WO2005011346A1 - Component support capable of being brazed by refusion - Google Patents

Component support capable of being brazed by refusion Download PDF

Info

Publication number
WO2005011346A1
WO2005011346A1 PCT/DE2004/000964 DE2004000964W WO2005011346A1 WO 2005011346 A1 WO2005011346 A1 WO 2005011346A1 DE 2004000964 W DE2004000964 W DE 2004000964W WO 2005011346 A1 WO2005011346 A1 WO 2005011346A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
solderable
area
carrier substrate
center
Prior art date
Application number
PCT/DE2004/000964
Other languages
German (de)
French (fr)
Inventor
Steffen Nahm
Original Assignee
Conti Temic Microelectronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic Gmbh filed Critical Conti Temic Microelectronic Gmbh
Priority to DE112004001679T priority Critical patent/DE112004001679D2/en
Publication of WO2005011346A1 publication Critical patent/WO2005011346A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the invention relates to a component carrier according to the preamble of claim 1.
  • the component carrier has a carrier substrate, for example a circuit board or foil carrier or ceramic substrate, on which components can be fastened by means of reflow soldering.
  • a carrier substrate for example a circuit board or foil carrier or ceramic substrate, on which components can be fastened by means of reflow soldering.
  • a solderable surface with a base area surrounding the solder center is formed on the surface of the carrier substrate around a predetermined solder center, the solderable surface being delimited by a metallization and / or solder resist.
  • carrier substrates with an organic protective layer are also known, this protective layer being passivated over the solderable area.
  • solder substance is applied to the solderable area, then the component is placed on it and the solder substance is then reflow soldered.
  • the reflow-solderable solder substance is applied in such a way that it completely covers the solderable surface and has overlap regions over regions of the surface of the carrier substrate which adjoin the solderable surface.
  • the overlap is necessary on the one hand to compensate for tolerances in production technology and also serves to provide a sufficient amount of solder substance, which is particularly important for the plug-in contacts in which the solder substance is to be drawn into the bore of the plug-in contact when heated by the capillary effect.
  • the solderable area around the solder center is usually circular or rectangular and is then covered by a strip of the solder substrate.
  • the area of the application of the solder substance is chosen to be large in relation to the base area of the solderable area, undesired accumulation of the solder in an area outside the solderable area can occur during reflow soldering.
  • the object of the invention is therefore to provide an improved component carrier and a
  • Fig. 2 top view of the circuit board according to Fig. after application of the solder substance before placing the component
  • FIG. 4 section through a soldered connection according to the prior art with a solderable area corresponding to the area of the solder substance;
  • FIG. 5 top view of the printed circuit board according to FIG.
  • Fig. 7 section through a solder joint according to the invention before soldering with a solderable surface with partial extension in the area overlapped by the solder substance
  • FIG. 8 top view of the circuit board according to Fig. 7 after the solder substance has been applied before the component is placed - the partial extension of the can be clearly seen.
  • solderable area Fig. 9 solder connection according to Fig. 7 after reflow soldering, one solder connection between each electrical component
  • FIG. 1 shows a section through a soldered connection of a component 2 on a printed circuit board 1 according to the prior art with a small solderable area 4 and one
  • solder paste is also applied outside the area to be soldered to the solder resist or the base material in order to provide a sufficient amount of solder substance, in particular for filling the bore 12, in which a connection pin 21 of the component 2 is inserted. Since the solder tries to form a ball when it melts, it can be clamped in as soon as the ball diameter exceeds the distance between the circuit board and the component. This leads to the solder tearing off and an unwanted solder ball 3a remaining under the component. This solder volume is missing in the area to be soldered in order to form a reliable solder joint 3b in comparison to a proper solder joint, cf. 3c.
  • the component carrier consisting of a carrier substrate 1 and a solderable surface 4, which in turn consists of a base area 4a around the solder center and at least a partial, i.e. local extension from the solder center to the outside in the area , which is subsequently overlapped over a large area by the solder substance, cf. 8 in plan view of the carrier substrate, here as printed circuit board 1, two solder connection points being planned, of which one solderable surface is already covered with the solder substance and the solderable surface has been indicated below, while the right surface is still free and the here circular base area A4a and in the direction of the later strip-shaped
  • the solder substrate 3 is applied as an approximately rectangular surface A3 on the solderable surface, the surface of the solder substrate A3 being at least in one direction significantly larger than the base surface 4a of the solderable surface and a partial extension 4b being arranged at least in this direction ,
  • the direction of the overlap region is generally determined in terms of production technology by the position of other solder contacts, as is shown here in the figures by the two solder contacts, and is also preferably aligned with the directions of movement of the devices for applying the solder substance parallel to the outer edges of the carrier substrate.
  • the overprinted solderable surface is thus partially lengthened into the areas in which accumulations or solder beads form when the solder is melted.
  • the solder thus flows over the extended area into the solder point.
  • the solder remaining on the solderable area can be removed via the
  • the geometry and size of the extension are set so that there is no relevant negative influence on the formation of the solder joint.
  • the geometry and shape of the partial extension can be varied depending on the application (e.g. angular, pointed, square, hemispherical, etc.).

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention concerns a component support capable of being brazed by refusion, comprising a support substrate (1) whereon components can be fixed by refusion brazing. Therefor, a surface (4) capable of being brazed is formed on the surface of said support substrate, about a predetermined brazing center, said surface (4) including a base surface (4a) surrounding the brazing center. A brazing substance (3), capable of being subjected to refusion, is applied on the support substrate so that it covers entirely the surface (4) capable of being brazed and has overlapping zones (A3>A4) above certain zones of the surface of the support substrate (1) adjacent to said surface capable of being brazed. Said surface (4) has at least one partial extension (4b) which locally extends the base surface (4a) from the brazing center towards the overlapping zones and thereby provides, during refusion of the brazing substance, a build-up of brazing metal inside the brazing center.

Description

Reflowlötbarer Bauelementeträger Reflow solderable component carrier
Die Erfindung betrifft einen Bauelementeträger gemäß dem Oberbegriff des Anspruchs 1.The invention relates to a component carrier according to the preamble of claim 1.
Der Bauelementeträger weist ein Trägersubstrat, bspw. ein Leiterplatten- oder Folien- träger- oder Keramiksubstrat auf, auf welchem Bauelemente mittels Reflowlötens befestigbar sind. Auf der Oberfläche des Trägersubstrats ist dazu um ein vorgegebenes Lotzentrum eine lötbare Fläche mit einer das Lotzentrum umgebenden Grundfläche ausgebildet, wobei die lötbare Fläche durch eine Metallisierung und/oder Lötstoplack begrenzt wird. Alternativ sind auch Trägersubstrate mit einer organischen Schutzschicht bekannt, wobei diese Schutzschicht über der lötbaren Fläche passiviert ist.The component carrier has a carrier substrate, for example a circuit board or foil carrier or ceramic substrate, on which components can be fastened by means of reflow soldering. For this purpose, a solderable surface with a base area surrounding the solder center is formed on the surface of the carrier substrate around a predetermined solder center, the solderable surface being delimited by a metallization and / or solder resist. Alternatively, carrier substrates with an organic protective layer are also known, this protective layer being passivated over the solderable area.
Auf der lötbaren Fläche wird eine Lotsubstanz aufgebracht, nachfolgend das Bauelement aufgesetzt und die Lotsubstanz danach reflowgelötet.A solder substance is applied to the solderable area, then the component is placed on it and the solder substance is then reflow soldered.
Die reflowlötfähige Lotsubstanz wird dabei derart aufgebracht, dass sie die lötbare Fläche vollständig abdeckt und Überlappungsbereiche über an die lötbare Fläche angrenzende Bereiche der Oberfläche des Trägersubstats aufweist. Die Überlappung ist zum einen zum Ausgleich produktionstechnischer Toleranzen erforderlich und dient zudem dazu, eine ausreichende Menge Lotsubstanz bereitzustellen, was insbesondere für die Durch- steckkontaktierungen wichtig ist, bei denen die Lotsubstanz beim Erhitzen durch den Kapillareffekt in die Bohrung der Durchsteckkontaktierung gezogen werden soll. Die lötbare Fläche ist um das Lotzentrum herum meist kreisförmig oder rechteckig ausgebildet und wird dann durch einen Streifen des Lotsubstrats überdeckt. Wird Fläche des Auftrags der Lotsubstanz dabei im Verhältnis zur Grundfläche der lötbaren Fläche groß gewählt, kann es beim Reflowlöten zu einer unerwünschten Ansammlung des Lots in einem Bereich außerhalb der lötbaren Fläche kommen. Wird bei gleich großer Fläche und damit Menge des Auftrags der Lotsubstanz andererseits die Grundfläche der lötbarenThe reflow-solderable solder substance is applied in such a way that it completely covers the solderable surface and has overlap regions over regions of the surface of the carrier substrate which adjoin the solderable surface. The overlap is necessary on the one hand to compensate for tolerances in production technology and also serves to provide a sufficient amount of solder substance, which is particularly important for the plug-in contacts in which the solder substance is to be drawn into the bore of the plug-in contact when heated by the capillary effect. The solderable area around the solder center is usually circular or rectangular and is then covered by a strip of the solder substrate. If the area of the application of the solder substance is chosen to be large in relation to the base area of the solderable area, undesired accumulation of the solder in an area outside the solderable area can occur during reflow soldering. On the other hand, with the same area and thus the amount of the solder substance applied, the base area of the solderable
Fläche bis annähernd auf die Größe der Fläche des Auftrags der Lotsubstanz ausgedehnt, liegt zwar die Ansammlung des Lots immer im Bereich der lötbaren Fläche, jedoch dennoch zum Teil nicht im Lotzentrum. Dies ist aber ebenfalls für die elektrische oder mechanische Belastbarkeit der Lötstelle negativ. Aufgabe der Erfindung ist es daher, einen verbesserten Bauelementeträger sowie einThe area of the solder is always in the area of the solderable area, but it is partly not in the solder center, extending to approximately the size of the area of the application of the solder substance. However, this is also negative for the electrical or mechanical strength of the solder joint. The object of the invention is therefore to provide an improved component carrier and a
Verfahren zum Reflowlöten vorzustellen, welcher eine Ansammlung der Lotsubstanz im Lotzentrum sicherstellt. Diese Aufgabe wird durch die Merkmale des Anspruchs 1 bzw. durch das Verfahren nach Anspruch 6 gelöst. Vorteilhafte Weiterbildungen sind den Unteransprüchen zu entnehmen. Die Erfindung wird nachfolgend anhand von Ausführungsbeispielen und Figuren näher erläutert. Kurze Beschreibung der Figuren: FigJ Schnitt durch eine Lötverbindung nach dem Stand der Technik mit einer kleinen lötbaren Fläche und einer Überlappung der Lotsubstanz in den nicht lötbaren Bereich vor dem LötenTo introduce methods for reflow soldering, which ensures that the solder substance accumulates in the solder center. This object is achieved by the features of claim 1 and by the method according to claim 6. Advantageous further developments can be found in the subclaims. The invention is explained in more detail below on the basis of exemplary embodiments and figures. Brief description of the figures: FigJ section through a solder joint according to the prior art with a small solderable area and an overlap of the solder substance in the non-solderable area before soldering
Fig.2 Draufsicht auf die Leiterplatte nach Fig. . nach Aufbringen der Lotsubstanz vor dem Aufsetzen des BauelementsFig. 2 top view of the circuit board according to Fig. after application of the solder substance before placing the component
Fig.3 Lötverbindung nach Fig. . nach dem Reflowlöten mit Ansammlung von Lot im nicht lötbaren BereichFig. 3 solder connection according to Fig. after reflow soldering with accumulation of solder in the non-solderable area
Fig.4 Schnitt durch eine Lötverbindung nach dem Stand der Technik mit einer der Fläche Lotsubstanz entsprechend großen lötbaren Fläche Fig.5 Draufsicht auf die Leiterplatte nach Fig.4 nach Aufbringen der Lotsubstanz vor dem Aufsetzen des Bauelements4 section through a soldered connection according to the prior art with a solderable area corresponding to the area of the solder substance; FIG. 5 top view of the printed circuit board according to FIG
Fig.6 Lötverbindung nach Fig.4 nach dem Reflowlöten mit Ansammlung von Lot außerhalb des LotzentrumsFig. 6 solder connection according to Fig. 4 after reflow soldering with accumulation of solder outside the solder center
Fig.7 Schnitt durch eine erfindungsgemäße Lötverbindung vor dem Löten mit einer lötbaren Fläche mit partieller Verlängerung in den von der Lotsubstanz überlappten BereichFig. 7 section through a solder joint according to the invention before soldering with a solderable surface with partial extension in the area overlapped by the solder substance
Fig.8 Draufsicht auf die Leiterplatte nach Fig.7 nach Aufbringen der Lotsubstanz vor dem Aufsetzen des Bauelements - deutlich erkennbar die partielle Verlängerung der. lötbaren Fläche Fig.9 Lötverbindung nach Fig.7 nach dem Reflowlöten jeweils eine Lötverbindung zwischen einem elektrischen BauelementFig. 8 top view of the circuit board according to Fig. 7 after the solder substance has been applied before the component is placed - the partial extension of the can be clearly seen. solderable area Fig. 9 solder connection according to Fig. 7 after reflow soldering, one solder connection between each electrical component
Die Fig.1 bis 3 und 4 bis 6 zeigen im Stand der Technik bisher realisierte Lösungen, an denen das technische Problem kurz beschrieben werden soll.1 to 3 and 4 to 6 show solutions which have been implemented in the prior art and in which the technical problem is to be briefly described.
So zeigt Fig.1 einen Schnitt durch eine Lötverbindung eines Bauelements 2 auf einer Leiterplatte 1 nach dem Stand der Technik mit einer kleinen lötbaren Fläche 4 und einer1 shows a section through a soldered connection of a component 2 on a printed circuit board 1 according to the prior art with a small solderable area 4 and one
Überlappung der Lotsubstanz 3 in den nicht lötbaren Bereich vor dem Löten. Hierbei wird die Lotpaste auch außerhalb des zu lötenden Bereichs auf den Lötstopplack oder das Basismaterial aufgetragen, um eine ausreichende Menge Lotsubstanz bereitzustellen, insbesondere für das Auffüllen der Bohrung 12, in der ein Anschlusspin 21 des Bauelements 2 eingeführt ist. Da das Lot beim Aufschmelzen versucht eine Kugel zu bilden, kann es, sobald der Kugeldurchmesser den Abstand zwischen Leiterplatte und Bauelement übersteigt, eingeklemmt werden. Das führt zum Lotabriss und Verbleiben einer ungewollten Lotkugel 3a unter dem Bauteil. Dieses Lotvolumen fehlt im zu lötenden Bereich zur Ausbildung einer zuverlässigen Lötstelle 3b im Vergleich zu einer ordnungsgemäßen Lotstelle, vgl. 3c.Overlap of the solder substance 3 in the non-solderable area before soldering. Here, the solder paste is also applied outside the area to be soldered to the solder resist or the base material in order to provide a sufficient amount of solder substance, in particular for filling the bore 12, in which a connection pin 21 of the component 2 is inserted. Since the solder tries to form a ball when it melts, it can be clamped in as soon as the ball diameter exceeds the distance between the circuit board and the component. This leads to the solder tearing off and an unwanted solder ball 3a remaining under the component. This solder volume is missing in the area to be soldered in order to form a reliable solder joint 3b in comparison to a proper solder joint, cf. 3c.
Die Fig. 4 bis 6 zeigen die Ausführung, bei der die Leiterplatte 1 mit einer lötbaren Fläche A4 unter der gesamten Lotpastenfläche A3 « A4, wobei die Größe der Fläche der Lotsubstanz 3 und damit das Lotmengenvolumen im vergleich zu den FigJ bis 3 annähernd gleich bleibt. Hierdurch wird zwar die Separation des Lotes zu einer nicht an die zu lötende Fläche angebundenen Kugel vermieden, jedoch ist hierbei keine gezielte Lotführung gewährleistet. Das bedeutet, der Anteil des in die Durchkontaktierung/ Lötstelle abfließenden Lotes kann stark variieren. Somit kann eine gleichmäßige und zuverlässige Ausbildung der Lötstelle nicht gewährleistet werden. Es können größere Lötmengen außerhalb des Lotzentrum erstarren, vgl. 3d, so dass die Lotmenge 3b im Lotzentrum unzureichend ist, um das Bauelement mechanisch stabil mit der Leiterplatte 1 zu verbinden. Auch die Stromleitfähigkeit insbesondere bei höheren Lastströmen ist herabgesetzt und insbesondere die Baugruppe ausfallträchtig.4 to 6 show the embodiment in which the circuit board 1 with a solderable area A4 under the entire solder paste area A3 «A4, the size of the The area of the solder substance 3 and thus the volume of solder quantity remains approximately the same in comparison to FIGS. 3 to 3. In this way, the separation of the solder into a ball that is not connected to the surface to be soldered is avoided, but no targeted solder guidance is guaranteed. This means that the proportion of the solder flowing into the via / solder joint can vary widely. A uniform and reliable formation of the solder joint cannot therefore be guaranteed. Larger quantities of solder can solidify outside the solder center, cf. 3d, so that the amount of solder 3b in the solder center is insufficient to mechanically stably connect the component to the circuit board 1. The current conductivity, in particular with higher load currents, is also reduced and, in particular, the module is prone to failure.
Die Fig. 7 bis 9 zeigen nun den erfindungsgemäßen Bauelementeträger, bestehend aus einer Trägersubstrat 1 und einer lötbaren Fläche 4, die wiederum bestehend aus einer Grundfläche 4a um das Lotzentrum herum sowie zumindest einer partiellen, also lokalen Verlängerung vom Lotzentrum nach außen gerichtet in den Bereich, der nachfolgend von der Lotsubstanz großflächig überlappt wird, vgl. insbesondere Fig. 8 in der Draufsicht auf das Trägersubstrat, hier als Leiterplatte 1 , wobei zwei Lötverbindungspunkte geplant sind, von denen eine lötbare Fläche bereits mit der Lotsubstanz abgedeckt ist und die lötbare Fläche darunter angedeutet wurde, während die rechte Fläche noch frei ist und die hier kreisförmige Grundfläche A4a und die in Richtung des späteren streifenförmigen7 to 9 now show the component carrier according to the invention, consisting of a carrier substrate 1 and a solderable surface 4, which in turn consists of a base area 4a around the solder center and at least a partial, i.e. local extension from the solder center to the outside in the area , which is subsequently overlapped over a large area by the solder substance, cf. 8 in plan view of the carrier substrate, here as printed circuit board 1, two solder connection points being planned, of which one solderable surface is already covered with the solder substance and the solderable surface has been indicated below, while the right surface is still free and the here circular base area A4a and in the direction of the later strip-shaped
Überlappungsbereichs die hier gepunktet hervorgehobene partielle Verlängerung erkennbar ist.Overlap area, the partial extension highlighted here with dots can be seen.
Bei diesem Bauelementeträger wird das Lotsubstrat 3 als eine näherungsweise rechteckige Fläche A3 auf der lötbaren Fläche aufgebracht, wobei die Fläche des Lotsubstrats A3 zumindest in eine Richtung deutlich größer als die Grundfläche 4a der lötbaren Fläche ist und zumindest in diese Richtung eine partielle Verlängerung 4b angeordnet ist. Die Richtung des Überlappungsbereichs ist dabei in der Regel fertigungstechnisch durch die Position anderer Lötkoπtakte bestimmt, wie hier in den Figuren durch die zwei Lötkontakte deutlich wird, und zudem an den Bewegungsrichtungen der Vorrichtungen zum Aufbringen der Lotsubstanz vorzugsweise parallel zu den Außenkanten des Trägersubstrats ausgerichtet.In this component carrier, the solder substrate 3 is applied as an approximately rectangular surface A3 on the solderable surface, the surface of the solder substrate A3 being at least in one direction significantly larger than the base surface 4a of the solderable surface and a partial extension 4b being arranged at least in this direction , The direction of the overlap region is generally determined in terms of production technology by the position of other solder contacts, as is shown here in the figures by the two solder contacts, and is also preferably aligned with the directions of movement of the devices for applying the solder substance parallel to the outer edges of the carrier substrate.
Es erfolgt also ein partielles Verlängern der überdruckten lötbaren Fläche in die Bereiche, in denen sich beim Umschmelzen des Lotes Anhäufungen oder Lotperlen bilden. Somit fließt das Lot über den verlängerten Bereich in die Lotstelle ab. Das auf der lötbaren Fläche verbleibende Lot kann über dieThe overprinted solderable surface is thus partially lengthened into the areas in which accumulations or solder beads form when the solder is melted. The solder thus flows over the extended area into the solder point. The solder remaining on the solderable area can be removed via the
Geometrie und Größe der Verlängerung so eingestellt werden, dass kein relevant negativer Einfluss auf die Ausbildung der Lötstelle entsteht. Die Geometrie und Form der partiellen Verlängerung kann je nach Anwendungsfall variiert werden (z.B. eckig, spitz, quadratisch, halbkugelförmig etc.). The geometry and size of the extension are set so that there is no relevant negative influence on the formation of the solder joint. The geometry and shape of the partial extension can be varied depending on the application (e.g. angular, pointed, square, hemispherical, etc.).

Claims

Patentansprüche claims
1) Bauelementeträger mit einem Trägersubstrat (1 ), auf dem Bauelemente (2) mittels Reflowlötens befestigbar sind und auf der Oberfläche des Trägersubstrats dazu um ein vorgegebenes Lotzentrum eine lötbare Fläche (4) mit einer das Lotzentrum umgebenden Grundfläche (4a) ausgebildet ist, wobei auf das Trägersubstrat eine reflowlötfähige Lotsubstanz (3) derart aufgebracht wird, dass sie die lötbare Fläche (4) vollständig abdeckt und Überlappungsbereiche über an die lötbare Fläche angrenzende Bereiche der Oberfläche des Trägersubstrats (1) aufweist (A3>A4), dadurch gekennzeichnet, dass die lötbare Fläche (4) zumindest eine partielle Verlängerung (4b) aufweist, welche die Grundfläche (4a) vom Lotzentrum aus in Richtung der Überlappungsbereiche lokal verlängert.1) Component carrier with a carrier substrate (1), on which components (2) can be fastened by reflow soldering, and a solderable surface (4) with a base area (4a) surrounding the solder center is formed on the surface of the carrier substrate for this purpose a reflow-solderable solder substance (3) is applied to the carrier substrate in such a way that it completely covers the solderable surface (4) and has overlap regions over regions of the surface of the carrier substrate (1) adjacent to the solderable surface (A3> A4), characterized in that the solderable area (4) has at least one partial extension (4b) which locally extends the base area (4a) from the solder center in the direction of the overlap areas.
2) Bauelementeträger nach Anspruch 1 , dadurch gekennzeichnet, dass das Trägersubstrat (1) zumindest eine Bohrung (12) zur Durchkontaktierung des Bauelements (2) aufweist und um die Bohrung (12) konzentrisch eine Grundfläche (4a) der lötbaren Fläche angeordnet ist und die lötbare Fläche zumindest eine radial von der Grundfläche (4a) nach außen in den Überlappungsbereich gerichtete partielle Verlängerung (4b) aufweist.2) component carrier according to claim 1, characterized in that the carrier substrate (1) has at least one bore (12) for through-contacting the component (2) and around the bore (12) a base surface (4a) of the solderable surface is arranged concentrically and the solderable surface has at least one partial extension (4b) directed radially from the base surface (4a) outward into the overlap region.
3) Bauelementeträger nach Anspruch 2, dadurch gekennzeichnet, dass das Lotsubstrat (3) als Fläche (A3) auf der lötbaren Fläche aufgebracht wird, die Fläche des Lotsubstrats (A3) zumindest in eine Richtung deutlich größer als die Grundfläche (4a) der lötbaren Fläche ist und zumindest in diese Richtung eine partielle Verlängerung (4b) angeordnet ist.3) component carrier according to claim 2, characterized in that the solder substrate (3) is applied as a surface (A3) on the solderable surface, the surface of the solder substrate (A3) at least in one direction significantly larger than the base surface (4a) of the solderable surface and a partial extension (4b) is arranged at least in this direction.
4) Bauelementeträger nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die lötbare Fläche (4) metallisiert und das Trägersubstrat in den an die lötbare Fläche angrenzenden Bereichen mit einem Lötstoplack versehen ist.4) component carrier according to one of the preceding claims, characterized in that the solderable surface (4) metallized and the carrier substrate is provided in the areas adjacent to the solderable surface with a solder resist.
5) Bauelementeträger nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass das Trägersubstrat (1) mit einer organischen Schutzschicht überzogen ist und diese Schutzschicht über der lötbaren Fläche (4) passiviert ist. ) Verfahren zum Reflowlöten von Bauelementen (2) auf einem Bauelementeträger, wobei auf der Oberfläche des Trägersubstrats (1 ) dazu um ein vorgegebenes Lotzentrum eine lötbare Fläche (4) mit einer das Lotzentrum umgebenden Grundfläche ausgebildet wird und auf das Trägersubstrat (1) eine reflowlötfähige Lotsubstanz (3) derart aufgebracht wird, dass sie die lötbare Fläche vollständig abdeckt und Überlappungsbereiche über an die lötbare Fläche angrenzende Bereiche der Oberfläche des Trägersubstrats (1) aufweist, dadurch gekennzeichnet, dass die Grundfläche (4a) der lötbare Fläche vom Lotzentrum aus in Richtung der Überlappungsbereiche lokal verlängert (4b) wird. 5) component carrier according to one of the preceding claims, characterized in that the carrier substrate (1) is coated with an organic protective layer and this protective layer is passivated over the solderable surface (4). ) Method for reflow soldering of components (2) on a component carrier, a solderable surface (4) with a base area surrounding the solder center being formed around a predetermined solder center on the surface of the carrier substrate (1) and a reflow solderable on the carrier substrate (1) Solder substance (3) is applied in such a way that it completely covers the solderable area and has overlapping areas over areas of the surface of the carrier substrate (1) adjacent to the solderable area, characterized in that the base area (4a) of the solderable area extends from the solder center in the direction the overlap areas is extended locally (4b).
PCT/DE2004/000964 2003-07-09 2004-05-08 Component support capable of being brazed by refusion WO2005011346A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112004001679T DE112004001679D2 (en) 2003-07-09 2004-05-08 Reflow solderable component carrier

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10331008A DE10331008A1 (en) 2003-07-09 2003-07-09 Reflow solderable component carrier
DE10331008.8 2003-07-09

Publications (1)

Publication Number Publication Date
WO2005011346A1 true WO2005011346A1 (en) 2005-02-03

Family

ID=33560000

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2004/000964 WO2005011346A1 (en) 2003-07-09 2004-05-08 Component support capable of being brazed by refusion

Country Status (2)

Country Link
DE (2) DE10331008A1 (en)
WO (1) WO2005011346A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007039612A1 (en) * 2007-08-22 2009-02-26 Continental Automotive Gmbh Method for populating electrical components provided with pins on a printed circuit board
AT515446B1 (en) * 2014-03-07 2019-12-15 Zkw Group Gmbh Structuring the solder mask of printed circuit boards to improve the soldering results

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0263943A1 (en) * 1986-09-15 1988-04-20 International Business Machines Corporation A method of soldering leaded and surface-mountable components to a printed circuit board
US5129573A (en) * 1991-10-25 1992-07-14 Compaq Computer Corporation Method for attaching through-hole devices to a circuit board using solder paste
US6081998A (en) * 1997-10-03 2000-07-04 Fujitsu Limited Method of surface mounting a connector
EP1032249A1 (en) * 1999-02-26 2000-08-30 Canon Kabushiki Kaisha Electronic circuit board and soldering method therefor
US6292372B1 (en) * 1999-07-15 2001-09-18 Lucent Technologies, Inc. Solder thieving pad for wave soldered through-hole components

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19738399A1 (en) * 1997-09-03 1999-03-04 Bosch Gmbh Robert Method for connecting electronic components to a carrier substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0263943A1 (en) * 1986-09-15 1988-04-20 International Business Machines Corporation A method of soldering leaded and surface-mountable components to a printed circuit board
US5129573A (en) * 1991-10-25 1992-07-14 Compaq Computer Corporation Method for attaching through-hole devices to a circuit board using solder paste
US6081998A (en) * 1997-10-03 2000-07-04 Fujitsu Limited Method of surface mounting a connector
EP1032249A1 (en) * 1999-02-26 2000-08-30 Canon Kabushiki Kaisha Electronic circuit board and soldering method therefor
US6292372B1 (en) * 1999-07-15 2001-09-18 Lucent Technologies, Inc. Solder thieving pad for wave soldered through-hole components

Also Published As

Publication number Publication date
DE10331008A1 (en) 2005-02-03
DE112004001679D2 (en) 2006-05-18

Similar Documents

Publication Publication Date Title
DE1952569A1 (en) Carrier for electrical components and integrated circuits
AT515071B1 (en) Method for positionally stable soldering
DE19704930B4 (en) Surface mount connectors that promote capillary action
EP1700516B1 (en) Arrangement with a contact element
EP0613331B1 (en) Method of attaching a hybrid circuit on a pcb
DE102006035528A1 (en) Method and wave soldering system for soldering components on the top and bottom of a printed circuit board
EP2609653B1 (en) Device comprising a housing with a circuit carrier
DE10045534A1 (en) Electronic component has capillary elements as connection elements, which are connected with contact areas of a carrier
WO2005011346A1 (en) Component support capable of being brazed by refusion
DE19903957A1 (en) Solder removal from a circuit board, especially after desoldering of defective ball grid array, flip-chip and chip-scale package components, comprises molten solder displacement from solder regions using a slide or stamp element
WO2021219800A1 (en) Barrier for preventing smt components from drifting
DE4310930A1 (en) Printed circuit board arrangement and method for producing an assembled printed circuit board
DE102005036563B4 (en) Electronic component
EP3200568B1 (en) Battery bridge and method for activating an electronic device
DE102019129971A1 (en) Method for soldering a component onto a printed circuit board, electronic unit and field device in automation technology
DE2812767A1 (en) Ceramic capacitor with lead wires for circuit board insertion - has annular beads on lead wires with notches on side facing circuit board
DE102019132852B4 (en) Method for producing a conductor structure element and conductor structure element
DE19963108C1 (en) Method for producing a solder connection and circuit with such a solder connection
DE10057606B4 (en) Arrangement for connecting the ferrite core of a planar transformer to ground
DE4221478C2 (en) Device for soldering on printed circuit boards
DE19802580A1 (en) Electric circuit board with panel
EP0413961A1 (en) Contact element for printed circuit board
DE10201209B4 (en) Lotformteil and method for equipping the same
EP0392151A2 (en) Stamping foil for applying conductive tracks to rigid or plastic supports
EP3668284A1 (en) Circuit board and method for manufacturing a circuit board

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DPEN Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1120040016797

Country of ref document: DE

REF Corresponds to

Ref document number: 112004001679

Country of ref document: DE

Date of ref document: 20060518

Kind code of ref document: P

WWE Wipo information: entry into national phase

Ref document number: 112004001679

Country of ref document: DE

122 Ep: pct application non-entry in european phase