WO2007008992A3 - Apparatus and methods for continuously depositing a pattern of material onto a substrate - Google Patents
Apparatus and methods for continuously depositing a pattern of material onto a substrate Download PDFInfo
- Publication number
- WO2007008992A3 WO2007008992A3 PCT/US2006/027063 US2006027063W WO2007008992A3 WO 2007008992 A3 WO2007008992 A3 WO 2007008992A3 US 2006027063 W US2006027063 W US 2006027063W WO 2007008992 A3 WO2007008992 A3 WO 2007008992A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- pattern
- mask
- order
- methods
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0831—Machines for printing webs
- B41F15/0836—Machines for printing webs by means of cylindrical screens or screens in the form of endless belts
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/10—Screen printing machines characterised by their constructional features
- B41P2215/12—Screens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physical Vapour Deposition (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
A pattern of material is continuously deposited onto a substrate. The substrate and a mask are continuously brought together over a portion of a drum where a deposition source emits material. The mask includes apertures that form a pattern, and the material from the deposition source passes through the pattern of the mask and collects onto the substrate to form the pattern of material. The elongation and the transverse position of the substrate and the mask may be controlled. Pattern elements of the substrate and of the mask may be sensed in order to adjust the elongation and/or the transverse position of the substrate and/or mask to maintain a precise registration. Furthermore, the apertures may have a least dimension on the order of 100 microns or less to thereby create features on the substrate having least dimensions on the order of 100 microns or less.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06787025A EP1902601A2 (en) | 2005-07-12 | 2006-07-11 | Apparatus and methods for continuously depositing a pattern of material onto a substrate |
JP2008521572A JP2009501280A (en) | 2005-07-12 | 2006-07-11 | Apparatus and method for continuously depositing a material pattern on a substrate |
CN200680025659A CN100596256C (en) | 2005-07-12 | 2006-07-11 | Apparatus and methods for continuously depositing a pattern of material onto a substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17941805A | 2005-07-12 | 2005-07-12 | |
US11/179,418 | 2005-07-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007008992A2 WO2007008992A2 (en) | 2007-01-18 |
WO2007008992A3 true WO2007008992A3 (en) | 2007-05-24 |
Family
ID=37637931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/027063 WO2007008992A2 (en) | 2005-07-12 | 2006-07-11 | Apparatus and methods for continuously depositing a pattern of material onto a substrate |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1902601A2 (en) |
JP (1) | JP2009501280A (en) |
CN (1) | CN100596256C (en) |
WO (1) | WO2007008992A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080171422A1 (en) * | 2007-01-11 | 2008-07-17 | Tokie Jeffrey H | Apparatus and methods for fabrication of thin film electronic devices and circuits |
JP5467531B2 (en) * | 2008-06-26 | 2014-04-09 | 株式会社ニコン | Display element manufacturing method and manufacturing apparatus |
US8339573B2 (en) | 2009-05-27 | 2012-12-25 | 3M Innovative Properties Company | Method and apparatus for photoimaging a substrate |
US20110065282A1 (en) * | 2009-09-11 | 2011-03-17 | General Electric Company | Apparatus and methods to form a patterned coating on an oled substrate |
KR101201755B1 (en) * | 2010-11-02 | 2012-11-15 | 삼성에스디아이 주식회사 | Vaccum evaporator and vaccum evaporating method using the same |
JP5736857B2 (en) * | 2011-03-09 | 2015-06-17 | 凸版印刷株式会社 | Deposition equipment |
JP5733507B2 (en) * | 2011-03-17 | 2015-06-10 | 凸版印刷株式会社 | Deposition method |
JP5937876B2 (en) * | 2012-04-18 | 2016-06-22 | 名古屋メッキ工業株式会社 | Plated fiber manufacturing apparatus and method |
CN103668047A (en) * | 2012-09-03 | 2014-03-26 | 香港纺织及成衣研发中心有限公司 | Vacuum coating pattern generation device and vacuum coating pattern generation method |
CN112226730A (en) * | 2020-09-30 | 2021-01-15 | 广州国显科技有限公司 | Flexible mask and evaporation device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2248039A (en) * | 1990-08-31 | 1992-03-25 | Ricoh Kk | Printer using a stencil |
US5395643A (en) * | 1991-09-18 | 1995-03-07 | International Business Machines Corporation | Method of and apparatus for depositing solder on a printed circuit board |
WO2001035703A1 (en) * | 1999-11-08 | 2001-05-17 | Speedline Technologies, Inc. | Improvements in solder printers |
US20050109811A1 (en) * | 2003-11-21 | 2005-05-26 | Swanson Ronald P. | Method and apparatus for controlling a moving web |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6897164B2 (en) | 2002-02-14 | 2005-05-24 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
-
2006
- 2006-07-11 WO PCT/US2006/027063 patent/WO2007008992A2/en active Application Filing
- 2006-07-11 CN CN200680025659A patent/CN100596256C/en not_active Expired - Fee Related
- 2006-07-11 EP EP06787025A patent/EP1902601A2/en not_active Withdrawn
- 2006-07-11 JP JP2008521572A patent/JP2009501280A/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2248039A (en) * | 1990-08-31 | 1992-03-25 | Ricoh Kk | Printer using a stencil |
US5395643A (en) * | 1991-09-18 | 1995-03-07 | International Business Machines Corporation | Method of and apparatus for depositing solder on a printed circuit board |
WO2001035703A1 (en) * | 1999-11-08 | 2001-05-17 | Speedline Technologies, Inc. | Improvements in solder printers |
US20050109811A1 (en) * | 2003-11-21 | 2005-05-26 | Swanson Ronald P. | Method and apparatus for controlling a moving web |
Also Published As
Publication number | Publication date |
---|---|
CN100596256C (en) | 2010-03-24 |
WO2007008992A2 (en) | 2007-01-18 |
JP2009501280A (en) | 2009-01-15 |
EP1902601A2 (en) | 2008-03-26 |
CN101223834A (en) | 2008-07-16 |
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