WO2004105220A3 - Power module system - Google Patents

Power module system Download PDF

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Publication number
WO2004105220A3
WO2004105220A3 PCT/US2004/015259 US2004015259W WO2004105220A3 WO 2004105220 A3 WO2004105220 A3 WO 2004105220A3 US 2004015259 W US2004015259 W US 2004015259W WO 2004105220 A3 WO2004105220 A3 WO 2004105220A3
Authority
WO
WIPO (PCT)
Prior art keywords
power module
module system
modularity
architecture
employing
Prior art date
Application number
PCT/US2004/015259
Other languages
French (fr)
Other versions
WO2004105220A2 (en
Inventor
Sayeed Ahmed
Fred Flett
Douglas K Maly
Ajay V Patwardhan
Original Assignee
Ballard Power Systems
Sayeed Ahmed
Fred Flett
Douglas K Maly
Ajay V Patwardhan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/642,424 external-priority patent/US6987670B2/en
Priority claimed from US10/642,391 external-priority patent/US6906404B2/en
Priority claimed from US10/658,804 external-priority patent/US7505294B2/en
Priority claimed from US10/664,808 external-priority patent/US7443692B2/en
Application filed by Ballard Power Systems, Sayeed Ahmed, Fred Flett, Douglas K Maly, Ajay V Patwardhan filed Critical Ballard Power Systems
Publication of WO2004105220A2 publication Critical patent/WO2004105220A2/en
Publication of WO2004105220A3 publication Critical patent/WO2004105220A3/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • Programmable Controllers (AREA)

Abstract

The disclosure is directed to an architecture for a power module, employing a high degree of modularity, that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications by simply interchanging components, electrical connections, and/or software.
PCT/US2004/015259 2003-05-16 2004-05-17 Power module system WO2004105220A2 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US47138703P 2003-05-16 2003-05-16
US60/471,387 2003-05-16
US10/642,391 2003-08-14
US10/642,424 2003-08-14
US10/642,424 US6987670B2 (en) 2003-05-16 2003-08-14 Dual power module power system architecture
US10/642,391 US6906404B2 (en) 2003-05-16 2003-08-14 Power module with voltage overshoot limiting
US10/658,804 2003-09-09
US10/658,804 US7505294B2 (en) 2003-05-16 2003-09-09 Tri-level inverter
US10/664,808 US7443692B2 (en) 2003-05-16 2003-09-17 Power converter architecture employing at least one capacitor across a DC bus
US10/664,808 2003-09-17

Publications (2)

Publication Number Publication Date
WO2004105220A2 WO2004105220A2 (en) 2004-12-02
WO2004105220A3 true WO2004105220A3 (en) 2005-03-31

Family

ID=33479852

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/015259 WO2004105220A2 (en) 2003-05-16 2004-05-17 Power module system

Country Status (1)

Country Link
WO (1) WO2004105220A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7348750B2 (en) 2004-12-03 2008-03-25 Continential Automotive Systems Us, Inc. Method, apparatus and article for load stabilization
US7710723B2 (en) 2007-07-17 2010-05-04 Gm Global Technology Operations, Inc. Vehicle inverter assembly with cooling channels
JP5778840B1 (en) 2014-09-25 2015-09-16 株式会社日立製作所 Power conversion unit and power conversion device
CN105429438B (en) * 2015-12-29 2018-08-14 湖北江汉建筑工程机械有限公司 A kind of building hoist case frequency converter and building hoist
DE102017218875B4 (en) * 2017-10-23 2022-07-28 Danfoss Silicon Power Gmbh power module assembly
EP3703238A1 (en) * 2019-02-28 2020-09-02 ABB Schweiz AG An inverter for a photovoltaic plant
JP1656709S (en) * 2019-05-31 2020-04-06
DE102020207709A1 (en) 2020-06-22 2021-12-23 Zf Friedrichshafen Ag Control device for operating an electric drive for a vehicle and method for producing such a control device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01189247A (en) * 1988-01-22 1989-07-28 Fujitsu Ltd System for controlling data transmission system
US4992925A (en) * 1988-01-29 1991-02-12 Heidelberger Druckmaschinen Ag Converter with intermediate d.c. circuit
EP0693820A1 (en) * 1994-07-20 1996-01-24 Hitachi, Ltd. Electric power conversion device for alternating current electric car
JPH08140363A (en) * 1994-11-04 1996-05-31 Fuji Electric Co Ltd Power converter
US5729450A (en) * 1995-06-14 1998-03-17 Magnetek, Inc. Power converter with ripple current and bulk filtering supplied by high-current, high-microfarad film capacitor arrangement
US6181590B1 (en) * 1999-06-04 2001-01-30 Mitsubishi Denki Kabushiki Kaisha Power inverter
WO2001010008A1 (en) * 1999-08-03 2001-02-08 Kabushiki Kaisha Yaskawa Denki Three-level inverter or pwm cycloconverter
US20010021115A1 (en) * 1998-06-16 2001-09-13 Andreas Grundl Half-bridge module
EP1143603A2 (en) * 2000-03-30 2001-10-10 Hitachi, Ltd. Semiconductor device and electric power conversion device
US20010030362A1 (en) * 2000-01-12 2001-10-18 International Rectifier Corporation Low cost power semiconductor module without substrate
US6456516B1 (en) * 1998-07-24 2002-09-24 Siemens Aktiengesellschaft Provision of a low-inductive rail for three-point phase module

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01189247A (en) * 1988-01-22 1989-07-28 Fujitsu Ltd System for controlling data transmission system
US4992925A (en) * 1988-01-29 1991-02-12 Heidelberger Druckmaschinen Ag Converter with intermediate d.c. circuit
EP0693820A1 (en) * 1994-07-20 1996-01-24 Hitachi, Ltd. Electric power conversion device for alternating current electric car
JPH08140363A (en) * 1994-11-04 1996-05-31 Fuji Electric Co Ltd Power converter
US5729450A (en) * 1995-06-14 1998-03-17 Magnetek, Inc. Power converter with ripple current and bulk filtering supplied by high-current, high-microfarad film capacitor arrangement
US20010021115A1 (en) * 1998-06-16 2001-09-13 Andreas Grundl Half-bridge module
US6456516B1 (en) * 1998-07-24 2002-09-24 Siemens Aktiengesellschaft Provision of a low-inductive rail for three-point phase module
US6181590B1 (en) * 1999-06-04 2001-01-30 Mitsubishi Denki Kabushiki Kaisha Power inverter
WO2001010008A1 (en) * 1999-08-03 2001-02-08 Kabushiki Kaisha Yaskawa Denki Three-level inverter or pwm cycloconverter
US20010030362A1 (en) * 2000-01-12 2001-10-18 International Rectifier Corporation Low cost power semiconductor module without substrate
EP1143603A2 (en) * 2000-03-30 2001-10-10 Hitachi, Ltd. Semiconductor device and electric power conversion device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 481 (E - 838) 31 October 1989 (1989-10-31) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 09 30 September 1996 (1996-09-30) *

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Publication number Publication date
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