WO2007029907A1 - A condenser microphone and method of making the same - Google Patents

A condenser microphone and method of making the same Download PDF

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Publication number
WO2007029907A1
WO2007029907A1 PCT/KR2006/000390 KR2006000390W WO2007029907A1 WO 2007029907 A1 WO2007029907 A1 WO 2007029907A1 KR 2006000390 W KR2006000390 W KR 2006000390W WO 2007029907 A1 WO2007029907 A1 WO 2007029907A1
Authority
WO
WIPO (PCT)
Prior art keywords
case
pcb
welding
tack
adhesive
Prior art date
Application number
PCT/KR2006/000390
Other languages
French (fr)
Inventor
Sung-Ho Park
Kwan-Wook Roh
Original Assignee
Bse Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co., Ltd filed Critical Bse Co., Ltd
Publication of WO2007029907A1 publication Critical patent/WO2007029907A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
    • B65B51/02—Applying adhesives or sealing liquids
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

Definitions

  • the present invention relates to a condenser microphone, and, more particularly to, a condenser microphone having a structure for performing tack welding of a case and a PCB and then adhering them with an adhesive, and a manufacturing method for the condenser microphone.
  • FIG. 9 is a schematic view showing a conventional condenser microphone.
  • a typical condenser microphone 10 as shown in Fig. 9, includes a cylindrical case
  • the condenser microphone 10 is manufactured by sequentially inserting the above parts into the case 11 and then curling an end 1 Ib of the case 11.
  • the polar ring 12 and the vibration membrane 13 may be adhered to become an integral typed member.
  • the back plate 16 has a structure forming an electret by attaching an organic film on a metal plate.
  • an object of the present invention is to provide a condenser microphone for increasing a joining strength between a case and a PCB by tack- welding an end of a case which is mounted with parts of the condenser microphone and then bonding them with an adhesive without a curling process for joining the case and the PCB, and a manufacturing method for the condenser microphone.
  • a condenser microphone comprising a hollow typed case having one side which is opened; a vibration plate which is inserted into the case; a spacer which is inserted into the case; a back plate which is inserted into the case; an insulating base which is inserted into the case; a conductive base which is inserted into the case; and a PCB which is mounted with parts and is formed with connecting terminals for connecting to the outside, whereby an end of the case is tack- welded to the PCB and then the case and the PCB are joined by an adhesive.
  • a method for manufacturing a condenser microphone comprises the steps of: inserting a diaphragm, a spacer, a back plate, an insulating base having an insulating property and a conductive base having conductivity into a hollow typed case having one side which is opened; aligning an end of the case on a connecting pattern of a PCB and tack- welding them; bonding the connecting part between the case and the PCB with an adhesive after tack-welding; and curing the adhesive.
  • FIG. 1 is a flow diagram for manufacturing a condenser microphone according to the present invention
  • FIG. 2 is a sectional side view of a first embodiment of a condenser microphone according to the present invention
  • FIGs. 3 A to 3D are views showing various PCBs which are used in a condenser microphone according to the present invention.
  • FIG. 4 is a sectional side view of a second embodiment of a condenser microphone according to the present invention.
  • FIG. 5 is a sectional side view of a third embodiment of a condenser microphone according to the present invention.
  • Fig. 6 is a sectional side view of a fourth embodiment of a condenser microphone according to the present invention.
  • FIG. 7 is a sectional side view of a fifth embodiment of a condenser microphone according to the present invention.
  • FIG. 8 is a sectional side view of a sixth embodiment of a condenser microphone according to the present invention.
  • FIG. 9 is a sectional side view of a conventional condenser microphone.
  • FIG. 1 is a flow diagram for manufacturing a condenser microphone according to the present invention.
  • a technology for tack- welding a case and a PCB and then bonding them with an adhesive having a property which is not changed in a high temperature for example, epoxy, silver paste, silicon, urethane, acryl, cream solder and the like, without a curling process for curling the end of the case to join the case and the PCB in the conventional manufacturing process after inserting the relevant parts into the case when assembling the condenser microphone.
  • a vibration plate consisting of a polar ring and a vibration membrane is inserted into the case (S 1 and S2). Then, a spacer is inserted to form a space between the vibration plate and a back plate, and an insulating base for insulating the back plate from the case is inserted into the case (S3 and S4). Then, after inserting the base plate into the insulating base, a conductive base is inserted and then the cleansing-treated PCB is aligned to the case (S5 to S8). At this time, a PCB is treated by a plasma-cleaning in the PCB cleaning process to increase a bonding force. In the aligning operation, an end of the case is aligned on a connecting pattern of the PCB.
  • the connecting pattern of the PCB and the case are tack- welded by welding, for example, laser welding, arc welding, electric resistance welding, seam welding, soldering and the like and then the PCB and the case are bonded with the adhesive (S9 and SlO).
  • the 'tack- welding' does not mean welding for a whole connecting portion between the case and the PCB, but means spot welding for one or more connecting points (preferably, two to four points) therebetween so that the case and the PCB are not separated from each other.
  • the case is fixed to the PCB by tack-welding and then is bonded to the case with the adhesive, the case is not pushed from the PCB, whereby the bonding operation can be performed in a correct position.
  • the adhesive is hardened by natural curing, ultraviolet curing, heat curing and the like, whereby manufacturing for the microphone is finished (Sl 1).
  • the ultraviolet curing is for irradiating an ultraviolet ray to the adhesive and then promptly curing the adhesive.
  • the heat curing is a method for curing the adhesive by applying heat.
  • the natural curing is a method for curing the adhesive leaving the adhesive as it is.
  • the condenser microphone manufactured by the above method according to the present invention may have various structures.
  • the condenser microphone may be classified into a structure (for Embodiments 1 to 3) having a case which is formed with a sound hole and a structure (for Embodiments 4 to 6) having a PCB which is formed with a sound hole according to the position where the sound hole is formed.
  • the condenser microphone may be classified into a general conductive base structure (for Embodiments 1 and 4), a spring shaped conductive base structure (for Embodiments 2 and 5) and a conductive base structure using a washer (for Embodiments 3 and 5).
  • Fig. 2 is a sectional side view showing a microphone having a case which is formed with a sound hole and a general conductive base according to the present invention.
  • a condenser microphone 100 is manufactured by sequentially inserting a vibration plate 104 consisting of a conductive polar ring 104a and a vibration membrane 104b, a spacer 106, an insulating base 108 which is made of an insulating material, a back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, and a conductive base 112 which is made of a conductive material into a metal case 102 which is formed with a sound hole 102a on a bottom surface thereof, and then bonding the case 102 to the PCB 120 with an adhesive 140 after tack- welding an end of the case 102 to the PCB 120.
  • the back plate 110 has a structure forming an electret by attaching an organic film on a metal plate.
  • the PCB 120 is formed with a conductive pattern 120b on the portion of the PCB which contacts the conductive base 112 and is also formed with a conductive pattern 120c on the portion of the PCB which contacts the case.
  • the case 102 and the conductive pattern 120c of the PCB 120 are partially tack- welded through a tack- welding point 130.
  • the tack- welding may be performed by laser welding, arc welding, electric resistance welding, seam welding, soldering and the like.
  • the joining between the case 102 and the PCB 120 may be performed by a method of bonding the whole connecting part of them with an adhesive 140 having a property which is not changed in a high temperature, for example, epoxy, silver paste, silicon, urethane, acryl, cream solder and the like.
  • PCB 120 and the case 102 are joined by the adhesive, the curling process is not required, whereby the problem generated due to the conventional curling process can be solved. Further, since there is no need to mount the PCB 120 within the case, as shown in Fig. 3, various shaped PCBs 120 can be used.
  • the PCBs 120 are formed with connecting patterns 102c for joining and electrical connection on the portions thereof which contact the case 102.
  • the PCB 120 may have a square shape or a shape which takes only some corners from the square shape.
  • the joining portion may have any of a circle and a square according to the shape of the case 102.
  • the joining portion is formed with a tack- welding point 130 for tack- welding.
  • the portion which is adhered by the adhesive has any of a circle and a square.
  • FIG. 3 A shows that, after a cylindrical case 102 which is formed with a sound hole
  • Fig. 3B shows that, after the cylindrical case 102 is aligned on the PCB 120 having a shape which takes only some corners from a square, the case 102 and the PCB 120 are tack- welded and then are joined with the adhesive 140, whereby the joining portion has a shape of a circle.
  • FIG. 3C shows that, after a rectangular parallelepiped shaped case 102 is aligned on a PCB 120 which is broader than the case 102, the case 102 and the PCB 120 are tack- welded and then are joined with the adhesive 140, whereby the joining portion has a shape of a square.
  • Fig. 3D shows that, after a rectangular parallelepiped shaped case 102 is aligned on a square shaped PCB 120 having a size similar to the case 102, the case 102 and the PCB 120 are tack- welded and then are joined with the adhesive 140, whereby the joining portion has a shape of a square.
  • a rectangular parallelepiped shaped case or any other shapes having sharp corners as well as a cylindrical case may be tack- welded and adhered on a PCB, thereby manufacturing microphones having various shapes.
  • the shape of a welding portion of the case also may be changed into a shape which crosses at right angles or a shape which is bent in a shape of 'D'.
  • the welding portion of the PCB is made by forming a copper clad through a general PCB manufacturing process and then plating the copper clad with Ni or Au.
  • the end of the case 102 is tack- welded on the PCB 120 and then the case 102 and the PCB 120 are joined by an adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that an external sound pressure does not enter the case.
  • Fig. 4 is a sectional side view showing a microphone having a case which is formed with a sound hole and a spring shaped conductive base according to the present invention.
  • a condenser microphone 200 is manufactured by sequentially inserting the vibration plate 104 consisting of the conductive polar ring 104a and the vibration membrane 104b, the spacer 106, the insulating base 108 which is made of an insulating material, the back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, and a conductive base 202 which is made of a metal spring into a metal case 102 which is formed with a sound hole 102a on a front side thereof, and then bonding the case 102 to the PCB 120 with the adhesive 140 after tack- welding an end of the case 102 to the PCB 120.
  • the PCB 120 is formed with a conductive pattern 120b on the portion of the PCB which contacts the spring shaped conductive base 202 and is also formed with the conductive pattern 120c on the portion of the PCB which contacts the case 102.
  • the case 102 and the conductive pattern 120c of the PCB 120 are partially tack- welded through the tack- welding point 130.
  • the tack- welding may be performed by laser welding, arc welding, electric resistance welding, seam welding, soldering and the like.
  • the joining between the case 102 and the PCB 120 may be performed by a method of bonding the whole connecting part of them with the adhesive 140 having a property which is not changed in a high temperature, for example, epoxy, silver paste, silicon, urethane, acryl, cream solder and the like.
  • the end of the case 102 is tack- welded on the PCB 120 and then the case 102 and the PCB 120 are joined by an adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that an external sound pressure does not enter the case.
  • the second embodiment has the same structure as the first embodiment except that the conductive base 202 adopts a spring structure, the further explanation will be omitted to avoid a repetition.
  • Fig. 5 is a sectional side view showing a microphone having a case which is formed with a sound hole and a conductive base using a conductive washer according to the present invention.
  • a condenser microphone 300 is manufactured by sequentially inserting the vibration plate 104 consisting of the conductive polar ring 104a and the vibration membrane 104b, the spacer 106, the insulating base 108 which is made of an insulating material, the back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, a conductive washer 302 for more efficiently connecting the conductive base with the PCB and the conductive base 112 which is made of a metal material into the metal case 102 which is formed with a sound hole 102a on a front side thereof, and then bonding the case 102 to the PCB 120 with the adhesive 140 after tack- welding an end of the case 102 to the PCB 120.
  • the PCB 120 is formed with a conductive pattern 120b on the portion of the PCB which contacts the conductive base 112 and is also formed with a conductive pattern 120c on the portion of the PCB which contacts the case 102.
  • the case 102 and the conductive pattern 120c of the PCB 120 are partially tack- welded through a tack- welding point 130.
  • the tack- welding may be performed by laser welding, arc welding, electric resistance welding, seam welding, soldering and the like.
  • the joining between the case 102 and the PCB 120 may be performed by a method of bonding the whole connecting part of them with the adhesive 140 having a property which is not changed in a high temperature, for example, epoxy, silver paste, silicon, urethane, acryl, cream solder and the like.
  • the end of the case 102 is tack- welded on the PCB 120 and then the case 102 and the PCB 120 are joined by an adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that an external sound pressure does not enter the case.
  • the third embodiment has the same structure as the first embodiment except that the conductive washer 302 is added to the conductive base 112, the further explanation will be omitted to avoid a repetition.
  • Fig. 6 is a sectional side view showing a microphone having a PCB which is formed with a sound hole and a general conductive base according to the present invention.
  • a condenser microphone 100' according to the present invention as shown in Fig.
  • the vibration plate 104 consisting of the conductive polar ring 104a and the vibration membrane 110b, the spacer 106, the insulating base 108 which is made of an insulating material, the back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, and the conductive base 112 which is made of a conductive material into a hollow typed metal case 102 having a closed front side, and then bonding the case 102 to the PCB 120 with an adhesive 140 after tack- welding an end of the case 102 to the PCB 120.
  • the back plate 110 has a structure forming an electret by attaching an organic film on a metal plate.
  • the tack- welding between the case 102 and the PCB 120 may be performed by laser welding, arc welding, electric resistance welding, seam welding, soldering and the like. Further, the joining between the case 102 and the PCB 120 may be performed by a method of bonding the whole connecting part of them with the adhesive 140 having a property which is not changed in a high temperature, for example, epoxy, silver paste, silicon, urethane, acryl, cream solder and the like.
  • the PCB 120 and the case 102 are joined by the adhesive 140, the curling process is not required, whereby the problem generated due to the conventional curling process can be solved.
  • the PCB since there is no need to mount the PCB 120 within the case 102, the PCB, as shown Fig. 3, may have various shapes. That is, the PCB used in the present invention, as shown in Figs. 3A to 3D, may have a square shape or a shape which takes only some corners from the square shape. Further, the joining portion may have any of a circle and a square according to the shape of the case.
  • a rectangular parallelepiped shaped case or any other shapes having sharp corners as well as a cylindrical case may be tack- welded and adhered on a PCB, thereby manufacturing microphones having various shapes.
  • the shape of a joining portion of the case also may be changed into a shape which crosses at right angles or a shape which is bent in a shape of 'D'.
  • the welding portion of the PCB is made by forming a copper clad through a general PCB manufacturing process and then plating the copper clad with Ni or Au.
  • the end of the case 102 is tack- welded on the PCB 120 and then the case 102 and the PCB 120 are joined by an adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by improving a sealing performance so that an external sound pressure does not enter the case.
  • Fig. 7 is a sectional side view showing a microphone having a PCB which is formed with a sound hole and a spring shaped conductive base according to the present invention.
  • the vibration plate 104 consisting of the conductive polar ring 104a and the vibration membrane 104b, the spacer 106, the insulating base 108 which is made of an insulating material, the back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, and the conductive base 202 which is made of a metal spring into a hollow typed metal case 102 having a closed front side, and then bonding the case 102 to the PCB 120 with the adhesive 140 after tack- welding an end of the case 102 to the PCB 120.
  • the end of the case 102 is tack- welded on the PCB 120 and then the case 102 and the PCB 120 are joined by an adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that an external sound pressure does not enter the case.
  • the spring shaped conductive base 202 of the second embodiment since the parts within the case are pressed toward the bottom side of the case by an elastic force of the conductive base 202, thereby more firmly supporting the parts and also enhancing an electrical conductive characteristic.
  • the fifth embodiment has the same structure as the second embodiment except that the sound hole 120a is not formed on the case 102, but formed on the PCB 120, the further explanation will be omitted to avoid a repetition.
  • Fig. 8 is a sectional side view showing a microphone having a PCB which is formed with a sound hole and a conductive base using a conductive washer according to the present invention.
  • a condenser microphone 300' according to the present invention as shown in Fig.
  • the vibration plate 104 consisting of the conductive polar ring 104a and the vibration membrane 104b, the spacer 106, the insulating base 108 which is made of an insulating material, the back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, the conductive washer 302 for more efficiently connecting the conductive base 112 with the PCB 120 and the conductive base 112 which is made of a metal material into a hollow typed metal case 102 having a closed front side, and then bonding the case 102 to the PCB 120 with the adhesive 140 after tack- welding an end of the case 102 to the PCB 120.
  • the 102 and the PCB 120 are joined by the adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that an external sound pressure does not enter the case.
  • the sixth embodiment has the same structure as the third embodiment except that the sound hole 120a is not formed on the case 102, but formed on the PCB 120, the further explanation will be omitted to avoid a repetition.
  • the vibration plate is positioned on the bottom surface of the case prior to the back plate.
  • the back plate may be positioned prior to the vibration plate.
  • the present invention may be applied to a microphone or a directional microphone having another structure, for example, the above reversed structure.
  • the metal case which is mounted with condenser microphone parts is directly tack- welded to the PCB and then the case and the PCB are bonded by the adhesive without the curling process for inserting a PCB into a metal case and then bending an end of the case.
  • a joining strength between the case and the PCB are increased, thereby enhancing an electrical conductivity therebetween and also enhancing a sound characteristic by sealing the case so that a sound pressure from the outside does not enter the case.
  • the shape of the PCB is not limited by the size of the case, the PCB which is used for the microphone is freely designed, thereby forming various shapes of terminals. Further, since an assembling work can be performed without a physical force applied in the conventional curling process, a more thin PCB can be adapted. As a result, the height of a product can be lowered, whereby a more thin microphone can be manufactured.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Mechanical Engineering (AREA)

Abstract

Disclosed are a condenser microphone having a structure for performing tack welding of a case and a PCB and then adhering them with an adhesive, and a manufacturing method for the condenser microphone. The manufacturing method comprises the steps of inserting a diaphragm, a spacer, a back plate, an insulating base having an insulating property and a conductive base having conductivity into a hollow typed case having one side which is opened, aligning an end of the case on a connecting pattern of a PCB and tack- welding them; bonding the connecting part between the case and the PCB with an adhesive after tack- welding, and curing the adhesive. The metal case which is mounted with condenser microphone parts is directly tack- welded to the PCB and then the case and the PCB are bonded by the adhesive without the curling process for inserting a PCB into a metal case and then bending an end of the case.

Description

Description
A CONDENSER MICROPHONE AND METHOD OF MAKING
THE SAME
Technical Field
[1] The present invention relates to a condenser microphone, and, more particularly to, a condenser microphone having a structure for performing tack welding of a case and a PCB and then adhering them with an adhesive, and a manufacturing method for the condenser microphone. Background Art
[2] Fig. 9 is a schematic view showing a conventional condenser microphone.
[3] A typical condenser microphone 10, as shown in Fig. 9, includes a cylindrical case
11 which is made of a metal and has a front side which is formed with a sound hole 1 Ia, a polar ring 12 which is made of a conductive material, a vibration membrane 13, a spacer 14, a first base (or insulating base) 15 which has a ring shape and is made of an insulating material, a back plate 16 which faces the vibration membrane 13 with the spacer 14 interposed therebetween, a second base (or conductive base) 17 which is made of a conductive material, a PCB 18 which is mounted with circuit parts and is formed with connecting terminals. The condenser microphone 10 is manufactured by sequentially inserting the above parts into the case 11 and then curling an end 1 Ib of the case 11. At this time, the polar ring 12 and the vibration membrane 13 may be adhered to become an integral typed member. Further, in case of an electret typed microphone, the back plate 16 has a structure forming an electret by attaching an organic film on a metal plate.
[4] However, according to the conventional condenser microphone, in a curling process for rolling and bending the end of the case 11 on the PCB 18 while pressing the end thereof toward the PCB 18, there happens a problem that the shape of the final product or an acoustic characteristic is affected by a pressure during a manufacturing process and tolerances of parts. For example, if a pressing force is not enough in the curling process, a sound pressure may be entered into a gap between the case and the PCB. In this case, there happens a distortion phenomenon in an acoustic characteristic, whereby an inferior product is manufactured or an electrical disconnection is generated. These problems have a bad influence upon the operation of the product itself. Further, if the pressing force is excessive in the curling process, there happen problems that a portion to be curled is torn or the internal parts are deformed, whereby an acoustic characteristic is deformed. Disclosure of Invention Technical Problem
[5] Accordingly, in order to solve the problems, an object of the present invention is to provide a condenser microphone for increasing a joining strength between a case and a PCB by tack- welding an end of a case which is mounted with parts of the condenser microphone and then bonding them with an adhesive without a curling process for joining the case and the PCB, and a manufacturing method for the condenser microphone. Technical Solution
[6] According to an aspect of the present invention, there is provided a condenser microphone comprising a hollow typed case having one side which is opened; a vibration plate which is inserted into the case; a spacer which is inserted into the case; a back plate which is inserted into the case; an insulating base which is inserted into the case; a conductive base which is inserted into the case; and a PCB which is mounted with parts and is formed with connecting terminals for connecting to the outside, whereby an end of the case is tack- welded to the PCB and then the case and the PCB are joined by an adhesive.
[7] According to another aspect of the present invention, there is provided a method for manufacturing a condenser microphone. The method comprises the steps of: inserting a diaphragm, a spacer, a back plate, an insulating base having an insulating property and a conductive base having conductivity into a hollow typed case having one side which is opened; aligning an end of the case on a connecting pattern of a PCB and tack- welding them; bonding the connecting part between the case and the PCB with an adhesive after tack-welding; and curing the adhesive. Brief Description of the Drawings
[8] The above and other objects and features of the invention will become apparent from the following description of preferred embodiments taken in conjunction with the accompanying drawings, in which:
[9] Fig. 1 is a flow diagram for manufacturing a condenser microphone according to the present invention;
[10] Fig. 2 is a sectional side view of a first embodiment of a condenser microphone according to the present invention;
[11] Figs. 3 A to 3D are views showing various PCBs which are used in a condenser microphone according to the present invention;
[12] Fig. 4 is a sectional side view of a second embodiment of a condenser microphone according to the present invention;
[13] Fig. 5 is a sectional side view of a third embodiment of a condenser microphone according to the present invention; [14] Fig. 6 is a sectional side view of a fourth embodiment of a condenser microphone according to the present invention;
[15] Fig. 7 is a sectional side view of a fifth embodiment of a condenser microphone according to the present invention;
[16] Fig. 8 is a sectional side view of a sixth embodiment of a condenser microphone according to the present invention; and
[17] Fig. 9 is a sectional side view of a conventional condenser microphone.
Best Mode for Carrying Out the Invention
[18] Hereinafter, preferred embodiments of the present invention will be explained in detail with reference to the appended drawings.
[19] Fig. 1 is a flow diagram for manufacturing a condenser microphone according to the present invention.
[20] According to the present invention, there is a provided a technology for tack- welding a case and a PCB and then bonding them with an adhesive having a property which is not changed in a high temperature, for example, epoxy, silver paste, silicon, urethane, acryl, cream solder and the like, without a curling process for curling the end of the case to join the case and the PCB in the conventional manufacturing process after inserting the relevant parts into the case when assembling the condenser microphone.
[21] Referring to Fig. 1, after preparing the hollow shaped case, a vibration plate consisting of a polar ring and a vibration membrane is inserted into the case (S 1 and S2). Then, a spacer is inserted to form a space between the vibration plate and a back plate, and an insulating base for insulating the back plate from the case is inserted into the case (S3 and S4). Then, after inserting the base plate into the insulating base, a conductive base is inserted and then the cleansing-treated PCB is aligned to the case (S5 to S8). At this time, a PCB is treated by a plasma-cleaning in the PCB cleaning process to increase a bonding force. In the aligning operation, an end of the case is aligned on a connecting pattern of the PCB.
[22] The connecting pattern of the PCB and the case are tack- welded by welding, for example, laser welding, arc welding, electric resistance welding, seam welding, soldering and the like and then the PCB and the case are bonded with the adhesive (S9 and SlO). Here, the 'tack- welding' does not mean welding for a whole connecting portion between the case and the PCB, but means spot welding for one or more connecting points (preferably, two to four points) therebetween so that the case and the PCB are not separated from each other. As such, if the case is fixed to the PCB by tack-welding and then is bonded to the case with the adhesive, the case is not pushed from the PCB, whereby the bonding operation can be performed in a correct position. [23] Then, after bonding them with the adhesive, the adhesive is hardened by natural curing, ultraviolet curing, heat curing and the like, whereby manufacturing for the microphone is finished (Sl 1). Here, the ultraviolet curing is for irradiating an ultraviolet ray to the adhesive and then promptly curing the adhesive. The heat curing is a method for curing the adhesive by applying heat. The natural curing is a method for curing the adhesive leaving the adhesive as it is.
[24] The condenser microphone manufactured by the above method according to the present invention may have various structures. For example, the condenser microphone may be classified into a structure (for Embodiments 1 to 3) having a case which is formed with a sound hole and a structure (for Embodiments 4 to 6) having a PCB which is formed with a sound hole according to the position where the sound hole is formed. Further, the condenser microphone may be classified into a general conductive base structure (for Embodiments 1 and 4), a spring shaped conductive base structure (for Embodiments 2 and 5) and a conductive base structure using a washer (for Embodiments 3 and 5).
[25]
[26] [Embodiment 1]
[27] Fig. 2 is a sectional side view showing a microphone having a case which is formed with a sound hole and a general conductive base according to the present invention.
[28] A condenser microphone 100, as shown in Fig. 2, is manufactured by sequentially inserting a vibration plate 104 consisting of a conductive polar ring 104a and a vibration membrane 104b, a spacer 106, an insulating base 108 which is made of an insulating material, a back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, and a conductive base 112 which is made of a conductive material into a metal case 102 which is formed with a sound hole 102a on a bottom surface thereof, and then bonding the case 102 to the PCB 120 with an adhesive 140 after tack- welding an end of the case 102 to the PCB 120. Here, in case of an electret typed microphone, the back plate 110 has a structure forming an electret by attaching an organic film on a metal plate.
[29] Referring to an enlarged view of Fig. 2, the PCB 120 is formed with a conductive pattern 120b on the portion of the PCB which contacts the conductive base 112 and is also formed with a conductive pattern 120c on the portion of the PCB which contacts the case. Here, the case 102 and the conductive pattern 120c of the PCB 120 are partially tack- welded through a tack- welding point 130. Here, the tack- welding may be performed by laser welding, arc welding, electric resistance welding, seam welding, soldering and the like. Further, the joining between the case 102 and the PCB 120 may be performed by a method of bonding the whole connecting part of them with an adhesive 140 having a property which is not changed in a high temperature, for example, epoxy, silver paste, silicon, urethane, acryl, cream solder and the like.
[30] According to the structure of the microphone of the present invention, since the
PCB 120 and the case 102 are joined by the adhesive, the curling process is not required, whereby the problem generated due to the conventional curling process can be solved. Further, since there is no need to mount the PCB 120 within the case, as shown in Fig. 3, various shaped PCBs 120 can be used. The PCBs 120 are formed with connecting patterns 102c for joining and electrical connection on the portions thereof which contact the case 102.
[31] According to Fig. 3, the PCB 120, as shown in Fig. 3, may have a square shape or a shape which takes only some corners from the square shape. Further, the joining portion may have any of a circle and a square according to the shape of the case 102. The joining portion is formed with a tack- welding point 130 for tack- welding. The portion which is adhered by the adhesive has any of a circle and a square.
[32] Fig. 3 A shows that, after a cylindrical case 102 which is formed with a sound hole
102a is aligned on a square shaped PCB 120, the case 102 and the PCB 120 are tack- welded and then are joined only with the adhesive 140, whereby the joining portion has a shape of a circle. Fig. 3B shows that, after the cylindrical case 102 is aligned on the PCB 120 having a shape which takes only some corners from a square, the case 102 and the PCB 120 are tack- welded and then are joined with the adhesive 140, whereby the joining portion has a shape of a circle. Fig. 3C shows that, after a rectangular parallelepiped shaped case 102 is aligned on a PCB 120 which is broader than the case 102, the case 102 and the PCB 120 are tack- welded and then are joined with the adhesive 140, whereby the joining portion has a shape of a square. Fig. 3D shows that, after a rectangular parallelepiped shaped case 102 is aligned on a square shaped PCB 120 having a size similar to the case 102, the case 102 and the PCB 120 are tack- welded and then are joined with the adhesive 140, whereby the joining portion has a shape of a square.
[33] As such, since the present invention does not require a curling process, a rectangular parallelepiped shaped case or any other shapes having sharp corners as well as a cylindrical case may be tack- welded and adhered on a PCB, thereby manufacturing microphones having various shapes. The shape of a welding portion of the case also may be changed into a shape which crosses at right angles or a shape which is bent in a shape of 'D'. Further, preferably, the welding portion of the PCB is made by forming a copper clad through a general PCB manufacturing process and then plating the copper clad with Ni or Au.
[34] Accordingly, the end of the case 102 is tack- welded on the PCB 120 and then the case 102 and the PCB 120 are joined by an adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that an external sound pressure does not enter the case.
[35]
[36] [Embodiment 2]
[37] Fig. 4 is a sectional side view showing a microphone having a case which is formed with a sound hole and a spring shaped conductive base according to the present invention.
[38] A condenser microphone 200 according to the present invention, as shown in Fig. 4, is manufactured by sequentially inserting the vibration plate 104 consisting of the conductive polar ring 104a and the vibration membrane 104b, the spacer 106, the insulating base 108 which is made of an insulating material, the back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, and a conductive base 202 which is made of a metal spring into a metal case 102 which is formed with a sound hole 102a on a front side thereof, and then bonding the case 102 to the PCB 120 with the adhesive 140 after tack- welding an end of the case 102 to the PCB 120.
[39] Referring to an enlarged view of Fig. 4, the PCB 120 is formed with a conductive pattern 120b on the portion of the PCB which contacts the spring shaped conductive base 202 and is also formed with the conductive pattern 120c on the portion of the PCB which contacts the case 102. Here, the case 102 and the conductive pattern 120c of the PCB 120 are partially tack- welded through the tack- welding point 130. Here, the tack- welding may be performed by laser welding, arc welding, electric resistance welding, seam welding, soldering and the like. Further, the joining between the case 102 and the PCB 120 may be performed by a method of bonding the whole connecting part of them with the adhesive 140 having a property which is not changed in a high temperature, for example, epoxy, silver paste, silicon, urethane, acryl, cream solder and the like.
[40] Accordingly, the end of the case 102 is tack- welded on the PCB 120 and then the case 102 and the PCB 120 are joined by an adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that an external sound pressure does not enter the case.
[41] Further, if the spring shaped conductive base 202 is used in the second embodiment, since the parts within the case are pressed toward the bottom side of the case by an elastic force of the conductive base 202, thereby more firmly supporting the parts and also enhancing an electrical conductive characteristic.
[42] Since the second embodiment has the same structure as the first embodiment except that the conductive base 202 adopts a spring structure, the further explanation will be omitted to avoid a repetition.
[43] [44] [Embodiment 3]
[45] Fig. 5 is a sectional side view showing a microphone having a case which is formed with a sound hole and a conductive base using a conductive washer according to the present invention.
[46] A condenser microphone 300 according to the present invention, as shown in Fig. 5, is manufactured by sequentially inserting the vibration plate 104 consisting of the conductive polar ring 104a and the vibration membrane 104b, the spacer 106, the insulating base 108 which is made of an insulating material, the back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, a conductive washer 302 for more efficiently connecting the conductive base with the PCB and the conductive base 112 which is made of a metal material into the metal case 102 which is formed with a sound hole 102a on a front side thereof, and then bonding the case 102 to the PCB 120 with the adhesive 140 after tack- welding an end of the case 102 to the PCB 120.
[47] Referring to an enlarged view of Fig. 5, the PCB 120 is formed with a conductive pattern 120b on the portion of the PCB which contacts the conductive base 112 and is also formed with a conductive pattern 120c on the portion of the PCB which contacts the case 102. Here, the case 102 and the conductive pattern 120c of the PCB 120 are partially tack- welded through a tack- welding point 130. Here, the tack- welding may be performed by laser welding, arc welding, electric resistance welding, seam welding, soldering and the like. Further, the joining between the case 102 and the PCB 120 may be performed by a method of bonding the whole connecting part of them with the adhesive 140 having a property which is not changed in a high temperature, for example, epoxy, silver paste, silicon, urethane, acryl, cream solder and the like.
[48] Accordingly, the end of the case 102 is tack- welded on the PCB 120 and then the case 102 and the PCB 120 are joined by an adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that an external sound pressure does not enter the case.
[49] Further, if the conductive washer 302 having elasticity is applied between the back plate 110 and the conductive base 112 as shown in Fig. 5 of the third embodiment, since the parts within the case are pressed toward the bottom side of the case by an elastic force of the conductive washer 302, thereby more firmly supporting the parts and also enhancing an electrical conductive characteristic.
[50] Since the third embodiment has the same structure as the first embodiment except that the conductive washer 302 is added to the conductive base 112, the further explanation will be omitted to avoid a repetition.
[51]
[52] [Embodiment 4] [53] Fig. 6 is a sectional side view showing a microphone having a PCB which is formed with a sound hole and a general conductive base according to the present invention.
[54] A condenser microphone 100' according to the present invention, as shown in Fig.
6, is manufactured by sequentially inserting the vibration plate 104 consisting of the conductive polar ring 104a and the vibration membrane 110b, the spacer 106, the insulating base 108 which is made of an insulating material, the back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, and the conductive base 112 which is made of a conductive material into a hollow typed metal case 102 having a closed front side, and then bonding the case 102 to the PCB 120 with an adhesive 140 after tack- welding an end of the case 102 to the PCB 120. Here, in case of an electret typed microphone, the back plate 110 has a structure forming an electret by attaching an organic film on a metal plate. Further, the tack- welding between the case 102 and the PCB 120 may be performed by laser welding, arc welding, electric resistance welding, seam welding, soldering and the like. Further, the joining between the case 102 and the PCB 120 may be performed by a method of bonding the whole connecting part of them with the adhesive 140 having a property which is not changed in a high temperature, for example, epoxy, silver paste, silicon, urethane, acryl, cream solder and the like.
[55] According to the structure of the microphone of the present invention, since the
PCB 120 and the case 102 are joined by the adhesive 140, the curling process is not required, whereby the problem generated due to the conventional curling process can be solved. Further, since there is no need to mount the PCB 120 within the case 102, the PCB, as shown Fig. 3, may have various shapes. That is, the PCB used in the present invention, as shown in Figs. 3A to 3D, may have a square shape or a shape which takes only some corners from the square shape. Further, the joining portion may have any of a circle and a square according to the shape of the case.
[56] As such, since the present invention does not require a curling process, a rectangular parallelepiped shaped case or any other shapes having sharp corners as well as a cylindrical case may be tack- welded and adhered on a PCB, thereby manufacturing microphones having various shapes. The shape of a joining portion of the case also may be changed into a shape which crosses at right angles or a shape which is bent in a shape of 'D'. Further, preferably, the welding portion of the PCB is made by forming a copper clad through a general PCB manufacturing process and then plating the copper clad with Ni or Au.
[57] Accordingly, the end of the case 102 is tack- welded on the PCB 120 and then the case 102 and the PCB 120 are joined by an adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by improving a sealing performance so that an external sound pressure does not enter the case. [58]
[59] [Embodiment 5]
[60] Fig. 7 is a sectional side view showing a microphone having a PCB which is formed with a sound hole and a spring shaped conductive base according to the present invention. [61] A condenser microphone 200' according to the present invention, as shown in Fig.
7, is manufactured by sequentially inserting the vibration plate 104 consisting of the conductive polar ring 104a and the vibration membrane 104b, the spacer 106, the insulating base 108 which is made of an insulating material, the back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, and the conductive base 202 which is made of a metal spring into a hollow typed metal case 102 having a closed front side, and then bonding the case 102 to the PCB 120 with the adhesive 140 after tack- welding an end of the case 102 to the PCB 120.
[62] Accordingly, the end of the case 102 is tack- welded on the PCB 120 and then the case 102 and the PCB 120 are joined by an adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that an external sound pressure does not enter the case. Further, if the spring shaped conductive base 202 of the second embodiment is used, since the parts within the case are pressed toward the bottom side of the case by an elastic force of the conductive base 202, thereby more firmly supporting the parts and also enhancing an electrical conductive characteristic.
[63] Since the fifth embodiment has the same structure as the second embodiment except that the sound hole 120a is not formed on the case 102, but formed on the PCB 120, the further explanation will be omitted to avoid a repetition.
[64]
[65] [Embodiment 6]
[66] Fig. 8 is a sectional side view showing a microphone having a PCB which is formed with a sound hole and a conductive base using a conductive washer according to the present invention.
[67] A condenser microphone 300' according to the present invention, as shown in Fig.
8, is manufactured by sequentially inserting the vibration plate 104 consisting of the conductive polar ring 104a and the vibration membrane 104b, the spacer 106, the insulating base 108 which is made of an insulating material, the back plate 110 which faces the vibration plate 104 with the spacer 106 interposed therebetween, the conductive washer 302 for more efficiently connecting the conductive base 112 with the PCB 120 and the conductive base 112 which is made of a metal material into a hollow typed metal case 102 having a closed front side, and then bonding the case 102 to the PCB 120 with the adhesive 140 after tack- welding an end of the case 102 to the PCB 120.
[68] As such, the end of the case 102 is tack-welded on the PCB 120 and then the case
102 and the PCB 120 are joined by the adhesive, thereby enhancing electrical conductivity between the case and the PCB and also enhancing a sound characteristic by sealing the case so that an external sound pressure does not enter the case.
[69] Further, if the conductive washer 302 having elasticity is applied between the back plate 110 and the conductive base 112 as described in the third embodiment, since the parts within the case are pressed toward the bottom side of the case by an elastic force of the conductive washer 302, thereby more firmly supporting the parts and also enhancing an electrical conductive characteristic.
[70] Since the sixth embodiment has the same structure as the third embodiment except that the sound hole 120a is not formed on the case 102, but formed on the PCB 120, the further explanation will be omitted to avoid a repetition.
[71] According the above embodiments of the present invention, the vibration plate is positioned on the bottom surface of the case prior to the back plate. However, on the contrary, the back plate may be positioned prior to the vibration plate. Thus, the present invention may be applied to a microphone or a directional microphone having another structure, for example, the above reversed structure. Industrial Applicability
[72] From the foregoing, according to the present invention, the metal case which is mounted with condenser microphone parts is directly tack- welded to the PCB and then the case and the PCB are bonded by the adhesive without the curling process for inserting a PCB into a metal case and then bending an end of the case. As a result, a joining strength between the case and the PCB are increased, thereby enhancing an electrical conductivity therebetween and also enhancing a sound characteristic by sealing the case so that a sound pressure from the outside does not enter the case.
[73] Further, since the shape of the PCB is not limited by the size of the case, the PCB which is used for the microphone is freely designed, thereby forming various shapes of terminals. Further, since an assembling work can be performed without a physical force applied in the conventional curling process, a more thin PCB can be adapted. As a result, the height of a product can be lowered, whereby a more thin microphone can be manufactured.

Claims

Claims
[1] A condenser microphone comprising: a hollow typed case having one side which is opened; a vibration plate which is inserted into the case; a spacer which is inserted into the case; a back plate which is inserted into the case; an insulating base which is inserted into the case; a conductive base which is inserted into the case; and a PCB which is mounted with parts and is formed with connecting terminals for connecting to the outside, whereby an end of the case is tack- welded to the PCB and then the case and the PCB are joined by an adhesive.
[2] The condenser microphone according to claim 1, wherein the case has any shape of a cylinder and a rectangular parallelepiped.
[3] The condenser microphone according to claim 1, wherein the PCB is broader than the case or has the same size as the case, the PCB being formed with a connecting pattern on its portion which joins with the case.
[4] The condenser microphone according to claim 1, wherein the conductive base has a spring structure.
[5] The condenser microphone according to claim 1 further comprising a conductive washer having conductivity and elasticity to elastically contact the conductive base with the PCB.
[6] A method for manufacturing a condenser microphone, the method comprising the steps of: inserting a diaphragm, a spacer, a back plate, an insulating base having an insulating property and a conductive base having conductivity into a hollow typed case having one side which is opened; aligning an end of the case on a connecting pattern of a PCB and tack- welding them; bonding the connecting part between the case and the PCB with an adhesive after tack- welding; and curing the adhesive.
[7] The method according to claim 6, wherein the case has any shape of a cylinder and a rectangular parallelepiped.
[8] The method according to claim 6, wherein the PCB is broader than the case or has the same size as the case, the PCB being formed with a connecting pattern on its portion which contacts the case.
[9] The method according to claim 6, wherein the tack-welding is any one selected from the group of laser welding, arc welding, electric resistance welding, seam welding and soldering.
[10] The method according to claim 6, wherein the adhesive is any one selected from the group of epoxy, silver paste, silicon, urethane, acryl and cream solder.
PCT/KR2006/000390 2005-09-07 2006-02-03 A condenser microphone and method of making the same WO2007029907A1 (en)

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CN103338415A (en) * 2013-06-08 2013-10-02 歌尔声学股份有限公司 Method for fixing microphone shell and circuit board
KR101485301B1 (en) * 2014-09-24 2015-01-22 (주)비엔씨넷 Condenser Microphone

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