WO2005089031A1 - プラズマ生成装置 - Google Patents
プラズマ生成装置 Download PDFInfo
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- WO2005089031A1 WO2005089031A1 PCT/JP2005/002477 JP2005002477W WO2005089031A1 WO 2005089031 A1 WO2005089031 A1 WO 2005089031A1 JP 2005002477 W JP2005002477 W JP 2005002477W WO 2005089031 A1 WO2005089031 A1 WO 2005089031A1
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- plasma
- anode
- cathode
- trigger
- tip
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32614—Consumable cathodes for arc discharge
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/48—Generating plasma using an arc
- H05H1/50—Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc
Definitions
- the present invention relates to a plasma generation device that generates plasma by performing vacuum arc discharge.
- the tip of the convex portion of the cathode surface having fine irregularities on the cathode surface from which the plasma is emitted is discharged. If the protruding tip is consumed by the emission of plasma, the other protruding tip becomes a new plasma emission point at the next plasma startup, and a plasma generation that can generate plasma intermittently for a long period of time.
- the device According to the device.
- the surface characteristics of a solid can be improved by forming a thin film on a surface of a solid material in a plasma or by implanting ions.
- Films formed using plasma containing metal ions and non-metal ions enhance the abrasion resistance and corrosion resistance of the solid surface, and are useful as protective films, optical thin films, transparent conductive films, and the like.
- carbon films made by using carbon plasma are highly useful as diamond-like carbon films (DLC films) composed of mixed crystals of diamond structure and graphite structure.
- Vacuum arc plasma is a plasma formed by an arc discharge generated between a cathode and an anode, the cathode force existing on the surface of the cathode, the cathode material being evaporated, and the cathode vaporized material.
- a reactive gas or Z and an inert gas such as a rare gas
- the reactive gas or Z and the inert gas are simultaneously ionized.
- a thin film can be formed on a solid surface or ions can be implanted to perform surface treatment.
- the generation of plasma is induced by separating the cathode and the trigger electrode while a current is flowing between the cathode in contact and the trigger electrode.
- vacuum arc plasma particles such as cathode material ions, electrons, and cathode material neutral particles (atoms and molecules) are generated by vacuum arc discharge.
- fine particles of the cathode material hereinafter referred to as “droplets”) ranging in size from sub-microns to several hundreds of microns (0.01-1000 m) are also emitted.
- FIG. 7 is a configuration diagram of the plasma generation unit 102 in the conventional plasma generation device.
- a plasma generation unit 102 provided in the vacuum chamber 1, as a pre-stage for generating a plasma 108 between the cathode 104 and the anode 140, an electric spark is generated by the trigger electrode 106 to induce the generation of the plasma 108.
- the trigger electrode 106 is provided with a drive device that can be driven up and down.
- the drive device brings the tip of the trigger electrode 106 into contact with the cathode surface 104a, and a voltage is applied to the contact point by the arc power source 122. Apply. A current is concentrated at this contact point, and when the trigger electrode 106 is separated from the cathode surface 104a, an electric spark is generated and the generation of plasma 108 is induced.
- the plasma generating substance forming the cathode material in the emission hole 104b is emitted as plasma constituent particles or droplets 118.
- the trigger electrode 106 is close to the emission hole 104b, a desirable contact state is not formed between the trigger electrode 106 and the cathode 104, so that the generation of the plasma 108 cannot be induced.
- the electrode configuration disclosed in Japanese Patent Application Laid-Open No. 2001-192815 reproduces the cathode material surface in a planar shape.
- a driving device for rotating the cathode material Although not shown, in the case where the plasma generator of FIG. 7 operates intermittently for a long time, the cathode rotating mechanism for rotating the cathode 104 with the center line perpendicular to the bottom of the plasma generating section as the rotation axis of the cathode 104 It is necessary to add a device and a polishing device for polishing the cathode surface with a grinder.
- the cathode 104 is rotated by the cathode rotation mechanism device to secure a desired contact state between the trigger electrode 106 and the cathode surface 104a.
- the contact position between the cathode 104 and the trigger electrode 106 is sequentially moved.
- the trigger electrode 106 and the flat cathode surface 104a have a good contact state, and the generation of plasma 108 can be induced again.
- the intermittent generation of the plasma 108 is temporarily suspended while the cathode surface 104a is being polished, so that the operation efficiency of the plasma generator is reduced.
- dust generated in the polishing process contaminates the inside of the vacuum chamber and deteriorates the quality of the formed film.
- the conventional trigger electrode 106 in FIG. 7 is disposed close to the cathode surface 104a.
- the trigger electrode 106 is rapidly deteriorated because it is heated by being exposed to the plasma 108. Further, there is a problem that the film deposited on the trigger electrode 106 is separated and mixed as a contamination to the plasma 108 to hinder the progress of the plasma 108.
- the plasma generating apparatus disclosed in U.S. Pat.No. 6,319,369 B1 (Patent Document 3) is provided with a drive mechanism for moving a trigger electrode to a plasma collision avoidance position.
- FIG. 8 shows a plasma generator of Patent Document 3.
- FIG. 8 is a configuration diagram of a plasma generator in a conventional plasma generator.
- a cathode cooling member 164 having an inlet 161 and an outlet 162 for cooling water is mounted on the flanges 165 and 168, and the cathode 104 is fixed on the cathode cooling member 164 by a fixing member 169.
- a magnet coil 168 provided around the anode 140 focuses the plasma and generates an induction magnetic field for guiding the plasma to a plasma outlet (not shown, but upward in the drawing).
- a baffle plate 173 for suppressing the progress of droplets reflected on the side wall, a reaction gas introduction port 134, and an open window 166 are provided.
- the trigger electrode 106 and the surface of the cathode 104 are in contact with each other, and when the trigger electrode 106 is separated from the cathode surface by the driving mechanism from this contact state, the leading end 106a of the trigger electrode 106 and the cathode surface are separated.
- a cathode spot is formed at the contact position, and an arc plasma is formed from the cathode spot toward the anode 140.
- the driving mechanism is controlled by a controller 167. Deterioration due to heating of the trigger electrode 106 and the Prevent contamination of the horra and prevent the progress of the plasma.
- the trigger electrode 106 is stored at the plasma collision avoidance position (the position of the trigger electrode indicated by a broken line). However, since a plasma emission hole is formed on the surface of the cathode 104 in FIG. 8, it is necessary to attach the trigger control device and the polishing device similarly to FIG. 7, and the vacuum chamber is frequently cleaned. Had to do.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2002-8893
- Patent Document 2 JP 2001-192815 A
- Patent Document 3 U.S. Patent No. 6319369
- the conventional plasma generation unit is provided with a cathode surface polishing apparatus, and the generation of plasma must be temporarily stopped in the polishing process of the cathode surface 104a. That is, the polishing treatment remarkably reduces the processing efficiency of the surface treatment using the plasma generating apparatus.
- an object of the present invention is to realize a plasma generator capable of performing intermittent operation of repeating a sequence operation of starting, maintaining, and stopping a cathode arc (vacuum arc) plasma for a long period of time. That is.
- the present invention has been proposed to solve the above problems, and has a first form of the present invention.
- the plasma generating unit functions as a trigger for starting and maintaining a cathode and a vacuum arc.
- An anode is arranged, the cathode surface of the cathode has a flat or fine irregular shape, the anode surface of the trigger / anode that comes into contact with the cathode surface has a flat surface, and the anode surface is at least at the time of plasma activation.
- the plasma generation apparatus is disposed so as to be in contact with the entire surface of the cathode surface, and uses a contact point between a tip of a fine projection on the cathode surface and the anode surface as a plasma emission point.
- the trigger / anode is provided with a driving mechanism, and the driving mechanism moves the trigger / anode repeatedly between the arc plasma starting position and the plasma collision avoiding position. It is a plasma generation device that can be configured.
- a drive mechanism is connected to a base end of the trigger / anode, and the trigger / anode moves between an arc plasma activation position and a plasma collision avoidance position with the drive mechanism as a fulcrum. It is a plasma generation device configured to be swingable repeatedly.
- the trigger / anode is formed in a hammer shape having a narrow anode base end and a wide anode tip end, and the tip end surface of the anode tip end is the anode surface. It is a plasma generation device that becomes
- a fifth aspect of the present invention is a plasma generation device in which a permanent magnet or an electromagnet is provided on the trigger / anode.
- a sixth aspect of the present invention is a plasma generating apparatus in which a tip of the trigger / anode is composed of a plasma generating material.
- a cathode material loading device for sequentially supplying a cathode material for forming the cathode to a plasma generating unit, and a leading end of a plurality of cathode materials arranged in series is provided.
- the cathode material in (1) becomes the above-mentioned cathode, and when the cathode is consumed, the subsequent cathode material is advanced to make a new cathode.
- An eighth aspect of the present invention is a plasma generating apparatus that has a storage chamber for accommodating a cathode material and replenishes the cathode material loading device with the cathode material.
- the projection of the cathode surface having a flat or fine unevenness The tip of the part is brought into contact with the anode surface having a flat surface, and a current is caused to flow through this contact point to induce the generation of arc plasma. If the tip of the convex portion evaporates due to the discharge of the arc plasma, at the next start of the plasma, the tip of another convex portion that can come into contact with the anode surface becomes a new plasma emission point and continuously generates plasma one after another. be able to .
- the tip of the conventional trigger / anode is formed in a rod shape, and when a plasma is generated by bringing the trigger / anode into contact with the cathode surface, the cathode surface has a size about the tip diameter of the trigger / anode.
- An emission hole is formed. That is, in the vacuum arc discharge, the cathode material filling the discharge holes is discharged as plasma or droplets.
- the cathode point since the cathode point has the property of moving without staying at a certain point, even if the discharge is for a short period of time of about several seconds, the cathode surface gradually becomes rough if the number of times is repeated. Generally, the area around where the trigger electrode touches is eroded.
- a plasma generating apparatus that performs intermittent repetition of start-up and 'maintenance' stops for a long time is provided with a polishing member for polishing the cathode surface, and it is necessary to periodically polish the cathode surface. .
- a large amount of dust was generated in the polishing process, causing contamination in the vacuum chamber. It also contributed to a decrease in the operation rate of the plasma generator.
- plasma is generated from the plasma emission point where the tip of the projection formed on the cathode surface and the anode surface are in contact with each other, and when the tip of the projection evaporates, the plasma is generated at the next plasma startup.
- the tip of another projection that can contact the anode surface becomes the new plasma emission point.
- the tips of the projections are formed one after another, so that the fine irregularities on the cathode surface are maintained, and plasma can be continuously generated from the cathode surface.
- plasma can be generated stably and intermittently without opening the vacuum chamber. Since the cathode surface is consumed evenly over a long period of time, the cathode surface gradually recedes, vacuum arc discharge continues until the cathode material disappears, and the plasma discharge continues until the cathode disappears completely. Continuous generation becomes possible.
- the trigger / anode is provided with a driving mechanism, and the driving mechanism causes the trigger / anode to repeatedly move between a plasma starting position and a plasma collision avoiding position.
- the driving mechanism causes the trigger / anode to repeatedly move between a plasma starting position and a plasma collision avoiding position.
- the trigger / anode is separated from the cathode surface force, a cathode spot is formed on the cathode surface, and an electric field is generated from the cathode spot.
- Vacuum arc plasma is formed in a diffused manner in the direction. Further, by moving the trigger / anode to the plasma collision avoidance position, most of the diffused vacuum arc plasma can be sent to the drawer side. Further, since a part of the plasma constituent particles reach the trigger / anode, the discharge can be maintained.
- a driving mechanism is connected to the base end of the trigger / anode, and the trigger / anode is moved between the plasma starting position and the plasma collision avoiding position with the driving mechanism as a fulcrum. Since the gap is repeatedly swung, a stable swinging movement of the trigger and the anode can be realized.
- the swing of the trigger / anode with the driving mechanism as a fulcrum draws an arc-shaped trajectory, and sweeps the plasma by the voltage induced between the cathode and the trigger / anode, while the plasma activation position force and the plasma collision avoidance position You can move smoothly up to.
- the trigger / anode is formed in the shape of a knuckle having a narrow anode base end and a wide anode tip, at the time of plasma activation, The cathode surface can completely contact the entire surface of the anode surface, and a favorable contact state between the anode surface and the tip of the projection can be ensured.
- the center of gravity of the trigger / anode is located on the tip end side of the anode, and the swinging motion of the trigger / anode can be constituted by a stable repetitive movement force like a single pendulum.
- a plasma flow for maintaining an arc discharge at the center of the trigger / anode is provided.
- ⁇ can be set inside, preventing the film from adhering around the trigger and anode.
- the conductive film adheres to the insulator around the anode, that part also acts as an anode, and as a result, the evaporant generated from the cathode spot is transported toward that part, so that the efficiency of use of the evaporant is reduced. Will decrease.
- the trigger / anode can be used as an active anode.
- the plasma spreading on the front surface of the anode of the trigger / anode is converged.
- the magnet can be arranged inside or outside the trigger / anode, and especially when the magnet is buried inside the anode, the magnet surface does not come into contact with the cathode, so the effectiveness of the magnet can be increased.
- the magnetic field generated by the permanent magnet or the electromagnet and the electromagnetic interaction of the plasma (The plasma is concentrated near the anode surface by the Lorentz force, and a high-density plasma region (plasma plume) can be formed.
- the trigger / anode constitutes an active anode, thereby providing high efficiency.
- Plasma can be generated. That is, by activating the trigger / anode, a part of neutral particles generated from the cathode can be ionized. In other words, since a part of neutral particles that do not contribute to the film formation can be used, the film formation rate can be increased.
- the tip of the trigger / anode is formed of a plasma generating material, plasma having a material strength different from that of the cathode can be generated.
- plasma having a material strength different from that of the cathode can be generated.
- a ZnO film mixed with A1 is formed on the surface of an object to be processed, it is necessary to form the cathode with an alloy mixed with A1 and Zn. That is, since the composition ratio of the formed film depends on the composition ratio of the alloy, it was difficult to arbitrarily control the composition ratio of the formed film.
- the trigger / anode according to the present invention is formed from a plasma-generating substance, and the trigger / anode is used as an active anode (the active anode concentrates current to evaporate a small amount of the anode material on the anode surface. Therefore, plasma containing a substance different from the cathode material can be generated. Therefore, in the surface treatment, more various plasma treatments according to the purpose of use can be performed.
- an active anode can be formed by embedding a plasma generating material on the anode surface. Further, by disposing a permanent magnet or an electromagnet at the tip of the anode, the plasma concentrates near the anode surface. Can further improve the efficiency of plasma generation.
- a cathode material loading device for sequentially supplying the cathode material to the plasma generating section is provided, and when the cathode is exhausted, the subsequent cathode material is instantly replenished, and a new cathode material is provided. It is possible to use a simple cathode. In the vacuum arc processing method, it is desirable that the vacuum chamber should not be opened as much as possible in order to prevent contamination of impurities and contamination from the outside. By providing the cathode material loading device according to the present invention, the cathode material can be replenished without opening and closing the vacuum chamber, and high-density plasma can be continuously generated for a long time.
- a storage chamber for accommodating a cathode material, supply the cathode material to the cathode material loading device, and continuously generate plasma for a long time.
- a plurality of workpieces can be set in the processing section, and plasma processing can be performed without interrupting the processing steps.
- the cathode material can be sequentially supplied without opening the vacuum chamber, and the contamination of impurities and contamination can be suppressed.
- FIG. 1 is a cross-sectional configuration diagram of a plasma generation device according to the present invention.
- FIG. 2 is an enlarged view of a plasma generating unit in FIG. 1.
- FIG. 3 is a configuration diagram showing a contact state between a tip of a convex portion of a cathode surface and an anode surface according to the present invention.
- FIG. 4 is an explanatory view of an active anode trigger / anode according to the present invention.
- FIG. 5 is a configuration diagram of an active anode trigger / anode according to the present invention.
- FIG. 6 is a configuration diagram of a plasma generation unit provided with a cathode material loading device according to the present invention.
- FIG. 7 is a configuration diagram of a plasma generation unit in a conventional plasma generation device.
- FIG. 8 is a configuration diagram of a plasma generation unit in a conventional plasma generation device. Explanation of symbols
- Plasma high-density region plasma plume Magnetic field
- FIG. 1 is a cross-sectional configuration diagram of a plasma generation device according to the present invention. By adding a plasma processing unit to this apparatus, it becomes a plasma processing apparatus.
- the plasma generating apparatus of FIG. 1 includes a plasma generating section 2, a drawlet collecting section 16, a first plasma guide section 9, a second plasma guide section 10, and a plasma generating section 2, which are formed in a vacuum chamber 11. It is composed of a plasma processing unit 12.
- the cathode 4 and the trigger / anode 6 are connected to an external arc power supply 22 via an insulating introduction terminal 26.
- a power supply capable of generating a vacuum arc discharge such as a general-purpose DC power supply, a pulse power supply, a DC superimposed pulse power supply, and an AC superimposed DC power supply, can be used.
- a limiting resistor (0.1-10 ⁇ ) 24 for limiting (adjusting) the current flowing through the trigger / anode 22 may be inserted between the trigger / anode 6 and the arc power supply 22. . ⁇
- a more preferred embodiment in this case is provided with another auxiliary anode.
- a power source is connected to the plasma transport duct 5, and the plasma transport duct 5 itself also serves as an auxiliary anode.
- an auxiliary anode can be separately laid in the duct (not shown). Further, this auxiliary electrode can be used as an active anode.
- the plasma 8 and the droplet 18 are generated in a mixed state from the cathode 4.
- the droplet 18 that also generates the force of the cathode 4 is electrically neutral and is not affected by a magnetic field, and thus has a characteristic of moving straight.
- the traveling direction of the droplet 18 and the traveling direction of the plasma 8 in the plasma transport duct 5 are branched into a substantially c-shape, and are formed in the first plasma guide section 9 by the induction magnetic field generator 35. Due to the synthetic magnetic field, the plasma 8 is bent and guided to the second plasma guide.
- the droplet 18 advances to the droplet collecting unit 16, and the plasma 8 advances to the second plasma guide unit 10 by a magnetic field. Further, a plasma processing unit 12 for performing surface treatment of the object 14 with the plasma 8 traveling in the second plasma guide unit 10 is additionally provided. A reactive gas can be introduced into the plasma processing method as needed. Note that a plasma processing apparatus including a plasma processing section is also referred to as a plasma generation apparatus in the present invention, and is included in the technical scope of the present invention.
- the constituent particles of the plasma 8 are evaporating substances generated by the cathode 4 of the plasma generating unit 2, or charged particles (ions, electrons) converted into plasma originating from the evaporating substance and the introduced gas (source). Also includes neutral particles such as molecules and atoms in a plasma precursor state.
- the deposition conditions in the plasma processing method are as follows: current: 1 to 600 A (preferably 5 to 500 A, more preferably 10 to 150 A). Further, the voltage, 5-100 V (preferably 10 80V, more preferably 10- 50 V), the pressure, 10- 1G - 10 2 Pa (preferably 10 6 - 10 2 Pa, more preferably 10- 5 — LO Pa).
- gas introduction is not performed!
- a gas introduction system 34a and a gas exhaust system 34b can be connected.
- General-purpose systems can be used as these systems.
- the introduced gas may be introduced from both the plasma processing unit (processing unit) 12 and the plasma generation unit 2, which may be introduced from the plasma generation unit 2.
- the type of gas may be different.
- a reactive gas is not used, a reactive gas is used as appropriate, in addition to a rare gas (usually Ar, He) for maintaining a constant pressure.
- the reactive gas reacts with evaporating particles (plasma particles) using the cathode material or the like as a source, so that a complex compound film can be easily formed.
- Reactive gases include nitrogen (N), oxygen (O), water
- One or more kinds can be appropriately selected and used from the group of 2 2 2 2 2 4 4 2 6 2.
- the rare gas may be mixed to adjust the concentration of the reactive gas.
- alcohol vapor, organometallic gas, or organometallic liquid vapor can be used as the reactive gas.
- FIG. 2 is an enlarged view of the plasma generating unit.
- the plasma generating unit 2 includes a cathode 4, a trigger / positive electrode 6, and an arc-stabilized magnetic field generator (electromagnetic coil or magnet) 30a and 30b.
- the cathode 4 is a source for supplying a main constituent substance of plasma, and a material for forming the cathode 4 is not particularly limited as long as it is a solid having conductivity.
- a single metal, an alloy, a single inorganic, an inorganic compound (metal oxide / nitride), or the like can be used alone or as a mixture of two or more.
- the alloy includes TiAl, AlSi, NdFe and the like.
- examples of the inorganic simple substance include C and Si.
- inorganic compounds ceramics
- TiO, ZnO, SnO, ITO inorganic compounds
- Indium-Tin-Oxide oxides such as InO, Cd SnO and CuO
- carbides and nitrides of TiN, TiAlC, TiC, CrN, TiCN and the like can also be mentioned.
- the material forming the tip 6a of the trigger / anode 6 is usually evaporated (when it is not desired to evaporate the trigger / anode material, that is, when it is desired to generate plasma of only the cathode evaporant), even at the plasma temperature.
- the material is not particularly limited as long as it is a non-magnetic material and a conductive solid. Metals, alloys, inorganics, inorganic compounds (metal oxides, nitrides), etc. They can be used alone or in combination of two or more.
- the material used for the above-described cathode 4 can be appropriately selected and used. It is desirable that the trigger / anode 6 is also formed of a material such as stainless steel, copper or carbon material (graphite: graphite).
- the trigger / anode 6 is temporarily brought into contact with the surface of the cathode 4 and then separated to generate an electric spark between the cathode 4 and the trigger / anode 6.
- this electric spark occurs, the electric resistance between the cathode 4 and the trigger / anode 6 decreases, and a vacuum arc is generated between the cathode and the trigger / anode.
- the base material 6b of the trigger / anode be formed of a material such as stainless steel or copper. More preferably, the outer wall of the base 6b of the trigger / anode 6 is insulated with ceramics or the like, so that the function as an anode can be given only to the trigger / anode tip 6a.
- a material for forming the trigger / anode 6a As a material for forming the trigger / anode 6a, general-purpose Mo (melting point: 2610 ° C) or W (melting point: 3387 ° C), a carbon material, preferably graphite (graphite), which is a high melting point metal, is used.
- the arc stabilizing magnetic field generators 30a and 30b are arranged on the outer periphery of the vacuum chamber 11 in the plasma generating unit 2, and stabilize the cathode point of the vacuum arc and the plasma 8 generated by the arc discharge. Let it.
- the arc stabilizing magnetic field generators 30a and 30b are arranged so that the applied magnetic fields to the plasma are in opposite directions (cusp shape), the plasma 8 is more stable.
- the extraction efficiency of the plasma 8 is prioritized, or when the trigger / anode 6 is disposed at a position facing the cathode surface 4a so as not to hinder the progress of the plasma 8, the applied magnetic fields are directed in the same direction ( (Mirror shape).
- the arc stabilizing magnetic field generator 30a can be arranged near the insulating introduction terminal 26a of the cathode 4 at the end of the vacuum chamber 11 at the end of the vacuum chamber 11.
- FIG. 3 is a configuration diagram of a contact state between the tips 4b or 4f of the convex portions on the cathode surface 4a and the anode surface 6c.
- (3A) is a configuration diagram of a contact state between the tip 4b of the projection and the anode surface 6c.
- the projection tip 4b and the anode surface 6c are in contact at the contact point.
- (3B) is a configuration diagram of a contact state between the projection tip 4f and the anode surface 6c.
- (3B) The protruding portion 4d disappears, and the protruding portion tip 4f comes into contact with the anode surface 6c to become a cathode spot. Further, when the convex portion 4e disappears due to the vacuum arc discharge, another convex portion closest to the anode surface 6c becomes a cathode point.
- one convex portion is discharged and turned into a concave portion, and as a result, a new convex portion is formed, and the cathode surface always has an uneven surface, while the cathode 4 gradually wears out.
- Retreat. In other words, the cathode surface always retains the uneven shape, and the projections on the cathode surface form good cathode spots.
- FIG. 4 is an explanatory diagram of an active anode trigger / anode.
- a magnet 6d electromagnet or permanent magnet
- the permanent magnet is easier to handle. Due to the magnetic field 44 generated by the magnet 6d, the density of lines of magnetic force increases near the surface of the anode surface. Therefore, near the anode surface, the electrons 40 emitted from the cathode surface 4a are wrapped around the lines of magnetic force by the Larmor motion, and as a result, the electron density near the anode surface increases and is attracted to these electrons.
- a plasma high-density region 43 is formed together with the ions.
- the electron trajectory 48a from which the cathodic force is also emitted, the ion emission direction 46c, the neutral atom emission direction 46a, and the plasma high-density region 43 (plasma plume) are schematically shown. It does not describe the trajectory of each particle.
- the tip 6a or the anode surface 6c of the active trigger / anode 6 may be formed of a plasma generating substance. In this case, by forming the tip 6a or the anode surface 6c of the trigger / anode 6 from a material different from that of the cathode 4, plasma composed of two types of elements can be generated.
- FIG. 5 is a configuration diagram of an active anode type trigger / anode.
- An active anode can be obtained by disposing a plasma generating substance at a part of the trigger / anode tip.
- (5A) is a configuration diagram of the trigger / anode 6 provided with the magnet 6d and the plasma generating material 6f.
- a magnet 6d is provided at the tip 6a of the trigger / anode 6, .
- a magnet 6d is provided at the tip as described above.
- the plasma constituting the region heats or sputters the anode surface by heat and ion-electron bombardment, and induces evaporation of the plasma generating material embedded in the anode surface.
- (5B) is a configuration diagram of a trigger / anode in which the plasma generating material 6f is provided.
- the trigger and anode are provided with magnets.
- the anode can also emit plasma with the surface force of the anode, and can form a plasma containing a substance different from the cathode material
- FIG. 6 is an example of a configuration diagram of the plasma generating unit 2 provided with the cathode material loading device 3.
- the basic structure of the cathode material loading device 3 is composed of a cathode spare material 4c and a loading section 60. As the number of cathodes 4 in operation decreases, the cathode spare material 4c is pushed out by the loading unit 60. Therefore, even when the cathode 4 is exhausted, the plasma can be continuously generated by replenishing the cathode material without interrupting the generation of the plasma.
- the loading unit 60 is a loading member 52 for advancing the cathode material, a vacuum bellows 54 for pushing the loading member 52 in a vacuum, a pushing mechanism 58 for the loading member 52, and a smooth insertion of the loading member 52. And a support member 56 for Although not shown, when the loading member 52 moves forward beyond the length of the cathode spare material 4c to replenish the cathode spare material 4c from the storage room 50, a driving device for returning the loading member 52 backward. May be added. Alternatively, the entire extruding mechanism may be put in a vacuum chamber without using the vacuum bellows.
- the cathode spare material 4c is stored, and after the cathode 4 is exhausted and the subsequent cathode spare material 4c is moved to the plasma generator 2, the cathode spare material stored in the storage room 50 is sequentially stored. Material 4c is replenished as a successor to cathode 4.
- This storage room 50 can be freely expanded according to the continuous operation time.
- the plasma generating apparatus is provided with a cathode surface having a flat or fine uneven shape and an anode surface having a flat surface, and the anode surface is at least reduced when plasma is started. Are also arranged so as to contact the entire surface of the cathode surface.
- the tip of the convex portion of the cathode surface that is in contact with the anode surface is defined as a plasma emission point, and when one of the tips of the convex portion is consumed, the other tip of the convex portion that can contact the anode at the next plasma start-up has a new plasma emission point.
- plasma can be generated intermittently.
- the plasma generating apparatus it is possible to continuously perform the intermittent surface modification treatment such as ion implantation and etching for a long time in a semiconductor manufacturing process or the like.
- the surface treatment can be performed by replenishing the cathode material without opening the vacuum chamber. ⁇ Contamination can be prevented. That is, by using the plasma generating apparatus according to the present invention, a plasma treatment can be stably and continuously performed for a long time on a processing object while maintaining high quality or high purity.
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- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma Technology (AREA)
- Physical Vapour Deposition (AREA)
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Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE602005027184T DE602005027184D1 (de) | 2004-03-16 | 2005-02-17 | Plasmagenerator |
EP05710327A EP1727406B1 (en) | 2004-03-16 | 2005-02-17 | Plasma generator |
AT05710327T ATE504075T1 (de) | 2004-03-16 | 2005-02-17 | Plasmagenerator |
US10/592,286 US7823537B2 (en) | 2004-03-16 | 2005-02-17 | Plasma generator |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004075091A JP4373252B2 (ja) | 2004-03-16 | 2004-03-16 | プラズマ生成装置 |
JP2004-075091 | 2004-03-16 |
Publications (1)
Publication Number | Publication Date |
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WO2005089031A1 true WO2005089031A1 (ja) | 2005-09-22 |
Family
ID=34976004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/002477 WO2005089031A1 (ja) | 2004-03-16 | 2005-02-17 | プラズマ生成装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7823537B2 (ja) |
EP (1) | EP1727406B1 (ja) |
JP (1) | JP4373252B2 (ja) |
CN (1) | CN100542373C (ja) |
AT (1) | ATE504075T1 (ja) |
DE (1) | DE602005027184D1 (ja) |
WO (1) | WO2005089031A1 (ja) |
Cited By (2)
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US20120234691A1 (en) * | 2010-04-26 | 2012-09-20 | Panasonic Corporation | Method for reducing carbon dioxide |
US8525079B2 (en) | 2005-12-11 | 2013-09-03 | W.E.T. Automotive Systems Ag | Flat heating element |
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JP4660452B2 (ja) * | 2006-09-30 | 2011-03-30 | 株式会社フェローテック | 拡径管型プラズマ生成装置 |
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US7946258B2 (en) * | 2006-10-20 | 2011-05-24 | Tetros Innovations, Llc | Method and apparatus to produce enriched hydrogen with a plasma system for an internal combustion engine |
US20080138676A1 (en) * | 2006-10-20 | 2008-06-12 | Charles Terrel Adams | Methods and systems of producing molecular hydrogen using a plasma system in combination with a membrane separation system |
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US8211276B2 (en) * | 2006-10-20 | 2012-07-03 | Tetros Innovations, Llc | Methods and systems of producing fuel for an internal combustion engine using a plasma system at various pressures |
US20080131360A1 (en) * | 2006-10-20 | 2008-06-05 | Charles Terrel Adams | Methods and systems of producing molecular hydrogen using a plasma system at various pressures |
US8220440B2 (en) * | 2006-10-20 | 2012-07-17 | Tetros Innovations, Llc | Methods and systems for producing fuel for an internal combustion engine using a low-temperature plasma system |
JP5189784B2 (ja) * | 2007-03-30 | 2013-04-24 | 株式会社フェローテック | プラズマガン周辺を電気的中性にしたプラズマ生成装置 |
SK500062013A3 (sk) * | 2013-03-05 | 2014-10-03 | Ga Drilling, A. S. | Generovanie elektrického oblúka, ktorý priamo plošne tepelne a mechanicky pôsobí na materiál a zariadenie na generovanie elektrického oblúka |
DE102015204592B4 (de) * | 2015-03-13 | 2016-12-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zum Beeinflussen einer Ausbreitung eines bei einem Vakuumlichtbogenprozess gebildeten Plasmas |
WO2016208094A1 (ja) * | 2015-06-24 | 2016-12-29 | キヤノンアネルバ株式会社 | 真空アーク成膜装置および成膜方法 |
JP6350603B2 (ja) * | 2016-07-07 | 2018-07-04 | トヨタ自動車株式会社 | アーク放電発生装置及び成膜方法 |
DE102019110642A1 (de) * | 2019-04-25 | 2020-10-29 | Vtd Vakuumtechnik Dresden Gmbh | Anode für PVD-Prozesse |
JP7391370B2 (ja) * | 2020-01-27 | 2023-12-05 | 株式会社Helix | 水プラズマ発生装置及びこれに用いられる通電部材、水プラズマ発生方法 |
CN111744752A (zh) * | 2020-05-27 | 2020-10-09 | 河北复朗施纳米科技有限公司 | 一种抑菌耐磨材料喷覆于智能锁表面的工艺方法 |
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-
2005
- 2005-02-17 CN CNB2005800083412A patent/CN100542373C/zh active Active
- 2005-02-17 DE DE602005027184T patent/DE602005027184D1/de active Active
- 2005-02-17 WO PCT/JP2005/002477 patent/WO2005089031A1/ja not_active Application Discontinuation
- 2005-02-17 AT AT05710327T patent/ATE504075T1/de not_active IP Right Cessation
- 2005-02-17 US US10/592,286 patent/US7823537B2/en active Active
- 2005-02-17 EP EP05710327A patent/EP1727406B1/en active Active
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Also Published As
Publication number | Publication date |
---|---|
EP1727406B1 (en) | 2011-03-30 |
EP1727406A1 (en) | 2006-11-29 |
ATE504075T1 (de) | 2011-04-15 |
DE602005027184D1 (de) | 2011-05-12 |
CN100542373C (zh) | 2009-09-16 |
JP2005267909A (ja) | 2005-09-29 |
CN1934914A (zh) | 2007-03-21 |
EP1727406A4 (en) | 2007-04-18 |
JP4373252B2 (ja) | 2009-11-25 |
US20070193518A1 (en) | 2007-08-23 |
US7823537B2 (en) | 2010-11-02 |
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