WO2005104220A1 - ワークの枚葉処理システムにおけるクリーントンネル - Google Patents
ワークの枚葉処理システムにおけるクリーントンネル Download PDFInfo
- Publication number
- WO2005104220A1 WO2005104220A1 PCT/JP2004/004489 JP2004004489W WO2005104220A1 WO 2005104220 A1 WO2005104220 A1 WO 2005104220A1 JP 2004004489 W JP2004004489 W JP 2004004489W WO 2005104220 A1 WO2005104220 A1 WO 2005104220A1
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- WO
- WIPO (PCT)
- Prior art keywords
- area
- clean
- region
- efem
- tunnel
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Definitions
- the present invention uses a conventional FOUP (closed box) for supplying and recovering wafers to and from a manufacturing apparatus using a cassette containing 25 sheets.
- Clean tunnel document that forms part of a single wafer processing system that has been changed to single wafer processing
- PCT / JP02Z05939 provides a system that links manufacturing equipment by a single unit by continuously transferring wafers and other workpieces (workpieces) in a very small clean area. ing.
- production efficiency can be increased by using single wafers for wafer transport in response to the increase in the size of semiconductor wafers. Thoroughly clean lean tunnels.
- an object of the present invention is to provide a clean tunnel that takes measures to prevent the clean tunnel from being contaminated by gas, particles, or the like from a manufacturing apparatus or the like in a single-wafer processing system. Disclosure of the invention
- the present invention includes a clean room area, and an area partitioned from the clean room area and divided into a clean tunnel area, an EFEM area, and a manufacturing apparatus area.
- the clean tunnel region is adjacent to the EFEM region
- the EFEM region is adjacent to the manufacturing device region
- the EFEM region is set to a lower pressure than the manufacturing device region and the clean tunnel region.
- a air curtain for preventing gas, particles, and the like flowing from the manufacturing apparatus area into the EFEM area from contaminating the clean tunnel area.
- a tunnel for preventing gas, particles, and the like flowing from the manufacturing apparatus area into the EFEM area from contaminating the clean tunnel area.
- the air curtain is a clean tunnel characterized by being formed by a cassette type fan device.
- the fan device is provided with a guide portion for guiding air toward the HEPA filter installed between the clean room region and the clean tunnel region or the EFEM region. It is a clean tunnel featuring this feature.
- the filter also serves as an air curtain filter
- the clean tunnel is characterized by this.
- the present invention discloses a configuration example of a work piece processing system as a representative of a semiconductor manufacturing process
- the present invention can also be applied to a liquid crystal device manufacturing process as described above.
- the work according to the present invention is not limited to a semiconductor wafer, but also includes a display substrate, a magnetic hard disk, and the like.
- FIG. 1 is a plan view showing the schematic configuration of a single-wafer processing system
- Fig. 2 is a front view of the system
- Fig. 3 is a detailed cross-sectional view of a roller-type single-wafer conveyor and a robot constituting the system
- Fig. 4 is a detailed plan view of the single-wafer conveyor and robot
- Fig. 5 is a front cross-sectional view of the main part of the system
- Fig. 6 is a plan view of the main part of the system
- Fig. 7 is used for the system.
- FIG. 3 is a diagram illustrating a configuration example of a filter unit to be used.
- the workpiece single-wafer processing system uses a FOUP or a cassette (hereinafter referred to as FOUP, which is conveyed by the inter-process conveying means, and is denoted by 1). )
- FOUP a cassette
- F ⁇ UP 1 F ⁇ UP 1
- the wafer 2 in the FOUP 1 can be made into a single wafer by the lopot 40.
- a buffer station 41 for temporarily storing the actual empty FOUP is incorporated into the FOUP 1, and the buffer station 41 is connected to the small patch transporter 8.
- the EFEM 6 has a wafer transfer lo-port 60, a par code and alphanumeric reading device 61 (not shown), a buffer set for automatic operation 62, and a FOUP 63 for manual operation. ⁇ ⁇ A FOUP opener 64 (not shown) is provided, and the clean area is connected by a clean tunnel 7 (shaded area in Fig. 1).
- the clean tunnel 7 only needs to be able to form the minimum necessary space in which the single wafer conveyor 3 can transfer the single wafer 2.
- the inside of the clean tunnel 7 is kept extremely clean, and the atmosphere outside the tunnel, that is, the atmosphere in the worker area (clean room area) is almost completely shut off.
- the single-wafer conveyor 3 has a loop shape and is of a continuous running type driven by a conveyor belt.
- the single-wafer conveyor body 3 is driven so that dust generated by the driving does not affect the cleanness in the clean tunnel 7.
- the lower part of 6 is connected to the exhaust duct via the exhaust fan and the air filter 37.
- the single-wafer conveyor 3 includes a drive roller 30a and a drive roller 30a inside a conveyor body 36. Driven. It may be provided with a let 30b and a lift-type stopper 30c for stopping the knurl 30b at a predetermined position.
- a fan 33 on which the wafer 2 is mounted is fixed to the pallet 30b at regular intervals, and a base end of the fan 33 is formed on a top surface of the conveyor body 36. Can move along gap 3 6a It has become.
- a holder 33 a for minimizing contact with the wafer 2 is attached to the finger 33, and only the outer peripheral edge of the wafer 2 is held.
- the robot node 60 b of the robot 60 has a holding portion 60 a for holding only the outer peripheral edge of the wafer 2, and the mouth port 60 is connected to the wafer conveyor 3 via the wafer 3. 2 is scooped and transferred between the manufacturing equipment 50-54, the knocker cassette 62, and the FOUP 63.
- a device that forms layers such as wiring and insulating films on a wafer a device that applies a resist, exposes and develops to form a resist pattern on the wafer, and a wafer It consists of a device that etches unnecessary parts of the wafer, a device that implants ions into the wafer, a device that removes the resist, a cleaning device between each process, an inspection device, etc. Are connected.
- the semiconductor manufacturing apparatuses 50 to 54 are in the respective manufacturing apparatus areas 5A, and the EFEMs 6 are in the respective EFEMs.
- the clean tunnel 7 is provided in the clean tunnel area 7A.
- the area 5A, the areas 6A and 7A are each substantially closed, and are also substantially closed with respect to the clean room area C.
- the manufacturing apparatus area 5A is adjacent to the EFEM area 6A, and an opening 9A for transferring the wafer 2 is formed between the two areas.
- the opening 9A is located on the manufacturing apparatus area 5A side of the opening 9A. Is a load lock 5 OA C Delivery port is provided.
- the EFEM area 6A is adjacent to the manufacturing apparatus area 5A and adjacent to the clean room area C, and an air cleaning section F1 is formed between the two areas 6A and C.
- the air purifying section F 1 is provided with a sealing material F 10 defining the EFEM area 6 A from the clean room area C, and is attached to the sealing material F 10 and has a A fan unit F11 for taking in air, a HEPA filter F12 for purifying the air taken in by this fan unit F11, and a fan unit F13 for forming an air curtain installed as necessary Consists of
- the HEPA filter F12 forms the upper part of the EFE region 6A, and a chemical filter corresponding to, for example, an acid, a dry etch, a CVD, or a diffusion organic gas at the time of etching can be provided.
- the fan device F13 accommodates a fan and its driving unit, and forms an air intake F130a and an air discharge port (not shown).
- Body F13 a guide F131, which guides the air from the air discharge port downward, and a flange formed between the guide F131, and the body F130. It consists of a part F 1 32.
- Such a fan device F13 is provided on the peripheral surface of the hole F100 of the sealing material F10, which is cut out to a size in which the guide portion F131 can be placed. 32 is locked, and it is arranged detachably.
- the height of the guide portion F131 which is formed in a cylindrical shape, is provided such that the front end opening F1311a is substantially in contact with the HEPA filter F12.
- an air curtain guide F 1 33 is provided below the tip opening F 13 1 a with the HEPA filter F 12 interposed therebetween, as shown in FIG.
- the air that has been installed and has been cleaned through the HEPA filter F12 from the tip opening F13a forms an air curtain F1334 for the opening 9A.
- the fan device F13 for forming the air curtain F134 is installed as necessary as described above, for the following reason.
- Some of the manufacturing apparatuses 50 to 54 generate substances that are harmful to the production, and some of them do not. It is not necessary to apply an air curtain to the production apparatuses that do not generate such substances. Keep the lid on.
- the arrangement of the manufacturing apparatus may be changed or the model may be changed. If it becomes necessary to apply an air curtain, the lid of the hole F100 is removed, and the fan device F is removed. Just set 1 and 3. Therefore, the fan unit F13 may be set as needed in accordance with the manufacturing apparatus to be installed, so that the system is highly economical, has a high flexibility, and can be manufactured in a short time. Can be changed.
- the tip opening F13a of the guide F13 of the fan device F13 comes into contact with the HEPA filter F12 so that the fan device F13 moves the fan device F13 inside the EFEM. Installation is easier than if it is installed inside.
- the drive source of the air purifying section F1 is provided outside the EFEM area 6A, maintenance of the drive source such as a motor can be performed from outside the EFEM area 6A, and the maintenance of the drive source can be performed. In this case, particles can be avoided. Further, the installation space and arrangement of the fan finette unit (FFU) in the EFEM area 6A are not required, and the possibility of dust generation from the FFU can be reduced to zero. Since the HEPA filter F12 also serves as a filter for the air curtain F133 or F134, it does not need to touch the HEPA filter 12 according to the model change of manufacturing equipment. The installation and removal of the air curtain can be performed quickly and freely.
- the fan device F13 has a guide portion F131, which is formed as shown in FIG. 7 (B). However, as shown in FIG. 7 (B), a tubular portion F13 corresponding to the guide portion F131 is formed. 1 3 6. may be installed in the air purification section F 1.
- the clean tunnel region 7A is adjacent to the EFEM region 6A, and an opening 9B for transferring the wafer 2 is formed between the two regions 7A and 6A.
- the region 7A is adjacent to the tarn room region C, and an air cleaning portion F2 is formed between both regions 7A and C.
- the air purifying section F 2 is formed substantially in the same manner as the air purifying section F 1, and includes a sealing member F 20, a fan device F 21 attached to the sealing member F 20, and a fan device F 2 1 HEPA filter F22 for purifying the air taken in by the system, and fan unit F23 for forming the air curtain, which is installed as necessary.
- the air curtain is located in the clean tunnel area 7A. Guides F1 3 3 are installed, and An air curtain F 1 34 is formed.
- the air purifying unit F2 has substantially the same operation and effect as the air purifying unit F1.
- the pressure P e of the EFEM area 6 A is set to a value lower than that of the manufacturing equipment area 5 A and the clean tunnel area 7 A, and the pressure P r of the clean room area C is Set to a value lower than EF EM area 6 A.
- the air moves from the clean tunnel region toward the EF EM region 6A due to the setting of the atmospheric pressure, and moves from the EF EM region 6A to the clean tunnel region 7A. Does not occur.
- the clean room air of about class 1,000 to 10,000,000 has a class 1 air pressure. It is also possible to prevent intrusion into the EF EM region 6A.
- the configuration example is disclosed by representing the present invention as a semiconductor manufacturing process, but the present invention can be applied to other work manufacturing processes, for example, a liquid crystal manufacturing process. Applicable to the 6th generation (1500 mm Xl 800 mm), which has a larger substrate size, and the 7th generation (1800 mm X 200 mm) above it .
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Ventilation (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/004489 WO2005104220A1 (ja) | 2004-03-30 | 2004-03-30 | ワークの枚葉処理システムにおけるクリーントンネル |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/004489 WO2005104220A1 (ja) | 2004-03-30 | 2004-03-30 | ワークの枚葉処理システムにおけるクリーントンネル |
Publications (1)
Publication Number | Publication Date |
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WO2005104220A1 true WO2005104220A1 (ja) | 2005-11-03 |
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PCT/JP2004/004489 WO2005104220A1 (ja) | 2004-03-30 | 2004-03-30 | ワークの枚葉処理システムにおけるクリーントンネル |
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WO (1) | WO2005104220A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2909882A1 (fr) * | 2006-12-14 | 2008-06-20 | Eurofeedback Soc Par Actions S | Dispositif de decontamination de produit sous forme pulverulente comportant une lampe flash |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09260226A (ja) * | 1996-03-21 | 1997-10-03 | Hitachi Ltd | 半導体製造システム |
JPH10163289A (ja) * | 1996-11-29 | 1998-06-19 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2002243233A (ja) * | 2001-02-14 | 2002-08-28 | Rorze Corp | 空気清浄化装置 |
JP2003314873A (ja) * | 2002-04-23 | 2003-11-06 | Kondo Kogyo Kk | 清浄空気供給装置および該装置におけるフィルターの交換方法 |
-
2004
- 2004-03-30 WO PCT/JP2004/004489 patent/WO2005104220A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09260226A (ja) * | 1996-03-21 | 1997-10-03 | Hitachi Ltd | 半導体製造システム |
JPH10163289A (ja) * | 1996-11-29 | 1998-06-19 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2002243233A (ja) * | 2001-02-14 | 2002-08-28 | Rorze Corp | 空気清浄化装置 |
JP2003314873A (ja) * | 2002-04-23 | 2003-11-06 | Kondo Kogyo Kk | 清浄空気供給装置および該装置におけるフィルターの交換方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2909882A1 (fr) * | 2006-12-14 | 2008-06-20 | Eurofeedback Soc Par Actions S | Dispositif de decontamination de produit sous forme pulverulente comportant une lampe flash |
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