WO2005088429A3 - Cooling system for electronic devices and device with such a cooling system - Google Patents
Cooling system for electronic devices and device with such a cooling system Download PDFInfo
- Publication number
- WO2005088429A3 WO2005088429A3 PCT/DE2005/000246 DE2005000246W WO2005088429A3 WO 2005088429 A3 WO2005088429 A3 WO 2005088429A3 DE 2005000246 W DE2005000246 W DE 2005000246W WO 2005088429 A3 WO2005088429 A3 WO 2005088429A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling system
- electronic devices
- fixing
- heat exchanger
- cooling medium
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004011782 | 2004-03-09 | ||
DE102004011782.9 | 2004-03-09 | ||
DE102004030124A DE102004030124A1 (en) | 2004-03-09 | 2004-06-22 | Cooling system for electronic components in e.g. computer, has components click-fixed into the interior of the device housing |
DE102004030124.7 | 2004-06-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005088429A2 WO2005088429A2 (en) | 2005-09-22 |
WO2005088429A3 true WO2005088429A3 (en) | 2005-10-27 |
Family
ID=34961906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2005/000246 WO2005088429A2 (en) | 2004-03-09 | 2005-02-14 | Cooling system for electronic devices and device with such a cooling system |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2005088429A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110232869A1 (en) * | 2008-12-05 | 2011-09-29 | Petruzzo Stephen E | Air Conditioner Eliminator System and Method for Computer and Electronic Systems |
WO2010141641A2 (en) | 2009-06-02 | 2010-12-09 | Stephen Petruzzo | Modular re-configurable computers and storage systems and methods |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
FR2839562A3 (en) * | 2002-05-13 | 2003-11-14 | Shuttle Inc | CENTRAL UNIT COOLING APPARATUS WITH THERMAL DUCT |
DE20311701U1 (en) * | 2003-07-25 | 2003-11-27 | Sharkoon Technologies Gmbh | Cooling system for e.g. personal computer, uses flowing water to absorb heat and emit heat via radiator inside computer casing |
WO2004062094A2 (en) * | 2002-12-27 | 2004-07-22 | Intel Corporation (A Delaware Coprporation) | Sealed and pressurized liquid cooling system for microprocessor |
-
2005
- 2005-02-14 WO PCT/DE2005/000246 patent/WO2005088429A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
FR2839562A3 (en) * | 2002-05-13 | 2003-11-14 | Shuttle Inc | CENTRAL UNIT COOLING APPARATUS WITH THERMAL DUCT |
WO2004062094A2 (en) * | 2002-12-27 | 2004-07-22 | Intel Corporation (A Delaware Coprporation) | Sealed and pressurized liquid cooling system for microprocessor |
DE20311701U1 (en) * | 2003-07-25 | 2003-11-27 | Sharkoon Technologies Gmbh | Cooling system for e.g. personal computer, uses flowing water to absorb heat and emit heat via radiator inside computer casing |
Also Published As
Publication number | Publication date |
---|---|
WO2005088429A2 (en) | 2005-09-22 |
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