WO2005038877A3 - MOLECULAR AIRBORNE CONTAMINANTS (MACs) REMOVAL AND WAFER SURFACE SUSTAINING SYSTEM AND METHOD - Google Patents

MOLECULAR AIRBORNE CONTAMINANTS (MACs) REMOVAL AND WAFER SURFACE SUSTAINING SYSTEM AND METHOD Download PDF

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Publication number
WO2005038877A3
WO2005038877A3 PCT/US2004/034175 US2004034175W WO2005038877A3 WO 2005038877 A3 WO2005038877 A3 WO 2005038877A3 US 2004034175 W US2004034175 W US 2004034175W WO 2005038877 A3 WO2005038877 A3 WO 2005038877A3
Authority
WO
WIPO (PCT)
Prior art keywords
macs
wafer surface
sub
wafer
removal
Prior art date
Application number
PCT/US2004/034175
Other languages
French (fr)
Other versions
WO2005038877A2 (en
Inventor
R Gregory Wolf
Michael Darwin
Original Assignee
Rudolph Technologies Inc
R Gregory Wolf
Michael Darwin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rudolph Technologies Inc, R Gregory Wolf, Michael Darwin filed Critical Rudolph Technologies Inc
Publication of WO2005038877A2 publication Critical patent/WO2005038877A2/en
Publication of WO2005038877A3 publication Critical patent/WO2005038877A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A MACs mitigation system includes a MACs film removal sub-system (14) and a wafer surface sustaining sub­system (16) for sustaining or maintaining the cleaned surface (I 8A) of a wafer (18) in a substantially MACs-free condition for some predetermined period of time, such as the typical amount of time required after MACs film removal to perform a desired measurement on the wafer using a metrology tool (12). The MACs film removal sub-system can comprise a source (14A) of microwave energy that beneficially both heats and dissociates the chemical constituents of the MACs film. The wafer surface sustaining sub-system can be co-located with a measurement stage portion of the metrology tool, and preferably includes an atmosphere provided by a source (20) of clean gas.
PCT/US2004/034175 2003-10-14 2004-10-14 MOLECULAR AIRBORNE CONTAMINANTS (MACs) REMOVAL AND WAFER SURFACE SUSTAINING SYSTEM AND METHOD WO2005038877A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51120903P 2003-10-14 2003-10-14
US60/511,209 2003-10-14

Publications (2)

Publication Number Publication Date
WO2005038877A2 WO2005038877A2 (en) 2005-04-28
WO2005038877A3 true WO2005038877A3 (en) 2009-04-09

Family

ID=34465197

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/034175 WO2005038877A2 (en) 2003-10-14 2004-10-14 MOLECULAR AIRBORNE CONTAMINANTS (MACs) REMOVAL AND WAFER SURFACE SUSTAINING SYSTEM AND METHOD

Country Status (2)

Country Link
US (1) US20050098264A1 (en)
WO (1) WO2005038877A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7771563B2 (en) * 2004-11-18 2010-08-10 Sumitomo Precision Products Co., Ltd. Systems and methods for achieving isothermal batch processing of substrates used for the production of micro-electro-mechanical-systems
US8232538B2 (en) * 2009-10-27 2012-07-31 Lam Research Corporation Method and apparatus of halogen removal using optimal ozone and UV exposure
US8525139B2 (en) * 2009-10-27 2013-09-03 Lam Research Corporation Method and apparatus of halogen removal
US8818754B2 (en) * 2011-04-22 2014-08-26 Nanometrics Incorporated Thin films and surface topography measurement using reduced library
EP2959504B1 (en) 2013-02-25 2018-07-04 Kla-Tencor Corporation Method and system for gas flow mitigation of molecular contamination of optics
PL3398709T3 (en) 2017-05-03 2021-06-28 Agathon AG, Maschinenfabrik Laser machining system with a thermo-concept
CN110220886A (en) * 2019-07-17 2019-09-10 南京信息工程大学 Coin discrimination system and application method based on laser induced breakdown spectroscopy

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5709754A (en) * 1995-12-29 1998-01-20 Micron Technology, Inc. Method and apparatus for removing photoresist using UV and ozone/oxygen mixture
WO2000019518A1 (en) * 1998-09-28 2000-04-06 Therma-Wave, Inc. Optical inspection equipment for semiconductor wafers with precleaning
US6296806B1 (en) * 1997-02-28 2001-10-02 Extraction Systems, Inc. Protection of semiconductor fabrication and similar sensitive processes
US6519045B2 (en) * 2001-01-31 2003-02-11 Rudolph Technologies, Inc. Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment
US6624393B2 (en) * 2000-02-07 2003-09-23 Therma-Wave, Inc. Method and apparatus for preparing semiconductor wafers for measurement

Family Cites Families (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2122040A (en) * 1936-10-10 1938-06-28 Fred J Machovec Step
US2436961A (en) * 1944-05-24 1948-03-02 Christopher K Gabriel Retractable vehicle step
US2487921A (en) * 1946-09-11 1949-11-15 Arthur N Torkelson Retractable step
US2575615A (en) * 1948-03-20 1951-11-20 Truk Step Company Inc Retractable step
US2764422A (en) * 1953-11-19 1956-09-25 Albert W Mcdonald Trailer step
US2925876A (en) * 1958-04-28 1960-02-23 John A Wagner Retractable vehicle steps
US3039562A (en) * 1959-11-06 1962-06-19 John A Wagner Retractable vehicle steps
US3095216A (en) * 1960-09-09 1963-06-25 Ford Motor Co Mechanical automatic step
US3172499A (en) * 1962-11-19 1965-03-09 Renna L Stairs Stowable vehicle step
US3528574A (en) * 1969-01-31 1970-09-15 Overhead Door Corp Vehicle cargo elevator and storing arrangement therefor
US3887217A (en) * 1972-06-23 1975-06-03 Walter W Thomas Retractable step for vehicles
US3833240A (en) * 1972-11-17 1974-09-03 R Weiler Retractable step for use with trailers, motor homes, or other vehicles
US3865399A (en) * 1973-10-23 1975-02-11 Lee V Way Auxiliary foldable step structure
US3889997A (en) * 1974-02-25 1975-06-17 Clarence E Schoneck Automatically operating truck end gate steps
US3957284A (en) * 1974-09-13 1976-05-18 The Boeing Company Movable steps for a transit vehicle
US3961809A (en) * 1975-02-06 1976-06-08 George Doyle Clugston Safety step for vehicles
US4073502A (en) * 1976-06-21 1978-02-14 Frank Raymond C Retractable step
US4020920A (en) * 1976-06-28 1977-05-03 Abbott John D Retractable transit coach step
US4110673A (en) * 1976-07-19 1978-08-29 Kwikee Enterprises, Inc. Extendable vehicle step and step motor control system
US4106790A (en) * 1977-04-06 1978-08-15 Blackstone Manufacturing Co., Inc. Vehicle step
US4116457A (en) * 1977-08-31 1978-09-26 Nerem Marvin E Step assembly for vehicle
FR2405849A1 (en) * 1977-10-13 1979-05-11 Faiveley Sa RETRACTABLE FOOTBOARD, ESPECIALLY FOR A RAILWAY CAR DOOR
US4174021A (en) * 1978-05-16 1979-11-13 Alnor Material Handling Limited Ladder truck
US4180143A (en) * 1978-07-21 1979-12-25 Clugston George D Step for vehicles
US4544887A (en) * 1982-10-21 1985-10-01 Gte Laboratories Incorporated Method of measuring photo-induced voltage at the surface of semiconductor materials
USD287001S (en) * 1984-04-10 1986-12-02 Hideaway Step, Inc. Electro-mechanical step unit for vehicles
US4623160A (en) * 1985-09-06 1986-11-18 Trudell Jerry W Extensible step assembly for vehicles
US4762768A (en) * 1986-01-29 1988-08-09 Macdermid, Incorporated Thermally stabilized photoresist images
US4720116A (en) * 1986-11-24 1988-01-19 Williams Michael G Storable stairway and platform apparatus for recreational vehicles
US4733752A (en) * 1987-07-14 1988-03-29 Sklar Robert Z Extensible ladder for boats
US5531857A (en) * 1988-07-08 1996-07-02 Cauldron Limited Partnership Removal of surface contaminants by irradiation from a high energy source
US5643472A (en) * 1988-07-08 1997-07-01 Cauldron Limited Partnership Selective removal of material by irradiation
US5099557A (en) * 1988-07-08 1992-03-31 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US5024968A (en) * 1988-07-08 1991-06-18 Engelsberg Audrey C Removal of surface contaminants by irradiation from a high-energy source
US4909700A (en) * 1989-02-03 1990-03-20 Invercan, Inc. Lift for wheelchairs
US4982974A (en) * 1989-02-03 1991-01-08 Interco Tire Corporation Adjustable high vehicle boarding step
US5166752A (en) * 1990-01-11 1992-11-24 Rudolph Research Corporation Simultaneous multiple angle/multiple wavelength ellipsometer and method
DE4016620A1 (en) * 1990-05-23 1991-11-28 Man Ghh Schienenverkehr MULTI-STAGE FOLDING STEP FOR TRACKED VEHICLES
US5199731A (en) * 1990-09-04 1993-04-06 Martin Samuel K Step assembly for vehicles
US5085450A (en) * 1990-12-13 1992-02-04 The Dometic Corporation Step stall prevention for vehicle steps
US5286049A (en) * 1991-10-09 1994-02-15 Flex-N-Gate Corporation Vehicle running board
US5462302A (en) * 1991-10-25 1995-10-31 Leitner; Horst Double swingarm front suspension for bicycles and motorcycles
US5333049A (en) * 1991-12-06 1994-07-26 Hughes Aircraft Company Apparatus and method for interferometrically measuring the thickness of thin films using full aperture irradiation
US5257847A (en) * 1992-07-10 1993-11-02 Pacific Auto Accessories, Inc. Shrouded truck step kit
US5261965A (en) * 1992-08-28 1993-11-16 Texas Instruments Incorporated Semiconductor wafer cleaning using condensed-phase processing
JP3227522B2 (en) * 1992-10-20 2001-11-12 株式会社日立製作所 Microwave plasma processing method and apparatus
US5284349A (en) * 1992-11-30 1994-02-08 May-Wes Manufacturing, Inc. Cab step assembly
US5375864A (en) * 1993-06-21 1994-12-27 Mcdaniel Manufacturing, Inc. Fold-down step for vehicles
US5538100A (en) * 1993-07-16 1996-07-23 Hedley; Robert I. Access device
US5505476A (en) * 1993-08-23 1996-04-09 Kwikee Products Co., Triple manual folding steps
US5474647A (en) * 1993-11-15 1995-12-12 Hughes Aircraft Company Wafer flow architecture for production wafer processing
US5601300A (en) * 1994-05-31 1997-02-11 Kenco/Williams, Inc. Vehicle frame mounting bracket system
US5547040A (en) * 1994-06-28 1996-08-20 Hwh Corporation Automatic step for recreational vehicles
US5661408A (en) * 1995-03-01 1997-08-26 Qc Solutions, Inc. Real-time in-line testing of semiconductor wafers
US6082751A (en) * 1996-04-23 2000-07-04 Hickory Springs Manufacturing Co. Step structure for recreational vehicles and the like
US5842709A (en) * 1996-10-16 1998-12-01 Kwikee Products Co., Inc. Retractable, swing down step assembly
KR200165343Y1 (en) * 1997-07-07 2000-01-15 이우영 Folding step
US5798837A (en) * 1997-07-11 1998-08-25 Therma-Wave, Inc. Thin film optical measurement system and method with calibrating ellipsometer
US5957237A (en) * 1997-12-11 1999-09-28 Specific Cruise Systems, Inc. Motorized collapsible step
US6325078B2 (en) * 1998-01-07 2001-12-04 Qc Solutions, Inc., Apparatus and method for rapid photo-thermal surface treatment
AU1957799A (en) * 1998-01-20 1999-08-09 Decoma International Inc. Modular power step
KR100339685B1 (en) * 1998-05-02 2002-10-25 삼성전자 주식회사 Apparatus for baking resist on semiconductor wafers
US6256097B1 (en) * 1999-01-08 2001-07-03 Rudolph Technologies, Inc. Ellipsometer and ellipsometry method
US6375207B1 (en) * 1999-02-22 2002-04-23 Decoma Exterior Trim Retractable running board
CA2362976C (en) * 1999-02-23 2008-04-29 Decoma Exterior Trim Inc. Modular power running board
US6213486B1 (en) * 1999-04-05 2001-04-10 Kwikee Products Co., Inc. Step assembly with concealed lower tread
US6885466B1 (en) * 1999-07-16 2005-04-26 Denso Corporation Method for measuring thickness of oxide film
US6270099B1 (en) * 1999-08-19 2001-08-07 Daniel G. Farkash Running board storage device
US6435534B1 (en) * 2000-06-29 2002-08-20 Harry W. Stone Side runner assembly for a vehicle having a dropping step
US6621582B2 (en) * 2000-09-11 2003-09-16 Rudolph Technologies, Inc. Optical metrology system and method employing laser-server supplying laser energy to distributed slave metrology heads
US6641158B2 (en) * 2001-02-15 2003-11-04 American Moto Products, Inc. Retractable vehicle step
US6834875B2 (en) * 2001-10-16 2004-12-28 American Moto Products, Inc. Retractable vehicle step
US6504618B2 (en) * 2001-03-21 2003-01-07 Rudolph Technologies, Inc. Method and apparatus for decreasing thermal loading and roughness sensitivity in a photoacoustic film thickness measurement system
US7113385B2 (en) * 2002-07-11 2006-09-26 Spb United, Inc. Method of controlling magnetic flux of electromagnet, and electromagnet implementing the same
US6955370B2 (en) * 2002-01-16 2005-10-18 Ventra Group Inc. Retractable running board
US6646752B2 (en) * 2002-02-22 2003-11-11 Taiwan Semiconductor Manufacturing Co. Ltd Method and apparatus for measuring thickness of a thin oxide layer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5709754A (en) * 1995-12-29 1998-01-20 Micron Technology, Inc. Method and apparatus for removing photoresist using UV and ozone/oxygen mixture
US6296806B1 (en) * 1997-02-28 2001-10-02 Extraction Systems, Inc. Protection of semiconductor fabrication and similar sensitive processes
WO2000019518A1 (en) * 1998-09-28 2000-04-06 Therma-Wave, Inc. Optical inspection equipment for semiconductor wafers with precleaning
US6624393B2 (en) * 2000-02-07 2003-09-23 Therma-Wave, Inc. Method and apparatus for preparing semiconductor wafers for measurement
US6519045B2 (en) * 2001-01-31 2003-02-11 Rudolph Technologies, Inc. Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment

Also Published As

Publication number Publication date
US20050098264A1 (en) 2005-05-12
WO2005038877A2 (en) 2005-04-28

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