WO2005100016A3 - Light-emitting panel and optically effective foil - Google Patents

Light-emitting panel and optically effective foil Download PDF

Info

Publication number
WO2005100016A3
WO2005100016A3 PCT/CH2005/000209 CH2005000209W WO2005100016A3 WO 2005100016 A3 WO2005100016 A3 WO 2005100016A3 CH 2005000209 W CH2005000209 W CH 2005000209W WO 2005100016 A3 WO2005100016 A3 WO 2005100016A3
Authority
WO
WIPO (PCT)
Prior art keywords
laminated structure
layers
foil
light
refraction index
Prior art date
Application number
PCT/CH2005/000209
Other languages
German (de)
French (fr)
Other versions
WO2005100016A2 (en
Inventor
Gerhard Staufert
Original Assignee
Lucea Ag
Gerhard Staufert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucea Ag, Gerhard Staufert filed Critical Lucea Ag
Priority to EP05729363A priority Critical patent/EP1735149A2/en
Publication of WO2005100016A2 publication Critical patent/WO2005100016A2/en
Publication of WO2005100016A3 publication Critical patent/WO2005100016A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/422—Luminescent, fluorescent, phosphorescent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

A light-emitting panel comprises a plurality of non-housed LED chips and a foil which covers a plurality of LED chips so as to protect them from outside influences and to influence at least in part the light emitted by the LEDs, for example converting its frequency. The foil is a conversion foil or a diffuser foil, i.e. it contains fluorescent dyes and/or diffusers. The fluorescent dye (also called conversion dye) and/or the diffusers are embedded in a first laminated structure. A second laminated structure is arranged on the side of the first laminated structure that faces the light-generating elements. All the layers of the first laminated structure and all the layers of the second laminated structure have a similar refraction index. On the contrary, there is a substantial difference between the refraction index of the layers of the first laminated structure and the layers of the second laminated structure. The refraction index of the layers of the first laminated structure is low, for example lower than 1.5, and the refraction index of the layers of the second laminated structure is as high as possible, for example higher than 1.5. The transition between a boundary layer of the first laminated structure and a boundary layer of the second laminated structure is not flat but rather has boundary surfaces which form an angle to the lamination plane or are possibly corrugated. According to another aspect of the invention, non-housed LED chips may be covered with a sheath which contains the conversion dye.
PCT/CH2005/000209 2004-04-16 2005-04-15 Light-emitting panel and optically effective foil WO2005100016A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05729363A EP1735149A2 (en) 2004-04-16 2005-04-15 Light-emitting panel and optically effective foil

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CH664/04 2004-04-16
CH6642004 2004-04-16
CH14252004 2004-08-31
CH1425/04 2004-10-31
CH19572004 2004-11-26
CH1957/04 2004-11-26

Publications (2)

Publication Number Publication Date
WO2005100016A2 WO2005100016A2 (en) 2005-10-27
WO2005100016A3 true WO2005100016A3 (en) 2006-11-02

Family

ID=34964081

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH2005/000209 WO2005100016A2 (en) 2004-04-16 2005-04-15 Light-emitting panel and optically effective foil

Country Status (2)

Country Link
EP (1) EP1735149A2 (en)
WO (1) WO2005100016A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8872330B2 (en) 2006-08-04 2014-10-28 Osram Opto Semiconductors Gmbh Thin-film semiconductor component and component assembly
US9142720B2 (en) 2007-01-29 2015-09-22 Osram Opto Semiconductors Gmbh Thin-film light emitting diode chip and method for producing a thin-film light emitting diode chip

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005055293A1 (en) 2005-08-05 2007-02-15 Osram Opto Semiconductors Gmbh Method for producing semiconductor chips and thin-film semiconductor chip
DE102005062514A1 (en) 2005-09-28 2007-03-29 Osram Opto Semiconductors Gmbh Multi-purpose light emitting diode incorporates selective wavelength trap
JP2009512178A (en) 2005-11-04 2009-03-19 パナソニック株式会社 LIGHT EMITTING MODULE AND DISPLAY DEVICE AND LIGHTING DEVICE USING THE SAME
DE102006007285A1 (en) * 2006-02-16 2007-08-30 Airbus Deutschland Gmbh Aircraft`s e.g. passenger aircraft, visualization system, has lining panel lining passenger cabin, where lining panel is coated with flexible display e.g. organic light emitting device display
DE102007001149A1 (en) * 2007-01-05 2008-07-10 Philipp Schilling Lighting device for two-sided illumination of an object with regard to a viewing surface has a casing part with a flat section linked to an angular section as one piece
DE102007054800A1 (en) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Luminescence conversion film for e.g. luminescence diode chip, has luminescence conversion material with fluorescent substance that is in form of organic particles, where film exhibits specific transparency to visible wavelength range
EP2164302A1 (en) 2008-09-12 2010-03-17 Ilford Imaging Switzerland Gmbh Optical element and method for its production
DE102009034370A1 (en) * 2009-07-23 2011-01-27 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optical element for an optoelectronic component
IT1401974B1 (en) 2010-09-28 2013-08-28 Università Degli Studi Di Milano Bicocca LIGHTING DEVICE
DE202011000255U1 (en) * 2011-02-03 2012-05-08 Zumtobel Lighting Gmbh Cover for a luminaire housing
US8986842B2 (en) 2011-05-24 2015-03-24 Ecole Polytechnique Federale De Lausanne (Epfl) Color conversion films comprising polymer-substituted organic fluorescent dyes
DE102012109236A1 (en) * 2012-09-28 2014-04-03 Osram Opto Semiconductors Gmbh Method for producing optoelectronic component e.g. solar cell, involves editing optical characteristic of functional layer, so that optoelectronic property of optoelectronic component unit is changed to target property
DE102013103983B4 (en) * 2013-04-19 2021-09-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Process for the production of a large number of radiation-emitting semiconductor chips
US9373761B2 (en) * 2014-09-23 2016-06-21 Osram Sylvania Inc. Patterned thin-film wavelength converter and method of making same
DE102015106865A1 (en) * 2015-05-04 2016-11-10 Osram Opto Semiconductors Gmbh Method for producing a converter component
DE102015112969A1 (en) * 2015-08-06 2017-02-09 Osram Opto Semiconductors Gmbh Method for producing an optoelectronic component
DE102017108573A1 (en) 2017-04-21 2018-10-25 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
DE102017113380A1 (en) 2017-06-19 2018-12-20 Schreiner Group Gmbh & Co. Kg Film construction with generation of visible light by means of LED technology
DE102017113375A1 (en) * 2017-06-19 2018-12-20 Schreiner Group Gmbh & Co. Kg Film construction with generation of visible light by means of LED technology

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5469020A (en) * 1994-03-14 1995-11-21 Massachusetts Institute Of Technology Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes
JPH11199781A (en) * 1998-01-08 1999-07-27 Nichia Chem Ind Ltd Color conversion sheet and luminescent device using sane
US20010010449A1 (en) * 2000-02-02 2001-08-02 Chien-Chia Chiu High efficiency white light emitting diode
WO2003023857A2 (en) * 2001-09-13 2003-03-20 Lucea Ag Led-luminous panel and carrier plate
US20030209714A1 (en) * 2000-10-12 2003-11-13 General Electric Company Solid state lighting device with reduced form factor including led with directional emission and package with microoptics
WO2004068597A2 (en) * 2003-01-27 2004-08-12 3M Innovative Properties Company Phosphor based light sources utilizing total internal reflection
WO2004102064A1 (en) * 2003-05-15 2004-11-25 Lucea Ag Light source

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5469020A (en) * 1994-03-14 1995-11-21 Massachusetts Institute Of Technology Flexible large screen display having multiple light emitting elements sandwiched between crossed electrodes
JPH11199781A (en) * 1998-01-08 1999-07-27 Nichia Chem Ind Ltd Color conversion sheet and luminescent device using sane
US20010010449A1 (en) * 2000-02-02 2001-08-02 Chien-Chia Chiu High efficiency white light emitting diode
US20030209714A1 (en) * 2000-10-12 2003-11-13 General Electric Company Solid state lighting device with reduced form factor including led with directional emission and package with microoptics
WO2003023857A2 (en) * 2001-09-13 2003-03-20 Lucea Ag Led-luminous panel and carrier plate
WO2004068597A2 (en) * 2003-01-27 2004-08-12 3M Innovative Properties Company Phosphor based light sources utilizing total internal reflection
WO2004102064A1 (en) * 2003-05-15 2004-11-25 Lucea Ag Light source

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 12 29 October 1999 (1999-10-29) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8872330B2 (en) 2006-08-04 2014-10-28 Osram Opto Semiconductors Gmbh Thin-film semiconductor component and component assembly
US9142720B2 (en) 2007-01-29 2015-09-22 Osram Opto Semiconductors Gmbh Thin-film light emitting diode chip and method for producing a thin-film light emitting diode chip

Also Published As

Publication number Publication date
EP1735149A2 (en) 2006-12-27
WO2005100016A2 (en) 2005-10-27

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