WO2006035856A1 - 回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置 - Google Patents
回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置 Download PDFInfo
- Publication number
- WO2006035856A1 WO2006035856A1 PCT/JP2005/017924 JP2005017924W WO2006035856A1 WO 2006035856 A1 WO2006035856 A1 WO 2006035856A1 JP 2005017924 W JP2005017924 W JP 2005017924W WO 2006035856 A1 WO2006035856 A1 WO 2006035856A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- inspection
- circuit device
- electrodes
- insulating substrate
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
Definitions
- the present invention includes, for example, an electrode device for testing a circuit device used when performing electrical inspection of a circuit device such as a printed circuit board or a semiconductor integrated circuit, a manufacturing method thereof, and the electrode device for testing a circuit device.
- the present invention relates to an inspection device for a circuit device. Background art
- circuit board to be inspected an electrical resistance between electrodes in a circuit board to be inspected (hereinafter also referred to as “circuit board to be inspected”) is measured.
- test electrodes two test target electrodes (hereinafter referred to as “test electrodes”) of the test circuit board 90 that are electrically connected to each other are used.
- test electrodes Press each of the current supply probes PA and PD and the voltage measurement probes PB and PC against each of 91 and 92, and in this state, connect the power supply device between the current supply probes PA and PD.
- a current is supplied from 93, and the voltage signal detected by the voltage measurement probes PB and PC at this time is processed in the electric signal processing device 94, whereby the electric resistance between the electrodes 91 and 92 to be inspected is increased.
- a means for determining the thickness is employed.
- the current supply probes PA and PD and the voltage measurement probes PB and PC may be brought into contact with the electrodes 91 and 92 with a considerably large pressing force.
- the probe is made of metal and its tip is pointed, so that the surface of the electrodes 91 and 92 to be inspected is damaged when the probe is pressed, and the circuit board Becomes impossible to use. Under these circumstances, measurement of electrical resistance cannot be performed on all circuit boards that are regarded as products, and so it must be a so-called sampling inspection. Can not.
- the connecting member that contacts the electrode to be inspected is anisotropically conductive.
- An inspection apparatus constituted by a sheet has been proposed (see, for example, Patent Document 1 to Patent Document 3).
- FIG. 25 is an explanatory diagram showing an outline of a configuration of an example of a conventional circuit device inspection device.
- the upper inspection head 6A and the lower inspection head 6B having a plurality of inspection pins 4 arranged at predetermined standard lattice point positions are arranged so as to face each other! RU
- the upper side inspection head 6A has a terminal electrode 8A on the back surface (the lower surface in FIG. 25) and a front surface (the lower surface in FIG. 25) on the front surface (the lower surface in FIG. 25) via the anisotropic conductive elastomer sheet 7A.
- An adapter 8 having an inspection electrode 8B is disposed, and an anisotropic conductive elastomer sheet 10A is disposed on the surface of the adapter 8.
- a terminal electrode 9A is provided on the rear surface (lower surface in FIG. 25) and the front surface (upper surface in FIG. 25).
- An adapter 9 having an inspection electrode 9B is disposed on the surface of the adapter 9, an anisotropic conductive elastomer sheet 10B is disposed.
- each of the inspection pins 4 in the upper inspection head 6A and the lower inspection head 6B is connected to the columnar tip portion 4A and the tip portion 4A.
- a central portion 4B having a larger diameter, continuous to the central portion 4B, a large diameter portion 4C having a larger diameter than the central portion 4B, and continuous to the large diameter portion 4C and having the same outer diameter as the central portion 4B.
- a test pin body 4E composed of a base end portion 4D and an electric wire 12 whose rear end portion is electrically connected to a tester (not shown) via a connector (not shown). The base end portion 4D of the main body 4E is crushed in a state where the one end portion 12A of the electric wire 12 is inserted therein, so that the electric wire 12 is integrally fixed and electrically connected to the inspection pin main body 4E.
- a circuit device 11 to be inspected such as a printed circuit board is disposed between the anisotropic conductive elastomer sheet 10A and the anisotropic conductive elastomer sheet 10B.
- the lower inspection head 6B is moved upward, each of the electrodes 11A to be inspected of the circuit device 11 to be inspected is inspected by the inspection electrode of the upper adapter 8 via the anisotropic conductive elastomer sheet 10A.
- Electrode to be inspected in circuit device 1 1 Each force of IB Touches each of inspection electrodes 9B of lower adapter 9 via anisotropic conductive elastomer sheet 10B, and pressurizes so that the whole is compressed in the thickness direction As a result, the required electrical connection between the inspection electrode 11A and the inspection pin 4 of the upper inspection head 6A is achieved, and the inspection pin 4 of the inspection electrode 11B and the lower inspection head 6B is achieved. In this state, the electrical inspection of the circuit device 11 to be inspected is performed.
- Patent Document 1 Japanese Patent Laid-Open No. 9 26446
- Patent Document 2 JP 2000-74965 A
- Patent Document 3 Japanese Patent Laid-Open No. 2000-241485
- the inspection pin in the inspection head is sufficiently insulated so that the required electrical inspection can be performed with high accuracy with the circuit apparatus to be inspected.
- the adjacent inspection pins are arranged with a sufficient interval, specifically, the separation distance between the adjacent inspection pins is 0.25 mm or more. Arranged and needed to be.
- the number of electrodes has increased with the increase in functionality and capacity of semiconductor integrated circuits, and the arrangement pitch of electrodes, that is, the distance between the centers of adjacent electrodes, and the high density.
- the adapter used for the electrical inspection of these circuit devices is required. For example, a wiring portion having a fine and complicated pattern and an inspection electrode are formed, or terminal electrodes are arranged at lattice point positions with a smaller pitch as the number of inspected electrodes on the circuit board to be inspected increases. In other words, it is necessary to form the terminal electrodes at a high density.
- FIG. 1 A method of electrically connecting the inspection pin body 5E and the electric wire 12 through a cylindrical metal member 14 having an inner diameter that fits or matches the outer diameter of the base end 5D of the inspection pin body 5E is used. Yes. Specifically, the base end portion 14A of the metal member 14 fixed in a state of being electrically connected to the base end portion 5D of the inspection pin main body 5E is in a state where the one end portion 12A of the electric wire 12 is inserted therein. As a result of the crushing, one end 12A of the electric wire 12 is fixed integrally to the inspection pin main body 5E.
- 5A is a cylindrical tip portion
- 5B is continuous to the tip portion 5A
- 5C is continuous to the central portion 5B, and from the central portion 5B. It is a large diameter part.
- the electrical contact T1 between the base end portion 5D of the inspection pin main body 5E and the metal member 14 and the electrical contact T2 between the metal member 14 and the electric wire 12 are provided at two locations.
- the contact resistance of the test pin 5 itself is increased, and as a result, the degree of variation in the measured value detected by the tester increases, and the required electrical inspection is performed. There is a problem that it cannot be performed with high accuracy.
- the present invention has been made based on the circumstances as described above.
- the first object of the present invention is to reduce the size of the connection electrode while ensuring sufficient insulation between the adjacent connection electrodes. It is an object of the present invention to provide an electrode device for circuit device inspection that can be formed with an array pitch and that can be configured with a low contact resistance of the electrode device itself.
- connection electrodes can be formed with a small arrangement pitch while ensuring sufficient insulation between the adjacent connection electrodes, and the contact resistance of the electrode device itself is reduced.
- An object of the present invention is to provide a method capable of reliably manufacturing an electrode device for circuit device inspection that can be configured as a small device.
- the third object of the present invention is to provide a circuit device having a small arrangement pitch of the electrodes to be inspected or having a large number of electrodes, even for all the electrodes to be inspected! Measure the desired electrical resistance
- An object of the present invention is to provide an inspection device for a circuit device that can be performed with high accuracy.
- An electrode device for circuit device inspection includes a flat insulating substrate and a plurality of connecting electrodes arranged at predetermined positions on the front surface side of the insulating substrate and having a flat back surface. And a plurality of electric wires integrally connected to the back surface of the connection electrode in a state where one end portion is fixed so as to extend through the insulating substrate in the thickness direction. It is characterized by.
- An electrode device for circuit device inspection includes an insulating substrate in which a plurality of wiring through holes penetrating in the thickness direction are formed at predetermined positions, and wiring for each of the insulating substrates.
- a plurality of columnar support members that are integrally fixed in the through-holes and have protruding portions that protrude from the surface of the insulating substrate, and the back surfaces of the support members are each supported by the front end surface of the support member.
- the connection electrodes whose back surface is flat and one end portion is fixed so as to extend through the supporting member in the thickness direction, the one end surface is integrated with the back surface of the connection electrode. It is characterized by comprising a plurality of connected electric wires.
- the height of the protruding portion of the support member is 10 to: L00 m.
- the outer diameter of the protruding portion of the support member is the connection electrode. The diameter is preferably 90 to 140% of the diameter.
- the height force of each connection electrode is ⁇ ⁇ 140 / zm.
- each connection electrode is constituted by a plate-like one or a hemispherical or one having a frustum-like projection electrode having a diameter that decreases toward the tip. be able to.
- each connection electrode is preferably formed by laminating a copper layer, a nickel layer, and a gold layer so that the back surface force is also directed to the surface. Moreover, in the circuit device inspection electrode device of the present invention, it is preferable that the connection electrode is arranged at a predetermined lattice point position.
- a plurality of wiring through-holes each penetrating in the thickness direction are formed in each wiring through-hole of the insulating substrate formed at a predetermined position.
- the wire is fixed by placing one end of the wire in a threaded manner, filling the through-hole for wiring with a liquid sealing agent and curing the liquid sealing agent, and fixing the surface of the insulating substrate.
- One end surface of the electric wire is exposed by flattening treatment, and the electric wire is treated as a mating electrode to form a connection electrode integrally connected to one end surface of each electric wire.
- a laminated body in which a protruding portion forming material layer is formed on the surface of an insulating substrate forming material is produced, A plurality of protruding portion forming through holes that penetrate each protruding portion forming material layer in the thickness direction, and a plurality of wirings that penetrate the insulating substrate forming material in the thickness direction, each continuous with the protruding portion forming through holes.
- the liquid sealant is filled into the hole portion and the liquid sealant is cured.
- connection electrode integrally connected to one end surface of each electric wire by exposing the one end surface of the electric wire, and using the electric wire as a plating electrode, and then forming the protruding portion forming material layer It has the process of forming the protrusion part of a supporting member by removing this.
- the electroplating process includes a step of forming a copper layer on one end surface of the wire, and a step of forming a nickel layer on the surface of the copper layer. And a step of forming a gold layer on the surface of the nickel layer.
- an insulating substrate having a thickness of 5 mm or less! /.
- a circuit device inspection apparatus includes the above-described circuit device inspection electrode device.
- the circuit device inspection adapter is disposed on the surface of the circuit device inspection electrode device via an anisotropic conductive sheet,
- the circuit device inspection adapter is used in a circuit device to be inspected to be inspected.
- An adapter body having a plurality of inspection electrodes formed according to a pattern corresponding to a plurality of electrodes to be inspected and having a plurality of terminal electrodes formed at predetermined positions on the back surface, and disposed on the surface of the adapter body It is characterized by comprising an anisotropic conductive sheet formed.
- a circuit device inspection adapter is disposed on the surface of the circuit device inspection electrode device via an anisotropic conductive sheet
- the circuit device inspection adapter is separated from one test target electrode formed according to a pattern corresponding to each of the plurality of test electrodes in the circuit device to be inspected on the surface.
- An adapter body having a test electrode pair made up of a current supply electrode and a voltage measurement electrode arranged, and having a plurality of terminal electrodes formed at predetermined positions on the back surface, and disposed on the surface of the adapter body. And an anisotropic conductive sheet.
- the circuit device inspection adapter has terminal electrodes formed in accordance with predetermined lattice point positions.
- one end surface of the electric wire is integrally connected to the back surface of the connection electrode, whereby the wire diameter of the electric wire is smaller than the size of the connection electrode. Therefore, a plurality of connection electrodes can be formed with sufficient insulation between adjacent connection electrodes, so that the arrangement pitch of the connection electrodes can be reduced.
- each connection electrode since each connection electrode has only one electrical contact with the electric wire, it can be configured with a small contact resistance and has good electrical characteristics. .
- connection electrode is provided on the front end surface of the support member that is integrally fixed to the insulating substrate in a state in which one end protrudes from the surface force of the insulating substrate.
- connection electrodes between adjacent connection electrodes It is possible to form the connection electrodes with a small arrangement pitch while ensuring sufficient insulation, and to reliably manufacture a circuit device inspection electrode device having a small contact resistance and good electrical characteristics. it can.
- connection electrodes can be formed with a small arrangement pitch while ensuring sufficient insulation between the adjacent connection electrodes, and the contact resistance is reduced. Since the circuit device inspection electrode device having a small and good electrical characteristic is provided, even for a circuit device having a small arrangement pitch of the electrodes to be inspected or having a large number of electrodes, the expected electric resistance is larger than the electrodes to be inspected. Can be measured with high accuracy.
- FIG. 1 is an explanatory sectional view showing an outline of a configuration of an example of an inspection apparatus for a circuit device according to the present invention, together with a circuit board to be inspected.
- FIG. 2 is an explanatory cross-sectional view showing an enlarged part of the inspection apparatus for the circuit device shown in FIG. 1.
- FIG. 3 is an explanatory view showing an upper adapter in the upper substrate clamping body constituting the circuit board inspection apparatus shown in FIG. 1 together with the upper inspection head and the circuit board to be inspected.
- FIG. 4 is an explanatory view showing a surface of an inspection circuit board in the circuit board inspection apparatus shown in FIG. 1.
- FIG. 4 is an explanatory view showing a surface of an inspection circuit board in the circuit board inspection apparatus shown in FIG. 1.
- FIG. 5 is an explanatory view showing the back surface of the circuit board for inspection in the circuit board inspection apparatus shown in FIG.
- FIG. 6 is a cross-sectional view for explaining the outline of the configuration of the electrode device constituting the upper side inspection head in the circuit board inspection apparatus shown in FIG. 1.
- FIG. 7 is an explanatory sectional view showing an insulating substrate in which a wiring through hole is formed in the insulating substrate forming material.
- FIG. 8 is an explanatory cross-sectional view showing a state in which an electric wire is arranged in each wiring through hole in the insulating substrate.
- FIG. 9 is an explanatory cross-sectional view showing a state in which the sealing agent filled in each wiring through hole in the insulating substrate is cured and the electric wire is fixed to the insulating substrate.
- FIG. 11 is an explanatory sectional view showing a state in which a connection electrode forming resist layer having a predetermined pattern hole is formed on the surface of an insulating substrate.
- connection electrode in which a copper layer, a nickel layer, and a gold layer are stacked on the front surface and the front surface is formed in the pattern hole in the connection electrode forming resist layer. It is sectional drawing for description which shows these.
- FIG. 13 A sectional view for explaining the outline of the configuration of the circuit device inspection electrode device constituting the upper side inspection head and the lower side inspection head in another example of the circuit device inspection device of the present invention.
- FIG. 14 is an explanatory cross-sectional view showing a composite in which a protruding portion forming material layer is formed on the surface of an insulating substrate forming material.
- FIG. 15 is an explanatory cross-sectional view showing a state in which a hole made of a protruding portion forming through hole and a wiring through hole is formed in the composite.
- FIG. 16 is an explanatory cross-sectional view showing a state in which an electric wire is arranged in each hole in the composite.
- FIG. 18 is an explanatory cross-sectional view showing a state in which the protruding portion of the electric wire that also projects the surface force of the composite is polished and the surface of the composite is flattened.
- FIG. 19 is an explanatory cross-sectional view showing a state in which a connecting electrode forming resist layer in which a predetermined pattern hole is formed is formed on the surface of a composite.
- FIG. 20 A state in which a connection electrode is formed by laminating a copper layer, a nickel layer, and a gold layer on the back surface and the front surface in the pattern hole in the resist layer for forming the connection electrode. It is sectional drawing for description which shows these.
- FIG. 21 is an explanatory cross-sectional view showing an outline of a configuration of still another example of the circuit device inspection apparatus of the present invention in a partially enlarged state.
- FIG. 6 The upper side of the upper substrate clamping body constituting the circuit board inspection apparatus shown in FIG. FIG. 6 is a cross-sectional view for explanation showing the part-side adapter together with the upper-side inspection head and the inspection target circuit board.
- FIG. 23 is an explanatory cross-sectional view showing an outline of a configuration in still another example of the circuit device inspection electrode device of the present invention.
- FIG. 24 is a schematic diagram of an apparatus for measuring electrical resistance between electrodes on a circuit board by using a current supply probe and a voltage measurement probe.
- FIG. 25 is an explanatory diagram showing an outline of the configuration of an example of a conventional circuit board inspection apparatus.
- FIG. 26 is an explanatory cross-sectional view showing an inspection pin constituting an inspection head of the circuit board inspection apparatus of FIG. 25.
- FIG. 27 is an explanatory cross-sectional view showing another configuration example of the inspection pin constituting the inspection head. Explanation of symbols
- Circuit board to be inspected circuit board to be inspected
- T1 electrical contacts
- Anisotropic conductive sheet Lower side inspection head Anisotropic conductive sheet Conductive particles
- a pattern hole 79 Resist layer for electrode formation for connection
- FIG. 1 is an explanatory sectional view showing an outline of the configuration of an example of an inspection apparatus for a circuit device of the present invention together with a circuit board to be inspected
- FIG. 2 is a part of the inspection apparatus for the circuit device shown in FIG. It is sectional drawing for description which expands and shows.
- An inspection device for this circuit device (hereinafter simply referred to as “inspection device”) 15 is a circuit board to be inspected (hereinafter also referred to as “circuit board to be inspected”) 1.
- the upper substrate clamping body 30 provided with the anisotropic conductive sheet 33 on the lower surface in FIG. 1 and its surface (upper surface in FIG. 1) disposed on the lower surface side of the circuit board 1 to be inspected
- the lower substrate pressing body 50 provided with the conductive sheet 53 is disposed so as to face each other in the vertical direction.
- the circuit board 1 to be inspected in this example has an upper surface inspected electrode 2 formed on the upper surface and a lower surface inspected electrode 3 formed on the lower surface, and these lower surface inspected electrodes. Each of 3 is individually electrically connected to the corresponding upper surface inspection electrode 2.
- circuit board 1 to be inspected various structures such as a single-sided printed circuit board, a double-sided printed circuit board, and a multilayer printed circuit board can be used.
- the circuit board may be any of a flexible board, a rigid board, and a flex / rigid board obtained by combining these.
- the upper substrate clamping body 30 is formed on, for example, a plate-shaped upper column support plate 23 made of a phenolic resin-containing laminate (trade name “Sumilite” manufactured by Sumitomo Bakelite Co., Ltd.) containing a fine yarn cloth. It is planted and supported by a plurality of upper struts 22 (four are shown in FIG. 1) extending vertically from the upper strut planting plate 23 in a downward direction.
- a plate-shaped upper column support plate 23 made of a phenolic resin-containing laminate (trade name “Sumilite” manufactured by Sumitomo Bakelite Co., Ltd.) containing a fine yarn cloth. It is planted and supported by a plurality of upper struts 22 (four are shown in FIG. 1) extending vertically from the upper strut planting plate 23 in a downward direction.
- the lower substrate clamping body 50 is planted on a flat plate-like lower column support plate 27 made of, for example, a laminate of phenol resin containing a fine yarn cloth (trade name “Sumilite” manufactured by Sumitomo Bakelite Co., Ltd.). It is supported by a plurality of (three are shown in FIG. 1) lower side struts 26 that extend vertically from the lower side strut planting plate 27 and extend upward.
- a flat plate-like lower column support plate 27 made of, for example, a laminate of phenol resin containing a fine yarn cloth (trade name “Sumilite” manufactured by Sumitomo Bakelite Co., Ltd.). It is supported by a plurality of (three are shown in FIG. 1) lower side struts 26 that extend vertically from the lower side strut planting plate 27 and extend upward.
- the upper substrate clamping body 30 constituting the inspection device 15 is configured such that the upper adapter 31 and the upper inspection head 35 are arranged in this order with the lower force in FIG.
- the upper-side adapter 31 is formed by an appropriate means on the inspection circuit board 32 constituting the adapter body and on the surface (the lower surface in FIG. 3) of the inspection circuit board 32. It is comprised by the anisotropically conductive sheet 33 which has the elasticity arrange
- a plurality of inspection electrodes 32A are formed on the surface of the inspection circuit board 32 in the upper adapter 31 according to the arrangement pattern of the upper surface inspection electrodes 2 on the upper surface of the inspection circuit board 1. Arranged!
- 32E is a positioning hole.
- the anisotropic conductive sheet 33 in the upper adapter 31 is arranged such that the conductive particles P are aligned in the thickness direction of the anisotropic conductive sheet 33 in the base material made of an elastic polymer material having insulation properties. It is a so-called dispersion-type anisotropic conductive sheet that is contained in an oriented state, and in the measurement state, a conductive path is formed by a chain of conductive particles P when pressed in the thickness direction. Is done.
- the “measurement state” means, for example, that the circuit board 1 to be inspected is clamped by the upper substrate clamping body 30 and the lower substrate clamping body 50, so that the anisotropic conductive sheet 33 has its thickness. It means the state pressed in the vertical direction.
- the anisotropic conductive sheet 33 has higher conductivity in the thickness direction than conductivity in the plane direction perpendicular to the thickness direction.
- the electrical resistance value in the thickness direction is preferred. It is preferable to have electrical characteristics such that the ratio of the electrical resistance value in the plane direction to 1 or less, particularly 0.5 or less.
- Each upper inspection head 35 has a plurality of connection electrodes 43 arranged on the surface thereof at lattice point positions having the same pitch as the terminal electrodes 32C of the upper adapter 31.
- An electrode device hereinafter simply referred to as “electrode device” 40 and an anisotropic conductive sheet 37 fixed and disposed on the surface of the electrode device 40 by appropriate means.
- the anisotropic conductive sheet 37 in the upper side inspection head 35 is insulated from the conductive path forming portion 37A in which the conductive particles P are densely packed in a base material made of an elastic polymer material having insulating properties. Formed of an insulating portion 37B in which no or almost no conductive particles P exist in a base material made of an elastic polymer material having a property and formed according to a pattern corresponding to the terminal electrode 32C. A plurality of columnar conductive path forming portions 37A having the same surface area as the region occupied by the terminal electrode 32C are insulated from each other by an insulating portion 37B. In the measurement state, the conductive path forming portion 37A corresponding to the surface of the terminal electrode 32C (the upper surface in FIG. 3) is brought into contact with the conductive path forming portion 37A and pressed in the thickness direction. A conductive path is formed by the chain of conductive particles P.
- the anisotropic conductive sheet 37 in the example of this figure is such that the surface of the conductive path forming portion 37A (the lower surface in FIG. 3) is the insulating portion 37B on one side (the lower surface in FIG. 3) on the inspection circuit board 32 side.
- the surface (bottom surface in Fig. 3) force is also projected.
- the lower substrate clamping body 50 that constitutes the inspection apparatus 15 is configured such that the lower adapter 51 and the lower inspection head 55 are arranged in this order with the upper force in FIG.
- the lower substrate clamping body 50 includes an inspection execution area 16 formed between the upper substrate clamping body 30 and the lower substrate clamping body 50.
- a circuit board holding mechanism for holding the circuit board.
- alignment pins 19 for positioning the circuit board 1 to be inspected at an accurate position in the inspection execution region 16 are movably fixed to the lower side column implantation plate 27.
- the fixed plate 18 is fixed to the alignment movable plate 18 and is provided in a state of penetrating a positioning pin through hole 50A formed in the lower substrate pressing body 50.
- the lower-side adapter 51 is arranged by being fixed by an appropriate means on the inspection circuit board 52 constituting the adapter body and on the surface (the upper surface in FIG. 1) of the inspection circuit board 52. And an anisotropic conductive sheet 53 having elasticity.
- the inspection electrode 52A is arranged according to the arrangement pattern of the lower surface inspection electrode 3 on the lower surface of the circuit board 1 to be inspected.
- the pitch is 0.2 mm, 0.3 mm, 0.4 omm, 0. omm, 0.75 mm, 0.8 mm, ⁇ A plurality of terminal electrodes 52C are arranged according to the standard grid point positions of 06mm, 1.27mm, 1.5mm, 1.8mm or 2.54mm, and each of these terminal electrodes 52C is detected by the internal wiring section 52D. It is electrically connected to the heel electrode 52A.
- the anisotropic conductive sheet 53 in the lower adapter 51 is oriented so that conductive particles are aligned in the thickness direction of the anisotropic conductive sheet 53 in a base material made of an elastic polymer material having insulation properties. It is a so-called dispersive anisotropic conductive sheet contained in a state, and in the measurement state, a conductive path is formed by a chain of conductive particles when pressed in the thickness direction.
- the anisotropic conductive sheet 53 has higher conductivity in the thickness direction than conductivity in the plane direction perpendicular to the thickness direction.
- the electrical resistance value in the thickness direction is preferred. It is preferable to have electrical characteristics such that the ratio of the electrical resistance value in the plane direction to 1 or less, particularly 0.5 or less.
- the lower side inspection head 55 has a plate-like electrode device 60 having a plurality of connection electrodes 63 arranged on the surface thereof at lattice point positions having the same pitch as the terminal electrodes 52C of the lower side adapter 51.
- the anisotropic conductive sheet 57 is fixed to the surface of the electrode device 60 by an appropriate means.
- the anisotropic conductive sheet 57 in the lower side inspection head 55 has the same configuration as the anisotropic conductive sheet 37 in the upper side inspection head 35, and has an insulating elastic polymer material.
- a conductive path is formed by a chain of conductive particles.
- the anisotropic conductive sheet 57 is guided on, for example, one side of the circuit board 52 for inspection.
- the surface of the electric circuit forming part is an uneven surface with the surface force of the insulating part protruding.
- the electrode device 40 constituting the upper inspection head 35 includes a flat insulating substrate 41 and an insulating substrate 41 as shown in FIG.
- one end surface 44B includes a plurality of electric wires 44 that are integrally coupled to the back surface of the connection electrode 43.
- Each electric wire 44 has one end 44A in each of the plurality of wiring through holes 42 formed so as to extend in the thickness direction at positions corresponding to the respective connection electrodes 43 on the insulating substrate 41. Is inserted and insulated by a columnar fixing member 45 made of, for example, a hardened liquid sealant, filled in a minute gap formed between the inner peripheral surface of the wiring through hole 42 and the outer peripheral surface of the electric wire 44.
- the other end is electrically connected to a connector (not shown) and is further electrically connected to a tester (not shown) through this connector. .
- an insulating material having a specific resistance of, for example, 1 X 10 10 ⁇ 'cm or more include polyimide resin, polyester, and the like.
- Resin polyamide resin, phenol resin, polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic 'polystyrene resin, polyphenylene sulfide resin, polyether ethyl ketone resin, fluorine High mechanical strength resin such as resin, polyether nitrile resin, polyethersulfone resin, polyarylate resin, polyamide imide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester Resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenol resin, glass fiber reinforced fluorine Glass fiber type composite resin materials such as resin, carbon fiber reinforced epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenol resin, carbon fiber reinforced resin Carbon fiber type composite resin such as silicon resin, epoxy resin, phenol resin etc.
- silica, alumina, boron nitride and other inorganic materials examples thereof include a composite resin material containing a mesh.
- a composite plate material formed by laminating a plurality of plate materials made of these materials can also be used.
- the thickness t of the insulating substrate 41 is, for example, 5 mm or less because the wiring through-hole 42 is formed by a drill cage, so that the workability and productivity of the material can be improved. U ⁇ preferred to be.
- the thickness of the insulating substrate forming material on which the through-holes 42 for wiring are formed is 5 mm or less, which causes adverse effects such as chipping or breakage of the drill blade by one drill cutting operation. Since the wiring through-hole 42 can be formed with high efficiency without the need for multiple drilling operations to form one wiring through-hole 42. Therefore, it is possible to shorten the time required for the drill cleaning process and to form the through-hole 42 for wiring with high efficiency, and it is possible to advantageously manufacture the required electrode device 40 with high production efficiency. .
- a preferred example of the insulating substrate 41 is a glass fiber reinforced epoxy resin having a thickness of 2 to 5 mm.
- the size of the opening diameter of the wiring through hole 42 formed in the insulating substrate 41 is configured to be able to be filled with an amount of liquid sealing agent that can sufficiently fix the electric wire 44. Although it is not particularly limited as long as it is made, for example, it is set to 0.25 to 0.35 mm for the electric wire 44 having a wire diameter of 200 / zm.
- liquid sealant that is cured to form the fixing member 45 a liquid sealant that has sufficiently high adhesion to the insulating substrate 41 is used.
- Specific examples thereof include, for example, epoxy resin, Examples thereof include polyimide resin and polyamide resin.
- connection electrodes 43 has a multilayer structure in which a copper layer 43A, a nickel layer 43B, and a gold layer 43C are laminated from the back surface to the front surface. With such a layer structure, it is possible to obtain good electrical characteristics such as low contact resistance and to form each metal layer with sufficiently high bonding strength by having the nickel layer 43B. This can surely prevent the connection electrode 43 from being damaged.
- the height of the connection electrode 43 that is, the protruding height h of the connection electrode 43 from the surface of the insulating substrate 41 is preferably 1 to 140 ⁇ m, for example, and more preferably 3 ⁇ 80 ⁇ m.
- the conductive path forming portion 37A of the anisotropic conductive sheet 37 is The connecting electrode 43 itself can be sufficiently pressurized, and the required electrical connection can be reliably achieved.
- each metal layer constituting each of the connection electrodes 43 is, for example, within a range of 0.5 to 120 111 for the copper layer 43A, and 438 layers of the nickel layer 43A so that the total thickness satisfies the above range.
- the gold layer 43C can be appropriately set within the range of 0.2 to 2 ⁇ m.
- connection electrode 43 Since the connection electrode 43 has a one-to-one correspondence with the terminal electrode 32C of the upper-side adapter 31, the size of the connection electrode 43 may be the same as that of the terminal electrode 32C.
- an enameled wire or a -chromium wire such as an enameled wire or a chromium wire
- a wire having a wire diameter of, for example, 50 to 400 ⁇ m is used.
- the electrode device 40 having the above-described configuration can be manufactured as follows. First, a flat plate-like insulating substrate forming material 41A is prepared, and as shown in FIG. 7, a predetermined lattice point position in this insulating substrate forming material 41A, that is, the same pitch as the terminal electrode 32C of the upper adapter 31 is obtained. A plurality of wiring through holes 42 each penetrating in the thickness direction are formed, for example, by drilling at the positions of the lattice points, whereby the insulating substrate 41 is formed.
- one end portion 44A of the electric wire 44 is disposed so as to be inserted into each wiring through hole 42 in the insulating substrate 41 so that the tip portion thereof also projects the surface force of the insulating substrate 41. Then, it is supported by an appropriate drop-off prevention means (not shown), and in this state, for example, by a minute gap formed between the outer peripheral surface of the wire 44 and the inner peripheral surface of the wiring through hole 42.
- Capillary phenomenon is used to fill each wiring through-hole 42 with a liquid sealant, and as shown in FIG. 9, the liquid sealant is cured to form a fixing member 45, and each wire 44 is fixed to the insulating substrate 41.
- the curing treatment of the liquid sealant is performed, for example, by heat treatment, and the specific treatment conditions are appropriately selected in consideration of the type of material used.
- the surface of the insulating substrate 41 is flattened by polishing the portion protruding from the surface of the insulating substrate 41 of each electric wire 44 (including the excessively cured portion of the sealant). Then, one end surface 44B of each electric wire 44 is exposed, and then, as shown in FIG. 11, a connection electrode to be formed on the surface of the insulating substrate 41 to which one end portion 44A of the electric wire 44 is fixed.
- Vs 43 A resist layer 46 for forming a connection electrode made of, for example, a photoresist having a corresponding pattern hole 46A is formed, and as shown in FIG. 12, an electric plating process is performed by using the electric wire 44 as a plating electrode.
- a copper layer 43A, a nickel layer 43B, and a gold layer 43C are laminated on one end surface 44B of 44 from the back surface to the front surface, so that one end surface 44B of the electric wire 44 is integrally connected to the back surface.
- a plate-like connection electrode 43 is formed. Thereafter, the electrode device 40 shown in FIG. 6 is obtained by removing the resist layer 46 for forming the connection electrode.
- the electrode device 60 constituting the lower side inspection head 55 has the same configuration as the electrode device 40 in the upper side inspection head 35, and includes a flat insulating substrate 61 and the insulating substrate. On the surface of 61, a plurality of plate-like connection electrodes 63 formed at lattice point positions with the same pitch as the terminal electrodes 52C of the lower adapter 51, and one end 64A each of which has an insulating substrate 61 thickness. One end surface 64B is provided with a plurality of electric wires 64 integrally connected to the back surface of the connection electrode 63 in a state of being fixed so as to extend through in the direction.
- Each electric wire 64 has one end portion 64A inserted into each of the wiring through holes 62 formed so as to extend in the thickness direction at positions corresponding to the respective connection electrodes 63 on the insulating substrate 61.
- the insulating substrate 61 is formed by a columnar fixing member 65 made of, for example, a hardened material of a liquid sealant, which is filled in a minute gap formed between the inner peripheral surface of the wiring through-hole 62 and the outer peripheral surface of the electric wire 64.
- the other end is electrically connected to a connector (not shown) and is further electrically connected to a tester (not shown) via this connector (see FIG. 6). ).
- This electrode device 60 can be manufactured in the same manner as the electrode device 40 constituting the upper side inspection head 35.
- the elastic polymer material constituting the base material of the anisotropic conductive sheet constituting the inspection device 15 of the present invention is preferably a polymer material having a crosslinked structure.
- Various materials can be used as the curable polymer material that can be used to obtain a crosslinked polymer material. Specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene rubber, and styrene. Conjugated rubbers such as monobutadiene copolymer rubbers, acrylonitrile monobutadiene copolymer rubbers and hydrogenated products thereof, styrene-butagen block copolymer rubbers, styrene isoprene block copolymers, etc.
- Copolymer rubber and hydrogenated products thereof black-prene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-gen copolymer rubber Etc.
- the anisotropically conductive sheet to be obtained is required to have weather resistance, it is preferable to use a material other than the conjugated rubber, particularly from the viewpoint of forming processability and electrical properties. It is preferable to use it.
- the silicone rubber is preferably one obtained by crosslinking or condensing liquid silicone rubber.
- the liquid silicone rubber preferably has a viscosity of 10 5 poise or less at a strain rate of 10- ⁇ ec, and is any of a condensation type, an addition type, a bur group or a hydroxyl group-containing one. May be. Specific examples include dimethyl silicone raw rubber, methyl beer silicone raw rubber, and methyl vinyl silicone raw rubber.
- liquid silicone rubber containing a bur group is usually dimethyldichlorosilane or dimethyldialkoxysilane, and dimethylvinylchlorosilane or dimethylvinylalkoxysilane.
- dimethyldichlorosilane or dimethyldialkoxysilane and dimethylvinylchlorosilane or dimethylvinylalkoxysilane.
- it can be obtained from cocoon by subjecting it to hydrolysis and condensation, followed by fractionation by repeated dissolution and precipitation, for example.
- a liquid silicone rubber containing vinyl groups at both ends is polymerized with a cyclic siloxane such as otamethylcyclotetrasiloxane in the presence of a catalyst, and is used as a polymerization terminator, for example, dimethyl dibule.
- a cyclic siloxane such as otamethylcyclotetrasiloxane
- a catalyst for example, the amount of cyclic siloxane and the amount of polymerization terminator
- the catalyst for the cation polymerization alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or silanolate solution thereof can be used, and the reaction temperature is as follows. For example, 80 to 130 ° C.
- a liquid silicone rubber containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) usually contains dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane! / Then, it is obtained by subjecting it to hydrolysis and condensation, for example, followed by fractionation by repeated dissolution and precipitation.
- cyclic siloxane is polymerized in the presence of a catalyst, and as a polymerization terminator, dimethylenohydrochlorosilane, methinoresihydrochlorosilane, dimethylenohydroalkoxysilane or the like is used as the polymerization terminator, and other reaction conditions (for example, The amount of the cyclic siloxane and the amount of the polymerization terminator can be selected as appropriate.
- the catalyst for the cation polymerization alkali such as hydroxy-tetramethyl ammonium and ⁇ -butyl phosphonium hydroxide or silanolate solutions thereof can be used, and the reaction temperature is For example, it is 80 to 130 ° C.
- Such an elastic polymer substance preferably has a molecular weight Mw (referred to as a standard polystyrene-converted weight average molecular weight) of 10,000 to 40,000.
- Mw molecular weight
- the molecular weight distribution index Two or less are preferred.
- the sheet forming material for obtaining the anisotropic conductive sheet may contain a curing catalyst for curing the polymer substance material.
- a curing catalyst organic peroxides, fatty acid azo compounds, hydrosilylation catalysts and the like can be used.
- organic peroxide used as the curing catalyst examples include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide and ditertiary butyl peroxide.
- fatty acid azo compound used as the curing catalyst include azobisisobutyl nitrile.
- Specific examples of those that can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and its salts, platinum unsaturated group-containing siloxane complexes, bululsiloxane-platinum complexes, platinum and 1,3 dibutyltetramethyldisiloxane. And known complexes such as triorganophosphine or triorganophosphite and platinum complex, acetylacetate platinum chelate, and cyclic gen and platinum complex.
- the amount of the curing catalyst used is appropriately selected in consideration of the type of polymer material, the type of curing catalyst, and other curing conditions, but it is usually 100 parts by mass of the polymer material. On the other hand, it is 3 to 15 parts by mass.
- the sheet forming material may contain an inorganic filler such as ordinary silica powder, colloidal silica, airgel silica, alumina, or the like, if necessary.
- an inorganic filler such as ordinary silica powder, colloidal silica, airgel silica, alumina, or the like.
- the amount of such an inorganic filler used is not particularly limited, but if used in a large amount, the orientation of the conductive particles by a magnetic field cannot be sufficiently achieved, which is not preferable.
- the viscosity of the sheet forming material is preferably in the range of 10,000 to 100,000 cP at a temperature of 25 ° C.
- the conductive particles P those showing magnetism are used from the viewpoint that they can be easily aligned in the thickness direction of the anisotropic conductive sheet by applying a magnetic field.
- conductive particles include metal particles exhibiting magnetism such as nickel, iron and cobalt, particles of alloys thereof, particles containing these metals, or particles containing these particles as core particles.
- the surface of the core particle is coated with a metal with good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic substance particles such as glass beads or polymer particles.
- Particles whose core particle surface is coated with a conductive magnetic material such as nickel or cobalt, or whose core particles are coated with both a conductive magnetic material and a highly conductive metal are mentioned.
- a conductive magnetic material such as nickel or cobalt
- the means for coating the surface of the core particles with the conductive metal is not particularly limited, and can be performed by, for example, an electrochemical method or an electrolytic method.
- the coverage of the conductive metal on the particle surface is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
- the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particles, more preferably 1 to 30% by mass, still more preferably 3 to 25% by mass, and particularly preferably 4%. ⁇ 20% by mass. If the conductive metal to be coated is gold, the coating amount is
- the water content of the conductive particles P is preferably 5% or less, more preferably 3% or less, still more preferably 2% or less, and particularly preferably 1% or less.
- the conductive particles P are contained at a volume fraction of 5 to 60%, preferably 8 to 50%, particularly preferably 10 to 40%.
- the electrical resistance in the thickness direction of the anisotropic conductive sheet is preferably 100 m ⁇ or less in a state where the anisotropic conductive sheet is pressed in the thickness direction with a load of 10 to 20 gf.
- the anisotropic conductive sheet 33 constituting the upper adapter 31 and the anisotropic conductive sheet 53 constituting the lower adapter 51 each have a thickness of 0.05 to 0.2 mm. Preferably there is.
- the thickness of the anisotropic conductive sheet 37 constituting the upper side inspection head 35 and the anisotropic conductive sheet 57 constituting the lower side inspection head 55 should be 0.1 to 1.5 mm, respectively. preferable.
- the thickness of the anisotropic conductive sheets 37 and 57 is the thickness of the conductive path forming portion, and the protrusion height from the surface of the insulating portion of the conductive path forming portion is 0.02 to: L 3 mm It is preferable that
- the dispersive anisotropic conductive sheets 33 and 53 constituting the inspection apparatus 15 of the present invention can be manufactured as follows.
- a fluid sheet-forming material is prepared by dispersing conductive particles in a polymer material that becomes an elastic polymer material by a curing process, and performing a defoaming process under reduced pressure as necessary.
- the sheet-forming material prepared in this way is treated with an anisotropic conductive sheet.
- the sheet forming material layer in a state where the conductive particles are dispersed is formed by injecting into the mold mold cavity.
- a pair of electromagnets are arranged on the upper and lower surfaces of the mold, and the electromagnets are operated to cause a parallel magnetic field to act in the thickness direction of the sheet-forming material layer and to be dispersed in the sheet-forming material layer. Align the conductive particles so that they are aligned in the thickness direction.
- the anisotropically conductive sheets 33 and 53 in which the conductive particles are aligned in the thickness direction in the elastic polymer substance are manufactured by curing the sheet forming material layer.
- the unevenly distributed anisotropic conductive sheets 37 and 57 constituting the inspection apparatus 15 of the present invention can be manufactured as follows.
- the overall shape is substantially a flat plate shape, each consisting of an upper mold and a lower mold corresponding to each other, and a magnetic field should not be applied to the material layer filled in the molding space between the upper mold and the lower mold. Therefore, an anisotropic conductive sheet molding die having a configuration capable of heat-curing the material layer is prepared.
- both the upper die and the lower die are made of iron, nickel, etc.
- the ferromagnetic part is arranged according to the pattern corresponding to the pattern of the conductive path forming part to be formed. .
- the molding surface of the upper mold is flat, and the molding surface of the lower mold is slightly uneven corresponding to the conductive path forming portion of the anisotropic conductive sheet to be formed.
- the anisotropic conductive sheet is produced as follows using the anisotropic conductive sheet molding die.
- a molding material containing conductive particles exhibiting magnetism in a polymer material that is cured to become an elastic polymer material is injected into a molding space of an anisotropic conductive sheet molding die. A molding material layer is formed.
- the anisotropic conductive sheet is manufactured independently, and the manufactured one is limited to a configuration in which the anisotropic conductive sheet is disposed on another component member such as an inspection circuit board. Instead, it may be integrated with other components in the manufacturing process.
- the electrical inspection of the circuit board 1 to be inspected is performed as follows.
- the circuit board 1 to be inspected is placed in the inspection execution region 16 by the circuit board holding mechanism, and in this state, each of the upper side column implantation plate 23 and the lower side column implantation plate 27 is inspected.
- each of the upper side substrate clamping body 30 and the lower side substrate clamping body 50 moves in the direction approaching 1 to the circuit board to be inspected.
- the circuit board 1 to be inspected is clamped by the upper substrate pressing body 30 and the lower substrate pressing body 50.
- all of the lower surface test electrodes 3 of the circuit board 1 to be inspected are electrically connected to the corresponding test electrodes 52A of the lower adapter 51 through the anisotropic conductive sheet 53, respectively.
- the terminal electrode 52C of the lower adapter 51 is electrically connected to the corresponding connection electrode 63 of the electrode device 60 in the lower inspection head 55 via the conductive path forming portion of the anisotropic conductive sheet 57.
- the upper surface inspection electrode 2 and the lower surface inspection electrode 3 of the circuit board 1 to be inspected Each force Electrically connected to each of the connection electrode 43 of the electrode device 40 in the upper side inspection head 35 and each of the connection electrode 63 of the electrode device 60 in the lower side inspection head 55, thereby electrically connecting the tester inspection circuit.
- the electrical resistance between the upper electrode 2 to be inspected 2 and the corresponding lower electrode 3 to be inspected is measured. As a result, the required electrical inspection is performed.
- the pressing force on the circuit board 1 to be inspected in the measurement state is, for example, 100 to 250 kgf.
- the electrode device 40 that constitutes the upper inspection head 35 and the electrode device 60 that constitutes the lower inspection head are connected to one end surface 44 of the electric wires 44, 64.
- B and 64B are integrally connected to the back surface of the connection electrodes 43 and 63, so that the wire diameter of the wires 44 and 64 is smaller than the size of the connection electrodes 43 and 63. Therefore, a plurality of connection electrodes 43 and 63 can be formed in a state in which sufficient insulation is ensured between adjacent connection electrodes. Specifically, it is practically difficult if it has a configuration with an inspection pin. It can be formed with an array pitch of 0.5 mm or less, and each of the connection electrodes 43 and 63 has an electric wire.
- the measured electrical resistance can be measured with high accuracy, even if the arrangement pitch of the electrodes to be inspected is small or the number of electrodes is large and the circuit device is used, but all of the electrodes to be inspected! be able to.
- connection electrodes 43 and 63 are substantially not limited by the configuration of the wiring portions of the connection electrodes 43 and 63, the degree of freedom in designing the electrode devices 40 and 60 themselves.
- the inspection apparatus 15 can be advantageously manufactured.
- FIG. 13 is an explanatory sectional view showing an outline of the configuration of the circuit device inspection electrode device constituting the upper side inspection head and the lower side inspection head in another example of the circuit device inspection device of the present invention.
- the electrode device 71 includes an insulating substrate 73 in which a plurality of wiring through holes 72 penetrating in the thickness direction are formed at predetermined lattice point positions, and each wiring through hole in the insulating substrate 73.
- 72 and a plurality of columnar support members 74 each having a protruding portion 74A protruding from the surface of the insulating substrate 73 provided integrally with the insulating substrate 73, and the back surface of each of the support members 74 by the front end surface of the support member 74.
- connection electrode 75 In a state where the plurality of plate-like connection electrodes 75 provided to be supported and the one end portion 76A are fixed so as to extend through the support member 74 in the thickness direction, the one end surface 76B is connected to the connection electrode 75. And a plurality of electric wires 76 that are integrally connected to the back surface.
- each electric wire 76 is electrically connected to a connector (not shown), and is further electrically connected to a tester (not shown) via this connector.
- the protruding portion 74A of the support member 74 related to each connection electrode 75 is in a state in which the outer peripheral surface of the electric wire 76 is covered with, for example, a hardened material of a liquid sealant. Also functions as a protective material for 76.
- the protruding height of the protruding portion 74A of the support member 74 is preferably 10 to: L00 m, more preferably 15 to 50 m, including the height of the connecting electrode 75.
- the height level HL of the surface of the electrode 75 with respect to the surface of the insulating substrate 73 is 250 m or less, more preferably 30 to: L00 ⁇ m, particularly preferably 40 to 80 ⁇ m.
- the protruding height of the protruding portion 74A is 10 m or more, sufficient pressurization characteristics can be reliably obtained for the conductive path forming portion 37A of the anisotropic conductive sheet 37, and the protruding height of the protruding portion 74A can be obtained.
- the length is 100 m or less, it can be configured to have sufficient strength against being pressed in the thickness direction in the measurement state.
- the outer diameter of the support member 74 is preferably 90 to 140% of the diameter of the connection electrode 75. As a result, it is possible to reliably prevent buckling from occurring due to pressurization in the thickness direction in the measurement state, and anisotropically conductive the connection electrode 75 in a state in which an appropriate posture is reliably maintained.
- the adhesive sheet can be pressurized.
- connection electrodes 75 has the same configuration as that of the electrode device 40 according to the first embodiment, and the copper layer 75A, the nickel layer 75B, and the gold layer 75C have a back surface force on the surface. It has a multi-layered structure that is layered towards it. With such a layer structure, good electrical characteristics such as low contact resistance can be obtained, and each metal layer can be formed with sufficiently high bonding strength by having the nickel layer 75B. It is possible to reliably prevent the connection electrode 75 from being damaged.
- connection electrode 75 is preferably 1 to 140 m, for example, and more preferably 3 to 80 ⁇ m.
- the copper layer 75A is in the range of 0.5 to 120 111, and the -Neckel layer is 758 ° C so that the total thickness satisfies the above range. It can be set appropriately within the range of 3 to 20 ⁇ m and the gold layer 75C within the range of 0.2 to 2 ⁇ m.
- connection electrode 75 has a one-to-one correspondence with the terminal electrode of the upper adapter, the size of the connection electrode 75 may be the same as that of the terminal electrode.
- the electric wire 76 for example, an enameled wire or a -chromium wire, which has been used more favorably than before, can be used, and one having a wire diameter of, for example, 50 to 300 m is used.
- the electrode device 71 configured as described above can be manufactured as follows.
- a composite body 78 is prepared in which a protruding portion forming material layer 77 made of, for example, polyimide tape is provided on the surface of a flat insulating substrate forming material 73A.
- a plurality of protruding portion forming through holes 77A extending through the protruding portion forming material layer 77 in the thickness direction thereof at predetermined lattice point positions in the composite body 78, for example, by a drill force.
- a plurality of through-holes 72 for wiring that extend through the insulating substrate forming material 73A in the thickness direction thereof, and are continuous with the projecting portion-forming through-holes 77A.
- a hole 78A extending through the entire 78 in the thickness direction is formed.
- one end portion 76A of the electric wire 76 is inserted and arranged in each hole 78A in the composite body 78 so that the tip portion thereof also projects the surface force of the composite body 78. It is supported by a drop-off prevention means (not shown), and in this state, for example, outside of the wire 76
- the liquid sealing agent is filled in each hole 78A by utilizing the capillary phenomenon due to the minute gap formed between the peripheral surface and the inner peripheral surface of the hole 78A.
- a columnar support member 74 fixed integrally with the hole 78A of the composite 78 and fixed with the one end 76A of the electric wire 76 extending in the thickness direction is provided inside. In this way, the electric wire 76 is fixed to the composite body 78 integrally.
- the surface of the composite 78 is polished by polishing the protruding portion of each support member 74 (including the electric wire 76) protruding from the surface of the protruding portion forming material layer 77 in the composite 78.
- the one end surface 76B of each electric wire 76 is exposed by flattening.
- a polishing process is actually performed including the surface portion of the protruding portion forming material layer 77.
- a pattern hole 79A corresponding to the connection electrode 75 to be formed is formed on the surface of the composite body 78 in which one end portion 76A of the electric wire 76 is fixed.
- a copper electrode 75A and a nickel layer are formed on one end face 76B of each electric wire 76 by applying an electric plating process using the electric wires 76 as a plating electrode, as shown in FIG. 75B and a gold layer 75C are formed by laminating from the back surface to the front surface, thereby forming a plate-like connection electrode 75 in which one end surface 76B of the electric wire 76 is physically connected to the back surface.
- the connecting electrode forming resist layer 79 is removed, and the protruding portion forming material layer 77 is removed, thereby forming the protruding portion 74A of the supporting member 74 protruding from the surface of the insulating substrate 73.
- the electrode device 71 shown in FIG. 13 is obtained. According to the electrode device 71 having such a configuration, the one end surface 76B of the electric wire 76 is integrally connected to the back surface of the connection electrode 75. Since the wire diameter of the electric wire 76 is smaller than the size of the connecting electrode 75, a plurality of connecting electrodes 75 can be formed with sufficient insulation between adjacent connecting electrodes.
- connection electrodes 75 can be formed with a small arrangement pitch, specifically, for example, an arrangement pitch of 0.5 mm or less (standard arrangement pitch). , There is only one electrical contact with the wire 76 Therefore, it can be configured with a low contact resistance, and good electrical characteristics can be obtained. In addition, the surface force of the insulating substrate 73 protrudes at the tip part. Since the connection electrode 75 is formed on the front end surface of the support member 74 that is integrally fixed to the insulating substrate 73 in the state, the electrode device 71 and the adapter are used in the electrical inspection of the circuit device. It is possible to sufficiently pressurize the anisotropic conductive sheet disposed between the two, and the required electrical connection can be reliably achieved.
- FIG. 21 is an explanatory cross-sectional view showing an outline of a configuration of still another example of the circuit device inspection apparatus according to the present invention in a partially enlarged state
- FIG. 22 is an inspection of the circuit board shown in FIG. It is sectional drawing for description which shows the upper side adapter in the upper side board
- This inspection apparatus has the same configuration as the inspection apparatus shown in FIG. 1 except that an adapter having the following configuration is used. About the same components as those shown in FIG. For convenience, the same reference numerals are given.
- the upper-side adapter 81 is fixed and arranged by an appropriate means on the inspection circuit board 82 constituting the adapter main body and on the surface (the lower surface in FIGS. 21 and 22) of the inspection circuit board 82. And an anisotropic conductive sheet 33 having high elasticity.
- a pair of inspection electrodes is formed on one upper surface inspection electrode 2 according to the arrangement pattern of the upper surface inspection electrode 2 on the upper surface of the circuit substrate 1 to be inspected.
- the current supply electrode 82A and the voltage measurement electrode 82B constituting the electrode are disposed so as to be separated from each other and in a region having the same area as the region occupied by the upper surface inspection electrode 2.
- the distance between the current supply electrode 82A and the voltage measurement electrode 82B in the inspection circuit board 82 is preferably 10 ⁇ m or more. If this separation distance is less than 10 ⁇ m, the current flowing between the current supply electrode 82A and the voltage measurement electrode 82B via the anisotropic conductive sheet 33 becomes large, so that the electric resistance is highly accurate. May be difficult to measure.
- the upper limit of the separation distance is determined by the size of each inspection electrode of the current supply electrode 82A and the voltage measurement electrode 82B and the size and pitch of the related upper surface inspection electrode 2 and is usually 500 m or less. If this separation distance is excessive, it is difficult to properly dispose both inspection electrodes with respect to one of the upper surface inspection electrodes 2 having a small size.
- pitches of 0.2 mm, 0.3 mm, 0.45 mm, 0.5 mm, 0.75 mm, and 0.5 mm are used.
- a plurality of terminal electrodes 82C are arranged according to standard grid point positions of 8mm, 1.06mm, 1.27mm, 1.5mm, 1.8mm or 2.54mm, and each of these terminal electrodes 82C is connected to the internal wiring section 82D. Therefore, it is electrically connected to the corresponding current supply electrode 82A or voltage measurement electrode 82B.
- the lower-side adapter 85 is arranged by being fixed to the inspection circuit board 86 constituting the adapter main body and the surface (upper surface in FIG. 21) of the inspection circuit board 86 by an appropriate means. And an anisotropic conductive sheet 53 having high elasticity.
- a pair of inspection electrodes is formed on one surface under test electrode 3 according to the arrangement pattern of the bottom surface inspection electrode 3 on the bottom surface of the circuit board 1 under test.
- the electrode for supplying current 86A and the electrode for measuring voltage 86B constituting the electrode are arranged so as to be separated from each other and in a region having the same area as the region occupied by the lower surface inspection electrode 3!
- the separation distance between the current supply electrode 86A and the voltage measurement electrode 86B in the inspection circuit board 86 is 10 ⁇ m or more. If this separation distance is less than 10 ⁇ m, the current flowing between the current supply electrode 86A and the voltage measurement electrode 86B through the anisotropic conductive sheet 53 becomes large, so that the electric resistance is highly accurate. May be difficult to measure.
- the upper limit of the separation distance is determined by the size of each inspection electrode of the current supply electrode 86A and the voltage measurement electrode 86B and the size and pitch of the related bottom surface inspection electrode 3, and is usually 500 m or less. If this separation distance is excessive, it will be difficult to properly place both inspection electrodes with respect to one of the small size inspection electrodes 3 on the bottom surface. Become.
- the pitch is 0.2 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.5 mm, 0.8 mm, 1. 06mm, upper. 27mm, 1.5mm, 1. 8mm or 2.
- a plurality of terminal electrodes 86C are arranged according to the standard grid point position, and each of these terminal electrodes 86C is supplied by the internal wiring section 86D. It is electrically connected to the supply electrode 86A or the voltage measurement electrode 86B.
- the electrode device 40 constituting the upper side inspection head and the electrode device 60 constituting the lower side inspection head are both configured by the structure shown in Fig. 6, for example.
- an electrical inspection of the circuit board 1 to be inspected is performed as follows. That is, the circuit board 1 to be inspected is placed in the inspection execution area 16 by the circuit board holding mechanism, and in this state, each of the upper side column installation board 23 and the lower side column installation board 27 is inspected circuit board. 1 is moved in a direction approaching the circuit board 1 to be inspected, and as a result, the inspected circuit board 1 is moved. The circuit board 1 is clamped by the upper side substrate pressing body 30 and the lower side substrate pressing body 50.
- all of the upper surface inspected electrodes 2 of the circuit board 1 to be inspected are inspected electrode pairs each consisting of the corresponding current supply electrode 82A and voltage measurement electrode 82B of the upper adapter 81.
- the terminal electrode 82C of the upper adapter 81 is electrically connected to the upper inspection head via the conductive path forming portion 37A of the anisotropic conductive sheet 37.
- the electrode device 40 is electrically connected to the corresponding connection electrode 43.
- all of the lower test electrodes 3 on the circuit board 1 to be inspected are anisotropically conductive to the test electrode pair consisting of the corresponding current supply electrode 86A and voltage measurement electrode 86B of the lower adapter 85, respectively.
- the terminal electrode 86C of the lower adapter 85 is connected to the electrode device 60 in the lower inspection head via the conductive path forming portion of the anisotropic conductive sheet 57. It is electrically connected to the electrode 63.
- each of the upper electrode under test 2 and the lower electrode under test 3 of the circuit board 1 to be tested is connected to each of the connection electrode 43 of the electrode device 40 and the connection electrode 63 of the electrode device 60.
- a state of being electrically connected to the test circuit of the tester is achieved and a measurement state is achieved.
- current is supplied from the tester to the current supply electrode, A voltage signal between the electrodes for voltage measurement is detected and processed by the tester, thereby measuring the electrical resistance between the upper test electrode 2 and the lower test electrode 3 on the circuit board 1 to be inspected.
- the pressing force against the circuit board 1 to be inspected in the measurement state is, for example, 100 to 250 kgf.
- the electrode device 40 that constitutes the upper inspection head and the electrode device 60 that constitutes the lower inspection head are configured such that one end surfaces of the electric wires 44 and 64 are integrally coupled to the rear surfaces of the connection electrodes 43 and 63.
- the wire diameters of the wires 44 and 64 are smaller than the size of the connection electrodes 43 and 63, so that a plurality of connection electrodes 43 and 63 are sufficient between the adjacent connection electrodes. Since it can be formed in a state in which insulation is ensured, the connection electrodes 43 and 63 can be formed with a small arrangement pitch, specifically, for example, an arrangement pitch of 0.5 mm or less.
- each of the connection electrodes 43 and 63 has only one electrical contact with the wires 44 and 64, it can be configured with a low contact resistance, and good electrical characteristics can be obtained. . Therefore, even with a circuit device in which the arrangement pitch of the electrodes to be inspected is small or the number of electrodes is large, all of the electrodes to be inspected can be measured with high accuracy with high accuracy. .
- each wire has a structure in which one end surface is integrally connected to the back surface of the corresponding connection electrode.
- it is not limited to a structure in which both the connection electrode and the electric wire are integrally connected by forming directly by electroplating.
- connection electrodes the electrode size, and other specific configurations can be appropriately changed according to the purpose.
- connection electrode may be composed entirely of a single metal layer.
- connection electrode is not limited to a plate-like one.
- FIG. 23 is a cross-sectional view for explaining the outline of the configuration of still another example of the circuit device inspection electrode device of the present invention.
- This circuit device inspection electrode device 71A has the same configuration as that shown in FIG. 13 except that the connection electrode is constituted by a protruding electrode 75D.
- the projecting electrode 75D in this example has a hemispherical force, for example, and its shape is particularly limited as long as the back surface is flat when the one end surfaces of the wires are connected together.
- it may have any shape such as a truncated cone or a column.
- the size (maximum diameter) of the protruding electrode 75D is appropriately set according to the dimensions and arrangement pitch of the electrode to be connected. For example, it is equivalent to the outer diameter of the support member 74 (the outer diameter of the protruding portion 74A). The size may be smaller than the outer diameter of the support member 74.
- the height h of the projecting electrode 75D is, for example, 10 to: LOO m, more preferably 20 to 50 ⁇ .
- the metal material constituting the projecting electrode 75D is not particularly limited as long as it has conductivity and can use the electroplating method. However, for the reason that good conductivity can be obtained. For example, it is preferable to use gold, silver, copper, palladium, rhodium, nickel, etc., as the protruding electrode 75D, even if the whole is made of a single metal, than an alloy of two or more kinds of metals. Or a laminate of two or more metals.
- the supporting member 74 is configured to protrude from one surface of the insulating substrate 73.
- the back surface of the protruding electrode 75D is the insulating substrate. It is supposed to have a structure that faces the surface of 73.
- Such a circuit device inspection electrode device 71A protrudes from the surface of the composite body 78 of each support member 74, for example, in the manufacturing process of the circuit device inspection electrode device according to the second embodiment.
- the surface of the composite 78 is flattened to expose one end surface 76 of each wire 76, in other words, the height of one end surface 76 ⁇ of each wire 76 is constant.
- a resist layer having a required pattern hole is formed on the surface of the protruding portion forming material layer 77 in the composite 78, and an electric plating process is performed using the electric wires 76 as a plating electrode.
- circuit device inspection electrode device 71A having the above-described configuration, it is possible to obtain the same effects as those according to the first embodiment and the second embodiment, and it is possible to obtain sufficient connection with the connection target electrode. An electrical connection can be achieved more reliably.
- a flat insulating substrate forming material made of glass fiber reinforced epoxy resin “FR-4” with a thickness of 2mm and dimensions of 60mm x 55mm, and penetrate each in the thickness direction of the insulating substrate forming material.
- Forming an insulating substrate by drilling a plurality of extending wiring through holes at the grid point positions where the distance between adjacent wiring through holes of the insulating substrate forming material is 0.23 mm did.
- the opening diameter of each wiring through hole is 0.27 mm.
- one end of the wire made of enameled wire with a wire diameter of 200 m is inserted through each wiring through-hole in the insulating substrate with the tip protruding from the surface force of the insulating substrate.
- a liquid sealant made of epoxy resin is applied in the vicinity of the wiring through hole on the surface of the insulating substrate, and formed between the outer peripheral surface of the wire and the inner peripheral surface of the wiring through hole.
- the liquid sealant is filled into each through-hole for wiring using the capillary phenomenon due to the microscopic voids, and the liquid sealant is cured by curing at 120 ° C for 2 hours. Thereby, each electric wire is fixed to the insulating substrate.
- connection electrode forming resist layer made of a photoresist having a thickness of 50 m is formed, and an electric plating process is performed using the electric wire as a plating electrode, so that a thickness of 50 m is formed on one end surface of each electric wire.
- a copper layer is formed.
- connection electrode As a plate-like connection electrode connected to is formed.
- the thickness of the nickel layer constituting the connection electrode is 2 m
- the thickness of the gold layer is 0.2 / zm
- the height of the connection electrode is 52.2 / zm
- the diameter of the connection electrode is 0. 35mm.
- electrode device (1) the electrode layer for circuit device inspection according to the present invention
- a composite is produced in which a protruding portion forming material layer made of a polyimide tape having a thickness of 50 m is formed on the surface of the insulating substrate forming material, and each protruding portion forming material layer is formed in the thickness direction.
- the part was formed by a drill cage at a lattice point position where the distance between adjacent holes of the composite was 0.23 mm. The opening diameter of each hole is 0.27 mm.
- an electric wire made of enameled wire having a wire diameter of 200 m is placed through each hole in the composite with the tip protruding from the surface of the composite, and in this state, A liquid sealant made of epoxy resin is applied in the vicinity of the hole on the surface of the composite to reduce the capillary phenomenon caused by the minute gaps formed between the outer peripheral surface of the wire and the inner peripheral surface of the hole.
- the liquid sealant is filled into each hole, and the liquid sealant is cured by curing at 120 ° C for 2 hours.
- a columnar support member that is fixed integrally and fixed in a state where one end portion of the electric wire penetrates and extends in the thickness direction is formed, and each electric wire is integrally fixed to the composite.
- the surface of the composite is flattened by polishing the portion of each support member that protrudes from the surface of the composite together with the surface portion of the material layer for forming the protruding portion.
- a copper layer having a thickness of 20 m is formed on one end face of each electric wire by forming an electric wire with a thickness of m and applying electric plating treatment with the electric wire as a plating electrode.
- a nickel layer and a gold layer are laminated on the surface of the copper layer so that the back surface force is also directed toward the surface, so that one end surface of the electric wire is integrated with the back surface.
- a plate-like connection electrode connected to the substrate is formed.
- the thickness of the connecting layer constituting the connecting electrode is 3 m
- the thickness of the gold layer is 0.2 m
- the height of the connecting electrode is 23.2 ⁇
- connection electrode forming resist layer is removed, and the protruding portion of the supporting member is formed by removing the protruding portion forming material layer, whereby the circuit device inspection electrode device according to the present invention (hereinafter, "Electrode device (2)") was obtained.
- the outer diameter of the supporting part in this electrode device (2) is 0.25 mm (90% of the connecting electrode diameter), the protruding height is 25 m, and the connecting electrode height is Including the height level of the surface of each connecting electrode relative to the surface of the insulating substrate HL force is 8.2 m.
- Terminal electrode dimensions Diameter 0.25 mm,
- Terminal electrode arrangement pitch 0.5 mm
- Base material Glass fiber reinforced epoxy resin, maximum thickness: 1.0 mm
- Conductive particles Material: Nickel particles plated with gold, average particle size: 20 m, contained Rate: 18% by volume,
- Elastic polymer material Material; Silicone rubber, Hardness; 40,
- Ratio of electrical resistance value in the thickness direction to electrical resistance value in the plane direction 1000 or more
- the electrode device (1) The electrode device (1)
- Projection height of conductive path forming part 0.05 mm
- Conductive particles Material: Nickel particles plated with gold, average particle size: 35 m, content: 13% by volume,
- Elastic polymer material Material; Silicone rubber, Hardness; 30
- Terminal electrode dimensions Diameter 0.25 mm,
- Terminal electrode arrangement pitch 0.5 mm
- Base material Glass fiber reinforced epoxy resin, maximum thickness: 1. Omm
- Conductive particles Material: Nickel particles plated with gold, average particle size: 20 m, content: 18% by volume,
- Elastic polymer material Material; Silicone rubber, Hardness; 40,
- the electrode device (1) The electrode device (1)
- Projection height of conductive path forming part 0.05 mm
- Conductive particles Material: Nickel particles plated with gold, average particle size: 35 m, content: 13% by volume,
- Elastic polymer material Material; Silicone rubber, Hardness; 30
- a circuit board having the following specifications is used as the circuit board to be inspected, and this circuit board is inspected by the above inspection device (1)
- the circuit board to be inspected is held by the pressing force of lOOkgf, and in this state, the electric current between each of the upper surface inspected electrodes in the circuit board to be inspected and each of the lower surface inspected electrodes corresponding thereto is held.
- the resistance was measured with a tester, and the percentage of the total number of measurements of electrode resistance measurements (electrode pairs) was determined. The results are shown in Table 1 below.
- Upper electrode to be inspected Minimum electrode size; Diameter 0.2 mm, Arrangement pitch; 0.4 mm, Number of electrodes; 2 000,
- Bottom electrode to be inspected Minimum electrode size; Diameter 0.2 mm, Arrangement pitch; 0.4 mm, Number of electrodes; 2 000 ⁇ Example 2>
- Example 1 an inspection device for a circuit device having the same configuration as the inspection device (1) except that the upper inspection head and the lower inspection head are configured by the electrode device (2) (hereinafter referred to as “ The inspection apparatus (2) ”) is manufactured, and the electrical connection between each of the upper surface inspected electrodes on the circuit board to be inspected and each of the lower surface inspected electrodes corresponding thereto is performed in the same manner as in Example 1.
- the resistance was measured with a tester, and the ratio of the measured value of the electrical resistance value (electrode pair) to the total number of measurements was determined. The results are shown in Table 1 below.
- test circuit board with the following conditions was prepared, and the upper and lower adapters were configured using this test circuit board.
- a circuit device inspection device (hereinafter, referred to as “inspection device (3)”) having the above structure was manufactured.
- this circuit board is held in the inspection execution area of the inspection apparatus (3), and the circuit board to be inspected is clamped with a lOOkgf pressing force.
- the voltage measurement electrode of the upper adapter and the voltage measurement electrode of the lower adapter the electrical resistance between each of the upper test electrodes on the test circuit board and the corresponding lower test electrodes was determined. The results are shown in Table 1 below.
- Terminal electrode dimensions Diameter 0.25 mm,
- Base material Glass fiber reinforced epoxy resin, Maximum thickness: 0.5mm
- Example 3 the upper inspection head and the lower inspection are performed by the electrode device (2).
- a circuit device inspection device (hereinafter referred to as “inspection device (4)”) having the same structure as the above-described inspection device (3) except that the head is configured is manufactured and the same as in Example 3. Then, the electrical resistance between each of the upper surface inspected electrodes on the circuit board to be inspected and each of the lower surface inspected electrodes corresponding thereto is measured by a tester, and the measured value of the electric resistance measured is 50 ⁇ or more. The ratio of the measured number (electrode pair) to the total number of measurements was determined. The results are shown in Table 1 below.
- the inspection pin body and the electric wire are connected via a metal member to produce an inspection pin under the following conditions, and the upper side inspection head and the lower side including the inspection pin.
- a comparative inspection device having the same configuration as the inspection device (1) except that an inspection head was used was produced.
- Example 2 the electrical resistance between each of the upper surface inspected electrodes on the circuit board to be inspected and each of the lower surface inspected electrodes corresponding thereto is measured by a tester, and the measured value of the electric resistance measurement value is measured.
- the percentage of the total number of measurements was calculated for those with an electrode of 50 ⁇ or more (electrode pair). The results are shown in Table 1 below.
- Base end dimensions Outer diameter 0.15mm, Total length 1.5mm,
- Metal member Material: Brass plated with gold, Shape: Tubular, 0.17mm inside diameter, 0.04mm wall thickness, 3.Omm in total length,
- Electric wire Material: Enamel wire, Wire diameter: 120 m,
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004285678 | 2004-09-30 | ||
JP2004-285678 | 2004-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006035856A1 true WO2006035856A1 (ja) | 2006-04-06 |
Family
ID=36119001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/017924 WO2006035856A1 (ja) | 2004-09-30 | 2005-09-29 | 回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置 |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200617400A (ja) |
WO (1) | WO2006035856A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITMI20120453A1 (it) * | 2012-03-22 | 2013-09-23 | Technoprobe Spa | Struttura di connessione di tipo ibrido |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102090578B1 (ko) * | 2013-05-06 | 2020-03-19 | 삼성디스플레이 주식회사 | 전자 장치의 기판, 이를 포함하는 전자 장치 및 접속부의 저항 측정 방법 |
JP6237441B2 (ja) * | 2014-04-24 | 2017-11-29 | 日本電産リード株式会社 | 電極構造体、検査治具、及び電極構造体の製造方法 |
CN111948567B (zh) * | 2019-04-30 | 2023-04-25 | 烽火通信科技股份有限公司 | 一种主板上电前短路检测方法及*** |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63208237A (ja) * | 1987-02-25 | 1988-08-29 | Hitachi Ltd | 半導体装置の測定装置 |
JPH11204177A (ja) * | 1998-01-07 | 1999-07-30 | Jsr Corp | シート状コネクター |
JP2000241485A (ja) * | 1999-02-24 | 2000-09-08 | Jsr Corp | 回路基板の電気抵抗測定装置および方法 |
JP2001015565A (ja) * | 1999-06-30 | 2001-01-19 | Hoya Corp | バンプ付きメンブレンリングの製造方法 |
JP2002062313A (ja) * | 2000-08-22 | 2002-02-28 | Toppan Printing Co Ltd | 電気検査用治具及びその製造方法 |
JP2003222637A (ja) * | 2002-01-31 | 2003-08-08 | Koyo Technos:Kk | 検査冶具及びその製造方法 |
JP2004239900A (ja) * | 2003-01-17 | 2004-08-26 | Jsr Corp | 回路基板の検査装置および回路基板の検査方法 |
-
2005
- 2005-09-29 WO PCT/JP2005/017924 patent/WO2006035856A1/ja active Application Filing
- 2005-09-30 TW TW094134332A patent/TW200617400A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63208237A (ja) * | 1987-02-25 | 1988-08-29 | Hitachi Ltd | 半導体装置の測定装置 |
JPH11204177A (ja) * | 1998-01-07 | 1999-07-30 | Jsr Corp | シート状コネクター |
JP2000241485A (ja) * | 1999-02-24 | 2000-09-08 | Jsr Corp | 回路基板の電気抵抗測定装置および方法 |
JP2001015565A (ja) * | 1999-06-30 | 2001-01-19 | Hoya Corp | バンプ付きメンブレンリングの製造方法 |
JP2002062313A (ja) * | 2000-08-22 | 2002-02-28 | Toppan Printing Co Ltd | 電気検査用治具及びその製造方法 |
JP2003222637A (ja) * | 2002-01-31 | 2003-08-08 | Koyo Technos:Kk | 検査冶具及びその製造方法 |
JP2004239900A (ja) * | 2003-01-17 | 2004-08-26 | Jsr Corp | 回路基板の検査装置および回路基板の検査方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITMI20120453A1 (it) * | 2012-03-22 | 2013-09-23 | Technoprobe Spa | Struttura di connessione di tipo ibrido |
Also Published As
Publication number | Publication date |
---|---|
TW200617400A (en) | 2006-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1031840B1 (en) | Electric resistance measuring apparatus and method for circuit board | |
US7821283B2 (en) | Circuit board apparatus for wafer inspection, probe card, and wafer inspection apparatus | |
KR101077757B1 (ko) | 회로 기판 검사용 어댑터 및 회로 기판 검사 장치 | |
WO2006087877A1 (ja) | 複合導電性シートおよびその製造方法、異方導電性コネクター、アダプター装置並びに回路装置の電気的検査装置 | |
TW200307135A (en) | Connector for measuring resistance, apparatus and method for measuring resistance of circuit board | |
US6870385B2 (en) | Anisotropic conductive sheet and wafer inspection device | |
KR20060014440A (ko) | 이방 도전성 커넥터 및 웨이퍼 검사 장치 | |
US20090072844A1 (en) | Wafer inspecting sheet-like probe and application thereof | |
WO2006035856A1 (ja) | 回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置 | |
JP2007278810A (ja) | 回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置 | |
KR101167748B1 (ko) | 웨이퍼 검사용 탐침 부재, 웨이퍼 검사용 프로브 카드 및웨이퍼 검사 장치 | |
EP1585374A1 (en) | Circuit board checker and circuit board checking method | |
JP4725318B2 (ja) | 複合導電性シートおよびその製造方法、異方導電性コネクター、アダプター装置並びに回路装置の電気的検査装置 | |
JP2006349671A (ja) | ウエハ検査用シート状プローブおよびその応用 | |
JP3801195B1 (ja) | 回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置 | |
WO2005036188A1 (ja) | 回路基板検査装置 | |
JP3906068B2 (ja) | 異方導電性シート、コネクターおよびウエハ検査装置 | |
JP2006126180A (ja) | 回路装置検査用電極装置およびその製造方法並びに回路装置の検査装置 | |
EP1662614A1 (en) | Anisotropic conductive sheet process for producing the same, and circuit board inspection apparatus | |
JP4479477B2 (ja) | 異方導電性シートおよびその製造方法並びにその応用製品 | |
JP3700721B2 (ja) | 回路基板の検査装置および回路基板の検査方法 | |
JP3700722B2 (ja) | 回路基板の検査装置および回路基板の検査方法 | |
JP2006284418A (ja) | ウエハ検査用プローブカードおよびウエハ検査装置 | |
JP2007225501A (ja) | プローブカードおよびプローブカード用のプローブ接触針固定用ホルダーの製造方法 | |
WO2006001303A1 (ja) | 回路基板の検査装置および回路基板の検査方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |