WO2004114365A3 - Lost cost chip carrier manufactured from conductive loaded resin-based material - Google Patents

Lost cost chip carrier manufactured from conductive loaded resin-based material Download PDF

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Publication number
WO2004114365A3
WO2004114365A3 PCT/US2004/011694 US2004011694W WO2004114365A3 WO 2004114365 A3 WO2004114365 A3 WO 2004114365A3 US 2004011694 W US2004011694 W US 2004011694W WO 2004114365 A3 WO2004114365 A3 WO 2004114365A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
fiber
based material
loaded resin
chip carrier
Prior art date
Application number
PCT/US2004/011694
Other languages
French (fr)
Other versions
WO2004114365A2 (en
Inventor
Thomas Aisenbrey
Thor Arne Larsen
Original Assignee
Integral Technologies Inc
Thomas Aisenbrey
Thor Arne Larsen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integral Technologies Inc, Thomas Aisenbrey, Thor Arne Larsen filed Critical Integral Technologies Inc
Publication of WO2004114365A2 publication Critical patent/WO2004114365A2/en
Publication of WO2004114365A3 publication Critical patent/WO2004114365A3/en

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    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

Chip carrier with integrated functions such as antennas, EMI shields, and heat sinks are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based integrated chip carrier functions can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the integrated chip carrier functions can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.
PCT/US2004/011694 2003-06-16 2004-04-15 Lost cost chip carrier manufactured from conductive loaded resin-based material WO2004114365A2 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US47875303P 2003-06-16 2003-06-16
US60/478,753 2003-06-16
US50979103P 2003-10-09 2003-10-09
US60/509,791 2003-10-09
US51235203P 2003-10-17 2003-10-17
US60/512,352 2003-10-17
US51902003P 2003-11-10 2003-11-10
US60/519,020 2003-11-10
US51967303P 2003-11-13 2003-11-13
US60/519,673 2003-11-13

Publications (2)

Publication Number Publication Date
WO2004114365A2 WO2004114365A2 (en) 2004-12-29
WO2004114365A3 true WO2004114365A3 (en) 2005-08-04

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PCT/US2004/011694 WO2004114365A2 (en) 2003-06-16 2004-04-15 Lost cost chip carrier manufactured from conductive loaded resin-based material

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006023123B4 (en) 2005-06-01 2011-01-13 Infineon Technologies Ag Distance detection radar for vehicles with a semiconductor module with components for high frequency technology in plastic housing and method for producing a semiconductor module with components for a distance detection radar for vehicles in a plastic housing
CN100405886C (en) * 2007-05-22 2008-07-23 北京理工大学 Polyethylene composite film for shielding wideband electromagnetic wave and its preparing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6448635B1 (en) * 1999-08-30 2002-09-10 Amkor Technology, Inc. Surface acoustical wave flip chip
US6534861B1 (en) * 1999-11-15 2003-03-18 Substrate Technologies Incorporated Ball grid substrate for lead-on-chip semiconductor package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6448635B1 (en) * 1999-08-30 2002-09-10 Amkor Technology, Inc. Surface acoustical wave flip chip
US6534861B1 (en) * 1999-11-15 2003-03-18 Substrate Technologies Incorporated Ball grid substrate for lead-on-chip semiconductor package

Also Published As

Publication number Publication date
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