WO2004103052A1 - Electronic part mounting system - Google Patents

Electronic part mounting system Download PDF

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Publication number
WO2004103052A1
WO2004103052A1 PCT/JP2004/006766 JP2004006766W WO2004103052A1 WO 2004103052 A1 WO2004103052 A1 WO 2004103052A1 JP 2004006766 W JP2004006766 W JP 2004006766W WO 2004103052 A1 WO2004103052 A1 WO 2004103052A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
electronic component
supply device
components
component supply
Prior art date
Application number
PCT/JP2004/006766
Other languages
French (fr)
Japanese (ja)
Inventor
Seigo Kodama
Hiroyuki Haneda
Original Assignee
Fuji Machine Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Mfg. Co., Ltd. filed Critical Fuji Machine Mfg. Co., Ltd.
Priority to JP2005506233A priority Critical patent/JPWO2004103052A1/en
Publication of WO2004103052A1 publication Critical patent/WO2004103052A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0452Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/086Supply management, e.g. supply of components or of substrates

Definitions

  • the present invention relates to an electronic component mounting system including a plurality of electronic component mounting machines, and more particularly to component management of the electronic component mounting system.
  • Patent Document 1 an electronic component mounter that mounts components supplied from a plurality of component supply devices on a substrate has been known (for example, Patent Document 1).
  • This electronic component mounter manages the number of remaining components in each component supply device, and gives advance notice based on the order in which component supply devices are cut out and the time at which they will occur. With this notice, the operator of the electronic component mounting machine had replaced the component supply device.
  • Patent Document 1 is Japanese Patent Application Laid-Open No. H04-164439 (page 4, FIG. 7).
  • the present invention has been made in order to solve the above-described problem.
  • the burden on the operator of the electronic component mounter is reduced.
  • the purpose is to provide an electronic component mounting system with reduced production efficiency. Disclosure of the invention
  • the present invention provides a plurality of electronic component mounters for mounting components respectively supplied from a plurality of component supply devices on a substrate, and manages the components of each component supply device by being communicably connected to each electronic component mounter.
  • the component management device is an electronic component mounting system provided with a means for notifying a component management operator of a component supply device to be set in the electronic component mounting machine to a component management operator.
  • the component management device notifies the component management operator of the component supply device to be set in the electronic component mounting machine, so the component management operator prepares the component supply device to be set and prepares the component supply device.
  • the supplied component supply device is delivered to the electronic component mounter. Then, the operator of the electronic component mounting machine sets the component supply device. Therefore, since the component management operator performs the component preparation work which has been performed by the operator of the electronic component mounting machine, the burden on the operator of the electronic component mounting machine can be reduced.
  • the notifying unit is configured to give a notification together with the remaining time until the set time at which the component supply device should be set in the electronic component mounting machine.
  • the component management operator prepares a component supply device to be set and delivers it to the electronic component mounting machine by the set time. Then, the operator of the electronic component mounter sets the component supply device. But Therefore, when the component supply device is set, the electronic component mounting machine is not stopped or is stopped as short as possible, so that the operation rate of the electronic component mounting machine can be prevented from lowering. .
  • a plurality of electronic component mounters for mounting components respectively supplied from a plurality of component supply devices on a substrate are installed in a production area, and each of the component supply devices is communicably connected to each of the electronic component mounters.
  • a component management device that manages the components of each component is installed in a component preparation error that sets components in each component supply device in advance.
  • This is an electronic component mounting system provided with a notice means for giving a notice to a component management operator together with the remaining time until the set time at which the component supply device should be set.
  • the component management device notifies the component management operator of the component supply device to be set in the electronic component mounter and the remaining time until the set time, so the component management operator in the component preparation area can Prepare the component supply device to be set and deliver the prepared component supply device to the electronic component mounting machine in the production area before the set time. Then, the operator of the electronic component mounter sets the component supply device.
  • This allows the parts management operator to centrally manage the parts in the parts preparation area and efficiently operate the parts in addition to the operation and effects of the invention described above. As a result, the cost of parts can be reduced.
  • the component management device includes: a component remaining number managing unit that manages the component remaining number of each component supply device; and a component remaining number managed by the component remaining number managing unit.
  • a component replenishment time calculation means for calculating the remaining time for replenishing components to the component supply device, and a component supply device requiring component replenishment are specified as component supply devices to be set in the electronic component mounting machine.
  • the notice means, The parts supply device specified by the specifying means and the remaining time of the parts supply device calculated by the parts replenishment time calculating means are notified to the parts management operator in advance.
  • the component management device when a component supply device that causes a component shortage during board manufacturing is detected, the component management device notifies the component management operator of the component supply device and the remaining time when the component shortage occurs.
  • the parts management operator at the rear prepares a new parts supply device in place of the parts supply device that will run out of parts, and replaces the prepared parts supply device with the production area by the time the parts run out. and c is delivered to the electronic component mounting apparatus, the new component supply devices are therefore replaced the operator of the electronic component mounting apparatus. Therefore, the parts can be replenished by setting a new component supply device in the electronic component mounter immediately before or immediately after the component runs out, and the operating rate of the electronic component mounter associated with the component replenishment is low. The bottom can be prevented.
  • the component management device grasps a plurality of board types on which components are mounted and the component types mounted on each board type, and determines a component type mounted on the next board type to be produced.
  • the component supply device is specified as the component supply device to be set in the electronic component mounting machine, and the notification means sets the component supply device by matching the specified component supply device with the production start time of the next board to be produced. Notice is given to the management operator.
  • the component management apparatus when there is a board type to be produced next, notifies the component supply device and the production start time relating to the board type to the component management operator. Prepares the component supply device for the next type of board to be produced, and delivers the prepared component supply device to the electronic mounting machine in the production area by the production start time. And the new component supply device is an electronic component mounting machine Replaced by the operator. Therefore, the setup can be changed by setting a new component supply device in the electronic component mounting machine before or immediately after the completion of the current production. The rate can be prevented from lowering as much as possible.
  • FIG. 1 is an overall configuration diagram showing an electronic component mounting system according to one embodiment of the present invention.
  • FIG. 2 is a production diagram in which the electronic component mounting line of FIG. 1 is installed.
  • FIG. 3 is a functional block diagram showing the electronic component mounting machine shown in FIG. 2
  • FIG. 4 is a functional block diagram showing the electronic component mounting machine shown in FIG. 2.
  • FIG. 5 is a functional block diagram showing the computer for computer management
  • FIG. 5 is a functional block diagram showing the computer for component management in FIG. 1
  • FIG. 7 is a diagram illustrating a feeder component information database stored in a storage unit in FIG. 7.
  • FIG. 7 is a diagram illustrating a feeder position information database stored in the storage unit in FIG.
  • FIG. 8 is a functional block diagram showing the computer for registering parts shown in FIG.
  • FIG. 10 is a flowchart showing a program executed by the parts management computer
  • FIG. 10 is a flowchart showing a program executed by the parts management computer.
  • Is a flowchart showing a program executed on the parts management computer
  • FIG. 12 is a flowchart showing a program executed on the parts management computer.
  • FIG. 13 is a diagram showing a display state on a display unit of the component management computer
  • FIG. 14 is created by a component management computer according to a modification of the present invention.
  • FIG. 15 is a diagram illustrating component mounting information
  • FIG. 15 is a diagram illustrating mounting completion time information created by a component management computer according to a modification of the present invention.
  • FIG. 1 is an overall configuration diagram showing an electronic component mounting system in which a plurality of electronic component mounting machines are installed in the production area and a component management device is installed in the component preparation area.
  • FIG. 2 is a configuration diagram illustrating a production area in which a plurality of electronic component mounting lines including machines are installed.
  • the electronic component mounting system consists of a plurality of electronic component mounting lines 10 installed in the production area As, an electronic component mounting machine management computer 30 installed in the production area As, and a component preparation area. It consists of a parts management computer 40 that constitutes a parts management device installed in Ab.
  • the electronic component mounting line 10, the electronic component mounting machine management computer 30, and the component management computer 40 are a local area network (hereinafter referred to as LAN) that constitutes a network in the factory. ) It is communicably connected via 50.
  • LAN local area network
  • a component supply device (a component supply feeder which is a feeder type component supply device) in which components (for example, electronic component reels R) are set in the vicinity of each electronic component mounting line 10 in advance.
  • a shelf T as for storing D f is installed.
  • the component preparation area A b has a shelf T ab1 for receiving and storing the electronic component reels R registered and processed in the loading area A t, a shelf T ab 2 for storing an empty component supply device D f, and A shelf T ab that stores the component supply device D f on which the electronic component reel R is set and registered.
  • each electronic component mounting line 10 is a production line configured by arranging a plurality of electronic component mounting machines 20.
  • Each electronic component mounter 20 is to produce printed boards by mounting electronic components on the boards transported in cooperation.
  • Each electronic component mounter 20 is a so-called robot type.
  • the X-axis robot which moves in the X-axis and Y-axis directions orthogonal to each other in the same horizontal plane, has a component transfer unit 28 provided with a mounting head on the robot, and a fixed component supply unit 27 After the components are sucked, they are mounted on a board supported by the board transport section 26.
  • This electronic component mounter 20 includes a control unit 21 as shown in FIG.
  • the communication unit 22 connected to the control unit 21 is connected to the electronic component mounting machine management computer 30 and the component management computer 40 via LAN 50.
  • the control unit 21 has a microcomputer (not shown).
  • the microcomputer has an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected via a bus. Have.
  • the CPU executes a predetermined program to control the mounting of electronic components on the board.
  • RAM temporarily stores variables required for executing the program
  • ROM stores the program.
  • the input unit 23, output unit 24, rewritable storage unit 25, board transfer unit 26, component supply unit 27, component transfer unit 28, and image processing unit 29 are connected to the control unit 21. Have been.
  • the input unit 23 is operated by an operator to input commands, data, and the like necessary for mounting the board.
  • the output unit 24 displays and prints various states relating to the board mounting control.
  • the storage unit 25 includes a system program for controlling the entire apparatus, a control program for individually controlling each element of the apparatus on the system program, a board production program, a calibration program, various other application programs, and the like. This is for storing data.
  • the board transfer section 26 carries in the board. ⁇ Carries out and carries out positioning and support.
  • the component supply unit 27 supplies electronic components to be mounted on the board, and a plurality of electronic component reels R each containing the electronic components are detachably mounted.
  • the component supply device D f is detachably mounted side by side.
  • the component transfer section 28 picks up the electronic components supplied by the component supply section 27 and mounts the electronic components on the board positioned and supported by the board transport section 26.
  • the image processing unit 29 processes the image data of the part which is being transferred and the image data of the board which has been imaged.
  • the board transfer section 26, the component supply section 27, and the component transfer section 28 are provided with drive mechanisms such as a servomotor and a stepping motor.
  • the electronic component mounter management computer 30 mainly controls the operation of each electronic component mounter 20.
  • the electronic component mounter management computer 30 includes a control unit 31, and a communication unit 32 connected to the control unit 31 electronically connects via the LAN 50. It is connected to the component mounter 20 and the component management computer 40.
  • the control unit 31 has a microcomputer (not shown).
  • the microcomputer has an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected via a bus. .
  • the CPU executes a predetermined program to execute control for controlling the operation of each electronic component mounter 20.
  • RAM is for temporarily storing variables required for executing the program
  • ROM is for storing the program.
  • the control section 31 has an input section 3.3, an output section 34, a rewritable storage section 35, an electronic component mounting machine registration processing section 36, an electronic component mounting machine production control section 37, and information acquisition. Section 3 8 is connected.
  • the input unit 33 is used by the operator to input necessary information, data, and the like.
  • the output unit 34 displays and prints various states related to control.
  • the storage unit 35 stores information on the operation status taken from each electronic component mounter 20, for example, the number of components consumed, the number of components used per board, and the number of components used per board. It stores the production time, the number of sheets to be produced, the number of boards produced, and the like.
  • the electronic component mounting machine registration processing section 36 is a computer for electronic component mounting machine management.
  • the registration processing is performed when the line organization of each electronic component mounting line 10 that is comprehensively managed by 30 is changed.
  • the updated latest line organization data is stored in the storage unit 35.
  • the electronic component mounter production general control section 37 controls (cooperates with) the operation of each electronic component mounter 20.
  • the information capturing unit 38 is used to provide information on the status (operating status) of each electronic component mounting machine 20 (for example, the number of components consumed, the number of components used per board, the production time per board, the production schedule) Number of boards and the number of boards produced).
  • the component management computer 40 centrally manages electronic components consumed by the electronic component mounter 20 of each electronic component mounting line 10 installed in the production area As. As shown in FIG. 5, the component management computer 40 includes a control unit 41, and a communication unit connected to the control unit 41.
  • the microphone-equipped computer has an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected via paths.
  • the CPU executes a predetermined program and sends the component status of the component supply device D f, production information (planned number of production, per board) from the electronic component mounter 20 or the electronic component mounter management computer 30. (Production time, etc.) to manage the electronic component reels R of these component supply devices Df, and to set the component supply device Df to be set in the electronic component mounter 20 and the component supply device Df. Performs control to notify the parts management operator of the remaining time until the set time to reset.
  • RAM is the same program And a ROM for temporarily storing variables required for executing the program.
  • the control unit 41 includes an input unit 43, a display unit (output unit) 44, a rewritable storage unit 45, a remaining parts management unit 46, a parts replenishment notice unit 47, and an information acquisition unit 48. It is connected.
  • the input unit 43 is used by the operator to input necessary information, data, and the like.
  • the input section 43 has a bar code reader 43a, and indicates the par code R a and D fa pasted to the electronic component reel R and the component supply device D f by the bar code reader 43a. Read each ID (identification symbol) that has been assigned.
  • the display unit 44 displays the component supply device Df to be set in the electronic component mounter 20 and the remaining time until the set time for setting the component supply device Df.
  • the storage unit 45 stores information about the operation status taken from each electronic component mounter 20 (for example, the number of components consumed, the number of components used per board, the production time per board, the number of scheduled production). And the number of boards produced, etc.), and as shown in Fig. 6, the ID of the mounted electronic component reel R and the remaining number of components using the ID of the component supply device D f as a key.
  • the feeder component information database (feeder component information DB), which consists of the component names, component names, and component run-out times, and as shown in Fig. 7, the component supply device Df Of the electronic component mounter 20, the set position ID of the component supply unit 27 of the electronic component mounter 20, and the ID of the electronic component mounting line 10 to which the electronic component mounter 20 belongs.
  • the remaining components management unit 46 determines the number of components held by the component supply device D f before the start of mounting and the number of components received from the electronic component mounter 20 based on the number of components consumed. It calculates the number of remaining components of each component supply device D f of the child component mounter 20.
  • the parts replenishment notice unit 47 supplies components based on the number of remaining components in each component supply device D f stored in the storage unit 45 and the production time per board received from the electronic component mounting apparatus 20. It calculates the time when the parts held by the device D f are empty (part time out), that is, the remaining time to replenish the parts (or the time to replenish). The remaining time for replenishing the components is the remaining time until the set time for setting the component supply device D f in the electronic component mounter 20.
  • the set time refers to the time when the component becomes empty, that is, the time when the component should be refilled.
  • the information capturing unit 48 stores information on the status (operating status) of each electronic component mounting machine 20 (for example, the number of components consumed, the number of components used per board, the production time per board, the production time). The planned number of boards and the number of boards produced) are taken in.
  • the component management computer 40 is preferably installed in the component preparation area Ab, but may be installed in another area. Also, instead of providing the component management computer 40, the above-described component management function of the component management computer 40 may be mounted on the electronic component mounting machine management computer 30 or the component registration computer 60. It may be. In this case, the operator of the electronic component mounting machine management computer 30 or the component registration operator OP1 of the component registration computer 60 also has the role of the component management operator OP2.
  • the component registering combo 60 installed in the receiving area At shown in FIG. 1 is for registering the electronic component reels R received in the receiving area At.
  • the component registration computer 60 has a control unit 61, and a communication unit 62 connected to the control unit 61 has an electronic component mounting machine 2 via a LAN 50. 0, connected to electronic component mounter management computer 30 and component management computer 40.
  • Control unit 6 1 The micro computer has an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected via a bus.
  • the CPU executes a predetermined program to perform control for managing the electronic component reel R.
  • RAM temporarily stores variables required for executing the program
  • ROM stores the program.
  • the control unit 61 is connected to an input unit 63, an output unit 64, a rewritable storage unit 65, a barcode reader 66 and a barcode printer 67, and the input unit 63 is used by an operator. They operate and enter necessary information and data.
  • the output unit 64 displays various states related to control.
  • the storage unit 65 stores the ID of each electronic component reel R, the mounted component name, and the number of mounted components in association with each other.
  • the bar code reader 66 reads a per code label originally attached to the electronic component reel R and acquires the mounted component name and the number of mounted components.
  • the bar code printer 67 prints the ID of the electronic component reel R, the name of the mounted component, and the bar code label Ra indicating the number of mounted components.
  • the computer 60 for registering parts registers an ID on an electronic component reel in which the name of the mounted parts and the number of mounted parts are input by the input operation of the parts registration operator OP 1 or the bar code reader 66.
  • the ID of each electronic component reel R, the mounted component name, and the number of mounted components are stored in association with each other automatically.
  • control units 21, 31, 41, 61 of the electronic component mounting machine 20, the electronic component mounting machine management computer 30, the component management computer 40, and the component registration computer 60 are the same. Each of them performs their own processing in parallel, and exchanges data as necessary. Is going.
  • the component management computer 40 repeatedly executes a program corresponding to the above-mentioned flow chart every predetermined short time. Each time the part management computer 40 starts executing the program in step 100 of FIG. 9, the part reel management routine 40 executes the parts reel management routine in steps 102, 104, and 106. Each part remaining number management routine and the parts replenishment notice routine are executed.
  • the component management operator OP2 sets the electronic component reel R in the component supply device Df
  • the barcode labels Dfa and Ra attached to both are read by the barcode reader 43a, and the information is read.
  • the ID of the component supply device Df indicated by the code label Dfa is associated with the ID of the electronic component reel R, the name of the mounted component, and the number of mounted components, which are indicated by the barcode label Ra.
  • register that is, when the feeder component information is input by the component management operator OP2, the component management computer 40 enters the feeder component information DB shown in FIG. 6 in the component reel management routine shown in FIG. Additional registration of new feeder part information is performed (steps 202 and 204).
  • the component management computer 40 executes the remaining component count management routine shown in FIG. Specifically, the ID of the component supply device D f in which the component has been consumed in mounting the component on the board from the electronic component mounter 20 (or the computer 30 for managing the electronic component mounter) and the consumption of the component.
  • the feeder component information of the component supply device D # of the corresponding ID is read from the storage unit 45 (steps 302, 304), and the consumed number is subtracted from the remaining component number.
  • the feeder component information is updated and registered in the storage unit 45 as a result of the subtraction as a new component remaining number (step 300).
  • the component management computer 40 counts all remaining components of the component supply device D f set in the electronic component mounter 20 connected via the LAN 50. to manage.
  • the parts management computer 40 executes a parts replenishment notification routine shown in FIG.
  • the component management computer 40 determines whether the flag F force S is "0".
  • Flag F is a flag indicating whether or not the component management computer 40 has received the production time per board from the electronic component mounter 20 or the electronic component mounter management computer 30. When "1", it indicates that the production time has been received. Since the flag F is reset to ⁇ 0 '' when the component management computer 40 is started, the component management computer 40 determines YES and NO in steps 402 and 404, respectively. Proceed to step 4 to terminate the execution of this program.
  • the component management computer 40 When the component management computer 40 receives the production time per board from the electronic component mounting machine 20 (or the electronic component mounting machine management computer 30), it determines YES in step 404. Then, in step 400, the flag F is set to “1”. As a result, the program can be determined to be NO at step 402 next time, and the program can proceed to step 408 by skipping the processing of steps 404 and 406.
  • the component management computer 40 reads out all the IDs of the component supply devices D ⁇ currently involved in the production based on the feeder position information DB shown in FIG. 7, and reads the feeder component information of those component supply devices D f. It is read from the feeder part information DB stored in the storage unit 45 (step 4 08), and the part supply time when the part supply device D f is out of parts is calculated from the remaining number of parts and the production time, and the calculation result is included.
  • the registered feeder component information is updated and registered in the feeder component information DB (step 410).
  • the component management computer 40 manages all the component outage times of the component supply device D f set in the electronic component mounter 20. In addition, when parts run out The interval is calculated by the following equation (1).
  • the number of components used per board is obtained from the electronic component mounter 20 or the electronic component mounter management computer 30.
  • the component management computer 40 displays the component supply devices D f on the display unit 44 in ascending order of the component outage time calculated in step 410 (step 412). Specifically, as shown in Fig. 13, the ID of the component supply device D f is used as a key, and the set position of the component supply device D f is displayed. .
  • the feeder set position indicates a line ID, an electronic component mounter ID, and a set position ID in order from the left, and specifies a place where the component supply device D f is set.
  • the part supply device D f at which a part runs out can be notified to the parts management operator OP2 together with the time at which the part runs out.
  • the component management computer 40 monitors the component supply device Df that is running out of components during production, and warns the component supply device Df.
  • the production completion time is calculated from the planned number of productions and the production time (step 4 14), and when the production completion time is shorter than the part outage time compared with the previously calculated part outage time, The component supply device Df determines that the component has run out during production, and displays a warning on the display unit 44 (steps 4 16 and 4 18). As a result, even if the parts outage time is the same or longer, the parts supply device D f for which parts replacement should be performed with priority can be notified to the parts management operator OP2.
  • the planned production quantity is obtained from the electronic component mounting machine 20 or the electronic component mounting machine management computer 30 power.
  • the component management operator OP 2 preliminarily sets the component supply device D f having the electronic component reel R required for the electronic component mounter 20 based on the notice or warning of component shortage by the component management computer 40 described above. This is to prepare and deliver to the shelf T as of the electronic component mounting line 10 constituting the corresponding electronic component mounter 20 before the components run out.
  • the information about the above-mentioned warning about running out of components issued by the component management computer 40 is transmitted to the electronic component mounter 20, and the electronic component mounter 20 also issues a warning.
  • the operator OP 3 of the electronic component mounter 20 takes out a new component supply device D f instead of the component supply device D f used to run out of components from the shelf T as which is delivered and stored in advance.
  • the component management computer 40 transmits the component supply device D f
  • the part management operator OP 2 in the parts preparation area A b notifies the part management operator OP 2 of the remaining time when the parts run out and the remaining time when the parts run out.
  • the new component supply device D # is mounted on the component supply unit 27 by the operator # 3 of the electronic component mounter 20.
  • the electronic component mounter 20 detects that the new component supply device D f has been attached to the component supply unit 27, and when the component supply device D f, which is used to cut components, runs out of components, a new component supply device D f. Parts will be sampled from D f. Therefore, since the component management operator OP 2 performs the component preparation work which was previously performed by the operator OP 3 of the electronic component mounting machine 20, the burden on the operator OP 3 of the electronic component mounting machine 20 can be reduced. .
  • the parts management operator OP 2 can centrally manage the parts in the parts preparation area A b and operate the parts efficiently, the parts cost can be reduced as a whole. .
  • the component supply device D f of the electronic component mounter 20 runs out of parts during production.
  • the component supply device D f to be set in the mounter 20 (steps 410 to 418)
  • the component management computer 40 grasps a plurality of board types on which components are to be mounted and the component types mounted on each board type, and obtains all the component types mounted on the next board type to be produced.
  • the component supply device Df of the component is specified as the component supply device Df to be set in the electronic component mounter 20, and the component supply device Df thus identified and the production start time of the next board type to be produced are determined. Parts management operator Notice to Data OP 2.
  • the production start time is a set time at which the component supply device D f should be set in the electronic component mounter 20. The remaining time until the start of production may be displayed together, or only this remaining time may be displayed.
  • the component management combinator 40 notifies the component management operator OP 2 of the component supply device D f and the production start time for the board type.
  • the component management operator OP2 in the component preparation area Ab prepares the component supply device Df for the next board type to be produced, and prepares the prepared component supply device Df by the production start time.
  • the product is delivered to the electronic component mounting machine 20 in the production area A s.
  • the new component supply device D f is set by the operator OP 3 of the electronic component mounter 20.
  • the setup can be changed by setting a new component supply device D f to the electronic component mounter 20 before or immediately after the completion of the current production, and the operation of the electronic component mounter accompanying the setup change can be performed.
  • the rate can be prevented from lowering as much as possible.
  • the component outage time was calculated based on the number of remaining components and the production time per board. However, the component outage time was calculated based on the remaining number of components and the mounting time per component. Time may be calculated.
  • the component management computer 40 receives the component mounting information (see FIG. 14) from the electronic component mounting machine 20 (or the electronic component mounting machine management computer 30), and receives the component mounting information. Calculates mounting completion time information (see Fig. 15.) for each component type (mounted component name) based on the.
  • the component mounting information includes the component mounting order, the component ID, the mounted component name (component type), the mounting time, which is the time required from the time when the previous mounting was completed to the time when the next mounting was completed, and the mounting order. It is composed of the total time obtained by integrating the mounting time.
  • the mounting time can be obtained by actual measurement or calculation.
  • Wearing Completion time information consists of a component ID and mounting completion time.The same mounting component name is picked up from the component mounting information, and is created by associating the component ID with the mounting completion time in the component mounting order. is there. For example, the mounting completion time information of the mounted component name RA001 created from the component mounting information of FIG. 14 is shown in FIG.
  • component IDP001 which is the first component of scale 01
  • component IDPO50 the second component of RAO01
  • the mounting of the component IDPO 51 is completed when T 3 has elapsed.
  • the component management computer 40 reads out all the IDs of the component supply devices D f that are currently involved in production based on the feeder position information DB shown in FIG. 7, and reads the feeder component information of those component supply devices D f.
  • the feeder component information read from the feeder component information DB stored in the storage unit 45, and the component supply device Df calculates the component outage time at which the component supply device Df will run out of components based on the number of remaining components and the mounting completion time, and includes the calculation result and includes the calculation result Is updated and registered in the feeder parts information DB.
  • the component management computer 40 manages all the component outage times of the component supply device D f set in the electronic component mounter 20.
  • the component outage time is the sum of the quotient of the number of remaining components divided by the amount of components used per board multiplied by the production time per board, and the mounting completion time corresponding to the remainder of the division. Represented by According to this, the component outage time can be calculated more accurately.
  • the present invention is applied to the robot-type electronic component mounter 20.
  • the present invention may be applied to a rotary-type electronic component mounter.
  • a mounting head for picking up and mounting electronic components is fixed rotatably, and after picking up components from a component supply unit fixedly slidable, the components are conveyed by a loader unit.
  • XY tape It is mounted on a substrate positioned by a tool (movable in the X-axis and Y-axis directions).
  • the production area A s is stopped after the component supply device D f has run out of components and the electronic component mounting machine 20 stops.
  • the new component supply device D f delivered to the electronic component mounter 20 is replaced and mounted on the component supply unit 27 by the operator OP3 of the electronic component mounter 20.
  • the component supply device D f is a feeder-type component supply device to which the electronic component reel R is detachably attached.
  • the present invention is not limited to this. The present invention can also be applied to a tray type, a stick type, a balcar cartridge type, and the like.
  • the component registration computer 60 installed in the receiving area At will notify the component registration operator OP1 of the component supply device to be set in the electronic component mounter 20. It may be.
  • the electronic component reel R to be set in the electronic component mounter 20 can be preferentially delivered to the component preparation area Ab.
  • the component management function of the electronic component mounting machine is assigned to a component management device separate from the electronic component mounting machine, and the component management operator is dedicated.
  • the electronic part It is suitable for reducing the burden on the operator of the component mounting machine and improving production efficiency.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

An electronic part mounting system includes: a plurality of electronic part mounting devices for mounting parts supplied from a plurality of part supply devices (Df) on a substrate; and a part management computer (40) communicably connected to the respective electronic part mounting devices and managing parts of the respective part supply devices. The part management computer (40) notifies a part management operator (OP2) in advance which part supply device is to be set on the electronic part mounting device.

Description

明 細 書 電子部品実装システム 技術分野  Description Electronic component mounting system Technical field
本発明は、 複数の電子部品実装機から構成される電子部品実装システ ムに関し、 特に電子部品実装システムの部品管理に関する。 背景技術  The present invention relates to an electronic component mounting system including a plurality of electronic component mounting machines, and more particularly to component management of the electronic component mounting system. Background art
従来から、 複数の部品供給デバイスからそれぞれ供給される部品を基 板に実装する電子部品実装機は知られている (例えば特許文献 1 )。 この 電子部品実装機は、 各部品供給デバイスの部品残数を管理しており、 部 品供給デバイスの部品切れを発生する順番、 発生する時間によ り予告し ている。 この予告により電子部品実装機のオペレータが部品供給デバィ スを交換していた。  2. Description of the Related Art Conventionally, an electronic component mounter that mounts components supplied from a plurality of component supply devices on a substrate has been known (for example, Patent Document 1). This electronic component mounter manages the number of remaining components in each component supply device, and gives advance notice based on the order in which component supply devices are cut out and the time at which they will occur. With this notice, the operator of the electronic component mounting machine had replaced the component supply device.
特許文献 1は特開平 0 4— 1 6 4 3 9 9号公報 (第 4頁、 第 7図) で あ 。  Patent Document 1 is Japanese Patent Application Laid-Open No. H04-164439 (page 4, FIG. 7).
最近では、 複数の電子部品実装機を並設して構成された一つまたは複 数の生産ラインにて実装するよ うになっており、 各ラインに配置された オペレータが複数の電子部品実装機の各部品供給デバィスの部品を一人 で管理する場合がある。 この場合、 オペレータ一人あたりの電子部品実 装機の台数が増加して、 オペレータの負担が増加する。 さ らに、 ォペレ ータは、 部品供給デバィスの交換だけでなくその他の電子部品実装機の 運転制御作業もあるので、 部品供給作業に専念できずに、 部品切れの予 告がなされていても部品供給デバイスの交換が遅れる場合があった。  Recently, multiple electronic component mounting machines have been mounted on one or more production lines, which are arranged side by side. In some cases, parts for each part supply device are managed by one person. In this case, the number of electronic component mounting machines per operator increases, and the burden on the operator increases. Furthermore, since the operator not only replaces the component supply device but also controls the operation of other electronic component mounting machines, it is not possible to concentrate on the component supply work, and even if the operator is notified that the parts will run out, Replacement of the component supply device was sometimes delayed.
そこで、 本発明は、 上述した問題を解消するためになされたもので、 電子部品実装機の部品管理機能を電子部品実装機とは別体の部品管理装 置にも受け持たせると ともに部品管理オペレータを専任させることによ り、 電子部品実装機のオペレータにかかる負担を軽減し、 生産効率の良 い電子部品実装システムを提供することを目的とする。 発明の開示 Therefore, the present invention has been made in order to solve the above-described problem. By assigning the component management function of the electronic component mounter to a component management device that is separate from the electronic component mounter, and by assigning a dedicated component management operator, the burden on the operator of the electronic component mounter is reduced. The purpose is to provide an electronic component mounting system with reduced production efficiency. Disclosure of the invention
本発明は、 複数の部品供給デバイスからそれぞれ供給される部品を基 板に実装する複数の電子部品実装機と、 各電子部品実装機と通信可能に 接続されて各部品供給デバイスの部品を管理する部品管理装置と、 を備 えてなり、 部品管理装置は、 電子部品実装機にセッ トすべき部品供給デ バイスを部品管理オペレータに予告する予告手段を備えた電子部品実装 システムである。  The present invention provides a plurality of electronic component mounters for mounting components respectively supplied from a plurality of component supply devices on a substrate, and manages the components of each component supply device by being communicably connected to each electronic component mounter. The component management device is an electronic component mounting system provided with a means for notifying a component management operator of a component supply device to be set in the electronic component mounting machine to a component management operator.
これによれば、 部品管理装置は電子部品実装機にセッ トすべき部品供 給デバイスを部品管理オペレータに予告するので、 部品管理オペレータ は、 セッ トすべき部品供給デバイスの準備をし、 その準備された部品供 給デバイスを電子部品実装機に配送する。 そして、 電子部品実装機のォ ペレータが部品供給デバイスをセッ トする。 したがって、 今まで電子部 品実装機のオペレータが行っていた部品準備作業を部品管理オペレータ が行うので、 電子部品実装機のオペレータの負担を軽減することができ る。  According to this, the component management device notifies the component management operator of the component supply device to be set in the electronic component mounting machine, so the component management operator prepares the component supply device to be set and prepares the component supply device. The supplied component supply device is delivered to the electronic component mounter. Then, the operator of the electronic component mounting machine sets the component supply device. Therefore, since the component management operator performs the component preparation work which has been performed by the operator of the electronic component mounting machine, the burden on the operator of the electronic component mounting machine can be reduced.
本発明の電子部品実装システムにおいては、 予告手段は、 電子部品実 装機に部品供給デバイスをセッ トすべきセッ ト時間までの残り時間とを 合わせて予告するよ うにしている。  In the electronic component mounting system according to the present invention, the notifying unit is configured to give a notification together with the remaining time until the set time at which the component supply device should be set in the electronic component mounting machine.
これによれば、 部品管理オペレータは、 セッ トすべき部品供給デパイ スの準備を行い、セッ ト時間までに電子部品実装機に配送する。そして、 電子部品実装機のオペレータが部品供給デバイスをセッ トする。 したが つて、 部品供給デバイスをセッ トする際に電子部品実装機を停止させる ことなく あるいは停止させてもできるだけ短時間に抑えるので、 電子部 品実装機の稼働率が低下するのを防ぐこ とができる。 According to this, the component management operator prepares a component supply device to be set and delivers it to the electronic component mounting machine by the set time. Then, the operator of the electronic component mounter sets the component supply device. But Therefore, when the component supply device is set, the electronic component mounting machine is not stopped or is stopped as short as possible, so that the operation rate of the electronic component mounting machine can be prevented from lowering. .
本発明は、 複数の部品供給デバィスからそれぞれ供給される部品を基 板に実装する複数の電子部品実装機を生産エリァに設置し、 各電子部品 実装機と通信可能に接続されて各部品供給デバィスの部品を管理する部 品管理装置を各部品供給デバイスに部品を予めセッ トする部品準備ェリ ァに設置し、 部品管理装置は、 電子部品実装機にセッ トすべき部品供給 デバイスと、 この部品供給デバイスをセッ トすべきセッ ト時間までの残 り時間とを合わせて部品管理オペレータに予告する予告手段を備えた電 子部品実装システムである。  According to the present invention, a plurality of electronic component mounters for mounting components respectively supplied from a plurality of component supply devices on a substrate are installed in a production area, and each of the component supply devices is communicably connected to each of the electronic component mounters. A component management device that manages the components of each component is installed in a component preparation error that sets components in each component supply device in advance. This is an electronic component mounting system provided with a notice means for giving a notice to a component management operator together with the remaining time until the set time at which the component supply device should be set.
これによれば、 部品管理装置は電子部品実装機にセッ トすべき部品供 給デバイスとセッ ト時間までの残り時間とを部品管理オペレータに予告 するので、 部品準備エリアにいる部品管理オペレータは、 セッ トすべき 部品供給デバイスの準備をし、 その準備された部品供給デバィスをセッ ト時間となる前に生産エリアの電子部品実装機に配送する。 そして、 電 子部品実装機のオペレータが部品供給デバイスをセッ トする。 これによ り、 上述した発明の作用 ·効果に加えて、 部品管理オペレータが部品準備 エリアにて部品を集中して管理する と と もに効率よく部品を運用するこ とができるので、 全体と して部品コス トを軽減することができる。  According to this, the component management device notifies the component management operator of the component supply device to be set in the electronic component mounter and the remaining time until the set time, so the component management operator in the component preparation area can Prepare the component supply device to be set and deliver the prepared component supply device to the electronic component mounting machine in the production area before the set time. Then, the operator of the electronic component mounter sets the component supply device. This allows the parts management operator to centrally manage the parts in the parts preparation area and efficiently operate the parts in addition to the operation and effects of the invention described above. As a result, the cost of parts can be reduced.
本発明の電子部品実装システムにおいては、 部品管理装置は、 各部品 供給デバィスの部品残数をそれぞれ管理する部品残数管理手段と、 この 部品残数管理手段によって管理された部品残数に基づいて部品供給デバ イスへ部品を補充する残り時間を算出する部品補充時間算出手段と、 部 品の補充が必要な部品供給デバィスを電子部品実装機にセッ トすべき部 品供給デパイスと して特定する特定手段と、をさ らに備え、予告手段は、 特定手段によ り特定された部品供給デパイスと、 部品補充時間算出手段 によ り算出されたこの部品供給デバィスの残り時間とを合わせて部品管 理オペレータに予告するよ うにしている。 In the electronic component mounting system of the present invention, the component management device includes: a component remaining number managing unit that manages the component remaining number of each component supply device; and a component remaining number managed by the component remaining number managing unit. A component replenishment time calculation means for calculating the remaining time for replenishing components to the component supply device, and a component supply device requiring component replenishment are specified as component supply devices to be set in the electronic component mounting machine. In addition to the specific means, the notice means, The parts supply device specified by the specifying means and the remaining time of the parts supply device calculated by the parts replenishment time calculating means are notified to the parts management operator in advance.
これによれば、 基板製造中に部品切れとなる部品供給デバィスが検知 された場合に、 部品管理装置はその部品供給デパイスと部品切れとなる 残り時間を部品管理オペレータに通知するので、 部品準備ェリ アにいる 部品管理オペレータは、 部品切れとなる部品供給デバィスの代わり であ る新しい部品供給デバィスの準備をし、 その準備された部品供給デバィ スを部品切れとなる時間までに生産エリ アの電子部品実装機に配送する c そして、 その新しい部品供給デバイスが電子部品実装機のオペレータに よって交換される。 したがって、 部品切れとなる前、 また部品切れした 直後に新しい部品供給デバイスを電子部品実装機にセッ トすることによ り部品補給ができるので、 部品補給に伴う電子部品実装機の稼働率の低 下を防ぐことができる。 According to this, when a component supply device that causes a component shortage during board manufacturing is detected, the component management device notifies the component management operator of the component supply device and the remaining time when the component shortage occurs. The parts management operator at the rear prepares a new parts supply device in place of the parts supply device that will run out of parts, and replaces the prepared parts supply device with the production area by the time the parts run out. and c is delivered to the electronic component mounting apparatus, the new component supply devices are therefore replaced the operator of the electronic component mounting apparatus. Therefore, the parts can be replenished by setting a new component supply device in the electronic component mounter immediately before or immediately after the component runs out, and the operating rate of the electronic component mounter associated with the component replenishment is low. The bottom can be prevented.
本発明の電子部品実装システムにおいては、 部品管理装置は、 部品を 実装する複数の基板種、 および各基板種に実装される部品種を把握し、 次に生産する基板種に実装される部品の部品供給デバイスを電子部品実 装機にセッ トすべき部品供給デバイスと して特定し、 予告手段は、 特定 された部品供給デバイスと、 次に生産する基板の生産開始時間とを合わ せて部品管理オペレータに予告するよ う にしている。  In the electronic component mounting system according to the present invention, the component management device grasps a plurality of board types on which components are mounted and the component types mounted on each board type, and determines a component type mounted on the next board type to be produced. The component supply device is specified as the component supply device to be set in the electronic component mounting machine, and the notification means sets the component supply device by matching the specified component supply device with the production start time of the next board to be produced. Notice is given to the management operator.
これによれば、 次に生産する基板種がある場合に、 部品管理装置はそ の基板種に関する部品供給デバイスと生産開始時間を部品管理オペレー タに通知するので、 部品準備エリアにいる部品管理オペレータは、 次に 生産する基板種に関する部品供給デバイスの準備をし、 それら準備され た部品供給デバィスを生産開始時間までに生産エリァの電子部品実装機 に配送する。 そして、 その新しい部品供給デバイスが電子部品実装機の オペレータによって交換される。 したがって、 現在の生産の完了前、 ま たは完了後すぐに新しい部品供給デバィスを電子部品実装機にセッ トす ることによ り段取り替えができるので、 段取り替えに伴う電子部品実装 機の稼働率の低下をできるだけ防ぐことができる。 According to this, when there is a board type to be produced next, the component management apparatus notifies the component supply device and the production start time relating to the board type to the component management operator. Prepares the component supply device for the next type of board to be produced, and delivers the prepared component supply device to the electronic mounting machine in the production area by the production start time. And the new component supply device is an electronic component mounting machine Replaced by the operator. Therefore, the setup can be changed by setting a new component supply device in the electronic component mounting machine before or immediately after the completion of the current production. The rate can be prevented from lowering as much as possible.
図面の簡単な説明 BRIEF DESCRIPTION OF THE FIGURES
第 1 図は、 本発明の一実施の形態に係る電子部品実装シス テ ムを. 示す全体構成図であ り 、 第 2 図は、 第 1 図の電子部品実装ラ イ ンが 設置された生産エ リ アを示す構成図であ り 、 第 3 図は、 第 2 図の電 子部品実装機を示す機能プロ-ック図であ り 、 第 4図は、 第 2 図の電 子部品実装機管理用コ ン ピュータを示す機能プロ ック図であ り 、 第 5 図は、 第 1 図の部品管理用コ ン ピュータ を示す機能プロ ック図で あ り 、 第 6 図は、 第 5 図の記憶部に記憶される フ ィ ーダ部品情報デ ータベースを示す図であ り 、 第 7 図は、 第 5 図の記憶部に記憶され るフィーダ位置情報データベースを示す図であ り 、 第 8 図は、 第 1 図の部品登録用コ ン ピュータを示す機能プロ ック図であ り 、 第 9 図 は、 部品管理用コ ン ピュータにて実行されるプロ グラムを表すフロ 一チャー トであ り 、 第 1 0 図は、 部品管理用コ ン ピュータ にて実行 されるプロ グラムを表すフ ロ ーチャ ー トであ り 、 第 1 1 図は、 部品 管理用コンピュータ にて実行されるプロ グラムを表すフローチヤ一 トであ り 、 第 1 2 図は、 部品管理用コ ン ピュータにて実行されるプ ロ グラムを表すフローチャー トであ り 、 第 1 3 図は、 部品管理用コ ンピュータの表示部における表示状態を示す図であ り 、 第 1 4図は、 本発明の変形例によ る部品管理用コ ン ピュータ にて作成される部品 装着情報を示す図であ り 、 第 1 5 図は、 本発明の変形例による部品 管理用コ ン ピュータ にて作成される装着完了時間情報を示す図であ る。 発明を実施するための最良の形態 . 以下、 本発明による電子部品実装システムの一実施の形態について図 面を参照して説明する。 第 1図は生産エリアに複数の電子部品実装機が 設置され、 部品準備ェリアに部品管理装置が設置された電子部品実装シ ステムを示す全体構成図であり、 第 2図は複数の電子部品実装機からな る複数の電子部品実装ライ ンが設置された生産ェリ ァを示す構成図であ る。 FIG. 1 is an overall configuration diagram showing an electronic component mounting system according to one embodiment of the present invention. FIG. 2 is a production diagram in which the electronic component mounting line of FIG. 1 is installed. FIG. 3 is a functional block diagram showing the electronic component mounting machine shown in FIG. 2, and FIG. 4 is a functional block diagram showing the electronic component mounting machine shown in FIG. 2. FIG. 5 is a functional block diagram showing the computer for computer management, FIG. 5 is a functional block diagram showing the computer for component management in FIG. 1, and FIG. FIG. 7 is a diagram illustrating a feeder component information database stored in a storage unit in FIG. 7. FIG. 7 is a diagram illustrating a feeder position information database stored in the storage unit in FIG. FIG. 8 is a functional block diagram showing the computer for registering parts shown in FIG. 1, and FIG. 9 is a computer for managing parts. FIG. 10 is a flowchart showing a program executed by the parts management computer, and FIG. 10 is a flowchart showing a program executed by the parts management computer. Is a flowchart showing a program executed on the parts management computer, and FIG. 12 is a flowchart showing a program executed on the parts management computer. FIG. 13 is a diagram showing a display state on a display unit of the component management computer, and FIG. 14 is created by a component management computer according to a modification of the present invention. FIG. 15 is a diagram illustrating component mounting information, and FIG. 15 is a diagram illustrating mounting completion time information created by a component management computer according to a modification of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of an electronic component mounting system according to the present invention will be described with reference to the drawings. Fig. 1 is an overall configuration diagram showing an electronic component mounting system in which a plurality of electronic component mounting machines are installed in the production area and a component management device is installed in the component preparation area. FIG. 2 is a configuration diagram illustrating a production area in which a plurality of electronic component mounting lines including machines are installed.
電子部品実装システムは、 生産エリア A s 内に設置された複数の電子 部品実装ライ ン 1 0 と、 生産エリア A s 内に設置された電子部品実装機 管理用コ ンピュータ 3 0 と、 部品準備ェリア A b内に設置された部品管 理装置を構成する部品管理用コ ンピュータ 4 0 とから構成されている。 電子部品実装ライ ン 1 0、 電子部品実装機管理用コ ンピュータ 3 0およ び部品管理用コ ンピュータ 4 0は、 工場内のネ ッ ト ワークを構成する口 一カルエリアネッ トワーク (以下、 L A Nという。) 5 0を介して通信可 能に接続されている。  The electronic component mounting system consists of a plurality of electronic component mounting lines 10 installed in the production area As, an electronic component mounting machine management computer 30 installed in the production area As, and a component preparation area. It consists of a parts management computer 40 that constitutes a parts management device installed in Ab. The electronic component mounting line 10, the electronic component mounting machine management computer 30, and the component management computer 40 are a local area network (hereinafter referred to as LAN) that constitutes a network in the factory. ) It is communicably connected via 50.
生産ェリア A s には、各電子部品実装ライン 1 0の近傍に予め部品(例 えば電子部品リール R ) がセッ トされた部品供給デバイス (フィ一ダ式 部品供給デバイスである部品供給フィーダ)' D f が収納される棚 T a s が設置されている。 部品準備エリア A bには、 着荷エリア A t にて登録 処理された電子部品リール Rを受け入れて収納する棚 T a b 1、 空の部 品供給デバィス D f を収納する棚 T a b 2、 および、 電子部品リール R がセッ トされ登録処理された部品供給デバイス D f を収納する棚 T a b In the production area A s, a component supply device (a component supply feeder which is a feeder type component supply device) in which components (for example, electronic component reels R) are set in the vicinity of each electronic component mounting line 10 in advance. A shelf T as for storing D f is installed. The component preparation area A b has a shelf T ab1 for receiving and storing the electronic component reels R registered and processed in the loading area A t, a shelf T ab 2 for storing an empty component supply device D f, and A shelf T ab that stores the component supply device D f on which the electronic component reel R is set and registered.
3が設置されている。 3 are installed.
各電子部品実装ライン 1 0は、 第 2図に示すよ うに、 複数の電子部品 実装機 2 0を並べて構成した一の生産ライ ンであり、 各電子部品実装機 As shown in FIG. 2, each electronic component mounting line 10 is a production line configured by arranging a plurality of electronic component mounting machines 20.
2 0が協動して搬送した基板に電子部品を実装してプリ ン ト基板を生産 するものである。 各電子部品実装機 2 0は、 いわゆるロボッ トタイプの ものであり、 同一水平面内で互いに直交する X軸および Y軸方向に移動 する X Υロボッ トに装着ヘッ ドを設けた部品移載部 2 8を設け、 固定さ れた部品供給部 2 7から部品を吸着した後、 基板搬送部 2 6に支持され た基板に実装するものである。 20 is to produce printed boards by mounting electronic components on the boards transported in cooperation. Each electronic component mounter 20 is a so-called robot type. The X-axis robot, which moves in the X-axis and Y-axis directions orthogonal to each other in the same horizontal plane, has a component transfer unit 28 provided with a mounting head on the robot, and a fixed component supply unit 27 After the components are sucked, they are mounted on a board supported by the board transport section 26.
この電子部品実装機 2 0は、 第 3図に示すよ うに、 制御部 2 1 を備え ている。 制御部 2 1 に接続された通信部 2 2は L A N 5 0を介して電子 部品実装機管理用コンピュータ 3 0および部品管理用コンピュータ 4 0 に接続されている。 制御部 2 1 はマイク ロ コンピュータ (図示省略) を 有しており、 マイク ロ コンピュータは、 バスを介してそれぞれ接続され た入出力イ ンターフェース、 C P U、 R A Mおよび R O M (いずれも図 示省略) を備えている。 C P Uは、 所定のプログラムを 行して、 基板 への電子部品の実装を制御する。 R A Mは同プログラムの実行に必要な 変数を一時的に記憶するものであり、 R O Mは前記プロダラムを記憶す るものである。  This electronic component mounter 20 includes a control unit 21 as shown in FIG. The communication unit 22 connected to the control unit 21 is connected to the electronic component mounting machine management computer 30 and the component management computer 40 via LAN 50. The control unit 21 has a microcomputer (not shown). The microcomputer has an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected via a bus. Have. The CPU executes a predetermined program to control the mounting of electronic components on the board. RAM temporarily stores variables required for executing the program, and ROM stores the program.
制御部 2 1 には入力部 2 3、出力部 2 4、書き換え可能な記憶部 2 5、 基板搬送部 2 6、 部品供給部 2 7、 部品移載部 2 8および画像処理部 2 9が接続されている。 入力部 2 3は、 作業者が操作して基板の実装に必 要な指令、 データなどを入力するものである。 出力部 2 4は、 基板実装 制御に関する種々の状態を表示したり印刷したりするものである。 記憶 部 2 5は、 装置全体を制御するシステムプログラム、 システムプロダラ ム上で装置の各要素をそれぞれ個別に制御する制御プログラム、 基板の 生産プログラム、 キャリブレーショ ンプログラム、 その他各種アプリケ ーショ ンプログラムやデータを記憶するものである。基板搬送部 2 6は、 基板の搬入 ■ 搬出および位置決め支持を行う ものである。 部品供給部 2 7は、 基板に実装すべき電子部品を供給するものであり、 電子部品が収 納された電子部品リール Rが着脱可能にそれぞれ取り付けられた複数の 部品供給デバィス D f が着脱可能に並設されたものである。 部品移載部 2 8は、 部品供給部 2 7により供給された電子部品を採取して基板搬送 部 2 6 によ り位置決め支持された基板上に実装するものである。 画像処 理部 2 9は、 撮像した移載途中の部品の画像データ、 撮像した基板の画 像データなどを処理するものである。基板搬送部 2 6、部品供給部 2 7、 部品移載部 2 8はサーボモータ、 ステツビングモータなどの駆動機構を 備えている。 The input unit 23, output unit 24, rewritable storage unit 25, board transfer unit 26, component supply unit 27, component transfer unit 28, and image processing unit 29 are connected to the control unit 21. Have been. The input unit 23 is operated by an operator to input commands, data, and the like necessary for mounting the board. The output unit 24 displays and prints various states relating to the board mounting control. The storage unit 25 includes a system program for controlling the entire apparatus, a control program for individually controlling each element of the apparatus on the system program, a board production program, a calibration program, various other application programs, and the like. This is for storing data. The board transfer section 26 carries in the board. ■ Carries out and carries out positioning and support. The component supply unit 27 supplies electronic components to be mounted on the board, and a plurality of electronic component reels R each containing the electronic components are detachably mounted. The component supply device D f is detachably mounted side by side. The component transfer section 28 picks up the electronic components supplied by the component supply section 27 and mounts the electronic components on the board positioned and supported by the board transport section 26. The image processing unit 29 processes the image data of the part which is being transferred and the image data of the board which has been imaged. The board transfer section 26, the component supply section 27, and the component transfer section 28 are provided with drive mechanisms such as a servomotor and a stepping motor.
電子部品実装機管理用コンピュータ 3 0は、 主と して各電子部品実装 機 2 0 の運転を統括して制御するものである。 電子部品実装機管理用コ ンピュータ 3 0は、 第 4図に示すように、 制御部 3 1 を備えていて、 制 御部 3 1 に接続された通信部 3 2は L A N 5 0を介して電子部品実装機 2 0および部品管理用コンピュータ 4 0に接続されている。 制御部 3 1 はマイクロコンピュータ (図示省略) を有しており、 マイクロコンピュ ータは、 バスを介してそれぞれ接続された入出力インターフェース、 C P U、 R A Mおよび R O M (いずれも図示省略) を備えている。 C P U は、 所定のプログラムを実行して、 各電子部品実装機 2 0の運転を統括 する制御を実行する。 R A Mは同.プログラムの実行に必要な変数を一時 的に記憶するものであり、 R O Mは前記プロダラ'ムを記憶するものであ る。  The electronic component mounter management computer 30 mainly controls the operation of each electronic component mounter 20. As shown in FIG. 4, the electronic component mounter management computer 30 includes a control unit 31, and a communication unit 32 connected to the control unit 31 electronically connects via the LAN 50. It is connected to the component mounter 20 and the component management computer 40. The control unit 31 has a microcomputer (not shown). The microcomputer has an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected via a bus. . The CPU executes a predetermined program to execute control for controlling the operation of each electronic component mounter 20. RAM is for temporarily storing variables required for executing the program, and ROM is for storing the program.
制御部 3 1 には入力部 3. 3、出力部 3 4、書き換え可能な記憶部 3 5、 電子部品実装機登録処理部 3 6、 電子部品実装機生産統括制御部 3 7お よび情報取込部 3 8が接続されている。 入力部 3 3は、 作業者が操作し て必要な情報、 データなどを入力するものである。 出力部 3 4は、 制御 に関する種々の状態を表示したり印刷したりするものである。 記憶部 3 5は、 各電子部品実装機 2 0から取り込んだ稼動状況に関する情報、 例 えば、 部品の消費数、 基板 1枚あたりの部品使用数、 基板 1枚あたりの 生産時間、生産予定枚数、生産した基板枚数などを記憶するものである。 電子部品実装機登録処理部 3 6は、 電子部品実装機管理用コンピュータThe control section 31 has an input section 3.3, an output section 34, a rewritable storage section 35, an electronic component mounting machine registration processing section 36, an electronic component mounting machine production control section 37, and information acquisition. Section 3 8 is connected. The input unit 33 is used by the operator to input necessary information, data, and the like. The output unit 34 displays and prints various states related to control. The storage unit 35 stores information on the operation status taken from each electronic component mounter 20, for example, the number of components consumed, the number of components used per board, and the number of components used per board. It stores the production time, the number of sheets to be produced, the number of boards produced, and the like. The electronic component mounting machine registration processing section 36 is a computer for electronic component mounting machine management.
3 0が統括管理する各電子部品実装ライン 1 0のライン編成を変更する 場合の登録処理を行う ものである。 変更された最新のライン編成データ は記憶部 3 5に記憶される。 電子部品実装機生産統括制御部 3 7は、 各 電子部品実装機 2 0の運転を統括して(連携して)制御するものである。 情報取込部 3 8は、 各電子部品実装機 2 0の状態 (稼働状況) に関する 情報 (例えば、 部品の消費数、 基板 1枚あたりの部品使用数、 基板 1枚 あたり の生産時間、 生産予定枚数、 生産した基板枚数) を取り込むもの である。 The registration processing is performed when the line organization of each electronic component mounting line 10 that is comprehensively managed by 30 is changed. The updated latest line organization data is stored in the storage unit 35. The electronic component mounter production general control section 37 controls (cooperates with) the operation of each electronic component mounter 20. The information capturing unit 38 is used to provide information on the status (operating status) of each electronic component mounting machine 20 (for example, the number of components consumed, the number of components used per board, the production time per board, the production schedule) Number of boards and the number of boards produced).
部品管理用コンピュータ 4 0は、 生産エリア A s に設置された各電子 部品実装ライン 1 0の電子部品実装機 2 0にて消費される電子部品を集 中して管理するものである。 部品管理用コンピュータ 4 0は、 第 5図に 示すよ うに、 制御部 4 1 を備えていて、 制御部 4 1 に接続された通信部 The component management computer 40 centrally manages electronic components consumed by the electronic component mounter 20 of each electronic component mounting line 10 installed in the production area As. As shown in FIG. 5, the component management computer 40 includes a control unit 41, and a communication unit connected to the control unit 41.
4 2は L A N 5 0を介して電子部品実装機 2 0、 電子部品実装機管理用 コンピュータ 3 0および部品登録用コンピュータ 6 0に接続されている, 制御部 4 1 はマイク ロコンピュータ (図示省略) を有しており、 マイク 口コンピュータは、 パスを介してそれぞれ接続された入出力インターフ エース、 C P U、 R A Mおよび R O M (いずれも図示省略) を備えてい る。 C P Uは、 所定のプログラムを実行して、 電子部品実装機 2 0また は電子部品実装機管理用コンピュータ 3 0から部品供給デバイス D f の 部品状況、 生産情報 (生産予定枚数、 基板 1枚あたりの生産時間など) を取り込んで、 それら部品供給デバイス D f の電子部品リール Rを管理 すると ともに、 電子部品実装機 2 0にセッ トすべき部品供給デバイス D f と、 その部品供給デバイス D f をセッ トするセッ ト時間までの残り時 間を部品管理オペレータに予告する制御を行う。 R A Mは同プログラム の実行に必要な変数を一時的に記憶するものであり、 R O Mは前記プロ グラムを記憶するものである。 42 is connected to the electronic component mounting machine 20, the electronic component mounting machine management computer 30 and the component registration computer 60 via the LAN 50, and the control unit 41 is a microcomputer (not shown). The microphone-equipped computer has an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected via paths. The CPU executes a predetermined program and sends the component status of the component supply device D f, production information (planned number of production, per board) from the electronic component mounter 20 or the electronic component mounter management computer 30. (Production time, etc.) to manage the electronic component reels R of these component supply devices Df, and to set the component supply device Df to be set in the electronic component mounter 20 and the component supply device Df. Performs control to notify the parts management operator of the remaining time until the set time to reset. RAM is the same program And a ROM for temporarily storing variables required for executing the program.
制御部 4 1 には入力部 4 3、 表示部 (出力部) 4 4、 書き換え可能な 記憶部 4 5、 部品残数管理部 4 6、 部品補充予告部 4 7および情報取込 部 4 8が接続されている。入力部 4 3は、作業者が操作して必要な情報、 データなどを入力するものである。 入力部 4 3は、 バー コードリーダ 4 3 a を備えていて、 バーコードリーダ 4 3 aによつて電子部品リール R および部品供給デバイス D f に貼り付けられたパーコード R a , D f a に示されたそれぞれの I D (識別記号) を読み込む。 表示部 4 4は、 電 子部品実装機 2 0にセッ トすべき部品供給デバイス D f と、 その部品供 給デバイス D f をセッ トするセッ ト時間までの残り時間を表示するもの である。  The control unit 41 includes an input unit 43, a display unit (output unit) 44, a rewritable storage unit 45, a remaining parts management unit 46, a parts replenishment notice unit 47, and an information acquisition unit 48. It is connected. The input unit 43 is used by the operator to input necessary information, data, and the like. The input section 43 has a bar code reader 43a, and indicates the par code R a and D fa pasted to the electronic component reel R and the component supply device D f by the bar code reader 43a. Read each ID (identification symbol) that has been assigned. The display unit 44 displays the component supply device Df to be set in the electronic component mounter 20 and the remaining time until the set time for setting the component supply device Df.
記憶部 4 5は、 各電子部品実装機 2 0から取り込んだ稼動状況に関す る情報 (例えば、 部品の消費数、 基板 1枚あたりの部品使用数、 基板 1 枚あたりの生産時間、生産予定枚数、生産した基板枚数など) を記憶し、 さ らに、 第 6図に示すよ うに、 部品供給デバイス D f の I Dをキーと し て、 搭載されている電子部品リール Rの I D、 部品残数、 搭載部品名、 および部品切れ時間から構成されるフィーダ部品情報データベース (フ ィーダ部品情報 D B )、 および、 第 7図に示すよ うに、 部品供給デバィス D f の I Dをキーと して、 搭載される電子部品実装機 2 0の I D、 その 電子部品実装機 2 0の部品供給部 2 7のセッ ト位置 I D、 およびその電 子部品実装機 2 0が属する電子部品実装ライン 1 0の I Dから構成され るフィーダ位置情報データベース (フィーダ位置情報 D B ) を記憶する ものである。  The storage unit 45 stores information about the operation status taken from each electronic component mounter 20 (for example, the number of components consumed, the number of components used per board, the production time per board, the number of scheduled production). And the number of boards produced, etc.), and as shown in Fig. 6, the ID of the mounted electronic component reel R and the remaining number of components using the ID of the component supply device D f as a key. The feeder component information database (feeder component information DB), which consists of the component names, component names, and component run-out times, and as shown in Fig. 7, the component supply device Df Of the electronic component mounter 20, the set position ID of the component supply unit 27 of the electronic component mounter 20, and the ID of the electronic component mounting line 10 to which the electronic component mounter 20 belongs. Feeder location information database Scan it is for storing the (feeder position information D B).
部品残数管理部 4 6は、 実装開始前の部品供給デバィス D f が保有す る部品の数量と電子部品実装機 2 0から受信した部品の消費数とから電 子部品実装機 2 0 の各部品供給デバィス D f の部品残数をそれぞれ算出 するものである。 部品捕充予告部 4 7は、 記憶部 4 5に記憶されている 各部品供給デバィス D f の部品残数と電子部品実装装置 2 0から受信し た基板 1枚あたりの生産時間とから部品供給デバィス D f が保有してい る部品が空になる時間 (部品切れ時間) すなわち部品を補充する残り時 間 (または補充すべき時間) を算出するものである。 この部品を補充す る残り時間が、 電子部品実装機 2 0に部品供給デバイス D f をセッ トす べきセッ ト時間までの残り時間である。 なお、 セッ ト時間は部品が空に なる時刻すなわち部品を補充すべき時刻のことをいう。 情報取込部 4 8 は、 各電子部品実装機 2 0 の状態 (稼働状況) に関する情報 (例えば、 部品の消費数、 基板 1枚あたりの部品使用数、 基板 1枚あたり の生産時 間、 生産予定枚数、 生産した基板枚数) を取り込むものである。 The remaining components management unit 46 determines the number of components held by the component supply device D f before the start of mounting and the number of components received from the electronic component mounter 20 based on the number of components consumed. It calculates the number of remaining components of each component supply device D f of the child component mounter 20. The parts replenishment notice unit 47 supplies components based on the number of remaining components in each component supply device D f stored in the storage unit 45 and the production time per board received from the electronic component mounting apparatus 20. It calculates the time when the parts held by the device D f are empty (part time out), that is, the remaining time to replenish the parts (or the time to replenish). The remaining time for replenishing the components is the remaining time until the set time for setting the component supply device D f in the electronic component mounter 20. The set time refers to the time when the component becomes empty, that is, the time when the component should be refilled. The information capturing unit 48 stores information on the status (operating status) of each electronic component mounting machine 20 (for example, the number of components consumed, the number of components used per board, the production time per board, the production time). The planned number of boards and the number of boards produced) are taken in.
なお、 部品管理用コ ンピュータ 4 0は、 部品準備エリ ア A bに設置さ れるのが好ましいが、 他のエリアに設置するよ うにしてもよい。 また、 部品管理用コ ンピュータ 4 0を設けずに部品管理用コ ンピュータ 4 0 の 上述した部品管理機能を電子部品実装機管理用コ ンピュータ 3 0または 部品登録用コ ンピュータ 6 0に搭載するよ うにしてもよい。 この場合、 電子部品実装機管理用コ ンピュータ 3 0 のオペレータまたは部品登録用 コ ンピュータ 6 0 の部品登録オペレータ O P 1 が部品管理オペレータ O P 2 の役割を兼任すること となる。  The component management computer 40 is preferably installed in the component preparation area Ab, but may be installed in another area. Also, instead of providing the component management computer 40, the above-described component management function of the component management computer 40 may be mounted on the electronic component mounting machine management computer 30 or the component registration computer 60. It may be. In this case, the operator of the electronic component mounting machine management computer 30 or the component registration operator OP1 of the component registration computer 60 also has the role of the component management operator OP2.
第 1図に示す着荷ェリア A tに設置されている部品登録用コ ンビユー タ 6 0は、 着荷ェリ ア A t に入荷された電子部品リール Rを登録するも のである。 部品登録用コ ンピュータ 6 0は、 第 8図に示すよ うに、 制御 部 6 1 を備えていて、 制御部 6 1 に接続された通信部 6 2は L A N 5 0 を介して電子部品実装機 2 0、 電子部品実装機管理用コ ンピュータ 3 0 および部品管理用コンピュータ 4 0に接続されている。 制御部 6 1 はマ イク口コンピュータ (図示省略) を有しており、 マイ ク ロコンピュータ は、バスを介してそれぞれ接続された入出力インターフェース、 C P U、 R A Mおよび R O M (いずれも図示省略) を備えている。 C P Uは、 所 定のプログラムを実行して、 電子部品リール Rを管理する制御を行う。 R A Mは同プログラムの実行に必要な変数を一時的に記憶するものであ り、 R O Mは前記プログラムを記憶するものである。 The component registering combo 60 installed in the receiving area At shown in FIG. 1 is for registering the electronic component reels R received in the receiving area At. As shown in FIG. 8, the component registration computer 60 has a control unit 61, and a communication unit 62 connected to the control unit 61 has an electronic component mounting machine 2 via a LAN 50. 0, connected to electronic component mounter management computer 30 and component management computer 40. Control unit 6 1 The micro computer has an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected via a bus. The CPU executes a predetermined program to perform control for managing the electronic component reel R. RAM temporarily stores variables required for executing the program, and ROM stores the program.
制御部 6 1 には入力部 6 3、出力部 6 4、書き換え可能な記憶部 6 5、 バーコードリーダ 6 6およびバーコー ドプリ ンタ 6 7が接続されている, 入力部 6 3は、 作業者が操作して必要な情報、 データなどを入力するも のである。 出力部 6 4は、 制御に関する種々の状態を表示するものであ る。 記憶部 6 5は、 各電子部品リール Rの I D、 搭載部品名および搭載 部品数を関連付けて記憶するものである。 バーコードリーダ 6 6は、 電 子部品リール Rに元々貼り付けられているパーコー ドラベルを読み取つ て搭載部品名および搭載部品数を取得するものである。 バーコードプリ ンタ 6 7は、 電子部品リール Rの I D、 搭載部品名おょぴ搭載部品数を 表すバーコ一ドラべノレ R a を印刷するものである。  The control unit 61 is connected to an input unit 63, an output unit 64, a rewritable storage unit 65, a barcode reader 66 and a barcode printer 67, and the input unit 63 is used by an operator. They operate and enter necessary information and data. The output unit 64 displays various states related to control. The storage unit 65 stores the ID of each electronic component reel R, the mounted component name, and the number of mounted components in association with each other. The bar code reader 66 reads a per code label originally attached to the electronic component reel R and acquires the mounted component name and the number of mounted components. The bar code printer 67 prints the ID of the electronic component reel R, the name of the mounted component, and the bar code label Ra indicating the number of mounted components.
この部品登録用コ ンピュータ 6 0は、 部品登録オペレータ O P 1 の入 力操作によ り、 またはバーコードリーダ 6 6によ り搭載部品名および搭 載部品数が入力された電子部品リール に I Dを自動に付して、 各電子 部品リ ール Rの I D、 搭載部品名および搭載部品数を関連付けて記憶す る。  The computer 60 for registering parts registers an ID on an electronic component reel in which the name of the mounted parts and the number of mounted parts are input by the input operation of the parts registration operator OP 1 or the bar code reader 66. The ID of each electronic component reel R, the mounted component name, and the number of mounted components are stored in association with each other automatically.
次に上記のよ うに構成した電子部品実装システムの作動を第 9図のフ ローチャー トに沿って説明する。 なお、 電子部品実装機 2 0、 電子部品 実装機管理用コンピュータ 3 0、 部品管理用コンピュータ 4 0および部 品登録用コンピュータ 6 0の各制御部 2 1, 3 1 , 4 1 , 6 1はそれぞ れ独自の処理を並列に行う と ともに、 必要に応じてデータのやり と り を 行っている。 Next, the operation of the electronic component mounting system configured as described above will be described with reference to the flowchart of FIG. The control units 21, 31, 41, 61 of the electronic component mounting machine 20, the electronic component mounting machine management computer 30, the component management computer 40, and the component registration computer 60 are the same. Each of them performs their own processing in parallel, and exchanges data as necessary. Is going.
部品管理用コ ンピュータ 4 0は、 所定の短時間毎に、 上記フ ローチヤ 一 トに対応したプログラムを繰り返し実行する。 部品管理用コ ンビユー タ 4 0は、 第 9図のステップ 1 0 0にてプログラムの実行を開始する毎 に、 ステップ 1 0 2 , 1 0 4, 1 0 6にて、 部品リ ール管理ルーチン、 部品残数管理ルーチン、 部品補充予告ルーチンの各処理を実行する。  The component management computer 40 repeatedly executes a program corresponding to the above-mentioned flow chart every predetermined short time. Each time the part management computer 40 starts executing the program in step 100 of FIG. 9, the part reel management routine 40 executes the parts reel management routine in steps 102, 104, and 106. Each part remaining number management routine and the parts replenishment notice routine are executed.
部品管理オペレータ O P 2が、 部品供給デバイス D f に電子部品リー ル Rをセッ トする際には、両方に付されているバーコー ドラベル D f a , R a をバーコードリーダ 4 3 a で読み取り、 ノ ーコー ドラベル D f a に 示されている部品供給デバイス D f の I Dに、 バーコ一 ドラベル R a に 示されている電子部品リール Rの I D、 搭載部品名および搭載部品数を 関連付けてフ ィーダ部品情報と して登録する。 すなわち、 部品管理用コ ンピュータ 4 0は、 部品管理オペレータ O P 2によ り フィーダ部品情報 が入力されると、 第 1 0図に示す部品リール管理ルーチンにおいて、 第 6図に示すフィーダ部品情報 D Bに新しいフィーダ部品情報を追加登録 する (ステ ップ 2 0 2 , 2 0 4 )。  When the component management operator OP2 sets the electronic component reel R in the component supply device Df, the barcode labels Dfa and Ra attached to both are read by the barcode reader 43a, and the information is read. -The ID of the component supply device Df indicated by the code label Dfa is associated with the ID of the electronic component reel R, the name of the mounted component, and the number of mounted components, which are indicated by the barcode label Ra. And register. That is, when the feeder component information is input by the component management operator OP2, the component management computer 40 enters the feeder component information DB shown in FIG. 6 in the component reel management routine shown in FIG. Additional registration of new feeder part information is performed (steps 202 and 204).
次に、 部品管理用コ ンピュータ 4 0は、 第 1 1図に示す部品残数管理 ルーチンを実行する。 具体的には、 電子部品実装機 2 0 (または電子部 品実装機管理用コンピュータ 3 0 ) から基板への部品の実装にともない 部品が消費された部品供給デバイス D f の I Dとその部品の消費数を受 信する と、 該当する I Dの部品供給デバイ ス D ί のフィーダ部品情報を 記憶部 4 5から読み出し (ステ ップ 3 0 2, 3 0 4 )、 部品残数から消費 数を減算して減算結果を新しい部品残数と して該当するフィーダ部品情 報を記憶部 4 5に更新登録する (ステップ 3 0 6 )。 これによ り、 部品管 理用コ ンピュータ 4 0は、 L A N 5 0を介して接続されている電子部品 実装機 2 0にセッ トされている部品供給デバイス D f の部品残数を全て 管理する。 Next, the component management computer 40 executes the remaining component count management routine shown in FIG. Specifically, the ID of the component supply device D f in which the component has been consumed in mounting the component on the board from the electronic component mounter 20 (or the computer 30 for managing the electronic component mounter) and the consumption of the component. When the number is received, the feeder component information of the component supply device D # of the corresponding ID is read from the storage unit 45 (steps 302, 304), and the consumed number is subtracted from the remaining component number. Then, the feeder component information is updated and registered in the storage unit 45 as a result of the subtraction as a new component remaining number (step 300). As a result, the component management computer 40 counts all remaining components of the component supply device D f set in the electronic component mounter 20 connected via the LAN 50. to manage.
そして、 部品管理用コンピュータ 4 0は、 第 1 2図に示す部品補充予 告ルーチンを実行する。 ステップ 4 0 2において、 部品管理用コンビュ ータ 4 0はフラグ F力 S 「 0」 であるかを判定する。 フラグ Fは部品管理 用コンピュータ 4 0が電子部品実装機 2 0または電子部品実装機管理用 コンピュータ 3 0から基板 1枚あたり の生産時間を受信したか否かを示 すフラグであり 、 フラグ Fが 「 1」 のとき生産時間は受信済みであるこ とを示す。 部品管理用コンピュータ 4 0の起動当初はフラグ Fは 「 0」 にリセッ ト されているので、 部品管理用コンピュータ 4 0は、 ステップ 4 0 2 , 4 0 4にてそれぞれ Y E S、 N Oと判定し、 ステップ 4 2 2に 進めてこのプログラムの実行を一旦終了する。  Then, the parts management computer 40 executes a parts replenishment notification routine shown in FIG. In step 402, the component management computer 40 determines whether the flag F force S is "0". Flag F is a flag indicating whether or not the component management computer 40 has received the production time per board from the electronic component mounter 20 or the electronic component mounter management computer 30. When "1", it indicates that the production time has been received. Since the flag F is reset to `` 0 '' when the component management computer 40 is started, the component management computer 40 determines YES and NO in steps 402 and 404, respectively. Proceed to step 4 to terminate the execution of this program.
部品管理用コンピュータ 4 0は、 電子部品実装機 2 0 (または電子部 品実装機管理用コンピュータ 3 0 ) から基板 1枚あたり の生産時間を受 信すると、 ステップ 4 0 4にて Y E S と判定し、 ステップ 4 0 6にてフ ラグ Fを 「 1」 にする。 これによ り、 次回以降ステップ 4 0 2にて N O と判定し、 ステップ 4 0 4, 4 0 6の処理を飛ばしてプログラムをステ ップ 4 0 8に進めることができる。  When the component management computer 40 receives the production time per board from the electronic component mounting machine 20 (or the electronic component mounting machine management computer 30), it determines YES in step 404. Then, in step 400, the flag F is set to “1”. As a result, the program can be determined to be NO at step 402 next time, and the program can proceed to step 408 by skipping the processing of steps 404 and 406.
部品管理用コンピュータ 4 0は、 第 7図に示すフィーダ位置情報 D B に基づいて現在生産に関与している部品供給デバイス D ίの I Dを全て 読み出し、 それらの部品供給デバィス D f のフィーダ部品情報を記憶部 4 5 に記憶されているフィーダ部品情報 D Bから読み出し (ステップ 4 0 8 )、部品残数および生産時間から部品供給デバイス D f が部品切れと なる部品切れ時間を算出して算出結果を含めたフィーダ部品情報をフィ ーダ部品情報 D Bに更新登録する (ステップ 4 1 0 )。 これにより、 部品 管理用コンピュータ 4 0は、 電子部品実装機 2 0にセッ トされている部 品供給デバイス D f の部品切れ時間を全て管理する。 なお、 部品切れ時 間は下記数 1 によ り算出される。 The component management computer 40 reads out all the IDs of the component supply devices D ί currently involved in the production based on the feeder position information DB shown in FIG. 7, and reads the feeder component information of those component supply devices D f. It is read from the feeder part information DB stored in the storage unit 45 (step 4 08), and the part supply time when the part supply device D f is out of parts is calculated from the remaining number of parts and the production time, and the calculation result is included. The registered feeder component information is updated and registered in the feeder component information DB (step 410). Thus, the component management computer 40 manages all the component outage times of the component supply device D f set in the electronic component mounter 20. In addition, when parts run out The interval is calculated by the following equation (1).
(数 1 )  (Number 1)
部品残数  Parts remaining
X 生産時間  X Production time
基板 1枚あたり の部品使用数  Number of parts used per board
基板 1枚あたりの部品使用数は、 電子部品実装機 2 0または電子部品 実装機管理用コンピュータ 3 0から取得される。  The number of components used per board is obtained from the electronic component mounter 20 or the electronic component mounter management computer 30.
次に部品管理用コンピュータ 4 0は、 ステップ 4 1 0にて算出された 部品切れ時間の短い順に部品供給デバィス D f を表示部 4 4に表示する (ステップ 4 1 2 )。 具体的には、 第 1 3図に示すよ うに、 部品供給デバ イス D f の I Dをキーと レて部品供給デバイス D f のセッ ト位置おょぴ 部品切れ時間が時間の短い順に表示される。 フィーダセッ ト位置は左か ら順にライン I D、電子部品実装機 I D、セッ ト位置 I Dを示しており、 部品供給デバィス D f がセッ トされている場所を特定している。 これに よ り、 部品切れとなる部品供給デバィス D f を部品切れとなる時間と合 わせて部品管理オペレータ O P 2に予告することができる。  Next, the component management computer 40 displays the component supply devices D f on the display unit 44 in ascending order of the component outage time calculated in step 410 (step 412). Specifically, as shown in Fig. 13, the ID of the component supply device D f is used as a key, and the set position of the component supply device D f is displayed. . The feeder set position indicates a line ID, an electronic component mounter ID, and a set position ID in order from the left, and specifies a place where the component supply device D f is set. As a result, the part supply device D f at which a part runs out can be notified to the parts management operator OP2 together with the time at which the part runs out.
また、 部品管理用コンピュータ 4 0は、 生産中に部品切れとなる部品 供給デバイス D f を監視しており、 その部品供給デバイス D f を警告す る。 具体的には、 生産予定枚数および生産時間から生産完了時間を算出 し (ステップ 4 1 4 )、 先に算出した部品切れ時間と比較して、 生産完了 時間が部品切れ時間以下である場合に、 その部品供給デバイス D f は生 産中に部品切れとなると判定し、 表示部 4 4に警告を表示する (ステツ プ 4 1 6 , 4 1 8 )。 これによ り、 部品切れ時間が同一または長い場合で あっても、 部品補充を優先的に行わなければならない部品供給デバィス D f を部品管理オペレータ O P 2に予告することができる。 また、 警告 が発せられた部品供給デバイス D f に部品が補充される と、 生産完了時 間が部品切れ時間よ り長く なるので、 その部品供給デバィス D f は生産 中に部品切れとならないと判定し、 表示部 4 4の警告を解除する (ステ ップ 4 1 6, 4 2 0 )。なお、生産完了時間は下記数 2によ り算出される。 (数 2 ) Also, the component management computer 40 monitors the component supply device Df that is running out of components during production, and warns the component supply device Df. Specifically, the production completion time is calculated from the planned number of productions and the production time (step 4 14), and when the production completion time is shorter than the part outage time compared with the previously calculated part outage time, The component supply device Df determines that the component has run out during production, and displays a warning on the display unit 44 (steps 4 16 and 4 18). As a result, even if the parts outage time is the same or longer, the parts supply device D f for which parts replacement should be performed with priority can be notified to the parts management operator OP2. In addition, if parts are replenished to the parts supply device D f where the warning was issued, the production completion time will be longer than the parts outage time. It is determined that parts will not run out during the operation, and the warning on display section 44 is released (steps 4 16 and 4 20). The production completion time is calculated by the following equation (2). (Equation 2)
生産予定枚数 X 生産時間  Production quantity X Production time
生産予定枚数は、 電子部品実装機 2 0または電子部品実装機管理用コ ンピュータ 3 0力、ら取得される。  The planned production quantity is obtained from the electronic component mounting machine 20 or the electronic component mounting machine management computer 30 power.
部品管理オペレータ O P 2は、 上述した部品管理用コンピュータ 4 0 による部品切れの予告または警告に基づいて、 電子部品実装機 2 0に必 要な電子部品リール Rを保有する部品供給デバイス D f を前もって準備 し、 該当する電子部品実装機 2 0を構成する電子部品実装ライン 1 0の 棚 T a s に部品切れとなる前に配送する作業を行う ものである。  The component management operator OP 2 preliminarily sets the component supply device D f having the electronic component reel R required for the electronic component mounter 20 based on the notice or warning of component shortage by the component management computer 40 described above. This is to prepare and deliver to the shelf T as of the electronic component mounting line 10 constituting the corresponding electronic component mounter 20 before the components run out.
また、 部品管理用コンピュータ 4 0が発する上記部品切れの警告はそ の情報が電子部品実装機 2 0に送信され、 電子部品実装機 2 0において も警告が発せられる。 これにより、 電子部品実装機 2 0のオペレータ O P 3は、 部品切れとなる部品供給デバイス D f の代わりである新しい部 品供給デバイス D f を予め配送されて収納されている棚 T a s から取り 出して電子部品実装機 2 0の部品供給部 2 7に装着する。  In addition, the information about the above-mentioned warning about running out of components issued by the component management computer 40 is transmitted to the electronic component mounter 20, and the electronic component mounter 20 also issues a warning. As a result, the operator OP 3 of the electronic component mounter 20 takes out a new component supply device D f instead of the component supply device D f used to run out of components from the shelf T as which is delivered and stored in advance. To the component supply unit 27 of the electronic component mounter 20.
上述した説明から明らかなよ うに、 本実施の形態においては、 基板製 造中に部品切れとなる部品供給デバィス D f が検知された場合に、 部品 管理用コンピュータ 4 0はその部品供給デバイス D f と部品切れとなる 残り時間とを部品管理オペレータ O P 2に予告通知するので、 部品準備 エリア A bにいる部品管理オペレータ O P 2は、 部品切れとなる部品供 給デバイス D f の代わりである新しい部品供給デバイス D f の準備をし その準備された部品供給デバイス D f を部品切れとなる時間 (部品準備 エリア A bから生産エリア A s までの配送時間、 部品供給デバイス D f を電子部品実装機 2 0に装着する時間などを考慮するのが好ま しい) ま でに生産エリ ア A s の電子部品実装機 2 0に配送する。 そして、 その新 しい部品供給デバイス D ίが電子部品実装機 2 0のオペレータ Ο Ρ 3に よって部品供給部 2 7に装着される。 電子部品実装機 2 0は新しい部品 供給デバイス D f が部品供給部 2 7に装着されたことを検出し、 部品切 れとなる部品供給デバイス D f が部品切れとなる と、 新しい部品供給デ バイス D f から部品を採取するよ うになる。 したがって、 今まで電子部 品実装機 2 0 のオペレータ O P 3が行っていた部品準備作業を部品管理 オペレータ O P 2が行うので、 電子部品実装機 2 0のオペレータ O P 3 の負担を軽減することができる。 また、 部品切れとなる前に新しい部品 供給デバイス D f を電子部品実装機 2 0にセッ トすることによ り部品補 給ができ、 電子部品実装機 2 0を停止させることはないので、 部品補給 に伴う電子部品実装機 2 0の稼働率の低下を防ぐことができる。さ らに、 部品管理オペレータ O P 2が部品準備ェリア A bにて部品を集中して管 理すると ともに効率よく部品を運用することができるので、 全体と して 部品コス トを軽減することができる。 As is apparent from the above description, in the present embodiment, when the component supply device D f that detects a component exhaustion during board manufacturing is detected, the component management computer 40 transmits the component supply device D f The part management operator OP 2 in the parts preparation area A b notifies the part management operator OP 2 of the remaining time when the parts run out and the remaining time when the parts run out. Prepare the supply device D f and transfer the prepared component supply device D f to the time when parts are exhausted (delivery time from the component preparation area A b to the production area A s, the component supply device D f to the electronic component mounting machine 2). (It is preferable to consider the time of wearing at 0) Delivered to the electronic component mounting machine 20 in the production area As. Then, the new component supply device D # is mounted on the component supply unit 27 by the operator # 3 of the electronic component mounter 20. The electronic component mounter 20 detects that the new component supply device D f has been attached to the component supply unit 27, and when the component supply device D f, which is used to cut components, runs out of components, a new component supply device D f. Parts will be sampled from D f. Therefore, since the component management operator OP 2 performs the component preparation work which was previously performed by the operator OP 3 of the electronic component mounting machine 20, the burden on the operator OP 3 of the electronic component mounting machine 20 can be reduced. . Also, by setting a new component supply device D f to the electronic component mounter 20 before the component runs out, the component can be supplied, and the electronic component mounter 20 is not stopped. It is possible to prevent a decrease in the operation rate of the electronic component mounting machine 20 due to replenishment. Furthermore, since the parts management operator OP 2 can centrally manage the parts in the parts preparation area A b and operate the parts efficiently, the parts cost can be reduced as a whole. .
なお、 上記実施の形態においては、 電子部品実装機 2 0の部品供給デ バイス D f が生産中に部品切れとなる場合について説明し、 生産中に部 品切れとなる部品供給デバイス D f を電子部品実装機 2 0にセッ トすべ き部品供給デバイス D f と して特定したが (ステップ 4 1 0〜 4 1 8 )、 生産する基板種を変更する場合すなわち次生産のために段取り替えする 場合についても本発明を適用することができる。 この場合、 部品管理用 コンピュータ 4 0は、 部品を実装する複数の基板種、 およぴ各基板種に 実装される部品種を把握し、 次に生産する基板種に実装される全ての部 品種の部品供給デバィス D f を電子部品実装機 2 0にセッ トすべき部品 供給デバイス D f と して特定し、 それら特定された部品供給デバイス D f と、 次に生産する基板種の生産開始時間とを合わせて部品管理オペレ ータ O P 2に予告する。 生産開始時間が、 電子部品実装機 2 0に部品供 給デバイス D f をセッ トすべきセッ ト時間である。 なお、 生産開始まで の残り時間を合わせて表示するよ うにしてもよいし、 この残り時間のみ を表示するよ うにしてもよい。 In the above embodiment, the case where the component supply device D f of the electronic component mounter 20 runs out of parts during production will be described. Although it was specified as the component supply device D f to be set in the mounter 20 (steps 410 to 418), when the type of board to be produced is changed, that is, when the setup is changed for the next production The present invention can also be applied to the present invention. In this case, the component management computer 40 grasps a plurality of board types on which components are to be mounted and the component types mounted on each board type, and obtains all the component types mounted on the next board type to be produced. The component supply device Df of the component is specified as the component supply device Df to be set in the electronic component mounter 20, and the component supply device Df thus identified and the production start time of the next board type to be produced are determined. Parts management operator Notice to Data OP 2. The production start time is a set time at which the component supply device D f should be set in the electronic component mounter 20. The remaining time until the start of production may be displayed together, or only this remaining time may be displayed.
これによれば、 次に生産する基板種がある場合に、 部品管理用コンビ ユ ータ 4 0はその基板種に関する部品供給デバイス D f と生産開始時間 を部品管理オペレータ O P 2に通知するので、 部品準備ェリ ア A b にい る部品管理オペレータ O P 2は、 次に生産する基板種に関する部品供給 デバイス D f の準備をし、 それら準備された部品供給デバイス D f を生 産開始時間までに生産エリア A s の電子部品実装機 2 0に配送する。 そ して、 その新しい部品供給デバイス D f が電子部品実装機 2 0のォペレ ータ O P 3によってセッ トされる。 したがって、 現在の生産の完了前、 または完了後すぐに新しい部品供給デバィス D f を電子部品実装機 2 0 にセッ トすることにより段取り替えができるので、 段取り替えに伴う電 子部品実装機の稼働率の低下をできるだけ防ぐことができる。  According to this, when there is a board type to be produced next, the component management combinator 40 notifies the component management operator OP 2 of the component supply device D f and the production start time for the board type. The component management operator OP2 in the component preparation area Ab prepares the component supply device Df for the next board type to be produced, and prepares the prepared component supply device Df by the production start time. The product is delivered to the electronic component mounting machine 20 in the production area A s. Then, the new component supply device D f is set by the operator OP 3 of the electronic component mounter 20. Therefore, the setup can be changed by setting a new component supply device D f to the electronic component mounter 20 before or immediately after the completion of the current production, and the operation of the electronic component mounter accompanying the setup change can be performed. The rate can be prevented from lowering as much as possible.
また、 上記実施の形態の部品補充予告ルーチンにおいては、 部品残数 および基板一枚あたりの生産時間に基づいて部品切れ時間を算出したが 部品残数および部品一個当たりの装着時間に基づいて部品切れ時間を算 出してもよい。 この場合、 部品管理用コンピュータ 4 0は、 電子部品実 装機 2 0 (または電子部品実装機管理用コンピュータ 3 0 ) から部品装 着情報 (第 1 4図参照) を受信し、 この部品装着情報に基づいて部品種 (搭載部品名) 毎の装着完了時間情報 (第 1 5.図参照) を算出する。 部 品装着情報は、 部品の装着順、 部品の I D、 搭載部品名 (部品種)、 前の 装着が完了した時点から次の装着が完了した時点までの所要時間である 装着時間、 および装着順に装着時間を積算した積算時間から構成されて いる。 装着時間は、 実測、 または計算によって得ることができる。 装着 完了時間情報は、 部品 I Dおよび装着完了時間から構成されており、 部 品装着情報から同一の搭載部品名をピックアップし、 それらを部品装着 順に部品 I Dと装着完了時間を関連付けて作成されるものである。 例え ば第 1 4図の部品装着情報から作成された搭載部品名 R A 0 0 1の装着 完了時間情報が第 1 5図に示されている。 すなわち、 尺 0 0 1 の 1番 目である部品 I D P 0 0 1は基板実装開始して t a経過時点に装着が完 了し、 R A O 0 1 の 2番目である部品 I D P O 5 0は基板実装開始して T 3経過時点に装着が完了し、 R A O O 1 の 3番目である部品 I D P O 5 1 は基板実装開始して T 4経過時点に装着が完了する。 Also, in the component replenishment notice routine of the above embodiment, the component outage time was calculated based on the number of remaining components and the production time per board. However, the component outage time was calculated based on the remaining number of components and the mounting time per component. Time may be calculated. In this case, the component management computer 40 receives the component mounting information (see FIG. 14) from the electronic component mounting machine 20 (or the electronic component mounting machine management computer 30), and receives the component mounting information. Calculates mounting completion time information (see Fig. 15.) for each component type (mounted component name) based on the. The component mounting information includes the component mounting order, the component ID, the mounted component name (component type), the mounting time, which is the time required from the time when the previous mounting was completed to the time when the next mounting was completed, and the mounting order. It is composed of the total time obtained by integrating the mounting time. The mounting time can be obtained by actual measurement or calculation. Wearing Completion time information consists of a component ID and mounting completion time.The same mounting component name is picked up from the component mounting information, and is created by associating the component ID with the mounting completion time in the component mounting order. is there. For example, the mounting completion time information of the mounted component name RA001 created from the component mounting information of FIG. 14 is shown in FIG. In other words, component IDP001, which is the first component of scale 01, has been mounted on the board and mounting has been completed at the elapse of ta, and component IDPO50, the second component of RAO01, has started mounting the board. The mounting of the component IDPO 51, which is the third component of RAOO 1, is completed when T 3 has elapsed.
部品管理用コンピュータ 4 0は、 第 7図に示すフィーダ位置情報 D B に基づいて現在生産に関与している部品供給デバイス D f の I Dを全て 読み出し、 それらの部品供給デバイス D f のフィーダ部品情報を記憶部 4 5 に記憶されているフィーダ部品情報 D Bから読み出し、 部品残数お よび装着完了時間から部品供給デバィス D f が部品切れとなる部品切れ 時間を算出して算出結果を含めたフィーダ部品情報をフィーダ部品情報 D Bに更新登録する。 これによ り、 部品管理用コンピュータ 4 0は、 電 子部品実装機 2 0にセッ トされている部品供給デバイス D f の部品切れ 時間を全て管理する。 なお、 部品切れ時間は部品残数を基板一枚あたり の部品使用量で除したその商に基板一枚あたり の生産時間を乗じた値と 除した結果の余り に相当する装着完了時間との和によって表される。 こ れによれば、 よ り正確に部品切れ時間を算出することができる。  The component management computer 40 reads out all the IDs of the component supply devices D f that are currently involved in production based on the feeder position information DB shown in FIG. 7, and reads the feeder component information of those component supply devices D f. The feeder component information read from the feeder component information DB stored in the storage unit 45, and the component supply device Df calculates the component outage time at which the component supply device Df will run out of components based on the number of remaining components and the mounting completion time, and includes the calculation result and includes the calculation result Is updated and registered in the feeder parts information DB. Thus, the component management computer 40 manages all the component outage times of the component supply device D f set in the electronic component mounter 20. The component outage time is the sum of the quotient of the number of remaining components divided by the amount of components used per board multiplied by the production time per board, and the mounting completion time corresponding to the remainder of the division. Represented by According to this, the component outage time can be calculated more accurately.
また、 上記実施の形態においては、 本発明をロボッ トタイプの電子部 品実装機 2 0に適用したが、 ロータ リ タイプの電子部品実装機に適用し てもよい。 ロータ リ タイプの電子部品実装機は、 電子部品を吸着し装着 する装着ヘッ ドが回転可能に固定され、 スライ ド可能に固定された部品 供給部から部品を吸着した後、 ローダ部によって搬送されて X Yテープ ル (X軸および Y軸方向に移動可能) によって位置決めされた基板に装 着するものである。 この場合、 電子部品実装装置 2 0の稼動中に部品供 給部が摺動するので、 部品供給デバィス D f が部品切れとなつて電子部 品実装機 2 0が停止した後、 生産ェリア A s の電子部品実装機 2 0に配 送された新しい部品供給デバイス D f が電子部品実装機 2 0のオペレー タ O P 3によつて部品供給部 2 7に交換装着される。 しかしこの場合で あっても、 生産ェリァ A s においては電子部品リール Rを部品供給デバ イス D f にセッ トする手間なく 、 部品切れした直後に新しい部品供給デ バイス D ί を電子部品実装機 2 0にセッ トすることによ り部品補給がで き、電子部品実装機 2 0を停止させてもできるだけ短時間に抑えるので、 部品補給に伴う電子部品実装機 2 0の稼働率の低下を防ぐことができる, また、 上記実施の形態においては、 部品供給デバイス D f が、 電子部 品リ ール Rが着脱可能に取り付けられるフィーダ式部品供給デバイスで ある場合について説明したが、 これに限られず、 ト レイ式のもの、 ステ ィ ック式のもの、 バルタカー ト リ ッジ式のものなどについても本発明を 適用することができる。 Further, in the above embodiment, the present invention is applied to the robot-type electronic component mounter 20. However, the present invention may be applied to a rotary-type electronic component mounter. In a rotary type electronic component mounting machine, a mounting head for picking up and mounting electronic components is fixed rotatably, and after picking up components from a component supply unit fixedly slidable, the components are conveyed by a loader unit. XY tape It is mounted on a substrate positioned by a tool (movable in the X-axis and Y-axis directions). In this case, since the component supply unit slides while the electronic component mounting apparatus 20 is operating, the production area A s is stopped after the component supply device D f has run out of components and the electronic component mounting machine 20 stops. The new component supply device D f delivered to the electronic component mounter 20 is replaced and mounted on the component supply unit 27 by the operator OP3 of the electronic component mounter 20. However, even in this case, in the production area As, there is no need to set the electronic component reel R to the component supply device Df. By setting to 0, parts can be replenished, and even if the electronic component mounter 20 is stopped, the time is kept as short as possible, thus preventing a decrease in the operating rate of the electronic component mounter 20 due to component supply. Also, in the above-described embodiment, a case has been described where the component supply device D f is a feeder-type component supply device to which the electronic component reel R is detachably attached. However, the present invention is not limited to this. The present invention can also be applied to a tray type, a stick type, a balcar cartridge type, and the like.
また、 上記実施の形態において、 着荷エリア A t に設置された部品登 録用コンピュータ 6 0が、 電子部品実装機 2 0にセッ トすべき部品供給 デバイスを部品登録オペレータ O P 1 に予告するよ うにしてもよい。 こ れによ り、 電子部品実装機 2 0にセッ トすべき電子部品リール Rを優先 的に部品準備エリア A bに配送することができる。 産業上の利用可能性  Also, in the above embodiment, the component registration computer 60 installed in the receiving area At will notify the component registration operator OP1 of the component supply device to be set in the electronic component mounter 20. It may be. Thus, the electronic component reel R to be set in the electronic component mounter 20 can be preferentially delivered to the component preparation area Ab. Industrial applicability
以上のよ うに、 本発明にかかる電子部品実装システムは、 電子部品実 装機の部品管理機能を電子部品実装機とは別体の部品管理装置にも受け 持たせると ともに部品管理オペレータを専任させることによ り、 電子部 品実装機のオペレータにかかる負担を軽減し、 生産効率を向上させる場 合に適している。 As described above, in the electronic component mounting system according to the present invention, the component management function of the electronic component mounting machine is assigned to a component management device separate from the electronic component mounting machine, and the component management operator is dedicated. The electronic part It is suitable for reducing the burden on the operator of the component mounting machine and improving production efficiency.

Claims

請 求 の 範 囲 The scope of the claims
1 . 複数の部品供給デバイスからそれぞれ供給される部品を基板に実装 する複数の電子部品実装機と、 前記各電子部品実装機と通信可能に接続 されて前記各部品供給デバイスの部品を管理する部品管理装置と、 を備 えてなり、 前記部品管理装置は、 前記電子部品実装機にセッ トすべき部 品供給デバィスを部品管理オペレータに予告する予告手段を備えたこと を特徴とする電子部品実装システム。 1. A plurality of electronic component mounters for mounting components respectively supplied from a plurality of component supply devices on a board, and components that are communicably connected to the respective electronic component mounters and manage components of the respective component supply devices. An electronic component mounting system, comprising: a management device; and a notifying means for notifying a component management operator of a component supply device to be set in the electronic component mounting machine. .
2 . 前記予告手段は、 前記電子部品実装機に部品供給デバイスをセッ ト すべきセッ ト時間までの残り時間とを合わせて予告することを特徴とす る請求の範囲第 1項に記載の電子部品実装システム。  2. The electronic device according to claim 1, wherein the advance notice unit gives an advance notice together with a remaining time until a set time at which a component supply device should be set to the electronic component mounter. Component mounting system.
3 . 複数の部品供給デバイスからそれぞれ供給される部品を基板に実装 する複数の電子部品実装機を生産ェリアに設置し、 前記各電子部品実装 機と通信可能に接続されて前記各部品供給デバィスの部品を管理する部 品管理装置を前記各部品供給デバィスに部品を予めセッ トする部品準備 エリアに設置し、 前記部品管理装置は、 前記電子部品実装機にセッ トす べき部品供給デバイスと、 該部品供給デバイスをセッ トすべきセッ ト時 間までの残り時間とを合わせて部品管理オペレータに予告する予告手段 を備.えたことを特徴とする電子部品実装システム。  3. A plurality of electronic component mounters for mounting components supplied from the plurality of component supply devices on the board are installed in the production area, and are connected to the respective electronic component mounters so as to be communicable with each other. A component management device that manages components is installed in a component preparation area where components are set in advance in each of the component supply devices, and the component management device includes: a component supply device to be set in the electronic component mounting machine; An electronic component mounting system comprising a means for notifying a component management operator of a remaining time until a set time for setting a component supply device.
4 . 前記部品管理装置は、 前記各部品供給デバイ スの部品残数をそれぞ れ管理する部品残数管理手段と、  4. The component management device includes: a component remaining number management unit that manages a component remaining number of each of the component supply devices;
該部品残数管理手段によつて管理された部品残数に基づいて前記部品 供給デバィスへ部品を補充する残り時間を算出する部品補充時間算出手 段と、  A component replenishment time calculation means for calculating a remaining time for replenishing components to the component supply device based on the number of remaining components managed by the remaining component number management means;
部品の補充が必要な部品供給デバィスを前記電子部品実装機にセッ ト すべき部品供給デバイスと して特定する特定手段と、 をさ らに備え、 前記予告手段は、前記特定手段によ り特定された部品供給デバィスと、 前記部品補充時間算出手段により算出された該部品供給デバイスの残り 時間とを合わせて部品管理オペレータに予告することを特徴とする請求 の範囲第 1項乃至第 3項の何れか一項に記載の電子部品実装システム。 Specifying means for specifying a component supply device requiring replenishment of components as a component supply device to be set in the electronic component mounter; and The notifying means gives a notice to a parts management operator together with the component supply device specified by the specifying means and the remaining time of the component supply device calculated by the component replenishment time calculating means. The electronic component mounting system according to any one of claims 1 to 3, wherein:
5 . 前記部品管理装置は、 部品を実装する複数の基板種、 および各基板 種に実装される部品種を把握し、 次に生産する基板種に実装される部品 の部品供給デバイスを前記電子部品実装機にセッ トすべき部品供給デバ イス と して特定し、 前記予告手段は、 特定された部品供給デバイスと、 次に生産する基板の生産開始時間とを合わせて部品管理オペレータに予 告することを特徴とする請求の範囲第 1項乃至第 3項の何れか一項に記 載の電子部品実装システム。 5. The component management device grasps a plurality of types of boards on which components are mounted and the types of components mounted on each type of board, and supplies a component supply device of a component mounted on a type of board to be produced next to the electronic component. Specified as a component supply device to be set in the mounting machine, and the notifying unit notifies the component management operator of the specified component supply device and the production start time of the next board to be produced. The electronic component mounting system according to any one of claims 1 to 3, characterized in that:
PCT/JP2004/006766 2003-05-14 2004-05-13 Electronic part mounting system WO2004103052A1 (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014064938A1 (en) * 2012-10-23 2014-05-01 パナソニック株式会社 Electronic component mounting system
WO2016013107A1 (en) * 2014-07-25 2016-01-28 富士機械製造株式会社 Feeder automatic replacement system
JP2017130593A (en) * 2016-01-22 2017-07-27 富士機械製造株式会社 Feeder automatic exchange system
JP2017224721A (en) * 2016-06-15 2017-12-21 富士機械製造株式会社 Splicing unit and electronic component supply system
WO2019187007A1 (en) * 2018-03-30 2019-10-03 ヤマハ発動機株式会社 Component feeding management device, component mounting system, and component feeding management method
WO2019187033A1 (en) * 2018-03-30 2019-10-03 ヤマハ発動機株式会社 Operation management system and component mounting system
WO2019229882A1 (en) * 2018-05-30 2019-12-05 ヤマハ発動機株式会社 Component replenishment management system and component mounting system
EP3487276A4 (en) * 2016-07-14 2020-03-11 Fuji Corporation Component management system, component mounting device, and component managing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5665616B2 (en) * 2011-03-17 2015-02-04 富士機械製造株式会社 Manufacturing number management device for electric circuit manufacturing system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04346298A (en) * 1991-05-23 1992-12-02 Matsushita Electric Ind Co Ltd Arrangement method for supply of component
JPH09223896A (en) * 1996-02-16 1997-08-26 Sharp Corp Electronic part mounting machine part management system
JP2001127487A (en) * 1999-10-29 2001-05-11 Matsushita Electric Ind Co Ltd Device and method for component management for printed board mounting system
JP2002164697A (en) * 2000-11-27 2002-06-07 Matsushita Electric Ind Co Ltd Method and apparatus for assisting material part supply in mounting process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04346298A (en) * 1991-05-23 1992-12-02 Matsushita Electric Ind Co Ltd Arrangement method for supply of component
JPH09223896A (en) * 1996-02-16 1997-08-26 Sharp Corp Electronic part mounting machine part management system
JP2001127487A (en) * 1999-10-29 2001-05-11 Matsushita Electric Ind Co Ltd Device and method for component management for printed board mounting system
JP2002164697A (en) * 2000-11-27 2002-06-07 Matsushita Electric Ind Co Ltd Method and apparatus for assisting material part supply in mounting process

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014086517A (en) * 2012-10-23 2014-05-12 Panasonic Corp Electronic component mounting system
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CN104663012B (en) * 2012-10-23 2017-09-05 松下知识产权经营株式会社 Electronic component mounting system
US9807920B2 (en) 2012-10-23 2017-10-31 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system
WO2014064938A1 (en) * 2012-10-23 2014-05-01 パナソニック株式会社 Electronic component mounting system
WO2016013107A1 (en) * 2014-07-25 2016-01-28 富士機械製造株式会社 Feeder automatic replacement system
JPWO2016013107A1 (en) * 2014-07-25 2017-04-27 富士機械製造株式会社 Feeder automatic change system
US9814168B2 (en) 2014-07-25 2017-11-07 Fuji Machine Mfg. Co., Ltd. Automatic feeder exchanging system
JP2017130593A (en) * 2016-01-22 2017-07-27 富士機械製造株式会社 Feeder automatic exchange system
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US11612090B2 (en) 2016-07-14 2023-03-21 Fuji Corporation Component management system, component mounting device, and component management method for predicting component exhaustion
WO2019187007A1 (en) * 2018-03-30 2019-10-03 ヤマハ発動機株式会社 Component feeding management device, component mounting system, and component feeding management method
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