WO2006048846A3 - Semiconductor chip connection based on carbon nanotubes - Google Patents

Semiconductor chip connection based on carbon nanotubes Download PDF

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Publication number
WO2006048846A3
WO2006048846A3 PCT/IB2005/053625 IB2005053625W WO2006048846A3 WO 2006048846 A3 WO2006048846 A3 WO 2006048846A3 IB 2005053625 W IB2005053625 W IB 2005053625W WO 2006048846 A3 WO2006048846 A3 WO 2006048846A3
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WO
WIPO (PCT)
Prior art keywords
carbon nanotubes
integrated circuit
semiconductor chip
chip connection
connection based
Prior art date
Application number
PCT/IB2005/053625
Other languages
French (fr)
Other versions
WO2006048846A2 (en
Inventor
Chris Wyland
Original Assignee
Koninkl Philips Electronics Nv
Chris Wyland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Chris Wyland filed Critical Koninkl Philips Electronics Nv
Publication of WO2006048846A2 publication Critical patent/WO2006048846A2/en
Publication of WO2006048846A3 publication Critical patent/WO2006048846A3/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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Abstract

Conductive connections between components of an integrated circuit package are made, wherein carbon nanotubes (130, 430) extend from a surface of a first integrated circuit package component (120, 410) and distal ends of the carbon nanotubes are embedded in a connector (422) at a second integrated circuit package component (110, 420). The embedding approach involves, e.g., physical coupling (i.e., pressing) of the carbon nanotubes and the connector together. This approach is applicable to coupling a variety of components together, such as integrated circuit dies (flip chip (120) and conventional (420) to package substrates (110, 410) and/or leadframes (410).
PCT/IB2005/053625 2004-11-04 2005-11-04 Semiconductor chip connection based on carbon nanotubes WO2006048846A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62541304P 2004-11-04 2004-11-04
US60/625,413 2004-11-04

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WO2006048846A2 WO2006048846A2 (en) 2006-05-11
WO2006048846A3 true WO2006048846A3 (en) 2006-09-21

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Publication number Priority date Publication date Assignee Title
TWI463615B (en) * 2004-11-04 2014-12-01 Taiwan Semiconductor Mfg Co Ltd Nanotube-based directionally-conductive adhesive
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US8647922B2 (en) 2007-11-08 2014-02-11 Nanyang Technological University Method of forming an interconnect on a semiconductor substrate
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