WO2005057625A3 - Method of differentially patterning layers of organic thin film material without damaging underlying layers - Google Patents

Method of differentially patterning layers of organic thin film material without damaging underlying layers Download PDF

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Publication number
WO2005057625A3
WO2005057625A3 PCT/US2004/040664 US2004040664W WO2005057625A3 WO 2005057625 A3 WO2005057625 A3 WO 2005057625A3 US 2004040664 W US2004040664 W US 2004040664W WO 2005057625 A3 WO2005057625 A3 WO 2005057625A3
Authority
WO
WIPO (PCT)
Prior art keywords
layers
layer
thin film
film material
organic thin
Prior art date
Application number
PCT/US2004/040664
Other languages
French (fr)
Other versions
WO2005057625A2 (en
WO2005057625B1 (en
Inventor
Chen-Hsiung Cheng
Xinbing Liu
Kazuo Nishimura
Original Assignee
Matsushita Electric Ind Co Ltd
Chen-Hsiung Cheng
Xinbing Liu
Kazuo Nishimura
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, Chen-Hsiung Cheng, Xinbing Liu, Kazuo Nishimura filed Critical Matsushita Electric Ind Co Ltd
Publication of WO2005057625A2 publication Critical patent/WO2005057625A2/en
Publication of WO2005057625A3 publication Critical patent/WO2005057625A3/en
Publication of WO2005057625B1 publication Critical patent/WO2005057625B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention is a method of differentially patterning layers organic thin film material without damaging underlying layers. More specifically, the invention is a method of patterning layers of organic thin film material such as OLEDs without damaging underlying layers by using an ultra-fast laser programmed with the appropriate wavelength (λ), pulse width (τ), spectral width (Δλ), spot size, repetition rate, bite size and power, all derived from examining each layer's absorption spectra, thermal, and chemical characteristics. The method of the present invention includes the steps of measuring each layer's absorption spectrum, examining each layer's thermal and chemical characteristics, determining if the layer ablatable, determining the laser setup, patterning the layer through laser ablation processing and determining if more layers need to be ablated.
PCT/US2004/040664 2003-12-04 2004-12-03 Method of differentially patterning layers of organic thin film material without damaging underlying layers WO2005057625A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52677903P 2003-12-04 2003-12-04
US60/526,779 2003-12-04

Publications (3)

Publication Number Publication Date
WO2005057625A2 WO2005057625A2 (en) 2005-06-23
WO2005057625A3 true WO2005057625A3 (en) 2005-12-01
WO2005057625B1 WO2005057625B1 (en) 2006-01-26

Family

ID=34676652

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/040664 WO2005057625A2 (en) 2003-12-04 2004-12-03 Method of differentially patterning layers of organic thin film material without damaging underlying layers

Country Status (1)

Country Link
WO (1) WO2005057625A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009103706A2 (en) * 2008-02-18 2009-08-27 The Technical University Of Denmark Method of thermocleaving a polymer layer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4925523A (en) * 1988-10-28 1990-05-15 International Business Machines Corporation Enhancement of ultraviolet laser ablation and etching organic solids
US5169678A (en) * 1989-12-26 1992-12-08 General Electric Company Laser ablatable polymer dielectrics and methods

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4925523A (en) * 1988-10-28 1990-05-15 International Business Machines Corporation Enhancement of ultraviolet laser ablation and etching organic solids
US5169678A (en) * 1989-12-26 1992-12-08 General Electric Company Laser ablatable polymer dielectrics and methods

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LEUNG ET AL.: "Noncontract Monitoring of Laser Ablation Using A miniature piezoelectric Probe to Detect Photoacoustic Pulses In air.", APPL.PHYS.LETT., vol. 60, no. 1, January 1992 (1992-01-01), pages 23 - 25, XP000257124 *

Also Published As

Publication number Publication date
WO2005057625A2 (en) 2005-06-23

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