WO2006081211A3 - Scribing tool and method - Google Patents

Scribing tool and method Download PDF

Info

Publication number
WO2006081211A3
WO2006081211A3 PCT/US2006/002355 US2006002355W WO2006081211A3 WO 2006081211 A3 WO2006081211 A3 WO 2006081211A3 US 2006002355 W US2006002355 W US 2006002355W WO 2006081211 A3 WO2006081211 A3 WO 2006081211A3
Authority
WO
WIPO (PCT)
Prior art keywords
scribing
semiconductor wafer
tool
engageable
scribing tool
Prior art date
Application number
PCT/US2006/002355
Other languages
French (fr)
Other versions
WO2006081211A2 (en
Inventor
Paul C Lindsey Jr
Original Assignee
Micro Proc Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/041,841 external-priority patent/US7392732B2/en
Application filed by Micro Proc Technology Inc filed Critical Micro Proc Technology Inc
Publication of WO2006081211A2 publication Critical patent/WO2006081211A2/en
Publication of WO2006081211A3 publication Critical patent/WO2006081211A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27B—SAWS FOR WOOD OR SIMILAR MATERIAL; COMPONENTS OR ACCESSORIES THEREFOR
    • B27B5/00—Sawing machines working with circular or cylindrical saw blades; Components or equipment therefor
    • B27B5/29—Details; Component parts; Accessories
    • B27B5/30—Details; Component parts; Accessories for mounting or securing saw blades or saw spindles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27B—SAWS FOR WOOD OR SIMILAR MATERIAL; COMPONENTS OR ACCESSORIES THEREFOR
    • B27B5/00—Sawing machines working with circular or cylindrical saw blades; Components or equipment therefor
    • B27B5/29—Details; Component parts; Accessories
    • B27B5/30—Details; Component parts; Accessories for mounting or securing saw blades or saw spindles
    • B27B5/32—Devices for securing circular saw blades to the saw spindle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0341—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0385—Rotary scoring blade
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9372—Rotatable type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9372—Rotatable type
    • Y10T83/9403—Disc type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Wood Science & Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

A scribing tool 10 for use in semiconductor scribing apparatus includes a rotatable semiconductor wafer scribing wheel 30 engageable with the semiconductor wafer 14 to form a scribe line when the tool exerts pressure on the semiconductor wafer and the scribing wheel rotates. Bearings 56 are engageable with the scribing wheel sides to resist sideways deflection during the scribing operation.
PCT/US2006/002355 2005-01-24 2006-01-23 Scribing tool and method WO2006081211A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/041,841 US7392732B2 (en) 2005-01-24 2005-01-24 Scribing tool and method
US11/041,841 2005-01-24
US11/326,204 US7415916B2 (en) 2005-01-24 2006-01-05 Scribing system with particle remover
US11/326,204 2006-01-05

Publications (2)

Publication Number Publication Date
WO2006081211A2 WO2006081211A2 (en) 2006-08-03
WO2006081211A3 true WO2006081211A3 (en) 2007-06-21

Family

ID=36740991

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/002355 WO2006081211A2 (en) 2005-01-24 2006-01-23 Scribing tool and method

Country Status (2)

Country Link
US (1) US7415916B2 (en)
WO (1) WO2006081211A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9138910B2 (en) * 2005-12-01 2015-09-22 Mitsuboshi Diamond Industrial Co., Ltd. Scribe device, scribe method, and tip holder
US20100199827A1 (en) * 2009-02-11 2010-08-12 James Colegrove Cutting Table Cutting Tool Assembly
CN102407536A (en) * 2011-09-30 2012-04-11 曾洲 Light guide plate machining device
JP6185813B2 (en) * 2013-09-30 2017-08-23 三星ダイヤモンド工業株式会社 Method and apparatus for dividing wafer laminate for image sensor
US10022883B2 (en) * 2016-11-22 2018-07-17 Xerox Corporation Sequential die cut and slitting for improved collation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5331877A (en) * 1993-06-02 1994-07-26 Ishii Chokokogu Mfg. Co., Ltd. Rotary blade assembly for a tile cutter
US5820006A (en) * 1994-01-18 1998-10-13 Dynatex International, Inc. Apparatus for scribing and/or breaking semiconductor wafers
US6722545B2 (en) * 1997-10-23 2004-04-20 Yuyama Mfg. Co., Ltd. Tablet cutting apparatus

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3094785A (en) * 1960-12-20 1963-06-25 Kulicke & Soffa Mfg Co Automatic semi-conductor wafer scriber
US3968712A (en) * 1975-05-01 1976-07-13 The Singer Company Fabricated table for stationary power tools
US4221150A (en) * 1978-11-24 1980-09-09 Optical Coating Laboratory, Inc. Glass scribing apparatus
US4228711A (en) * 1979-05-17 1980-10-21 The Fletcher-Terry Company Self-castering glass cutter and compensating bi-directional head
US4383460A (en) * 1981-06-26 1983-05-17 Red Devil Inc. Self aligning pillar post for glass cutters
US5183672A (en) * 1991-04-16 1993-02-02 Gary W. Fetterhoff Apparatus for forming at least one fold line pattern in a rigid plastic material
US5718615A (en) * 1995-10-20 1998-02-17 Boucher; John N. Semiconductor wafer dicing method
US6679243B2 (en) * 1997-04-04 2004-01-20 Chien-Min Sung Brazed diamond tools and methods for making
US6203416B1 (en) * 1998-09-10 2001-03-20 Atock Co., Ltd. Outer-diameter blade, inner-diameter blade, core drill and processing machines using same ones
DE19844397A1 (en) * 1998-09-28 2000-03-30 Hilti Ag Abrasive cutting bodies containing diamond particles and method for producing the cutting bodies
EP1179512B1 (en) * 2000-08-11 2011-12-28 Mitsuboshi Diamond Industrial Co., Ltd. Cutter wheel, apparatus and method for scribing brittle materials

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5331877A (en) * 1993-06-02 1994-07-26 Ishii Chokokogu Mfg. Co., Ltd. Rotary blade assembly for a tile cutter
US5820006A (en) * 1994-01-18 1998-10-13 Dynatex International, Inc. Apparatus for scribing and/or breaking semiconductor wafers
US6722545B2 (en) * 1997-10-23 2004-04-20 Yuyama Mfg. Co., Ltd. Tablet cutting apparatus

Also Published As

Publication number Publication date
WO2006081211A2 (en) 2006-08-03
US7415916B2 (en) 2008-08-26
US20060162173A1 (en) 2006-07-27

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