WO2007019493A3 - Process for making single crystalline flakes using deep etching - Google Patents
Process for making single crystalline flakes using deep etching Download PDFInfo
- Publication number
- WO2007019493A3 WO2007019493A3 PCT/US2006/030870 US2006030870W WO2007019493A3 WO 2007019493 A3 WO2007019493 A3 WO 2007019493A3 US 2006030870 W US2006030870 W US 2006030870W WO 2007019493 A3 WO2007019493 A3 WO 2007019493A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor material
- single crystalline
- thin strips
- deep etching
- making single
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/0019—Flexible or deformable structures not provided for in groups B81C1/00142 - B81C1/00182
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/0038—Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02027—Setting crystal orientation
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02035—Shaping
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5225—Shielding layers formed together with wiring layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/019—Bonding or gluing multiple substrate layers
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06551—Conductive connections on the side of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06589—Thermal management, e.g. cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
Abstract
A method of forming a plurality of thin strips of semiconductor material includes cutting a wafer having a thickness K from a semiconductor boule. The wafer is masked to form a plurality mask lines of a thickness associated with the desired thickness of the thin strips of semiconductor material. The wafer is etched to form plateaus of semiconductor material beneath the mask line having heights associated with the desired width of the thin strips of semiconductor material. The plateaus are removed thereby providing thin strips of semiconductor material.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70592505P | 2005-08-05 | 2005-08-05 | |
US60/705,925 | 2005-08-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007019493A2 WO2007019493A2 (en) | 2007-02-15 |
WO2007019493A3 true WO2007019493A3 (en) | 2008-12-31 |
Family
ID=37727993
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/030849 WO2007019487A2 (en) | 2005-08-05 | 2006-08-07 | Method and system for fabricating thin devices |
PCT/US2006/030870 WO2007019493A2 (en) | 2005-08-05 | 2006-08-07 | Process for making single crystalline flakes using deep etching |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/030849 WO2007019487A2 (en) | 2005-08-05 | 2006-08-07 | Method and system for fabricating thin devices |
Country Status (1)
Country | Link |
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WO (2) | WO2007019487A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7605054B2 (en) | 2007-04-18 | 2009-10-20 | S.O.I.Tec Silicon On Insulator Technologies | Method of forming a device wafer with recyclable support |
US8258624B2 (en) | 2007-08-10 | 2012-09-04 | Intel Mobile Communications GmbH | Method for fabricating a semiconductor and semiconductor package |
WO2010062659A1 (en) * | 2008-10-28 | 2010-06-03 | Athenaeum, Llc | Epitaxial film assembly system & method |
US8598016B2 (en) * | 2011-06-15 | 2013-12-03 | Applied Materials, Inc. | In-situ deposited mask layer for device singulation by laser scribing and plasma etch |
FR2977075A1 (en) * | 2011-06-23 | 2012-12-28 | Soitec Silicon On Insulator | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR SUBSTRATE |
US9452495B1 (en) * | 2011-07-08 | 2016-09-27 | Sixpoint Materials, Inc. | Laser slicer of crystal ingots and a method of slicing gallium nitride ingots using a laser slicer |
US9799792B2 (en) | 2015-01-14 | 2017-10-24 | International Business Machines Corporation | Substrate-free thin-film flexible photovoltaic device and fabrication method |
US9496165B1 (en) | 2015-07-09 | 2016-11-15 | International Business Machines Corporation | Method of forming a flexible semiconductor layer and devices on a flexible carrier |
KR101723789B1 (en) * | 2016-06-03 | 2017-04-06 | 서울시립대학교 산학협력단 | Method for analyzing line edge roughness for three-dimentional semiconductor device |
CN109273607A (en) * | 2018-11-05 | 2019-01-25 | 武汉理工大学 | A method of flexible large area perovskite solar cell module is prepared using femtosecond laser |
CN109273608B (en) * | 2018-11-05 | 2021-01-19 | 武汉理工大学 | Semitransparent perovskite solar cell and preparation method thereof |
CN111736259A (en) * | 2020-07-24 | 2020-10-02 | 歌尔股份有限公司 | Waveguide lens module, manufacturing method thereof and AR equipment |
CN117253791A (en) * | 2023-11-20 | 2023-12-19 | 物元半导体技术(青岛)有限公司 | IGBT device manufacturing method and IGBT device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6214703B1 (en) * | 1999-04-15 | 2001-04-10 | Taiwan Semiconductor Manufacturing Company | Method to increase wafer utility by implementing deep trench in scribe line |
US6387773B1 (en) * | 1999-06-30 | 2002-05-14 | Infineon Technologies Ag | Method for fabricating trenches having hallows along the trenches side wall for storage capacitors of DRAM semiconductor memories |
US20030152756A1 (en) * | 2001-12-18 | 2003-08-14 | Yasufumi Yamada | Method and apparatus for processing three-dimensional structure, method for producing three-dimensional shape product and three-dimensional structure |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4848931A (en) * | 1985-11-20 | 1989-07-18 | Toyo Aluminium Kabushiki Kaisha | Packaging sheet and containers and pouches using the sheet |
JPS63155731A (en) * | 1986-12-19 | 1988-06-28 | Agency Of Ind Science & Technol | Semiconductor device |
US4900372A (en) * | 1987-11-13 | 1990-02-13 | Kopin Corporation | III-V on Si heterostructure using a thermal strain layer |
US5248621A (en) * | 1990-10-23 | 1993-09-28 | Canon Kabushiki Kaisha | Method for producing solar cell devices of crystalline material |
JP2001085715A (en) * | 1999-09-09 | 2001-03-30 | Canon Inc | Isolation method of semiconductor layer and manufacturing method of solar battery |
JP4708577B2 (en) * | 2001-01-31 | 2011-06-22 | キヤノン株式会社 | Method for manufacturing thin film semiconductor device |
FR2821697B1 (en) * | 2001-03-02 | 2004-06-25 | Commissariat Energie Atomique | METHOD OF MANUFACTURING THIN LAYERS ON A SPECIFIC CARRIER AND AN APPLICATION |
US7220656B2 (en) * | 2003-04-29 | 2007-05-22 | Micron Technology, Inc. | Strained semiconductor by wafer bonding with misorientation |
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2006
- 2006-08-07 WO PCT/US2006/030849 patent/WO2007019487A2/en active Application Filing
- 2006-08-07 WO PCT/US2006/030870 patent/WO2007019493A2/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6214703B1 (en) * | 1999-04-15 | 2001-04-10 | Taiwan Semiconductor Manufacturing Company | Method to increase wafer utility by implementing deep trench in scribe line |
US6387773B1 (en) * | 1999-06-30 | 2002-05-14 | Infineon Technologies Ag | Method for fabricating trenches having hallows along the trenches side wall for storage capacitors of DRAM semiconductor memories |
US20030152756A1 (en) * | 2001-12-18 | 2003-08-14 | Yasufumi Yamada | Method and apparatus for processing three-dimensional structure, method for producing three-dimensional shape product and three-dimensional structure |
Also Published As
Publication number | Publication date |
---|---|
WO2007019487A2 (en) | 2007-02-15 |
WO2007019493A2 (en) | 2007-02-15 |
WO2007019487A3 (en) | 2007-12-21 |
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