WO2006067689A3 - Printed circuit board arrangement - Google Patents

Printed circuit board arrangement Download PDF

Info

Publication number
WO2006067689A3
WO2006067689A3 PCT/IB2005/054244 IB2005054244W WO2006067689A3 WO 2006067689 A3 WO2006067689 A3 WO 2006067689A3 IB 2005054244 W IB2005054244 W IB 2005054244W WO 2006067689 A3 WO2006067689 A3 WO 2006067689A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
conductor
board arrangement
buried
Prior art date
Application number
PCT/IB2005/054244
Other languages
French (fr)
Other versions
WO2006067689A2 (en
Inventor
Samber Marc A De
Os Koen Van
Original Assignee
Koninkl Philips Electronics Nv
Samber Marc A De
Os Koen Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Samber Marc A De, Os Koen Van filed Critical Koninkl Philips Electronics Nv
Priority to JP2007546291A priority Critical patent/JP2008524841A/en
Priority to US11/722,342 priority patent/US20100012367A1/en
Publication of WO2006067689A2 publication Critical patent/WO2006067689A2/en
Publication of WO2006067689A3 publication Critical patent/WO2006067689A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a printed circuit board arrangement with a multi- layer substrate (1, 2) having a buried conductor (4) and a contact area (3), connected to the conductor (4) and being disposed on a surface of the substrate. In order to improve the cooling of the buried conductor, a metal cooling area (6) is provided above the conductor (4), and is connected to the conductor by means of one or more via conductors (7).
PCT/IB2005/054244 2004-12-21 2005-12-14 Printed circuit board arrangement WO2006067689A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007546291A JP2008524841A (en) 2004-12-21 2005-12-14 Printed circuit board equipment
US11/722,342 US20100012367A1 (en) 2004-12-21 2005-12-14 Printed circuit board arrangement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04106756 2004-12-21
EP04106756.2 2004-12-21

Publications (2)

Publication Number Publication Date
WO2006067689A2 WO2006067689A2 (en) 2006-06-29
WO2006067689A3 true WO2006067689A3 (en) 2006-09-21

Family

ID=36588696

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2005/054244 WO2006067689A2 (en) 2004-12-21 2005-12-14 Printed circuit board arrangement

Country Status (4)

Country Link
JP (1) JP2008524841A (en)
CN (1) CN101088310A (en)
TW (1) TW200638822A (en)
WO (1) WO2006067689A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011084326A1 (en) * 2011-10-12 2013-04-18 Osram Opto Semiconductors Gmbh Flexible printed circuit board for electrical contacting and mechanical fastening of a lamp in a luminaire
DE102014217927A1 (en) * 2014-09-08 2016-03-10 Robert Bosch Gmbh Method for solderless electrical press-in contacting of electrically conductive press-fit pins in printed circuit boards
JP6251420B1 (en) * 2016-05-30 2017-12-20 三菱電機株式会社 Electronic module and method for manufacturing electronic module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768813A2 (en) * 1995-10-13 1997-04-16 Murata Manufacturing Co., Ltd. Printed circuit boards
US6008987A (en) * 1998-04-21 1999-12-28 Nortel Networks Corporation Electronic circuitry
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US6212076B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Enhanced heat-dissipating printed circuit board package
US6335862B1 (en) * 1999-11-17 2002-01-01 Nec Corporation Multilayer printed wiring board provided with injection hole for thermally conductive filler

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768813A2 (en) * 1995-10-13 1997-04-16 Murata Manufacturing Co., Ltd. Printed circuit boards
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US6008987A (en) * 1998-04-21 1999-12-28 Nortel Networks Corporation Electronic circuitry
US6212076B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Enhanced heat-dissipating printed circuit board package
US6335862B1 (en) * 1999-11-17 2002-01-01 Nec Corporation Multilayer printed wiring board provided with injection hole for thermally conductive filler

Also Published As

Publication number Publication date
JP2008524841A (en) 2008-07-10
CN101088310A (en) 2007-12-12
WO2006067689A2 (en) 2006-06-29
TW200638822A (en) 2006-11-01

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