WO2006135237A3 - Dispositif et procede pour traiter des composants electroniques avec un flux de coupe double - Google Patents

Dispositif et procede pour traiter des composants electroniques avec un flux de coupe double Download PDF

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Publication number
WO2006135237A3
WO2006135237A3 PCT/NL2006/050131 NL2006050131W WO2006135237A3 WO 2006135237 A3 WO2006135237 A3 WO 2006135237A3 NL 2006050131 W NL2006050131 W NL 2006050131W WO 2006135237 A3 WO2006135237 A3 WO 2006135237A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
cutting flow
processing electronic
double cutting
assembly
Prior art date
Application number
PCT/NL2006/050131
Other languages
English (en)
Other versions
WO2006135237A2 (fr
Inventor
Hendrik Wensink
Original Assignee
Fico Bv
Hendrik Wensink
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Hendrik Wensink filed Critical Fico Bv
Publication of WO2006135237A2 publication Critical patent/WO2006135237A2/fr
Publication of WO2006135237A3 publication Critical patent/WO2006135237A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • B24C1/045—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass for cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D11/00—Combinations of several similar cutting apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Laser Beam Processing (AREA)

Abstract

La présente invention concerne un dispositif permettant de traiter un ensemble de composants électroniques avec au moins un double flux de coupe. Il comprend une source d'énergie pour produire au moins deux flux de coupe, une double tête de coupe, un support pour l'ensemble de composants électroniques, et un organe d'entraînement pour déplacer l'un par rapport à l'autre la tête double et le support. L'invention concerne également un procédé de traitement d'un ensemble de composants électroniques avec un flux de coupe.
PCT/NL2006/050131 2005-06-02 2006-06-01 Dispositif et procede pour traiter des composants electroniques avec un flux de coupe double WO2006135237A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1029171A NL1029171C2 (nl) 2005-06-02 2005-06-02 Inrichting en werkwijze voor het met een dubbele snijstraal bewerken van elektronische componenten.
NL1029171 2005-06-02

Publications (2)

Publication Number Publication Date
WO2006135237A2 WO2006135237A2 (fr) 2006-12-21
WO2006135237A3 true WO2006135237A3 (fr) 2007-03-29

Family

ID=35462602

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2006/050131 WO2006135237A2 (fr) 2005-06-02 2006-06-01 Dispositif et procede pour traiter des composants electroniques avec un flux de coupe double

Country Status (3)

Country Link
NL (1) NL1029171C2 (fr)
TW (1) TW200703490A (fr)
WO (1) WO2006135237A2 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2341205A1 (fr) * 1976-02-13 1977-09-09 Thomson Csf Diode passivee, a dielectrique epais, presentant une forme parallelepipedique, et procede collectif de fabrication de ladite diode
JPS59218292A (ja) * 1983-05-25 1984-12-08 Mitsubishi Electric Corp レ−ザ加工装置
JPS60121089A (ja) * 1983-12-02 1985-06-28 Mitsubishi Electric Corp レ−ザビ−ムによる鋼板のつき合わせ溶接法
DE3533644C1 (en) * 1985-09-20 1987-03-26 Duerkopp System Technik Gmbh Method and device for cutting sheet-like material using a jet of fluid at a very high pressure
US5605492A (en) * 1994-11-14 1997-02-25 Trumpf Gmbh & Co. Method and machine tool for cutting workpieces
US20020125232A1 (en) * 1998-08-26 2002-09-12 Choo Dae-Ho Laser cutting apparatus and method
US6612910B1 (en) * 1998-03-11 2003-09-02 Hitachi, Ltd. Liquid crystal glass substrate, method of cutting the liquid crystal glass substrate, cutter for the liquid crystal glass substrate and display using the liquid crystal glass substrate
WO2005057650A1 (fr) * 2003-12-12 2005-06-23 Sunyang Tech Co., Ltd. Appareil de separation par jet d'eau pour fabrication de semiconducteurs et procede de separation de semiconducteurs
FR2885547A1 (fr) * 2005-05-10 2006-11-17 Saint Gobain Decoupe par jets

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252981A (ja) * 1985-08-30 1987-03-07 Nippei Toyama Corp 複数レ−ザ照射ヘツド
US5948288A (en) * 1996-05-28 1999-09-07 Komag, Incorporated Laser disk texturing apparatus
US20040089450A1 (en) * 2002-11-13 2004-05-13 Slade William J. Propellant-powered fluid jet cutting apparatus and methods of use
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2341205A1 (fr) * 1976-02-13 1977-09-09 Thomson Csf Diode passivee, a dielectrique epais, presentant une forme parallelepipedique, et procede collectif de fabrication de ladite diode
JPS59218292A (ja) * 1983-05-25 1984-12-08 Mitsubishi Electric Corp レ−ザ加工装置
JPS60121089A (ja) * 1983-12-02 1985-06-28 Mitsubishi Electric Corp レ−ザビ−ムによる鋼板のつき合わせ溶接法
DE3533644C1 (en) * 1985-09-20 1987-03-26 Duerkopp System Technik Gmbh Method and device for cutting sheet-like material using a jet of fluid at a very high pressure
US5605492A (en) * 1994-11-14 1997-02-25 Trumpf Gmbh & Co. Method and machine tool for cutting workpieces
US6612910B1 (en) * 1998-03-11 2003-09-02 Hitachi, Ltd. Liquid crystal glass substrate, method of cutting the liquid crystal glass substrate, cutter for the liquid crystal glass substrate and display using the liquid crystal glass substrate
US20020125232A1 (en) * 1998-08-26 2002-09-12 Choo Dae-Ho Laser cutting apparatus and method
WO2005057650A1 (fr) * 2003-12-12 2005-06-23 Sunyang Tech Co., Ltd. Appareil de separation par jet d'eau pour fabrication de semiconducteurs et procede de separation de semiconducteurs
FR2885547A1 (fr) * 2005-05-10 2006-11-17 Saint Gobain Decoupe par jets

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 279 (M - 427) 7 November 1985 (1985-11-07) *

Also Published As

Publication number Publication date
NL1029171C2 (nl) 2006-12-05
TW200703490A (en) 2007-01-16
WO2006135237A2 (fr) 2006-12-21

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