WO2004107437A1 - Image sensing module and method for constructing the same - Google Patents

Image sensing module and method for constructing the same Download PDF

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Publication number
WO2004107437A1
WO2004107437A1 PCT/SG2004/000132 SG2004000132W WO2004107437A1 WO 2004107437 A1 WO2004107437 A1 WO 2004107437A1 SG 2004000132 W SG2004000132 W SG 2004000132W WO 2004107437 A1 WO2004107437 A1 WO 2004107437A1
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WO
WIPO (PCT)
Prior art keywords
lens
lens holder
holder extension
base section
molded housing
Prior art date
Application number
PCT/SG2004/000132
Other languages
French (fr)
Inventor
Teck Lee Chee
Chee Wee Ang
Original Assignee
Valen Technologies (S) Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valen Technologies (S) Pte Ltd filed Critical Valen Technologies (S) Pte Ltd
Publication of WO2004107437A1 publication Critical patent/WO2004107437A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Definitions

  • the present invention is related to an image sensing module and the method of
  • the image sensor can receive light beam transmitted by the image and convert
  • An image sensing module typically includes a package with a transparent
  • the image sensor positioned over the transparent window for focusing light onto the image sensor.
  • lens assembly requires sub-components to assemble and additional handling steps.
  • Weber discloses an image sensor package that includes an image sensor, a window, and a molding
  • the molding has a lens holder extension portion extending upwards from the
  • the lens holder extension portion includes a female threaded aperture
  • joining step is required to fix the molding to a substrate and a window has to be molded
  • the present invention provides an imaging sensing module that includes a
  • premolded package with an integral lens holder, an image sensor and an optical lens.
  • the premolded package includes a molded housing having an integral lens holder
  • the image sensor is fastened to the base section of the molded housing and
  • the optical lens is attached to the lens holder extension.
  • the present invention also provides a method of forming the image sensor
  • a raw lead frame is inserted into a molding tool, and injection molding is performed so as to
  • Another aspect of the present invention is a method of forming a plurality of
  • FIG. 1 shows the isometric view of the premolded package with an integral lens
  • FIG. 2 shows the cross-sectional view of the image-sensing module according to
  • FIG. 3 illustrates the method of constructing the image sensing module according
  • the present invention provides an imaging sensing module that includes a
  • FIG. 1 shows the
  • the premolded package includes a molded housing 2 with an integral lens holder according to the preferred embodiment of the present invention.
  • the premolded package includes a molded housing 2 with an
  • integral lens holder extension 3 The molded housing 2 with the integral lens holder
  • extension 3 is a one-piece molded part.
  • a raw lead frame with wire leads 5 is partially
  • FIG. 2 shows the cross-sectional view of an image sensing module that
  • An image sensor 10 is
  • Wire bonds 1 1 attach the image sensor 10 to the inner
  • a lens barrel 13 having
  • a threaded exterior surface is provided for supporting the optical lens 9 as shown in
  • the lens holder extension is provided with an interior cylindrical surface that is
  • the lens barrel 13 is attached to the
  • lens holder extension 3 by rotating the lens barrel 13 while it is being inserted into the
  • the lens 9 may be attached to the lens holder extension 3 by
  • One advantage of the image sensing module of the present invention is that it is not necessary to have a separate glass cover (or transparent lid) between the image
  • FIG. 3 illustrates the flow chart of a method for constructing the imaging sensor module according to the preferred embodiment of the present invention.
  • a raw stamped frame is provided in stage 100.
  • invention is formed by etching or stamping a thin metal strip to provide the wire leads.
  • the lead frame can be made of copper or copper alloys. Alternatively, the lead frame
  • plastic molding material encapsulates the lead frame in such a manner that exposes
  • molding material is preferably a thermoplastic material with a high melting point in the
  • the molding tool can be any material selected from 300-400 S C; e.g. liquid crystal polymers.
  • the molding tool can be any material selected from 300-400 S C; e.g. liquid crystal polymers.
  • the molding tool can be any material selected from 300-400 S C; e.g. liquid crystal polymers.
  • the die attachment step involves attaching the image sensor chip to the
  • the wire bonding step involves electrically connecting the
  • image sensor chip to be used in the image sensor package includes Charge Coupled
  • CCD Complementary Metal-Oxide Semiconductor
  • CMOS Complementary Metal-Oxide Semiconductor
  • an optical lens assembly is then fitted into the lens holder in stage 400 to provide an imaging sensing module.
  • calibration is performed to determine
  • the image sensor is also eliminated.
  • the method of the present invention requires
  • a plurality of image sensor packages can be fabricated by
  • An array of connecting raw lead frames is inserted into a molding tool and
  • injection molding is carried out to form an array of molded housings with lead frames
  • image sensors therein can be separated into individual packages by conventional means.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

An imaging sensing module includes a premolded package with an integral lens holder (3), an image sensor (10) and an optical lens (9). The premolded package includes a molded housing (2) having an integral lens holder extension (3) and a base section with a raw lead frame (5) partially embedded within the base section. The image sensor (10) is fastened to the base section of the molded housing and the optical lens (9) is attached to the lens holder extension (3).The method of forming the image sensor package with an integral lens holder comprises the steps of: inserting a raw lead frame (5) into a molding tool, performing injection molding to produce a molded housing (2) having a lens holder extension (3) and a base section with the lead frame (5) partially embedded in the base section.

Description

IMAGE SENSING MODULE AND METHOD FOR CONSTRUCTING THE SAME
FIELD OF THE INVENTION
The present invention is related to an image sensing module and the method of
forming an image sensor package.
BACKGROUND OF THE INVENTION
Many digital image products, e.g., video camera, PC digital video camera,
electronic camera, visual telephone, etc., acquire images by the use of an image
sensor. The image sensor can receive light beam transmitted by the image and convert
it into digital signal. Because of this light-receiving function, the packaging for the
image sensor requires different features than other common electronic products. It is
conventional for the image sensor package to have a chip containing housing with a
window so as to allow the image sensor chip to be exposed to the object to be optically
sensed. An image sensing module typically includes a package with a transparent
glass window, an image sensor chip placed inside the package, and a lens assembly
positioned over the transparent window for focusing light onto the image sensor. The
lens assembly requires sub-components to assemble and additional handling steps.
Thus, in order to incorporate all the necessary sub-components of the lens assembly,
the construction of the conventional image sensing module becomes complicated and
costly. Furthermore, the conventional image sensing module is bulky and heavy
because of all the necessary sub-components.
US Pat. No. 6,483,101 B1 issued to Webster introduces an approach toward simplifying the image module assembly. In one embodiment, Weber discloses an image sensor package that includes an image sensor, a window, and a molding,
wherein the molding has a lens holder extension portion extending upwards from the
window. The lens holder extension portion includes a female threaded aperture
adaptable for receiving a threaded lens support. Even though Webster's image sensor
package has reduced complexity, it is not as simple in construction as it could be. A
joining step is required to fix the molding to a substrate and a window has to be molded
into the molding prior to installing the lens assembly.
SUMMARY OF THE SUMMARY OF THE INVENTION
The present invention provides an imaging sensing module that includes a
premolded package with an integral lens holder, an image sensor and an optical lens.
The premolded package includes a molded housing having an integral lens holder
extension and a base section with a raw lead frame partially embedded within the base
section. The image sensor is fastened to the base section of the molded housing and
the optical lens is attached to the lens holder extension.
The present invention also provides a method of forming the image sensor
package with an integral lens holder. To fabricate the image sensor package, a raw lead frame is inserted into a molding tool, and injection molding is performed so as to
produce a molded housing having a lens holder extension and a base section with the
lead frame partially embedded in the base section.
After the premolded package is fabricated, an image sensor is placed inside the
molded housing and attached to the base section of the housing. Subsequently, an optical lens is attached to the lens holder extension to provide an image sensing module in accordance with the present invention. Another aspect of the present invention is a method of forming a plurality of
image sensor packages simultaneously by fabricating a plurality of molded housings
directly on an array of raw lead frames.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows the isometric view of the premolded package with an integral lens
holder according to the preferred embodiment of the present invention.
FIG. 2 shows the cross-sectional view of the image-sensing module according to
the preferred embodiment of the present invention.
FIG. 3 illustrates the method of constructing the image sensing module according
to the preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention provides an imaging sensing module that includes a
premolded package with an integral lens holder and a lens assembly. FIG. 1 shows the
premolded package with an integral lens holder according to the preferred embodiment of the present invention. The premolded package includes a molded housing 2 with an
integral lens holder extension 3. The molded housing 2 with the integral lens holder
extension 3 is a one-piece molded part. A raw lead frame with wire leads 5 is partially
embedded within the base section 6 of the molded housing in such a manner that leaves inner portions 5a and outer portions 5b of the wire leads exposed. The lens
holder extension 3 includes an interior cylindrical surface 7 that defines a lens opening 8. The lens opening 8 is located above the base section 6 of the molded housing. FIG. 2 shows the cross-sectional view of an image sensing module that
incorporates the premolded package described in FIG. 1. An image sensor 10 is
attached to die pad 12 on the interior bottom surface of the molded housing 2, directly
below the lens opening 8. Wire bonds 1 1 attach the image sensor 10 to the inner
portions 5a of the wire leads. A lens barrel 13, which supports lens 9, is fitted inside the
lens holder extension 3. As shown in FIG. 2, the image sensor 10 is enclosed by the
molded housing 3 and the lens 9. In the preferred embodiment, a lens barrel 13 having
a threaded exterior surface is provided for supporting the optical lens 9 as shown in
FIG. 2. The lens holder extension is provided with an interior cylindrical surface that is
also threaded so as to engage the lens barrel. The lens barrel 13 is attached to the
lens holder extension 3 by rotating the lens barrel 13 while it is being inserted into the
lens opening 8. By this threading arrangement, the position of the lens can be readily
adjustable for focusing the lens. Alternatively, other conventional means may be
employed for attaching and supporting the optical lens 9 inside the lens holder
extension 3. For example, the lens 9 may be attached to the lens holder extension 3 by
the use of adhesives, or by snap-on lens assembly etc.
One advantage of the image sensing module of the present invention is that it is not necessary to have a separate glass cover (or transparent lid) between the image
sensor and the lens to protect the image sensor. In addition, unlike prior art modules,
no separate substrate for supporting the image sensor is required because the die pad
can be attached directly to the molded housing. Thus, the image sensing module of the
invention has the most simple design as compared to prior art modules.
FIG. 3 illustrates the flow chart of a method for constructing the imaging sensor module according to the preferred embodiment of the present invention. A raw stamped frame is provided in stage 100. The raw lead frame to be used in the present
invention is formed by etching or stamping a thin metal strip to provide the wire leads.
The lead frame can be made of copper or copper alloys. Alternatively, the lead frame
can be made of copper plated with other metals. In the next stage 200, the raw lead
frame is inserted into a molding tool (or die), and then injection molding is performed so
as to produce a plastic molded housing having a lead frame embedded within the
bottom portion of the housing and a lens holder extension as shown in Fig. 1. The
plastic molding material encapsulates the lead frame in such a manner that exposes
inner lead portions 5a and outer lead portions 5b of the wire leads 5. The plastic
molding material is preferably a thermoplastic material with a high melting point in the
range of 300-400 SC; e.g. liquid crystal polymers. The molding tool can be any
conventional molding tool capable of producing the molded housing having the
configuration as described above. In the next stage 300, an image sensor is placed
inside the housing, and a die attachment step and a wire bonding step are then
performed. The die attachment step involves attaching the image sensor chip to the
interior bottom surface of the molded housing, directly below the lens opening, as shown in FIG. 2. Conventional attaching techniques can be used for die attachment;
e.g., using an adhesive. The wire bonding step involves electrically connecting the
active portion of the chip to the exposed inner lead portions of the lead frame. The
image sensor chip to be used in the image sensor package includes Charge Coupled
Device (CCD) and Complementary Metal-Oxide Semiconductor (CMOS), but is not limited thereto.
After the premolded package with an image sensor chip therein is constructed, an optical lens assembly is then fitted into the lens holder in stage 400 to provide an imaging sensing module. In the final stage 500, calibration is performed to determine
the proper focal distance of the lens to the image sensor chip and the lens assembly is
then fixed into position. Calibration involves adjusting the lens position until radiation
passing through the lens is properly focused.
In the prior art, it is typical to provide a separate substrate on which the die pad is
to be attached. After the image sensor package is fabricated, the package is joined
with the substrate by adhesive. The method of the invention eliminates this
conventional joining step by eliminating the need for a separate substrate. In addition,
the conventional step of providing a transparent cover or window between the lens and
the image sensor is also eliminated. Thus, the method of the present invention requires
minimal manufacturing steps for constructing an image sensing module as compared to
prior art methods.
In order to increase production volume and to minimize the cost of an individual premolded package, a plurality of image sensor packages can be fabricated by
simultaneously forming a plurality of molded housing directly on an array of raw lead
frames. An array of connecting raw lead frames is inserted into a molding tool and
injection molding is carried out to form an array of molded housings with lead frames
embedded therein, as shown in FIG. 4. Next, an image sensor is placed inside each of
the molded housings, and die attachment and wire bonding are then performed as
previously described for FIG. 3. Subsequently, the array of premolded packages with
image sensors therein can be separated into individual packages by conventional means.
Although the invention has been described in relation to the preferred embodiments, it is to be understood that many modifications and variations of the described embodiments are possible without departing from the spirit and scope of the
invention as claimed here after.

Claims

1. A premolded image sensor package comprising:
a molded housing having a base section and an integral lens holder extension,
wherein the molded housing with the base section and the lens holder extension is a
one-piece molded part, the lens holder extension extends above the base section and
has an interior surface that defines a lens opening, the lens opening is configured so
that an optical lens can be attached to the lens holder extension; and
a raw lead frame partially embedded in the base section of the molded housing.
2. The premolded image sensor package of claim 1 , wherein the interior surface of
the lens holder extension is a cylindrical surface and the lens opening is cylindrical.
3. The premolded image sensor package of claim 1 , wherein the molded housing is
made of a thermoplastic material with a high melting point.
4. An image sensing module comprising:
a molded housing having a base section and an integral lens holder extension, wherein the molded housing with the base section and the lens holder extension is a
one-piece molded part, the lens holder extension extends above the base section and
has an interior surface that defines a lens opening, the lens opening is configured so
that an optical lens can be attached to the lens holder extension; a raw lead frame partially embedded in the base section of the molded housing; an image sensor placed inside the molded housing and attached to the base
section; and
an optical lens attached to the lens holder extension;
wherein the image sensor is enclosed by said molded housing and said optical
lens.
5. The image sensing module of claim 4, wherein the interior surface of the lens
holder extension is a cylindrical surface and the lens opening is cylindrical.
6. The image sensing module of claim 5 further comprising a lens barrel having a
threaded exterior cylindrical surface, and wherein the cylindrical interior surface of the
lens holder extension is also threaded so that the lens barrel can be inserted into the
lens holder extension by rotating the lens barrel.
7. The image sensing module of claim 4, wherein the molded housing is made of a
thermoplastic material with a high melting point.
8. The image sensing module of claim 4 further comprises a lens frame that
supports said optical lens, the lens frame being attached to the interior surface of the
lens holder extension.
9. A method of fabricating a premolded image sensor package comprising the steps of:
providing a raw lead frame with wire leads; inserting said raw lead frame into a molding tool; and
performing injection molding so as to produce a molded housing having a lens
holder extension and a base section with the raw lead frame partially embedded in the
base section,
wherein the lens holder extension extends above the base section and has an
interior surface that defines a lens opening, the lens opening is configured so that an
optical lens can be attached to the lens holder extension.
10. The method of claim 9, wherein the lens holder extension has a cylindrical
interior surface and the lens opening is cylindrical.
11. The method of claim 9, wherein a thermoplastic material with a high melting point
is used to produce the molded housing.
12. A method of fabricating a plurality of premolded image sensor packages
comprising the steps of:
providing an array of connecting raw lead frames; inserting said array of connecting raw lead frames into a molding tool; and
performing injection molding so as to produce a plurality of joining molded
housings, each having a lens holder extension and a base section with a raw lead
frame partially embedded in the base section, wherein the lens holder extension
extends above the base section and has an interior surface that defines a lens opening, the lens opening is configured so that an optical lens can be attached to the lens holder extension; separating the joining molded housings into individual molded housings.
13. The method of claim 12, wherein a thermoplastic material with a high melting
point is used to produce the molded housing.
14. A method of constructing an image sensing module comprising the steps of:
providing a raw lead frame with wire leads;
inserting said raw lead frame into a molding tool;
performing injection molding so as to produce a molded housing having a lens
holder extension and a base section with the raw lead frame partially embedded in the
base section, wherein portions of the wire leads are exposed inside the housing for
electrical connection, said lens holder extension extends above the base section and
has an interior surface that defines a lens opening;
placing an image sensor inside the molded housing;
attaching a die pad to the base section of the molded housing;
attaching an image sensor to the die pad; electrically connecting the image sensor to the exposed portions of the wire
leads; and
attaching an optical lens to the lens holder extension.
15. The method of claim 14, wherein a thermoplastic material with a high melting
point is used to produce the molded housing.
16. The method of claim 14, wherein the lens holder extension has a threaded
interior cylindrical surface.
17. The method of claim 16, wherein the optical lens is attached to the lens holder
extension by supporting the optical lens in a lens barrel having a threaded exterior
cylindrical surface, and inserting the lens barrel into the lens holder extension by
rotating the lens barrel.
18. The method of claim 17 further comprising the step of calibrating the optical lens
by rotating the lens barrel until radiation passing through the lens is focused.
PCT/SG2004/000132 2003-05-30 2004-05-14 Image sensing module and method for constructing the same WO2004107437A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200303242 2003-05-30
SG200303242-2 2003-05-30

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Publication Number Publication Date
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1699228A1 (en) * 2005-03-04 2006-09-06 Premier Image Technology Corporation Camera module and the manufacturing process thereof
CN109273416A (en) * 2018-10-30 2019-01-25 上海索晔国际贸易有限公司 A kind of multistage photoelectric device bracket

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US6545332B2 (en) * 2001-01-17 2003-04-08 Siliconware Precision Industries Co., Ltd. Image sensor of a quad flat package
US6734419B1 (en) * 2001-06-28 2004-05-11 Amkor Technology, Inc. Method for forming an image sensor package with vision die in lens housing

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JPH08274289A (en) * 1995-03-31 1996-10-18 Toshiba Corp Solid-state image sensing device
EP0790652A1 (en) * 1995-08-02 1997-08-20 Matsushita Electronics Corporation Solid-state image pickup device and its manufacture
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US20020034022A1 (en) * 2000-08-17 2002-03-21 Masao Nakamura Method for producing solid-state imaging device
US6545332B2 (en) * 2001-01-17 2003-04-08 Siliconware Precision Industries Co., Ltd. Image sensor of a quad flat package
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1699228A1 (en) * 2005-03-04 2006-09-06 Premier Image Technology Corporation Camera module and the manufacturing process thereof
CN109273416A (en) * 2018-10-30 2019-01-25 上海索晔国际贸易有限公司 A kind of multistage photoelectric device bracket

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