WO2006092975A1 - 加工用ステージ及び集束ビーム加工装置並びに集束ビーム加工方法 - Google Patents
加工用ステージ及び集束ビーム加工装置並びに集束ビーム加工方法 Download PDFInfo
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- WO2006092975A1 WO2006092975A1 PCT/JP2006/302989 JP2006302989W WO2006092975A1 WO 2006092975 A1 WO2006092975 A1 WO 2006092975A1 JP 2006302989 W JP2006302989 W JP 2006302989W WO 2006092975 A1 WO2006092975 A1 WO 2006092975A1
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- Prior art keywords
- workpiece
- focused beam
- processing
- sample
- mounting table
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching for microworking, e.g. etching of gratings, trimming of electrical components
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
- G01N35/04—Details of the conveyor system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
Definitions
- the present invention relates to a processing stage used for processing a workpiece by irradiating a focused beam while observing the workpiece in an observation region within a predetermined range, and the processing step.
- the present invention relates to a focused beam cage apparatus having a cover and a focused beam cage method.
- TEM transmission electron microscope
- Section samples for TEM observation that is, TEM samples, are manufactured by various methods, but recently, a method of manufacturing using a focused ion beam (FIB) FIB apparatus is generally used. It has become. The section sample prepared by the FIB apparatus is transferred to the stage of the TEM apparatus and then observed with high resolution.
- FIB focused ion beam
- sample preparation apparatus has a sample stage fine movement means attached to a sample chamber whose inside can be adjusted to a vacuum state, and can be inserted into the sample chamber via the sample stage fine movement means, and a sample piece is placed thereon.
- the first stage and the second stage on which a part of the sample piece can be placed (the cut specimen) can be placed, and the extracted sample is transferred from the first stage to the second stage in the specimen chamber. It is equipped with transfer means and various components such as a sample-single-force section sample in the sample chamber and a deposition film.
- the second stage is in a state where an excised sample is placed, and another analysis device such as a transmission electron microscope (TEM), a scanning electron microscope (SEM), or a secondary ion mass spectrometer. (SIMS) can be inserted into the stage inlet.
- TEM transmission electron microscope
- SEM scanning electron microscope
- SIMS secondary ion mass spectrometer
- the first stage is inserted into the sample chamber via the sample stage fine movement means, and an excised sample is prepared from the placed sample piece. Then, after the produced excised sample is gripped by the transfer means, the first stage is pulled out from the sample chamber and the second stage is inserted. At this time, the vacuum state in the sample chamber is maintained. After the second stage is inserted, the transfer means places the gripped sample on the second stage. Note that the deposition film is used to hold the extracted sample and place it on the second stage. Then, after the extracted sample is placed on the second stage, the extracted sample can be easily transferred by pulling out the second stage and inserting it into the stage insertion port of another analysis device, for example, a TEM device. This can save time and labor. In addition, since it is not necessary to touch the sample piece directly by hand after placing the sample piece on the first stage, the loss or the like can be eliminated.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2004-301853
- Patent Document 2 JP 2004-309499 A
- Non-Patent Document 1 "MEMS 'Latest Trends in MEMS Technology", Toray Research Center, May 2004
- the sample preparation apparatuses described in Patent Documents 1 and 2 transfer an extracted sample that is a workpiece.
- the change can be done in a short time, but it is necessary to replace the first stage and the second stage. Therefore, it is necessary to change the stage each time an excised sample is prepared. In the case of continuously processing a plurality of samples, replacement takes time, and efficient processing cannot be performed.
- the present invention has been made in view of such circumstances, and an object of the present invention is for machining that can be easily transferred and processed efficiently without taking the workpiece out.
- a stage, a focused beam processing apparatus, and a focused beam processing method are provided.
- the present invention provides the following means in order to solve the above problems.
- the processing stage of the present invention is a processing stage used when processing a workpiece by irradiating a focused beam while observing the target object within an observation region within a predetermined range.
- a table having a plurality of mounting tables each capable of mounting the workpiece on the upper surface, and rotating the mounting table around the Z axis perpendicular to the upper surface, and arbitrarily moving the upper surface to an arbitrary surface.
- Rotation tilting means for tilting at an angle, and the table is movable so as to place a plurality of mounting tables in the observation area.
- the table is movable, the workpiece placed on the upper surface of each mounting table is quickly positioned within the observation area. Can be made. As a result, it is possible to perform processing while efficiently observing the workpiece placed on each mounting table, thereby improving work efficiency.
- the workpiece can be easily transferred to another mounting table.
- the workpiece is held by a manipulator or the like to separate the mounting table force. Then, by moving the table in this state and placing another mounting table in the observation region, the workpiece can be easily transferred onto another mounting table.
- each mounting table can be arranged in the observation area only by moving the table. Therefore, it takes a conventional time! Therefore, the processing time can be shortened and the manufacturing cost can be reduced. [0017] Further, since the rotation tilting means is provided, each mounting table can be rotated around the Z axis or tilted at an arbitrary angle. Therefore, when processing the workpiece in the observation area, it can be processed by irradiating with a focused beam of any angular force, which increases the certainty of the processing work and improves ease of use and convenience. .
- the table in the processing stage of the present invention, is formed in a rectangular shape in a top view extending in one direction, and the plurality of mounting tables are arranged in the one direction. It is characterized by being arranged in a line along.
- each mounting table is arranged in the observation area only by moving the table in one direction. Can be made. Therefore, the configuration can be simplified and the operation becomes easy.
- the processing stage of the present invention includes a holding unit that holds the workpiece in the observation region and separates at least the upper surface force of the mounting table in the processing stage of the present invention. It is characterized by that.
- the holding means since the holding means is provided, it is possible to easily transfer the object to be moved from one mounting table to another mounting table. That is, the processed workpiece is held in the observation region and the upper surface force is separated. In this state, the table is moved to place another mounting table in the observation area. Then, the workpiece to be held can be easily transferred by placing it on the upper surface of another mounting table.
- the processing stage of the present invention is the processing stage of the present invention, further comprising tilting means for tilting the table at an arbitrary angle, and the holding means can be tilted together with the table. It is characterized by being.
- the table and the holding means are tilted together by the tilting means in a state in which the relative relationship between them is maintained. Therefore, the holding means It is possible to irradiate a focused beam with any angular force when the workpiece is moved and brought into contact with a workpiece placed on another mounting table, and the contact point is temporarily joined using the focused beam. . Therefore, temporary joining can be performed accurately, and processing accuracy can be further improved.
- the focused beam processing apparatus of the present invention includes any one of the processing stages of the present invention described above, observation means for observing a workpiece placed in the observation area, and arrangement in the observation area.
- the workpiece is provided with an irradiating means for irradiating the focused beam.
- the workpiece is irradiated with the focused beam by the irradiation unit while observing the workpiece placed in the observation region by the observation unit.
- each stage can be easily arranged in the observation area by a processing stage having a movable table, continuous processing of the workpiece can be easily performed. Therefore, the processing time can be shortened and the cost for processing can be reduced.
- the mounting table can be rotated and tilted around the Z axis by the rotation tilting means, so that the workpiece can be processed by irradiating the focused beam from any angle. Therefore, high-precision machining can be performed, and the certainty of the machining work is increased. In addition, it is easy to use and excellent in convenience.
- the focused beam processing method of the present invention allows a workpiece to be processed in a state where any one of a plurality of mounting tables on which a workpiece is mounted is placed in an observation region within a predetermined range.
- a focused beam processing method for irradiating an object with a focused beam and processing the workpiece, wherein the table having a plurality of the mounting tables is moved to place any one mounting table in the observation area A rough processing step for roughing the workpiece by irradiating the bundled beam while observing the workpiece after the placement step, and the processed workpiece fed after the roughing step
- a workpiece placed on the mounting table for example, a diamond barrel is placed on another mounting table,
- it can be easily transferred to the cantilever side and attached to the tip of the cantilever using, for example, a deposition film.
- the table is moved by the arranging step, and the placing table on which the diamond abrasive grains are placed is arranged in the observation region.
- the diamond abrasive grains are observed by a roughing process to select a suitable one (size, outer shape, etc.) for the needle tip, and the selected diamond barrel is irradiated with a focused beam to reach the needle tip.
- a suitable shape size, outer shape, etc.
- the mounting table can be rotated or tilted at an arbitrary angle, the focused beam can be irradiated from any angle, and the flow can be reliably performed.
- the abraded diamond abrasive grains are held by holding means such as a manipulator and lifted to separate the upper surface force of the mounting table.
- the table is moved by the moving step, and the cantilever is placed in the observation area, and another placing table is placed.
- a contact process is performed in which the diamond abrasive grains are brought close to each other while observing to contact a predetermined position of the tip of the cantilever.
- the cantilever and the diamond barrel are bonded by, for example, a deposition film by irradiating a focused beam, and the diamond barrel is finely processed so as to become a needle tip.
- the mounting table can be rotated and tilted in the same manner as described above, it is possible to irradiate a focused beam from any angle, and reliably form a deposition film around the diamond barrel to ensure bonding. Can be made.
- each mounting table can be arranged in the observation area simply by moving the table, continuous machining of workpieces, which previously required time, can be easily performed, reducing machining time and Reduce costs that are hard to beat Can be planned.
- the focused beam processing method of the present invention allows a workpiece to be processed in a state in which any one of a plurality of mounting tables on which the workpiece is mounted is arranged in an observation region within a predetermined range.
- a focused beam processing method for irradiating an object with a focused beam and processing the workpiece wherein the table having a plurality of the mounting tables is moved to place any one mounting table in the observation area
- the workpiece A separation step of holding the small piece by the holding means and separating it from the upper surface of the mounting table, a moving step of moving the table after the separation step and placing another mounting table in the observation area, and the movement
- the separated workpiece pieces are A contact process in which the workpiece is brought close to another mounting table and brought into contact with another workpiece placed on the upper surface, and after the contacting step, the workpiece piece and
- a workpiece placed on the mounting table for example, a specimen piece that is a workpiece piece, such as a specimen force, is prepared, and the specimen A piece can be easily transferred to another object to be mounted on another mounting table, for example, a sample holder, and attached using a deposition film to manufacture a TEM observation sample.
- the table is moved by the arranging step, and the placing table on which the sample is placed is placed in the observation region.
- a sample piece is manufactured by irradiating a predetermined position with a focused beam and cutting while observing the sample.
- the mounting table can be rotated or tilted at an arbitrary angle, a focused beam can be irradiated from any angle, and a sample piece of an arbitrary shape can be reliably produced.
- the produced sample piece is held by a holding means such as a manipulator and lifted to separate the upper surface force of the mounting table.
- a holding means such as a manipulator and lifted to separate the upper surface force of the mounting table.
- the table is moved by a moving process, and another mounting table on which the sample holder is mounted is placed in the observation region. After moving the table, bring the sample piece closer to the sample holder while observing the sample holder. A contact process for contacting a predetermined position of the slider is performed.
- a TEM observation sample can be manufactured by irradiating a focused beam and bonding the sample piece and the sample holder with, for example, a deposition film in the bonding step.
- the focused beam can be irradiated from any angle, and a deposition film is reliably formed around the sample piece to ensure bonding. Can be a thing.
- the object to be powered can be easily moved and moved by simply moving the table, and an efficient machining operation can be performed.
- each mounting table can be arranged in the observation area simply by moving the table, continuous machining of workpieces, which previously required time, can be easily performed, reducing machining time and It is possible to reduce the cost of intensive efforts.
- each mounting table can be placed in the observation region only by moving the table; Continuous machining and the like can be easily performed, and the machining time can be shortened and the manufacturing cost can be reduced.
- the focused beam processing apparatus of the present invention while observing the workpiece positioned in the observation region by the observation means, the workpiece is irradiated with the focused beam from the irradiation means.
- the workpiece can be processed.
- each stage can be easily positioned within the observation area by a processing stage with a movable table, so that continuous processing of workpieces can be performed easily and processing time is reduced.
- the workpiece can be easily transferred and processed only by moving the table, and an efficient processing operation can be performed.
- each mounting table within the observation area simply by moving the table, so that it is possible to easily perform continuous machining of workpieces, which requires conventional time, and shortens the machining time.
- FIG. 1 is a top view showing an embodiment of a focused beam processing apparatus having a processing stage according to the present invention, and shows a state where the upper surface of a first sample port is located in an observation region.
- FIG. 1 is a top view showing an embodiment of a focused beam processing apparatus having a processing stage according to the present invention, and shows a state where the upper surface of a first sample port is located in an observation region.
- FIG. 2 is a side view of the state shown in FIG.
- FIG. 3 is a top view showing a state in which the table of the focused beam processing apparatus shown in FIG. 1 moves and the upper surface of the second sample port is located in the observation region.
- FIG. 4 is a side view of the state shown in FIG.
- FIGS. 1 to 4 An embodiment of a processing stage, a focused beam processing apparatus, and a focused beam processing method according to the present invention will be described with reference to FIGS. 1 to 4.
- the target object is diamond abrasive grains and a cantilever.
- An explanation will be given by taking as an example a case in which a diamond cannon is attached to the tip of a cantilever.
- the focused beam processing apparatus 1 of the present embodiment includes a first sample port (mounting table) 2 on which the diamond particles D are mounted on the upper surface 2a, and a cantilever L on the upper surface.
- a processing stage 4 having a second sample port (mounting table) 3 placed on 3a, an observation means (not shown) for observing the diamond barrel D or cantilever L placed in the observation area W, and an observation area
- a gas that supplies an irradiation unit (irradiation means) 6 that irradiates a focused beam B such as FIB to diamond bullet D or cantilever L disposed in W, and a source gas G that forms a deposition film in observation region W Provide with source 7.
- the force stage 4 is used when processing by irradiating the focused beam B while observing the diamond abrasive grain D or the cantilever L in the observation region W within a predetermined range.
- the table 10 having the first sample port 2 and the second sample port 3 and the first sample port 2 and the second sample port 3 are rotated around the Z axis perpendicular to the upper surfaces 2a and 3a, respectively.
- Rotating and tilting means 11 for tilting the upper surfaces 2a and 3a to an arbitrary angle, and holding the diamond abrasive grains D or the cantilever L in the observation region W, at least the upper surface 2a or the second sample port 3 of the first sample port 2 And a tilt mechanism (tilt means) 13 for tilting the table 10 at an arbitrary angle.
- the first sample port 2 and the second sample port 3 are formed in, for example, a cylindrical shape (circular cross section) having a diameter of 10 mm and a height of 10 mm. Further, the first sample port 2 and the second sample port 3 are attached to the first rotary table 15 and the second rotary table 16 formed in a disc shape so as to be tiltable while being centered. That is, the first sample port 2 and the second sample port 3 are supported by a tilt mechanism (not shown) provided inside the first rotary table 15 and the second rotary table 16 on the lower surface side so that an arbitrary angle, for example, Tilt within the range of 0 ° to 90 °.
- a tilt mechanism not shown
- the table 10 is formed in a substantially rectangular shape in top view extending in one direction S.
- the first turntable 15 and the second turntable 16 are rotatably mounted on the table 10 with a predetermined interval along one direction S. That is, the first sample port 2 and the second sample port 3 are arranged in a line along one direction S of the table 10.
- a motor shaft 17 that is rotationally driven by a motor (not shown) is attached to the table 10.
- the motor shaft 17 is attached adjacent to the second turntable 16 so that the center of rotation coincides with the axis A connecting the rotation centers of the first turntable 15 and the second turntable 16.
- the rotating belt 18 is wound so as to contact the outer peripheral surfaces of the motor shaft 17, the first rotating table 15, and the second rotating table 16, respectively.
- the tilt mechanism, the motor shaft 17, the rotating belt 18, the first rotating table 15, and the second rotating table 16 constitute the rotating and tilting means 11.
- the table 10 is movably attached to a mounting base 20 formed in a box shape.
- the moving direction is a direction along the axis A direction.
- the table 10 can place the first sample port 2 and the second sample port 3 in the observation area W, respectively.
- a prober 22 having a transplantation needle prober 21 at the tip is attached to the mounting base 20.
- the prober 22 is three-dimensionally movable in the Z-axis direction and the XY-axis direction perpendicular to the Z-axis, so that the tip of the implantation needle prober 21 enters the observation area W. It has become possible to adjust to. Then, using the deposition film, the diamond particle D and the cantilever L can be fixed and held at the tip of the implantation probe 21. That is, the transplantation needle prober 21 and prober 22 constitute the holding means 12.
- the mounting base 20 is attached to the tip of an arm 25 that can be expanded and contracted in the XY axis direction so as to be rotatable about the axis A. Specifically, it is attached to the tip of the arm 25 via the tilt mechanism 13, and can be tilted (tilted) within a range of ⁇ 60 degrees, for example.
- the tilt mechanism 13 allows the table 10 and the holding means 12 to tilt together while maintaining the relative relationship between the forces and the table 10 and the holding means 12.
- the base end side of the arm 25 is attached to a base 27 fixed to the front flange 26 so as to be movable in the Z-axis direction.
- the mounting base 20 can be moved in the three directions of the X, Y, and Z axes via the arm 25.
- the focused beam carriage device 1 configured as described above places the diamond particle D placed on the first sample port 2 to the second sample port 3 side and changes the tip of the cantilever L. A focused beam processing method to be fixed to will be described.
- the table 10 is moved to place the first sample port 2 on which the diamond abrasive grains D are placed in the observation region W, and the placement After the process, the diamond abrasive grain D is irradiated with the focused beam B to observe the diamond abrasive grain D.
- a separation step of holding the particles D by the holding means 12 and separating them from the upper surface 2a of the first sample port 2 and after the separation step, the table 10 is moved to place the second sample port 3 in the observation region W.
- the moving process, and after the moving process the separated diamond barrel D is approached toward the second sample port 3 (another mounting table), and the cantilever L (another workpiece to be processed) mounted on the upper surface 3a.
- a contact step of contacting the object), and diamond after the contact step The contact portion between the grain D and the cantilever L is irradiated with a focused beam B to combine the two, and a micro-machining process for micro-machining the diamond abrasive grain D is provided.
- the first sample port 2 and the second sample port 3 are rotated around the Z axis and inclined at an arbitrary angle.
- a plurality of diamond particles D are placed on the upper surface 2 a of the first sample port 2, and a plurality of cantilevers L are placed on the upper surface 3 a of the second sample port 3.
- the table 10 is moved to bring the first sample port 2 on which the diamond barrel D is placed into the observation region W. Perform the above placement process.
- a plurality of diamond barrels D placed on the upper surface 2a of the first sample port 2 can be observed by the observation means.
- a suitable diamond tip for example, one having the optimum size, outer shape, etc. is selected from a plurality of diamond abrasive grains D.
- the selected diamond barrel D is irradiated with a focused beam B from the irradiation unit 6, and roughened so that the diamond barrel D has a desired shape.
- the first sample port 2 can be rotated around the Z axis by the tilting means 11 and the upper surface 2a can be tilted to an arbitrary angle.
- the desired shape can be reliably checked.
- the diamond abrasive grain D can be reliably measured since the process of observing the diamond barrel D can be observed by the observation means.
- the probe needle 21 is moved three-dimensionally by the prober 22, and the tip of the graft prober 21 is brought into contact with the rough diamond abrasive grain D. Then, by supplying the source gas G from the gas supply source 7 and irradiating the focused beam B, a deposition film is formed, and the tip of the transplant probe needle 21 and the diamond abrasive grain D are fixed (held). . After the solid, the prober 22 is moved, and the above-described separation step of separating the diamond abrasive grains D from the upper surface 2a of the first sample port 2 is performed.
- the table 10 is moved in one direction S, that is, in the direction of the axis A, and the cantilever L is placed in the observation region W. Perform the above moving process to place sample port 3. Then, the prober 22 is operated while observing with the observation means, and the contact step in which the diamond barrel D fixed to the tip of the transplantation prober 22 is brought into contact with the tip of the cantilever L is performed.
- a deposition film is formed again, and the cantilever L and the diamond abrasive grain D are temporarily fixed.
- the table 10 and the holding means 12 can be tilted around the axis A by the tilt mechanism 13 in a state in which the mutual positional relationship is maintained, so that the deposition film is not affected by the implantation prober 21. It is easy to put on the desired position. Therefore, it is possible to perform temporary fixing without any misalignment, leading to improvement in machining accuracy.
- the focused film B is irradiated to fix the transplantation needle prober 21 and the diamond abrasive grains D, and the deposited film is etched and held by the holding means 12 Solve.
- the diamond barrel D is completely attached to the tip of the cantilever L and joined together.
- the above-mentioned fine heating process is performed to finely process the needle tip.
- the rotation and tilting means 11 allows the second sample port 3 to be freely rotated and tilted. It can be completely formed around the grain D to ensure the joining and to ensure fine application.
- a cantilever L having diamond barrel D as a needle tip at the tip can be manufactured.
- Processing can be performed by irradiating a focused beam B from the irradiation unit 6.
- the processing stage 4 having the movable table 10 since the processing stage 4 having the movable table 10 is provided, the first in the observation area W can be obtained by moving the table 10 without bringing out the diamond barrel D and the cantilever L once outside the apparatus.
- the sample port 2 and the second sample port 3 can be arranged to facilitate the transfer of the diamond barrel D, so that the efficiency can be improved and the machining operation can be performed.
- continuous machining which has conventionally required time, can be easily performed, so that the machining time can be shortened and the manufacturing cost can be reduced.
- first sample port 2 and the second sample port 3 are arranged in a line on the table 10, the first sample port 2 and the second sample port 3 are simply moved in one direction S.
- the second sample port 3 can be arranged in the observation region W. Therefore, it is possible to simplify the configuration and facilitate the operation.
- the table 10 is provided with two mounting tables, that is, the first sample port 2 and the second sample port 3.
- the present invention is not limited to this.
- three or more mounting tables are provided. It doesn't matter.
- the force shown in the example in which diamond abrasive grains D and cantilevers L are used as the objects to be covered, and diamond canisters D are attached to cantilevers L is not limited to this case.
- a sample and a sample holder are used as the objects to be caloeed, a sample piece is prepared from the sample by the focused beam B, the sample piece is transferred and fixed to the sample holder, and the view for TEM is used. You may make an observation sample.
- the focused beam processing method in this case includes an arrangement step in which the first sample port 2 for placing the sample on the upper surface 2a is arranged in the observation region W by moving the table 10, and after the arrangement step, A production process for producing a sample piece (workpiece small piece) by irradiating the focused beam B while observing the sample, and after the production process, the sample piece is held by the holding means 12 and the first piece.
- the separation step of separating from the upper surface 2a of the sample port 2, the movement step of moving the table 10 after the separation step, and disposing the second sample port 3 in the observation region W, and the separation of the sample port 2 after the movement step A contact step in which the sample piece is brought close to the second sample port 3 and brought into contact with the sample holder placed on the upper surface 3a, and after the contact step, a focusing bead is formed on the contact portion between the sample piece and the sample holder.
- the table 10 is moved by the placement step, and the first sample port 2 on which the sample is placed is placed in the observation region W.
- the sample beam is cut by irradiating the focused beam B at a predetermined position while observing the sample.
- the first sample port 2 can be rotated or tilted to any angle, so that the focused beam B can be irradiated from any angle, and a sample piece of any shape can be reliably produced. .
- the separation step the produced sample piece is held by the holding means 12 and is lifted and separated from the upper surface 2 a of the first sample port 2.
- the table 10 is moved by a moving process, and the second sample port 3 on which the sample holder is placed is placed in the observation region W.
- a contact step is performed in which the sample piece is brought close to the sample holder while observing and brought into contact with a predetermined position of the sample holder.
- the observation sample for TEM can be manufactured by irradiating the focused beam B and bonding the sample piece and the sample holder with, for example, a deposition film.
- the second sample port 3 can be rotated and tilted as in the above-described manufacturing process, the focused beam B can be irradiated from any angle, and the deposition film is surely provided around the sample piece. Can be formed to ensure the bonding.
- the sample piece can be easily moved and processed only by moving the table 10, so that an efficient processing operation can be performed.
- each mounting table can be placed in the observation region by simply moving the table; Etc. can be easily performed, and the processing time can be reduced and the manufacturing cost can be reduced.
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Abstract
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Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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DE112006000517T DE112006000517T5 (de) | 2005-03-04 | 2006-02-21 | Arbeitsstufe, Fokusstrahl-Arbeitsvorrichtung und Fokusstrahl-Arbeitsverfahren |
US11/849,705 US8598485B2 (en) | 2005-03-04 | 2007-09-04 | Stage for working, focused beam working apparatus and focused beam working method |
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JP2005060110A JP4185062B2 (ja) | 2005-03-04 | 2005-03-04 | 加工用ステージ及び集束ビーム加工装置並びに集束ビーム加工方法 |
JP2005-060110 | 2005-03-04 |
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US11/849,705 Continuation US8598485B2 (en) | 2005-03-04 | 2007-09-04 | Stage for working, focused beam working apparatus and focused beam working method |
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Also Published As
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US20080029492A1 (en) | 2008-02-07 |
JP4185062B2 (ja) | 2008-11-19 |
US8598485B2 (en) | 2013-12-03 |
DE112006000517T5 (de) | 2008-01-10 |
JP2006242796A (ja) | 2006-09-14 |
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