WO2007067838A3 - One dimensional nanostructure spiral inductors - Google Patents
One dimensional nanostructure spiral inductors Download PDFInfo
- Publication number
- WO2007067838A3 WO2007067838A3 PCT/US2006/060936 US2006060936W WO2007067838A3 WO 2007067838 A3 WO2007067838 A3 WO 2007067838A3 US 2006060936 W US2006060936 W US 2006060936W WO 2007067838 A3 WO2007067838 A3 WO 2007067838A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- inductor
- dimensional nanostructure
- spiral inductors
- inductance
- substrate
- Prior art date
Links
- 239000002086 nanomaterial Substances 0.000 title abstract 4
- 230000003197 catalytic effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 230000007613 environmental effect Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53276—Conductive materials containing carbon, e.g. fullerenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0046—Printed inductances with a conductive path having a bridge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
A method is provided for making an inductor comprising forming a catalytic material (14) over a substrate (12); and creating a network of one dimensional nanostructures (30) on the catalytic material, the network providing an inductance when a voltage is applied thereacross. This inductor is described in three applications: as an on-chip inductor for electronic circuitry, as a magnetic sensor, and as an environmental sensor. Several embodiments are described herein for forming networks of nanostructures on or above the substrate that provide an inductance having a high Q and a reduced die size for RF circuits. Several embodiments are also described for use of the nanostructure to sense gasses, radiation, a magnetic field, and the like.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29600305A | 2005-12-06 | 2005-12-06 | |
US11/296,003 | 2005-12-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007067838A2 WO2007067838A2 (en) | 2007-06-14 |
WO2007067838A3 true WO2007067838A3 (en) | 2007-12-21 |
Family
ID=38123583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/060936 WO2007067838A2 (en) | 2005-12-06 | 2006-11-15 | One dimensional nanostructure spiral inductors |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101326535A (en) |
WO (1) | WO2007067838A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150173380A1 (en) * | 2012-07-06 | 2015-06-25 | Pier RUBESA | Method and apparatus for the amplification of electrical charges in biological systems or bioactive matter using an inductive disk with a fixed geometric trace |
CN102881651B (en) * | 2012-10-25 | 2015-10-28 | 天津理工大学 | A kind of method improving electrical interconnection characteristic of carbon nano tube |
CN104614403B (en) * | 2015-01-22 | 2017-05-24 | 江西师范大学 | Sensor, forming method of sensor, and method for defecting gas |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040112964A1 (en) * | 2002-09-30 | 2004-06-17 | Nanosys, Inc. | Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites |
-
2006
- 2006-11-15 WO PCT/US2006/060936 patent/WO2007067838A2/en active Application Filing
- 2006-11-15 CN CN 200680046047 patent/CN101326535A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040112964A1 (en) * | 2002-09-30 | 2004-06-17 | Nanosys, Inc. | Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites |
Also Published As
Publication number | Publication date |
---|---|
CN101326535A (en) | 2008-12-17 |
WO2007067838A2 (en) | 2007-06-14 |
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