32及び第 2の治具 35のための運搬部 (運搬装置)として、上記吸着装 置 41に代えて、機械的なチャック機構を用いてもよい。このチャック機構を用いた場 合、第 1の治具 32及び第 2の治具 35の上面に、チャック機構が係止可能な係止部材 が設けられる。  [0078] Instead of the suction device 41, a mechanical chuck mechanism may be used as a transport unit (transport device) for the first jig 32 and the second jig 35. When this chuck mechanism is used, a locking member capable of locking the chuck mechanism is provided on the upper surfaces of the first jig 32 and the second jig 35.
[0079] 半導体素子 12の配置や大きさや高さは、前記実施形態のそれに限られない。  The arrangement, size, and height of the semiconductor element 12 are not limited to those of the above embodiment.
第 2の治具 35は、肖 ijり出しによって形成された一体的な部品であってもよぐ複数の 分割体が互 、に接合されることで構成されてもょ 、。 The second jig 35 may be an integral part formed by projecting a plurality of pieces. It may consist of the split pieces joined together.
[0080] 全ての第 2の治具 35を全部同時に位置決め孔 34内に挿入するのではなぐ 1個ず つ又は適宜の数ずつ位置決め孔 34内に挿入してもよい。  [0080] Instead of inserting all the second jigs 35 into the positioning holes 34 at the same time, they may be inserted into the positioning holes 34 one by one or an appropriate number.
第 2の治具 35の加圧面 35aの大きさは、必ずしも対応する半導体素子 12の非接合 面の全面に当接可能な大きさでなくてもよい。加圧面 35aの大きさは、対応する半導 体素子 12の非接合面よりも大きくてもあるいは小さくてもよい。  The size of the pressing surface 35a of the second jig 35 does not necessarily have to be a size capable of contacting the entire non-bonding surface of the corresponding semiconductor element 12. The size of the pressing surface 35a may be larger or smaller than the non-bonding surface of the corresponding semiconductor element 12.
[0081] 半田シート 33の外形は、半導体素子 12の外形と同一であってもよぐ半導体素子 1[0081] The outer shape of the solder sheet 33 may be the same as the outer shape of the semiconductor element 12. The semiconductor element 1
2より/ J、さくてもよい。 More than 2 / J, you can do it.
誘導加熱で第 2の治具 35を加熱してその熱で半田シート 33を溶融させる構成にお いて、第 2の治具 35はステンレス製に限らず、誘導加熱可能な材料であればよぐ例 えば、ステンレスに代えて、鉄やグラフアイト、或いは熱伝導率の異なる 2種類の導体 材料で構成されてもよい。  In the configuration in which the second jig 35 is heated by induction heating and the solder sheet 33 is melted by the heat, the second jig 35 is not limited to stainless steel but may be any material that can be induction heated. For example, instead of stainless steel, it may be composed of iron, graphite, or two types of conductor materials having different thermal conductivities.
[0082] 半田シート 33を溶融温度以上に加熱する加熱方法は誘導加熱以外の方法であつ てもよい。例えば、容器 17内に電気ヒーターを設けて半田シート 33を加熱するように してちよい。  [0082] The heating method for heating the solder sheet 33 to the melting temperature or higher may be a method other than induction heating. For example, an electric heater may be provided in the container 17 to heat the solder sheet 33.
[0083] 回路基板 11は、セラミック基板 14が冷媒流路 15aを有しないヒートシンク 15に固定 された構成であってもよい。また、回路基板 11は、ヒートシンク 15を有しない構成であ つてもよい。  The circuit board 11 may have a configuration in which the ceramic substrate 14 is fixed to the heat sink 15 that does not have the refrigerant flow path 15a. Further, the circuit board 11 may be configured without the heat sink 15.
[0084] 蓋体 19は、本体 18に対して取り外し不能な構成、例えば、開閉可能に本体 18に 連結されてもよい。  [0084] The lid 19 may be connected to the main body 18 so as to be detachable from the main body 18, for example, to be opened and closed.
蓋体 19は、少なくとも高周波加熱コイル 28と対向する部位が電気的絶縁材で形成 されているのが好ましぐ当該部位をガラスに代えて、例えば、セラミックスゃ榭脂で 形成してもよい。また、蓋体 19全体を同じ電気的絶縁材で形成してもよい。  The lid 19 may be formed of, for example, a ceramic resin instead of glass, where at least a portion facing the high-frequency heating coil 28 is preferably formed of an electrically insulating material. Further, the entire lid 19 may be formed of the same electrical insulating material.
[0085] 容器 17の内外の圧力差に対応して蓋体 19の強度を上げる必要がある場合には、 蓋体 19を、例えば、グラスファイバーと榭脂との複合材 (GFRP (ガラス繊維強化ブラ スチック））で構成してもよい。また、蓋体 19を、金属で構成してもよい。金属としては 非磁性材の金属が好ましい。なお、蓋体 19に磁性材の金属を用いる場合には、第 2 の治具 35よりも電気抵抗率が高いものを用いた方が良い。また、蓋体 19を金属と絶 縁材との複合材で形成してもよい。また、第 2の治具 35に効果的に磁束を導くように 、第 2の治具 35の直上部には強磁性体の電磁鋼板等を用いると良い。 [0085] When it is necessary to increase the strength of the lid 19 corresponding to the pressure difference between the inside and outside of the container 17, the lid 19 is made of, for example, a composite material (GFRP (glass fiber reinforced Plastic)). The lid 19 may be made of metal. The metal is preferably a non-magnetic metal. When a magnetic metal is used for the lid 19, it is better to use a metal having a higher electrical resistivity than the second jig 35. Also, remove the lid 19 from metal. You may form with a composite material with an edge material. In order to effectively guide the magnetic flux to the second jig 35, a ferromagnetic electromagnetic steel sheet or the like is preferably used immediately above the second jig 35.
[0086] 高周波加熱コイル 28は、複数の第 2の治具 35の上方において、複数の第 2の治具 35に跨って配置されてもよい。この場合、高周波加熱コイル 28に対する高周波電流 の供給経路や冷却水の供給経路を少なくすることができ、半田付け装置 HKの構造 をさらに簡素化できる。 The high-frequency heating coil 28 may be disposed above the plurality of second jigs 35 and straddling the plurality of second jigs 35. In this case, the number of high-frequency current supply paths and cooling water supply paths to the high-frequency heating coil 28 can be reduced, and the structure of the soldering apparatus HK can be further simplified.
[0087] 生産ラインィ匕に伴って容器 17を移動可能とし、当該容器 17とともに移動する第 2の 治具 35の移動経路に沿って高周波加熱コイル 28を配置してもよい。この場合、高周 波加熱コイル 28を移動経路に沿った形状に形成しても良 、し、移動経路に沿って複 数配置しても良い。このように構成することで、容器 17を移動させながら加熱すること が可能である。  The container 17 may be movable along with the production line, and the high-frequency heating coil 28 may be disposed along the movement path of the second jig 35 that moves together with the container 17. In this case, the high frequency heating coil 28 may be formed in a shape along the moving path, or a plurality of high frequency heating coils 28 may be arranged along the moving path. With this configuration, the container 17 can be heated while being moved.
[0088] 高周波加熱コイル 28は、第 2の治具 35の側面に対向するように配置されても良い。  The high frequency heating coil 28 may be disposed so as to face the side surface of the second jig 35.
高周波加熱コイル 28は、容器 17 (密閉空間 S)内に配置されても良い。  The high-frequency heating coil 28 may be disposed in the container 17 (sealed space S).

Claims

請求の範囲 The scope of the claims
[1] 回路基板上に設けられた接合部に半田シートを用いて半導体素子を半田付けする 際に用いられる位置決め治具において、  [1] In a positioning jig used when soldering a semiconductor element using a solder sheet to a joint provided on a circuit board,
上下方向に貫通する位置決め孔を有する第 1の治具であって、前記位置決め孔は 前記半導体素子及び前記半田シートの挿入を許容し、第 1の治具は前記位置決め 孔が前記接合部に対応するように前記回路基板に対して配置されることと、  A first jig having a positioning hole penetrating in the vertical direction, wherein the positioning hole allows the semiconductor element and the solder sheet to be inserted, and the first jig corresponds to the joining portion. Being arranged with respect to the circuit board,
前記位置決め孔に揷脱可能な第 2の治具であって、該第 2の治具は、前記位置決 め孔内に挿入された状態において前記半田シート上に配置された前記半導体素子 を前記回路基板へ向けて押圧する加圧面を有し、第 2の治具は、位置決め孔に挿入 されたとき、前記加圧面が前記接合部と対向する位置に配置されるように、位置決め 孔を形成する壁面によって位置決めされることと  A second jig capable of being removed from the positioning hole, wherein the second jig inserts the semiconductor element disposed on the solder sheet in a state of being inserted into the positioning hole. The second jig has a pressing surface for pressing toward the circuit board, and the second jig forms a positioning hole so that the pressing surface is arranged at a position facing the joint when inserted into the positioning hole. Being positioned by the wall surface
を備える位置決め治具。  A positioning jig comprising:
[2] 前記位置決め孔は、該位置決め孔の前記壁面に前記半田シートの周縁部が対向 することで前記半田シートを前記接合部上に位置決めするように形成されている請 求項 1に記載の位置決め治具。  [2] The positioning hole according to claim 1, wherein the positioning hole is formed so as to position the solder sheet on the joint portion by allowing a peripheral edge portion of the solder sheet to face the wall surface of the positioning hole. Positioning jig.
[3] 前記位置決め孔の前記壁面と前記加圧面によって押圧されて!/、る前記半導体素 子の周縁部との間には、前記半田シートの厚さの 1Z2以上の大きさを有する隙間が 、前記半導体素子の周囲全体に亘つて形成される請求項 1又は請求項 2に記載の位 置決め治具。  [3] A gap having a size of 1Z2 or more of the thickness of the solder sheet is provided between the wall surface of the positioning hole and the peripheral portion of the semiconductor element that is pressed by the pressing surface. The positioning jig according to claim 1 or 2, wherein the positioning jig is formed over the entire periphery of the semiconductor element.
[4] 前記隙間は、前記半田シートの厚さより大きい請求項 3に記載の位置決め治具。  4. The positioning jig according to claim 3, wherein the gap is larger than the thickness of the solder sheet.
[5] 前記第 2の治具は前記加圧面に開口を有する通路を備え、該通路は、前記半導体 素子又は前記半田シートを前記加圧面に吸着するための負圧を発生する負圧源に 接続される請求項 1〜請求項 4のいずれか一項に記載の位置決め治具。 [5] The second jig includes a passage having an opening in the pressure surface, and the passage serves as a negative pressure source that generates a negative pressure for adsorbing the semiconductor element or the solder sheet to the pressure surface. The positioning jig according to any one of claims 1 to 4, which is connected.
[6] 前記負圧源を有する吸着装置であって、該吸着装置は、前記負圧源に接続され且 つ前記第 2の治具に対向する面に開口を有する通路を備えることと、 [6] An adsorption device having the negative pressure source, the adsorption device comprising a passage connected to the negative pressure source and having an opening on a surface facing the second jig;
前記吸着装置と前記第 2の治具との間に設けられるシール部材であって、前記吸 着装置の通路と前記第 2の治具の通路とは前記シール部材を介して接続されることと をさらに備える請求項 5に記載の位置決め治具。 A seal member provided between the suction device and the second jig, the passage of the suction device and the passage of the second jig being connected via the seal member; The positioning jig according to claim 5, further comprising:
[7] 前記加圧面以外の前記第 2の治具の部位には、前記通路に接続される接続部が 設けられ、該接続部はフレキシブルな配管を介して前記負圧源に接続されて ヽる請 求項 5に記載の位置決め治具。 [7] A connection portion connected to the passage is provided at a portion of the second jig other than the pressure surface, and the connection portion is connected to the negative pressure source via a flexible pipe. The positioning jig according to claim 5.
[8] 前記第 2の治具は誘導加熱可能な導電材料により形成されている請求項 1〜請求 項 7の 、ずれか一項に記載の位置決め治具。 [8] The positioning jig according to any one of claims 1 to 7, wherein the second jig is formed of a conductive material capable of induction heating.
[9] 前記加圧面の外形は前記半田シート及び半導体素子の外形より大きい請求項 1〜 請求項 8のいずれか一項に記載の位置決め治具。 [9] The positioning jig according to any one of [1] to [8], wherein an outer shape of the pressing surface is larger than outer shapes of the solder sheet and the semiconductor element.
[10] 回路基板上に設けられた接合部に半田シートを用いて半導体素子を半田付けする 際に、該回路基板に対して半田シート及び半導体素子を位置決めするための位置 決め方法において、 [10] In a positioning method for positioning the solder sheet and the semiconductor element with respect to the circuit board when the semiconductor element is soldered to the joint provided on the circuit board using the solder sheet,
第 1の治具と第 2の治具とを備える位置決め治具を準備することであって、前記第 1 の治具は上下方向に貫通する位置決め孔を有し、前記第 2の治具は前記位置決め 孔に揷脱可能であるとともに加圧面を有することと、  Preparing a positioning jig comprising a first jig and a second jig, wherein the first jig has a positioning hole penetrating in the vertical direction, and the second jig is The positioning hole is detachable and has a pressure surface;
前記位置決め孔が前記接合部に対応するように、前記第 1の治具を前記回路基板 に対して配置することと、  Disposing the first jig with respect to the circuit board such that the positioning hole corresponds to the joint portion;
前記加圧面に半田シートを配置した状態で前記位置決め孔に前記第 2の治具を挿 入することであって、前記加圧面が前記接合部に対向するように前記位置決め孔の 壁面によって第 2の治具が位置決めされ、それによつて半田シートが接合部に対して 位置決めされることと、  The second jig is inserted into the positioning hole in a state where the solder sheet is disposed on the pressing surface, and a second wall is formed by the wall surface of the positioning hole so that the pressing surface faces the joint. The jig is positioned so that the solder sheet is positioned relative to the joint,
前記加圧面に半導体素子を配置した状態で前記位置決め孔に前記第 2の治具を 挿入することであって、前記加圧面が前記半田シートに対向するように前記位置決 め孔の壁面によって第 2の治具が位置決めされ、それによつて半導体素子が半田シ ートに対して位置決めされることと  The second jig is inserted into the positioning hole in a state where the semiconductor element is disposed on the pressure surface, and the second surface is formed by the wall surface of the positioning hole so that the pressure surface faces the solder sheet. 2 jigs are positioned, and the semiconductor element is positioned with respect to the solder sheet.
を備える位置決め方法。  A positioning method comprising:
[11] 前記半導体素子の外形より大きい外形を有する半田シートが使用される請求項 10 に記載の位置決め方法。 11. The positioning method according to claim 11, wherein a solder sheet having an outer shape larger than that of the semiconductor element is used.
[12] 回路基板と、該回路基板上に設けられた接合部に半田シートを用いて半田付けさ れる半導体素子とを備える半導体モジュールの製造方法において、 第 1の治具と第 2の治具とを備える位置決め治具を準備することであって、前記第 1 の治具は上下方向に貫通する位置決め孔を有し、前記第 2の治具は前記位置決め 孔に揷脱可能であるとともに加圧面を有することと、 [12] In a method for manufacturing a semiconductor module comprising a circuit board and a semiconductor element soldered to a joint provided on the circuit board using a solder sheet, Preparing a positioning jig comprising a first jig and a second jig, wherein the first jig has a positioning hole penetrating in the vertical direction, and the second jig is The positioning hole is detachable and has a pressure surface;
前記位置決め孔が前記接合部に対応するように、前記第 1の治具を前記回路基板 に対して配置することと、  Disposing the first jig with respect to the circuit board such that the positioning hole corresponds to the joint portion;
前記加圧面に半田シートを配置した状態で前記位置決め孔に前記第 2の治具を挿 入することであって、前記加圧面が前記接合部に対向するように前記位置決め孔の 壁面によって第 2の治具が位置決めされ、それによつて半田シートが接合部に対して 位置決めされることと、  The second jig is inserted into the positioning hole in a state where the solder sheet is disposed on the pressing surface, and a second wall is formed by the wall surface of the positioning hole so that the pressing surface faces the joint. The jig is positioned so that the solder sheet is positioned relative to the joint,
前記加圧面に前記半導体素子を配置した状態で前記位置決め孔に前記第 2の治 具を挿入することであって、前記加圧面が前記半田シートに対向するように前記位置 決め孔の壁面によって第 2の治具が位置決めされ、それによつて半導体素子が半田 シートに対して位置決めされることと、  The second jig is inserted into the positioning hole in a state where the semiconductor element is disposed on the pressure surface, and the second surface is formed by the wall surface of the positioning hole so that the pressure surface faces the solder sheet. 2 jigs are positioned, whereby the semiconductor element is positioned with respect to the solder sheet;
前記位置決め孔に挿入された第 2の治具の加圧面によって前記半導体素子を前 記回路基板へ向けて押圧した状態で前記半田シートを加熱及び溶融し、それによつ て半導体素子を接合部に半田付けすることと  The solder sheet is heated and melted in a state where the semiconductor element is pressed against the circuit board by the pressing surface of the second jig inserted into the positioning hole, and thereby the semiconductor element is used as a joint. Soldering and
を備える半導体モジュールの製造方法。 A method for manufacturing a semiconductor module comprising:
回路基板に設けられた接合部に半田シートを用いて半導体素子を半田付けする半 田付け装置において、  In a soldering apparatus for soldering a semiconductor element using a solder sheet to a joint provided on a circuit board,
上下方向に貫通する位置決め孔を有する第 1の治具であって、前記位置決め孔は 前記半導体素子及び前記半田シートの挿入を許容し、第 1の治具は前記位置決め 孔が前記接合部に対応するように前記回路基板に対して配置されることと、  A first jig having a positioning hole penetrating in the vertical direction, wherein the positioning hole allows the semiconductor element and the solder sheet to be inserted, and the first jig corresponds to the joining portion. Being arranged with respect to the circuit board,
前記位置決め孔に揷脱可能な第 2の治具であって、該第 2の治具は、前記位置決 め孔内に挿入された状態において前記半田シート上に配置された前記半導体素子 を前記回路基板へ向けて押圧する加圧面を有し、第 2の治具は、位置決め孔に挿入 されたとき、前記加圧面が前記接合部と対向する位置に配置されるように、位置決め 孔を形成する壁面によって位置決めされることと、  A second jig capable of being removed from the positioning hole, wherein the second jig inserts the semiconductor element disposed on the solder sheet in a state of being inserted into the positioning hole. The second jig has a pressing surface for pressing toward the circuit board, and the second jig forms a positioning hole so that the pressing surface is arranged at a position facing the joint when inserted into the positioning hole. Being positioned by the wall surface to be
前記第 1の治具及び前記第 2の治具のうち少なくとも第 2の治具を運搬可能な運搬 部と Transport capable of transporting at least a second jig out of the first jig and the second jig Department and
を備える半田付け装置。 A soldering apparatus comprising:
PCT/JP2007/050779 2006-01-20 2007-01-19 Aligning jig, aligning method, method for manufacturing semiconductor module and soldering apparatus WO2007083738A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103000559A (en) * 2011-09-16 2013-03-27 富士电机株式会社 Positioning clamp for semiconductor chip and manufacture method for semiconductor device
WO2021197713A1 (en) * 2020-03-31 2021-10-07 Siemens Aktiengesellschaft Workpiece carrier and mold for joining an electric circuit carrier

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5838559B2 (en) 2011-02-08 2016-01-06 富士電機株式会社 Semiconductor device assembly jig and semiconductor device assembly method
JP2013135199A (en) * 2011-12-27 2013-07-08 Toyota Industries Corp Semiconductor device
JP6303623B2 (en) 2014-03-07 2018-04-04 富士電機株式会社 Semiconductor device, semiconductor device manufacturing method, positioning jig
JP6330640B2 (en) * 2014-12-09 2018-05-30 三菱電機株式会社 Manufacturing method of semiconductor device
JP7287085B2 (en) 2019-04-18 2023-06-06 富士電機株式会社 ASSEMBLY JIG SET AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104295A (en) * 1992-03-19 1994-04-15 Tamura Seisakusho Co Ltd Soldering of hybrid ic
JPH07297209A (en) * 1994-04-22 1995-11-10 Mitsubishi Electric Corp Die bonding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104295A (en) * 1992-03-19 1994-04-15 Tamura Seisakusho Co Ltd Soldering of hybrid ic
JPH07297209A (en) * 1994-04-22 1995-11-10 Mitsubishi Electric Corp Die bonding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103000559A (en) * 2011-09-16 2013-03-27 富士电机株式会社 Positioning clamp for semiconductor chip and manufacture method for semiconductor device
WO2021197713A1 (en) * 2020-03-31 2021-10-07 Siemens Aktiengesellschaft Workpiece carrier and mold for joining an electric circuit carrier

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