WO2006112696A2 - Method for electroforming a studded plate and a copy die, electroforming die for this method, and copy die - Google Patents

Method for electroforming a studded plate and a copy die, electroforming die for this method, and copy die Download PDF

Info

Publication number
WO2006112696A2
WO2006112696A2 PCT/NL2006/000183 NL2006000183W WO2006112696A2 WO 2006112696 A2 WO2006112696 A2 WO 2006112696A2 NL 2006000183 W NL2006000183 W NL 2006000183W WO 2006112696 A2 WO2006112696 A2 WO 2006112696A2
Authority
WO
WIPO (PCT)
Prior art keywords
elevations
die
plate
electroforming
section
Prior art date
Application number
PCT/NL2006/000183
Other languages
French (fr)
Other versions
WO2006112696A3 (en
Inventor
Harm Gerrit Knol
Lars Cristian Herzbach
Original Assignee
Stork Veco B.V.
Heidelberger Druckmaschinen Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stork Veco B.V., Heidelberger Druckmaschinen Ag filed Critical Stork Veco B.V.
Priority to EP06732990A priority Critical patent/EP1871925B1/en
Publication of WO2006112696A2 publication Critical patent/WO2006112696A2/en
Publication of WO2006112696A3 publication Critical patent/WO2006112696A3/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/10Moulds; Masks; Masterforms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H29/00Delivering or advancing articles from machines; Advancing articles to or into piles
    • B65H29/52Stationary guides or smoothers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/20Separation of the formed objects from the electrodes with no destruction of said electrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2404/00Parts for transporting or guiding the handled material
    • B65H2404/50Surface of the elements in contact with the forwarded or guided material

Definitions

  • a first aspect of the present invention relates to a method for electroforming a plate having a working side which is provided with separate elevations.
  • a plate of this type which is also referred to in this description as a studded plate, can be used, inter alia, as a conveyor surface for conveying substrates, such as sheets of paper, where a small contact surface area between the conveyor surface and the substrate is desirable.
  • a studded plate of this type can also be used as a component of a mould for forming in particular three- dimensional objects.
  • a plate with a working side which is provided with separate elevations are known.
  • a plate of this type is generally produced by machining or deforming a surface of a flat plate so as to form the elevations.
  • One significant drawback of the studded plate produced in this way is that the elevations are not all of the same height with respect to the surface of the plate obtained by machining, which is undesirable.
  • a first object of the present invention is to satisfy this demand.
  • the method for electroforming a plate having a working side which is provided with separate elevations comprises the steps of: providing a flat conductive electroforming die with insulating regions that are separated from one another; electrolytically depositing a screen layer, which comprises a network of dykes, which dykes delimit screen openings, of metal on the electroforming die, the dykes, as seen in section, having at least one convex surface part; passivating the uncovered surface of the screen layer; electrolytically depositing a continuous metal layer on the passivated surface of the screen layer, in such a manner that at least the screen openings of the screen layer are filled and the passivated surface of the screen layer is completely covered, separating the continuous metal layer having a working side provided with separate elevations, which elevations, when seen in section, have at least one concave surface part, as the studded plate from the screen layer.
  • the first two steps correspond to a standard electroforming method for the production of flat screen material.
  • An electroforming die with insulating regions of this type can be produced, for example, by applying insulating regions to a flat conductive electroforming die, so that the insulating regions form small elevations with respect to the conductive surface of the die. Insulating regions of this type are often formed by applying a photosensitive resist material to the flat die, followed by exposing it through a film, which film is provided with a generally regular pattern of the insulating regions to be formed.
  • the unexposed photoresist parts are removed, so that insulating regions of photoresist material remain behind on the electroforming die. Insulating regions of this type are also known as resist islands. Another possible option is for insulating regions to be arranged in recesses (for example etched recesses) formed in the surface of the electroforming die, so that the latter has a flat surface without elevations.
  • the electroforming die is placed in an electroplating bath of an electroformable metal or metal alloy and connected as electrode (cathode) . In this way, metal from the electroplating bath is deposited on the conductive parts of the electroforming die. This deposition of the screen layer is continued until the screen layer deposited in this way has reached the desired thickness.
  • the result is a screen layer of metal which comprises dykes that delimit screen openings. Consequently, the dykes, as seen in section, have at least one convex surface part which delimits the screen openings.
  • the term "in section” means a section taken in the thickness direction of the plate, corresponding to the height direction of the elevations or recesses .
  • the screen layer is not removed from the electroforming die, but rather a passivation layer is provided on the uncovered surface of the screen layer.
  • suitable passivating agents include potassium dichromate, potassium permanganate, chromium or gold.
  • the electroforming die with the passivated screen layer on it is placed in an electroplating bath again, which bath contains an electroformable metal or metal alloy.
  • This metal or alloy may optionally be identical to the metal or metal alloy forming the first screen layer.
  • a subsequent metal layer is deposited on the passivated surface of the screen layer, with the conditions, such as duration, being selected in such a way that a continuous metal layer is deposited, completely filling at least the screen openings and completely covering the passivated surface, preferably until a planar uncovered surface, also known as the growth front, is achieved.
  • the continuous metal layer which has been formed is removed, as the intended studded plate, from the first screen layer.
  • the metal parts of the continuous metal layer which have filled the screen openings form the elevations of the studded plate, which on the one hand are of a uniform height and on the other hand have a characteristic surface.
  • this characteristic surface comprises a concave surface part, as seen in section. This may be a continuous surface without sharp transitions at one or more corners, primarily depending on the shape and dimensions of the insulating regions.
  • the elevations of the studded plate form a direct reproduction of the recesses or screen openings in the screen layer.
  • the studded plate obtained in this way has a working side with elevations, the tops of which are at the same height.
  • the regions of the studded plate between the elevations are planar.
  • the insulating regions will usually be arranged as islands of identical dimensions and often also in a fixed pattern, for example hexagonally, orthogonally or the like.
  • the elevations which are ultimately formed in the studded plate are then arranged in the same pattern.
  • a convex surface part of a dyke of the screen layer more preferably comprises a part of a circle of constant radius, as a result of ideal growth of the first screen layer.
  • the fourth and fifth steps of the method according to the invention described above can be repeated in order to produce a subsequent studded plate.
  • the electroforming die with the screen layer of which the surface has been passivated is, however, fragile, and consequently there is a not inconsiderable risk of it being damaged.
  • a second aspect of the invention provides for the production of a copy die for the production of a studded plate.
  • This copy die comprises a plate with a top side which is provided with separate recesses, which recesses, as seen in section, comprise at least one convex surface part. These recesses correspond to the intended elevations in the studded plate.
  • the underside of the copy die is generally planar.
  • the method in accordance with this aspect of the invention to this end comprises the steps of electrolytically depositing a metal layer on an electrically conductive plate with conductive separate elevations, which elevations, as seen in section, comprise at least one concave surface part, after which the deposited metal layer, as the copy die, is separated from the said plate.
  • the said electrically conductive plate is preferably the product of the method in accordance with the first aspect of the invention.
  • the copy die preferably also has recesses, of which the wall parts defining the recesses comprise a convex surface part as part of a circle of constant radius.
  • a method for electroforming a studded plate of this type in accordance with a third aspect of the invention comprises the following steps: passivation of the surface of the copy die obtained in accordance with the second aspect of the invention, followed by electrolytic deposition of a further metal layer on the passivated surface of the copy die, in such a manner that at least the recesses are filled and the passivated surface is completely covered, and separating the further metal layer, as the said studded plate, from the copy die.
  • passivation of the surface of the copy die obtained in accordance with the second aspect of the invention followed by electrolytic deposition of a further metal layer on the passivated surface of the copy die, in such a manner that at least the recesses are filled and the passivated surface is completely covered, and separating the further metal layer, as the said studded plate, from the copy die.
  • the metal from which the screen layer, the continuous metal layer and the further metal layer are obtained may be any electroformable metal or metal alloy, in particular copper and preferably nickel.
  • Suitable galvanic baths comprise nickel-containing or copper-containing baths. Controlling the bath composition allows the studded plate to be produced with a smooth surface or a rougher surface.
  • an undoped nickel bath i.e. a nickel bath without brightener, can produce a rougher product compared to a product produced from a nickel bath doped with brightener.
  • a further aspect of the invention provides an electroforming die for producing a copy die, which comprises an electrically conductive plate having a top side provided with separate elevations, which elevations, as seen in section, have at least one concave surface part, and preferably a planar underside.
  • Yet another aspect of the invention relates to a copy die for producing a plate having a working side provided with separate elevations, which copy die comprises an electrically conductive plate having a top side provided with recesses, which recesses, as seen in section, comprise at least one convex surface part.
  • the copy die can therefore be used as an electroforming die producing the said studded plates.
  • Another use is for the injection-moulding or press-moulding of products made from plastic, in which case the studded plate is used as part of the mould.
  • the studded plates according to the invention do not have any screen openings, but rather have a continuous surface.
  • the products are electroformed from an electroformable metal or metal alloy.
  • the separate elevations or separate recesses are of virtually uniform height or depth, with a tolerance of the order of magnitude of one micrometre.
  • the elevations or recesses can be arranged in a regular pattern, although an irregular (stochastic) pattern can also be used.
  • the insulating regions are circular in cross section. The result of this is that the elevations are of virtually ideal circular cross section at any height. Other cross sections, such as rectangular, triangular, hexagonal, elliptical, are also conceivable.
  • the separate elevations are dots, advantageously dots having dimensions in the order of magnitude of e.g. about one to several tens of micrometres, more preferably spaced apart at a regular distance.
  • the relatively small dots spaced apart at regular intervals provide a small contact area in comparison with for example linear ridges extending over the whole surface of a plate.
  • the invention also relates to the use of a plate having a working side provided with separate elevations, which elevations, as seen in section, have at least one concave surface part, as conveyor surface for conveying substrates, such as sheets of paper.
  • a conveyor surface for conveying substrates, such as sheets of paper the conveyor surface comprising a plate having a working side provided with separate elevations, which elevations, as seen in section, have at least one concave surface part.
  • Figure 1 shows an example of an electroforming die with a regular pattern of insulating regions of photoresist
  • Figure 2 shows an insulating photoresist island in detail
  • Figure 3 shows an embodiment of a studded plate obtained using the electroforming die shown in Figure 1;
  • Figure 4 shows a detail of an elevation of the studded plate illustrated in Figure 3;
  • Figures 5-10 show a number of steps of a method according to the invention for the production of a studded plate;
  • Figures 11-13 show a number of steps of a method according to the invention for the production of a copy die .
  • Figure 1 shows a planar electroforming die 10 on which insulating photoresist islands 12 with a circular cross section are arranged.
  • the photoresist islands 12 are arranged in an orthogonal pattern.
  • the section through the photoresist islands is, for example, in the range from 75 to 100 micrometres, for example 85 micrometres.
  • the height of the photoresist islands is in the range from a few micrometres to about ten micrometres, for example 5 micrometres, while the distance between two adjacent photoresist islands of a basic form of the orthogonal pattern is of the order of magnitude of 150 to a few hundred micrometres, for example 200 micrometres.
  • Figure 2 shows a detail of a photoresist island 12 of this type, having a diameter d r and a height h r .
  • Figure 3 shows a plan view of the studded plate 20 which can be produced with the aid of the electroforming die 10 illustrated in Figures 1 and 2, as will be explained in more detail below.
  • the elevations 22, indicated by dots in Figure 3 are arranged in a pattern which corresponds to the orthogonal pattern of the insulating regions 12 of the electroforming die 10 used.
  • FIG 4 shows an elevation 22 in detail.
  • the elevation 22 has a circular base 24 and, as seen in section, a concave outer surface 26.
  • This concave outer surface 26 describes part of a circle of constant radius r p .
  • the diameter d t of the planar top 28 of the elevation 22 is, for example, 15 micrometres, for a base diameter of 85 micrometres and a height of 35 micrometres. In other words, growth radius r p is likewise 35 micrometres.
  • Figures 5-10 show the steps involved in the production of a studded plate of this type by means of a preferred method according to the invention.
  • FIG. 5 shows a plan view of part of an embodiment of an electroforming die 10.
  • the electroforming die 10 comprises a planar plate 14 of electrically conductive material, on which circular regions 12 of insulating material, such as photoresist, are provided, i.e. in this embodiment the regions 12 form elevations of a low height on the plate 14.
  • Figure 6 shows the electroforming die 10 from Figure 5 in section.
  • the electroforming die 10 is connected as cathode in an electroplating bath, for example of nickel.
  • an electroplating bath for example of nickel.
  • Figure 7 shows the electroforming die 10 with resist islands 12 and screen layer 18 deposited thereon.
  • the screen layer 18 comprises a network of dykes 30 which delimit screen openings 32.
  • the dykes 30 have partly grown over the insulating regions 12.
  • metal such as nickel
  • metal is once again deposited on top of the screen layer 18, with the electroforming die 10 with screen layer 18 being placed in an electroplating bath and connected as cathode .
  • a continuous metal layer is formed as studded plate 20 on the screen layer 18, filling the screen openings 32 and covering the entire surface. This deposition is continued until the desired thickness has been reached, and generally a flat growth front has been formed.
  • Fig. 9 shows this continuous metal layer in section as studded plate 20 with a planar underside 50, and with a working side 52 after it has been separated from the screen layer 18, while Figure 10 shows a plan view of this product.
  • the elevations 22 are of the shape shown in detail in Fig. 4, with a concave surface 26.
  • Figures 11-13 show steps involved in producing a copy die using the product of Figure 9.
  • metal is deposited in an galvanic bath, so that the recesses 38 between the elevations 22 in the product 20 are completely filled and also the elevations 22 themselves are covered.
  • an electrically conductive copy die 40 is obtained, the shape of the deposition surface 42 of this copy die 40, with recesses 44, corresponding to the deposition surface of the assembly of electroforming die, photoresist islands and screen layer, as illustrated in Figure 7.
  • This copy die 40 can be used in the same way as the above-described assembly for the production of studded plates.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

Method for electroforming a plate (20) having a working side provided with separate elevations (22), which method comprises the steps of: providing a flat conductive electroforming die (10) with insulating regions (12) that are separated from one another; electrolytically depositing a screen layer (18), which comprises a network of dykes (30), which dykes (30) delimit screen openings (32), of metal on the electroforming die (10), the dykes (30), as seen in section, having at least one convex surface part; passivating the uncovered surface of the screen layer (18); electrolytically depositing a continuous metal layer (20) on the passivated surface of the screen layer (18), in such a manner that at least the screen openings (32) are filled and the passivated surface is completely covered, separating the continuous metal layer (20) having a working side (52) provided with separate elevations (22), which elevations, when seen in section, have at least one concave surface part (26), as the said plate, from the screen layer (18).

Description

Method for electroforming a studded plate and a copy die, electroforming die for this method, and copy die
A first aspect of the present invention relates to a method for electroforming a plate having a working side which is provided with separate elevations. A plate of this type, which is also referred to in this description as a studded plate, can be used, inter alia, as a conveyor surface for conveying substrates, such as sheets of paper, where a small contact surface area between the conveyor surface and the substrate is desirable. A studded plate of this type can also be used as a component of a mould for forming in particular three- dimensional objects.
A plate with a working side which is provided with separate elevations are known. A plate of this type is generally produced by machining or deforming a surface of a flat plate so as to form the elevations. One significant drawback of the studded plate produced in this way is that the elevations are not all of the same height with respect to the surface of the plate obtained by machining, which is undesirable.
Therefore, there is a demand for a plate with a working side provided with separate elevations which are of uniform height with respect to the remainder of the surface of the working side of the plate, and for a method for the production thereof.
A first object of the present invention is to satisfy this demand. The method for electroforming a plate having a working side which is provided with separate elevations according to the invention to this end comprises the steps of: providing a flat conductive electroforming die with insulating regions that are separated from one another; electrolytically depositing a screen layer, which comprises a network of dykes, which dykes delimit screen openings, of metal on the electroforming die, the dykes, as seen in section, having at least one convex surface part; passivating the uncovered surface of the screen layer; electrolytically depositing a continuous metal layer on the passivated surface of the screen layer, in such a manner that at least the screen openings of the screen layer are filled and the passivated surface of the screen layer is completely covered, separating the continuous metal layer having a working side provided with separate elevations, which elevations, when seen in section, have at least one concave surface part, as the studded plate from the screen layer.
In the method according to this aspect of the invention, the first two steps correspond to a standard electroforming method for the production of flat screen material. This involves the use of an electroforming die which is provided with insulating regions. An electroforming die with insulating regions of this type can be produced, for example, by applying insulating regions to a flat conductive electroforming die, so that the insulating regions form small elevations with respect to the conductive surface of the die. Insulating regions of this type are often formed by applying a photosensitive resist material to the flat die, followed by exposing it through a film, which film is provided with a generally regular pattern of the insulating regions to be formed. After the exposure step, the unexposed photoresist parts are removed, so that insulating regions of photoresist material remain behind on the electroforming die. Insulating regions of this type are also known as resist islands. Another possible option is for insulating regions to be arranged in recesses (for example etched recesses) formed in the surface of the electroforming die, so that the latter has a flat surface without elevations. Then, the electroforming die is placed in an electroplating bath of an electroformable metal or metal alloy and connected as electrode (cathode) . In this way, metal from the electroplating bath is deposited on the conductive parts of the electroforming die. This deposition of the screen layer is continued until the screen layer deposited in this way has reached the desired thickness. The result is a screen layer of metal which comprises dykes that delimit screen openings. Consequently, the dykes, as seen in section, have at least one convex surface part which delimits the screen openings. In the context of the present description, the term "in section" means a section taken in the thickness direction of the plate, corresponding to the height direction of the elevations or recesses . When producing a normal screen e.g. for use in screenprinting, this screen layer can then be removed from the electroforming die as a basic skeleton, which basic skeleton is then grown further, or this screen layer can continue to be grown on the electroforming die itself until it reaches the desired thickness and then removed from the die. By contrast, in the method according to the invention, the screen layer is not removed from the electroforming die, but rather a passivation layer is provided on the uncovered surface of the screen layer. Examples of suitable passivating agents include potassium dichromate, potassium permanganate, chromium or gold.
After this passivation step has been carried out, the electroforming die with the passivated screen layer on it is placed in an electroplating bath again, which bath contains an electroformable metal or metal alloy. This metal or alloy may optionally be identical to the metal or metal alloy forming the first screen layer. As a result, a subsequent metal layer is deposited on the passivated surface of the screen layer, with the conditions, such as duration, being selected in such a way that a continuous metal layer is deposited, completely filling at least the screen openings and completely covering the passivated surface, preferably until a planar uncovered surface, also known as the growth front, is achieved. In a final step, the continuous metal layer which has been formed is removed, as the intended studded plate, from the first screen layer. On account of the use of the electroforming method explained above, the metal parts of the continuous metal layer which have filled the screen openings form the elevations of the studded plate, which on the one hand are of a uniform height and on the other hand have a characteristic surface. Specifically, this characteristic surface comprises a concave surface part, as seen in section. This may be a continuous surface without sharp transitions at one or more corners, primarily depending on the shape and dimensions of the insulating regions. The elevations of the studded plate form a direct reproduction of the recesses or screen openings in the screen layer. The studded plate obtained in this way has a working side with elevations, the tops of which are at the same height. The regions of the studded plate between the elevations are planar.
In the first method step, the insulating regions will usually be arranged as islands of identical dimensions and often also in a fixed pattern, for example hexagonally, orthogonally or the like. The elevations which are ultimately formed in the studded plate are then arranged in the same pattern.
A convex surface part of a dyke of the screen layer more preferably comprises a part of a circle of constant radius, as a result of ideal growth of the first screen layer.
After the second continuous metal layer has been removed, the fourth and fifth steps of the method according to the invention described above can be repeated in order to produce a subsequent studded plate. The electroforming die with the screen layer of which the surface has been passivated is, however, fragile, and consequently there is a not inconsiderable risk of it being damaged.
To avoid this drawback, a second aspect of the invention provides for the production of a copy die for the production of a studded plate. This copy die comprises a plate with a top side which is provided with separate recesses, which recesses, as seen in section, comprise at least one convex surface part. These recesses correspond to the intended elevations in the studded plate. The underside of the copy die is generally planar. The method in accordance with this aspect of the invention to this end comprises the steps of electrolytically depositing a metal layer on an electrically conductive plate with conductive separate elevations, which elevations, as seen in section, comprise at least one concave surface part, after which the deposited metal layer, as the copy die, is separated from the said plate. The said electrically conductive plate is preferably the product of the method in accordance with the first aspect of the invention. The copy die preferably also has recesses, of which the wall parts defining the recesses comprise a convex surface part as part of a circle of constant radius.
This copy die can then in turn be used to produce studded plates. For this purpose, a method for electroforming a studded plate of this type in accordance with a third aspect of the invention comprises the following steps: passivation of the surface of the copy die obtained in accordance with the second aspect of the invention, followed by electrolytic deposition of a further metal layer on the passivated surface of the copy die, in such a manner that at least the recesses are filled and the passivated surface is completely covered, and separating the further metal layer, as the said studded plate, from the copy die. In this way, it is easy for the original die to be kept as a "master", while the actual production of the studded plates is carried out using a copy die.
As has already been explained above, the metal from which the screen layer, the continuous metal layer and the further metal layer are obtained may be any electroformable metal or metal alloy, in particular copper and preferably nickel. Suitable galvanic baths comprise nickel-containing or copper-containing baths. Controlling the bath composition allows the studded plate to be produced with a smooth surface or a rougher surface. By way of example, an undoped nickel bath, i.e. a nickel bath without brightener, can produce a rougher product compared to a product produced from a nickel bath doped with brightener.
A further aspect of the invention provides an electroforming die for producing a copy die, which comprises an electrically conductive plate having a top side provided with separate elevations, which elevations, as seen in section, have at least one concave surface part, and preferably a planar underside.
Yet another aspect of the invention relates to a copy die for producing a plate having a working side provided with separate elevations, which copy die comprises an electrically conductive plate having a top side provided with recesses, which recesses, as seen in section, comprise at least one convex surface part. The copy die can therefore be used as an electroforming die producing the said studded plates. Another use is for the injection-moulding or press-moulding of products made from plastic, in which case the studded plate is used as part of the mould.
One important difference compared to screen materials is that the studded plates according to the invention do not have any screen openings, but rather have a continuous surface.
The products are electroformed from an electroformable metal or metal alloy. The separate elevations or separate recesses are of virtually uniform height or depth, with a tolerance of the order of magnitude of one micrometre. The elevations or recesses can be arranged in a regular pattern, although an irregular (stochastic) pattern can also be used. In a preferred embodiment, the insulating regions are circular in cross section. The result of this is that the elevations are of virtually ideal circular cross section at any height. Other cross sections, such as rectangular, triangular, hexagonal, elliptical, are also conceivable. Preferably, the separate elevations are dots, advantageously dots having dimensions in the order of magnitude of e.g. about one to several tens of micrometres, more preferably spaced apart at a regular distance. The relatively small dots spaced apart at regular intervals, provide a small contact area in comparison with for example linear ridges extending over the whole surface of a plate.
According to a still further aspect the invention also relates to the use of a plate having a working side provided with separate elevations, which elevations, as seen in section, have at least one concave surface part, as conveyor surface for conveying substrates, such as sheets of paper. Another aspect of the invention relates to a conveyor surface for conveying substrates, such as sheets of paper, the conveyor surface comprising a plate having a working side provided with separate elevations, which elevations, as seen in section, have at least one concave surface part.
The invention is explained below with reference to the appended drawings, wherein:
Figure 1 shows an example of an electroforming die with a regular pattern of insulating regions of photoresist; Figure 2 shows an insulating photoresist island in detail;
Figure 3 shows an embodiment of a studded plate obtained using the electroforming die shown in Figure 1;
Figure 4 shows a detail of an elevation of the studded plate illustrated in Figure 3; Figures 5-10 show a number of steps of a method according to the invention for the production of a studded plate; and
Figures 11-13 show a number of steps of a method according to the invention for the production of a copy die .
Figure 1 shows a planar electroforming die 10 on which insulating photoresist islands 12 with a circular cross section are arranged. The photoresist islands 12 are arranged in an orthogonal pattern. The section through the photoresist islands is, for example, in the range from 75 to 100 micrometres, for example 85 micrometres. The height of the photoresist islands is in the range from a few micrometres to about ten micrometres, for example 5 micrometres, while the distance between two adjacent photoresist islands of a basic form of the orthogonal pattern is of the order of magnitude of 150 to a few hundred micrometres, for example 200 micrometres.
Figure 2 shows a detail of a photoresist island 12 of this type, having a diameter dr and a height hr.
Figure 3 shows a plan view of the studded plate 20 which can be produced with the aid of the electroforming die 10 illustrated in Figures 1 and 2, as will be explained in more detail below. The elevations 22, indicated by dots in Figure 3, are arranged in a pattern which corresponds to the orthogonal pattern of the insulating regions 12 of the electroforming die 10 used.
Figure 4 shows an elevation 22 in detail. The elevation 22 has a circular base 24 and, as seen in section, a concave outer surface 26. This concave outer surface 26 describes part of a circle of constant radius rp. The diameter dt of the planar top 28 of the elevation 22 is, for example, 15 micrometres, for a base diameter of 85 micrometres and a height of 35 micrometres. In other words, growth radius rp is likewise 35 micrometres. Figures 5-10 show the steps involved in the production of a studded plate of this type by means of a preferred method according to the invention.
Figure 5 shows a plan view of part of an embodiment of an electroforming die 10. The electroforming die 10 comprises a planar plate 14 of electrically conductive material, on which circular regions 12 of insulating material, such as photoresist, are provided, i.e. in this embodiment the regions 12 form elevations of a low height on the plate 14.
Figure 6 shows the electroforming die 10 from Figure 5 in section.
The electroforming die 10 is connected as cathode in an electroplating bath, for example of nickel. When electric current is passed through the electroplating bath, first of all metal is deposited between the insulating regions 12 on the uncovered conductive tracks 16 of the electroforming die 10, and then the insulating regions 12 are also partly overgrown.
Figure 7 shows the electroforming die 10 with resist islands 12 and screen layer 18 deposited thereon. The screen layer 18 comprises a network of dykes 30 which delimit screen openings 32. The dykes 30 have partly grown over the insulating regions 12.
After the uncovered surface of the screen layer 18 has been passivated, metal, such as nickel, is once again deposited on top of the screen layer 18, with the electroforming die 10 with screen layer 18 being placed in an electroplating bath and connected as cathode . In this way, a continuous metal layer is formed as studded plate 20 on the screen layer 18, filling the screen openings 32 and covering the entire surface. This deposition is continued until the desired thickness has been reached, and generally a flat growth front has been formed. Cf. Fig. 8.
Fig. 9 shows this continuous metal layer in section as studded plate 20 with a planar underside 50, and with a working side 52 after it has been separated from the screen layer 18, while Figure 10 shows a plan view of this product. The elevations 22 are of the shape shown in detail in Fig. 4, with a concave surface 26.
Figures 11-13 show steps involved in producing a copy die using the product of Figure 9. After the studded plate 20 has been passivated, for example using chromium, metal is deposited in an galvanic bath, so that the recesses 38 between the elevations 22 in the product 20 are completely filled and also the elevations 22 themselves are covered. After separation, cf. Figure 13, an electrically conductive copy die 40 is obtained, the shape of the deposition surface 42 of this copy die 40, with recesses 44, corresponding to the deposition surface of the assembly of electroforming die, photoresist islands and screen layer, as illustrated in Figure 7. This copy die 40 can be used in the same way as the above-described assembly for the production of studded plates.

Claims

1. Method for electroforming a plate having a working side and a top side provided with separate elevations, which method comprises the steps of: providing a flat conductive electroforming die (10) with insulating regions (12) that are separated from one another; electrolytically depositing a screen layer (18), which comprises a network of dykes (30) , which dykes (30) delimit screen openings (32) , of metal on the electroforming die (10) , the dykes (30) , as seen in section, having at least one convex surface part; passivating the uncovered surface of the screen layer (18) ; electrolytically depositing a continuous metal layer (20) on the passivated surface of the screen layer (18), in such a manner that at least the screen openings (32) are filled and the passivated surface is completely covered, separating the continuous metal layer (20) having a working side (52) provided with separate elevations (22), which elevations, when seen in section, have at least one concave surface part (26) , as the said plate, from the screen layer (18) .
2. Method according to claim 1, in which a convex surface part comprises a part of a circle of constant radius.
3. Method for electroforming a copy die, which die comprises a plate with a top side provided with separate recesses, which recesses, as seen in section, comprise at least one convex surface part, which method comprises the steps of electrolytically depositing a metal layer (40) on an electrically conductive plate (20) with separate elevations (22), which elevations (22), as seen in section, have at least one concave surface part (26) ; separating the deposited metal layer (40) having a top side provided with separate recesses (44) , which recesses (44) , as seen in section, comprise at least one convex surface part, as the copy die from the said plate (20) .
4. Method according to claim 3, in which the electrically conductive plate with elevations is the product (20) of the method according to claim 1.
5. Method according to claim 3 or 4, in which a concave surface part comprises a part of a circle of constant radius.
6. Method for electroforming a plate having a working side, provided with separate elevations, which method comprises the steps of: passivating the surface of the copy die (40) obtained as described in one of claims 3-5, electrolytically depositing a further metal layer (20) on the passivated surface of the copy die (40) , in such a manner that at least the recesses are filled and the passivated surface is completely covered, separating the further metal layer (20) having a working side (52) provided with separate elevations (22) , which elevations (22) , as seen in section, have at least one concave surface part (26) , as the said plate from the copy die.
7. Method according to one of the preceding claims, in which the electrolytic deposition is carried out in a bath liquid which comprises nickel and brightener.
8. Electroforming die for producing a copy die, comprising an electrically conductive plate (20) having a top side provided with separate elevations (22), which elevations (22), as seen in section, have at least one concave surface part (26) .
9. Copy die for producing a plate having a working side provided with separate elevations, which die comprises an electrically conductive plate (40) having a top side provided with recesses (44) , which recesses (44) , as seen in section, comprise at least one convex surface part.
10. Use of a plate having a working side (52) provided with separate elevations (22) which elevations (22) , as seen in section, have at least one concave surface part (26) , as conveyor surface for conveying substrates, such as sheets of paper.
11. Conveyor surface for conveying substrates, such as sheets of paper, the conveyor surface comprising a plate having a working side (52) provided with separate elevations (22) which elevations (22) , as seen in section, have at least one concave surface part (26) .
PCT/NL2006/000183 2005-04-21 2006-04-07 Method for electroforming a studded plate and a copy die, electroforming die for this method, and copy die WO2006112696A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06732990A EP1871925B1 (en) 2005-04-21 2006-04-07 Method for electroforming a studded plate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1028835A NL1028835C2 (en) 2005-04-21 2005-04-21 Method for electroforming a stud plate and a copy die, electroforming die therefor, and copy die.
NL1028835 2005-04-21

Publications (2)

Publication Number Publication Date
WO2006112696A2 true WO2006112696A2 (en) 2006-10-26
WO2006112696A3 WO2006112696A3 (en) 2007-06-07

Family

ID=34975037

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2006/000183 WO2006112696A2 (en) 2005-04-21 2006-04-07 Method for electroforming a studded plate and a copy die, electroforming die for this method, and copy die

Country Status (3)

Country Link
EP (1) EP1871925B1 (en)
NL (1) NL1028835C2 (en)
WO (1) WO2006112696A2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008013322A1 (en) 2007-03-30 2008-10-02 Heidelberger Druckmaschinen Ag Printing unit of a substrate processing machine
DE102008019254A1 (en) 2007-05-16 2008-11-20 Heidelberger Druckmaschinen Ag Substrate contacting surface with a surface structuring
DE102010009225A1 (en) 2009-03-13 2010-09-16 Heidelberger Druckmaschinen Ag Method for producing a pseudo-stochastic template surface
CN114043798A (en) * 2021-11-23 2022-02-15 昆山良品丝印器材有限公司 Processing technology of silk screen printing plate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3543362A (en) 1966-04-06 1970-12-01 Richard Steding Abrading device or file
EP0152363A2 (en) 1984-02-07 1985-08-21 Kuhn S.A. Silage block cutting apparatus
US5807227A (en) 1996-04-09 1998-09-15 Heidelberg Harris Inc. Fold-off guiding method and device for a folding apparatus
US20020063061A1 (en) 2000-11-30 2002-05-30 Yasuhiro Doi Method of reproducing a die and property check method of the same
US20020070495A1 (en) 2000-12-07 2002-06-13 Brother Kogyo Kabushiki Kaisha Sheet feeder
US20020117799A1 (en) 2001-02-23 2002-08-29 Michael Gustafson Non-planar single sheet separator wall and apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4564423A (en) * 1984-11-28 1986-01-14 General Dynamics Pomona Division Permanent mandrel for making bumped tapes and methods of forming
JP3554228B2 (en) * 1998-07-29 2004-08-18 キヤノン株式会社 Microlens mold or mold master, and method for producing them

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3543362A (en) 1966-04-06 1970-12-01 Richard Steding Abrading device or file
EP0152363A2 (en) 1984-02-07 1985-08-21 Kuhn S.A. Silage block cutting apparatus
US5807227A (en) 1996-04-09 1998-09-15 Heidelberg Harris Inc. Fold-off guiding method and device for a folding apparatus
US20020063061A1 (en) 2000-11-30 2002-05-30 Yasuhiro Doi Method of reproducing a die and property check method of the same
US20020070495A1 (en) 2000-12-07 2002-06-13 Brother Kogyo Kabushiki Kaisha Sheet feeder
US20020117799A1 (en) 2001-02-23 2002-08-29 Michael Gustafson Non-planar single sheet separator wall and apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008013322A1 (en) 2007-03-30 2008-10-02 Heidelberger Druckmaschinen Ag Printing unit of a substrate processing machine
US8413575B2 (en) 2007-03-30 2013-04-09 Heidelberger Druckmaschinen Ag Printing unit of a printing material processing machine and method and machine for treating printing material
DE102008019254A1 (en) 2007-05-16 2008-11-20 Heidelberger Druckmaschinen Ag Substrate contacting surface with a surface structuring
US8714085B2 (en) 2007-05-16 2014-05-06 Heidelberger Druckmaschinen Ag Surface with a surface structure for contacting printing material, machine for processing material and method for producing areas with a surface structure
DE102008019254B4 (en) * 2007-05-16 2015-06-25 Heidelberger Druckmaschinen Ag Substrate contacting surface with a surface structuring
DE102010009225A1 (en) 2009-03-13 2010-09-16 Heidelberger Druckmaschinen Ag Method for producing a pseudo-stochastic template surface
US8462391B2 (en) 2009-03-13 2013-06-11 Heidelberger Druckmaschinen Ag Method for producing a pseudo-stochastic master surface, master surface, method for producing a cylinder cover, cylinder cover, machine processing printing material, method for producing printed products and method for microstamping printing products
DE102010009225B4 (en) * 2009-03-13 2019-10-31 Heidelberger Druckmaschinen Ag Method for producing an elevator of a printing substrate contacting cylinder
CN114043798A (en) * 2021-11-23 2022-02-15 昆山良品丝印器材有限公司 Processing technology of silk screen printing plate

Also Published As

Publication number Publication date
WO2006112696A3 (en) 2007-06-07
EP1871925B1 (en) 2012-07-18
NL1028835C2 (en) 2006-10-24
EP1871925A2 (en) 2008-01-02

Similar Documents

Publication Publication Date Title
JP4744790B2 (en) Deposition mask, deposition mask frame assembly, and manufacturing method thereof
US6036832A (en) Electroforming method, electroforming mandrel and electroformed product
US6350360B1 (en) Method of fabricating a 3-dimensional tool master
WO2010035417A1 (en) Electroforming method
US4839001A (en) Orifice plate and method of fabrication
EP1871925A2 (en) Method for electroforming a studded plate and a copy die, electroforming die for this method, and copy die
JP3851789B2 (en) Mandrel and orifice plate electroformed using the same
CN105992463A (en) Method for manufacturing step circuit board and step circuit board
DE4231742C2 (en) Process for the galvanic molding of plate-like bodies provided with structures
WO2018016362A1 (en) Metal electrodeposition cathode plate and production method therefor
JP4650113B2 (en) Laminated structure, donor substrate, and manufacturing method of laminated structure
US5462648A (en) Method for fabricating a metal member having a plurality of fine holes
EP0894157B1 (en) Electroforming method, electroforming mandrel and electroformed product
JPH05220920A (en) Production of metal mask plate for printing
JPH0692053A (en) Production of metal mask plate for printing
JP2008208431A (en) Electroforming mold, method of manufacturing electroforming mold and method of manufacturing electroformed component
CN104024487A (en) Production method for transfer mold, transfer mold produced using same, and component produced using said transfer mold
CN103974541A (en) Metal circuit manufacturing method and printed circuit board
JP2992642B2 (en) Manufacturing method of screen printing mask
KR20190005432A (en) Method and workpiece of electroforming
EP1568803B1 (en) Electroforming method for producing objects with a high degree of accuracy
JPH09300573A (en) Electrocast thin metal plate and manufacture thereof
WO2002000966A1 (en) Electroforming die, method of manufacturing the same, application thereof and electroformed products
JP4113906B2 (en) Manufacturing method of mesh-integrated metal mask
KR102175099B1 (en) Method for manufacturing a fine metal mask and a fine metal mask threfore

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2006732990

Country of ref document: EP

NENP Non-entry into the national phase in:

Ref country code: DE

NENP Non-entry into the national phase in:

Ref country code: RU

WWP Wipo information: published in national office

Ref document number: 2006732990

Country of ref document: EP