WO2006095449A1 - Self-feeding cooling system - Google Patents

Self-feeding cooling system Download PDF

Info

Publication number
WO2006095449A1
WO2006095449A1 PCT/JP2005/007733 JP2005007733W WO2006095449A1 WO 2006095449 A1 WO2006095449 A1 WO 2006095449A1 JP 2005007733 W JP2005007733 W JP 2005007733W WO 2006095449 A1 WO2006095449 A1 WO 2006095449A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
chassis
power
cooling system
cooling medium
Prior art date
Application number
PCT/JP2005/007733
Other languages
French (fr)
Inventor
Kenichi Kato
Original Assignee
Kenichi Kato
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kenichi Kato filed Critical Kenichi Kato
Publication of WO2006095449A1 publication Critical patent/WO2006095449A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to the cooling device in shut place like chassis.
  • the subject of the present invention is to reduce this workload taken over for heat generation measures.
  • the cooling system that is ideal for having the following structures. a) Structure that cooling medium is liquid like water or oil, and cooled down without influence of electromagnetic noise in shut chassis that is generated from like motor's power. b) Air-cooling structure that regards cycle of cooling medium as power. c) Structure that cools down heat-inducing parts like electronic devices directly. Moreover, it can increase the target to cool directly by adding additional parts.
  • the present invention is the cooling system ideal for a) cutting off electromagnetic noise by offering moving power of pump motor, that cycles cooling medium, by shielding a part of chassis or being independent from chassis. b) cooling down with cycling power in cooling medium as moving power to a fan by the way of a water wheel without using electric power directly. c) having flexibility to add cooling targets by connecting cooler part that cools down heat-inducing parts directly and cycle source that cycles cooling medium in chassis with like pipes, and connecting to a cascade accordingly, and then connecting a termination to an outlet. d) using Peltier effect to cool down. e) supplying electricity by Peltier effect or Seebeck effect.
  • the present invention generates electricity by Seebeck effect with temperature rise, and cooling power is supplied to Peltier element. Therefore, external power supply is not required or it reduces power supply to chassis by using very low electricity.
  • the present invention makes it possible to offer the cooling system that prevent for temperature rise in chassis and with low electromagnetic noise. This contributes to operation stability of developed products and reduction of designers' workloads.
  • the present invention is expected to be used as a cooling device in chassis of an electric circuit device as seen in figure 1.
  • Figure 1 represents the structure of invented self- feeding cooling system
  • FIG. 2 represents the section of the cooling pipe in chassis DETAILED DESCRIPTION OF THE INVENTION
  • the pump for circulation (1) connects with the outlet cooling part (2) /the inlet cooling part (9) through the pipe (8).
  • Each cooling part cools down cooling medium by Peltier element, and it connects with the cooling pipe in chassis (3).
  • Peltier elements are attached to both the outlet cooling part (2) /the inlet cooling part (9) in order to expect higher cooling effect, however it is not defined. Either of them can be cooled according to temperature rise of system or additional part can be attached if required.
  • Shield or chassis as external device is connected between the outlet cooling part (2) / the inlet cooling part (9) and the cooling pipe in chassis. Electromagnetic noise against an electric circuit is cut off by this boundary. Therefore, the outlet cooling part ⁇ 2)1 the inlet cooling part (9) and the cooling pipe in chassis (3) are connected by inserting or by pipe.
  • Peltier element attached to the outlet cooling part ⁇ 2)1 the inlet cooling part (9) is connected with wire because it gets power supply from Seebeck element.
  • power control circuit is inserted in this part in order to control power supply to Peltier element.
  • Concerning Seebeck element high temperature side of heat source is taken from like a power circuit and low temperature side of heat source is taken from Peltier element or the outlet cooling part (2) / the inlet cooling part (9).
  • the cooling pipe in chassis (3) has the air-cooling fan (4), that cools down the chassis by using cycle power of cooling medium.
  • Figure 1 shows the cooling pipe (3) of outlet and inlet are parallel, but each direction is not defined. It can be randomly dealt according to a shape of chassis or direction of the wind of the air-cooling fan
  • the air-cooling fan is expected to be installed on both side of the cooling pipe in chassis (3).
  • the air-cooling fan (4) is to cool chassis by cycling cool air in the cooling pipe in chassis (3).
  • the pipe (8) connected to each cooling pan (5) is also cooled at same time.
  • the cooling pipe in chassis (3) is connected to the cooling pan (5) that is attached to each heat-inducting part through the pipe (8) serially. Concerning the cooling pan (5), it makes a channel internal for the purpose of function as medium making liquid-cooled effect. The shape is required according to the shape of an actual device, it is not defined here. Because the pipe (8) connected to each cooling pan (5) has cool air, the same effect as air-conditioning that cycles in housing is expected.
  • the last outlet of the cooling pan (5) is connected to inlet side of the cooling pipe in chassis (3).

Abstract

If ambient temperature is raised, it may cause a malfunction of an electric circuit, and therefore, circuit designers have to take care of temperature in operation environment. The subject of the present invention is to reduce this workload taken over for heat generation measures. The cooling system, that is ideal for having the following structures. a) Structure that cooling medium is liquid like water or oil, and cooled down without influence of electromagnetic noise in shut chassis that is generated from like motor's power. b) Air-cooling structure that regards cycle of cooling medium as power. c) Structure that cools down heat-inducing parts like electronic devices directly. Moreover, it can increase the target to cool directly by adding additional parts.

Description

DESCRIPTION
SELF-FEEDING COOLING SYSTEM
FIELD OF THE INVENTION
The present invention relates to the cooling device in shut place like chassis.
BACKGROUND OF THE INVENTION
In order to cool down like chassis, it is general to prevent for the temperature in chassis raising by making a slit type of hole to take in air. Moreover, in case heat-inducing parts like electric circuits generate heat particularly, like electric fans have to be installed to cool down chassis.
However, in this way, electric circuits or motors used for electric fans can be the radiation source of electromagnetic noise like EMC. As frequency gets higher, it gets stronger external influences of electromagnetic noise. As a result, it becomes difficult to take in air in terms of both radiation and perceiving. At the same time, high frequency circuit generates high heat, and therefore, any measures against heat have to be considered under sever conditions accordingly.
In shut chassis, in case of cooling down electric parts directly with electric fan or Peltier element, it might promote raising temperature by contraries by each heat radiation because it is hard to waste heat.
In existing cooling devices, its power is supplied by that of chassis. However, this imposes a burden on power supply to chassis.
SUMMARY OF THE INVENTION
If ambient temperature is raised, it may cause a malfunction of an electric circuit, and therefore, circuit designers have to take care of temperature in operation environment.
The subject of the present invention is to reduce this workload taken over for heat generation measures.
The cooling system, that is ideal for having the following structures. a) Structure that cooling medium is liquid like water or oil, and cooled down without influence of electromagnetic noise in shut chassis that is generated from like motor's power. b) Air-cooling structure that regards cycle of cooling medium as power. c) Structure that cools down heat-inducing parts like electronic devices directly. Moreover, it can increase the target to cool directly by adding additional parts.
The present invention is the cooling system ideal for a) cutting off electromagnetic noise by offering moving power of pump motor, that cycles cooling medium, by shielding a part of chassis or being independent from chassis. b) cooling down with cycling power in cooling medium as moving power to a fan by the way of a water wheel without using electric power directly. c) having flexibility to add cooling targets by connecting cooler part that cools down heat-inducing parts directly and cycle source that cycles cooling medium in chassis with like pipes, and connecting to a cascade accordingly, and then connecting a termination to an outlet. d) using Peltier effect to cool down. e) supplying electricity by Peltier effect or Seebeck effect.
The present invention generates electricity by Seebeck effect with temperature rise, and cooling power is supplied to Peltier element. Therefore, external power supply is not required or it reduces power supply to chassis by using very low electricity.
In an electric circuit block in chassis, it reduces malfunction caused by electromagnetic noise because it cools down without using like motor's power.
It is easy to deal with heat-inducing parts individually because power generation parts can be cooled directly.
Furthermore, it is possible to add parts randomly.
The present invention makes it possible to offer the cooling system that prevent for temperature rise in chassis and with low electromagnetic noise. This contributes to operation stability of developed products and reduction of designers' workloads.
The present invention is expected to be used as a cooling device in chassis of an electric circuit device as seen in figure 1.
BRIEF DESCRIPTION OF THE DRAWING
Figure 1 represents the structure of invented self- feeding cooling system
Figure 2 represents the section of the cooling pipe in chassis DETAILED DESCRIPTION OF THE INVENTION
The pump for circulation (1) connects with the outlet cooling part (2) /the inlet cooling part (9) through the pipe (8). Each cooling part cools down cooling medium by Peltier element, and it connects with the cooling pipe in chassis (3). Peltier elements are attached to both the outlet cooling part (2) /the inlet cooling part (9) in order to expect higher cooling effect, however it is not defined. Either of them can be cooled according to temperature rise of system or additional part can be attached if required.
Shield or chassis as external device is connected between the outlet cooling part (2) / the inlet cooling part (9) and the cooling pipe in chassis. Electromagnetic noise against an electric circuit is cut off by this boundary. Therefore, the outlet cooling part {2)1 the inlet cooling part (9) and the cooling pipe in chassis (3) are connected by inserting or by pipe.
Peltier element attached to the outlet cooling part {2)1 the inlet cooling part (9) is connected with wire because it gets power supply from Seebeck element. However, in case of requiring temperature control by sensor, or installing auxiliary power, power control circuit is inserted in this part in order to control power supply to Peltier element. Concerning Seebeck element, high temperature side of heat source is taken from like a power circuit and low temperature side of heat source is taken from Peltier element or the outlet cooling part (2) / the inlet cooling part (9).
The cooling pipe in chassis (3) has the air-cooling fan (4), that cools down the chassis by using cycle power of cooling medium. Figure 1 shows the cooling pipe (3) of outlet and inlet are parallel, but each direction is not defined. It can be randomly dealt according to a shape of chassis or direction of the wind of the air-cooling fan
(4). The air-cooling fan is expected to be installed on both side of the cooling pipe in chassis (3).
Also, the air-cooling fan (4) is to cool chassis by cycling cool air in the cooling pipe in chassis (3).
The pipe (8) connected to each cooling pan (5) is also cooled at same time.
The cooling pipe in chassis (3) is connected to the cooling pan (5) that is attached to each heat-inducting part through the pipe (8) serially. Concerning the cooling pan (5), it makes a channel internal for the purpose of function as medium making liquid-cooled effect. The shape is required according to the shape of an actual device, it is not defined here. Because the pipe (8) connected to each cooling pan (5) has cool air, the same effect as air-conditioning that cycles in housing is expected.
The last outlet of the cooling pan (5) is connected to inlet side of the cooling pipe in chassis (3).

Claims

1. the cooling system ideal for a) the structure that cooling medium is liquid like water or oil, and cooled down without influence of electromagnetic noise in shut chassis that is generated from like motor's power. b) the air-cooling structure that regards cycle of cooling medium as power. c) the structure that cools down heat-inducing parts like electronic devices directly. Moreover, it can increase the target to cool directly by adding additional parts.
2. the Claim 1 's cooling system, that cuts off electromagnetic noise by offering moving power of pump motor, that cycles cooling medium, by shielding a part of chassis or being independent from chassis.
3 • the Claim 1 's cooling system, that cools down with cycling power in cooling medium as moving power to a fan by the way of a water wheel without using electric power directly.
4 • the Claim 1 's cooling system, that has flexibility to add cooling targets by connecting cooler part that cools down heat-inducing parts directly and cycle source that cycles cooling medium in chassis with like pipes, and connecting to a cascade accordingly, and then connecting a termination to an outlet.
5, the claim 1 's cooling system that uses Peltier effect to cool down.
6, the claim 1 's cooling system that supplies electricity by Peltier effect or Seebeck effect.
PCT/JP2005/007733 2005-03-07 2005-04-15 Self-feeding cooling system WO2006095449A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-106699 2005-03-07
JP2005106699A JP2008060093A (en) 2005-03-07 2005-03-07 Self-feeding cooling system

Publications (1)

Publication Number Publication Date
WO2006095449A1 true WO2006095449A1 (en) 2006-09-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/007733 WO2006095449A1 (en) 2005-03-07 2005-04-15 Self-feeding cooling system

Country Status (2)

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JP (1) JP2008060093A (en)
WO (1) WO2006095449A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021231620A1 (en) * 2020-05-12 2021-11-18 GemaTEG Inc. Electronic device cooling systems using cooled fluid and control of same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5923332B2 (en) * 2011-07-20 2016-05-24 浩明 中弥 Thermoelectric conversion element, thermoelectric conversion power generation device and power generation method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4022024A (en) * 1974-05-13 1977-05-10 Eugenio Eibenschutz Abeles Thermosiphon engine and method
FR2623047A1 (en) * 1987-11-09 1989-05-12 Eris Method and system for transmitting electrical energy by means of a fluid circuit
US5419780A (en) * 1994-04-29 1995-05-30 Ast Research, Inc. Method and apparatus for recovering power from semiconductor circuit using thermoelectric device
US6502405B1 (en) * 2001-10-19 2003-01-07 John Van Winkle Fluid heat exchanger assembly
DE10143116A1 (en) * 2001-09-03 2003-03-20 Wolfram Bohnenkamp Improved cooling systems with Peltier elements
US20040187501A1 (en) * 2003-03-27 2004-09-30 Intel Corporation Phase-change refrigeration apparatus with thermoelectric cooling element and methods

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4022024A (en) * 1974-05-13 1977-05-10 Eugenio Eibenschutz Abeles Thermosiphon engine and method
FR2623047A1 (en) * 1987-11-09 1989-05-12 Eris Method and system for transmitting electrical energy by means of a fluid circuit
US5419780A (en) * 1994-04-29 1995-05-30 Ast Research, Inc. Method and apparatus for recovering power from semiconductor circuit using thermoelectric device
DE10143116A1 (en) * 2001-09-03 2003-03-20 Wolfram Bohnenkamp Improved cooling systems with Peltier elements
US6502405B1 (en) * 2001-10-19 2003-01-07 John Van Winkle Fluid heat exchanger assembly
US20040187501A1 (en) * 2003-03-27 2004-09-30 Intel Corporation Phase-change refrigeration apparatus with thermoelectric cooling element and methods

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021231620A1 (en) * 2020-05-12 2021-11-18 GemaTEG Inc. Electronic device cooling systems using cooled fluid and control of same

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JP2008060093A (en) 2008-03-13

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