WO2006069140A3 - Electriplast moldable capsule and method of manufacture - Google Patents

Electriplast moldable capsule and method of manufacture Download PDF

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Publication number
WO2006069140A3
WO2006069140A3 PCT/US2005/046337 US2005046337W WO2006069140A3 WO 2006069140 A3 WO2006069140 A3 WO 2006069140A3 US 2005046337 W US2005046337 W US 2005046337W WO 2006069140 A3 WO2006069140 A3 WO 2006069140A3
Authority
WO
WIPO (PCT)
Prior art keywords
bundle
moldable
based material
electriplast
resin
Prior art date
Application number
PCT/US2005/046337
Other languages
French (fr)
Other versions
WO2006069140A2 (en
Inventor
Thomas Aisenbrey
Original Assignee
Integral Technologies Inc
Thomas Aisenbrey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integral Technologies Inc, Thomas Aisenbrey filed Critical Integral Technologies Inc
Publication of WO2006069140A2 publication Critical patent/WO2006069140A2/en
Publication of WO2006069140A3 publication Critical patent/WO2006069140A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

A method to form moldable capsules of a conductively doped resin-based material are created. The method comprises compressing a bundle of micron conductive fiber strands by passing the bundle through a compressing ring. A resin-based material is extruded/pultruded onto the compressed bundle. The resin-based material and the bundle are sectioned into moldable capsules. The micron conductive fiber comprises between about 20 % and about 50 % of the total weight of each moldable capsule.
PCT/US2005/046337 2004-12-21 2005-12-21 Electriplast moldable capsule and method of manufacture WO2006069140A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63808004P 2004-12-21 2004-12-21
US60/638,080 2004-12-21

Publications (2)

Publication Number Publication Date
WO2006069140A2 WO2006069140A2 (en) 2006-06-29
WO2006069140A3 true WO2006069140A3 (en) 2007-06-14

Family

ID=36602281

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/046337 WO2006069140A2 (en) 2004-12-21 2005-12-21 Electriplast moldable capsule and method of manufacture

Country Status (1)

Country Link
WO (1) WO2006069140A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9012021B2 (en) * 2008-03-26 2015-04-21 Xerox Corporation Composition of matter for composite plastic contact elements featuring controlled conduction pathways, and related manufacturing processes
DE202013100463U1 (en) * 2013-02-01 2014-05-07 Smp Deutschland Gmbh Polymer harness

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085931A (en) * 1989-01-26 1992-02-04 Minnesota Mining And Manufacturing Company Microwave absorber employing acicular magnetic metallic filaments
US5545474A (en) * 1994-03-01 1996-08-13 Martin Marietta Corporation Electromagnetic-attenuating coating materials
US6905637B2 (en) * 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085931A (en) * 1989-01-26 1992-02-04 Minnesota Mining And Manufacturing Company Microwave absorber employing acicular magnetic metallic filaments
US5545474A (en) * 1994-03-01 1996-08-13 Martin Marietta Corporation Electromagnetic-attenuating coating materials
US6905637B2 (en) * 2001-01-18 2005-06-14 General Electric Company Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom

Also Published As

Publication number Publication date
WO2006069140A2 (en) 2006-06-29

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