WO2007031024A1 - A high performance passive type phase transformation heat sink system and an application thereof - Google Patents

A high performance passive type phase transformation heat sink system and an application thereof Download PDF

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Publication number
WO2007031024A1
WO2007031024A1 PCT/CN2006/002387 CN2006002387W WO2007031024A1 WO 2007031024 A1 WO2007031024 A1 WO 2007031024A1 CN 2006002387 W CN2006002387 W CN 2006002387W WO 2007031024 A1 WO2007031024 A1 WO 2007031024A1
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Prior art keywords
micro
condenser
groove
capillary
heat dissipation
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PCT/CN2006/002387
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English (en)
French (fr)
Inventor
Yaohua Zhao
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Sino-Tech Investment Holdings Limited
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Publication of WO2007031024A1 publication Critical patent/WO2007031024A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a technology for passive phase change heat exchange of a heating working element or component, in particular to a high performance passive phase change heat dissipation system and application thereof, and the specific application comprises a phase change heat dissipation system for a desktop computer and a notebook A cooling system in a small room such as a computer.
  • Background technique
  • the heat density of the High performance chip is about 60 W/cm 2 .
  • This heat flux density is at the same level as the core heat flux of a light water furnace reactor (LWR), but the difference between the heat sink surface temperature and the ambient temperature required by the former is much lower than the latter.
  • the thermal control technology of the computer that is, the cooling technology requirement, has to satisfy the upper limit temperature (about 100oC) and the ever-increasing heat dissipation heat flux density, which has become an international technical problem.
  • the cooling capacity of the general-scale air-cooling technology currently in common use is an order of magnitude lower than the heat density of the above-mentioned high-performance chips at a general flow speed (for example, 20 m/s).
  • active methods and passive methods are active methods and passive methods.
  • the passive approach is to refine the heat exchanger flow path to enhance heat transfer performance and increase heat transfer area (such as adding microchannels, etc.).
  • the active methods mainly include increasing the working fluid flow rate and reducing the inlet temperature of the cooling medium.
  • These enhancement methods involve micro-systems and micro-heat transfer problems, such as increasing the micro repowering system (lifting the working fluid flow rate), micro-refrigeration systems (reducing the cooling medium temperature), and micro-fan systems (improving the environment). Convective heat transfer) performance.
  • the phase change cooling technology of computers is another type of new cooling technology that is being developed and developed that is different from air cooling technology.
  • the theoretical limit of the phase change evaporation heat flux is about two orders of magnitude higher than the current maximum heat flux density of the computer.
  • the temperature condition satisfies the upper limit temperature of the computer.
  • micro-heat pipe technologies also divided into capillary type, forced vibration type and self-excited oscillation type
  • micro-slot group evaporation type heat sink technology are also divided into capillary type, forced vibration type and self-excited oscillation type
  • micro-slot group evaporation type heat sink technology are also divided into capillary type, forced vibration type and self-excited oscillation type.
  • the best passive cooling technology in China has limited heat dissipation capability.
  • the cooling method of domestic desktop computers is mainly fin-and-fan method, technically working on the fin process and fan performance.
  • the cooling system of notebook computers that require small size and high heat dissipation power is basically imported from abroad and the host. It can be said that at home and abroad, LSI cooling issues (including CPU, HDD, FDD and LCD) will be the constraint computer The most important and most urgent factor in performance.
  • high-energy lasers, optical communications and other fields have also put forward new requirements for high-power and small-sized heat sinks.
  • the present invention provides a high performance passive phase change heat dissipation system for the deficiencies or defects existing in the prior art.
  • the use of the heat dissipation system facilitates sufficient heat dissipation of the high heat flux heat generating body to meet the heat dissipation requirements of high performance chips, high energy lasers, optical communication or other electromechanical devices.
  • the present invention also provides a phase change heat dissipation system for a desktop computer that meets the cooling requirements of a next generation desktop computer with a large heat exchange capacity.
  • the present invention also provides a heat dissipation system for use in a small space such as a notebook computer, which is advantageous for increasing the total heat exchange amount.
  • the general technical idea of the present invention is as follows:
  • a high-performance micro-slot group phase change cooling mode has been developed, which utilizes the capillary pump loop to make the micro-slot group evaporator and condensation
  • the space-isolated structure is designed to improve the heat-dissipating and cooling capacity of high-heat-flow-density heating elements, and to develop high-performance passive cooling elements that meet various small sizes and to meet advanced electronic devices in the next generation of computers and other extreme environments.
  • the cooling system addresses the licensing needs of the military and the thermal issues facing the IT industry.
  • the technical solution of the present invention is as follows - a high performance passive phase change heat dissipation system, comprising a micro-slot group evaporator and a condenser, wherein: the micro-slot group evaporator is connected with a capillary pump ring line, the capillary pump ring line Connected to the condenser.
  • the micro-slot group evaporator includes a micro-slot group evaporating heat exchange element, and a dense micro-capillary groove is distributed on the evaporation surface of the evaporating heat-exchange element, and a capillary force generated in the micro-capillary groove can suck the liquid into the groove, thereby
  • the liquid in the tank forms a meniscus evaporation heat transfer near the gas, liquid and solid three-phase contact lines.
  • the microgroove group surface layer is a Ti0 2 material layer or other hydrophilic material layer for superhydrophilic treatment of the micro groove group surface.
  • the micro-capillary groove is a straight groove, the groove width is 0.01-lmm, and the groove depth is 1-4 times of the groove width.
  • the groove width is 0.1-0.5 mm.
  • the capillary pumping line includes a vapor delivery line portion and a liquid return line portion, and a one-way valve is disposed in the line.
  • the outlet end of the liquid return line portion is butted to the microchannel structure, and the microchannel structure is used for the capillary pump loop
  • the reflux liquid in the capillary is driven by the capillary.
  • the condenser is a naturally cooled condenser, a forced air cooled condenser, a water cooled condenser or a reinforced high efficiency condenser using a polymer grid-like complex membrane.
  • a phase change heat dissipation system for a desktop computer comprising: a micro-slot group evaporator and a condenser for heat dissipation of a chip, wherein the micro-slot group evaporator is connected with a capillary pump ring line, the condenser is located on the table top On both sides of the chassis of the computer, the capillary pump ring line is connected to the condenser.
  • a heat dissipation system for use in a small space such as a notebook computer comprising: a micro-slot group evaporator and a condenser for cooling the CPU, wherein the micro-slot group evaporator is connected with a capillary pump ring line, the condensation
  • the devices are respectively located on the display backplane layer of the notebook computer and the host backplane layer, and the capillary pump ring pipeline is connected to the condenser, and a hose path is adopted at the rotating shaft of the notebook computer.
  • the heat dissipation cooling capability is improved by utilizing a capillary pump ring line to realize spatial isolation of the micro-slot group evaporator and the condenser, so that the heat dissipation system is advantageous for high heat flux density.
  • the heating element is fully cooled and cooled to meet the heat dissipation requirements of high performance chips, high energy lasers, optical communications or other electromechanical devices.
  • the micro-groove group evaporator uses the micro-groove group to evaporate the heat-exchange element, the capillary phenomenon is fully utilized by the dense micro-capillary grooves distributed on the evaporation surface, and the capillary force generated in the micro-groove causes the liquid to be sucked into the micro-groove.
  • the liquid in each tank is attached to a three-phase (gas, liquid, solid) contact line with a small meniscus, and the evaporation of the meniscus has a large local heat transfer coefficient.
  • the heat exchange capacity may be higher than or several times the critical thermal load of boiling in the general pool. It has the characteristics of arbitrary heat exchange size and great heat exchange. Therefore, the heat exchange technology may have important application prospects in the future heat dissipation of ultra-microelectronics and micro-system devices and heat dissipation of spacecraft components.
  • microgroove group surface layer is a Ti0 2 material layer or other hydrophilic material layer
  • the micro-groove group surface is subjected to super-hydrophilic treatment, thereby obtaining a strengthened micro-groove group evaporating heat exchange element.
  • the groove width is 0.01-lmm
  • the groove depth is 1-4 times of the groove width
  • the groove width can be further increased to 0.1-0.5 MM; this is for the open type micro-slot group evaporation heat transfer surface , can get the best micro-slot size parameters and the best structural design (multi-layer, 'combined micro-groove and external capillary reinforcement structure, etc.).
  • the check valve is provided with a one-way valve, this can fully ensure the one-way flow of the vapor and the liquid, so that the entire CPL circuit, that is, the capillary pump ring line, which is not provided with the liquid pump, is determined by the geometric design of the circuit. Node pressure, which is conducive to the normal operation of the system.
  • the microchannel structure Since the outlet end of the liquid return line portion is docked to the microchannel structure, the microchannel structure is used for the capillary pump loop
  • the reflux liquid in the middle is driven by capillary, that is to say, by using the docking technology of the circuit and the evaporator, not only the liquid returning from the return pipe is continuously replenished into the evaporator, but also an optimal design can be realized, and the liquid connection is added to On the evaporation surface, the influence of gravity on the flow resistance can be overcome, and the negative pressure formed by the capillary force in the micro-groove group can be used to increase the driving force of the liquid return flow.
  • the condenser is a naturally cooled condenser, a forced air-cooled condenser, a water-cooled condenser or a reinforced high-efficiency condenser using a polymer grid-like complex membrane, this facilitates proper configuration according to different working conditions or operating environments. .
  • the structure design of the microchannel group evaporator and the condenser is spatially separated by the capillary pump ring line to improve the high heat flux density.
  • the condenser is placed on both sides of the chassis of the desktop computer, and the evaporation evaporation of the evaporator can be applied to the outer walls of both sides of the computer case to generate natural convection heat exchange with the outside air. After the steam is condensed It is recirculated into the evaporator, so that it can meet the cooling requirements of future desktop computers with a large heat exchange capacity without the need of a fan.
  • the structural design of the micro-slot group evaporator and the condenser is spatially separated by using a capillary pump ring line to improve the height of the structure.
  • the condenser is placed on the display backplane layer of the notebook computer and the host backplane layer, and a hose path is adopted at the rotating shaft of the notebook computer; this can solve the critical heat flow.
  • Figure 1 is a schematic diagram of the evaporation of the capillary micro-groove, including the structure diagram and partial enlargement of the evaporating heat exchange element of the micro-groove group.
  • Q is the heat flow of the heating element, and the direction of the heat flow is indicated by solid arrows, and the circular and hollow arrows indicate the partial enlarged area and the endothermic evaporation.
  • the partial enlargement map indicates the level of the trough top, the three-phase contact line, the adsorption layer, the meniscus, and the level or position of the evaporating microfluid film.
  • Figure 2 is a schematic view of the structure of the evaporation plate, including micro-capillary grooves on the evaporation surface, which are distributed longitudinally and laterally.
  • FIG. 3 shows the forced air cooling desktop CPU heat sink.
  • FIG. 4 is a cooling system diagram of a water-cooled external condenser. The cooling water and capillary pump ring are shown.
  • Figure 5 is a diagram of a naturally cooled heat dissipation system. The figure shows the microslot group evaporator, the capillary pump ring line and the external cold The connection status of the condenser.
  • FIG. 6 is a schematic diagram of the cooling system of the notebook computer. The figure shows the status of the notebook's display backplane and the host backplane as the heat sink.
  • 1-micro-groove group evaporative heat exchange element 11-micro-cylinder trough; 11A-vertical trough; 11B-transverse trough; 2' - evaporation plate; 2- micro-slot group evaporator; 3-condenser; 3 '-water-cooled Condenser; 4-liquid (evaporant); 5-fan; 6-CPU chip; 6' - heating element; 10-CPL capillary pump ring; 20- CPL steam part; 30- CPL liquid part.
  • the micro-groove group evaporating heat exchange element generally refers to engraving a dense fine straight groove on a plate of any size, and the capillary force generated in the micro-slot causes the liquid to be sucked into the micro-groove Inside.
  • the liquid in each tank has a slight meniscus near the three-phase (gas, liquid, solid) contact line, and the evaporation of the meniscus has a great local heat transfer coefficient.
  • the amount of heat exchange may be higher than or several times the critical thermal load of boiling in the general pool. And it has the characteristics of arbitrary heat exchange size and great heat exchange.
  • the heat exchange technology may have important application prospects in the future heat dissipation of ultra-microelectronics and micro-system devices and heat dissipation of spacecraft components.
  • the innovations can be summarized as follows: Developed a new generation of high-performance cooling technology, the most advanced application technology in the relevant fields in the world; different from the conventional micro-cooling system, which is large in size and cannot meet the requirements of modern technology. Technology can lay the foundation for future micro-cold system technology.
  • micro-groove group surface is super-hydrophilic treated with Ti0 2 material or other hydrophilic materials to obtain enhanced micro-groove group evaporation Thermal component.
  • the schematic diagram of the capillary microchannel evaporation shown in Fig. 1 includes a structural diagram and a partial enlargement diagram of the microgroove group evaporating heat exchange element 1.
  • Q is the heat flow of the heating element, and the direction of the heat flow is indicated by solid arrows; the circular ring and the hollow arrow indicate the partial enlarged area and the endothermic evaporation; the figure also shows the shape of the liquid distribution in the micro-capillary groove 11.
  • the partial enlargement map indicates the level or position of the top of the tank, the three-phase contact line, the adsorption layer, the meniscus, and the evaporating micro-liquid film.
  • the capillary force generated in the micro-capillary groove 11 allows the liquid to be sucked into the tank, so that the liquid in the tank forms a meniscus evaporation heat exchange in the vicinity of the gas, liquid, and solid three-phase contact line.
  • the structure of the microgroove group evaporating heat exchange element 1 shown in Fig. 2 includes micro-capillary grooves 11 on the evaporation surface, which are distributed in the longitudinal direction and the lateral direction, that is, the vertical grooves 11A and the lateral grooves 11B.
  • the micro-capillary groove is a straight groove, the groove width is 0.01-lmm, and the groove depth is The groove width is 1-4 times; and the groove width may further preferably be 0.1 to 0.5 mm.
  • the micro-capillary grooves can also be non-straight grooves. As shown in FIG.
  • the forced air-cooled desktop CPU cooler is shown in the figure, and the forced air cooling of the condenser 3 by the fan of the conventional configuration is shown, including the CPU chip 6, the micro-slot group evaporating heat exchange element 1 and The position of the capillary groove, the evaporation plate 2', the condensing portion, that is, the condenser 3, the fan 5, and the liquid 4.
  • the condenser 3 is forcedly air-cooled by the fan 5 to further improve the heat exchange capability of the system.
  • the capillary pump ring system that is, the capillary pump ring system:
  • CPL technology has been applied to the heat dissipation problem of spacecraft. Since the heat generated by the internal components of the spacecraft must be brought to the surface away from the heat generating body for heat exchange and cooling, the heat generated by the heat generating body of the evaporator is carried by the steam through the steam line to the cooling portion, and is condensed to become a liquid and a liquid passage. Go back to the evaporator. The driving force of the fluid circulation is generated by the capillary force on the evaporator.
  • the heat transfer density of the heating element on the general spacecraft is not very high, and the surface of the evaporator can be driven by a very fine groove (or hole) structure to achieve a large capillary driving force.
  • the maximum heat flux density of the evaporator in the CPL system is small.
  • the main reason is that the current CPL can only form the evaporation surface and the capillary micro-groove (or pore) as a single structure, and it is difficult to achieve high evaporation heat flux density and high capillary driving force at the same time, so the critical heat flux density is low.
  • the evaporating component and the condensing component can be made in one piece, so that the CPL system can be disregarded.
  • the evaporating component and the condensing component can be made in one piece, so that the CPL system can be disregarded.
  • the consensus of most people to bring heat to the back of the computer display it is the consensus of most people to bring heat to the back of the computer display.
  • the steam and condensed liquid share a loop (heat pipe type)
  • the total change will be greatly limited. Thermal critical mass. This research will develop a new type of CPL system to achieve a high heat flow transmission system.
  • the innovations can be summarized as follows:
  • the new CPL system with a number of new technologies can be applied to both normal gravity and microgravity conditions; the micro-slot evaporation surface and the liquid capillary drive structure are designed separately to achieve the high critical heat flux density of the evaporator.
  • the key technologies used are: Steam delivery line and liquid circuit design. Since the liquid pump is not installed in the entire CPL circuit, the geometric design of the circuit will determine the pressure of each node in the circuit system to determine whether it is operating normally.
  • One-way valve setting technology in order to fully ensure the one-way flow of vapor and liquid, a check valve is arranged in the pipeline. The connection between the circuit and the evaporator, the liquid returned by the return pipe must be continuously replenished into the evaporator.
  • the best design is to add the liquid connection to the evaporation surface, so as to overcome the influence of gravity on the flow resistance, and at the same time
  • the negative pressure formed by the capillary force in the microgroove group increases the driving
  • the water-cooled external condenser heat dissipation system shown in Fig. 4 shows the micro-groove group evaporating heat exchange element 1 and its capillary micro-groove, the steam portion 20 in the CPL, the water-cooled condenser 3', and the liquid in the CPL. Part 30, the position of the microgroove evaporator 2, the heating element 6'.
  • the natural cooling type heat dissipation system shown in Fig. 5 shows the position of the naturally cooled condenser 3, the CPL, that is, the capillary pump ring line 10, and the micro-slot group evaporator 2 (heat absorber).
  • the micro-slot group evaporator 2 is connected to the capillary pump ring line 10, and the capillary pump ring line 10 is connected to the condenser 3.
  • the notebook cooling system shown in Figure 6 shows the position of the heat sink, heat pipe, heat chip, high performance heat sink, and power supply.
  • this embodiment uses the display backplane layer of the notebook computer and the host backplane layer as the heat dissipation surface, that is, the condenser 3.
  • the high-performance heat sink is a micro-slot group evaporator with a micro-slot group evaporative heat exchange element 1.
  • the heat generating chip is the CPU chip 6 and the like.
  • the heat pipe is the capillary pump ring line 10 .
  • the microgroove evaporator is connected to the condenser 3 via the capillary pump loop 10 and uses a hose path at the rotating shaft of the notebook.

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Description

一种高性能被动式相变散热***及其应用 技术领域
本发明涉及对发热的工作元件或部件进行被动式相变热交换的技术， 特别是一种高 性能被动式相变散热***及其应用， 具体应用包括用于台式计算机的相变散热***和用 于笔记本电脑等小 间内的散热***。 背景技术
髙性能芯片 （High performance chip) 的发热密度即将要达到 60W/cm2的程度。 这样 的热流密度与轻水炉反应堆 （LWR) 的炉心热流密度为同一水平， 但前者要求的散热面 温度与环境温度之差较后者要低得多。 计算机的热控技术亦即冷却技术要求， 既要满足 其许容上限温度（约 100oC)， 又要满足不断提升的散热热流密度， 这已成一个国际性的 技术难题。
目前普遍使用的一般尺度的空冷技术的冷却能力，在一般流动速度时（例如 20m/s)， 要比上述高性能芯片的发热密度低一个数量级。 要强化空冷技术冷却能力， 有主动方法 和被动方法。 被动办法就是要将换热器流路微细化以强化换热性能和增加换热面积 （如 增加微槽道等）。 主动办法主要有提高工质流速及降低冷却工质的进口温度等。 这些强化 方法都涉及到微***及微传热问题， 如提高微动力*** （Micro repowering system) (提 髙工质流速)、 微冷冻*** （降低冷却工质温度）和微风扇*** （提高与环境间的对流换 热） 性能。
计算机的相变冷却技术是区别于空冷技术的另一类正在开发和发展的新型冷却技 术。 相变蒸发热流密度的理论极限比目前计算机最高热流密度还要高出约两个数量级。 且温度条件满足计算机的许容上限温度。 目前与之相关的有微热管技术（又分为毛细型、 强制震动型及自励振荡型等） 及微槽群蒸发型热沉技术， 国际上已有不少国家基金和大 型企业投入了不少资金进行开发研究。但总的来说， 由于受微细管内的流动特性的制约， 普通微热管技术已遇到了目前无法克服的发展瓶颈一临界热流制约问题， 导致其总热输 送能力无法有效提高。
目前国内最好的被动式冷却技术 （热管技术） 散热能力有限。 比如， 国内的台式计 算机的冷却方法主要为翅片加风扇方式， 技术上是在翅片工艺及风扇性能上下功夫。 而 要求体积小、 散热功率大的笔记本电脑的冷却***基本上都是从国外和主机配套引进。 可以说， 在国内国外， LSI的冷却问题 (包括 CPU、 HDD、 FDD和 LCD)将是制约计算机 性能的最主要、 也是最迫切的因素。 同时， 高能激光， 光通讯等领域也对功率大及体积 微小的散热器也提出了新的要求。
因此， 随着微电子技术的飞速发展、 我国各种尖端技术的迅速提升及国防工业的现 实需要， 研究开发具有自主知识产权的包括计算机在内的微电子器件的散热技术有着重 大的现实意义和经济价值。 发明内容
本发明针对现有技术中存在的不足或缺陷， 提供一种高性能被动式相变散热***。 采用该散热***有利于对高热流密度的发热体进行充分的散热冷却， 从而满足高性能芯 片、 高能激光、 光通讯或其他机电器件的散热要求。
本发明还提供一种用于台式计算机的相变散热***， 以较大的换热能力满足下一代 台式计算机的冷却要求。
本发明还提供一种有利于提高总换热量的用于笔记本电脑等小空间内的散热***。 本发明总的技术构思如下：
基于对国内外微电子及微***器件微散热技术的研究现状及需求的分析， 发展出一 种高性能微槽群相变冷却模式， 通过利用毛细泵环管路使得微槽群蒸发器与冷凝器实现 空间隔离的结构设讦来提高对高热流密度发热体的散热冷却能力， 研制出满足各种微小 尺寸的高性能被动式冷却元件以及满足下一代各种计算机以及其它极端环境中先进电子 器件的散热***， 解决军事领域的特许需要和 IT产业面临的热问题。
本发明的技术方案如下- 高性能被动式相变散热***， 包括微槽群蒸发器和冷凝器， 其特征在于： 所述微槽 群蒸发器连接有毛细泵环管路， 该毛细泵环管路与所述冷凝器相连接。
所述微槽群蒸发器包括微槽群蒸发换热元件， 该蒸发换热元件的蒸发面上分布有密 集的微毛细槽， 微毛细槽内产生的毛细力能够使液体吸入槽内， 从而使槽内液体在气、 液、 固三相接触线附近形成弯月面蒸发换热。
所述微槽群面层为 Ti02材料层或其它亲水材料层，用于对微槽群面进行超亲水处理。 所述微毛细槽为直槽， 槽宽为 0.01-lmm, 槽深为槽宽的 1- 4倍。
所述槽宽为 0.1-0.5mm。
所述毛细泵环管路包括蒸气输送管路部分和液体回流管路部分， 并且在管路中设置 有单向阀。
所述液体回流管路部分的出口端对接于微槽结构， 该微槽结构用于对毛细泵环管路 中的回流液体进行毛细驱动。
所述冷凝器为自然冷却式冷凝器、 强制空冷式冷凝器、 水冷式冷凝器或采用高分子 网格状络合膜的强化高效冷凝器。
用于台式计算机的相变散热***， 其特征在于： 包括用于芯片散热的微槽群蒸发器 和冷凝器， 所述微槽群蒸发器连接有毛细泵环管路， 所述冷凝器位于台式计算机的机箱 两侧， 所述毛细泵环管路与所述冷凝器相连接。
用于笔记本电脑等小空间内的散热***， 其特征在于： 包括用于 CPU散热的微槽群 蒸发器和冷凝器， .所述微槽群蒸发器连接有毛细泵环管路， 所述冷凝器分别位于笔记本 电脑的显示屏背板层和主机背板层， 所述毛细泵环管路与冷凝器相连接， 并在笔记本电 脑的旋转轴处采用软管路。
本发明的技术效果如下：
由于本发明的高性能被动式相变散热***， 通过利用毛细泵环管路使得微槽群蒸发 器与冷凝器实现空间隔离的结构设计来提高散热冷却能力， 使得该散热***有利于对高 热流密度的发热体进行充分的散热冷却， 从而满足高性能芯片、 高能激光、 光通讯或其 他机电器件的散热要求。
由于微槽群蒸发器釆用微槽群蒸发换热元件， 通过蒸发面上分布的密集的微毛细槽 充分利用毛细现象， 微槽内产生的毛细力使液体吸入微槽内。 每个槽内液体在三相 （气、 液、 固） 接触线附&有一微小的弯月面， 该弯月面的蒸发具有极大的局部换热系数。 通 过设计最佳的尺寸及结构布局，充分揭示微槽内相变传热传质及临界热负荷产生的机理， 其换热量有可能高于或几倍于一般池内沸腾的临界热负荷。 且具有换热尺寸任意， 总换 热量极大等特点。 因而该换热技术有可能在今后超微电子及微***器件散热以及航天器 部件散热等方面， 有着重要的应用前景。
由于微槽群面层为 Ti02材料层或其它亲水材料层，用于对微槽群面进行超亲水处理， 从而得到强化的微槽群蒸发换热元件。
由于微毛细槽为直槽， 槽宽为 0.01-lmm， 槽深为槽宽的 1- 4倍； 而且槽宽可进一歩 优选为 0.1-0.5MM;这就针对开式微槽群蒸发传热面， 能够得到最佳的微槽尺寸参数及最 佳结构设计 (多层、'组合微槽及外置型毛细力强化结构等)。
由于管路中设置有单向阀， 这就能够充分保证蒸气与液体单向流动， 使得不设置液 泵的整个 CPL回路即毛细泵环管路中， 通过回路的几何设计决定回路***中的各节点压 力， 从而有利于***的正常运行。
由于液体回流管路部分的出口端对接于微槽结构， 该微槽结构用于对毛细泵环管路 中的回流液体进行毛细驱动， 这就是说， 通过运用回路与蒸发器的对接技术， 不仅实现 回液管回流的液体连续补充到蒸发器内， 而且可以实现最佳设计方案， 将液体连接补充 到蒸发面上， 从而可以克服重力对流动的阻力影响， 同时可利用微槽群内毛细力形成的 负压增大液体回流的驱动力。
由于冷凝器为自然冷却式冷凝器、 强制空冷式冷凝器、 水冷式冷凝器或采用高分子 网格状络合膜的强化高效冷凝器， 这就有利于根据不同工况或运行环境进行合理配置。
由于本发明的用于台式计算机的相变散热***， 是基于一个总的发明构思， 在利用 毛细泵环管路使得微槽群蒸发器与冷凝器实现空间隔离的结构设计来提高对高热流密度 发热体的散热冷却熊力的基础上， 将冷凝器设置于台式计算机的机箱两侧， 能够将蒸发 器的蒸发热带到电脑机箱的两侧外壁， 与外部空气产生自然对流换热， 蒸汽冷凝后再循 环到蒸发器内， 从而可以在不需要风扇的情况下， 以较大的换热能力满足今后台式计算 机的冷却要求。
由于本发明的用于笔记本电脑等小空间内的散热***， 也是基于一个总的发明构思， 在利用毛细泵环管路使得微槽群蒸发器与冷凝器实现空间隔离的结构设计来提高对高热 流密度发热体的散热冷却能力的基础上， 将冷凝器设置于笔记本电脑的显示屏背板层和 主机背板层， 并且在笔记本电脑的旋转轴处采用软管路； 这就能够解决临界热流制约问 题， 提髙总换热量， 由试验得出， 冷却能力可以达到热流密度 250W / cm 2， 最大换热能 力 1000W。 当然关于蒸发器的内部结构设计， 必须考虑芯片水平放置和垂直放置以及倾 斜放置等情况， 流 ½循环及液体补充将与蒸发器的内部结构设计密切相关。 同时还需要 采用 CPL的软管连接技术： 蒸发器和冷凝器的连接由于经过计算机显示屏的旋转轴， 因 而需要实现软连接。 附图说明
图 1为毛细微槽蒸发原理图， 包括微槽群蒸发换热元件结构图和局部放大图。 图中 Q 为发热体热流， 并用实心箭头表示了热流方向， 圆环及空心箭头表示局部放大区域与 吸热蒸发。 局部放大图指明了槽顶、 三相接触线、 吸附层、 弯月面、 蒸发微液膜的层次 或位置状况。
图 2为蒸发板结构示意图， 包括蒸发面上的微毛细槽， 呈纵向和横向分布。
图 3为强制空冷式台式电脑 CPU散热器图。
图 4为水冷式外置冷凝器散热***图。 图中表示了冷却水和毛细泵环。
图 5为自然冷却式散热***图。 图中表示了微槽群蒸发器、 毛细泵环管路和外置冷 凝器的连接状况。
图 6为笔记本电脑散热***示意图。 图中指明了以笔记本电脑的显示屏背板层和主 机背板层作为散热面的状况。
附图标记列示如下：
1-微槽群蒸发换热元件； 11-微毛细槽； 11A-竖向槽； 11B-横向槽； 2' - 蒸发板； 2- 微槽群蒸发器； 3-冷凝器； 3 ' -水冷式冷凝器； 4-液体（蒸发剂）； 5-风扇； 6- CPU芯片； 6' -发热体； 10-CPL即毛细泵环； 20- CPL中蒸汽部分； 30- CPL中液体部分。 具体实施方式
下面结合附图对本发明作进一步的详细说明。
关于本发明中的微槽群蒸发换热元件- 微槽群蒸发换热元件一般是指在一任意尺寸的平板上刻上密集的微细直槽， 微槽内 产生的毛细力使液体吸入微槽内。 每个槽内液体在三相 （气、 液、 固） 接触线附近有一 微小的弯月面， 该弯月面的蒸发具有极大的局部换热系数。 通过设计最佳的尺寸及结构 布局， 其换热量有可能高于或几倍于一般池内沸腾的临界热负荷。 且具有换热尺寸任意， 总换热量极大等特点。 因而该换热技术有可能在今后超微电子及微***器件散热以及航 天器部件散热等方面， 有着重要的应用前景。 其创新点可以概括为： 开发了新一代高性 能冷却技术， 为国际上相关领域的最先进应用技术； 区别于以往被动冷却元件体积较大 而无法适应现代髙技术所要求的微冷***， 该技术可以奠定今后微冷***技术的基础。 其釆用的关键技术为： 揭示微槽内相变传热传质及临界热负荷产生的机理； 针对开式微 槽群蒸发传热面， 得到最佳的微槽尺寸参数及最佳结构设计 (多层、 组合微槽及外置型毛 细力强化结构等)； 针对不同液体工质，利用 Ti02材料或其它亲水材料对微槽群面进行超 亲水处理， 得到强化的微槽群蒸发换热元件。
如图 1所示的毛细微槽蒸发原理图， 包括微槽群蒸发换热元件 1的结构图和局部放 大图。 图中 Q为发热体热流， 并用实心箭头表示了热流方向； 圆环及空心箭头表示局部 放大区域与吸热蒸发； 图中同时表示了微毛细槽 11内的液体分布形状。 局部放大图指明 了槽顶、 三相接触线、 吸附层、 弯月面、 蒸发微液膜的层次或位置状况。 微毛细槽 11内 产生的毛细力能够使液体吸入槽内， 从而使槽内液体在气、 液、 固三相接触线附近形成 弯月面蒸发换热。 '
如图 2所示的微槽群蒸发换热元件 1的结构， 包括蒸发面上的微毛细槽 11， 呈纵向 和横向分布， 即竖向槽 11A和横向槽 11B。 微毛细槽为直槽， 槽宽为 0.01-lmm， 槽深为 槽宽的 1- 4倍； 而且槽宽可进一步优选为 0.1-0.5mm。 当然微毛细槽也可以为非直槽。 如图 3所示的强制空冷式台式电脑 CPU散热器， 图中表示出了利用现有配置的风扇 对冷凝器 3进行强制空冷的状况， 包括 CPU芯片 6、 微槽群蒸发换热元件 1及其毛细微 槽、 蒸发板 2 ' 、 冷凝部分即冷凝器 3、 风扇 5、 液体 4的位置状况。 通过风扇 5对冷凝 器 3进行强制空冷， 更进一步***的提高换热能力。
关于本发明中的 CPL***即毛细泵环***：
CPL技术已经应用于航天器的散热问题。 由于航天器内部器件产生的热量必须带到 远离发热体的表面进行换热冷却， 蒸发器通过蒸发将发热体产生的热量由蒸汽通过蒸气 管路带到冷却部位， 冷凝后成为液体并由液体通路回到蒸发器。 流体循环的驱动力由蒸 发器上的毛细力产生。 但一般航天器上的发热体的热流密度不是很高， 蒸发器表面上可 通过极微细槽 （或孔） 结构来达到较大的毛细驱动力。 目前国际上 CPL***中蒸发器的 最大热流密度较小。 主要原因是因为目前的 CPL只能将蒸发面和毛细力微槽 （或孔） 做 成一体结构， 而很难同时实现高蒸发热流密度和高毛细驱动力， 因而临界热流密度较低。
对于空间相对较大的台式计算机的冷却***，蒸发部件和冷凝部件可以做成一体式， 因而可不考虑 CPL***。 但对空间狭小且热流密度大的笔记本式电脑冷却， 将热量带到 电脑显示屏背面冷却已是多数人的共识， 而当蒸汽和冷凝液体共用一个回路时（热管式） 会大大限制总的换热临界量。 本研究将开发出一种新型的 CPL***， 实现高热流的传输 ***。 其创新点可以概括为： 采用多项新技术的新型 CPL***， 可同时适用于普通重力 及微重力条件； 将微槽蒸发面和液体毛细驱动结构分开设计， 实现蒸发器的高临界热流 密度。 其采用的关键技术为： 蒸汽输送管路及液体回路的设计， 由于整个 CPL回路中不 设置液泵， 回路的几何设计将决定回路***中的各节点压力， 从而决定是否正常运行。 单向阀设置技术， 为充分保证蒸气与液体单向流动， 在管路中设置单向阀。 回路与蒸发 器的对接技术， 由回液管回流的液体必须连续补充到蒸发器内， 最佳设计方案是要将液 体连接补充到蒸发面上， 从而可以克服重力对流动的阻力影响， 同时可利用微槽群内毛 细力形成的负压增大液体回流的驱动力。
关于本发明中的强化微型冷凝器- 由于蒸发热量必须通过冷凝换热器， 将蒸汽冷凝为液体后再循环到蒸发器中， 因此 高效冷凝器的开发亦将变得很重要。 本专利幵发出能长久维持滴状冷凝的低能表面， 由 此构成与微型蒸 器功率相匹配的冷凝器。 其创新点可以概括为： 本研究首次提出了网 格状髙分子膜的模型， 与金属基底形成大面积的高强度配位键， 与以往小分子络合物膜 相比， 稳定性大大增强， 不仅可以有效地延长使用寿命， 还有可能在规则的网格中形成 高密度的核化中心。 其采用的关键技术为： 高分子网格状络合膜的制备及其在强化微型 冷凝器中的应用； 冷凝过程的微观机理和强化控制条件； 高效冷凝器研制。
如图 4所示的水冷式外置冷凝器散热***， 图中表示出了微槽群蒸发换热元件 1及 其毛细微槽、 CPL中蒸汽部分 20、 水冷式冷凝器 3 ' 、 CPL中液体部分 30、 微槽群蒸发 器 2、 发热体 6' 的位置状况。
如图 5所示的自然冷却式散热***， 图中表示出了自然冷却式冷凝器 3、 CPL即毛 细泵环管路 10、 微槽群蒸发器 2 (吸热器） 的位置状况。 微槽群蒸发器 2连接毛细泵环 管路 10， 该毛细泵环管路 10与冷凝器 3相连接。
如图 6所示的笔记本电脑散热***， 图中表示出了散热面、 导热管、 发热芯片、 高 性能吸热器、 电源的位置状况。 从图中可以看出， 该实施例是以笔记本电脑的显示屏背 板层和主机背板层作为散热面， 即冷凝器 3。 高性能吸热器即带有微槽群蒸发换热元件 1 的微槽群蒸发器。发热芯片即 CPU芯片 6等。导热管即毛细泵环管路 10。微槽群蒸发器 通过毛细泵环管路 10与冷凝器 3相连接， 并在笔记本电脑的旋转轴处采用软管路。
应当指出， 以上所述具体实施方式可以使本领域的技术人员更全面地理解本发明， 但不以任何方式限制本发明。 因此， 尽管本说明书参照附图和实施方式对本发明已进行 了详细的说明， 但是， 本领域技术人员应当理解， 仍然可以对本发明进行修改或者等同 替换； 而一切不脱离本发明的精神和技术实质的技术方案及其改进， 其均应涵盖在本发 明专利的保护范围当中。

Claims

权利要求
1.高性能被动式相变散热***， 包括微槽群蒸发器和冷凝器， 其特征在于： 所述微槽 群蒸发器连接有毛 泵环管路， 该毛细泵环管路与所述冷凝器相连接。
2.根据权利要求 1所述的高性能被动式相变散热***，其特征在于：所述微槽群蒸发 器包括微槽群蒸发换热元件， 该蒸发换热元件的蒸发面上分布有密集的微毛细槽， 微毛 细槽内产生的毛细力能够使液体吸入槽内， 从而使槽内液体在气、 液、 固三相接触线附 近形成弯月面蒸发换热。
3.根据权利要求 2所述的高性能被动式相变散热***，其特征在于：所述微槽群面层 为 Ti02材料层或其它亲水材料层， 用于对微槽群面进行超亲水处理。
4.根据权利要求 2所述的高性能被动式相变散热***，其特征在于：所述微毛细槽为 直槽， 槽宽为 0.01-lmm， 槽深为槽宽的 1- 4倍。
5.根据权利要求 4 所述的高性能被动式相变散热***， 其特征在于： 所述槽宽为 0.1 -0.5mm, 槽深为槽宽的 2- 3倍。
6.根据权利要求 1所述的高性能被动式相变散热***，其特征在于：所述毛细泵环管 路包括蒸气输送管路部分和液体回流管路部分， 并且在管路中设置有单向阀。
7.根据权利要求 6所述的高性能被动式相变散热***，其特征在于：所述液体回流管 路部分的出口端对接于微槽结构， 该微槽结构用于对毛细泵环管路中的回流液体进行毛 细驱动。
8.根据权利要求 1所述的髙性能被动式相变散热***，其特征在于：所述冷凝器为自 然冷却式冷凝器、 强制空冷式冷凝器或水冷式冷凝器。
9.用于台式计算机的相变散热***，其特征在于：包括用于芯片散热的微槽群蒸发器 和冷凝器， 所述械槽群蒸发器连接有毛细泵环管路， 所述冷凝器位于台式计算机的机箱 两侧， 所述毛细泵环管路与所述冷凝器相连接。
10.用于笔记本电脑等小空间内的散热***，其特征在于：包括用于 CPU散热的微槽 群蒸发器和冷凝器， 所述微槽群蒸发器连接有毛细泵环管路， 所述冷凝器分别位于笔记 本电脑的显示屏背板层和主机背板层， 所述毛细泵环管路与冷凝器相连接， 并在笔记本 电脑的旋转轴处采用软管路。
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