WO2005117255A1 - Filter circuit, logic ic, multi-chip module, filter-equipped connector, transmitting apparatus and transmitting system - Google Patents

Filter circuit, logic ic, multi-chip module, filter-equipped connector, transmitting apparatus and transmitting system Download PDF

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Publication number
WO2005117255A1
WO2005117255A1 PCT/JP2005/009623 JP2005009623W WO2005117255A1 WO 2005117255 A1 WO2005117255 A1 WO 2005117255A1 JP 2005009623 W JP2005009623 W JP 2005009623W WO 2005117255 A1 WO2005117255 A1 WO 2005117255A1
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WO
WIPO (PCT)
Prior art keywords
winding
filter circuit
transmission
filter
circuit
Prior art date
Application number
PCT/JP2005/009623
Other languages
French (fr)
Japanese (ja)
Inventor
Hisaaki Kanai
Norio Chujyou
Original Assignee
Hitachi Communication Technologies, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Communication Technologies, Ltd. filed Critical Hitachi Communication Technologies, Ltd.
Publication of WO2005117255A1 publication Critical patent/WO2005117255A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/06—Frequency selective two-port networks including resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board

Definitions

  • Filter circuit logic IC, multi-chip module, filter mounted connector
  • the present invention relates to a filter circuit that is less susceptible to signal waveform deterioration due to extraneous magnetic field noise and is capable of reducing the generation of radiated electromagnetic noise, and in particular, relates to an IC that transmits and receives high-speed signals, and It relates to devices such as communication devices, servers, and communication ICs that are configured using the devices.
  • a low-noise filter circuit for reducing high-frequency noise is provided by a driver circuit, a receiver circuit, or a transmission circuit. Often installed on the road.
  • These filter circuits are generally constituted by passive elements such as inductors and capacitive elements.
  • passive elements such as inductors and capacitive elements.
  • an induced current is induced in the direction that cancels the external magnetic field noise. Noise may be superimposed on the transmission signal, causing loss of data or malfunction of the transmission device.
  • electromagnetic noise is radiated from the inductor, which may cause malfunction of other circuits or devices.
  • Patent Document 1 Japanese Unexamined Patent Publication No. No. 280
  • shielding the entire IC including the circuit from the external circuit with a grounded conductor plate (shield case) the effect of external magnetic field noise is reduced, and the radiated electromagnetic noise from the circuit is reduced. There are ways to reduce it.
  • Patent Document 1 JP-A-6-350280
  • An object of the present invention is to provide a filter circuit that eliminates an increase in the cost of a transmission device, and an IC and a transmission device provided with the filter circuit.
  • an inductor forming a filter circuit such as a high-pass filter circuit has at least two inductors having a center axis in a vertical direction on the same plane and different positions of the respective center axes. It is formed of windings, each winding is wound so that the electromagnetic noise radiated from the windings has the opposite sign, and connected so as to cancel the induced current generated by the external magnetic field noise.
  • the present invention provides an inductor constituting a filter circuit, wherein a first winding having one end as an input, and a first winding disposed on the same plane as the first winding and having one end connected to the first winding. And a second winding having the other end as an output, and a signal current flowing in each of the first winding and the second winding is wound in a vortex in the opposite rotation direction.
  • the first winding and the second winding are connected so that induced currents generated in the first winding and the second winding due to external magnetic field noise flow in opposite directions.
  • the present invention is a transmission system configured by connecting a driver circuit and a receiver circuit by a transmission path, wherein the transmission path includes the filter circuit as a noise path filter circuit. It is characterized by. Further, the present invention is a transmission system configured by connecting a driver circuit and a receiver circuit by a transmission line, wherein the transmission line is provided with the filter circuit to compensate for waveform deterioration in the transmission line. It is characterized in that it is provided with a packaged filter IC as a hynos filter circuit.
  • the present invention is a logic IC characterized in that the filter circuit is provided in a logic IC having a logic circuit for performing a logical operation.
  • the present invention is also a multi-chip module, wherein a die on which the filter circuit is mounted and a die on which a logic circuit is mounted are mounted together in a package.
  • the present invention is also a connector mounted with a filter, which is a connector for connecting between transmission paths, and includes a filter chip in which the filter circuit is formed into a chip.
  • the present invention is also a transmission device that determines a transmission path of a transmission signal to which an optical module connected to an optical fiber is also obtained by a switch IC and transmits the transmission path, wherein the transmission path in the optical module or the switch IC is provided.
  • the filter circuit is provided as a high-pass filter circuit.
  • the present invention also relates to a backplane having a transmission path formed by connecting a plurality of switch boards each having an optical module connected to an optical fiber and a switch IC for determining a transmission path of a transmission signal obtained by the optical module.
  • a transmission device configured to be electrically connected to a board by a backplane connector, wherein the filter circuit is provided as a high-pass filter circuit in a transmission path in the optical module, the switch IC, or the backplane connector. It is characterized by.
  • an inductor constituting a filter circuit is formed by two windings having a center axis in a vertical direction on the same plane and having different positions of the respective center axes, By winding each winding so that the electromagnetic noise radiated from the winding has the opposite sign to each other, and canceling out the induced current generated by the external magnetic field noise, a relatively distant circuit or The influence of not only the external magnetic field noise of the device power but also the external magnetic field noise of the adjacent circuit power can be similarly reduced, and the radiated electromagnetic noise from the filter circuit can also be reduced.
  • the filter circuit for reducing the induced current and the radiated electromagnetic noise is connected It is possible to suppress an increase in costs such as assembly costs for ICs and transmission devices that do not require the use of a ground conductor plate.
  • FIG. 1A is a configuration diagram showing a first embodiment of the high-pass filter circuit of the present invention fabricated on a Si substrate or the like
  • FIG. 1B is a diagram showing a first embodiment of the high-pass filter circuit of the present invention.
  • the high-pass filter circuit according to the first embodiment includes two windings 102a and 102b having a central axis in the same plane in the vertical direction and having different positions of the respective central axes, and one end is connected to the ground terminal 109.
  • the first resistor 103 having one end connected to the inductor 101, the other end connected to the first resistor 103, and the other end connected to an input terminal 107 for inputting a signal from an external circuit.
  • the inductor 101 suppresses the induced current generated by external magnetic field noise (about 10 GHz to 5 GHz or more) having the same vector as the magnetic field radiated from each winding when the signal current is transmitted. It is characterized by comprising two windings 102a and 102b so as to cancel each other.
  • the signal currents flowing through the two windings 102a and 102b are connected so that the eddies in the opposite rotational directions are wound, and the induced current generated by the external magnetic field noise flows in the opposite direction. It is characterized by that.
  • the two windings 102a, 1 constituting the inductor in the filter circuit of the present invention.
  • the 02b By configuring the 02b to have the same inductance characteristics, it is possible to effectively cancel the induced current and radiated electromagnetic noise that occur in each of them.
  • the length of the transmission path constituting the inductor 101 is reduced to one fifth of the wavelength (about 3 to 6 cm) of the external magnetic field noise (about 10 to 5 GHz) to be reduced or the transmission signal (10 to 1 GHz). 1/5! Of the band wavelength (approximately 3 to 30 cm) of the band! This is to reduce the phase difference of the induced current generated in each winding, effectively reduce the effect of external magnetic field noise, and reduce the phase difference of the electromagnetic noise radiated from each winding. This is to reduce the sum of electromagnetic noise. In other words, by shortening the length of the transmission line that forms the inductor, it is possible to effectively reduce transmission waveform degradation due to higher frequency external magnetic field noise, and to reduce the electromagnetic noise radiated by the inductor. The reduction effect also increases.
  • FIG. 2 (a) shows the amount of induced current 201a, 201b generated in each of windings 102a, 102b due to extraneous magnetic field noise having a magnetic field strength with a maximum amplitude of about lWb in the filter circuit shown in FIG.
  • the amount of induced current 201d is shown, with the horizontal axis representing time and the vertical axis representing current.
  • the amount of induced current 201a generated in one winding 102a and the amount of induced current 201b generated in the other winding 102b have opposite signs, and their amplitudes are substantially the same.
  • the size has become. That is, the sum 201c of the induced currents generated in the two windings 102a and 102b can be made substantially zero.
  • the maximum amount of induced current 201d generated in the comparative example in which the inductor is formed by one winding is 0.2 mA or more, so that the signal waveform deterioration is larger than that of the inductor configuration of the present invention.
  • FIG. 2 (b) shows the magnetic field at the center of each of windings 102a and 102b when a signal current having a maximum amplitude of about 16 mA flows through inductor 101 in the filter circuit shown in FIG.
  • the magnetic field strengths 202a and 202b the sum of the respective magnetic field strengths 202c, and an inductor having an inductance value equivalent to that of the inductor 101 shown in FIG.
  • the magnetic field strength 202d in the example is shown, with the horizontal axis representing time and the vertical axis representing magnetic field strength.
  • the magnetic field strength 202a radiated from one winding 102a and the magnetic field strength 202b radiated from the other winding 102b have opposite signs to each other, and have substantially the same amplitude.
  • the size has become. That is, the sum 203c of the magnetic field intensities radiated from the two windings 102a and 102b can be made substantially zero.
  • the maximum magnetic field strength 202d generated in the comparative example in which the inductor is formed by one winding is equal to or more than 10OWb, so that the influence on the external circuit is greater than that of the inductor configuration of the present invention.
  • the case where a Si substrate is used as the substrate on which the high-pass filter circuit is mounted is shown.
  • a ceramic substrate which is not limited to the Si substrate, or another semiconductor substrate such as GaAs, is used.
  • a low-pass filter circuit that passes only a low frequency band or a specific frequency band is used as the filter circuit. A similar effect can be obtained even in a band-pass filter circuit that passes only the signal.
  • the filter circuit of the present invention for reducing induced current and radiated electromagnetic noise is an assembly cost for an IC or transmission device that does not require the use of a grounded conductor plate (shield case) described in Patent Document 1. And so on can be prevented from increasing.
  • FIG. 3 is a diagram illustrating a configuration of a second embodiment of the filter circuit in the case where the capacitance element and the electrode of the input / output terminal are shared in the first embodiment of the filter circuit illustrated in FIG.
  • the filter circuit of FIG. 3 differs from that of FIG. 1 in that the capacitor 106 shares one electrode with an input terminal 107 for inputting a signal from an external circuit connected to the other end of the second resistor 104. And an output terminal 108 that outputs a signal to an external circuit connected to the other end of the third resistance element 105, and a capacitance element 106b that shares one of the electrodes.
  • the other electrode of the capacitor 106a and the other electrode of the capacitor 106b are connected by a conductor 120.
  • the two capacitive elements 106a and 106b are connected in series between the input terminal 107 and the output terminal 108.
  • the chip size can be reduced as compared with the filter circuit shown in FIG.
  • the cost of integrated circuits can be reduced, and the cost of transmission equipment can be suppressed from increasing.
  • FIG. 4 shows a configuration of another embodiment of an inductor that can further reduce the length of a transmission line forming the inductor.
  • two windings 301a and 301b having a center axis in the same plane in the vertical direction and having different positions of the respective center axes are arranged at the center of the windings 301a and 301b.
  • Magnetic metals 302a and 302b are arranged at the center of the windings 301a and 301b.
  • the magnetic metals 302a and 302b By arranging the magnetic metals 302a and 302b at the center of the windings 301a and 301b, the magnetic flux density passing through the center of the windings increases, so that the transmission is shorter than that of an inductor without the magnetic metal. Since the same inductance value can be obtained with the path length, the effect of higher frequency external magnetic field noise can be reduced, and the effect of reducing electromagnetic noise radiated from the inductor can be increased.
  • FIG. 5 shows an embodiment in which the inductors in the filter circuits of FIGS. 1 and 3 are configured by a plurality of winding layers.
  • the duct has a first winding 401 having one end on an input side (not shown), and a second winding 402 having one end connected to the first winding 401 and having one end connected to the first winding 401.
  • a fourth winding 404 is arranged in the vertical direction of the three windings 403, and has one end connected to the third winding 403 and the other end on the output side (not shown).
  • the first winding 401 and the second winding 402 are configured such that the signal currents flowing in the respective windings form a vortex in the same rotational direction
  • the third winding 403 and the fourth winding 404 are The signal current flowing through each of the first winding 401 and the signal current flowing through the second winding 402 is configured to wind in a vortex in a rotation direction opposite to that of the signal current flowing through the first winding 401 or the second winding 402. It is assumed that the second winding 402 and the third winding 403 are connected so that the induced current generated in the second winding 402 and the induced current generated in the third winding 403 and the fourth winding 404 flow in opposite directions.
  • an inductor when an inductor is configured by arranging two windings in two layers in the horizontal direction, the required number of layers of the substrate increases compared to when an inductor is configured with one winding, but more An equivalent inductance value can be obtained with a small mounting area.
  • the inductor configuration in which the windings are formed in two layers is shown, but the induced current generated by the external magnetic field noise is canceled out, and the total electromagnetic noise radiated from each winding is small. The same effect can be obtained in an inductor having three winding layers or an inductor having four winding layers, as long as the winding is configured as described above.
  • the filter circuit can be compared with the filter circuits of the embodiment shown in Figs. 1 and 3.
  • the mounting area of the entire circuit can be reduced.
  • FIG. 6 is a diagram showing an embodiment of the filter circuit of the present invention configured using chip coils, chip capacitors, and chip resistors of individual components.
  • the filter circuit according to the third embodiment includes a chip coil 501 having one end connected to a ground terminal 508, a first chip resistor 502 having one end connected to the chip coil 501, and one end connected to an input terminal 506 for inputting a signal.
  • the chip coil 501 is formed of two windings having a center axis in the same plane in the vertical direction and having different positions of the center axis, as shown in the first to fourth embodiments. Are connected so that the signal currents flowing through the windings form spirals in the opposite directions of rotation, and the induced currents generated in the respective windings by external magnetic field noise flow in the opposite directions. It is characterized by. As described above, even when the filter circuit is configured using the individual components, it is possible to reduce the radiated electromagnetic noise while being affected by the external magnetic field noise.
  • the filter IC packaged with the bypass filter circuit described in the first embodiment for compensating waveform deterioration in the transmission path is configured by a driver circuit and a receiver circuit.
  • a second embodiment applied to a transmission device (transmission system) will be described with reference to FIG.
  • the transmission device (transmission system) shown in FIG. 7 includes a driver circuit 602 for transmitting a transmission signal of about 10 GHz to 1 GHz or more to the transmission path 604, and a transmission circuit of about 10 GHz to 1 GHz or more transmitted through the transmission path 604.
  • a filter circuit (specifically, a high-pass filter circuit) provided on the transmission line 604 for improving a transmission waveform deteriorated by a dielectric loss or a skin effect in the transmission line 604.
  • the driver circuit 1201 includes a logical operation circuit 1202 for performing arithmetic processing on data, and an output buffer 1203 for transmitting data.
  • the Recino circuit 1204 includes an input buffer 1205 for receiving data, and a logical operation circuit 1206 for performing arithmetic processing on received data.
  • the filter IC 601 is formed of an inductor that reduces the radiated electromagnetic noise described in the first embodiment and is not easily affected by an external magnetic field noise of about 10 GHz to 5 GHz or more. It is characterized by the following.
  • the filter IC is It is shown in a package with a line! /, But it may be a package such as BGA ⁇ flip chip! / ⁇ .
  • the data signal output from the driver circuit 602 to the transmission line 604 becomes a signal waveform in which the rise and fall characteristics are degraded due to the skin effect and the dielectric loss in the transmission line 604.
  • the filter IC 601 shapes the signal waveform to improve the rise-Z fall characteristic by compensating for the influence of the loss in the transmission line 604.
  • the shaped signal waveform is output from the filter IC 601 and transmitted to the receiver circuit 603 via the transmission path 604.
  • the filter IC 601 hardly radiates electromagnetic noise even when transmitting a signal current, so that the influence on other circuits and devices is small.
  • the filter IC 601 can stably improve the transmission waveform.
  • the transmission circuit is configured using the filter IC in which the filter circuit (specifically, the no-pass filter circuit) according to the present invention is packaged, so that the radiation is radiated from the transmission system.
  • a transmission system that can stably transmit (operate) transmission signals of about 10 GHz to 1 GHz or more because it can hardly increase electromagnetic noise and reduce the effects of external magnetic field noise of about 10 GHz to 5 GHz or more. It can be built.
  • the logic IC according to the third embodiment includes a filter circuit 901 for compensating a loss in a transmission line and shaping a transmission waveform, a logic circuit 902 for performing a logical operation on a signal, the filter circuit 901 and the logic circuit 902.
  • the filter circuit 901 is characterized in that the filter circuit 901 is configured by an inductor that reduces the radiated electromagnetic noise described in the first embodiment and is not easily affected by external magnetic field noise.
  • the transmission signal reaches the filter circuit 901 via the bonding wire 905.
  • the signal that has reached the filter circuit 901 is shaped by the filter circuit 901 and transmitted to the logic circuit 902. At this time, even when a signal current is transmitted in the filter circuit 901, almost no electromagnetic noise is radiated, and, for example, an adjacent circuit such as the logic circuit 902 is affected by induced current caused by radiated magnetic field noise. Can be reduced.
  • the filter circuit according to the present invention on the die, the influence of not only the external magnetic field noise at a relatively distant place but also the adjacent circuit force and the radiated magnetic field noise on the filter circuit is obtained. Since it is possible to reduce noise and radiated electromagnetic noise from the filter circuit, it is possible to form a logic IC that reduces data loss and errors during logic operation processing.
  • the method of electrically connecting the die and the package by the bonding wire has been described.
  • the method of electrically connecting the die and the package is, for example, A similar effect can be obtained by mounting a die as a flip chip on a substrate and connecting it to a package.
  • the multi-chip module according to the fourth embodiment is a filter circuit die equipped with the filter circuit (specifically, a high-pass filter circuit) for compensating for the loss in the transmission line described in the first embodiment.
  • a logic circuit die 1002 equipped with a logic circuit for performing a logical operation on a signal
  • a node / cage 1003 equipped with the filter circuit die 1001 and the logic circuit die 1002, and between dies or between dies and packages.
  • a bonding wire 1004 for electrically connecting the terminals is formed.
  • the fourth embodiment differs from the third embodiment in that a die 1001 equipped with a filter circuit is separated from a die 1002 equipped with a logic circuit. There is.
  • the filter circuit mounted on the filter circuit die 1001 is characterized by being configured with an inductor, which reduces radiated electromagnetic noise and is not easily affected by external magnetic field noise.
  • the multi-chip module by mixing the filter circuit die equipped with the filter circuit according to the present invention and the logical circuit die, not only the external magnetic field noise at a relatively distant place but also the filter circuit can be obtained.
  • the logic circuit is newly added by mounting the filter circuit and the logic circuit on different dies. In some cases, it may not be necessary to manufacture the IC in such a case. In such a case, the manufacturing cost is lower than that of the logic IC according to the third embodiment shown in FIG. It becomes possible to reduce the door.
  • a method of electrically connecting between dies or between a die and a package by a bonding wire has been described, but a method of electrically connecting between dies or between a die and a package is described. Then, for example, a similar effect can be obtained by a method in which the die is mounted on a substrate as a flip chip and connected to a die or a package.
  • the filter circuit described in the first embodiment (specifically, no , A bypass filter circuit).
  • the filter-mounted connector according to the fifth embodiment includes a backplane connector 1101 for electrically connecting two substrates, and a filter circuit for compensating for the loss in the transmission line described in the first embodiment ( Specifically, it is equipped with a high-pass filter circuit) and a filter chip 1102 connected to a transmission line in the backplane connector 1101.
  • the transmission signal of about 1 OGHz to lGHz or more reaching the daughter board pin 1104 is transmitted to the filter chip 1102, and the transmission path in the filter chip 1102 is transmitted.
  • the transmission waveform is shaped by compensating for the loss.
  • the shaped transmission signal is output to another external circuit (not shown) via the daughter board pin 1104 or the mother board pin 1103.
  • the filter chip 1102 equipped with the filter circuit according to the present invention hardly radiates electromagnetic noise, so that the influence on other circuits and devices is small and the filter chip 1102 Since the influence of the induced current generated by the magnetic field noise radiated from the circuit or the device can be reduced, it is possible to stably improve the transmission waveform.
  • the filter chip 1102 is applied to the backplane connector 1101 .
  • a connector used at the end of a cable for connecting a board or an apparatus may be used. You may apply.
  • the filter-mounted connector using the filter circuit according to the present invention, the electromagnetic noise radiated from the connector can be hardly increased, and the effect of the external magnetic field noise can be reduced. As a result, it is possible to manufacture a filter-mounted connector that operates stably, and it is not necessary to mount the filter circuit inside the IC or on the board, so that the IC or board can be miniaturized. Become.
  • FIG. Fig. 11 shows a transmission device (transmission system) that switches the transmission path of a transmission signal transmitted by an optical fiber, and a plurality of optical signals that convert a transmission signal of about 10 GHz to 1 GHz or more into an optical-electrical signal.
  • a module 702 a plurality of optical fibers 701 for transmitting an optical signal, a plurality of switch ICs 705 for determining a transfer path of the transmission signal, a plurality of switch boards 703 on which the plurality of optical modules 702 and the switch IC 705 are mounted, It comprises a backboard 704 for transmitting signals between the plurality of switchboards 703, and a plurality of backplane connectors 706 for electrically connecting each of the plurality of switchboards 703 to the backboard 704. That is, the transmission device (transmission system) includes a plurality of optical fibers 701 connected.
  • a plurality (many) of switch boards 703 mounted with an optical module 702 and a switch IC 705 for switching a transfer path of a transmission signal from the optical module 702 to a frequency of about 10 GHz to 1 GHz or more are formed on the back board 704 in the form of a blade. Connected with connector 706.
  • the filter circuit according to the present invention is applied to the optical module 702, the switch IC 705, or the backplane connector 706. Since the optical module 702 and the switch IC 705 include a driver circuit 602 and a receiver circuit 603 as shown in FIG. 7, a filter circuit (a circuit) is provided between the driver circuit 602 and the receiver circuit 603. It is possible to provide a filter IC) 601. Further, the filter chip 1102 can be inserted into the knock plane connector 706 as in the fifth embodiment shown in FIG.
  • the optical signal received from the optical fiber 701 is converted into an electric signal of about 10 GHz to 1 GHz or more by the optical module 702 to which the optical fiber 701 is connected. Further, the converted electric signal is transmitted from the optical module 702 to the switch IC 705, and the transfer path of the electric signal is determined in the switch IC 705. At this time, depending on the determined transfer path, the electric signal is transferred to the other optical module 702 on the switch board 703 or to the optical module 702 on the other switch board 703 via the back board 704. You. The transferred electric signal is converted from the electric signal into an optical signal by the optical module 702, and connected to the optical module 702, and the optical signal is transmitted to another transmission device by the optical fiber 701.
  • the transmission device As described above, by configuring the transmission device using the optical module, the switch IC, and the connector to which the filter circuit according to the present invention is applied, the influence of extraneous magnetic field noise is reduced, and the data loss or the transmission device is reduced. It is possible to reduce the occurrence of erroneous operations and to reduce electromagnetic noise radiated from the device.
  • Specific examples of such a transmission device include, but are not limited to, a switch board, a router, a server, a computer, and peripheral devices of a computer.
  • the induced current generated by the external magnetic field noise generated by the adjacent circuit power is reduced, the electromagnetic noise radiated from the inductor cap is suppressed, and the IC and the transmission device are reduced. It is possible to provide a filter circuit that eliminates the cost increase, and an IC and a transmission device including the filter circuit.
  • FIG. 1 is a schematic configuration diagram and a circuit diagram showing Example 1 of a filter circuit according to a first embodiment of the present invention.
  • FIG. 2 is a diagram showing an amount of induced current generated in a winding constituting an inductor and a magnetic field intensity radiated from the winding.
  • FIG. 3 is a schematic configuration diagram showing Example 2 of the filter circuit according to the first embodiment of the present invention.
  • FIG. 4 is a schematic diagram showing a configuration of an inductor used in the filter circuit according to the present invention and capable of further shortening the length of a transmission line.
  • FIG. 5 is a schematic diagram showing a case where an inductor is configured by four windings, which is used in a filter circuit according to the present invention.
  • FIG. 6 is a schematic configuration diagram showing Example 3 of the filter circuit according to the first embodiment of the present invention, which is configured by a chip coil, a chip capacitor, and a chip resistor of individual components.
  • FIG. 7 is a diagram showing a transmission system according to a second embodiment of the present invention to which a filter IC in which a filter circuit is IC packaged is applied.
  • FIG. 8 is a perspective view showing a logic IC according to a third embodiment of the present invention, in which a filter circuit is mounted and packaged on a die on which a logic circuit for performing a logical operation on a signal is mounted. is there.
  • FIG. 9 is a multi-chip according to a fourth embodiment of the present invention, in which a plurality of dies such as a die equipped with a filter circuit and a die equipped with a logic circuit are mixed in the same knockout. It is a perspective view which shows a module.
  • FIG. 10 is a perspective view showing a filter-mounted connector according to a fifth embodiment of the present invention, in which a filter chip in which a filter circuit is packaged is mounted on a backplane connector.
  • FIG. 11 is a perspective view showing a transmission apparatus for transmitting and receiving high-speed signals using a filter circuit according to a sixth embodiment of the present invention.
  • FIG. 12 is a configuration diagram showing one embodiment of a driver circuit and a receiver circuit used in the transmission device (transmission system) according to the present invention.

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Abstract

A filter circuit, an optical module, an IC, a connector, a transmitting apparatus and a transmitting system having the filter circuit that reduces an induced current caused by an external magnetic field noise occurring from an adjacent circuit, suppresses electromagnetic noise radiated from an inductor, and resolves the problem of cost increase of ICs and transmitting apparatus. In a filter circuit composed of passive elements such as a capacitance element, inductors and so on, the inductors comprise two respective windings having central axes running in the vertical direction in the same plane but locating at different positions, and those windings are connected to each other in such a manner that the currents flow through the respective windings in mutually-reverse spiral fashions and that the induced current caused by the external magnetic field noise flows in the opposite direction.

Description

明 細 書  Specification
フィルタ回路、論理 IC、マルチチップモジュール、フィルタ搭載型コネクタ  Filter circuit, logic IC, multi-chip module, filter mounted connector
、伝送装置及び伝送システム , Transmission device and transmission system
技術分野  Technical field
[0001] 本発明は、外来磁界ノイズによる信号波形劣化の影響を受けにくぐ且つ輻射電磁 ノイズの発生を低減することが可能なフィルタ回路のに関するものであり、特に高速 信号を送受信する IC、およびそれを用いて構成される通信機器、サーバ、通信 ICな どの装置に関する。  The present invention relates to a filter circuit that is less susceptible to signal waveform deterioration due to extraneous magnetic field noise and is capable of reducing the generation of radiated electromagnetic noise, and in particular, relates to an IC that transmits and receives high-speed signals, and It relates to devices such as communication devices, servers, and communication ICs that are configured using the devices.
背景技術  Background art
[0002] 近年、 IC間や伝送装置間のデータ転送容量が急速に増加しており、これに伴い IC や伝送装置を構成するドライバ回路とレシーバ回路を電気的に接続する伝送路 1本 当りのデータ伝送速度にお 、ては、たとえば 2. 5Gビット Z秒や 10Gビット Z秒と 、つ た高速ィ匕が進んでいる。このようなデータ伝送速度の高速化は、伝送路における表 皮効果や誘電体損失の増加を招き、信号波形の劣化が顕著となる。この信号波形の 劣化を補償するために、ドライバ回路やレシーバ回路あるいは伝送路上に、誘電体 損失や導体損失の影響を補償するためのイコライザ回路 (ハイパスフィルタ回路)を 設けた ICや伝送装置が作製されつつある。  [0002] In recent years, the data transfer capacity between ICs and between transmission devices has been rapidly increasing, and with this, per transmission line that electrically connects a driver circuit and a receiver circuit constituting an IC or a transmission device. With respect to the data transmission speed, for example, 2.5 Gbit Z seconds or 10 Gbit Z seconds, high-speed transmission is progressing. Such an increase in the data transmission speed causes a skin effect and an increase in dielectric loss in the transmission path, and the signal waveform is significantly deteriorated. In order to compensate for the deterioration of the signal waveform, ICs and transmission devices with an equalizer circuit (high-pass filter circuit) provided on the driver circuit, receiver circuit, or transmission line to compensate for the effects of dielectric loss and conductor loss are manufactured. Is being done.
[0003] また、データ転送速度の高速化は、伝送路間の電磁干渉により生じる高周波ノイズ の増大を招くことから、高周波ノイズを低減するためのローノ スフィルタ回路をドライ バ回路やレシーバ回路あるいは伝送路上に設けることも多い。  [0003] Further, an increase in the data transfer rate causes an increase in high-frequency noise caused by electromagnetic interference between transmission paths. Therefore, a low-noise filter circuit for reducing high-frequency noise is provided by a driver circuit, a receiver circuit, or a transmission circuit. Often installed on the road.
[0004] これらのフィルタ回路は、一般にインダクタや容量素子といった受動素子によって構 成されている。フィルタ回路を構成するインダクタは、外来磁界ノイズがインダクタを構 成する巻き線の中心部に入射されると、外来磁界ノイズをキャンセルする方向に誘導 電流が誘起されるため、数百 Aといった大きな電流ノイズが伝送信号に重畳されて データの欠落や伝送装置の誤作動が発生する場合がある。また、インダクタに信号 電流を伝送すると、インダクタより電磁ノイズが輻射されるため、他の回路や装置の誤 作動を招く場合がある。この課題を解決する手段として、特許文献 1 (特開平 6— 350 280号公報）に示すように、回路を含む IC全体を、接地した導体板 (シールドケース） で外部回路より遮蔽することにより、外部磁界ノイズの影響を低減し、且つ回路からの 輻射電磁ノイズを低減する方法がある。 [0004] These filter circuits are generally constituted by passive elements such as inductors and capacitive elements. When the external magnetic field noise enters the center of the winding that forms the inductor, an induced current is induced in the direction that cancels the external magnetic field noise. Noise may be superimposed on the transmission signal, causing loss of data or malfunction of the transmission device. In addition, when a signal current is transmitted to the inductor, electromagnetic noise is radiated from the inductor, which may cause malfunction of other circuits or devices. To solve this problem, Patent Document 1 (Japanese Unexamined Patent Publication No. No. 280), by shielding the entire IC including the circuit from the external circuit with a grounded conductor plate (shield case), the effect of external magnetic field noise is reduced, and the radiated electromagnetic noise from the circuit is reduced. There are ways to reduce it.
[0005] 特許文献 1 :特開平 6— 350280号公報 Patent Document 1: JP-A-6-350280
発明の開示  Disclosure of the invention
[0006] し力しながら、上記方法では、接地導体板の外部力ものノイズの影響を低減するこ とは可能であるが、接地導体板で遮蔽した回路内にぉ ヽて輻射された電磁ノイズに よってインダクタに生じる誘導電流を低減することはできず、また、 ICとは別に接地導 体板を設ける必要があることから ICや伝送装置のコストの増加につながるという課題 がある。  [0006] Although the above method can reduce the influence of external noise on the ground conductor plate, the electromagnetic noise radiated entirely in the circuit shielded by the ground conductor plate can be reduced. Therefore, there is a problem that the induced current generated in the inductor cannot be reduced, and the cost of the IC and the transmission device increases because the ground conductor plate must be provided separately from the IC.
[0007] そこで、本発明は、これらの課題である、隣接した回路力も発生した外来磁界ノイズ によって生じる誘導電流を低減し、また、インダクタカゝら輻射される電磁ノイズを抑制 し、且つ ICや伝送装置のコストの増加を解消するフィルタ回路及び該フィルタ回路を 備えた ICや伝送装置を提供することを目的としたものである。  [0007] Therefore, the present invention reduces these problems, that is, induced current caused by extraneous magnetic field noise that also generates adjacent circuit forces, suppresses electromagnetic noise radiated from the inductor cap, and improves IC and IC performance. An object of the present invention is to provide a filter circuit that eliminates an increase in the cost of a transmission device, and an IC and a transmission device provided with the filter circuit.
[0008] 上記目的を達成するために、本発明は、ハイパスフィルタ回路などのフィルタ回路 を構成するインダクタは、同一平面の鉛直方向に中心軸を持ち且つそれぞれの中心 軸の位置の異なる少なくとも 2つの巻き線で形成し、それぞれの巻き線を巻き線より 輻射される電磁ノイズが互いに逆符号持つように巻き、外来磁界ノイズにより生じる誘 導電流を相殺するように接続して構成されることを特徴とする。  [0008] In order to achieve the above object, according to the present invention, an inductor forming a filter circuit such as a high-pass filter circuit has at least two inductors having a center axis in a vertical direction on the same plane and different positions of the respective center axes. It is formed of windings, each winding is wound so that the electromagnetic noise radiated from the windings has the opposite sign, and connected so as to cancel the induced current generated by the external magnetic field noise. And
[0009] 具体的には、本発明は、フィルタ回路を構成するインダクタにおいて、一端を入力と した第 1巻き線と、前記第 1巻き線と同一平面内に配置し一端を前記第 1巻き線に接 続し、他端を出力とした第 2巻き線とで構成し、第 1巻き線と第 2巻き線のそれぞれに 流れる信号電流が反対の回転方向の渦を卷くように構成し、外来磁界ノイズにより第 1巻き線と第 2巻き線に生じる誘導電流が逆方向に流れるように第 1巻き線と第 2巻き 線を接続して構成したことを特徴とするものである。  [0009] Specifically, the present invention provides an inductor constituting a filter circuit, wherein a first winding having one end as an input, and a first winding disposed on the same plane as the first winding and having one end connected to the first winding. And a second winding having the other end as an output, and a signal current flowing in each of the first winding and the second winding is wound in a vortex in the opposite rotation direction. The first winding and the second winding are connected so that induced currents generated in the first winding and the second winding due to external magnetic field noise flow in opposite directions.
[0010] また、本発明は、ドライバ回路とレシーバ回路とを伝送路で接続して構成される伝 送システムであって、前記伝送路に、前記フィルタ回路をノヽィパスフィルタ回路として 備えたことを特徴とする。 [0011] また、本発明は、ドライバ回路とレシーバ回路とを伝送路で接続して構成される伝 送システムであって、前記伝送路に、前記フィルタ回路を前記伝送路における波形 劣化を補償するハイノスフィルタ回路としてパッケージィ匕したフィルタ ICで備えたこと を特徴とする。 [0010] Further, the present invention is a transmission system configured by connecting a driver circuit and a receiver circuit by a transmission path, wherein the transmission path includes the filter circuit as a noise path filter circuit. It is characterized by. Further, the present invention is a transmission system configured by connecting a driver circuit and a receiver circuit by a transmission line, wherein the transmission line is provided with the filter circuit to compensate for waveform deterioration in the transmission line. It is characterized in that it is provided with a packaged filter IC as a hynos filter circuit.
[0012] また、本発明は、論理演算処理する論理回路を有する論理 IC内に、前記フィルタ 回路を備えたことを特徴とする論理 ICである。  [0012] The present invention is a logic IC characterized in that the filter circuit is provided in a logic IC having a logic circuit for performing a logical operation.
[0013] また、本発明は、前記フィルタ回路を搭載したダイと論理回路を搭載したダイとをパ ッケージ内に混載実装したことを特徴とするマルチチップモジュールである。 [0013] The present invention is also a multi-chip module, wherein a die on which the filter circuit is mounted and a die on which a logic circuit is mounted are mounted together in a package.
[0014] また、本発明は、伝送路間を接続するコネクタであって、前記フィルタ回路をチップ 化したフィルタチップを内包することを特徴とするフィルタ搭載型コネクタである。 [0014] The present invention is also a connector mounted with a filter, which is a connector for connecting between transmission paths, and includes a filter chip in which the filter circuit is formed into a chip.
[0015] また、本発明は、光ファイバを接続した光モジュール力も得られる伝送信号の転送 経路をスィッチ ICで決定して伝送する伝送装置であって、前記光モジュールまたは 前記スィッチ IC内の伝送路に、前記フィルタ回路をハイパスフィルタ回路として備え たことを特徴とする。 [0015] The present invention is also a transmission device that determines a transmission path of a transmission signal to which an optical module connected to an optical fiber is also obtained by a switch IC and transmits the transmission path, wherein the transmission path in the optical module or the switch IC is provided. Preferably, the filter circuit is provided as a high-pass filter circuit.
[0016] また、本発明は、光ファイバを接続した光モジュールと該光モジュール力 得られる 伝送信号の転送経路を決定するスィッチ ICとを実装したスィッチボードの複数を、伝 送路を形成したバックボードにバックプレーンコネクタで電気的に接続して構成され る伝送装置であって、前記光モジュールまたは前記スィッチ ICまたは前記バックプレ ーンコネクタ内の伝送路に、前記フィルタ回路をハイパスフィルタ回路として備えたこ とを特徴とする。  The present invention also relates to a backplane having a transmission path formed by connecting a plurality of switch boards each having an optical module connected to an optical fiber and a switch IC for determining a transmission path of a transmission signal obtained by the optical module. A transmission device configured to be electrically connected to a board by a backplane connector, wherein the filter circuit is provided as a high-pass filter circuit in a transmission path in the optical module, the switch IC, or the backplane connector. It is characterized by.
[0017] 以上説明したように、本発明によれば、フィルタ回路を構成するインダクタを同一平 面の鉛直方向に中心軸を持ち且つそれぞれの中心軸の位置の異なる 2つの巻き線 で形成し、それぞれの巻き線を巻き線より輻射される電磁ノイズが互いに逆符号持つ ように巻き線を巻き、外来磁界ノイズにより生じる誘導電流を相殺するように構成とす ることで、比較的遠方の回路や装置力 の外来磁界ノイズのみならず、隣接した回路 力もの外来磁界ノイズによる影響にっ 、ても同様に低減することができ、且つフィルタ 回路からの輻射電磁ノイズも低減することができる。  As described above, according to the present invention, an inductor constituting a filter circuit is formed by two windings having a center axis in a vertical direction on the same plane and having different positions of the respective center axes, By winding each winding so that the electromagnetic noise radiated from the winding has the opposite sign to each other, and canceling out the induced current generated by the external magnetic field noise, a relatively distant circuit or The influence of not only the external magnetic field noise of the device power but also the external magnetic field noise of the adjacent circuit power can be similarly reduced, and the radiated electromagnetic noise from the filter circuit can also be reduced.
[0018] また、本発明によれば、誘導電流や輻射電磁ノイズを低減するフィルタ回路は、接 地導体板を用いる必要がなぐ ICや伝送装置に力かる組立費等のコストの増加を抑 えることが可能となる。 According to the present invention, the filter circuit for reducing the induced current and the radiated electromagnetic noise is connected It is possible to suppress an increase in costs such as assembly costs for ICs and transmission devices that do not require the use of a ground conductor plate.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0019] 以下、本発明に係るフィルタ回路、論理 IC、マルチチップモジュール、フィルタ搭載 型コネクタ、伝送装置及び伝送システムの実施の形態について図面を用いて説明す る。  Hereinafter, embodiments of a filter circuit, a logic IC, a multichip module, a connector with a filter, a transmission device, and a transmission system according to the present invention will be described with reference to the drawings.
[0020] [第 1の実施の形態]  [First Embodiment]
まず、本発明に係る第 1の実施の形態であるフィルタ回路について図面を参照して 説明する。  First, a filter circuit according to a first embodiment of the present invention will be described with reference to the drawings.
[0021] [実施例 1]  [Example 1]
まず、本発明に係るフィルタ回路の実施例 1につ 、て説明する。  First, a first embodiment of the filter circuit according to the present invention will be described.
[0022] 図 1 (a)は、 Si基板等上に作製した本発明のハイパスフィルタ回路の実施例 1を示 す構成図、図 1 (b)は本発明のハイパスフィルタ回路の実施例 1を示す回路図である 。第 1の実施の形態のハイパスフィルタ回路は、同一平面の鉛直方向に中心軸を持 ち且つそれぞれの中心軸の位置の異なる 2つの巻き線 102a、 102bで構成し、一端 を接地端子 109に接続したインダクタ 101と、一端を前記インダクタ 101に接続した 第 1抵抗素子 103と、一端を前記第 1抵抗素子 103に接続し、他端を外部回路より信 号を入力する入力端子 107に接続した第 2抵抗素子 104と、一端を前記第 1抵抗素 子 103に接続し、他端を外部回路に信号を出力する出力端子 108に接続した第 3抵 抗素子 105と、一端を前記入力端子 107に接続し、他端を前記出力端子 108に接 続した容量素子 106とで構成される。特に、インダクタ 101は、信号電流を伝送した 場合にそれぞれの巻き線より輻射される磁界が逆位相となり、且つ同一ベクトルを持 つ外来磁界ノイズ（10GHz〜5GHz程度あるいはそれ以上)より生じる誘導電流を相 殺するように、 2つの巻き線 102a、 102bで構成していることを特徴とする。すなわち、 2つの巻き線 102a、 102bにおいては、それぞれに流れる信号電流を反対の回転方 向の渦を卷くようにし、且つ外来磁界ノイズにより生じる誘導電流が逆方向に流れる ように接続して 、ることを特徴とする。  FIG. 1A is a configuration diagram showing a first embodiment of the high-pass filter circuit of the present invention fabricated on a Si substrate or the like, and FIG. 1B is a diagram showing a first embodiment of the high-pass filter circuit of the present invention. FIG. The high-pass filter circuit according to the first embodiment includes two windings 102a and 102b having a central axis in the same plane in the vertical direction and having different positions of the respective central axes, and one end is connected to the ground terminal 109. The first resistor 103 having one end connected to the inductor 101, the other end connected to the first resistor 103, and the other end connected to an input terminal 107 for inputting a signal from an external circuit. A second resistance element 104, a third resistance element 105 having one end connected to the first resistance element 103 and the other end connected to an output terminal 108 for outputting a signal to an external circuit, and one end connected to the input terminal 107; And a capacitive element 106 having the other end connected to the output terminal 108. In particular, the inductor 101 suppresses the induced current generated by external magnetic field noise (about 10 GHz to 5 GHz or more) having the same vector as the magnetic field radiated from each winding when the signal current is transmitted. It is characterized by comprising two windings 102a and 102b so as to cancel each other. That is, in the two windings 102a and 102b, the signal currents flowing through the two windings 102a and 102b are connected so that the eddies in the opposite rotational directions are wound, and the induced current generated by the external magnetic field noise flows in the opposite direction. It is characterized by that.
[0023] さらに、本発明のフィルタ回路においてインダクタを構成する 2つの巻き線 102a、 1 02bを、同一のインダクタンス特性を持つように構成することで、それぞれに生じる誘 導電流や輻射電磁ノイズを効率的に相殺することが可能となる。 [0023] Further, the two windings 102a, 1 constituting the inductor in the filter circuit of the present invention. By configuring the 02b to have the same inductance characteristics, it is possible to effectively cancel the induced current and radiated electromagnetic noise that occur in each of them.
[0024] さらに、インダクタ 101を構成する伝送路の長さを、低減すべき外来磁界ノイズ（10 GHz〜5GHz程度）の波長（3〜6cm程度）の 5分の 1もしくは伝送信号（10GHz〜l GHz程度）の帯域波長（3〜30cm程度）の 5分の 1の!、ずれか短!、方の長さ以下と する。これは、それぞれの巻き線で生じる誘導電流の位相差を小さくすることで効果 的に外来磁界ノイズの影響を低減し、且つそれぞれの巻き線より輻射される電磁ノィ ズの位相差を小さくすることで電磁ノイズの総和を小さくするためである。言 、換える と、インダクタを構成する伝送路の長さを短くすることで、より高周波の外来磁界ノイズ による伝送波形劣化を効果的に低減することが可能となり、且つインダクタカ 輻射 される電磁ノイズの低減効果も大きくなる。  Further, the length of the transmission path constituting the inductor 101 is reduced to one fifth of the wavelength (about 3 to 6 cm) of the external magnetic field noise (about 10 to 5 GHz) to be reduced or the transmission signal (10 to 1 GHz). 1/5! Of the band wavelength (approximately 3 to 30 cm) of the band! This is to reduce the phase difference of the induced current generated in each winding, effectively reduce the effect of external magnetic field noise, and reduce the phase difference of the electromagnetic noise radiated from each winding. This is to reduce the sum of electromagnetic noise. In other words, by shortening the length of the transmission line that forms the inductor, it is possible to effectively reduce transmission waveform degradation due to higher frequency external magnetic field noise, and to reduce the electromagnetic noise radiated by the inductor. The reduction effect also increases.
[0025] 図 2 (a)は、図 1に示したフィルタ回路において、最大振幅が lWb程度の磁界強度 を持つ外来磁界ノイズにより、それぞれの巻き線 102a、 102bに生じる誘導電流量 2 01a、 201bと、それぞれの誘導電流量の総和 201cと、本発明の効果の比較のため に図 1に示したインダクタ 101と同等のインダクタンス値を持つインダクタを 1つの巻き 線で構成した比較例の場合に生じる誘導電流量 201dを示しており、横軸を時間とし 、縦軸を電流量とする。  FIG. 2 (a) shows the amount of induced current 201a, 201b generated in each of windings 102a, 102b due to extraneous magnetic field noise having a magnetic field strength with a maximum amplitude of about lWb in the filter circuit shown in FIG. In the case of a comparative example in which an inductor having the same inductance value as the inductor 101 shown in FIG. The amount of induced current 201d is shown, with the horizontal axis representing time and the vertical axis representing current.
[0026] 本発明のインダクタにおいて、一方の巻き線 102aに生じる誘導電流量 201aと、他 方の巻き線 102bに生じる誘導電流量 201bは、互いに逆符号となっており、その振 幅は同程度の大きさとなっている。つまり、 2つの巻き線 102a、 102bに生じる誘導電 流量の総和 201cをほぼゼロとすることができる。一方、インダクタを 1つの巻き線で構 成した比較例の場合に生じる最大の誘導電流量 201dは、 0. 2mA以上となるため、 本発明のインダクタ構成に比べて信号波形劣化が大きくなる。  [0026] In the inductor of the present invention, the amount of induced current 201a generated in one winding 102a and the amount of induced current 201b generated in the other winding 102b have opposite signs, and their amplitudes are substantially the same. The size has become. That is, the sum 201c of the induced currents generated in the two windings 102a and 102b can be made substantially zero. On the other hand, the maximum amount of induced current 201d generated in the comparative example in which the inductor is formed by one winding is 0.2 mA or more, so that the signal waveform deterioration is larger than that of the inductor configuration of the present invention.
[0027] 以上のことから、本発明に係る容量素子 106や抵抗素子 103〜105やインダクタ 1 01の受動素子で形成されるノ、ィパスフィルタ回路において本発明のインダクタ構成 を用いることにより、 10GHz〜5GHz程度あるいはそれ以上の外来磁界ノイズによる 10GHz〜： LGHz程度あるいはそれ以上の伝送信号の伝送波形劣化の影響を低減 することが可能となる。 [0028] 図 2 (b)は、図 1に示したフィルタ回路において、最大振幅が 16mA程度の信号電 流がインダクタ 101に流れた場合のそれぞれの巻き線 102a、 102bの中心部におけ る磁界の強度 202a、 202bと、それぞれの磁界強度の総和 202cと、本発明の効果 の比較のために図 1に示したインダクタ 101と同等のインダクタンス値を持つインダク タを 1つの巻き線で構成した比較例の場合の磁界の強度 202dを示しており、横軸を 時間とし、縦軸を磁界強度とする。 From the above, by using the inductor configuration of the present invention in a bypass filter circuit formed by the capacitive element 106, the resistive elements 103 to 105, and the passive element of the inductor 101 according to the present invention, the 10 GHz Up to about 5 GHz or more due to extraneous magnetic field noise 10 GHz or more: It is possible to reduce the effect of transmission waveform deterioration of transmission signals of about LGHz or more. FIG. 2 (b) shows the magnetic field at the center of each of windings 102a and 102b when a signal current having a maximum amplitude of about 16 mA flows through inductor 101 in the filter circuit shown in FIG. Of the magnetic field strengths 202a and 202b, the sum of the respective magnetic field strengths 202c, and an inductor having an inductance value equivalent to that of the inductor 101 shown in FIG. The magnetic field strength 202d in the example is shown, with the horizontal axis representing time and the vertical axis representing magnetic field strength.
[0029] 本発明のインダクタにおいて、一方の巻き線 102aより輻射される磁界強度 202aと 、他方の巻き線 102bより輻射される磁界強度 202bは、互いに逆符号となっており、 その振幅は同程度の大きさとなっている。つまり、 2つの巻き線 102a、 102bより輻射 される磁界強度の総和 203cをほぼゼロとすることができる。一方、インダクタを 1つの 巻き線で構成した比較例の場合に生じる最大の磁界強度 202dは、 lOOWb以上とな るため、本発明のインダクタ構成に比べて外部回路に対する影響が大き 、。  [0029] In the inductor of the present invention, the magnetic field strength 202a radiated from one winding 102a and the magnetic field strength 202b radiated from the other winding 102b have opposite signs to each other, and have substantially the same amplitude. The size has become. That is, the sum 203c of the magnetic field intensities radiated from the two windings 102a and 102b can be made substantially zero. On the other hand, the maximum magnetic field strength 202d generated in the comparative example in which the inductor is formed by one winding is equal to or more than 10OWb, so that the influence on the external circuit is greater than that of the inductor configuration of the present invention.
[0030] 以上のことから、本発明のインダクタ構成を用いることにより、輻射する電磁ノイズを 低減し、外部回路や装置等に対して与える影響を低減できる。  As described above, by using the inductor configuration of the present invention, radiated electromagnetic noise can be reduced, and the effect on external circuits and devices can be reduced.
[0031] 本実施例では、ハイパスフィルタ回路を搭載する基板として Si基板の場合を示した 力 特に Si基板に限定されるものではなぐセラミック基板やたとえば GaAsなどの他 の半導体基板を用いた場合においても同様の効果を得ることができる。また、フィル タ回路として広域の周波数帯のみを通過させるハイノスフィルタ回路を示した力 本 発明のインダクタ構成を用いることにより、低域の周波数帯域のみを通過させるロー パスフィルタ回路や特定の周波数帯域のみを通過させるバンドパスフィルタ回路にお いても、同様の効果を得ることができる。  In the present embodiment, the case where a Si substrate is used as the substrate on which the high-pass filter circuit is mounted is shown. In the case where a ceramic substrate, which is not limited to the Si substrate, or another semiconductor substrate such as GaAs, is used. Can obtain the same effect. In addition, by using the inductor configuration of the present invention, a low-pass filter circuit that passes only a low frequency band or a specific frequency band is used as the filter circuit. A similar effect can be obtained even in a band-pass filter circuit that passes only the signal.
[0032] 上記のようにインダクタを構成することにより、比較的遠方の回路や装置からの外来 磁界ノイズのみならず、隣接した回路力ゝらの外来磁界ノイズによる影響を低減するこ とができ、且つハイパスフィルタ回路からの輻射電磁ノイズも低減することができる。ま た、本発明の、誘導電流や輻射電磁ノイズを低減するフィルタ回路は、特許文献 1〖こ 記載された接地導体板 (シールドケース)を用いる必要がなぐ ICや伝送装置にかか る組立費等のコストの増加を抑えることが可能となる。  [0032] By configuring the inductor as described above, it is possible to reduce not only the external magnetic field noise from a relatively distant circuit or device, but also the influence of the external magnetic field noise from the adjacent circuit power. In addition, radiated electromagnetic noise from the high-pass filter circuit can be reduced. In addition, the filter circuit of the present invention for reducing induced current and radiated electromagnetic noise is an assembly cost for an IC or transmission device that does not require the use of a grounded conductor plate (shield case) described in Patent Document 1. And so on can be prevented from increasing.
[0033] [実施例 2] 次に、本発明に係るフィルタ回路の実施例 2について図 3を用いて説明する。図 3 は、図 1に示すフィルタ回路の実施例 1における容量素子と入出力端子の電極を共 通化した場合のフィルタ回路の実施例 2の構成を示す図である。図 3のフィルタ回路 において、図 1と相違する点は、容量素子 106を、第 2抵抗素子 104の他端と接続さ れた外部回路より信号を入力する入力端子 107と一方の電極を共通化した容量素 子 106aと、第 3抵抗素子 105の他端と接続された外部回路に信号を出力する出力 端子 108と一方の電極を共通化した容量素子 106bとで構成したことである。なお、 容量素子 106aの他方の電極と容量素子 106bの他方の電極とは導体 120で接続さ れて構成される。これにより、入力端子 107と出力端子 108との間に 2つの容量素子 106aと容量素子 106bとが直列に接続されることになる。このように、容量素子を構 成する電極を入出力端子 107、 108の各々と共通化することにより、図 1に示すフィ ルタ回路に比べてチップサイズを小さくすることができることから、フィルタ回路を含む ICのコストを低減でき、伝送装置のコストの増加を抑えることができる。 [Example 2] Next, a second embodiment of the filter circuit according to the present invention will be described with reference to FIG. FIG. 3 is a diagram illustrating a configuration of a second embodiment of the filter circuit in the case where the capacitance element and the electrode of the input / output terminal are shared in the first embodiment of the filter circuit illustrated in FIG. The filter circuit of FIG. 3 differs from that of FIG. 1 in that the capacitor 106 shares one electrode with an input terminal 107 for inputting a signal from an external circuit connected to the other end of the second resistor 104. And an output terminal 108 that outputs a signal to an external circuit connected to the other end of the third resistance element 105, and a capacitance element 106b that shares one of the electrodes. Note that the other electrode of the capacitor 106a and the other electrode of the capacitor 106b are connected by a conductor 120. Thus, the two capacitive elements 106a and 106b are connected in series between the input terminal 107 and the output terminal 108. In this manner, by sharing the electrodes constituting the capacitive element with each of the input / output terminals 107 and 108, the chip size can be reduced as compared with the filter circuit shown in FIG. The cost of integrated circuits can be reduced, and the cost of transmission equipment can be suppressed from increasing.
[0034] [実施例 3] [Example 3]
次に、上記フィルタ回路の実施例 1及び 2に用いられているインダクタの他の実施 例について図 4を用いて説明する。図 4は、インダクタを構成する伝送路の長さをより 短くすることが可能となるインダクタの他の実施例の構成を示す。図 4に示すインダク タにおいては、同一平面の鉛直方向に中心軸を持ち且つそれぞれの中心軸の位置 の異なる 2つの巻き線 301a、 301bと、それぞれの巻き線 301a、 301bの中心部に配 置した磁性金属 302a、 302bとで構成される。巻き線 301a、 301bの中心部に磁性 金属 302a、 302bを配置することで、巻き線の中心部を通過する磁束密度が増加す るため、磁性金属を配置していないインダクタに比べて、短い伝送路長さで同等のィ ンダクタンス値を得ることができることから、より高周波の外来磁界ノイズの影響を低減 し、且つインダクタカゝら輻射される電磁ノイズの低減効果を大きくすることができる。  Next, another embodiment of the inductor used in the first and second embodiments of the filter circuit will be described with reference to FIG. FIG. 4 shows a configuration of another embodiment of an inductor that can further reduce the length of a transmission line forming the inductor. In the inductor shown in Fig. 4, two windings 301a and 301b having a center axis in the same plane in the vertical direction and having different positions of the respective center axes are arranged at the center of the windings 301a and 301b. Magnetic metals 302a and 302b. By arranging the magnetic metals 302a and 302b at the center of the windings 301a and 301b, the magnetic flux density passing through the center of the windings increases, so that the transmission is shorter than that of an inductor without the magnetic metal. Since the same inductance value can be obtained with the path length, the effect of higher frequency external magnetic field noise can be reduced, and the effect of reducing electromagnetic noise radiated from the inductor can be increased.
[0035] [実施例 4] Example 4
次に、上記フィルタ回路の実施例 1及び 2に用いられて 、るインダクタの更に他の 実施例について図 5を用いて説明する。図 5は、図 1及び図 3のフィルタ回路におけ るインダクタを複数層の巻き線にて構成した場合の一実施例である。本実施例のイン ダクタは、一端を入力側（図示せず)とした第 1巻き線 401と、前記第 1巻き線 401の 鉛直方向に位置し、一端を前記第 1巻き線 401に接続した第 2巻き線 402と、前記第 1巻き線 401と同一平面上に位置し、第 1巻き線 401と異なる位置に中心軸を持ち、 一端を前記第 2巻き線 402に接続した第 3巻き線 403と、前記第 3巻き線 403の鉛直 方向に位置し、一端を前記第 3巻き線 403に接続し、他端を出力側（図示せず)とし た第 4巻き線 404とで構成される。ここで、第 1巻き線 401と第 2巻き線 402は、それぞ れに流れる信号電流が同じ回転方向の渦を卷くように構成し、第 3巻き線 403と第 4 巻き線 404は、それぞれに流れる信号電流が第 1巻き線 401あるいは第 2巻き線 402 に流れる信号電流とは反対の回転方向の渦を卷くように構成し、外来磁界ノイズによ り、第 1巻き線 401と第 2巻き線 402に生じる誘導電流と、第 3巻き線 403と第 4巻き線 404に生じる誘導電流が逆方向に流れるように第 2巻き線 402と第 3巻き線 403を接 続したことを特徴とする。このように 2層の巻き線を水平方向に 2つ配置してインダクタ を構成した場合には、 1層の巻き線でインダクタを構成した場合に比べて基板の必要 層数は増加するが、より小さな実装面積で同等のインダクタンス値を得ることができる 。また、本実施例では、巻き線を 2層にした場合のインダクタ構成を示したが、外来磁 界ノイズにより生じる誘導電流を相殺し、且つそれぞれの巻き線から輻射される電磁 ノイズの総和が小さくなるように巻き線を構成したものであれば、巻き線を 3層にして 構成したインダクタや、 4層にして構成したインダクタにお ヽても同様の効果を得るこ とがでさる。 Next, still another embodiment of the inductor used in the first and second embodiments of the filter circuit will be described with reference to FIG. FIG. 5 shows an embodiment in which the inductors in the filter circuits of FIGS. 1 and 3 are configured by a plurality of winding layers. In this embodiment, The duct has a first winding 401 having one end on an input side (not shown), and a second winding 402 having one end connected to the first winding 401 and having one end connected to the first winding 401. A third winding 403, which is located on the same plane as the first winding 401, has a central axis at a position different from the first winding 401, and has one end connected to the second winding 402, A fourth winding 404 is arranged in the vertical direction of the three windings 403, and has one end connected to the third winding 403 and the other end on the output side (not shown). Here, the first winding 401 and the second winding 402 are configured such that the signal currents flowing in the respective windings form a vortex in the same rotational direction, and the third winding 403 and the fourth winding 404 are The signal current flowing through each of the first winding 401 and the signal current flowing through the second winding 402 is configured to wind in a vortex in a rotation direction opposite to that of the signal current flowing through the first winding 401 or the second winding 402. It is assumed that the second winding 402 and the third winding 403 are connected so that the induced current generated in the second winding 402 and the induced current generated in the third winding 403 and the fourth winding 404 flow in opposite directions. Features. In this way, when an inductor is configured by arranging two windings in two layers in the horizontal direction, the required number of layers of the substrate increases compared to when an inductor is configured with one winding, but more An equivalent inductance value can be obtained with a small mounting area. Further, in the present embodiment, the inductor configuration in which the windings are formed in two layers is shown, but the induced current generated by the external magnetic field noise is canceled out, and the total electromagnetic noise radiated from each winding is small. The same effect can be obtained in an inductor having three winding layers or an inductor having four winding layers, as long as the winding is configured as described above.
[0036] 以上のように、複数層の巻き線を接続して構成したインダクタを用いてフィルタ回路 を形成することにより、図 1及び図 3に示す実施の形態のフィルタ回路に比べて、フィ ルタ回路全体の実装面積を小さくすることができる。  [0036] As described above, by forming a filter circuit using an inductor formed by connecting a plurality of layers of windings, the filter circuit can be compared with the filter circuits of the embodiment shown in Figs. 1 and 3. The mounting area of the entire circuit can be reduced.
[0037] [実施例 5]  [Example 5]
次に、本発明に係るフィルタ回路の実施例 3について図 6を用いて説明する。図 6 は、個別部品のチップコイル、チップコンデンサ、チップ抵抗を用いて構成した本発 明のフィルタ回路の一実施例を示す図である。本実施例 3に示すフィルタ回路は、一 端を接地端子 508に接続したチップコイル 501と、一端を該チップコイル 501に接続 した第 1チップ抵抗 502と、一端を信号を入力する入力端子 506に接続し、他端を上 記第 1チップ抵抗 502に接続した第 2チップ抵抗 503と、一端を信号波形を出力する 出力端子 507に接続し、他端を上記第 1チップ抵抗 502に接続した第 3チップ抵抗 5 04と、一端を上記入力端子 506に接続し、他端を上記出力端子 507に接続したチッ プコンデンサ 505とで構成されている。特に、チップコイル 501は、上記実施例 1〜4 で示すように、同一平面の鉛直方向に中心軸を持ち且つ中心軸の位置の異なる 2つ の巻き線で形成され、 2つの巻き線はそれぞれに流れる信号電流が互いに反対の回 転方向の渦を卷くように構成され、また、外来磁界ノイズによりそれぞれの巻き線に生 じる誘導電流が逆方向に流れるように接続されて ヽることを特徴とする。このように、 個別部品を用いてフィルタ回路を構成した場合にぉ 、ても、外来磁界ノイズの影響を 受けに《し且つ輻射電磁ノイズを低減することが可能である。 Next, a third embodiment of the filter circuit according to the present invention will be described with reference to FIG. FIG. 6 is a diagram showing an embodiment of the filter circuit of the present invention configured using chip coils, chip capacitors, and chip resistors of individual components. The filter circuit according to the third embodiment includes a chip coil 501 having one end connected to a ground terminal 508, a first chip resistor 502 having one end connected to the chip coil 501, and one end connected to an input terminal 506 for inputting a signal. Connect, the other end up A second chip resistor 503 connected to the first chip resistor 502, a third chip resistor 504 having one end connected to the output terminal 507 for outputting a signal waveform, and the other end connected to the first chip resistor 502; A chip capacitor 505 has one end connected to the input terminal 506 and the other end connected to the output terminal 507. In particular, the chip coil 501 is formed of two windings having a center axis in the same plane in the vertical direction and having different positions of the center axis, as shown in the first to fourth embodiments. Are connected so that the signal currents flowing through the windings form spirals in the opposite directions of rotation, and the induced currents generated in the respective windings by external magnetic field noise flow in the opposite directions. It is characterized by. As described above, even when the filter circuit is configured using the individual components, it is possible to reduce the radiated electromagnetic noise while being affected by the external magnetic field noise.
[0038] [第 2の実施の形態]  [Second Embodiment]
次に、本発明に係る、伝送路における波形劣化を補償する第 1の実施の形態で説 明したノ、ィパスフィルタ回路をパッケージ化したフィルタ ICを、ドライバ回路およびレ シーバ回路で構成される伝送装置 (伝送システム）に適用した第 2の実施の形態につ いて図 7を用いて説明する。図 7に示す伝送装置 (伝送システム）は、 10GHz〜lG Hz程度あるいはそれ以上の伝送信号を伝送路 604へと送信するドライバ回路 602と 、伝送路 604を通して伝送される 10GHz〜lGHz程度あるいはそれ以上の伝送信 号を受信するレシーバ回路 603と、該伝送路 604に設けられ、伝送路 604における 誘電体損失や表皮効果より劣化した伝送波形を改善するフィルタ回路 (具体的には ハイパスフィルタ回路）をリード線のあるパッケージィ匕したフィルタ IC601と、伝送信号 を伝送する上記伝送路 604で構成される。上記ドライバ回路 602およびレシーバ回 路 603の構成の一実施例を図 12に示す。ドライバ回路 1201 (602)は、データを演 算処理する論理演算回路 1202と、データを送信するための出力バッファ 1203で構 成される。レシーノ 回路 1204 (603)は、データを受信するための入力バッファ 1205 と、受信データを演算処理する論理演算回路 1206で構成される。  Next, according to the present invention, the filter IC packaged with the bypass filter circuit described in the first embodiment for compensating waveform deterioration in the transmission path is configured by a driver circuit and a receiver circuit. A second embodiment applied to a transmission device (transmission system) will be described with reference to FIG. The transmission device (transmission system) shown in FIG. 7 includes a driver circuit 602 for transmitting a transmission signal of about 10 GHz to 1 GHz or more to the transmission path 604, and a transmission circuit of about 10 GHz to 1 GHz or more transmitted through the transmission path 604. And a filter circuit (specifically, a high-pass filter circuit) provided on the transmission line 604 for improving a transmission waveform deteriorated by a dielectric loss or a skin effect in the transmission line 604. It is composed of a packaged filter IC 601 having lead wires and the above-mentioned transmission path 604 for transmitting a transmission signal. One embodiment of the configuration of the driver circuit 602 and the receiver circuit 603 is shown in FIG. The driver circuit 1201 (602) includes a logical operation circuit 1202 for performing arithmetic processing on data, and an output buffer 1203 for transmitting data. The Recino circuit 1204 (603) includes an input buffer 1205 for receiving data, and a logical operation circuit 1206 for performing arithmetic processing on received data.
[0039] フィルタ IC601は、第 1の実施の形態で説明した輻射電磁ノイズを低減し、且つ 10 GHz〜5GHz程度あるいはそれ以上の外来磁界ノイズの影響を受けにく 、インダク タで構成されていることを特徴とする。本第 2の実施の形態では、フィルタ ICをリード 線のあるパッケージで示して!/、るが、 BGAゃフリップチップなどのパッケージでもよ!/ヽ 。ドライバ回路 602より伝送路 604に出力されたデータ信号は、伝送路 604において 表皮効果や誘電体損失の影響を受けて、立ち上がり Z立ち下がり特性の劣化した信 号波形となる。立ち上がり Z立ち下がり特性の劣化した信号波形は、フィルタ IC601 に入力されると、フィルタ IC601において伝送路 604における損失の影響を補償して 立ち上がり Z立ち下がり特性を改善した信号波形に整形される。整形した信号波形 を、フィルタ IC601より出力し、伝送路 604を介してレシーバ回路 603に伝送する。 第 1の実施の形態で説明したフィルタ回路を用!、たフィルタ IC601は、信号電流を伝 送した場合においても、電磁ノイズをほとんど輻射しないことから他の回路や装置に 対する影響が小さぐまた、隣接する回路や装置力 放射される磁界ノイズにより生じ る誘導電流の影響を低減できることから、フィルタ IC601にお 、て安定して伝送波形 の改善効果を得る。 The filter IC 601 is formed of an inductor that reduces the radiated electromagnetic noise described in the first embodiment and is not easily affected by an external magnetic field noise of about 10 GHz to 5 GHz or more. It is characterized by the following. In the second embodiment, the filter IC is It is shown in a package with a line! /, But it may be a package such as BGA ゃ flip chip! / ヽ. The data signal output from the driver circuit 602 to the transmission line 604 becomes a signal waveform in which the rise and fall characteristics are degraded due to the skin effect and the dielectric loss in the transmission line 604. When the signal waveform having the degraded rise-Z fall characteristic is input to the filter IC 601, the filter IC 601 shapes the signal waveform to improve the rise-Z fall characteristic by compensating for the influence of the loss in the transmission line 604. The shaped signal waveform is output from the filter IC 601 and transmitted to the receiver circuit 603 via the transmission path 604. Using the filter circuit described in the first embodiment, the filter IC 601 hardly radiates electromagnetic noise even when transmitting a signal current, so that the influence on other circuits and devices is small. In addition, since the influence of induced current caused by radiated magnetic field noise can be reduced in adjacent circuits and devices, the filter IC 601 can stably improve the transmission waveform.
[0040] 以上のように本発明に係るフィルタ回路 (具体的にはノ、ィパスフィルタ回路）をパッ ケージィ匕したフィルタ ICを用いて伝送システムを構成することにより、伝送システムか ら輻射される電磁ノイズをほとんど増加させず、且つ 10GHz〜5GHz程度あるいは それ以上の外部磁界ノイズによる影響を低減できることから、 10GHz〜lGHz程度 あるいはそれ以上の伝送信号を安定して伝送できる（動作する）伝送システムを構築 することが可能となる。  As described above, the transmission circuit is configured using the filter IC in which the filter circuit (specifically, the no-pass filter circuit) according to the present invention is packaged, so that the radiation is radiated from the transmission system. A transmission system that can stably transmit (operate) transmission signals of about 10 GHz to 1 GHz or more because it can hardly increase electromagnetic noise and reduce the effects of external magnetic field noise of about 10 GHz to 5 GHz or more. It can be built.
[0041] [第 3の実施の形態]  [Third Embodiment]
次に、本発明に係る、信号を論理演算処理する論理回路を搭載したダイ上に第 1 の実施の形態で説明したフィルタ回路を搭載し、ノ ッケージィ匕した論理 ICの第 3の実 施の形態について図 8を用いて説明する。本第 3の実施の形態の論理 ICは、伝送路 における損失を補償し伝送波形を整形するフィルタ回路 901と、信号を論理演算処 理する論理回路 902と、前記フィルタ回路 901と前記論理回路 902を搭載した (形成 した）ダイ 903と、前記ダイ 903を搭載してパッケージ化されたパッケージ 904と、ダイ 903とパッケージ 904を電気的に接続する例えばボンディングワイア 905とで構成さ れる。なお、同じダイ 903にフィルタ回路 901と論理回路 902とを作り込んで搭載する 必要がある。そのため、論理回路を製造するプロセスにフィルタ回路特有な製造プロ セス (容量や抵抗)を追加する必要がある。そして、フィルタ回路 901は、第 1の実施 の形態で説明した輻射電磁ノイズを低減し、且つ外来磁界ノイズの影響を受けにくい インダクタで構成されていることを特徴とする。外部回路より論理 ICに信号を伝送した 場合、伝送信号はボンディングワイア 905を介してフィルタ回路 901に到達する。フィ ルタ回路 901に到達した信号は、フィルタ回路 901により波形整形され、論理回路 9 02に伝送される。このとき、フィルタ回路 901においては信号電流を伝送した場合に おいても、電磁ノイズをほとんど輻射せず、また、たとえば論理回路 902などの隣接 する回路力 放射される磁界ノイズにより生じる誘導電流の影響を低減できる。 Next, according to the third embodiment of the logic IC of the present invention, in which the filter circuit described in the first embodiment is mounted on a die on which a logic circuit for performing a logical operation on a signal is mounted according to the present invention. The configuration will be described with reference to FIG. The logic IC according to the third embodiment includes a filter circuit 901 for compensating a loss in a transmission line and shaping a transmission waveform, a logic circuit 902 for performing a logical operation on a signal, the filter circuit 901 and the logic circuit 902. A die 903 mounted (formed), a package 904 mounted with the die 903 and packaged, and a bonding wire 905 for electrically connecting the die 903 and the package 904, for example. It is necessary to build and mount a filter circuit 901 and a logic circuit 902 on the same die 903. Therefore, the manufacturing process peculiar to the filter circuit is included in the process of manufacturing the logic circuit. Process (capacitance and resistance) needs to be added. The filter circuit 901 is characterized in that the filter circuit 901 is configured by an inductor that reduces the radiated electromagnetic noise described in the first embodiment and is not easily affected by external magnetic field noise. When a signal is transmitted from the external circuit to the logic IC, the transmission signal reaches the filter circuit 901 via the bonding wire 905. The signal that has reached the filter circuit 901 is shaped by the filter circuit 901 and transmitted to the logic circuit 902. At this time, even when a signal current is transmitted in the filter circuit 901, almost no electromagnetic noise is radiated, and, for example, an adjacent circuit such as the logic circuit 902 is affected by induced current caused by radiated magnetic field noise. Can be reduced.
[0042] 以上のように、ダイ上に本発明に係るフィルタ回路を形成することにより、フィルタ回 路において、比較的遠方の外来磁界ノイズのみならず、隣接した回路力 輻射され る磁界ノイズの影響を低減でき、且つフィルタ回路からの輻射電磁ノイズを低減でき ることから、データの欠落や論理演算処理時の誤りの発生を低減する論理 ICを形成 することが可能となる。 [0042] As described above, by forming the filter circuit according to the present invention on the die, the influence of not only the external magnetic field noise at a relatively distant place but also the adjacent circuit force and the radiated magnetic field noise on the filter circuit is obtained. Since it is possible to reduce noise and radiated electromagnetic noise from the filter circuit, it is possible to form a logic IC that reduces data loss and errors during logic operation processing.
[0043] また、本第 3の実施の形態では、ダイとパッケージをボンディングワイアにより電気的 に接続する方法を示したが、ダイとパッケージを電気的に接続する方法であれば、た とえば、ダイをフリップチップとして基板上に搭載しパッケージと接続する方法でも、 同様の効果を得ることが可能である。  Further, in the third embodiment, the method of electrically connecting the die and the package by the bonding wire has been described. However, if the method of electrically connecting the die and the package is, for example, A similar effect can be obtained by mounting a die as a flip chip on a substrate and connecting it to a package.
[0044] [第 4の実施の形態]  [Fourth Embodiment]
次に、本発明に係る、第 1の実施の形態で説明したフィルタ回路を搭載したダイと 論理回路を搭載したダイなどの複数のダイを同一のノ ッケージ内に混載したマルチ チップモジュールの第 4の実施の形態について図 9を用いて説明する。本第 4の実施 の形態のマルチチップモジュールは、第 1の実施の形態で説明した、伝送路におけ る損失を補償するフィルタ回路 (具体的にはハイパスフィルタ回路)を搭載したフィル タ回路ダイ 1001と、信号を論理演算処理する論理回路を搭載した論理回路ダイ 10 02と、前記フィルタ回路ダイ 1001と前記論理回路ダイ 1002を搭載するノ¾ /ケージ 1 003と、ダイ間あるいはダイとパッケージ間を電気的に接続する例えばボンディングヮ ィァ 1004で構成される。第 4の実施の形態において、第 3の実施の形態と相違する 点は、フィルタ回路を搭載するダイ 1001を論理回路を搭載したダイ 1002と別にした ことにある。そして、フィルタ回路ダイ 1001に搭載したフィルタ回路は、輻射電磁ノィ ズを低減し、且つ外来磁界ノイズの影響を受けにく 、インダクタで構成されて 、ること を特徴とする。このように、本発明に係るフィルタ回路を搭載したフィルタ回路ダイと論 理回路ダイを混載してマルチチップモジュールを構成することにより、フィルタ回路に おいて、比較的遠方の外来磁界ノイズのみならず、たとえば同一パッケージに搭載し た論理回路と ヽつた隣接した回路カゝら輻射される磁界ノイズの影響を低減でき、且つ フィルタ回路からの輻射電磁ノイズを低減できることから、データの欠落や論理演算 処理時の誤りの発生を低減するマルチチップモジュールを形成することが可能となる また、第 4の実施の形態の場合には、フィルタ回路と論理回路を異なるダイに搭載 することにより、論理回路を新たに作製することが不要となる場合が有り、このような場 合には、図 8に示した第 3の実施の形態の論理 ICに比べて製造コストを低減すること が可能となる。 Next, the fourth embodiment of the multi-chip module according to the present invention, in which a plurality of dies such as a die having the filter circuit described in the first embodiment and a die having a logic circuit mounted therein are mixed in the same knockout. The embodiment will be described with reference to FIG. The multi-chip module according to the fourth embodiment is a filter circuit die equipped with the filter circuit (specifically, a high-pass filter circuit) for compensating for the loss in the transmission line described in the first embodiment. 1001, a logic circuit die 1002 equipped with a logic circuit for performing a logical operation on a signal, a node / cage 1003 equipped with the filter circuit die 1001 and the logic circuit die 1002, and between dies or between dies and packages. For example, a bonding wire 1004 for electrically connecting the terminals is formed. The fourth embodiment differs from the third embodiment in that a die 1001 equipped with a filter circuit is separated from a die 1002 equipped with a logic circuit. There is. The filter circuit mounted on the filter circuit die 1001 is characterized by being configured with an inductor, which reduces radiated electromagnetic noise and is not easily affected by external magnetic field noise. As described above, by forming the multi-chip module by mixing the filter circuit die equipped with the filter circuit according to the present invention and the logical circuit die, not only the external magnetic field noise at a relatively distant place but also the filter circuit can be obtained. For example, since it is possible to reduce the effects of magnetic field noise radiated from adjacent circuit chips, such as a logic circuit mounted on the same package, and to reduce radiated electromagnetic noise from the filter circuit, data loss and logical operation processing It is possible to form a multi-chip module that reduces the occurrence of errors at the time. In the case of the fourth embodiment, the logic circuit is newly added by mounting the filter circuit and the logic circuit on different dies. In some cases, it may not be necessary to manufacture the IC in such a case. In such a case, the manufacturing cost is lower than that of the logic IC according to the third embodiment shown in FIG. It becomes possible to reduce the door.
[0045] また、本第 4の実施の形態では、ダイ間あるいはダイとパッケージ間をボンディング ワイアにより電気的に接続する方法を示したが、ダイ間あるいはダイとパッケージ間を 電気的に接続する方法であれば、たとえば、ダイをフリップチップとして基板上に搭 載しダイあるいはパッケージと接続する方法でも、同様の効果を得ることが可能であ る。  Further, in the fourth embodiment, a method of electrically connecting between dies or between a die and a package by a bonding wire has been described, but a method of electrically connecting between dies or between a die and a package is described. Then, for example, a similar effect can be obtained by a method in which the die is mounted on a substrate as a flip chip and connected to a die or a package.
[0046] 以上説明したように、第 3および第 4の実施の形態は、論理演算処理する論理回路 を有する論理 IC内に、第 1の実施の形態で説明したフィルタ回路 (具体的にはノ、ィパ スフィルタ回路）を備えたものである。  As described above, in the third and fourth embodiments, the filter circuit described in the first embodiment (specifically, no , A bypass filter circuit).
[0047] [第 5の実施の形態]  [Fifth Embodiment]
次に、本発明に係る、第 1の実施の形態で説明したフィルタ回路をパッケージィ匕し たフィルタチップをバックプレーンコネクタに搭載したフィルタ搭載型コネクタの第 5の 実施の形態について図 10を用いて説明する。本第 5の実施の形態のフィルタ搭載型 コネクタは、二つの基板を電気的に接続するバックプレーンコネクタ 1101と、第 1の 実施の形態で説明した伝送路における損失を補償するためのフィルタ回路 (具体的 にはハイパスフィルタ回路）を搭載しており、バックプレーンコネクタ 1101内の伝送路 に接続したフィルタチップ 1102とで構成される。外部回路から出力され基板（図示せ ず）を介してマザ一ボード側ピン 1103ある!/、はドータボード側ピン 1104に到達した 1 OGHz〜lGHz程度あるいはそれ以上の伝送信号は、フィルタチップ 1102に伝送さ れ、フィルタチップ 1102において伝送路の損失を補償し、伝送波形を整形される。 整形された伝送信号は、ドータボード側ピン 1104ある 、はマザ一ボード側ピン 1103 を介して他の外部回路（図示せず）に出力される。このとき、本発明に係るフィルタ回 路を搭載したフィルタチップ 1102は、信号電流を伝送した場合においても、電磁ノィ ズをほとんど輻射しないことから他の回路や装置に対する影響が小さぐまた、隣接 する回路や装置から放射される磁界ノイズにより生じる誘導電流の影響を低減できる ことから、安定して伝送波形の改善効果を得ることが可能となる。 Next, referring to FIG. 10, a fifth embodiment of a filter-mounted connector according to the present invention, in which a filter chip obtained by packaging the filter circuit described in the first embodiment and mounted on a backplane connector, will be described. Will be explained. The filter-mounted connector according to the fifth embodiment includes a backplane connector 1101 for electrically connecting two substrates, and a filter circuit for compensating for the loss in the transmission line described in the first embodiment ( Specifically, it is equipped with a high-pass filter circuit) and a filter chip 1102 connected to a transmission line in the backplane connector 1101. Board output from external circuit (shown ), The transmission signal of about 1 OGHz to lGHz or more reaching the daughter board pin 1104 is transmitted to the filter chip 1102, and the transmission path in the filter chip 1102 is transmitted. The transmission waveform is shaped by compensating for the loss. The shaped transmission signal is output to another external circuit (not shown) via the daughter board pin 1104 or the mother board pin 1103. At this time, even when a signal current is transmitted, the filter chip 1102 equipped with the filter circuit according to the present invention hardly radiates electromagnetic noise, so that the influence on other circuits and devices is small and the filter chip 1102 Since the influence of the induced current generated by the magnetic field noise radiated from the circuit or the device can be reduced, it is possible to stably improve the transmission waveform.
[0048] 本第 5の実施の形態では、フィルタチップ 1102をバックプレーンコネクタ 1101に適 用した実施の形態を示したが、たとえば、基板や装置間を接続するケーブルの端部 に用いられるコネクタに適用してもよ 、。  In the fifth embodiment, the embodiment in which the filter chip 1102 is applied to the backplane connector 1101 has been described. However, for example, a connector used at the end of a cable for connecting a board or an apparatus may be used. You may apply.
[0049] 以上のように本発明に係るフィルタ回路を用いてフィルタ搭載型コネクタを構成する ことにより、コネクタ力 輻射される電磁ノイズをほとんど増加させず、且つ外部磁界ノ ィズによる影響を低減できることから、安定して動作するフィルタ搭載型コネクタを作 製することができ、また、フィルタ回路を IC内あるいは基板上に実装することが不要と なるため、 ICあるいは基板を小型化することが可能となる。  As described above, by configuring the filter-mounted connector using the filter circuit according to the present invention, the electromagnetic noise radiated from the connector can be hardly increased, and the effect of the external magnetic field noise can be reduced. As a result, it is possible to manufacture a filter-mounted connector that operates stably, and it is not necessary to mount the filter circuit inside the IC or on the board, so that the IC or board can be miniaturized. Become.
[0050] [第 6の実施の形態]  [Sixth Embodiment]
次に、本発明に係る、第 1の実施の形態で説明したフィルタ回路を用いた高速信号 を送受信する装置の第 6の実施の形態につ 、て図 11を用いて説明する。図 11は、 光ファイバで送られた伝送信号の転送経路をスイッチングする伝送装置 (伝送システ ム）を示しており、 10GHz〜lGHz程度あるいはそれ以上の伝送信号を光一電気信 号変換する複数の光モジュール 702と、光信号を伝送する複数の光ファイバ 701と、 伝送信号の転送経路を決定する複数のスィッチ IC705と、上記複数の光モジュール 702と上記スィッチ IC705を実装した複数のスィッチボード 703と、複数のスィッチボ ード 703間に信号を伝送するためのバックボード 704と、複数のスィッチボード 703 の各々とバックボード 704を電気的に接続する複数のバックプレーンコネクタ 706と で構成される。即ち、伝送装置 (伝送システム）は、光ファイバ 701を接続した複数の 光モジュール 702と光モジュール 702からの 10GHz〜lGHz程度あるいはそれ以 上の伝送信号の転送経路を切り換えるスィッチ IC705とを実装したスィッチボード 70 3の複数（多数）をブレード状にバックボード 704にバックブレーンコネクタ 706で接続 実装して構成される。 Next, a sixth embodiment of a device for transmitting and receiving high-speed signals using the filter circuit described in the first embodiment according to the present invention will be described with reference to FIG. Fig. 11 shows a transmission device (transmission system) that switches the transmission path of a transmission signal transmitted by an optical fiber, and a plurality of optical signals that convert a transmission signal of about 10 GHz to 1 GHz or more into an optical-electrical signal. A module 702, a plurality of optical fibers 701 for transmitting an optical signal, a plurality of switch ICs 705 for determining a transfer path of the transmission signal, a plurality of switch boards 703 on which the plurality of optical modules 702 and the switch IC 705 are mounted, It comprises a backboard 704 for transmitting signals between the plurality of switchboards 703, and a plurality of backplane connectors 706 for electrically connecting each of the plurality of switchboards 703 to the backboard 704. That is, the transmission device (transmission system) includes a plurality of optical fibers 701 connected. A plurality (many) of switch boards 703 mounted with an optical module 702 and a switch IC 705 for switching a transfer path of a transmission signal from the optical module 702 to a frequency of about 10 GHz to 1 GHz or more are formed on the back board 704 in the form of a blade. Connected with connector 706.
[0051] そして、本発明に係るフィルタ回路を、光モジュール 702やスィッチ IC705またはバ ックプレーンコネクタ 706に適用する。なお、光モジュール 702やスィッチ IC705には 、図 7に示すように、ドライバ回路 602およびレシーバ回路 603が入って構成されて いるため、これらのドライバ回路 602とレシーバ回路 603との間にフィルタ回路（フィル タ IC) 601を設けることは可能である。また、ノ ックプレーンコネクタ 706にも、図 10に 示す第 5の実施の形態と同様に、フィルタチップ 1102を挿入することが可能である。  Then, the filter circuit according to the present invention is applied to the optical module 702, the switch IC 705, or the backplane connector 706. Since the optical module 702 and the switch IC 705 include a driver circuit 602 and a receiver circuit 603 as shown in FIG. 7, a filter circuit (a circuit) is provided between the driver circuit 602 and the receiver circuit 603. It is possible to provide a filter IC) 601. Further, the filter chip 1102 can be inserted into the knock plane connector 706 as in the fifth embodiment shown in FIG.
[0052] この伝送装置では、光ファイバ 701より受信した光信号は、この光ファイバ 701が接 続された光モジュール 702により 10GHz〜lGHz程度あるいはそれ以上の電気信 号に変換される。さらにこの変換された電気信号は光モジュール 702からスィッチ IC 705に伝送され、スィッチ IC705において電気信号の転送経路が決定される。このと き、決定した転送経路に応じて、電気信号はスィッチボード 703上の他方の光モジュ ール 702あるいはバックボード 704を介して他のスィッチボード 703上にある光モジュ ール 702に転送される。転送された電気信号を、光モジュール 702にて電気信号か ら光信号に変換し、この光モジュール 702に接続されて 、る光ファイバ 701にて他の 伝送装置へと光信号を送信する。  In this transmission device, the optical signal received from the optical fiber 701 is converted into an electric signal of about 10 GHz to 1 GHz or more by the optical module 702 to which the optical fiber 701 is connected. Further, the converted electric signal is transmitted from the optical module 702 to the switch IC 705, and the transfer path of the electric signal is determined in the switch IC 705. At this time, depending on the determined transfer path, the electric signal is transferred to the other optical module 702 on the switch board 703 or to the optical module 702 on the other switch board 703 via the back board 704. You. The transferred electric signal is converted from the electric signal into an optical signal by the optical module 702, and connected to the optical module 702, and the optical signal is transmitted to another transmission device by the optical fiber 701.
[0053] 以上説明したように本発明に係るフィルタ回路を適用した光モジュール、スィッチ IC 、コネクタを用いて伝送装置を構成することにより、外来磁界ノイズの影響を小さくし てデータの欠落や伝送装置の誤作動の発生を低減し、且つ装置より輻射される電磁 ノイズを低減することが可能となる。なお、このような伝送装置の具体例としては、これ に限定されるものではないが、たとえば、スィッチボード、ルータ、サーバ、コンビユー タおよびコンピュータの周辺機器などが挙げられる。  As described above, by configuring the transmission device using the optical module, the switch IC, and the connector to which the filter circuit according to the present invention is applied, the influence of extraneous magnetic field noise is reduced, and the data loss or the transmission device is reduced. It is possible to reduce the occurrence of erroneous operations and to reduce electromagnetic noise radiated from the device. Specific examples of such a transmission device include, but are not limited to, a switch board, a router, a server, a computer, and peripheral devices of a computer.
産業上の利用可能性  Industrial applicability
[0054] 本発明によれば、隣接した回路力 発生した外来磁界ノイズによって生じる誘導電 流を低減し、また、インダクタカゝら輻射される電磁ノイズを抑制し、且つ ICや伝送装置 のコストの増加を解消するフィルタ回路及び該フィルタ回路を備えた ICや伝送装置を 提供することが可能となる。 According to the present invention, the induced current generated by the external magnetic field noise generated by the adjacent circuit power is reduced, the electromagnetic noise radiated from the inductor cap is suppressed, and the IC and the transmission device are reduced. It is possible to provide a filter circuit that eliminates the cost increase, and an IC and a transmission device including the filter circuit.
図面の簡単な説明 Brief Description of Drawings
[図 1]図 1は、本発明の第 1の実施の形態に係るフィルタ回路の実施例 1を示す概略 構成図及び回路図である。 FIG. 1 is a schematic configuration diagram and a circuit diagram showing Example 1 of a filter circuit according to a first embodiment of the present invention.
[図 2]図 2は、インダクタを構成する巻き線に生じる誘導電流量と、巻き線より輻射され る磁界強度を示す図である。  FIG. 2 is a diagram showing an amount of induced current generated in a winding constituting an inductor and a magnetic field intensity radiated from the winding.
[図 3]図 3は、本発明の第 1の実施の形態に係るフィルタ回路の実施例 2を示す概略 構成図である。  FIG. 3 is a schematic configuration diagram showing Example 2 of the filter circuit according to the first embodiment of the present invention.
[図 4]図 4は、本発明に係るフィルタ回路に用いられる、伝送路の長さをより短くするこ とを可能とするインダクタの構成を示す概略図である。  FIG. 4 is a schematic diagram showing a configuration of an inductor used in the filter circuit according to the present invention and capable of further shortening the length of a transmission line.
[図 5]図 5は、本発明に係るフィルタ回路に用いられる、 4つの巻き線にてインダクタを 構成した場合を示す概略図である。  FIG. 5 is a schematic diagram showing a case where an inductor is configured by four windings, which is used in a filter circuit according to the present invention.
[図 6]図 6は、本発明の第 1の実施の形態に係るフィルタ回路の個別部品のチップコ ィル、チップキャパシタ、チップ抵抗で構成した実施例 3を示す概略構成図である。  FIG. 6 is a schematic configuration diagram showing Example 3 of the filter circuit according to the first embodiment of the present invention, which is configured by a chip coil, a chip capacitor, and a chip resistor of individual components.
[図 7]図 7は、本発明に係る第 2の実施の形態である、フィルタ回路を ICパッケージィ匕 したフィルタ ICを適用した伝送システムを示す図である。 FIG. 7 is a diagram showing a transmission system according to a second embodiment of the present invention to which a filter IC in which a filter circuit is IC packaged is applied.
[図 8]図 8は、本発明に係る第 3の実施の形態である、信号を論理演算処理する論理 回路を搭載したダイ上にフィルタ回路を搭載しパッケージ化した論理 ICを示す斜視 図である。  FIG. 8 is a perspective view showing a logic IC according to a third embodiment of the present invention, in which a filter circuit is mounted and packaged on a die on which a logic circuit for performing a logical operation on a signal is mounted. is there.
[図 9]図 9は、本発明に係る第 4の実施の形態である、フィルタ回路を搭載したダイと 論理回路を搭載したダイなどの複数のダイを同一のノ ッケージ内に混載したマルチ チップモジュールを示す斜視図である。  FIG. 9 is a multi-chip according to a fourth embodiment of the present invention, in which a plurality of dies such as a die equipped with a filter circuit and a die equipped with a logic circuit are mixed in the same knockout. It is a perspective view which shows a module.
[図 10]図 10は、本発明に係る第 5の実施の形態である、フィルタ回路をパッケージィ匕 したフィルタチップをバックプレーンコネクタに搭載したフィルタ搭載型コネクタを示す 斜視図である。  FIG. 10 is a perspective view showing a filter-mounted connector according to a fifth embodiment of the present invention, in which a filter chip in which a filter circuit is packaged is mounted on a backplane connector.
[図 11]図 11は、本発明に係る第 6の実施の形態である、フィルタ回路を用いた高速 信号を送受信する伝送装置を示す斜視図である。 [図 12]図 12は、本発明に係る伝送装置 (伝送システム）に用いられるドライバ回路お よびレシーバ回路の一実施例を示す構成図である。 FIG. 11 is a perspective view showing a transmission apparatus for transmitting and receiving high-speed signals using a filter circuit according to a sixth embodiment of the present invention. FIG. 12 is a configuration diagram showing one embodiment of a driver circuit and a receiver circuit used in the transmission device (transmission system) according to the present invention.

Claims

請求の範囲 The scope of the claims
[1] インダクタ、容量素子及び抵抗素子の受動素子で形成されるフィルタ回路であって 前記インダクタは、同一平面の鉛直方向に中心軸を持ち且つそれぞれの中心軸の 位置の異なる少なくとも 2つの巻き線で構成し、前記少なくとも 2つの巻き線力 それ ぞれに流れる信号電流が反対の回転方向の渦を卷くように形成し、且つ外来磁界ノ ィズにより生じる誘導電流が逆方向に流れるように接続して構成されることを特徴とす るフィルタ回路。  [1] A filter circuit formed by passive elements of an inductor, a capacitive element, and a resistive element, wherein the inductor has a central axis in a vertical direction on the same plane, and at least two windings having different central axis positions. The signal current flowing through each of the at least two winding forces is formed so as to wind in a vortex in the opposite rotational direction, and the induced current generated by the external magnetic field noise flows in the opposite direction. A filter circuit characterized by being connected and configured.
[2] 請求項 1記載のフィルタ回路において、前記少なくとも 2つの巻き線の中心部に磁 性体を有することを特徴とするフィルタ回路。  2. The filter circuit according to claim 1, wherein a magnetic body is provided at a center of the at least two windings.
[3] インダクタ、容量素子及び抵抗素子の受動素子で形成されるフィルタ回路であって 前記インダクタは、第 1巻き線と、該第 1巻き線の鉛直方向に位置し、一端を前記第 1巻き線に接続した第 2巻き線と、前記第 1巻き線と同一平面上に位置し、第 1巻き線 と異なる位置に中心軸を持ち、一端を前記第 2巻き線に接続した第 3巻き線と、前記 第 3巻き線の鉛直方向に位置し、一端を前記第 3巻き線に接続した第 4巻き線とで構 成し、前記第 1巻き線と前記第 2巻き線は、それぞれに流れる信号電流が同じ回転方 向の渦を卷くように形成し、前記第 3巻き線と前記第 4巻き線は、それぞれに流れる 信号電流が前記第 1巻き線あるいは前記第 2巻き線に流れる信号電流とは反対の回 転方向の渦を卷くように形成し、外来磁界ノイズにより、前記第 1巻き線と前記第 2卷 き線に生じる誘導電流と、前記第 3巻き線と前記第 4巻き線に生じる誘導電流が逆方 向に流れるように前記第 2巻き線と前記第 3巻き線を接続して構成されることを特徴と するフィルタ回路。 [3] A filter circuit formed by a passive element of an inductor, a capacitive element, and a resistive element, wherein the inductor is located in a vertical direction of the first winding and one end of the first winding. A second winding connected to the second winding and a third winding positioned on the same plane as the first winding, having a center axis at a position different from the first winding, and having one end connected to the second winding. And a fourth winding, which is located in the vertical direction of the third winding and has one end connected to the third winding, wherein the first winding and the second winding flow respectively. A signal current is formed so as to form a vortex in the same rotational direction, and the third winding and the fourth winding are formed by a signal current flowing through each of the first winding and the second winding. It is formed so as to form a vortex in the direction of rotation opposite to the current. And the second winding and the third winding are connected such that the induced current generated in the second winding and the induced current generated in the third winding and the fourth winding flow in opposite directions. A filter circuit characterized by being configured by:
[4] 個別部品のチップコイル、チップコンデンサ及びチップ抵抗を用いて形成したフィ ノレタ回路であって、  [4] A finalizer circuit formed using chip coils, chip capacitors, and chip resistors of individual components,
前記チップコイルは、同一平面の鉛直方向に中心軸を持ち、且つ中心軸の位置の 異なる少なくとも 2つの巻き線で形成され、前記少なくとも 2つの巻き線はそれぞれに 流れる信号電流が互いに反対の回転方向の渦を卷くように形成し、且つ外来磁界ノ ィズによりそれぞれの巻き線に生じる誘導電流が逆方向に流れるように接続して構成 されることを特徴とするフィルタ回路。 The chip coil has a central axis in a vertical direction on the same plane, and is formed of at least two windings having different positions of the central axis, and the at least two windings have signal currents flowing through the respective winding directions opposite to each other. Of the external magnetic field A filter circuit characterized by being connected in such a manner that induced currents generated in respective windings due to noise flow in opposite directions.
[5] ドライバ回路とレシーバ回路とを伝送路で接続して構成される伝送システムであつ て、 [5] A transmission system configured by connecting a driver circuit and a receiver circuit via a transmission line,
前記伝送路に、請求項 1に記載のフィルタ回路をハイノスフィルタ回路として備えた ことを特徴とする伝送システム。  2. A transmission system comprising the filter circuit according to claim 1 as a Hinos filter circuit in the transmission line.
[6] ドライバ回路とレシーバ回路とを伝送路で接続して構成される伝送システムであつ て、 [6] A transmission system configured by connecting a driver circuit and a receiver circuit via a transmission line,
前記伝送路に、請求項 1に記載のフィルタ回路を前記伝送路における波形劣化を 補償するハイパスフィルタ回路としてパッケージィ匕したフィルタ ICで備えたことを特徴 とする伝送システム。  2. A transmission system, comprising: a filter IC packaged with the filter circuit according to claim 1 as a high-pass filter circuit for compensating for waveform deterioration in the transmission line.
[7] 論理演算処理する論理回路を有する論理 IC内に、請求項 1に記載のフィルタ回路 を備えたことを特徴とする論理 IC。  [7] A logic IC having the filter circuit according to claim 1 in a logic IC having a logic circuit for performing a logical operation process.
[8] 請求項 1に記載のフィルタ回路を搭載したダイと論理回路を搭載したダイとをパッケ ージ内に混載実装したことを特徴とするマルチチップモジュール。 [8] A multichip module, wherein a die on which the filter circuit according to claim 1 is mounted and a die on which a logic circuit is mounted are mixedly mounted in a package.
[9] 伝送路間を接続するコネクタであって、請求項 1に記載のフィルタ回路をチップ化し たフィルタチップを内包することを特徴とするフィルタ搭載型コネクタ。 [9] A connector for mounting a filter, which is a connector for connecting between transmission paths, and includes a filter chip in which the filter circuit according to claim 1 is chipped.
[10] 光ファイバを接続した光モジュールカゝら得られる伝送信号の転送経路をスィッチ IC で決定して伝送する伝送装置であって、 [10] A transmission device for determining a transmission path of a transmission signal obtained from an optical module connected to an optical fiber by a switch IC and transmitting the transmission signal,
前記光モジュールまたは前記スィッチ IC内の伝送路に、請求項 1に記載のフィルタ 回路をハイパスフィルタ回路として備えたことを特徴とする伝送装置。  2. A transmission device comprising the filter circuit according to claim 1 as a high-pass filter circuit in a transmission line in the optical module or the switch IC.
[11] 光ファイバを接続した光モジュールと該光モジュール力 得られる伝送信号の転送 経路を決定するスィッチ ICとを実装したスィッチボードの複数を、伝送路を形成した ノ ックボードにバックプレーンコネクタで電気的に接続して構成される伝送装置であ つて、 [11] A plurality of switch boards, each mounting an optical module connected to an optical fiber and a switch IC for determining a transfer path of a transmission signal obtained by the optical module, are electrically connected to a knock board on which a transmission path is formed by a backplane connector. Transmission device
前記光モジュールまたは前記スィッチ ICまたは前記バックプレーンコネクタ内の伝 送路に、請求項 1に記載のフィルタ回路をハイパスフィルタ回路として備えたことを特 徴とする伝送装置。  2. A transmission device comprising the filter circuit according to claim 1 as a high-pass filter circuit in a transmission path in the optical module, the switch IC, or the backplane connector.
PCT/JP2005/009623 2004-05-26 2005-05-26 Filter circuit, logic ic, multi-chip module, filter-equipped connector, transmitting apparatus and transmitting system WO2005117255A1 (en)

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