WO2006111805A1 - Photosource optique aux axes decales - Google Patents

Photosource optique aux axes decales Download PDF

Info

Publication number
WO2006111805A1
WO2006111805A1 PCT/IB2006/000802 IB2006000802W WO2006111805A1 WO 2006111805 A1 WO2006111805 A1 WO 2006111805A1 IB 2006000802 W IB2006000802 W IB 2006000802W WO 2006111805 A1 WO2006111805 A1 WO 2006111805A1
Authority
WO
WIPO (PCT)
Prior art keywords
lens
reflector
axis
symmetry axis
light emitting
Prior art date
Application number
PCT/IB2006/000802
Other languages
English (en)
Inventor
Vladimir Semenovich Abramov
Alexander Valerievich Shishov
Nikolay Valentinovich Scherbakov
Original Assignee
Acol Technologies Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acol Technologies Sa filed Critical Acol Technologies Sa
Publication of WO2006111805A1 publication Critical patent/WO2006111805A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the following inventions disclosure is generally concerned with lighting and light source systems and specifically concerned with packaging for light emitting semiconductors which promotes an output beam having a directional bias.
  • LEDs are used to form lighting systems of many types.
  • One example of particular interest is very large display screens for sporting events. These display screens are comprised of hundreds of thousands of elements in a two dimensional array. Sports fans viewing the display from great distances can see video images presented on thereon. In these circumstances, the relative position between the display and the viewers suggests a preferred output beam direction for each pixel element. It is not always efficient to have the LEDs produce a beam perpendicular to the display plane. Indeed, if a display plane is oriented vertically, then it is sometimes preferred that the majority of the light output be directed in a slightly downward direction; these displays are typically located higher than the viewers who look at them.
  • Figure 1 illustrates a planar display screen 1 having a plurality of LED elements (five). These LEDs have a planar baseplate 3 which lies on the tilted seats 4 of the mounting system.
  • the LED lens 5 produces a beam axis normal to the mounting plane or perpendicular and orthogonal with respect to the baseplate.
  • the beam 7 thus has a slight downward bias with respect to the display plane.
  • the display of Figure 1 is best viewed in the far field by a person looking slightly up towards the display.
  • These semiconductor lighting systems are generally comprised of semiconductor die and supporting optomechanical packaging.
  • an optomechanical package arranged with at least one optical subsystem having a positional bias which promotes a direction shift in an output beam.
  • optical systems of these devices are made of subsystems which may be position shifted with respect to each other to cause the direction bias in the output beam.
  • a lens may be displaced with respect to a semiconductor chip and reflector thus causing an output to be comprised of a downward pointing beam.
  • Semiconductor lighting system packages of these inventions are arranged with three major optical sub-systems including: a light source, a reflector and a lens.
  • a semiconductor light producing source emits light from its several facets, in several directions simultaneously.
  • a reflector turns light emitted from four side facets upwardly and into the beam which is emitted from the chip top surface.
  • these semiconductor lighting systems nearly always comprise a chip and some version of a reflector.
  • a lens takes highly divergent light from the semiconductor and focuses it into a more narrow beam.
  • Each of these three optical subsystems have a symmetry axis associated therewith.
  • Optomechanical packages of these inventions include a displacement with respect to either of these symmetry axes.
  • Such displacement is arranged to provide an output beam which leaves the device in a non-orthogonal direction with respect to its baseplate and mounting plane.
  • Experts in optics will quickly understand how a, position displacement is translated to a direction change in the output beam and this is further explained in detail.
  • Figure 1 is a prior art drawing of an optical system showing an optical output with a downward bias
  • Figure 2 is a ray trace diagram showing fundamental lens principles
  • Figure 3 is illustrates major subsystems of a semiconductor optomechanical package
  • Figure 4 illustrates these subsystems and their symmetry axes in perspective drawings
  • Figure 5 illustrates a special package of these inventions where a lens has been displaced with respect to a semiconductor die and its mount/reflector system.
  • Figure 6 is a diagram to show the resulting output generated from the system of Figure 5;
  • Figure 7 shows an alternative version whereby a semiconductor die is displaced with respect to both a lens and reflector;
  • Figure 8 shows yet another alternative version whereby a reflector is displaced with respect to both a semiconductor die and a lens
  • Figure 9 illustrates a planar mounting system having a plurality of elements and an output not orthogonal to the mounting plane
  • Figure 10 is a cross section diagram of a special version of LED package which also serves the objectives of these inventions.
  • Figure 11 is a perspective diagram of yet another special version which also may be used to achieve an output beam with a directional bias;
  • Figure 12 illustrates a special indexing means used to assure a proper displacement alignment between optical sub-systems;
  • Figure 13 shows a common LED package with displaced optical sub-systems.
  • optomechanical packaging systems for semiconductor light emitting diodes having a output beam with directional bias. It will be appreciated that each of the embodiments described include both an apparatus and method and that the apparatus and method of one preferred embodiment may be different than the apparatus and method of another embodiment.
  • Optical sources commonly known as 'LEDs' are primarily comprised of an emitting chip and an optomechanical package. The optical portion of the system usually includes a reflector to couple side emitted light into a primary beam.
  • optical systems almost invariably include a lens to condense light into a more narrow beam. Accordingly, one might say the optical system of an LED comprises three major parts: a source, a reflector and a lens.
  • Optical systems of these inventions are LED packages having three major parts or sub-systems as mentioned. Further, these packages differ from their cousins in the arts in that either of these major optical subsystems is position shifted with respect to the others.
  • Optomechanical packages are arranged with a position or alignment bias which promotes a direction shift in an output beam.
  • Sub-systems having a reference axis, or an axis of symmetry may be position shifted, or 'mis-aligned' with respect to each other to cause direction bias in the output beam.
  • Such displacement is arranged with the purpose of providing an output beam which leaves the device in a non-orthogonal direction with respect to its baseplate and mounting plane.
  • Figure 2 illustrates.
  • the lens performs a Fourier transform of the object plane 'OP'.
  • a point source is mapped into plane waves which propagate in a direction which depends on the position of the point source in the object plane.
  • Point source 'B' lying on the optic axis in the object plane creates a beam which leaves the lens in a direction perpendicular to the object plane.
  • Point source 1 A' which is displaced away from and above the geometric center of the system results in a beam having a propagation direction shifted downwardly with respect to the system axis.
  • plane waves will arrive lower than those from point source 'B'.
  • a baseplate 31 is a substrate having a flat surface which provides a system reference plane 32.
  • the output beam direction is coupled to the baseplate via an orthogonal relationship; that is, output beams leave the package perpendicular to the mounting plane.
  • the substrate may have provided therein a special recess 33 having rotational and axial symmetry. Properly prepared, the recess operates as a reflector for light coming from the sides of the semiconductor die 34.
  • a semiconductor die or 'chip' is cylindrical with rectangular cross section and its geometry lies with an axis at its center.
  • a third optical subsystem includes a spherical lens 35 formed into the top surface of hard plastic molded cover element 36.
  • a spherical lens has axial symmetry by definition.
  • all three optical sub-systems, the semiconductor chip, the reflector and the lens share a common axis 37.
  • the 'point source' appears to lie where the axis intersects with the object plane of the lens.
  • the resulting output beam is orthogonal and perpendicular to the baseplate or system reference plane. Due to the construction described, the baseplate provides a mechanical reference and foundation and as such is necessarily related to the beam output direction. When these LED devices are mounted to other systems, the mounting plane suggests the beam direction (normal) and designers of systems deploying LEDs count on the beam direction being perpendicular to the mounting surface.
  • Figure 4A shows a semiconductor chip 41 which takes roughly the shape of a cube.
  • a primary emission surface, a top surface 42 is geometrically centered about axis 43.
  • a 'loose' definition of 'centered' is intended here.
  • Semiconductor die are best made with flat facets and do not readily support truly axial symmetries. Thus, an approximation is acceptable and the die is said to have a 'symmetry axis' as shown. Light emitted from the chip will be approximately symmetric about this axis. Some account is to be taken for electrical contacts and other small deviation.
  • Figure 4B shows a 'recess' or surface of revolution object 44. While a 'recess' seems to refer to a non-existing entity, it is to be understood that a recess is formed in a substrate or some other bulk material object. The recess surface is then polished and/or metalized to form a reflector.
  • a good reflector for an LED system may be a simple conic section having a flat floor 45 which the chip may be bonded.
  • the surface 46 will receive light from the sides of the chip and turn that light upward into a common beam; a beam comprised of top surface emission. In this arrangement, the reflector is said to have an axis 47.
  • a spherical lens 48 of Figure 4C also has a reference and symmetry axis 49.
  • a light emitting device includes a baseplate 51 and a semiconductor die 52 having a top surface thereon and a symmetry axis extending orthogonally therefrom.
  • An axially symmetric reflector 53 is a recess cut into the baseplate. Both the die and reflector have common or colinear axes 54.
  • the cover element and lens 55 having a reference axis 56 is displaced in position by an amount ⁇ 57 with respect to both the die axis and the reflector axis, the beam appears to the lens to be coming from a point not on the axis of the lens but rather from a point slightly displaced in position.
  • this is embodied as a beam direction change and the final output beam does not leave parallel with either axis but instead with a few degrees of angular deviation with respect thereto.
  • the lens reference axis is parallel with but not colinear with either the die axis or the reflector axis.
  • FIG. 6 shows a side-by-side comparison of two systems: a first having no displacement and a second having a pronounced displacement.
  • a first device has optical sub-systems each with its axis colinear with the other two.
  • Baseplate 61 is a substrate with two flat sides, one of which has a recess, a conic shaped indent, formed therein. The recess is well aligned and optically coupled to a semiconductor die 62.
  • a cover element 63 of hard molded plastic has a spherical top surface to form a lens.
  • the semiconductor chip 63 is mounted at the floor of the recess with its top surface parallel to the system reference plane.
  • Each of said recess, lens and chip has a symmetry axis 64, one colinear with the other.
  • optical output beam 65 emanates from device in a direction perpendicular with respect to the system reference plane.
  • baseplate 66 having reflector 67 formed therein and chip 68 mounted thereto is shifted laterally by an amount ⁇ in position with respect to the lens 69.
  • the device produces an output beam 610 which leaves the system in a direction 611 that is not perpendicular to the system plane, but rather is angled a few degrees away from the system normal.
  • Figure 7 shows an alternative version.
  • a cover element with lens 71 and reflector 72 share a common axis 73.
  • Semiconductor diode chip 74 is displaced in the recess and has an axis 75 which is displaced by an amount ⁇ from the other two axes.
  • the chip axis is parallel to, but not colinear with the axes of the lens and reflector.
  • This device also produces a beam which leaves the system with a direction bias that is a few degrees away from the direction of the three optical subsystem axes. It is useful to remind the reader that a lateral displacement, i.e. a shift of position, is translated into a beam angle change in the far field.
  • FIG. 8 Another alternative version is illustrated in Figure 8.
  • the reflector axis is displaced from the other two axes which remain colinear.
  • Lens cover element 81 and diode chip 82 share a common axis 83.
  • the baseplate having a reflector 84 formed therein is shifted right a bit to cause its axis 85 a small lateral displacement ⁇ 86.
  • This system will also generate an output beam whose direction is characterized as being shifted a few degrees from the system normal.
  • Figure 9 illustrates one such system having a large planar area 91 covered with LED elements 92 each having a biased output beam.
  • the LED baseplate 93 is flat and mounts flush with the plane which makes up the system surface.
  • Normally shaped spherical lens 94 suggests a system normal direction 95 orthogonal with respect to the entire system plane.
  • the output beam 96 is slightly downward shifted due to a positional shift in either the chip, the lens, or the reflector at the designer's option.
  • Figure 10 includes versions where the reflector is integrated with the lens as a single unit molded cover element 101.
  • the top surface 102 is spherical and polished smooth to form a first lens.
  • the cover element undersurface includes several important features.
  • a second lens 103 is provided.
  • a special total internal reflection TIR type reflector 104 is a conic section formed in the undersurface of the cover element.
  • a flat seat 105 is useful for assuring the cover element joins the baseplate with good alignment and appropriate coupling.
  • a flat substrate 106 without recess is the baseplate.
  • both lenses and the reflector share a single axis 107.
  • the semiconductor chip 108 is moved slightly right by an amount ⁇ .
  • Figure 11 illustrates. Cylindrical lens 111 and chip 112 are well aligned. A reflector is not shown but one may be used in such systems.
  • the system normal 113 and the output beam exit the device in the same direction.
  • cylindrical lens 114 is slightly displaced laterally with respect to chip 115 to form a position shift ⁇ 116.
  • the system normal 117 and the output beam 118 direction are not the same, but rather output beam has an angular shift downward a few degrees.
  • a cover element 121 having a lens 122 and substrate 123 can be formed with cooperating indexing means properly placed to assure a desired displacement between the lens and the baseplate having a semiconductor chip properly positioned and aligned thereto.
  • a cover element may have integrated therewith pins 124 which fit into corresponding holes 125 in the baseplate substrate.
  • Figure 13 illustrates cover element 131 with lens surface 132 and reflector 133 having axis 135 slightly shifted from the lens axis 136.
  • a semiconductor chip mounted in the reflector would produce a beam which radiates in a direction different than axes direction.
  • Base 134 implies a system flat or reference plane and provides alignment in mounting systems. In this way, standard LED packages also support these inventions.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un boîtier de photosource à semi-conducteurs comportant des sous-systèmes optiques agencés de façon à infléchir l'axe des faisceaux de sortie. Un axe de symétrie de l'un des trois système incluant un microcircuit photoémetteur à semi-conducteur, un réflecteur et une lentille est déplacé latéralement par rapport aux deux qui peuvent demeurer colinéaires. La lentille provoque une translation du déplacement de façon à réaliser un changement de sens su faisceau de sortie. Ainsi, le faisceau de sortie n'est pas émis perpendiculairement au plan du système, mais selon un axe s'écartant de quelques degré de la perpendiculaire au système.
PCT/IB2006/000802 2005-04-16 2006-04-07 Photosource optique aux axes decales WO2006111805A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10689705A 2005-04-16 2005-04-16
US11/106,897 2005-04-16

Publications (1)

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WO2006111805A1 true WO2006111805A1 (fr) 2006-10-26

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Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1916472A1 (fr) * 2006-10-27 2008-04-30 Valeo Vision Dispositif d'éclairage ou de signalisation comportant deux sources lumineuses agencées sur les deux faces d'un support commun
US7841750B2 (en) 2008-08-01 2010-11-30 Ruud Lighting, Inc. Light-directing lensing member with improved angled light distribution
CN102037504A (zh) * 2009-07-06 2011-04-27 惠州科锐光电有限公司 具有倾斜峰值发射图样的发光二极管显示器
JP2011138982A (ja) * 2009-12-29 2011-07-14 Omron Corp 照明装置および照明装置の製造方法
WO2012106141A1 (fr) * 2011-02-04 2012-08-09 Cree, Inc. Composant à diodes électroluminescentes
EP2479813A3 (fr) * 2011-01-20 2012-11-14 MLS Co., Ltd. Diode électroluminescente à montage en surface avec lentille optique
US8348475B2 (en) 2008-05-23 2013-01-08 Ruud Lighting, Inc. Lens with controlled backlight management
US8388193B2 (en) 2008-05-23 2013-03-05 Ruud Lighting, Inc. Lens with TIR for off-axial light distribution
WO2013176832A1 (fr) * 2012-05-23 2013-11-28 Cree, Inc. Réseau de del à émission inclinée
USD697664S1 (en) 2012-05-07 2014-01-14 Cree, Inc. LED lens
US8698171B2 (en) 2005-01-10 2014-04-15 Cree, Inc. Solid state lighting component
USD718490S1 (en) 2013-03-15 2014-11-25 Cree, Inc. LED lens
JP2015220332A (ja) * 2014-05-16 2015-12-07 才原 巧 発光ダイオードユニット
EP2834556A4 (fr) * 2012-04-06 2015-12-23 Cree Inc Système optique à réseau de del multilentilles
US9255686B2 (en) 2009-05-29 2016-02-09 Cree, Inc. Multi-lens LED-array optic system
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US9423096B2 (en) 2008-05-23 2016-08-23 Cree, Inc. LED lighting apparatus
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9523479B2 (en) 2014-01-03 2016-12-20 Cree, Inc. LED lens
US9541258B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for wide lateral-angle distribution
US9541257B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for primarily-elongate light distribution
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
EP2829958B1 (fr) * 2012-03-19 2018-09-26 Murata Manufacturing Co., Ltd. Capteur optique
EP3165818B1 (fr) 2015-11-06 2019-01-02 Siteco Beleuchtungstechnik GmbH Éclairage intérieur ou extérieur, en particulier réverbère comprenant une lentille à forme libre pouvant être décalée
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US10408429B2 (en) 2012-02-29 2019-09-10 Ideal Industries Lighting Llc Lens for preferential-side distribution
US10468566B2 (en) 2017-04-10 2019-11-05 Ideal Industries Lighting Llc Hybrid lens for controlled light distribution
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same

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Cited By (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US9076940B2 (en) 2005-01-10 2015-07-07 Cree, Inc. Solid state lighting component
US8698171B2 (en) 2005-01-10 2014-04-15 Cree, Inc. Solid state lighting component
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
EP1916472A1 (fr) * 2006-10-27 2008-04-30 Valeo Vision Dispositif d'éclairage ou de signalisation comportant deux sources lumineuses agencées sur les deux faces d'un support commun
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same
US8388193B2 (en) 2008-05-23 2013-03-05 Ruud Lighting, Inc. Lens with TIR for off-axial light distribution
US8348475B2 (en) 2008-05-23 2013-01-08 Ruud Lighting, Inc. Lens with controlled backlight management
US9657918B2 (en) 2008-05-23 2017-05-23 Cree, Inc. Light fixture with wide-angle light distribution
US9476570B2 (en) 2008-05-23 2016-10-25 Cree, Inc. Lens with controlled backlight management
US9423096B2 (en) 2008-05-23 2016-08-23 Cree, Inc. LED lighting apparatus
US7841750B2 (en) 2008-08-01 2010-11-30 Ruud Lighting, Inc. Light-directing lensing member with improved angled light distribution
US9484329B2 (en) 2008-10-24 2016-11-01 Cree, Inc. Light emitter array layout for color mixing
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US9255686B2 (en) 2009-05-29 2016-02-09 Cree, Inc. Multi-lens LED-array optic system
US9689552B2 (en) 2009-05-29 2017-06-27 Cree, Inc. Multi-lens LED-array optic system
EP2452330A1 (fr) * 2009-07-06 2012-05-16 Cree Huizhou Opto Limited Dispositif d'affichage à diodes électroluminescentes à motif d'émission de pic incliné
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
CN102037504A (zh) * 2009-07-06 2011-04-27 惠州科锐光电有限公司 具有倾斜峰值发射图样的发光二极管显示器
EP2452330A4 (fr) * 2009-07-06 2014-10-29 Cree Huizhou Opto Ltd Dispositif d'affichage à diodes électroluminescentes à motif d'émission de pic incliné
EP2341280A3 (fr) * 2009-12-29 2013-06-19 Omron Corporation Dispositif d'éclairage et son procédé de production
JP2011138982A (ja) * 2009-12-29 2011-07-14 Omron Corp 照明装置および照明装置の製造方法
EP2479813A3 (fr) * 2011-01-20 2012-11-14 MLS Co., Ltd. Diode électroluminescente à montage en surface avec lentille optique
CN103562985A (zh) * 2011-02-04 2014-02-05 科锐 发光二极管组件
US9035328B2 (en) 2011-02-04 2015-05-19 Cree, Inc. Light-emitting diode component
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
WO2012106141A1 (fr) * 2011-02-04 2012-08-09 Cree, Inc. Composant à diodes électroluminescentes
US20140117386A1 (en) * 2011-02-04 2014-05-01 Cree, Inc. Tilted emission led array
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
US9541258B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for wide lateral-angle distribution
US9541257B2 (en) 2012-02-29 2017-01-10 Cree, Inc. Lens for primarily-elongate light distribution
US10408429B2 (en) 2012-02-29 2019-09-10 Ideal Industries Lighting Llc Lens for preferential-side distribution
EP2829958B1 (fr) * 2012-03-19 2018-09-26 Murata Manufacturing Co., Ltd. Capteur optique
EP2834556A4 (fr) * 2012-04-06 2015-12-23 Cree Inc Système optique à réseau de del multilentilles
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