WO2006123520A1 - Apparatus for carrying in/out substrate and method for carrying in/out substrate - Google Patents

Apparatus for carrying in/out substrate and method for carrying in/out substrate Download PDF

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Publication number
WO2006123520A1
WO2006123520A1 PCT/JP2006/308633 JP2006308633W WO2006123520A1 WO 2006123520 A1 WO2006123520 A1 WO 2006123520A1 JP 2006308633 W JP2006308633 W JP 2006308633W WO 2006123520 A1 WO2006123520 A1 WO 2006123520A1
Authority
WO
WIPO (PCT)
Prior art keywords
tray
substrate
carry
pin
loading
Prior art date
Application number
PCT/JP2006/308633
Other languages
French (fr)
Japanese (ja)
Inventor
Tetsuro Kamichika
Tomohiro Ueda
Original Assignee
Hirata Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corporation filed Critical Hirata Corporation
Priority to CN2006800008384A priority Critical patent/CN101018723B/en
Priority to JP2006548435A priority patent/JP4537411B2/en
Priority to TW095116598A priority patent/TWI320392B/zh
Publication of WO2006123520A1 publication Critical patent/WO2006123520A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0235—Containers
    • B65G2201/0258—Trays, totes or bins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0267—Pallets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0294—Vehicle bodies

Definitions

  • the present invention relates to a substrate carry-in / out device, and more particularly to a substrate carry-in / out device for taking out a substrate from a tray carder loaded on a pallet and further storing the processed substrate in a tray.
  • a plurality of fixing pins having a certain length are provided on a stage for delivering a substrate or the like, and holes are formed in accordance with positions where these fixing pins are inserted.
  • a method is disclosed in which a plurality of trays provided are taken out from the top one by one and stacked on a fixed pin to take out and transport the substrates in the tray. The order in which the trays are stacked is reversed before and after the substrate is taken out.
  • Japanese Patent Application Laid-Open No. 2004-186249 discloses a place where a plurality of trays stacked in multiple stages are transported to a high position, and a fixed pin having a length longer than the height of the stacking tray waits ( A method is disclosed in which the lower tray separated to the bottom is moved up and down to take out the substrate on the pins.
  • the fixing pins need to be equal to or higher than the height of the laminated tray, and the laminated tray needs to be arranged at a high position. Therefore, there is a problem that the scale of the apparatus is inevitably increased.
  • the material taken out by the substrate transfer device is a material that is easily damaged like a glass substrate, it must be handled with care.
  • the conventional substrate transfer apparatus since the operation of moving the substrate is long and the operation is complicated until the substrate is taken out, there is a risk of damaging the substrate in the middle. It is necessary to eliminate this danger as much as possible.
  • the present invention mainly solves the problems of the prior art as described above, and smoothly removes the tray card even if the substrate requires handling, and re-processes the processed substrate.
  • An object of the present invention is to provide a substrate carry-in / out device that can be efficiently accommodated in a tray and that can reduce the size of the device.
  • the present invention has been made to achieve the above object, and according to the present invention, there is provided a substrate carry-in / out device for taking out or carrying in a substrate by a trayer, wherein a predetermined number of pin pins are provided.
  • a conveyor for moving a pallet loaded with a plurality of trays having through holes, a pallet positioning means for positioning the pallet at a predetermined position of the conveyor, and the pallet being positioned by the positioning means And the plurality Tray lifting / lowering means for separating the trays of the stage and providing a predetermined separation space between the separated trays, and separating the tray for moving the loading / unloading target tray corresponding to the substrate to be loaded / unloaded in the separation space up and down Means, substrate support pin moving means for allowing a substrate support pin for supporting the substrate to enter and retreat under the carry-in / out target tray, and the board in the pin insertion hole of the carry-in / out target tray Pin insertion means for inserting support pins, and the substrate support pins project from the carry-in / out tray by passing through the pin insertion holes, and the substrate is unloaded by the projected substrate support pins.
  • a substrate carry-in / out device which is supported in a state where it is lifted from a tray to be entered.
  • a substrate loading / unloading method for taking out or loading a substrate from a tray carder, wherein a pallet in which a plurality of trays having a predetermined number of pin insertion holes are stacked is moved. And positioning the pallet, separating the stacked trays, and providing a tray relative movement step for providing a predetermined separation space, and loading / unloading corresponding to the substrate to be loaded / unloaded in the separation space.
  • a tray separating process for moving the target tray up and down independently of the other trays so that the target tray is separated from the other trays, and a substrate support pin for supporting the substrate enter under the target tray.
  • a substrate delivery process for delivering the substrate between the two.
  • the substrate carry-out and carry-out of the substrate to and from one tray having a plurality of pin through holes and selected from a plurality of stacked trays.
  • a first lifting / lowering that separates the plurality of trays up and down at a boundary between a loading / unloading tray corresponding to a substrate to be loaded / unloaded and a tray below the loading / unloading tray.
  • a substrate support for supporting the substrate in a separation space between the tray to be carried in and out and a tray below the tray to be carried in and out, which is generated by being separated by the first tray lifting and lowering means.
  • a substrate carry-in / out device characterized in that after the substrate support pin is moved into the separation space by the substrate support pin moving means, the carry-in / out object tray is lowered by the second lifting / lowering means.
  • FIG. 1 is a configuration diagram schematically illustrating a substrate carry-in / out device according to an embodiment of the present invention.
  • FIG. 2 is a view for explaining a pallet positioning operation in the substrate carry-in / out device according to the embodiment of the present invention.
  • FIG. 3 is a diagram for explaining the structure and operation of the first positioning unit 112.
  • FIG. 4 is a diagram for explaining the structure and operation of a second positioning unit 113.
  • FIG. 5 is a diagram for explaining the operation of the tray chuck 107.
  • FIG. 6 is a view for explaining the structure of a tray chuck.
  • FIG. 7 is a diagram showing a structure of a tray chuck unit.
  • FIG. 8 is a diagram showing a state when a slide pin and a swivel pin enter under the processing target tray.
  • FIG. 9 is a diagram for explaining the structure of a tray.
  • FIG. 10 is an operation transition diagram showing the operation when the lowermost tray is also taken out of the glass substrate.
  • FIG. 11 is an operation transition diagram showing an operation when taking out the second and subsequent tray glass substrates.
  • FIG. 12 is an operation transition diagram showing an operation when a glass substrate is carried into the uppermost tray.
  • FIG. 13 is an operation transition diagram showing an operation when a glass substrate is carried into a tray below the second stage in the upper part.
  • FIG. 14 is a diagram showing a configuration example in which a positioning unit 200 is provided in the tray chuck unit.
  • FIG. 15 is an operation explanatory diagram of the positioning unit 200.
  • FIG. 16 is an operation explanatory diagram of the positioning unit 200.
  • FIG. 17 is a side view of a tray 302 instead of the tray 102.
  • FIG. 18 is a diagram showing an example in which the optical sensor 400 is provided in the robot hand 110.
  • FIG. 19 is an explanatory diagram of a check operation for checking whether or not the glass substrate is mounted on each tray 302, and a diagram showing a detection result of the optical sensor 400.
  • FIG. 20 is a block diagram of a control system using the detection result of the optical sensor 400.
  • FIG. 1 is an external view showing the entire substrate carry-in / out apparatus 100 according to an embodiment of the present invention.
  • the substrate loading / unloading apparatus 100 takes out the glass substrate 108 (not shown in FIG. 1) in order from the bottom of the plurality of trays 102 loaded on the pallet 101, and further accommodates the processed substrates in the tray again. It has the function to do. If all the trays are loaded with the substrates, the glass tray 108 is also removed in order from the lowermost tray. Further, for example, when all trays below a certain tray are empty, the glass substrate 108 can be taken out from the tray carder with the upper side being the object to be carried in or out, or can be carried into the lower side tray. . When glass substrates 108 are mounted on all trays, the glass substrates are taken out in order from the bottom, and when loading glass substrates into all empty trays, the loading operation is also performed at the highest level. . These removal Z loading operations will be described in detail later.
  • reference numeral 103 denotes a first conveyor for positioning and transporting the pallet 101 on which the loaded tray 102 is placed to the take-out position of the glass substrate 108.
  • Reference numeral 104 denotes a second conveyor for sending the pallet 101 and the tray 102 to the first conveyor 103.
  • the first conveyor 103 and the second conveyor 104 are connected so as to have the same height from the installation surface (floor surface) of the apparatus.
  • the second conveyor 104 is pallet 1 A driving roller 104a for moving 01 in the X direction (both positive and negative directions) and a free roller 104b for supporting the pallet 101 also with a downward force are provided.
  • the first conveyor 103 is provided with driving rollers at both ends, and no free roller is provided at the center of the conveying surface.
  • Reference numeral 109 denotes a robot for taking out the glass substrate 108 from the tray 102.
  • Reference numeral 110 denotes a U-shaped arm of the robot 109. This arm enters under the glass substrate 108 lifted by the side pins 122 and the swivel pins 126, lifts the glass substrate 108 so that it is picked up and then scooped up. Receive it pin force.
  • Reference numeral 106 denotes a tray chuck driving unit, which includes a tray chuck 107.
  • the trays 102 corresponding to the number of steps that need to be raised and lowered are gripped by the tray chuck 107 from both sides in the Y direction, and the tray chuck 107 is moved up and down by the tray chuck drive unit 106 in this state.
  • the tray chuck 107 is provided with a locking portion (a gripping claw) 107a for locking the tray 102 that moves up and down.
  • Reference numeral 120 denotes a side pin operating portion, which is composed of a guide rail 128 and a cylinder portion 123 of a rodless cylinder.
  • a side pin mounting part 121 in which a plurality of side pins 122 are arranged is attached to the cylinder part 123, and the cylinder part 123 is driven to drive the side pin mounting part along the guide rail 128. Enable 121 to move back and forth (Y direction).
  • Reference numeral 124 denotes a swivel pin operating unit, a swivel pin mounting part 125 having a plurality of swivel pins 126 disposed thereon, and a rotary actuator 1 013 capable of swiveling the swivel pin placing part 125 in an angular direction. And.
  • the side pin operation unit 120 is disposed outside the tray chuck 107 (tray chuck row), and the swivel pin operation unit 124 is disposed between the two rows of tray chuck rows constituting the tray chuck unit 107.
  • Reference numeral 127 denotes a carry-in / out target tray separation mechanism, and the carry-in / out target tray 102a is placed in the upper tray.
  • the tray chuck driving unit 106 is divided into three units in the vertical direction. Under each unit, the side pin operating unit 120, the turning pin operating unit 124, and the carry-in / out target tray separating mechanism 127 are provided. Is attached.
  • the tray separating mechanism 127 to be carried in / out.
  • the side pin operating unit 120 causes the side pin mounting unit 121 to enter under the carry-in / out target tray 102a.
  • the swivel pin operating part 124 turns the swivel pin mounting part 125 so as to enter under the carry-in / out tray 102a.
  • the side pin operating unit 120 and the swivel pin operating unit 124 are inserted into the space under the carry-in / out target tray 102a, and the side pins 122 and swivel 126 are passed through the through-hole of the carry-in / out target tray 102a.
  • the tray 102a and the glass substrate 108 are supported at positions separated by the side pins 122 and the pivot pins 126.
  • the robot hand 110 takes out the raised glass substrate 108 when unloading, and receives the glass substrate 108 transferred by the robot node 110 by the side pin 122 and the swivel pin 126 when loading. Contain.
  • the number of side pins 122 and swivel pins 126 is not limited as long as the glass substrate 108 is stable. Further, the tip of the pin is covered with a soft material such as rubber so as not to damage the glass substrate 108.
  • the tray 102 is configured by stacking 60 trays.
  • the lowest tray (first tray) is assumed to be fixed to the pallet 101.
  • FIG. 2 is a schematic diagram for explaining the positioning operation when the tray 102 placed on the pallet 101 is conveyed on the conveyor and arrives at the fixed position of the glass substrate extraction operation.
  • the pallet 101 on which the tray 102 is placed is transported from the upstream direction of the conveyor (the positive direction of the X axis) to the downstream direction (the negative direction of the X axis).
  • the conveyor 103 is controlled to stop.
  • the stop operation of the conveyor 103 is a pallet in this embodiment.
  • a sensor (not shown) is provided for detecting that 101 is in contact with the positioning block 111. When this sensor detects contact of the pallet 101 with the positioning block 111, only the conveyor 103 is stopped.
  • this conveyor stop method may employ a mechanism that turns on the mechanical switch when the pallet 101 abuts against the positioning block 111.
  • the conveyor 103 is provided with driving rollers (for example, chain driving) at both ends and the center of the conveying surface is vacant, the lifting unit 114 indicated by D in FIG. The lower surface force also lifts the pallet 101 several centimeters.
  • the first positioning unit 112 is also configured to lift the contact surface 112a with the pallet 101 several centimeters in accordance with the lifting operation of the elevating unit 114 (details will be described later). Since the lifting unit 114 has a free roller on the top surface (the rotation direction is the Y-axis direction), the pallet 101 is easy to move in the horizontal plane.
  • the second positioning unit 113 protrudes from the river width direction (X-axis direction) of the conveyor 103, and the pallet 101 is The other unit (not shown) is positioned in the Y-axis direction so as to sandwich both side forces in the Y-axis direction (river width direction) of the conveyor 103 (projecting on the opposite side surface).
  • the contact surface of the positioning block 111 having the same structure as the first positioning unit 112 ( (Laura part) 11 la also follows a few centimeters and rises! /
  • the second positioning unit 113 is separated from the pallet 101. Further, the elevating unit 114 is lowered, and the loading / unloading operation of the glass substrate 108 is started. Note that a lower limit sensor is provided in the lifting unit 114, and then descends again after ascending. As a result, the sensor is turned on, and it becomes a trigger signal for starting the next board loading / unloading operation.
  • FIG. 3 is a diagram showing details of the first positioning unit 112.
  • the first positioning unit 112 when the first positioning unit 112 is in the standby state, the first positioning unit 112 is disposed at the position W. Further, the action part 115a of the cylinder 115 is also arranged at the position W. Then, when it is detected that the contact is in contact with the positioning block 111, a control signal is sent to the cylinder 115. In response to the control signal, the operation unit 115a is moved from position W to position S1 by the cylinder so that the first positioning unit 112 is set from the position W in the standby state to the position S1 in the positioning state.
  • the first positioning unit 112 is brought into contact with the pallet 101 via a roller 112a, and the roller 112a slides around a shaft 112b. That is, as described above, after the pallet 101 is positioned in the traveling direction (X-axis direction) on the conveyor, the pallet 101 is lifted by the lifting unit 114 from the lower surface of the conveyor. When the pallet 101 is lifted, the force for positioning in the X-axis direction slides with respect to the central axis 112b so that the roller 112a can follow the pallet 101 at that time. In order to make this slide possible, the shaft of the central shaft 112b is somewhat longer.
  • FIG. 4 is a diagram showing details of the second positioning unit 113.
  • the second positioning unit 113 when the second positioning unit 113 is in the standby state, the second positioning unit 113 is disposed at the position W. Further, the action part 116a of the cylinder 116 is also arranged at the position W. Then, when the pallet 101 is lifted several centimeters by the lifting unit 114, a control signal is sent to the cylinder 115. In response to the control signal, the operation unit 116a is moved from position W to position S2 by the cylinder so that the second positioning unit 113 is set from the position W in the standby state to the position S2 in the positioning state.
  • This second positioning unit positions the pallet 101 so that the side surfaces in the Y-axis direction are sandwiched between the two sides.
  • A is provided at each end of 103.
  • the tray chuck 107 is driven by a tray chuck driving unit 106.
  • the tray 102 Normally, the tray 102 also carries out the lowermost force in order, but every time it is carried out, all trays are returned to the original state (all trays are stacked), and the grip of the tray chuck 107 is released. Then, the tray chuck 107 is raised by a predetermined height, and the tray above the tray to be carried out next is gripped and lifted again. This is the basic operation of the tray chuck 107.
  • the tray chuck 107 is divided into three units, each of which can hold and lift, for example, a 19-stage tray.
  • a tray separation mechanism 127 is attached under each unit, so that one unit is held by this, and each unit is lifted by 20 steps at the same time.
  • each tray chuck is in a stand-by state when unloading is completed every 20 stages, which is the force that enables the tray tray to grip and lift the 60-stage tray as a whole.
  • the lower tray chuck 107d is in a standby state when the 20th tray from the bottom is finished
  • the middle tray chuck 107c is in a standby state when the 21st tray has been transported to the 40th tray.
  • a in FIG. 5 shows an operation after the glass substrate 108 is taken out from the tray 102 at the 19th stage from the bottom among the trays having a total of 60 stages.
  • the tray chuck 107 holds and lifts the upper 41 stages of the tray 102.
  • the tray chuck 107 is lowered and the tray is returned to the original state.
  • the entire tray chuck 107 is lowered to a position where the tray loading / unloading operation is started.
  • the tray chuck 107 is divided into three units in this way. In other words, if three tray chucks always move up and down, when processing nearly 60 stages of trays, the device height is almost doubled, which meets the demand for smaller devices. Because there is no.
  • the installation height on the conveyor is approximately (60 + 20) stages, for example, if the apparatus carries in and out 60-stage trays. If it is only a minute high, it will be.
  • the number of tray chuck divisions is not limited to three, but may be any number.
  • FIG. 6 is a view showing the structure of the tray chuck 107.
  • 6A is a schematic view of the front surface of the tray chuck
  • FIG. 6B is a schematic diagram of the side surface of the tray chuck
  • FIG. 6C is an enlarged view of the drive portion P of the gripping operation of the tray chuck.
  • the tray chuck 107 is provided in the tray chuck driving unit 106 via a tray chuck holder 1004, and is divided into, for example, three units 107b to d, each having 20 stages of gripping claws. 107a (not shown in FIG. 6A).
  • Each unit 107b-d has two rows of vertical columns 1003 connected by a first bar 1001. This vertical column 1003 is provided with 20 gripping claws 107a, for example, 19 pieces and one piece of tray separating mechanism 127, for a total of 20 pieces! This is so that one tray chuck unit can hold the 20-step tray and move it up and down.
  • the second bar 1002 and the first bar fixed (fixed by the connecting block 1006) provided so as to protrude from the tray chuck holder 1004 1001 is connected to a guide rail 1009 via a slider 1010.
  • a cylinder shaft 1007 is fixed to the tray chuck holder 1004, and a cylinder operating unit 1008 is provided on the first bar 1001. Accordingly, the first bar 1001 moves in the arrow G direction (Y-axis direction in FIG. 1). Since the vertical bar 1003 to which the units 107b to 107d are attached is fixed to the first bar 1001, each unit 107b to 107d also moves in the direction of the arrow G by this operation, and thereby the gripping operation of the tray. You can now!
  • the servo module provided in the tray chuck drive unit 106 is provided.
  • the ball screw 1011 is rotated by the motor 1012, and thereby, the tray chuck holder 100 4 is controlled to move up and down in the H direction.
  • FIG. 7 shows two of the three tray chuck units.
  • each tray chuck unit includes a first bar 1001, a second bar 1002, and two rows of vertical pillars 1003 attached to the first and second bars.
  • Tray separating mechanism 127 attached to the side of the first bar 100 1
  • slider (front / rear slider) 1010 attached to the bottom of the first bar 1001
  • Side pin operating unit 120 and a pivot pin operating unit 124 attached to the bottom surface of the second bar 1002 and between the vertical pillars 1003.
  • the side pin operating unit 120 includes a side pin mounting unit 121 in which a plurality of side pins 122 are arranged, and a cylinder 123 that moves along the guide rail 128 of the rodless cylinder. Can be moved back and forth (in the Y direction).
  • the swivel pin operation unit 124 includes a swivel pin placement unit 125 in which a plurality of swivel pins 126 are arranged, and a rotary actuator 1013 that enables the swivel pin placement unit 125 to swivel in an angular direction. Yes.
  • the pivot pin 126 and the side pin 122 are disposed at the same height.
  • the tray separating mechanism 127 is disposed between the two vertical pillars 1003, and separates the carry-in / out target tray 102a from the tray (tray group) 102 to move up and down.
  • the tray separation mechanism 127 includes a support column 1270, an elevating mechanism portion 1271 attached thereto, a slider 1272 attached to the elevating mechanism portion 1271, a support bar 1273 attached to the elevating slider 1272, and a support bar. Detaching claws 12 74 attached to both ends of the 1273.
  • the elevating mechanism portion 1271 includes a ball screw 1275 and a servo motor 1276 indicated by broken lines. By controlling the operation of the servo motor 1276, the slider 1272 and the support bar 1273 attached thereto can be moved up and down.
  • the tray separating mechanism 127 since the tray separating mechanism 127 is attached to the first bar 1001, the front / rear slider 1010 can perform the front / rear motion. Front / back slider 1010 Therefore, the carry-in / out target tray 102a can be moved up and down by holding the carry-in / out target tray 102a with the gripping claws 1274 as the processing target tray separating mechanism 127 moves forward and moving the support bar 1273 up and down in this state.
  • the tray 102 2a (not shown in FIG. 7) to be carried in / out is separated from the tray (tray group) 102 and the glass substrate 108 is taken out or ready for the receiving operation.
  • the side pin operating unit 120 advances the side pin mounting unit 121.
  • the swivel pin operating unit 124 turns the swivel pin mounting unit 125 to enter the carry-in / out target tray 102a.
  • each of the side pin 122 and the pivot pin 126 is positioned below the through hole of the tray 102a.
  • the side pin operation unit 120 and the swivel pin operation unit 124 are provided in each tray chuck unit on both sides of the tray 102. Accordingly, the side pins 122 and the pivot pins 126 enter both sides of the carry-in / out target tray 102a and are positioned below all the through holes.
  • the processing target tray separating mechanism 127 lowers the carry-in / out target tray 102a.
  • the glass substrate 108 in the tray is lifted by the side pins 122 and the pivot pins 126.
  • the robot hand 110 takes out the lifted glass substrate 108.
  • FIG. 9 shows the structure of the tray.
  • 60 trays are stacked, and each tray is provided with a plurality of through holes 1021.
  • the through hole 1021 is provided to pass through the lift pin 105, the side pin 122, and the swivel pin 126 and lift the glass substrate 108 by a predetermined height.
  • the corners of the bottom surface of the tray are chamfered (see 1023) so that the trays are positioned and not easily collapsed when the trays are stacked.
  • Each tray 102 is provided with a locking portion 1022 on the tray edge (one turn) where the gripping claw 107a and the separation claw 1274 are locked.
  • FIG. 10 is an operation transition diagram showing how the glass substrate 108 is taken out from the first-stage tray (the carrying-in / out target tray 102a).
  • the trays 102 stacked in 60 stages are carried by the conveyor 104 and positioned at the loading / unloading position (A in FIG. 10). The positioning operation is performed as described in FIGS.
  • the tray chuck 107 moves forward so as to sandwich the tray 102, and preparations are made to lift the second and higher trays (B in FIG. 10).
  • the trays in the second and subsequent stages are lifted (C in FIG. 10), and at the same time or thereafter, the lift pins 105 are raised to lift the glass substrate 108 by a predetermined height (D in FIG. 10).
  • the lift pin 105 passes through the hole 1021 provided in the tray 102a and lifts the glass substrate 108 from the tray by a predetermined height. Any number of the lift pins 105 may be used as long as the glass substrate 108 is stable. Note that.
  • the tip of the lift pin 105 may be covered with a soft material such as rubber so as not to damage the glass substrate 108, like the side pin 120 and the pivot pin 124.
  • the robot hand 110 enters between the tray 102a and the glass substrate 108, takes out the glass substrate 108, and transfers it to a substrate processing apparatus (not shown). is there.
  • the lift pins are lowered, and the second-stage or higher trays are lifted from the second-stage or higher trays to be described later.
  • the board may be taken out and returned to its original position, and the second and higher trays that have been lifted are again stacked on the first empty tray, and the second and higher trays described later are used. You can start taking out the board.
  • the length of the lift pin 105 is only long enough to penetrate the pallet 101 and one tray, lift the glass substrate 108, and allow the robot hand 110 to remove it. It is much shorter than the length of a conventional pin. Therefore, accommodate the lift pin Therefore, it is not necessary to take much space between the pallet mounting table and the floor.
  • FIG. 11 is an operation transition diagram showing how the glass substrate 108 is taken out from the processing target tray 102a in the second and higher stages.
  • the tray chuck 107 moves forward so as to sandwich the tray 102 (A in FIG. 11), and preparations are made to lift the tray on the second and higher stages (B in FIG. 11).
  • a difference from when the first-stage tray is carried in and out is that the second-stage tray 102a is separated and held by the claw 1274.
  • the second and higher trays 102 are lifted (C in FIG. 11). At this time, as shown in FIG. 11, since the second tray 102a to be loaded and unloaded is gripped by the separation claw 1274, it is separated from the tray 102 above it. ing.
  • FIG. 11 is a front view, the swivel pin operation unit 124 is shown in the figure.
  • the tray separating mechanism 127 lowers only the second tray 102a by a predetermined height. In this way, the side pin 122 and the pivot pin 126 pass through the through hole 1021 of the tray 102a to lift the glass substrate 108 accommodated in the tray 102a (E in FIG. 11).
  • the robot hand 110 enters between the tray 102a and the glass substrate 108, takes out the glass substrate 108, and places it on a substrate processing apparatus (not shown). I hand it over. This operation is the same as for the first tray.
  • the tray separation mechanism 127 to be processed raises the empty tray 102a and aligns the upper surface edge thereof with the bottom surface of the third-stage tray (in terms of appearance, the figure). 11 states like D). Then, the side pin 122 and the pivot pin 126 are retracted ( (Appearance is as shown in Fig. 11C). Furthermore, the second or higher tray 102 is placed on the first tray 102b (as shown in Fig. 11B), and the tray chuck 107 is retracted (as shown in Fig. 11A). Preparation for loading / unloading of the third tray is started.
  • the operation as described above is executed from the third stage to the 60th stage, and all the glass substrates 108 are taken out from the tray 102.
  • the tray chuck unit (107b to 107d) used for every 20 trays is changed.
  • the tray chuck 107 moves forward so as to sandwich the tray 102, and preparations are made to lift the 60th tray 102a (B in FIG. 12). Since it is necessary to raise and lower the tray 102a, the tray 102a is gripped by the separation claw 1274 that is not gripped by the tray gripping claw 107a.
  • the tray 102a at the 60th stage is lifted (C in Fig. 12), and at the same time or thereafter, the side pin 122 and the pivot pin 126 enter the tray 102a (D in Fig. 12).
  • the tray separating mechanism 127 for carrying in / out the object lowers the tray 102a of the 60th stage by a predetermined height, and the side pin 122 and the swivel pin 126 pass through the through hole 1021 of the tray, and the glass substrate 108 delivery preparations are complete.
  • a robot hand 110 (not shown in FIG. 12) holding the processed glass substrate 108 enters the side pins 122 and the pivot pins 126, and receives the glass substrate 108 on these pins. Hand it over (E in Figure 12).
  • the carry-in / out target tray separating mechanism 127 raises the tray 102a and accommodates the delivered glass substrate 108 in the tray 102a.
  • the glass substrate 108 is delivered to the side pin 122 and the pivot pin 126, or When the glass substrate 108 is accommodated in the tray 102a, the glass substrate 108 is positioned by a sensor (not shown), and the glass substrate is accommodated in the tray in a misalignment position. For example, if the sensor detects a displacement, the glass substrate 108 is taken out from the side pin 122 and the pivot pin 126 by the robot hand 110, and the delivery operation is executed again.
  • the side pin 122 and the pivot pin 126 are retracted to their original positions (state C in FIG. 12), and further, the object to be carried in / out is separated.
  • the mechanism 127 lowers the gripped tray 102a and places the 60th tray 102a on the 59th tray (state B in FIG. 12). Then, the tray chuck 107 is retracted from the tray 102, and preparations for carrying the glass substrate 108 into the next tray (59th tray) are made.
  • FIG. 13 is an operation transition diagram showing how the glass substrate 108 is carried into the 59th tray 102a.
  • the tray chuck 107 moves forward so as to sandwich the tray 102, and preparations are made to lift the 59th and higher trays (A in FIG. 13).
  • the tray in the 60th stage is gripped by the tray gripping claw 107a
  • the tray 102a in the 59th stage which is the object to be carried in / out, is gripped by the separation claw 1274.
  • the 59th and 60th stage trays are lifted by a predetermined height (B in FIG. 13).
  • the 59th tray 102a to be loaded and unloaded is gripped by the separation claw 1 274, so that it is separated from the 60th tray. It has become.
  • the tray separating mechanism 127 lowers only the 59th tray 102a by a predetermined height. In this way, the side pin 122 and the pivot pin 126 pass through the through hole 1021 of the tray 102a and pass through the tray 102a, and preparation for delivery of the glass substrate 108 is completed. In this state, for example, a robot node 110 (not shown in FIG. 13) holding the processed glass substrate 108 enters the side pins 122 and the swivel pins 126, and the glass substrate 108 is applied to these pins. Hand it over (D in Figure 13).
  • the tray separating mechanism 127 to be carried in / out raises the tray 102a.
  • the transferred glass substrate 108 is accommodated in the tray 102a.
  • the positioning of the glass substrate 108 by a sensor is the same as when the glass substrate 108 is carried into the 60th tray.
  • the heights of the conveyors 103 and 104 are fixed, and the glass substrate 108 is lifted and removed by moving the lift pins 105 and moving the slide pins 122 and the swivel pins 126 Z Since it is carried in, the operation of the apparatus can be simplified, and it is effective for space saving of the apparatus, particularly when the height is limited.
  • the pin when the pin is fixed and the conveyor itself is moved up and down, first set the absolute length.
  • the minimum pin length (the length corresponding to the number of tray steps) and the height corresponding to the number of tray steps are required as a minimum device.
  • the lift pins are raised and lowered, the number is twice the number of tray steps. Does not require device height. Each tray does not weigh as much, but it can be quite heavy when stacked in layers. In such a case, it is important to minimize the vertical movement of the heavy object itself, and this embodiment can achieve this.
  • the slide pin 122 and the swivel pin 126 are also retracted under the tray, so that the pin is in the tray.
  • the risk of breakage of the glass substrate 108 without worrying about piercing the glass substrate 108 stored in the container is dramatically reduced.
  • the tray chuck is removed when the pins are fixed, most of the glass substrate stored in the gripped tray is likely to be damaged. Let's go.
  • all the trays are placed on the pallet 101 on the first competitor 103 at the stage where the loading / unloading of all the trays is completed. Therefore, as soon as the loading / unloading is completed, the replacement operation with the pallet loaded with the tray to be processed next can be started, so the processing time for substrate transfer can be shortened as a whole, and efficient transfer is possible. Can be realized.
  • the glass substrate 108 can be taken out or carried in without any positional deviation.
  • the position of the first tray is clearly determined, as long as the pallet 101 is accurately positioned, the tray loaded on it is automatically positioned accurately.
  • the robot 109 causes the glass substrate 108 to move.
  • the positioning function of the glass substrate 108 can be added to the substrate carry-in / out device 100.
  • FIG. 14 is a diagram showing a configuration example in which the positioning unit 200 is provided in the tray chuck unit.
  • the bar 1 is an extension of the second bar 1002 of the tray chuck unit in the X direction.
  • a positioning unit 200 is attached to the lower side of both end portions of 002 ′ via an attachment portion 201.
  • the positioning unit 200 includes positioning rollers 210a, 210b, 21 la, and 21 lb, a support plate 220 that supports the rollers 210a, 210b, 21 la, and 21 lb, and a support plate 220 that reciprocates in the X direction.
  • an actuator 230 for moving and an actuator 240 for reciprocating the actuator 230 in the Y direction is provided.
  • the positional relationship between the positioning rollers 210a and 210b and 21 la and 21 lb is the distance between the outer periphery of the glass substrate 108 and the outer periphery of the tray 102 when stored at an appropriate position in the tray 102. Is set in advance.
  • the glass substrate 108 is positioned by defining the positions of its four corners with the four positioning units 200.
  • the rollers 210 a and 210 b are rollers for positioning one of the four corners of the glass substrate 108, and are supported by the support plate 220 so as to rotate on the upper side of the support plate 220.
  • the rollers 211 a and 21 lb are for controlling the amount of movement of the support plate 220 by the actuators 230 and 240, and are rotatably supported by the support plate 220 below the support plate 220.
  • the actuators 230 and 240 are both air actuators.
  • FIGS. 15 and 16 are upper side views of the periphery of the positioning unit 200 and a part (corner portion) of the carry-in / out target tray 102a, and the lower view is a plan view thereof.
  • FIGS. 15 and 16 a description will be given of the case where the tray 102 at the second or higher level is set as the carry-in / out target tray 102a, but the same applies when the bottom tray 102 is set as the target tray 102a. is there.
  • FIG. 15 shows a case where the positioning unit 200 is in a standby state.
  • the glass substrate 108 corresponding to the carry-in / out target tray 102a is placed on the slide pin 122 and the turning pin 126 (not shown). Further, as shown in the lower part of FIG. 15, the glass substrate 108 is in a state of being displaced from the carry-in / out target tray 102a in plan view.
  • the actuator 240 is first extended, and then The actuator 230 is operated to move the support plate 220 in the Y direction and the X direction in the figure. Due to the extension of the actuator 240, the support plate 220 advances between the glass substrate 108 and the tray 10a for loading / unloading, and the roller 21la contacts the side of the tray 102a for loading / unloading along the X direction.
  • the drive (extension) of the actuator 240 stops when the roller 21 la contacts the carrying-in / out tray 102a. At this time, the roller 210a comes into contact with the side of the glass substrate 108 along the X direction according to the displacement of the glass substrate 108. As a result, the glass substrate 108 is positioned in the Y direction.
  • the roller 211b is brought into contact with the side of the carry-in / out target tray 102b along the Y direction by driving the actuator 230.
  • Actuator 230 stops driving (sliding) when 21 lb of roller comes into contact with the loading / unloading tray 102a.
  • the roller 210b comes into contact with the side of the glass substrate 108 along the Y direction according to the position of the glass substrate 108.
  • the glass substrate 108 is also positioned in the X direction.
  • the drive of the actuators 230 and 240 is stopped when, for example, the rollers 211a and 21 lb contact the carrying-in / out object tray 102a, the actuators 230 and 240 cannot move the support plate 220 any more.
  • a method of weakening the urging force by the actuators 230 and 240 in advance is mentioned.
  • the positioning of the glass substrate 108 is simultaneously performed by the four positioning units 200 arranged corresponding to the four corners, and the four corners of the glass substrate 108 are positioned by the rollers 210a and 210b. Will be.
  • the positioning unit 200 After positioning, the positioning unit 200 returns to the state shown in FIG. Such positioning of the glass substrate 108 can be performed both when the glass substrate 108 is carried in and when it is carried out. Glass substrate 108 is positioned on the substrate loading / unloading device 100 side With this configuration, the robot 109 does not need to hold the glass substrate 108 again, and the tact time can be shortened.
  • FIG. 17 is a side view of a tray 302 that replaces the tray 102.
  • the tray 302 is provided with an opening 3021 communicating with the inside of the tray 102 on the side surface of the tray 102, and the other configuration is the same as the tray 102.
  • the opening 3021 it can be seen from the side of the tray 302 whether or not the glass substrate 108 is mounted in the tray 302. Therefore, it is possible to check whether or not the glass substrate 108 is mounted on each tray 302 by scanning the side surface of the stacked trays 302 in the vertical direction using an optical sensor.
  • FIG. 18 is a diagram showing an example in which the optical sensor 400 is provided in the robot hand 110.
  • the optical sensor 400 includes a light emitting element 401 and a light receiving element 402.
  • the light emitting element 401 also irradiates light with the tip force of the robot hand 110.
  • the reflected light reflected by the object is received by the light receiving element 402 at the tip of the robot hand 110, and the presence of the object is detected. .
  • FIG. 19 the glass substrate 108 is mounted on each tray 302 by the optical sensor 400.
  • FIG. 6 is a diagram for explaining the operation when checking whether or not the optical sensor 400 is detected.
  • the glass substrate 108 is mounted on the second and fifth trays 302 from the bottom.
  • the robot 110 brings the optical sensor 400 close to the side surface of the stacked tray 302, and keeps the distance between the optical sensor 400 and the side surface of the tray 302 constant, while keeping the distance between the optical sensor 400 and the tray 302 at a constant speed. Raise from the position of 302 (or descend from the position of the uppermost tray 302).
  • the light emitted from the light emitting element 401 of the optical sensor 400 is reflected by the side surface of the tray 302 and detected by the light receiving element 402.
  • the light irradiated to the opening 3021 is reflected by the side surface of the glass substrate 108 and detected by the light receiving element 402.
  • the light receiving element 402 does not detect this.
  • the electrical signal that also outputs the force of the optical sensor 400 (light receiving element 402) is mounted on the tray 302 on which the glass substrate 108 is mounted and on the tray 302.
  • the waveform is different from that of the 302, and it is possible to check whether or not the glass substrate 108 is mounted on each tray 302 from this detection result and information on the movement position of the robot hand 110. That's true.
  • FIG. 20 is a block diagram of a control system using the detection result of the optical sensor 400.
  • the example in the figure shows a host computer 500 that manages the entire factory where the substrate carry-in / out device 100 is installed, a control device 501 that controls the robot 109, and a control device 502 that controls the substrate carry-in / out device 100.
  • An example of a system that is connected to be communicable is shown.
  • the detection result of the optical sensor 400 is transmitted to the host computer 500 via the control device 501.
  • the host computer 500 selects the tray 302 to be loaded / unloaded with respect to the control device 502 according to the operation status of various substrate processing apparatuses related to the substrate loading / unloading apparatus 100.
  • the control device 502 sets the tray 302 according to the selection instruction as a tray to be loaded / unloaded, and performs the above-described loading / unloading operation. It will be.

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Abstract

An apparatus for carrying in and out a substrate is provided for taking out the substrate from a tray or carrying the substrate onto the tray. The apparatus separates the stacked trays and permits a substrate supporting pin to enter into a space made by the separation. In the status where the substrate supporting pin is positioned under the tray to be carried in/out, the substrate supporting pin is inserted into a pin inserting hole of the tray to be carried in/out. At the time of taking out the substrate, the substrate is lifted from the tray by the substrate supporting pin so that the substrate can be taken out.

Description

明 細 書  Specification
基板搬出入装置及び基板搬出入方法  Substrate carry-in / out device and substrate carry-in / out method
技術分野  Technical field
[0001] 本発明は、基板搬出入装置に関し、特にパレット上に積載されたトレイカゝら基板を 取り出し、さらに、処理された基板を再度トレイに収容するための基板搬出入装置に 関する。  The present invention relates to a substrate carry-in / out device, and more particularly to a substrate carry-in / out device for taking out a substrate from a tray carder loaded on a pallet and further storing the processed substrate in a tray.
背景技術  Background art
[0002] 従来より、基板を 1枚ずつ収容したトレィを積層した状態で移送し、搬出位置に到 達した該トレイ群から基板を 1枚ずつ取り出して処理装置に供給したり、または、処理 装置から処理後の基板を取り出してトレイに収容する基板搬送装置が種々提案され 、また実現化されている。  [0002] Conventionally, trays containing substrates one by one are transported in a stacked state, and the substrates are taken out one by one from the tray group that has reached the carry-out position, and supplied to the processing apparatus, or the processing apparatus Various substrate transfer apparatuses that take out a processed substrate from the substrate and store it in a tray have been proposed and realized.
[0003] 例えば、特開平 11— 59893号公報には、基板等を受渡しするためのステージ上に 一定の長さを有する複数の固定ピンを設け、この固定ピンが挿通する位置に合わせ て孔が設けられた複数のトレィを上から 1段ずつ取り出して固定ピンに対して積層し ていくことでトレイ中の基板を取り出して搬送する方法が開示されている。なお、このト レイの積層順は、基板取り出し前と後とでは逆になつている。  [0003] For example, in Japanese Patent Application Laid-Open No. 11-59893, a plurality of fixing pins having a certain length are provided on a stage for delivering a substrate or the like, and holes are formed in accordance with positions where these fixing pins are inserted. A method is disclosed in which a plurality of trays provided are taken out from the top one by one and stacked on a fixed pin to take out and transport the substrates in the tray. The order in which the trays are stacked is reversed before and after the substrate is taken out.
[0004] また、特開 2004— 186249号公報には、多段に積まれた複数のトレィをー且高い 位置へ搬送し、積層トレイの高さ以上の長さを有する固定ピンが待機する場所 (下に 位置する）へ切り離した下段のトレィを上下動させ、ピン上の基板を取り出す方法が 開示されている。  [0004] Further, Japanese Patent Application Laid-Open No. 2004-186249 discloses a place where a plurality of trays stacked in multiple stages are transported to a high position, and a fixed pin having a length longer than the height of the stacking tray waits ( A method is disclosed in which the lower tray separated to the bottom is moved up and down to take out the substrate on the pins.
[0005] し力しながら、特開平 11 59893号公報に記載の基板搬送装置では、何十段に も積まれた複数段のトレイの全て力も基板を取り出すには相当の長さの固定ピンを用 意しなければならないので、装置が大型化し、限られたスペースに設置して基板処 理を実行することが困難である。一方、トレイの段数を制限すれば、装置を小型化す ることはできるが、一度に処理できるトレィ数が少ないため処理効率が落ちる可能性 があるため好ましくない。また各積層型トレイには使用を重ねていくうちに形状誤差を 生じてしまう。この形状誤差は、トレイの積層順を変えた場合のトレイ上下間のズレを 生じさせる原因となるため、トレイの積層順を変えることができない。この搬送装置を 用いた場合にはそれに対応できな 、と 、う欠点もある。 [0005] However, in the substrate transport apparatus described in Japanese Patent Application Laid-Open No. 11 59893, a fixing pin having a considerable length is used to take out the substrate with all the force of a plurality of trays stacked in tens of stages. Since it must be prepared, the apparatus becomes large, and it is difficult to perform board processing by installing it in a limited space. On the other hand, if the number of trays is limited, the apparatus can be reduced in size, but this is not preferable because the number of trays that can be processed at one time is small and processing efficiency may be reduced. In addition, shape errors will occur in each stacked tray over time. This shape error is caused by the misalignment between the top and bottom of the tray when the tray stacking order is changed. Because of this, it is not possible to change the tray stacking order. When this transport device is used, it cannot cope with it.
[0006] また、特開 2004— 186249号公報に記載の基板搬送装置でも、固定ピンを積層ト レイの高さ以上にする必要があり、ー且高い位置に積層トレイを配置させる必要があ るため、装置規模が必然的に大きくなつてしまうという問題点がある。  [0006] Also, in the substrate transport apparatus described in Japanese Patent Application Laid-Open No. 2004-186249, the fixing pins need to be equal to or higher than the height of the laminated tray, and the laminated tray needs to be arranged at a high position. Therefore, there is a problem that the scale of the apparatus is inevitably increased.
以上のように装置規模が大きくなると、既存の工場に新たに基板搬送装置を設置す る場合に、ピン収容スペースを取ることができない問題も生じうる。もっとも新規にェ 場を建設すればこの問題も解決できるが、コスト増加につながり、好ましい状況では ない。  As described above, when the apparatus scale becomes large, there may be a problem that a pin accommodation space cannot be taken when a new substrate transfer apparatus is installed in an existing factory. This problem can be solved by constructing a new site, but this leads to increased costs and is not a favorable situation.
[0007] さらに、基板搬送装置で取り出す素材がガラス基板のように破損しやす ヽ材料の場 合には、取り扱いに注意を要する。つまり、従来の基板搬送装置では、基板を取り出 すまでの間に、基板を移動させる距離が長ぐその動作が複雑なので、途中で基板 を破損してしまう危険性があるのである。この危険性をできるだけ除去する必要があ る。  [0007] Furthermore, if the material taken out by the substrate transfer device is a material that is easily damaged like a glass substrate, it must be handled with care. In other words, in the conventional substrate transfer apparatus, since the operation of moving the substrate is long and the operation is complicated until the substrate is taken out, there is a risk of damaging the substrate in the middle. It is necessary to eliminate this danger as much as possible.
[0008] 特に、特開 2004— 186249号公報に記載の搬送装置では、トレィを上下させる昇 降台や積層されたトレイ群から切り離した上部分のトレィを把持する係合爪が故障し た場合に、全てのトレイが落下してトレイ中の基板が破損し、大きな損害が生じたり、 事故発生の重大な要因となりうる危険性もある。  [0008] In particular, in the transport device described in Japanese Patent Application Laid-Open No. 2004-186249, when an ascending / descending table that raises or lowers the tray or an engaging claw that grips the upper portion of the tray separated from the stacked tray group fails. In addition, there is a danger that all trays may fall and the substrates in the trays may be damaged, causing major damage and a serious factor in the occurrence of an accident.
発明の開示  Disclosure of the invention
[0009] 本発明は、主に、上述のような従来技術が有していた問題を解決するものであり、 取り扱いに注意を要する基板でもスムーズにトレイカも取り出し、かつ処理済みの基 板を再度トレイに効率よく収容することができるとともに、装置規模を抑えることのでき る、基板搬出入装置を提供することを目的とする。  [0009] The present invention mainly solves the problems of the prior art as described above, and smoothly removes the tray card even if the substrate requires handling, and re-processes the processed substrate. An object of the present invention is to provide a substrate carry-in / out device that can be efficiently accommodated in a tray and that can reduce the size of the device.
[0010] 本発明は、上記目的を達成するためになされたものであり、本発明によれば、 トレイカも基板を取り出す、または搬入するための基板搬出入装置であって、所定数 のピン揷通孔を有するトレィを複数段積載したパレットを移動させるための、コンベア と、前記コンベアの所定の位置に、前記パレットを位置決めするパレット位置決め手 段と、前記位置決め手段によって前記パレットが位置決めされた状態で、前記複数 段のトレィを分離し、分離したトレイ間に所定の分離空間を設けるトレイ昇降手段と、 前記分離空間の中で、搬出入の対象となる基板に対応する搬出入対象トレィを上下 動させるトレイ切り離し手段と、基板を支持するための基板支持ピンを前記搬出入対 象トレイの下へ進入及び退避させるための基板支持ピン移動手段と、前記搬出入対 象トレイの前記ピン揷通孔に前記基板支持ピンを挿通させるピン挿通手段と、を備え 、前記基板支持ピンは、前記ピン挿通孔を揷通することで前記搬出入対象トレイから 突出し、突出した前記基板支持ピンによって、前記基板が前記搬出入対象トレイから 持ち上げられた状態で支持されることを特徴とする基板搬出入装置が提供される。 [0010] The present invention has been made to achieve the above object, and according to the present invention, there is provided a substrate carry-in / out device for taking out or carrying in a substrate by a trayer, wherein a predetermined number of pin pins are provided. A conveyor for moving a pallet loaded with a plurality of trays having through holes, a pallet positioning means for positioning the pallet at a predetermined position of the conveyor, and the pallet being positioned by the positioning means And the plurality Tray lifting / lowering means for separating the trays of the stage and providing a predetermined separation space between the separated trays, and separating the tray for moving the loading / unloading target tray corresponding to the substrate to be loaded / unloaded in the separation space up and down Means, substrate support pin moving means for allowing a substrate support pin for supporting the substrate to enter and retreat under the carry-in / out target tray, and the board in the pin insertion hole of the carry-in / out target tray Pin insertion means for inserting support pins, and the substrate support pins project from the carry-in / out tray by passing through the pin insertion holes, and the substrate is unloaded by the projected substrate support pins. Provided is a substrate carry-in / out device which is supported in a state where it is lifted from a tray to be entered.
[0011] また、本発明によれば、トレイカゝら基板を取り出す、または搬入するための基板搬出 入方法であって、所定数のピン揷通孔を有する複数のトレィを積層したパレットを移 動させ、前記パレットの位置決めを行った後、前記積層されたトレイを分離し、所定の 分離空間を設けるトレイ相対移動工程と、前記分離空間の中で、搬出入対象となる 基板に対応する搬入出対象トレィを他のトレイと独立して上下動させ、他のトレイと切 り離された状態にするトレィ切り離し工程と、基板を支持するための基板支持ピンを 前記搬出入対象トレイの下へ進入させる基板支持ピン移動工程と、前記基板支持ピ ンが前記搬出入対象トレイの前記ピン挿通孔を揷通して前記搬出入対象トレイから 突出するように、前記基板支持ピンと前記搬出入対象トレイとを相対移動させるピン 挿通工程と、前記基板支持ピンが前記搬出入対象トレイの前記ピン挿通孔を揷通し て前記搬出入対象トレイカ 突出した状態において、前記基板支持ピンと他の移載 装置との間で基板の受渡を行う基板受渡工程と、を含む基板搬出入方法が提供され る。  [0011] Further, according to the present invention, there is provided a substrate loading / unloading method for taking out or loading a substrate from a tray carder, wherein a pallet in which a plurality of trays having a predetermined number of pin insertion holes are stacked is moved. And positioning the pallet, separating the stacked trays, and providing a tray relative movement step for providing a predetermined separation space, and loading / unloading corresponding to the substrate to be loaded / unloaded in the separation space A tray separating process for moving the target tray up and down independently of the other trays so that the target tray is separated from the other trays, and a substrate support pin for supporting the substrate enter under the target tray. The substrate support pin moving step, and the substrate support pin and the loading / unloading target so that the substrate supporting pin passes through the pin insertion hole of the loading / unloading target tray and protrudes from the loading / unloading target tray. A pin insertion step for relatively moving the lay, and the substrate support pin and another transfer device in a state in which the substrate support pin protrudes through the pin insertion hole of the carry-in / out target tray and the carry-in / out target tray card And a substrate delivery process for delivering the substrate between the two.
[0012] また、本発明によれば、複数のピン揷通孔を有し、段積みされた複数段のトレイの 中から選択される 1つのトレイに対して、基板の搬出入を行なう基板搬出入装置にお いて、搬出入対象の基板に対応する搬出入対象トレイと、当該搬出入対象トレイの下 のトレイとの間を境にして、前記複数段のトレィを上下に分離する第 1昇降手段と、前 記第 1トレィ昇降手段により分離されたことにより生じる、前記搬入出対象トレイと当該 搬出入対象トレイの下のトレイとの間の分離空間へ、基板を支持するための基板支 持ピンを進入させる基板支持ピン移動手段と、前記分離空間内において、前記搬出 入対象トレィを上下に移動させる第 2昇降手段と、を備え、前記基板支持ピンが、前 記搬出入対象トレイの前記ピン挿通孔を揷通して前記搬出入対象トレイカ 突出す るように、前記基板支持ピン移動手段により前記基板支持ピンを前記分離空間へ進 入させた後、前記第 2昇降手段により前記搬出入対象トレィを降下させることを特徴と する基板搬出入装置が提供される。 [0012] Further, according to the present invention, the substrate carry-out and carry-out of the substrate to and from one tray having a plurality of pin through holes and selected from a plurality of stacked trays. In the loading / unloading device, a first lifting / lowering that separates the plurality of trays up and down at a boundary between a loading / unloading tray corresponding to a substrate to be loaded / unloaded and a tray below the loading / unloading tray. And a substrate support for supporting the substrate in a separation space between the tray to be carried in and out and a tray below the tray to be carried in and out, which is generated by being separated by the first tray lifting and lowering means. A substrate support pin moving means for entering the pins, and the carry-out in the separation space. Second elevating means for moving the entry target tray up and down, and the substrate support pin passes through the pin insertion hole of the carry-in / out target tray so that the carry-in / out target tray card protrudes There is provided a substrate carry-in / out device characterized in that after the substrate support pin is moved into the separation space by the substrate support pin moving means, the carry-in / out object tray is lowered by the second lifting / lowering means.
[0013] 本発明のその他の特徴及び利点は、添付図面を参照とした以下の説明により明ら かになるであろう。なお、添付図面においては、同じ若しくは同様の構成には、同じ 参照番号を付す。 [0013] Other features and advantages of the present invention will become apparent from the following description with reference to the accompanying drawings. In the accompanying drawings, the same or similar components are denoted by the same reference numerals.
図面の簡単な説明  Brief Description of Drawings
[0014] 添付図面は明細書に含まれ、その一部を構成し、本発明の実施の形態を示し、そ の記述と共に本発明の原理を説明するために用いられる。  [0014] The accompanying drawings are included in the specification and constitute a part thereof, show an embodiment of the present invention, and are used together with the description to explain the principle of the present invention.
[図 1]本発明の一実施形態による基板搬出入装置を概略的示した構成図である。  FIG. 1 is a configuration diagram schematically illustrating a substrate carry-in / out device according to an embodiment of the present invention.
[図 2]本発明の一実施形態による基板搬出入装置におけるパレット位置決め動作を 説明するための図である。  FIG. 2 is a view for explaining a pallet positioning operation in the substrate carry-in / out device according to the embodiment of the present invention.
[図 3]第 1の位置決めユニット 112の構造及び動作を説明するための図である。  3 is a diagram for explaining the structure and operation of the first positioning unit 112. FIG.
[図 4]第 2の位置決めユニット 113の構造及び動作を説明するための図である。  FIG. 4 is a diagram for explaining the structure and operation of a second positioning unit 113.
[図 5]トレイチャック 107の動作を説明するための図である。  5 is a diagram for explaining the operation of the tray chuck 107. FIG.
[図 6]トレイチャックの構造を説明するための図である。  FIG. 6 is a view for explaining the structure of a tray chuck.
[図 7]トレイチャックユニットの構造を示す図である。  FIG. 7 is a diagram showing a structure of a tray chuck unit.
[図 8]スライドピン及び旋回ピンが処理対象トレイの下に進入したときの様子を示す図 である。  FIG. 8 is a diagram showing a state when a slide pin and a swivel pin enter under the processing target tray.
[図 9]トレイの構造を説明するための図である。  FIG. 9 is a diagram for explaining the structure of a tray.
[図 10]最下段トレイカもガラス基板を取り出すときの動作を示す動作遷移図である。  FIG. 10 is an operation transition diagram showing the operation when the lowermost tray is also taken out of the glass substrate.
[図 11]2段目以降のトレイカ ガラス基板を取り出すときの動作を示す動作遷移図で ある。  FIG. 11 is an operation transition diagram showing an operation when taking out the second and subsequent tray glass substrates.
[図 12]最上段のトレイにガラス基板を搬入するときの動作を示す動作遷移図である。  FIG. 12 is an operation transition diagram showing an operation when a glass substrate is carried into the uppermost tray.
[図 13]上カゝら 2段目以下のトレイにガラス基板を搬入するときの動作を示す動作遷移 図である。 [図 14]トレイチャックユニットに位置決めユニット 200を設けた構成例を示す図である FIG. 13 is an operation transition diagram showing an operation when a glass substrate is carried into a tray below the second stage in the upper part. FIG. 14 is a diagram showing a configuration example in which a positioning unit 200 is provided in the tray chuck unit.
[図 15]位置決めユニット 200の動作説明図である。 FIG. 15 is an operation explanatory diagram of the positioning unit 200.
[図 16]位置決めユニット 200の動作説明図である。  FIG. 16 is an operation explanatory diagram of the positioning unit 200.
[図 17]トレイ 102に代わるトレイ 302の側面視図である。  FIG. 17 is a side view of a tray 302 instead of the tray 102.
[図 18]光センサ 400をロボットハンド 110に設けた例を示す図である。  FIG. 18 is a diagram showing an example in which the optical sensor 400 is provided in the robot hand 110.
[図 19]各々のトレイ 302にガラス基板 108が搭載されているか否かのチェック動作の 説明図及び光センサ 400の検知結果を示す図である。  FIG. 19 is an explanatory diagram of a check operation for checking whether or not the glass substrate is mounted on each tray 302, and a diagram showing a detection result of the optical sensor 400.
[図 20]光センサ 400の検知結果を利用した制御システムのブロック図である。  FIG. 20 is a block diagram of a control system using the detection result of the optical sensor 400.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0015] <第 1実施形態 >  [0015] <First embodiment>
以下、本発明を適用した基板搬出入装置の実施の形態を図を参照して説明する。  Embodiments of a substrate carry-in / out apparatus to which the present invention is applied will be described below with reference to the drawings.
[0016] 図 1は、本発明の一実施形態に係る基板搬出入装置 100の全体を示す外観図で ある。基板搬出入装置 100は、パレット 101に積載された複数のトレイ 102の下から 順番にトレイカもガラス基板 108 (図 1には図示せず)を取り出し、さらには処理後の 基板を再度トレイに収容する機能を有するものである。なお、全てのトレイに基板が入 つて 、る場合には一番下段のトレイカも順番にガラス基板 108を取り出すようにする。 また、例えば、ある段のトレイより下の段のトレイが全て空の場合には、その上段側を 搬出入対象としてガラス基板 108をトレイカゝら取り出したり、又は下段側トレイに搬入 することができる。全ての段のトレイにガラス基板 108が搭載されている場合には下か ら順にガラス基板を取り出し、また、全て空のトレイにガラス基板を搬入する場合には 最上段力も搬入の動作が行われる。これら取り出し Z搬入動作にっ 、ては後で詳細 に説明する。  FIG. 1 is an external view showing the entire substrate carry-in / out apparatus 100 according to an embodiment of the present invention. The substrate loading / unloading apparatus 100 takes out the glass substrate 108 (not shown in FIG. 1) in order from the bottom of the plurality of trays 102 loaded on the pallet 101, and further accommodates the processed substrates in the tray again. It has the function to do. If all the trays are loaded with the substrates, the glass tray 108 is also removed in order from the lowermost tray. Further, for example, when all trays below a certain tray are empty, the glass substrate 108 can be taken out from the tray carder with the upper side being the object to be carried in or out, or can be carried into the lower side tray. . When glass substrates 108 are mounted on all trays, the glass substrates are taken out in order from the bottom, and when loading glass substrates into all empty trays, the loading operation is also performed at the highest level. . These removal Z loading operations will be described in detail later.
[0017] 図 1において、 103は、積載されたトレイ 102が載せられたパレット 101を、ガラス基 板 108の取り出し位置に位置決め及び搬送するための第 1のコンベアである。また、 104は、第 1のコンベア 103にパレット 101及びトレィ 102を送り出すための第 2のコ ンベアである。第 1のコンベア 103と第 2のコンベア 104は装置の設置面（床面）から は同一の高さを有するように接続されている。そして、第 2のコンベア 104はパレット 1 01を X方向（正負両方向）に移動させるための駆動用ローラ 104a、及びパレット 101 を下力も支えるためのフリーローラ 104bを備えている。なお、本実施形態では、第 1 のコンベア 103は両端部に駆動用ローラを設け、搬送面中央にはフリーローラは設 けられていない。 In FIG. 1, reference numeral 103 denotes a first conveyor for positioning and transporting the pallet 101 on which the loaded tray 102 is placed to the take-out position of the glass substrate 108. Reference numeral 104 denotes a second conveyor for sending the pallet 101 and the tray 102 to the first conveyor 103. The first conveyor 103 and the second conveyor 104 are connected so as to have the same height from the installation surface (floor surface) of the apparatus. The second conveyor 104 is pallet 1 A driving roller 104a for moving 01 in the X direction (both positive and negative directions) and a free roller 104b for supporting the pallet 101 also with a downward force are provided. In the present embodiment, the first conveyor 103 is provided with driving rollers at both ends, and no free roller is provided at the center of the conveying surface.
[0018] 109は、トレイ 102からガラス基板 108を取り出すためのロボットである。また、 110 はロボット 109のコの字型のアームであり、このアームがサイドピン 122及び旋回ピン 126によって持ち上げられたガラス基板 108の下に入り、ガラス基板 108を吸着保持 後すくい上げるように持ち上げてそれをピン力 受け取る。  Reference numeral 109 denotes a robot for taking out the glass substrate 108 from the tray 102. Reference numeral 110 denotes a U-shaped arm of the robot 109. This arm enters under the glass substrate 108 lifted by the side pins 122 and the swivel pins 126, lifts the glass substrate 108 so that it is picked up and then scooped up. Receive it pin force.
[0019] 106はトレイチャック駆動部であり、トレイチャック 107を備えている。昇降が必要な 段数分のトレィ 102がその Y方向の両側よりトレイチャック 107によって把持され、そ の状態でそのトレイチャック 107がトレイチャック駆動部 106によって上下動作するよ うになされている。前記トレイチャック 107は昇降するトレイ 102を係止する係止部 (把 持爪） 107aが設けられている。  Reference numeral 106 denotes a tray chuck driving unit, which includes a tray chuck 107. The trays 102 corresponding to the number of steps that need to be raised and lowered are gripped by the tray chuck 107 from both sides in the Y direction, and the tray chuck 107 is moved up and down by the tray chuck drive unit 106 in this state. The tray chuck 107 is provided with a locking portion (a gripping claw) 107a for locking the tray 102 that moves up and down.
[0020] 120はサイドピン動作部であり、ロッドレスシリンダーのガイドレール 128とシリンダー 部 123から構成される。前記シリンダ一部 123には複数のサイドピン 122が配置され るサイドピン載置部 121が取り付けられ、前記シリンダー部 123を駆動させることによ り、前記ガイドレール 128に沿つてサイドピン載置部 121を前後に ( Y方向に)移動可 能にする。  [0020] Reference numeral 120 denotes a side pin operating portion, which is composed of a guide rail 128 and a cylinder portion 123 of a rodless cylinder. A side pin mounting part 121 in which a plurality of side pins 122 are arranged is attached to the cylinder part 123, and the cylinder part 123 is driven to drive the side pin mounting part along the guide rail 128. Enable 121 to move back and forth (Y direction).
[0021] 124は旋回ピン動作部であり、複数の旋回ピン 126が配置される旋回ピン載置部 1 25と、旋回ピン載置部 125を角度方向に旋回可能とするロータリーアクチユエータ 1 013とを備えている。  [0021] Reference numeral 124 denotes a swivel pin operating unit, a swivel pin mounting part 125 having a plurality of swivel pins 126 disposed thereon, and a rotary actuator 1 013 capable of swiveling the swivel pin placing part 125 in an angular direction. And.
[0022] なお、サイドピン動作部 120はトレイチャック 107 (トレイチャック列）の外側に、旋回 ピン動作部 124はトレイチャックユニット 107を構成する 2列のトレイチャック列の間に 配置されている。  Note that the side pin operation unit 120 is disposed outside the tray chuck 107 (tray chuck row), and the swivel pin operation unit 124 is disposed between the two rows of tray chuck rows constituting the tray chuck unit 107.
[0023] 127は搬出入対象トレィ切り離し機構であり、搬出入対象トレィ 102aを上段側トレイ  [0023] Reference numeral 127 denotes a carry-in / out target tray separation mechanism, and the carry-in / out target tray 102a is placed in the upper tray.
(トレイ群） 102から切り離して昇降させるための機構である。前記トレイチャック駆動 部 106は上下方向に 3つに分割されたユニット構成となっており、各ユニットの下に前 記サイドピン動作部 120、旋回ピン動作部 124、搬出入対象トレィ切り離し機構 127 が取り付けられている。 (Tray group) A mechanism for lifting and lowering from the tray group 102. The tray chuck driving unit 106 is divided into three units in the vertical direction. Under each unit, the side pin operating unit 120, the turning pin operating unit 124, and the carry-in / out target tray separating mechanism 127 are provided. Is attached.
[0024] 前記トレイチャック駆動部 106によって上下に切り離された空間内で、前記搬出入 対象のトレイ 102a (図 1には図示せず)が前記搬出入対象トレィ切り離し機構 127に より 1つだけ他のトレィ（トレィ群） 102から切り離された状態において、サイドピン動作 部 120はサイドピン載置部 121を前記搬出入対象トレィ 102aの下に進入させる。ま た、旋回ピン動作部 124も同様に旋回ピン載置部 125を旋回させて、前記搬出入対 象トレイ 102aの下に進入させる。その後、前記搬出入対象トレィ 102aの下空間に前 記サイドピン動作部 120、旋回ピン動作部 124を進入させ、サイドピン 122、旋回 12 6を前記搬出入対象トレィ 102aの揷通孔に揷通させることにより、トレイ 102aとガラス 基板 108がサイドピン 122及び旋回ピン 126によって分離された位置で支持される。  [0024] Within the space vertically separated by the tray chuck drive unit 106, only one tray 102a (not shown in FIG. 1) to be carried in / out is removed by the tray separating mechanism 127 to be carried in / out. In the state of being separated from the tray (tray group) 102, the side pin operating unit 120 causes the side pin mounting unit 121 to enter under the carry-in / out target tray 102a. Similarly, the swivel pin operating part 124 turns the swivel pin mounting part 125 so as to enter under the carry-in / out tray 102a. Thereafter, the side pin operating unit 120 and the swivel pin operating unit 124 are inserted into the space under the carry-in / out target tray 102a, and the side pins 122 and swivel 126 are passed through the through-hole of the carry-in / out target tray 102a. By doing so, the tray 102a and the glass substrate 108 are supported at positions separated by the side pins 122 and the pivot pins 126.
[0025] 搬出の際は、その持ち上げられたガラス基板 108をロボットハンド 110が取り出し、 また搬入の際はロボットノヽンド 110によって移載されるガラス基板 108を前記サイドピ ン 122、旋回ピン 126によって受け取り、収容する。なお、サイドピン 122及び旋回ピ ン 126は、ガラス基板 108が安定さえすればその数はいくつでも良い。また、ピンの 先端はガラス基板 108を傷つけな 、ようにゴム等の柔らカ 、材料で覆われるようにし ている。  [0025] The robot hand 110 takes out the raised glass substrate 108 when unloading, and receives the glass substrate 108 transferred by the robot node 110 by the side pin 122 and the swivel pin 126 when loading. Contain. The number of side pins 122 and swivel pins 126 is not limited as long as the glass substrate 108 is stable. Further, the tip of the pin is covered with a soft material such as rubber so as not to damage the glass substrate 108.
[0026] なお、本実施形態において、トレイ 102は 60段のトレイが積層されて構成されてい る力 最下段（1段目）のトレイはパレット 101に固定されているものとする。  In this embodiment, the tray 102 is configured by stacking 60 trays. The lowest tray (first tray) is assumed to be fixed to the pallet 101.
[0027] 以上のような構成を有する基板搬出入装置 100の構成及び動作について、図 2乃 至図 13を用いてより詳細に説明する。 The configuration and operation of the substrate carry-in / out apparatus 100 having the above-described configuration will be described in more detail with reference to FIGS.
[0028] くパレット 101の位置決め動作 > [0028] Pallet 101 positioning operation>
図 2は、パレット 101に載せられたトレイ 102がコンベア上を搬送され、ガラス基板取 り出し動作の定位置に到着した場合の位置決め動作を説明するための概略図であ る。  FIG. 2 is a schematic diagram for explaining the positioning operation when the tray 102 placed on the pallet 101 is conveyed on the conveyor and arrives at the fixed position of the glass substrate extraction operation.
[0029] まず、図 2の Aにおいて、トレイ 102が載ったパレット 101はコンベアの川上方向（X 軸の正方向）から川下方向（X軸の負方向）に搬送され、第 1のコンベア 103の一端（ 川下側の端）に設けられた位置決めブロック 111に当接した場合、コンベア 103は停 止するように制御される。なお、コンベア 103の停止動作は、本実施形態ではパレット 101が位置決めブロック 111に当接したことを検知する図示しな 、センサが設けられ ている。このセンサが、パレット 101の位置決めブロック 111への接触を検知すると、 コンベア 103のみを停止させる。また、このコンベア停止方法としては、センサを設け るほか、パレット 101が位置決めブロック 111に当接したことによって機械的なスイツ チが ONになるような機構を採用するようにしてもょ 、。 First, in FIG. 2A, the pallet 101 on which the tray 102 is placed is transported from the upstream direction of the conveyor (the positive direction of the X axis) to the downstream direction (the negative direction of the X axis). When it comes into contact with the positioning block 111 provided at one end (the downstream end), the conveyor 103 is controlled to stop. In addition, the stop operation of the conveyor 103 is a pallet in this embodiment. A sensor (not shown) is provided for detecting that 101 is in contact with the positioning block 111. When this sensor detects contact of the pallet 101 with the positioning block 111, only the conveyor 103 is stopped. In addition to providing a sensor, this conveyor stop method may employ a mechanism that turns on the mechanical switch when the pallet 101 abuts against the positioning block 111.
[0030] 第 1のコンベア 103が停止すると、図 2の Bに示されるように、進行方向に対してパ レット 101の末尾方向力 第 1の位置決めユニット 112がコンベア 103の下面から突 出し、パレット 103を位置決めブロック 111との間に挟み込み、進行方向（X軸方向） を位置決めしてパレットを固定する。なお、この第 1の位置決めユニット 112のより詳 細な構造にっ 、ては図 3を用いて後述する。  [0030] When the first conveyor 103 stops, as shown in FIG. 2B, the rearward force of the pallet 101 in the traveling direction, the first positioning unit 112 protrudes from the lower surface of the conveyor 103, and the pallet 103 is sandwiched between the positioning block 111 and the pallet is fixed by positioning the moving direction (X-axis direction). A more detailed structure of the first positioning unit 112 will be described later with reference to FIG.
[0031] そして、コンベア 103は駆動 (例えば、チェーン駆動）ローラが両端に設けられ、搬 送面中央が空いたものとなっているため、図 2の Dで示される昇降ユニット 114がコン ベア 103の下面力もパレット 101を数センチ持ち上げる。このとき第 1の位置決めュ- ット 112も、昇降ユニット 114のリフト動作に従って、パレット 101との当接面 112aも数 センチ持ち上がるような機構になっている（詳細は後述する)。なお、昇降ユニット 11 4は、上面がフリーローラ（回転方向が Y軸方向）となっているため、パレット 101は水 平面内で移動しやすくなつている。  [0031] Since the conveyor 103 is provided with driving rollers (for example, chain driving) at both ends and the center of the conveying surface is vacant, the lifting unit 114 indicated by D in FIG. The lower surface force also lifts the pallet 101 several centimeters. At this time, the first positioning unit 112 is also configured to lift the contact surface 112a with the pallet 101 several centimeters in accordance with the lifting operation of the elevating unit 114 (details will be described later). Since the lifting unit 114 has a free roller on the top surface (the rotation direction is the Y-axis direction), the pallet 101 is easy to move in the horizontal plane.
[0032] X軸方向での位置決めが終わると続いて、図 2の Cで示されるように、コンベア 103 の川幅方向（X軸方向）から第 2の位置決めユニット 113が各々突出し、パレット 101 を (他方のユニットは図示されておらず、反対側の側面に突出している）コンベア 103 の Y軸方向（川幅方向）の両側力 挟み込むようにして、 Y軸方向の位置決めが行わ れる。なお、図 2の Cで示されるように、昇降ユニット 114でパレット 101が下力も持ち 上げられているので、第 1の位置決めユニット 112と同様の構造である位置決めブロ ック 111の当接面（ローラ部） 11 laも、数センチ追従し、上昇して!/、る。  [0032] After the positioning in the X-axis direction is finished, as shown in FIG. 2C, the second positioning unit 113 protrudes from the river width direction (X-axis direction) of the conveyor 103, and the pallet 101 is The other unit (not shown) is positioned in the Y-axis direction so as to sandwich both side forces in the Y-axis direction (river width direction) of the conveyor 103 (projecting on the opposite side surface). As indicated by C in FIG. 2, since the pallet 101 is also lifted by the lifting unit 114, the contact surface of the positioning block 111 having the same structure as the first positioning unit 112 ( (Laura part) 11 la also follows a few centimeters and rises! /
[0033] そして、以上のような位置決め動作により、ガラス基板 108を取り出すのに適切な位 置にパレット 101が位置決めされると、まず、第 2の位置決めユニット 113がパレット 1 01から離れる。また、昇降ユニット 114が下降し、ガラス基板 108の搬出入動作が開 始される。なお、昇降ユニット 114に下限センサが設けられており、上昇後再度下降 したことでセンサが ONとなるようになっており、それによつて次の基板搬出入動作へ の開始のためのトリガー信号となる。 [0033] When the pallet 101 is positioned at a position appropriate for taking out the glass substrate 108 by the positioning operation as described above, first, the second positioning unit 113 is separated from the pallet 101. Further, the elevating unit 114 is lowered, and the loading / unloading operation of the glass substrate 108 is started. Note that a lower limit sensor is provided in the lifting unit 114, and then descends again after ascending. As a result, the sensor is turned on, and it becomes a trigger signal for starting the next board loading / unloading operation.
[0034] なお、位置決めブロック 111と第 1の位置決めユニット 112とによるパレット挟持動作 は、全てのトレイ 102に載置されているガラス基板 108が取り出されるまで継続される Note that the pallet clamping operation by the positioning block 111 and the first positioning unit 112 is continued until the glass substrates 108 placed on all the trays 102 are taken out.
[0035] 図 3は、第 1の位置決めユニット 112の詳細を示す図である。図 3で示されるように、 第 1の位置決めユニット 112が待機状態の時にはポジション Wに配置される。また、 シリンダ 115の作用部 115aもポジション Wに配置されている。そして、ノ《レット 101力 S 位置決めブロック 111に当接したことを検知した場合、制御信号がシリンダ 115に送 られる。その制御信号に応じて第 1の位置決めユニット 112を待機状態時のポジショ ン Wから位置決め状態時のポジション S1に設定するように、作用部 115aをシリンダ によってポジション Wからポジション S 1に移動させる。 FIG. 3 is a diagram showing details of the first positioning unit 112. As shown in FIG. 3, when the first positioning unit 112 is in the standby state, the first positioning unit 112 is disposed at the position W. Further, the action part 115a of the cylinder 115 is also arranged at the position W. Then, when it is detected that the contact is in contact with the positioning block 111, a control signal is sent to the cylinder 115. In response to the control signal, the operation unit 115a is moved from position W to position S1 by the cylinder so that the first positioning unit 112 is set from the position W in the standby state to the position S1 in the positioning state.
[0036] また、図 3において、第 1の位置決めユニット 112のパレット 101へ当接はローラ 11 2aを介してなされ、さらにこのローラ 112aは軸 112bを中心にしてスライドするように なっている。つまり、前述のように、パレット 101はコンベア上での進行方向（X軸方向 )における位置決めがなされた後、コンベア下面からパレット 101を昇降ユニット 114 によって持ち上げる。そして、パレット 101が持ち上げられると、 X軸方向の位置決め が行われる力 そのときパレット 101に対してローラ 112aが追従できるように中心軸 1 12bに対してスライドする。このスライドを可能にするために中心軸 112bのシャフトは ある程度長めになって 、る。  In FIG. 3, the first positioning unit 112 is brought into contact with the pallet 101 via a roller 112a, and the roller 112a slides around a shaft 112b. That is, as described above, after the pallet 101 is positioned in the traveling direction (X-axis direction) on the conveyor, the pallet 101 is lifted by the lifting unit 114 from the lower surface of the conveyor. When the pallet 101 is lifted, the force for positioning in the X-axis direction slides with respect to the central axis 112b so that the roller 112a can follow the pallet 101 at that time. In order to make this slide possible, the shaft of the central shaft 112b is somewhat longer.
[0037] 図 4は、第 2の位置決めユニット 113の詳細を示す図である。図 4で示されるように、 第 2の位置決めユニット 113が待機状態の時にはポジション Wに配置される。また、 シリンダ 116の作用部 116aもポジション Wに配置されている。そして、昇降ユニット 1 14によってパレット 101が数センチ持ち上げられると、制御信号がシリンダ 115に送 られる。その制御信号に応じて第 2の位置決めユニット 113を待機状態時のポジショ ン Wから位置決め状態時のポジション S 2に設定するように、作用部 116aをシリンダ によってポジション Wからポジション S2に移動させる。この第 2の位置決めユニットは パレット 101を Y軸方向の側面を両側力 挟むようにして位置決めを行うため、コンペ ァ 103の両端に各々設けられて 、る。 FIG. 4 is a diagram showing details of the second positioning unit 113. As shown in FIG. 4, when the second positioning unit 113 is in the standby state, the second positioning unit 113 is disposed at the position W. Further, the action part 116a of the cylinder 116 is also arranged at the position W. Then, when the pallet 101 is lifted several centimeters by the lifting unit 114, a control signal is sent to the cylinder 115. In response to the control signal, the operation unit 116a is moved from position W to position S2 by the cylinder so that the second positioning unit 113 is set from the position W in the standby state to the position S2 in the positioning state. This second positioning unit positions the pallet 101 so that the side surfaces in the Y-axis direction are sandwiched between the two sides. A is provided at each end of 103.
[0038] くトレイチャック 107の構成 >  [0038] Configuration of the tray chuck 107>
図 5及び図 6、図 7を用いてトレイチャック 107の構成及び動作について説明する。  The configuration and operation of the tray chuck 107 will be described with reference to FIGS. 5, 6, and 7.
[0039] トレイチャック 107は、トレイチャック駆動部 106によって駆動するようになっている。  The tray chuck 107 is driven by a tray chuck driving unit 106.
通常、トレイ 102は最下段力も順番に搬出されるが、その搬出ごとに全てのトレィをー 且、元の状態 (全トレイが積み上がった状態）に戻し、トレイチャック 107の把持を解除 する。そして、トレイチャック 107が所定高さ分だけ上昇し、次に搬出すべきトレイより 上のトレィを再び把持して持ち上げることになる。これがトレイチャック 107の基本動 作である。  Normally, the tray 102 also carries out the lowermost force in order, but every time it is carried out, all trays are returned to the original state (all trays are stacked), and the grip of the tray chuck 107 is released. Then, the tray chuck 107 is raised by a predetermined height, and the tray above the tray to be carried out next is gripped and lifted again. This is the basic operation of the tray chuck 107.
[0040] 図 5において、トレイチャック 107は、 3つのユニットに分割されており、それぞれは、 例えば 19段のトレィを把持して持ち上げることができるようになつている。各ユニット の下にはトレイ切り離し機構 127が取り付けてあるので、これによりさらに 1段把持して 各ユニットは計 20段を同時に持ち上がることになる。ここでは、トレイチャック全体で 6 0段のトレィを把持して持ち上げることができるようになつている力 20段毎に搬出が 終わるとそれぞれのトレイチャックは待機状態になる。つまり、下から 20段のトレイの 搬出が終わると下段のトレイチャック 107dは待機状態に、 21段力も 40段までのトレイ の搬出が終わると中段のトレイチャック 107cは待機状態になる。  In FIG. 5, the tray chuck 107 is divided into three units, each of which can hold and lift, for example, a 19-stage tray. A tray separation mechanism 127 is attached under each unit, so that one unit is held by this, and each unit is lifted by 20 steps at the same time. Here, each tray chuck is in a stand-by state when unloading is completed every 20 stages, which is the force that enables the tray tray to grip and lift the 60-stage tray as a whole. In other words, the lower tray chuck 107d is in a standby state when the 20th tray from the bottom is finished, and the middle tray chuck 107c is in a standby state when the 21st tray has been transported to the 40th tray.
[0041] ここで、図 5の Aは、全部で 60段あるトレイのうち下から 19段目のトレイ 102からガラ ス基板 108を取り出した後の動作を示している。このとき、トレイチャック 107は上 41 段のトレィ 102を把持し、持ち上げていることになる。ここで、下から 19段目（つまり上 力 41段目）のトレイ 102からガラス基板 108の搬出（搬入）が終わると、トレイチャッ ク 107が下降してー且トレイを元の状態に戻す。  Here, A in FIG. 5 shows an operation after the glass substrate 108 is taken out from the tray 102 at the 19th stage from the bottom among the trays having a total of 60 stages. At this time, the tray chuck 107 holds and lifts the upper 41 stages of the tray 102. Here, when the glass substrate 108 is unloaded (loaded) from the tray 102 at the 19th stage from the bottom (that is, the 41st stage of the upper force), the tray chuck 107 is lowered and the tray is returned to the original state.
[0042] 続いて、図 5の Bで示されるように、トレイチャック 107全体がトレイの搬出入動作を 開始する位置まで下降する。  Subsequently, as shown by B in FIG. 5, the entire tray chuck 107 is lowered to a position where the tray loading / unloading operation is started.
[0043] そして、今までは上 ·中 ·下段のトレイチャックユニット 107b乃至 dを用いて把持及び 持ち上げ動作を行っていた力 下から 20段のトレイの搬出が完了したので、図 5の C で示されるように、下段のトレイチャックユニット 107dは待機状態となり、中上段のトレ イチャックユニット 107b及び cのみを用いて把持及びトレイの持ち上げ動作を行うよう にする。 [0043] Since the upper and middle trays and the lower tray chuck units 107b to 107d have been used to hold and lift the tray 20 units from the bottom, unloading of the 20 trays has been completed. As shown in the figure, the lower tray chuck unit 107d is in a standby state, and only the middle and upper tray chuck units 107b and c are used to hold and lift the tray. To.
[0044] このように、トレイチャック 107を 3つのユニットに分割したのは、装置全体の高さをな るべく低くするためである。すなわち、もし常に 3つ分のトレイチャックが上下するとす れば、 60段近くのトレィを処理する場合には、ほぼ倍の装置高さを必要としてしまい 、装置の小型化の要請には応えられないからである。これに対して、本実施形態のよ うにトレイチャック 107を分割した場合には、例えば 60段のトレイの搬出入を行う装置 であれば、コンベア上の設置高さは略（60 + 20)段分の高ささえあればょ 、ことにな る。なお、トレイチャックの分割の個数は 3分割に限ったのもではなぐ技術的には何 分割でもよい。  [0044] The reason why the tray chuck 107 is divided into three units in this way is to reduce the overall height of the apparatus as much as possible. In other words, if three tray chucks always move up and down, when processing nearly 60 stages of trays, the device height is almost doubled, which meets the demand for smaller devices. Because there is no. On the other hand, when the tray chuck 107 is divided as in the present embodiment, the installation height on the conveyor is approximately (60 + 20) stages, for example, if the apparatus carries in and out 60-stage trays. If it is only a minute high, it will be. Technically, the number of tray chuck divisions is not limited to three, but may be any number.
[0045] 図 6はトレイチャック 107の構造を示す図である。図 6の Aはトレイチャック正面概要 図であり、図 6の Bはトレイチャック側面概要図、図 6の Cはトレイチャックの把持動作 の駆動部分 Pの拡大図である。  FIG. 6 is a view showing the structure of the tray chuck 107. 6A is a schematic view of the front surface of the tray chuck, FIG. 6B is a schematic diagram of the side surface of the tray chuck, and FIG. 6C is an enlarged view of the drive portion P of the gripping operation of the tray chuck.
[0046] 図 6の Aにおいて、トレイチャック 107は、トレイチャック駆動部 106にトレイチャック 保持体 1004を介して設けられており、例えば 3つのユニット 107b乃至 dに分割され、 それぞれ 20段の把持爪 107a (図 6の Aには図示せず)を備えている。そして、それぞ れのユニット 107b乃至 dは、第 1のバー 1001で連結された 2列の垂直柱 1003を備 えている。この垂直柱 1003には把持爪 107aが例えば 19個とトレィ切り離し機構 12 7の爪 1個の計 20個が設けられて!/、る。 1つのトレイチャックユニットで 20段のトレィを 把持し、昇降できるようにするためである。  In FIG. 6A, the tray chuck 107 is provided in the tray chuck driving unit 106 via a tray chuck holder 1004, and is divided into, for example, three units 107b to d, each having 20 stages of gripping claws. 107a (not shown in FIG. 6A). Each unit 107b-d has two rows of vertical columns 1003 connected by a first bar 1001. This vertical column 1003 is provided with 20 gripping claws 107a, for example, 19 pieces and one piece of tray separating mechanism 127, for a total of 20 pieces! This is so that one tray chuck unit can hold the 20-step tray and move it up and down.
[0047] また、図 6の B及び Cで示されるように、トレイチャック保持体 1004から突出するよう にして設けられた固定 (連結ブロック 1006によって固定）の第 2のバー 1002と第 1の バー 1001とは、ガイドレール 1009とスライダー 1010を介して連結されている。また、 トレイチャック保持体 1004にはシリンダ軸 1007が固定されており、第 1のバー 1001 にはシリンダ動作部 1008が設けられている。従って、第 1のバー 1001は矢印 G方向 (図 1の Y軸方向）に動くようになる。第 1のバー 1001にはユニット 107b乃至 dが取り 付けられた垂直柱 1003が固定されているので、この動作により各ユニット 107b乃至 dも矢印 G方向に動作し、これによつてトレイの把持動作を行えるようになって!/、る。  In addition, as shown by B and C in FIG. 6, the second bar 1002 and the first bar fixed (fixed by the connecting block 1006) provided so as to protrude from the tray chuck holder 1004 1001 is connected to a guide rail 1009 via a slider 1010. A cylinder shaft 1007 is fixed to the tray chuck holder 1004, and a cylinder operating unit 1008 is provided on the first bar 1001. Accordingly, the first bar 1001 moves in the arrow G direction (Y-axis direction in FIG. 1). Since the vertical bar 1003 to which the units 107b to 107d are attached is fixed to the first bar 1001, each unit 107b to 107d also moves in the direction of the arrow G by this operation, and thereby the gripping operation of the tray. You can now!
[0048] また、図 6の Bに示されるように、トレイチャック駆動部 106内に設けられたサーボモ ータ 1012によってボールネジ 1011が回転し、これによつてトレイチャック保持体 100 4が H方向に上下運動するように制御される。 [0048] Further, as shown in FIG. 6B, the servo module provided in the tray chuck drive unit 106 is provided. The ball screw 1011 is rotated by the motor 1012, and thereby, the tray chuck holder 100 4 is controlled to move up and down in the H direction.
[0049] <トレイチャックユニットの構成 >  [0049] <Configuration of tray chuck unit>
続いてトレイチャック 107を構成する 1つのトレイチャックユニット（107b、 c又は d)の 構成を説明する。図 7は、 3つのトレイチャックユニットのうち 2つを示している。  Next, the configuration of one tray chuck unit (107b, c or d) constituting the tray chuck 107 will be described. FIG. 7 shows two of the three tray chuck units.
[0050] 図 7に示されるように、各トレイチャックユニットは、第 1のバー 1001と、第 2のバー 1 002と、第 1及び第 2のバーに取り付けられた 2列の垂直柱 1003と、第 1のバー 100 1の側面に取り付けられたトレイ切り離し機構 127と、第 1のバー 1001の底面に取り 付けられたスライダー（前後スライダー） 1010と、第 2のバー 1002の両端底面に取り 付けられたサイドピン動作部 120と、第 2のバー 1002の底面であって垂直柱 1003の 間に取り付けられた旋回ピン動作部 124と、を備えている。  [0050] As shown in FIG. 7, each tray chuck unit includes a first bar 1001, a second bar 1002, and two rows of vertical pillars 1003 attached to the first and second bars. Tray separating mechanism 127 attached to the side of the first bar 100 1, slider (front / rear slider) 1010 attached to the bottom of the first bar 1001, and attached to the bottom of both ends of the second bar 1002 Side pin operating unit 120 and a pivot pin operating unit 124 attached to the bottom surface of the second bar 1002 and between the vertical pillars 1003.
[0051] サイドピン動作部 120は、複数のサイドピン 122が配置されるサイドピン載置部 121 と、ロッドレスシリンダーのガイドレール 128に沿ってシリンダー 123が移動することで サイドピン載置部 121を前後に ( Y方向に)移動可能にする。  [0051] The side pin operating unit 120 includes a side pin mounting unit 121 in which a plurality of side pins 122 are arranged, and a cylinder 123 that moves along the guide rail 128 of the rodless cylinder. Can be moved back and forth (in the Y direction).
[0052] 旋回ピン動作部 124は、複数の旋回ピン 126が配置される旋回ピン載置部 125と、 旋回ピン載置部 125を角度方向に旋回可能とするロータリーアクチユエータ 1013と を備えている。なお、旋回ピン 126とサイドピン 122とは同じ高さに配置されている。  [0052] The swivel pin operation unit 124 includes a swivel pin placement unit 125 in which a plurality of swivel pins 126 are arranged, and a rotary actuator 1013 that enables the swivel pin placement unit 125 to swivel in an angular direction. Yes. The pivot pin 126 and the side pin 122 are disposed at the same height.
[0053] トレイ切り離し機構 127は、 2つの垂直柱 1003の間に配置されており、搬出入対象 トレイ 102aをトレイ（トレイ群） 102から切り離して昇降させるためのものである。トレイ 切り離し機構 127は、支持柱 1270と、それに取り付けられた昇降機構部 1271と、昇 降機構部 1271に取り付けられたスライダー 1272と、昇降スライダー 1272に取り付 けられた支持バー 1273と、支持バー 1273の両先端に取り付けられた切り離し爪 12 74と、を備えている。また、昇降機構部 1271は、破線で示されるボールネジ 1275と サーボモータ 1276とにより構成される。サーボモータ 1276の動作を制御することに より、スライダー 1272及びそれに取り付けられた支持バー 1273が上下動できるよう になっている。  The tray separating mechanism 127 is disposed between the two vertical pillars 1003, and separates the carry-in / out target tray 102a from the tray (tray group) 102 to move up and down. The tray separation mechanism 127 includes a support column 1270, an elevating mechanism portion 1271 attached thereto, a slider 1272 attached to the elevating mechanism portion 1271, a support bar 1273 attached to the elevating slider 1272, and a support bar. Detaching claws 12 74 attached to both ends of the 1273. The elevating mechanism portion 1271 includes a ball screw 1275 and a servo motor 1276 indicated by broken lines. By controlling the operation of the servo motor 1276, the slider 1272 and the support bar 1273 attached thereto can be moved up and down.
[0054] また、トレイ切り離し機構 127は第 1のバー 1001に取り付けられているので、前後ス ライダー 1010によって前後運動ができるようになつている。前後スライダー 1010によ つて処理対象トレィ切り離し機構 127が前進することによって搬出入対象トレィ 102a を把持爪 1274で把持し、その状態で支持バー 1273を上下させることによって搬出 入対象トレィ 102aも上下させることができる。以上の動作により、搬出入対象トレィ 10 2a (図 7には図示せず）がトレイ（トレイ群） 102から切り離されてガラス基板 108の取り 出し、若しくは受け入れ動作の準備が完了する。 Further, since the tray separating mechanism 127 is attached to the first bar 1001, the front / rear slider 1010 can perform the front / rear motion. Front / back slider 1010 Therefore, the carry-in / out target tray 102a can be moved up and down by holding the carry-in / out target tray 102a with the gripping claws 1274 as the processing target tray separating mechanism 127 moves forward and moving the support bar 1273 up and down in this state. Through the above operation, the tray 102 2a (not shown in FIG. 7) to be carried in / out is separated from the tray (tray group) 102 and the glass substrate 108 is taken out or ready for the receiving operation.
[0055] 図 8に示すように、サイドピン動作部 120はサイドピン載置部 121を前進させる。ま た同時に、旋回ピン動作部 124は旋回ピン載置部 125を旋回させて、搬出入対象ト レイ 102aの下に進入させる。  As shown in FIG. 8, the side pin operating unit 120 advances the side pin mounting unit 121. At the same time, the swivel pin operating unit 124 turns the swivel pin mounting unit 125 to enter the carry-in / out target tray 102a.
[0056] これによりサイドピン 122及び旋回ピン 126のそれぞれはトレイ 102aの揷通孔の下 に位置することになる。  [0056] Thereby, each of the side pin 122 and the pivot pin 126 is positioned below the through hole of the tray 102a.
[0057] サイドピン動作部 120及び旋回ピン動作部 124は、トレイ 102両側の各トレイチャッ クユニットに設けられている。従って、サイドピン 122及び旋回ピン 126は、搬出入対 象トレイ 102aの両側力 進入してその全ての揷通孔の下に位置する。  [0057] The side pin operation unit 120 and the swivel pin operation unit 124 are provided in each tray chuck unit on both sides of the tray 102. Accordingly, the side pins 122 and the pivot pins 126 enter both sides of the carry-in / out target tray 102a and are positioned below all the through holes.
[0058] そして、処理対象トレィ切り離し機構 127が搬出入対象トレィ 102aを下降させる。  Then, the processing target tray separating mechanism 127 lowers the carry-in / out target tray 102a.
搬出入対象トレィ 102aが下降することにより、トレイ内のガラス基板 108がサイドピン 122及び旋回ピン 126によって持ち上げられる。その持ち上げられたガラス基板 108 をロボットハンド 110が取り出すのである。  As the carry-in / out object tray 102a is lowered, the glass substrate 108 in the tray is lifted by the side pins 122 and the pivot pins 126. The robot hand 110 takes out the lifted glass substrate 108.
[0059] <トレイ 102の構造 >  [0059] <Structure of tray 102>
図 9は、トレイの構造を示す図である。トレイ 102は、例えば 60段分積まれており、 各トレイには複数の揷通孔 1021が設けられている。この揷通孔 1021は、リフトピン 1 05やサイドピン 122や旋回ピン 126を貫通させ、ガラス基板 108を所定高さ分だけト レイカ 持ち上げるために設けられたものである。  FIG. 9 shows the structure of the tray. For example, 60 trays are stacked, and each tray is provided with a plurality of through holes 1021. The through hole 1021 is provided to pass through the lift pin 105, the side pin 122, and the swivel pin 126 and lift the glass substrate 108 by a predetermined height.
[0060] また、トレイ底面の角は、トレィを積み重ねたときに位置決めしやすぐ崩れないよう にするため、面取り（1023参照）がなされている。  [0060] Further, the corners of the bottom surface of the tray are chamfered (see 1023) so that the trays are positioned and not easily collapsed when the trays are stacked.
[0061] トレイ 102のそれぞれは、把持爪 107a及び切り離し爪 1274が係止する係止部 10 22がトレイ縁（1周分）に設けられている。  Each tray 102 is provided with a locking portion 1022 on the tray edge (one turn) where the gripping claw 107a and the separation claw 1274 are locked.
[0062] くガラス基板 108の取り出し動作 >  [0062] Removal operation of glass substrate 108>
続いて、位置決めされたパレット 101に載せられた各トレイ 102からガラス基板 108 を取り出す動作につ!、て、図 10及び図 11を用いて説明する。 Subsequently, from each tray 102 placed on the positioned pallet 101, a glass substrate 108 is obtained. The operation of taking out will be described with reference to FIGS. 10 and 11. FIG.
[0063] (1)最下段（1段目）のトレイカ の取り出し動作 [0063] (1) Removal operation of the lowermost (first stage) tray
1段目のトレイはボルトによりパレット 101に固定されているので、 2段目以降のトレイ とは動作が異なっている。図 10は、 1段目のトレィ (搬出入対象トレィ 102a)からガラ ス基板 108を取り出す様子を示す動作遷移図である。  Since the first tray is fixed to the pallet 101 with bolts, the operation differs from the second and subsequent trays. FIG. 10 is an operation transition diagram showing how the glass substrate 108 is taken out from the first-stage tray (the carrying-in / out target tray 102a).
[0064] まず、 60段に積まれたトレイ 102がコンベア 104によって運ばれ、搬出入位置に位 置決めされる（図 10の A)。位置決め動作は、図 2乃至図 4で説明したように実行され る。 [0064] First, the trays 102 stacked in 60 stages are carried by the conveyor 104 and positioned at the loading / unloading position (A in FIG. 10). The positioning operation is performed as described in FIGS.
[0065] 続、て、トレイチャック 107がトレイ 102を挟み込むように前進し、 2段目以上のトレイ を持ち上げる準備がなされる（図 10の B)。  [0065] Subsequently, the tray chuck 107 moves forward so as to sandwich the tray 102, and preparations are made to lift the second and higher trays (B in FIG. 10).
[0066] そして、 2段目以降のトレィを持ち上げ（図 10の C)、それと同時に、或いはその後、 リフトピン 105が上昇し、ガラス基板 108を所定高さ持ち上げる（図 10の D)。リフトピ ン 105は、トレイ 102aの設けられている穴 1021を通りガラス基板 108をトレイから所 定の高さ分持ち上げるようになつている。このリフトピン 105は、ガラス基板 108が安 定さえすればその数はいくつでも良い。なお。リフトピン 105の先端は、サイドピン 12 0や旋回ピン 124と同様、ガラス基板 108を傷つけないようにゴム等の柔らかい材料 で覆われるようにしてもょ ヽ。  [0066] Then, the trays in the second and subsequent stages are lifted (C in FIG. 10), and at the same time or thereafter, the lift pins 105 are raised to lift the glass substrate 108 by a predetermined height (D in FIG. 10). The lift pin 105 passes through the hole 1021 provided in the tray 102a and lifts the glass substrate 108 from the tray by a predetermined height. Any number of the lift pins 105 may be used as long as the glass substrate 108 is stable. Note that. The tip of the lift pin 105 may be covered with a soft material such as rubber so as not to damage the glass substrate 108, like the side pin 120 and the pivot pin 124.
[0067] リフトピン 105によってガラス基板 108が持ち上げられると、ロボットハンド 110がトレ ィ 102aとガラス基板 108との間に進入し、ガラス基板 108を取り出し、図示しない基 板処理装置にそれを受け渡すのである。  [0067] When the glass substrate 108 is lifted by the lift pins 105, the robot hand 110 enters between the tray 102a and the glass substrate 108, takes out the glass substrate 108, and transfers it to a substrate processing apparatus (not shown). is there.
[0068] 1段目のトレィ 102aに収容されたガラス基板 108が取り出されると、リフトピンは下 降し、 2段目以上のトレィを持上げた状態のまま、後述する 2段目以上のトレイからの 基板取り出し動作に入っても良いし、ー且、元の位置に戻るとともに、持ち上げてい た 2段目以上のトレィを 1段目の空トレイに再度重ね、後述する 2段目以上のトレィか らの基板の取り出し動作に入っても良 、。  [0068] When the glass substrate 108 accommodated in the first-stage tray 102a is taken out, the lift pins are lowered, and the second-stage or higher trays are lifted from the second-stage or higher trays to be described later. The board may be taken out and returned to its original position, and the second and higher trays that have been lifted are again stacked on the first empty tray, and the second and higher trays described later are used. You can start taking out the board.
[0069] リフトピン 105の長さは、パレット 101及び 1枚のトレィを貫通し、ガラス基板 108を持 ち上げ、ロボットハンド 110がそれを取り出すのに充分な長さを有しているだけなので 、従来のピンの長さよりもはるかに短くて済むのである。従って、リフトピンを収容する ためパレット載置台と床との間のスペースをそれ程取らなくても済むのである。 [0069] The length of the lift pin 105 is only long enough to penetrate the pallet 101 and one tray, lift the glass substrate 108, and allow the robot hand 110 to remove it. It is much shorter than the length of a conventional pin. Therefore, accommodate the lift pin Therefore, it is not necessary to take much space between the pallet mounting table and the floor.
[0070] また、最下段のトレイがパレットに固定されている場合は、リフトピン 105が付加され 、トレイチャックユニット 107dの把持爪 107aは 18段、トレイチャックユニット 107b、 10 7cの把持爪 107は 19段となる。  [0070] When the lowermost tray is fixed to the pallet, lift pins 105 are added, the gripping claws 107a of the tray chuck unit 107d are 18 steps, and the gripping claws 107 of the tray chuck units 107b and 107c are 19 It becomes a step.
[0071] (2) 2段目以上のトレイからの取り出し動作  [0071] (2) Removing from the second or higher tray
図 11は、 2段目以上の処理対象トレィ 102aからガラス基板 108を取り出す様子を 示す動作遷移図である。  FIG. 11 is an operation transition diagram showing how the glass substrate 108 is taken out from the processing target tray 102a in the second and higher stages.
[0072] まず、トレイチャック 107がトレイ 102を挟み込むように前進し（図 11の A)、 2段目以 上のトレィを持ち上げる準備がなされる（図 11の B)。ここで、 1段目のトレィを搬出入 するときと異なる点は、 2段目トレイ 102aが切り離し爪 1274によって把持されている ことである。  [0072] First, the tray chuck 107 moves forward so as to sandwich the tray 102 (A in FIG. 11), and preparations are made to lift the tray on the second and higher stages (B in FIG. 11). Here, a difference from when the first-stage tray is carried in and out is that the second-stage tray 102a is separated and held by the claw 1274.
[0073] そして、 2段目以上のトレイ 102を持ち上げる（図 11の C)。このとき、図 11のじから も分力るように、搬出入対象である 2段目のトレイ 102aは切り離し爪 1274で把持され ているので、それより上のトレィ 102と切り離された状態になっている。  [0073] Then, the second and higher trays 102 are lifted (C in FIG. 11). At this time, as shown in FIG. 11, since the second tray 102a to be loaded and unloaded is gripped by the separation claw 1274, it is separated from the tray 102 above it. ing.
[0074] 2段目以上のトレイ 102を持ち上げた状態で、サイドピン動作部 120及び旋回ピン 動作部 124が 2段目のトレィ 102a下に進入して来る（図 11の D)。なお、図 11は正面 図なので、図中には旋回ピン動作部 124は表されて 、な 、。  [0074] With the trays 102 in the second and higher stages lifted, the side pin operating unit 120 and the swivel pin operating unit 124 enter below the second stage tray 102a (D in FIG. 11). Since FIG. 11 is a front view, the swivel pin operation unit 124 is shown in the figure.
[0075] さらに、トレイ切り離し機構 127が、 2段目のトレイ 102aのみを所定高さ分だけ下降 させる。このようにすると、サイドピン 122及び旋回ピン 126がトレイ 102aの揷通孔 10 21を通過して、トレイ 102aに収容されているガラス基板 108を持ち上げる（図 11の E [0075] Further, the tray separating mechanism 127 lowers only the second tray 102a by a predetermined height. In this way, the side pin 122 and the pivot pin 126 pass through the through hole 1021 of the tray 102a to lift the glass substrate 108 accommodated in the tray 102a (E in FIG. 11).
) o ) o
[0076] ガラス基板 108が 2段目のトレイ 102aから持ち上げられると、ロボットハンド 110がト レイ 102aとガラス基板 108との間に進入し、ガラス基板 108を取り出し、図示しない 基板処理装置にそれを受け渡すのである。この動作は 1段目のトレイの場合と同様で ある。  [0076] When the glass substrate 108 is lifted from the second tray 102a, the robot hand 110 enters between the tray 102a and the glass substrate 108, takes out the glass substrate 108, and places it on a substrate processing apparatus (not shown). I hand it over. This operation is the same as for the first tray.
[0077] ガラス基板 108の受渡しが終了すると、処理対象トレィ切り離し機構 127は、空のト レイ 102aを上昇させ、その上面縁部を 3段目のトレイの底面部に合致させる（外観上 は図 11の Dのような状態)。そして、サイドピン 122及び旋回ピン 126を退避させる（ 外観上は図 11の Cのような状態)。さらに、 2段目以上のトレイ 102を 1段目のトレィ 1 02b上に載置し（図 11の Bのような状態）、トレイチャック 107が退避し（図 11の Aのよ うな状態）、 3段目のトレイの搬出入の準備に入る。 [0077] When the delivery of the glass substrate 108 is completed, the tray separation mechanism 127 to be processed raises the empty tray 102a and aligns the upper surface edge thereof with the bottom surface of the third-stage tray (in terms of appearance, the figure). 11 states like D). Then, the side pin 122 and the pivot pin 126 are retracted ( (Appearance is as shown in Fig. 11C). Furthermore, the second or higher tray 102 is placed on the first tray 102b (as shown in Fig. 11B), and the tray chuck 107 is retracted (as shown in Fig. 11A). Preparation for loading / unloading of the third tray is started.
[0078] 以上のような動作が 3段目以降、 60段まで実行され、全てのガラス基板 108がトレイ 102から取り出される。 The operation as described above is executed from the third stage to the 60th stage, and all the glass substrates 108 are taken out from the tray 102.
[0079] なお、トレイ 20段ごとに使用するトレイチャックユニット（107b乃至 d)が変更される のは、前述の通りである。  [0079] As described above, the tray chuck unit (107b to 107d) used for every 20 trays is changed.
[0080] くガラス基板 108の搬入動作〉 [0080] Loading operation of glass substrate 108>
以下、図 12及び図 13を用いてガラス基板 108の搬入動作を説明する。  Hereinafter, the operation of loading the glass substrate 108 will be described with reference to FIGS.
[0081] 図 12に示されるように、ガラス基板 108を空トレイ 102に搬入するときは最上段（60 段目）のトレイカ 実行される。 [0081] As shown in FIG. 12, when the glass substrate 108 is carried into the empty tray 102, the uppermost (60th) tray is executed.
[0082] まず、 60段に積まれた空トレイ 102がコンベア 104によって運ばれ、動作処理位置 に位置決めされる（図 12の A)。位置決め動作は、図 2乃至図 4で説明したように実行 される。 First, empty trays 102 stacked in 60 stages are carried by the conveyor 104 and positioned at the operation processing position (A in FIG. 12). The positioning operation is performed as described in FIGS.
[0083] 続!、て、トレイチャック 107がトレイ 102を挟み込むように前進し、 60段目のトレイ 10 2aを持ち上げる準備がなされる（図 12の B)。トレイ 102aを上下させる必要があるた め、トレイ 102aの把持はトレイ把持爪 107aによってではなぐ切り離し爪 1274によつ て行われる。  [0083] Next, the tray chuck 107 moves forward so as to sandwich the tray 102, and preparations are made to lift the 60th tray 102a (B in FIG. 12). Since it is necessary to raise and lower the tray 102a, the tray 102a is gripped by the separation claw 1274 that is not gripped by the tray gripping claw 107a.
[0084] そして、 60段目のトレィ 102aを持ち上げ（図 12の C)、それと同時に、或いはその 後、サイドピン 122及び旋回ピン 126がトレイ 102a進入し（図 12の D)する。  [0084] Then, the tray 102a at the 60th stage is lifted (C in Fig. 12), and at the same time or thereafter, the side pin 122 and the pivot pin 126 enter the tray 102a (D in Fig. 12).
[0085] そして、搬出入対象トレィ切り離し機構 127が 60段目のトレイ 102aを所定高さだけ 下降させ、サイドピン 122及び旋回ピン 126がトレイの揷通孔 1021を貫通した状態 にして、ガラス基板 108の受渡しの準備が完了する。この状態で、例えば処理済のガ ラス基板 108を保持したロボットハンド 110 (図 12には図示せず）がサイドピン 122及 び旋回ピン 126の上に進入し、ガラス基板 108をそれらピンに受け渡す（図 12の E)。  Then, the tray separating mechanism 127 for carrying in / out the object lowers the tray 102a of the 60th stage by a predetermined height, and the side pin 122 and the swivel pin 126 pass through the through hole 1021 of the tray, and the glass substrate 108 delivery preparations are complete. In this state, for example, a robot hand 110 (not shown in FIG. 12) holding the processed glass substrate 108 enters the side pins 122 and the pivot pins 126, and receives the glass substrate 108 on these pins. Hand it over (E in Figure 12).
[0086] 受渡しが終わると、搬出入対象トレィ切り離し機構 127はトレイ 102aを上昇させて 受け渡されたガラス基板 108をトレイ 102aに収容する。  [0086] When the delivery is completed, the carry-in / out target tray separating mechanism 127 raises the tray 102a and accommodates the delivered glass substrate 108 in the tray 102a.
[0087] なお、サイドピン 122及び旋回ピン 126にガラス基板 108が受け渡されるとき、或い はガラス基板 108がトレイ 102aに収容されるとき、図示しないセンサーによってガラス 基板 108の位置決め処理がなされ、トレイ内でのガラス基板の収容位置がズレな 、よ うな対処がなされる。例えば、センサーが位置ズレを検知すると、ガラス基板 108がサ イドピン 122、旋回ピン 126からロボットハンド 110によって取り出され、再度受渡し動 作が実行されるようにしてもょ 、。 [0087] It should be noted that when the glass substrate 108 is delivered to the side pin 122 and the pivot pin 126, or When the glass substrate 108 is accommodated in the tray 102a, the glass substrate 108 is positioned by a sensor (not shown), and the glass substrate is accommodated in the tray in a misalignment position. For example, if the sensor detects a displacement, the glass substrate 108 is taken out from the side pin 122 and the pivot pin 126 by the robot hand 110, and the delivery operation is executed again.
[0088] ガラス基板 108が 60段目のトレイ 102aに適切に収容されると、サイドピン 122及び 旋回ピン 126は元の位置に退避し（図 12の Cの状態）、さらに、搬出入対象切り離し 機構 127は把持したトレイ 102aを下降させて 60段目のトレイ 102aを 59段目のトレイ の上に載置する（図 12の Bの状態）。そして、トレイチャック 107はトレイ 102から退避 し、次のトレィ（59段目のトレイ）にガラス基板 108を搬入するための準備がなされる。  [0088] When the glass substrate 108 is properly accommodated in the 60th tray 102a, the side pin 122 and the pivot pin 126 are retracted to their original positions (state C in FIG. 12), and further, the object to be carried in / out is separated. The mechanism 127 lowers the gripped tray 102a and places the 60th tray 102a on the 59th tray (state B in FIG. 12). Then, the tray chuck 107 is retracted from the tray 102, and preparations for carrying the glass substrate 108 into the next tray (59th tray) are made.
[0089] 図 13は、 59段目のトレイ 102aにガラス基板 108を搬入する様子を示す動作遷移 図である。  FIG. 13 is an operation transition diagram showing how the glass substrate 108 is carried into the 59th tray 102a.
[0090] まず、トレイチャック 107がトレイ 102を挟み込むように前進し、 59段目以上のトレイ を持ち上げる準備がなされる（図 13の A)。ここで、 60段目のトレィはトレイ把持爪 10 7aで把持され、搬出入対象たる 59段目のトレイ 102aは切り離し爪 1274で把持され ている。  First, the tray chuck 107 moves forward so as to sandwich the tray 102, and preparations are made to lift the 59th and higher trays (A in FIG. 13). Here, the tray in the 60th stage is gripped by the tray gripping claw 107a, and the tray 102a in the 59th stage, which is the object to be carried in / out, is gripped by the separation claw 1274.
[0091] そして、 59及び 60段目のトレィを所定高さだけ持ち上げる（図 13の B)。このとき、 図 13の Bからも分力るように、搬出入対象である 59段目のトレィ 102aは切り離し爪 1 274で把持されているので、 60段目のトレイとは切り離された状態になっている。  Then, the 59th and 60th stage trays are lifted by a predetermined height (B in FIG. 13). At this time, as shown in FIG. 13B, the 59th tray 102a to be loaded and unloaded is gripped by the separation claw 1 274, so that it is separated from the 60th tray. It has become.
[0092] 59及び 60段目のトレイ 102を持ち上げた状態で、サイドピン動作部 120及び旋回 ピン動作部 124が 2段目のトレイ 102a下に進入して来る（図 13の C)。  [0092] With the 59th and 60th trays 102 lifted, the side pin operation unit 120 and the swivel pin operation unit 124 enter below the second tray 102a (C in FIG. 13).
[0093] さらに、トレイ切り離し機構 127が、 59段目のトレイ 102aのみを所定高さ分だけ下 降させる。このようにすると、サイドピン 122及び旋回ピン 126がトレイ 102aの揷通孔 1021を通過して、トレイ 102aを貫通する状態にして、ガラス基板 108の受渡しの準 備が完了する。この状態で、例えば処理済のガラス基板 108を保持したロボットノヽン ド 110 (図 13には図示せず）がサイドピン 122及び旋回ピン 126の上に進入し、ガラ ス基板 108をそれらピンに受け渡す（図 13の D)。  Furthermore, the tray separating mechanism 127 lowers only the 59th tray 102a by a predetermined height. In this way, the side pin 122 and the pivot pin 126 pass through the through hole 1021 of the tray 102a and pass through the tray 102a, and preparation for delivery of the glass substrate 108 is completed. In this state, for example, a robot node 110 (not shown in FIG. 13) holding the processed glass substrate 108 enters the side pins 122 and the swivel pins 126, and the glass substrate 108 is applied to these pins. Hand it over (D in Figure 13).
[0094] 受渡しが終わると、搬出入対象トレィ切り離し機構 127はトレイ 102aを上昇させて 受け渡されたガラス基板 108をトレイ 102aに収容する。 [0094] When the delivery is finished, the tray separating mechanism 127 to be carried in / out raises the tray 102a. The transferred glass substrate 108 is accommodated in the tray 102a.
[0095] なお、図示しないセンサーによるガラス基板 108の位置決めについては 60段目のト レイにガラス基板 108を搬入するときと同様である。  Note that the positioning of the glass substrate 108 by a sensor (not shown) is the same as when the glass substrate 108 is carried into the 60th tray.
[0096] ガラス基板 108が 59段目のトレイ 102aに適切に収容されると、サイドピン 122及び 旋回ピン 126は元の位置に退避し（図 13の Bの状態）、さらに、トレイチャック 107及 び切り離し機構 127は把持した 59及び 60段目のトレイを下降させて 58段目のトレイ の上に載置する（図 13の Aの状態）。そして、トレイチャック 107はトレイ 102から退避 し、次のトレィ（58段目のトレイ）にガラス基板 108を搬入するための準備がなされる。  [0096] When the glass substrate 108 is properly accommodated in the 59th tray 102a, the side pins 122 and the pivot pins 126 are retracted to their original positions (state B in FIG. 13). The separation mechanism 127 lowers the gripped 59th and 60th trays and places them on the 58th tray (state A in FIG. 13). Then, the tray chuck 107 is retracted from the tray 102, and preparations for carrying the glass substrate 108 into the next tray (58th tray) are made.
[0097] 以上の動作を繰り返し、 60段全てのトレイに対してガラス基板 108が搬入される。な お、最下段（1段目）のトレイは、パレット 101に固定されているので、サイドピン 122及 び旋回ピン 126は用いずに、リフトピン 105を用いてガラス基板 108をロボットハンド 1 10から受け取り、それをトレイに収容する。  [0097] The above operation is repeated, and the glass substrate 108 is carried into all 60 trays. Note that the bottom (first) tray is fixed to the pallet 101, so that the glass substrate 108 is removed from the robot hand 110 using the lift pins 105 without using the side pins 122 and the swivel pins 126. Receive it and place it in a tray.
[0098] 上記は本発明の実施形態のひとつでトレイ昇降手段にサイドピン移動手段、搬出 入対象切り離し機構を取り付けた場合で説明したが、これらを連結せず、全て個別駆 動に構成し、搬出入対象トレィ 102aへのサイドピン 122、 126挿通動作順を変え、搬 出入対象切り離し機構 127により搬出入トレイ 102aを他のトレイカも切り離した後、サ イドピン 122、 126を搬出入対象トレィ 102aの下へ進入させ、上昇させるようにしても よい。また、積層されたトレイの切り離しにおいて、上側トレィを上下動させず、下側ト レイを昇降させ、それにより生じた分離空間内にサイドピンを進入させるようにしても 良い。その場合、サイドピン移動手段、搬出入対象切り離し機構は下側のトレイ昇降 手段に取り付けると構成がよりシンプルになる。その他、この発明を逸脱しない範囲 であればどのような実施形態であったも良 、ことは 、うまでもな!/、。  [0098] The above is one of the embodiments of the present invention, and the case where the side pin moving means and the carry-in / out object separating mechanism are attached to the tray lifting / lowering means has been described. After changing the insertion order of the side pins 122 and 126 to the carry-in / out target tray 102a and separating the other input / output tray 102a by the carry-in / out target separating mechanism 127, the side pins 122 and 126 are connected to the carry-in / out target tray 102a. You may make it go down and raise it. Further, when separating the stacked trays, the upper tray may not be moved up and down, but the lower tray may be moved up and down, and the side pin may enter the separation space generated thereby. In that case, if the side pin moving means and the carry-in / out object separating mechanism are attached to the lower tray lifting / lowering means, the configuration becomes simpler. In addition, any embodiment may be used as long as it does not deviate from the present invention.
[0099] <本実施形態の効果 >  <Effect of this embodiment>
以上の説明してきたように、本実施形態によれば、コンベア 103及び 104の高さは 固定で、リフトピン 105の昇降、スライドピン 122及び旋回ピン 126の動作によってガ ラス基板 108を持ち上げて取り出す Z搬入するようにしたので、装置の動作を簡素化 することができると共に、装置の省スペース化、特に高さが限られる場合に有効であ る。つまり、ピンを固定式にしてコンベア自体を昇降させる場合には、まず絶対長とし てのピン長（トレィ段数分の長さ）とさらにトレィ段数分の高さが最低限装置としては必 要となるところ、本実施形態では、リフトピンを昇降させているためトレイ段数の 2倍の 装置高さを必要とはしない。ひとつひとつのトレイの重さはそれ程でもないが、何段も 重ねられた場合にはかなりの重量になる。かかる場合、この重量物の上下運動自体 を必要最小限にすることが重要であり、本実施形態ではそれが実現できる。 As described above, according to the present embodiment, the heights of the conveyors 103 and 104 are fixed, and the glass substrate 108 is lifted and removed by moving the lift pins 105 and moving the slide pins 122 and the swivel pins 126 Z Since it is carried in, the operation of the apparatus can be simplified, and it is effective for space saving of the apparatus, particularly when the height is limited. In other words, when the pin is fixed and the conveyor itself is moved up and down, first set the absolute length. The minimum pin length (the length corresponding to the number of tray steps) and the height corresponding to the number of tray steps are required as a minimum device. In this embodiment, since the lift pins are raised and lowered, the number is twice the number of tray steps. Does not require device height. Each tray does not weigh as much, but it can be quite heavy when stacked in layers. In such a case, it is important to minimize the vertical movement of the heavy object itself, and this embodiment can achieve this.
[0100] また、本実施形態では、 1枚のガラス基板 108の取り出し或 、は搬入動作が終了す るたびに、スライドピン 122及び旋回ピン 126をトレイの下空間力も退避させるので、 ピンがトレイに格納されたガラス基板 108を突き抜くという心配がなぐガラス基板 108 の破損の危険性が劇的に減少する。従来技術のように、ピンが固定であるとトレイチ ャックが外れれば、把持されたトレイに格納されて 、るガラス基板の大部分は破損す る可能性が高 、ことは容易に想像つくであろう。  [0100] Further, in this embodiment, each time the one glass substrate 108 is taken out or carried in, the slide pin 122 and the swivel pin 126 are also retracted under the tray, so that the pin is in the tray. The risk of breakage of the glass substrate 108 without worrying about piercing the glass substrate 108 stored in the container is dramatically reduced. As in the prior art, it is easy to imagine that if the tray chuck is removed when the pins are fixed, most of the glass substrate stored in the gripped tray is likely to be damaged. Let's go.
[0101] さらに、本実施形態では、全トレイについて搬出入が完了した段階で、第 1のコンペ ァ 103上に全トレイがパレット 101に載った状態になっている。従って、搬出入が完了 すれば直ぐにでも次に処理すべきトレィを載せたパレットとの交換動作に入ることが できるため、トータルとして基板搬送の処理時間を短くすることができ、効率のよい搬 送を実現することができる。  Furthermore, in this embodiment, all the trays are placed on the pallet 101 on the first competitor 103 at the stage where the loading / unloading of all the trays is completed. Therefore, as soon as the loading / unloading is completed, the replacement operation with the pallet loaded with the tray to be processed next can be started, so the processing time for substrate transfer can be shortened as a whole, and efficient transfer is possible. Can be realized.
[0102] また、本実施形態では、最下段のトレイがパレットに固定されているので、位置ズレ なくガラス基板 108を取り出し、又は搬入することができる。つまり、最初のトレイの位 置が明確に決定されるので、パレット 101の位置決めさえ正確に行えば、それに積載 されたトレイの位置決めも自動的に正確に行われる。  [0102] In the present embodiment, since the lowermost tray is fixed to the pallet, the glass substrate 108 can be taken out or carried in without any positional deviation. In other words, since the position of the first tray is clearly determined, as long as the pallet 101 is accurately positioned, the tray loaded on it is automatically positioned accurately.
[0103] <第 2実施形態 >  [0103] <Second Embodiment>
上記実施形態では、スライドピン 122及び旋回ピン 126上に載置されたガラス基板 108、或いは、リフトピン 105上に載置されたガラス基板 108に位置ずれが生じてい る場合、ロボット 109によりガラス基板 108を持ち直すことにより、位置ずれを解消す る場合について説明したが、基板搬出入装置 100にガラス基板 108の位置決め機 能を付加することもできる。  In the above embodiment, when the glass substrate 108 placed on the slide pin 122 and the pivot pin 126 or the glass substrate 108 placed on the lift pin 105 is displaced, the robot 109 causes the glass substrate 108 to move. Although the case where the positional deviation is eliminated by re-holding has been described, the positioning function of the glass substrate 108 can be added to the substrate carry-in / out device 100.
[0104] 図 14はトレイチャックユニットに位置決めユニット 200を設けた構成例を示す図であ る。同図の例ではトレイチャックユニットの第 2のバー 1002を X方向に延長したバー 1 002'の両端部下側に、取付部 201を介して位置決めユニット 200が取り付けられて いる。 FIG. 14 is a diagram showing a configuration example in which the positioning unit 200 is provided in the tray chuck unit. In the example in the figure, the bar 1 is an extension of the second bar 1002 of the tray chuck unit in the X direction. A positioning unit 200 is attached to the lower side of both end portions of 002 ′ via an attachment portion 201.
[0105] 位置決めユニット 200は位置決め用のローラ 210a、 210b, 21 la及び 21 lbと、口 ーラ 210a、 210b, 21 la及び 21 lbを支持する支持板 220と、支持板 220を X方向 に往復移動させるァクチユエータ 230と、ァクチユエータ 230を Y方向に往復移動さ せるァクチユエータ 240と、を備える。  [0105] The positioning unit 200 includes positioning rollers 210a, 210b, 21 la, and 21 lb, a support plate 220 that supports the rollers 210a, 210b, 21 la, and 21 lb, and a support plate 220 that reciprocates in the X direction. There is provided an actuator 230 for moving and an actuator 240 for reciprocating the actuator 230 in the Y direction.
[0106] 位置決め用のローラ 210a及び 210bと、 21 la及び 21 lbとの位置関係は、トレイ 10 2内の適切な位置に収容された場合のガラス基板 108の外周とトレイ 102の外周との 距離により予め設定されている。  [0106] The positional relationship between the positioning rollers 210a and 210b and 21 la and 21 lb is the distance between the outer periphery of the glass substrate 108 and the outer periphery of the tray 102 when stored at an appropriate position in the tray 102. Is set in advance.
[0107] ガラス基板 108の位置決めは、 4つの位置決めユニット 200により、その 4隅の位置 を規定することにより行なう。ローラ 210a、 210bはガラス基板 108の 4隅のうちの 1つ を位置決めするためのローラであり、支持板 220の上側で支持板 220により回転自 在に支持されている。  [0107] The glass substrate 108 is positioned by defining the positions of its four corners with the four positioning units 200. The rollers 210 a and 210 b are rollers for positioning one of the four corners of the glass substrate 108, and are supported by the support plate 220 so as to rotate on the upper side of the support plate 220.
[0108] ローラ 211a、 21 lbはァクチユエータ 230及び 240による支持板 220の移動量を規 制するためのローラであり、支持板 220の下側で支持板 220により回転自在に支持 されている。ァクチユエータ 230及び 240は本実施形態の場合、いずれもエアァクチ ユエータである。  The rollers 211 a and 21 lb are for controlling the amount of movement of the support plate 220 by the actuators 230 and 240, and are rotatably supported by the support plate 220 below the support plate 220. In the case of the present embodiment, the actuators 230 and 240 are both air actuators.
[0109] 次に、図 15及び図 16を参照して位置決めユニット 200によるガラス基板 108の位 置決め動作について説明する。図 15及び図 16の上段の図は、位置決めユニット 20 0及び搬出入対象トレィ 102aの一部（隅部）の周辺の側面視図であり、下段の図は その平面視図である。以下、図 15及び図 16を参照して、 2段目以上のトレイ 102を 搬出入対象トレィ 102aとした場合について説明するが、最下段のトレィ 102を搬出 入対象トレィ 102aとした場合も同様である。  [0109] Next, the positioning operation of the glass substrate 108 by the positioning unit 200 will be described with reference to FIGS. 15 and 16 are upper side views of the periphery of the positioning unit 200 and a part (corner portion) of the carry-in / out target tray 102a, and the lower view is a plan view thereof. Hereinafter, with reference to FIGS. 15 and 16, a description will be given of the case where the tray 102 at the second or higher level is set as the carry-in / out target tray 102a, but the same applies when the bottom tray 102 is set as the target tray 102a. is there.
[0110] 図 15は位置決めユニット 200が待機状態にある場合を示している。搬入出対象トレ ィ 102aに対応するガラス基板 108はスライドピン 122及び不図示の旋回ピン 126上 に載置された状態にある。また、図 15の下段に示すように、ガラス基板 108は平面視 で搬出入対象トレィ 102aから位置ずれを生じた状態にある。  FIG. 15 shows a case where the positioning unit 200 is in a standby state. The glass substrate 108 corresponding to the carry-in / out target tray 102a is placed on the slide pin 122 and the turning pin 126 (not shown). Further, as shown in the lower part of FIG. 15, the glass substrate 108 is in a state of being displaced from the carry-in / out target tray 102a in plan view.
[0111] この状態において、図 16に示すように、まずァクチユエータ 240を伸長し、その後、 ァクチユエータ 230を作動して、支持板 220を同図の Y方向及び一 X方向に移動さ せる。ァクチユエータ 240の伸長により、支持板 220がガラス基板 108と搬出入対象ト レイ 102aとの間に進行し、ローラ 21 laが搬出入対象トレィ 102aの、 X方向に沿う辺 に当接する。ローラ 21 laが搬入出対象トレィ 102aに当接することによりァクチユエ一 タ 240の駆動（伸長）が停止する。この時、ガラス基板 108の位置ずれに応じて、ロー ラ 210aがガラス基板 108の X方向に沿う辺に当接する。この結果、ガラス基板 108の Y方向の位置決めがなされる。 In this state, as shown in FIG. 16, the actuator 240 is first extended, and then The actuator 230 is operated to move the support plate 220 in the Y direction and the X direction in the figure. Due to the extension of the actuator 240, the support plate 220 advances between the glass substrate 108 and the tray 10a for loading / unloading, and the roller 21la contacts the side of the tray 102a for loading / unloading along the X direction. The drive (extension) of the actuator 240 stops when the roller 21 la contacts the carrying-in / out tray 102a. At this time, the roller 210a comes into contact with the side of the glass substrate 108 along the X direction according to the displacement of the glass substrate 108. As a result, the glass substrate 108 is positioned in the Y direction.
[0112] 続いて、ァクチユエータ 230の駆動によりローラ 211bが搬出入対象トレィ 102bの Y 方向に沿う辺に当接する。ローラ 21 lbが搬入出対象トレィ 102aに当接することによ りァクチユエータ 230の駆動 (スライド）が停止する。この時、ガラス基板 108の位置ず れに応じて、ローラ 210bがガラス基板 108の Y方向に沿う辺に当接する。この結果、 ガラス基板 108の X方向の位置決めもなされる。  Subsequently, the roller 211b is brought into contact with the side of the carry-in / out target tray 102b along the Y direction by driving the actuator 230. Actuator 230 stops driving (sliding) when 21 lb of roller comes into contact with the loading / unloading tray 102a. At this time, the roller 210b comes into contact with the side of the glass substrate 108 along the Y direction according to the position of the glass substrate 108. As a result, the glass substrate 108 is also positioned in the X direction.
[0113] なお、ァクチユエータ 230及び 240の駆動の停止は、例えば、搬出入対象トレィ 10 2aにローラ 211a、 21 lbが当接した場合に、それ以上、ァクチユエータ 230及び 240 が支持板 220を移動できない程度に、ァクチユエータ 230及び 240による付勢力を 予め弱くしておく方法が挙げられる。  It should be noted that the drive of the actuators 230 and 240 is stopped when, for example, the rollers 211a and 21 lb contact the carrying-in / out object tray 102a, the actuators 230 and 240 cannot move the support plate 220 any more. To some extent, a method of weakening the urging force by the actuators 230 and 240 in advance is mentioned.
[0114] このようにしてガラス基板 108及び搬出入対象トレィ 102aの水平方向の相対的な 位置決めがなされる。つまり、ローラ 210a及び 210bと、 21 la及び 21 lbとの相対的 な配置関係を、ガラス基板 108と搬出入対象トレィ 102aとの間の適切な配置関係に 対応して設定しておくことで、 2つのローラ 21 la及び 21 lbが搬出入対象トレィ 102a の周縁の 2辺に当接し、ァクチユエータ 230及び 240による支持板 220の移動が停 止した時に、ガラス基板 108の位置決めが完了することになる。  [0114] In this way, relative positioning of the glass substrate 108 and the carry-in / out target tray 102a in the horizontal direction is performed. In other words, by setting the relative positional relationship between the rollers 210a and 210b and 21 la and 21 lb corresponding to the appropriate positional relationship between the glass substrate 108 and the tray 102a to be carried in and out, The positioning of the glass substrate 108 is completed when the two rollers 21 la and 21 lb come into contact with two sides of the periphery of the tray 102a to be carried in and out, and the movement of the support plate 220 by the actuators 230 and 240 stops. .
[0115] 上述した通り、ガラス基板 108の位置決めはその 4隅にそれぞれ対応して配置され る 4つの位置決めユニット 200により同時に行なわれ、ガラス基板 108の 4隅の位置 が各ローラ 210a及び 210bにより位置決めされることになる。  [0115] As described above, the positioning of the glass substrate 108 is simultaneously performed by the four positioning units 200 arranged corresponding to the four corners, and the four corners of the glass substrate 108 are positioned by the rollers 210a and 210b. Will be.
[0116] 位置決め後、位置決めユニット 200は図 15に示す状態に戻ることになる。なお、こ のようなガラス基板 108の位置決めはガラス基板 108の搬入時及び搬出時のいずれ においても行なうことができる。ガラス基板 108の位置決めを基板搬出入装置 100側 の構成で行なうことにより、ロボット 109によりガラス基板 108を持ち直す必要がなくな り、タクトタイムを短縮ィ匕できる。 [0116] After positioning, the positioning unit 200 returns to the state shown in FIG. Such positioning of the glass substrate 108 can be performed both when the glass substrate 108 is carried in and when it is carried out. Glass substrate 108 is positioned on the substrate loading / unloading device 100 side With this configuration, the robot 109 does not need to hold the glass substrate 108 again, and the tact time can be shortened.
[0117] <第 3実施形態 >  [0117] <Third Embodiment>
次に段積みされたトレイ 102からガラス基板 108の搬出入を下力ももしくは上力も順 に行うのではなぐ任意の位置のトレイ 102に対し搬出入を行うランダムアクセスを行 う場合について説明する。  Next, a description will be given of a case where random access is performed to carry in / out the tray 102 at an arbitrary position, in which the glass substrate 108 is not carried in / out from the stacked trays 102 in order.
[0118] 順次式の場合はガラス基板の搬入、搬出を上力 又は下力 順に行うため、段積 みされたトレイの中で部分的に歯抜け状態の収容は想定しにくいが、ランダムァクセ スを行う場合、基板の収容状態はばらばらになる可能性もある。 1つのトレィ 102にガ ラス基板を 2枚投入しょうとする等のミスを防止するためにもガラス基板 108の搬入開 始時、及び、搬出時開始前には、各々のトレイ 102にガラス基板 108が搭載されてい る力否かをチェックすることが望ましい。本実施形態では、各々のトレイ 102にガラス 基板 108が搭載されているか否かを検出する基板検出を行なう構成について説明す る。  [0118] In the case of the sequential type, glass substrates are loaded and unloaded in the order of upward or downward force, so it is difficult to envisage partial omission in the stacked trays. When carrying out the test, the accommodation state of the substrate may be scattered. In order to prevent mistakes such as trying to insert two glass substrates into one tray 102, the glass substrate 108 is placed in each tray 102 at the start of loading and unloading of the glass substrate 108. It is desirable to check whether the power is installed. In the present embodiment, a configuration for performing substrate detection for detecting whether or not a glass substrate 108 is mounted on each tray 102 will be described.
[0119] 図 17はトレイ 102に代わるトレイ 302の側面視図である。トレイ 302はトレイ 102の側 面にトレィ 102内に連通した開口部 3021が設けられたものであり、その他の構成はト レイ 102と同じである。この開口部 3021を設けたことにより、トレイ 302の側方からトレ ィ 302内にガラス基板 108が搭載されているか否かが見えることになる。よって、段積 みされたトレイ 302の側面を光センサにより上下方向に走査することで各々のトレイ 3 02にガラス基板 108が搭載されている力否かをチェックすることができる。  FIG. 17 is a side view of a tray 302 that replaces the tray 102. The tray 302 is provided with an opening 3021 communicating with the inside of the tray 102 on the side surface of the tray 102, and the other configuration is the same as the tray 102. By providing the opening 3021, it can be seen from the side of the tray 302 whether or not the glass substrate 108 is mounted in the tray 302. Therefore, it is possible to check whether or not the glass substrate 108 is mounted on each tray 302 by scanning the side surface of the stacked trays 302 in the vertical direction using an optical sensor.
[0120] 光センサを上下に走査させる移動機構は基板搬出入装置 100側に設けることもで きるが、ここではロボット 109のロボットハンド 110の先端に設ける例について説明す る。図 18は光センサ 400をロボットハンド 110に設けた例を示す図である。  [0120] Although the moving mechanism for scanning the optical sensor up and down can be provided on the substrate carry-in / out apparatus 100 side, an example in which the moving mechanism is provided at the tip of the robot hand 110 of the robot 109 will be described here. FIG. 18 is a diagram showing an example in which the optical sensor 400 is provided in the robot hand 110.
[0121] 光センサ 400は発光素子 401と受光素子 402とを有する。発光素子 401はロボット ハンド 110の先端力も光を照射する。発光素子 401の照射範囲に物体が存在してい た場合は、その物体で反射された反射光がロボットハンド 110の先端の受光素子 40 2で受光され、その物体の存在が検知されることになる。  The optical sensor 400 includes a light emitting element 401 and a light receiving element 402. The light emitting element 401 also irradiates light with the tip force of the robot hand 110. When an object exists in the irradiation range of the light emitting element 401, the reflected light reflected by the object is received by the light receiving element 402 at the tip of the robot hand 110, and the presence of the object is detected. .
[0122] 図 19は光センサ 400により、各々のトレイ 302にガラス基板 108が搭載されている か否かのチェックを行なう場合の動作説明図及び光センサ 400の検知結果を示す図 である。 [0122] In FIG. 19, the glass substrate 108 is mounted on each tray 302 by the optical sensor 400. FIG. 6 is a diagram for explaining the operation when checking whether or not the optical sensor 400 is detected.
[0123] 図 19の例では、下から 2段目及び 5段目のトレイ 302にはガラス基板 108が搭載さ れて 、な 、。ロボット 110は光センサ 400を段積みされたトレイ 302の側面に近接さ せ、光センサ 400とトレイ 302の側面との距離を一定の保ちながら、一定の速度で口 ボットハンド 110を最下段のトレィ 302の位置から上昇（又は最上段のトレィ 302の位 置から降下)させる。  In the example of FIG. 19, the glass substrate 108 is mounted on the second and fifth trays 302 from the bottom. The robot 110 brings the optical sensor 400 close to the side surface of the stacked tray 302, and keeps the distance between the optical sensor 400 and the side surface of the tray 302 constant, while keeping the distance between the optical sensor 400 and the tray 302 at a constant speed. Raise from the position of 302 (or descend from the position of the uppermost tray 302).
[0124] 光センサ 400の発光素子 401から照射される光は、トレイ 302の側面で反射し、受 光素子 402により検知される。また、開口部 3021に照射される光は、ガラス基板 108 が存在している場合には、ガラス基板 108の側面で反射し、受光素子 402により検知 される力 ガラス基板 108が存在していない場合には反射光が無いため、受光素子 4 02によりこれが検知されることがない。  The light emitted from the light emitting element 401 of the optical sensor 400 is reflected by the side surface of the tray 302 and detected by the light receiving element 402. In addition, when the glass substrate 108 is present, the light irradiated to the opening 3021 is reflected by the side surface of the glass substrate 108 and detected by the light receiving element 402. When the glass substrate 108 is not present Since there is no reflected light, the light receiving element 402 does not detect this.
[0125] このため、図 19の検知結果に示すように光センサ 400 (受光素子 402)力も出力さ れる電気信号は、ガラス基板 108が搭載されて 、るトレイ 302と搭載されて 、な 、トレ ィ 302とで波形が異なるものとなり、この検知結果と、ロボットハンド 110の移動位置の 情報とから、各々のトレイ 302にガラス基板 108が搭載されている力否かをチェックす ることがでさること〖こなる。  For this reason, as shown in the detection result of FIG. 19, the electrical signal that also outputs the force of the optical sensor 400 (light receiving element 402) is mounted on the tray 302 on which the glass substrate 108 is mounted and on the tray 302. The waveform is different from that of the 302, and it is possible to check whether or not the glass substrate 108 is mounted on each tray 302 from this detection result and information on the movement position of the robot hand 110. That's true.
[0126] そして、光センサ 400の検知結果により、搬出入対象となるトレィ 302が選択され、 搬出入動作が行なわれることになる。図 20は光センサ 400の検知結果を利用した制 御システムのブロック図である。  [0126] Then, the tray 302 to be carried in / out is selected based on the detection result of the optical sensor 400, and the carrying-in / out operation is performed. FIG. 20 is a block diagram of a control system using the detection result of the optical sensor 400.
[0127] 同図の例は、基板搬出入装置 100が設置される工場全体を管理するホストコンビュ ータ 500と、ロボット 109を制御する制御装置 501及び基板搬出入装置 100を制御 する制御装置 502とが通信可能に接続されたシステム例を示して 、る。光センサ 400 の検知結果は制御装置 501を介してホストコンピュータ 500へ送信される。ホストコン ピュータ 500は、受信した検知結果に基づき、基板搬出入装置 100に関連する各種 の基板処理装置の動作状況に応じて、制御装置 502に対して搬出入対象となるトレ ィ 302を選択して指示する。トレイ 302の選択指示を受信した制御装置 502は、その 選択指示に応じたトレイ 302を搬出入対象トレイに設定し、上述した搬出入動作を行 うことになる。 [0127] The example in the figure shows a host computer 500 that manages the entire factory where the substrate carry-in / out device 100 is installed, a control device 501 that controls the robot 109, and a control device 502 that controls the substrate carry-in / out device 100. An example of a system that is connected to be communicable is shown. The detection result of the optical sensor 400 is transmitted to the host computer 500 via the control device 501. Based on the received detection result, the host computer 500 selects the tray 302 to be loaded / unloaded with respect to the control device 502 according to the operation status of various substrate processing apparatuses related to the substrate loading / unloading apparatus 100. Instruct. Receiving the instruction for selecting the tray 302, the control device 502 sets the tray 302 according to the selection instruction as a tray to be loaded / unloaded, and performs the above-described loading / unloading operation. It will be.
なお、本発明は上記実施の形態に制限されるものではなぐ本発明の精神及び範 囲から離脱することなぐ様々な変更及び変形が可能である。  It should be noted that the present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present invention.

Claims

請求の範囲 The scope of the claims
[1] トレイカも基板を取り出す、または搬入するための基板搬出入装置であって、  [1] A tray loader is also a substrate loading / unloading device for taking out or loading a substrate,
所定数のピン揷通孔を有するトレィを複数段積載したパレットを移動させるための、 コンベアと、  A conveyor for moving a pallet loaded with a plurality of trays having a predetermined number of pin through holes;
前記コンベアの所定の位置に、前記パレットを位置決めするパレット位置決め手段 と、  Pallet positioning means for positioning the pallet at a predetermined position of the conveyor;
前記位置決め手段によって前記パレットが位置決めされた状態で、前記複数段のト レイを分離し、分離したトレイ間に所定の分離空間を設けるトレイ昇降手段と、 前記分離空間の中で、搬出入の対象となる基板に対応する搬出入対象トレィを上 下動させるトレイ切り離し手段と、  Tray lifting / lowering means for separating the plurality of trays in a state where the pallet is positioned by the positioning means and providing a predetermined separation space between the separated trays; Tray separating means for moving up and down the tray to be loaded / unloaded corresponding to the substrate to be
基板を支持するための基板支持ピンを前記搬出入対象トレイの下へ進入及び退避 させるための基板支持ピン移動手段と、  A substrate support pin moving means for allowing a substrate support pin for supporting the substrate to enter and retreat under the carry-in / out tray;
前記搬出入対象トレイの前記ピン揷通孔に前記基板支持ピンを挿通させるピン挿 通手段と、を備え、  Pin insertion means for inserting the substrate support pin through the pin insertion hole of the carry-in / out target tray,
前記基板支持ピンは、前記ピン挿通孔を揷通することで前記搬出入対象トレイから 突出し、  The substrate support pin protrudes from the carry-in / out tray by passing through the pin insertion hole,
突出した前記基板支持ピンによって、前記基板が前記搬出入対象トレイから持ち 上げられた状態で支持されることを特徴とする基板搬出入装置。  The substrate loading / unloading apparatus, wherein the substrate is supported by the protruding substrate supporting pins in a state where the substrate is lifted from the loading / unloading tray.
[2] 前記トレィ切り離し手段が前記ピン挿通手段として機能し、  [2] The tray separating means functions as the pin insertion means,
前記基板支持ピンが前記搬出入対象トレイの下方へ位置した状態で、前記トレィ切 り離し手段により前記搬出入トレイを降下させることにより、前記搬出入対象トレイの 前記ピン揷通孔に前記基板支持ピンを挿通させることを特徴とする請求項 1に記載 の基板搬出入装置。  In the state where the substrate support pin is positioned below the tray for carrying in / out, the tray support means lowers the carry-in / out tray by the tray separating means, thereby supporting the substrate in the pin insertion hole of the tray for carrying in / out. 2. The substrate carry-in / out device according to claim 1, wherein a pin is inserted.
[3] 前記基板支持ピン移動手段は、前記基板支持ピンを旋回させることにより前記搬出 入対象トレイの下へ前記基板支持ピンを進入及び退避させることを特徴とする請求 項 1に記載の基板搬出入装置。  3. The substrate carry-out according to claim 1, wherein the substrate support pin moving means causes the substrate support pin to enter and retreat under the carry-in / out tray by turning the substrate support pin. Input device.
[4] 前記基板支持ピン移動手段は、前記基板支持ピンをスライドさせることにより前記 搬出入対象トレイの下方へ前記基板支持ピンを進入及び退避させることを特徴とす る請求項 1に記載の基板搬出入装置。 [4] The substrate support pin moving means is characterized in that the substrate support pin enters and retracts below the carry-in / out tray by sliding the substrate support pin. The substrate carry-in / out device according to claim 1.
[5] 前記トレィ昇降手段は、各々の前記トレィを支持するトレイ把持爪を上下方向に多 段に備え、 [5] The tray lifting and lowering means includes a plurality of tray gripping claws for supporting each tray in the vertical direction.
前記トレィ把持爪は、上下方向に区分けされる複数のグループ単位で駆動制御さ れて 、ることを特徴とする請求項 1に記載の基板搬出入装置。  2. The substrate carry-in / out device according to claim 1, wherein the tray gripping claw is driven and controlled in a plurality of groups divided in the vertical direction.
[6] 前記基板支持ピン移動手段は前記トレィ昇降手段に取り付けられていることを特徴 とする請求項 1に記載の基板搬出入装置。 6. The substrate carry-in / out apparatus according to claim 1, wherein the substrate support pin moving means is attached to the tray lifting / lowering means.
[7] 前記トレィ切り離し手段は前記トレィ昇降手段に取り付けられていることを特徴とす る請求項 1に記載の基板搬出入装置。 7. The substrate carry-in / out apparatus according to claim 1, wherein the tray separating means is attached to the tray lifting / lowering means.
[8] さらに、最下段のトレイに対し、基板をこの最下段のトレイカ 持ち上げられた状態 で支持するリフトピンを備えることを特徴とする請求項 1に記載の基板搬出入装置。 8. The substrate carry-in / out device according to claim 1, further comprising lift pins for supporting the substrate in a state where the lowermost tray is lifted with respect to the lowermost tray.
[9] トレイカ 基板を取り出す、または搬入するための基板搬出入方法であって、 [9] Tray card A substrate loading / unloading method for taking out or loading a board,
所定数のピン揷通孔を有する複数のトレィを積層したパレットを移動させ、前記パレ ットの位置決めを行った後、前記積層されたトレイを分離し、所定の分離空間を設け るトレイ相対移動工程と、  After moving a pallet in which a plurality of trays having a predetermined number of pin through holes are moved and positioning the pallet, the stacked trays are separated, and a tray relative movement for providing a predetermined separation space is performed. Process,
前記分離空間の中で、搬出入対象となる基板に対応する搬入出対象トレィを他のト レイと独立して上下動させ、他のトレイと切り離された状態にするトレィ切り離し工程と 基板を支持するための基板支持ピンを前記搬出入対象トレイの下へ進入させる基 板支持ピン移動工程と、  In the separation space, the tray separating step for moving the tray for loading / unloading corresponding to the substrate to be loaded / unloaded independently of other trays to separate the tray from the other trays and the substrate are supported. A substrate support pin moving step for causing a substrate support pin to enter under the carry-in / out tray,
前記基板支持ピンが前記搬出入対象トレイの前記ピン挿通孔を揷通して前記搬出 入対象トレイカゝら突出するように、前記基板支持ピンと前記搬出入対象トレイとを相対 移動させるピン挿通工程と、  A pin insertion step for relatively moving the substrate support pin and the loading / unloading target tray so that the substrate supporting pin passes through the pin insertion hole of the loading / unloading target tray and protrudes from the loading / unloading target tray;
前記基板支持ピンが前記搬出入対象トレイの前記ピン挿通孔を揷通して前記搬出 入対象トレイカ 突出した状態において、前記基板支持ピンと他の移載装置との間 で基板の受渡を行う基板受渡工程と、  A substrate delivery step of delivering a substrate between the substrate support pin and another transfer device in a state where the substrate support pin passes through the pin insertion hole of the carry-in / out target tray and protrudes from the carry-in / out target tray card. When,
を含む基板搬出入方法。  Board loading / unloading method including
[10] 前記基板支持ピンにより支持された基板の位置決めを行なう基板位置決め手段を 備えたことを特徴とする請求項 1に記載の基板搬出入装置。 [10] Substrate positioning means for positioning the substrate supported by the substrate support pins The substrate carry-in / out apparatus according to claim 1, further comprising:
[11] 複数段積載された、各々の前記トレイが基板を有している力否かを検出する基板検 出手段を備え、 [11] A substrate detecting means for detecting whether or not each of the trays loaded in a plurality of stages has a substrate is provided.
前記搬出入対象トレィは前記基板検出手段の検出結果に基づいて選択されること を特徴とする請求項 1に記載の基板搬出入装置。  2. The substrate carry-in / out device according to claim 1, wherein the carry-in / out target tray is selected based on a detection result of the substrate detection means.
[12] 複数のピン揷通孔を有し、段積みされた複数段のトレイの中から選択される 1つのト レイに対して、基板の搬出入を行なう基板搬出入装置において、 [12] In a substrate loading / unloading apparatus that loads and unloads a substrate to / from one tray selected from a plurality of stacked trays having a plurality of pin through holes,
搬出入対象の基板に対応する搬出入対象トレイと、当該搬出入対象トレイの下のト レイとの間を境にして、前記複数段のトレィを上下に分離する第 1昇降手段と、 前記第 1トレイ昇降手段により分離されたことにより生じる、前記搬入出対象トレイと 当該搬出入対象トレイの下のトレイとの間の分離空間へ、基板を支持するための基 板支持ピンを進入させる基板支持ピン移動手段と、  First elevating means for separating the plurality of trays up and down with a boundary between a carry-in / carry-out tray corresponding to a substrate to be carried in / out and a tray below the carry-in / carry-out tray; (1) Substrate support in which a substrate support pin for supporting a substrate enters a separation space between the tray to be carried in / out and a tray below the tray to be carried in / out generated by separation by the tray lifting / lowering means Pin moving means;
前記分離空間内において、前記搬出入対象トレィを上下に移動させる第 2昇降手 段と、を備え、  A second lifting and lowering means for moving the carry-in / out target tray up and down in the separation space;
前記基板支持ピンが、前記搬出入対象トレイの前記ピン挿通孔を揷通して前記搬 出入対象トレイカ 突出するように、前記基板支持ピン移動手段により前記基板支持 ピンを前記分離空間へ進入させた後、前記第 2昇降手段により前記搬出入対象トレ ィを降下させることを特徴とする基板搬出入装置。  After the substrate support pins enter the separation space by the substrate support pin moving means so that the substrate support pins pass through the pin insertion holes of the carry-in / out target tray and protrude from the carry-in / out target tray card The substrate loading / unloading apparatus, wherein the second loading / lowering means lowers the loading / unloading tray.
PCT/JP2006/308633 2005-05-17 2006-04-25 Apparatus for carrying in/out substrate and method for carrying in/out substrate WO2006123520A1 (en)

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JP2005104475A (en) * 2003-09-26 2005-04-21 Sharp Corp Substrate-accommodating tray pallet, and substrate transfer system

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JPWO2006123520A1 (en) 2008-12-25
WO2006123402A1 (en) 2006-11-23
CN101018723B (en) 2011-06-15
JP4537411B2 (en) 2010-09-01
KR100830225B1 (en) 2008-05-16
CN101018723A (en) 2007-08-15
TWI320392B (en) 2010-02-11
KR20070088490A (en) 2007-08-29

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