WO2005072161A3 - Apparatus and process for sensing target gas species in semiconductor processing systems - Google Patents

Apparatus and process for sensing target gas species in semiconductor processing systems Download PDF

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Publication number
WO2005072161A3
WO2005072161A3 PCT/US2005/001409 US2005001409W WO2005072161A3 WO 2005072161 A3 WO2005072161 A3 WO 2005072161A3 US 2005001409 W US2005001409 W US 2005001409W WO 2005072161 A3 WO2005072161 A3 WO 2005072161A3
Authority
WO
WIPO (PCT)
Prior art keywords
gas
sensor element
semiconductor processing
gas detector
species
Prior art date
Application number
PCT/US2005/001409
Other languages
French (fr)
Other versions
WO2005072161A2 (en
Inventor
Philip S H Chen
Ing-Shin Chen
Frank Dimeo Jr
Jeffrey W Neuner
James Welch
Jeffrey F Roeder
Original Assignee
Advanced Tech Materials
Philip S H Chen
Ing-Shin Chen
Frank Dimeo Jr
Jeffrey W Neuner
James Welch
Jeffrey F Roeder
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/758,825 external-priority patent/US7228724B2/en
Priority claimed from US10/784,750 external-priority patent/US20040163445A1/en
Application filed by Advanced Tech Materials, Philip S H Chen, Ing-Shin Chen, Frank Dimeo Jr, Jeffrey W Neuner, James Welch, Jeffrey F Roeder filed Critical Advanced Tech Materials
Priority to EP05711523A priority Critical patent/EP1714135A2/en
Priority to JP2006549662A priority patent/JP2007519905A/en
Publication of WO2005072161A2 publication Critical patent/WO2005072161A2/en
Publication of WO2005072161A3 publication Critical patent/WO2005072161A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/14Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
    • G01N27/16Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by burning or catalytic oxidation of surrounding material to be tested, e.g. of gas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065Plasma etching; Reactive-ion etching

Abstract

A gas detector and process for detecting a target gas species, such as a fluorine-containing species in a gas containing same, e.g., an effluent of a semiconductor processing tool undergoing etch cleaning with HF, NF3, etc. The gas detector in one aspect employs a nickel-containing filament that is sensitive to the fluorine-containing species, which can function both as a sensing component and as a heat source when elevated temperature sensing is required. The gas detector in one aspect employs an elongated gas sensor element that can be vertically mounted on a support structure. Vertical mounting of such elongated gas sensor element on the support structure significantly improves the signal strength, reduces the response time, minimizes the footprint of the gas detector, and provides structural flexibility for accommodating thermal expansion/contraction of such gas sensor element.
PCT/US2005/001409 2004-01-16 2005-01-14 Apparatus and process for sensing target gas species in semiconductor processing systems WO2005072161A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05711523A EP1714135A2 (en) 2004-01-16 2005-01-14 Apparatus and process for sensing target gas species in semiconductor processing systems
JP2006549662A JP2007519905A (en) 2004-01-16 2005-01-14 Apparatus and method for detecting a target gas species in a semiconductor processing system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/758,825 2004-01-16
US10/758,825 US7228724B2 (en) 2002-10-17 2004-01-16 Apparatus and process for sensing target gas species in semiconductor processing systems
US10/784,750 2004-02-23
US10/784,750 US20040163445A1 (en) 2002-10-17 2004-02-23 Apparatus and process for sensing fluoro species in semiconductor processing systems

Publications (2)

Publication Number Publication Date
WO2005072161A2 WO2005072161A2 (en) 2005-08-11
WO2005072161A3 true WO2005072161A3 (en) 2005-12-29

Family

ID=34830621

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/001409 WO2005072161A2 (en) 2004-01-16 2005-01-14 Apparatus and process for sensing target gas species in semiconductor processing systems

Country Status (5)

Country Link
EP (1) EP1714135A2 (en)
JP (1) JP2007519905A (en)
KR (1) KR20060127091A (en)
TW (1) TWI360152B (en)
WO (1) WO2005072161A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060211253A1 (en) * 2005-03-16 2006-09-21 Ing-Shin Chen Method and apparatus for monitoring plasma conditions in an etching plasma processing facility

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4662212A (en) * 1984-09-10 1987-05-05 Sumitomo Bakelite Company Limited Measuring instrument for concentration of gas
US5841017A (en) * 1996-03-25 1998-11-24 Cerberus Ag Photo-acoustic gas sensor
US6265222B1 (en) * 1999-01-15 2001-07-24 Dimeo, Jr. Frank Micro-machined thin film hydrogen gas sensor, and method of making and using the same
US6468642B1 (en) * 1995-10-03 2002-10-22 N.V. Bekaert S.A. Fluorine-doped diamond-like coatings
US6499354B1 (en) * 1998-05-04 2002-12-31 Integrated Sensing Systems (Issys), Inc. Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5784342A (en) * 1980-11-14 1982-05-26 Ricoh Co Ltd Manufacture of gas detection element
JPS63186136A (en) * 1987-01-28 1988-08-01 Nikon Corp Halogen sensor
JP2955583B2 (en) * 1990-01-23 1999-10-04 株式会社リケン Detection element for gas sensor
JP3078485B2 (en) * 1995-10-12 2000-08-21 リンナイ株式会社 Contact combustion type gas sensor
JP3857384B2 (en) * 1996-08-26 2006-12-13 グンゼ株式会社 Semiconductor gas sensor
US7080545B2 (en) * 2002-10-17 2006-07-25 Advanced Technology Materials, Inc. Apparatus and process for sensing fluoro species in semiconductor processing systems

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4662212A (en) * 1984-09-10 1987-05-05 Sumitomo Bakelite Company Limited Measuring instrument for concentration of gas
US6468642B1 (en) * 1995-10-03 2002-10-22 N.V. Bekaert S.A. Fluorine-doped diamond-like coatings
US5841017A (en) * 1996-03-25 1998-11-24 Cerberus Ag Photo-acoustic gas sensor
US6499354B1 (en) * 1998-05-04 2002-12-31 Integrated Sensing Systems (Issys), Inc. Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices
US6265222B1 (en) * 1999-01-15 2001-07-24 Dimeo, Jr. Frank Micro-machined thin film hydrogen gas sensor, and method of making and using the same

Also Published As

Publication number Publication date
WO2005072161A2 (en) 2005-08-11
TWI360152B (en) 2012-03-11
JP2007519905A (en) 2007-07-19
EP1714135A2 (en) 2006-10-25
KR20060127091A (en) 2006-12-11
TW200529289A (en) 2005-09-01

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